Freescale Semiconductor 1322X-SRB 1322X-SRB User Manual
Freescale Semiconductor, Inc. 1322X-SRB
Users Manual Rev 2
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| Document Description | Users Manual Rev 2 |
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| Date Submitted | 2008-07-24 00:00:00 |
| Date Available | 2008-07-25 00:00:00 |
| Creation Date | 2008-07-17 09:39:37 |
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1322x Sensor Node Reference Manual Document Number: 1322xSNRM Rev. 1.1 07/2008 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064, Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-521-6274 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. ARM is the registered trademark of ARM Limited. ARM7TDMI-S is the trademark of ARM Limited. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2007, 2008. All rights reserved. Contents About This Book Audience . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii Chapter 1 Safety1322x Sensor Node Information 1.1 1.2 1.2.1 1.2.2 1.2.3 1.3 1.4 FCC Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . FCC Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 C.F.R. Sec. 15.21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 C.F.R. Sec.15.105(b) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 C.F.R. Sec.15.203 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Regulatory Approval For Canada . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disposal Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1-1 1-1 1-2 1-2 1-2 1-2 Chapter 2 1322x Sensor Node Module Overview and Description 2.1 2.2 2.3 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Board Level Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 Chapter 3 System Overview and Functional Block Descriptions 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.8.1 3.8.2 3.8.3 3.9 3.10 3.11 System Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . System Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Management and Measurement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Low-cost 2.4 GHz ISM Band radio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . USB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . User Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Debug/Development Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pressure Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Three-axis Accelerometer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Audio Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GPIO Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 3-2 3-3 3-4 3-4 3-4 3-5 3-5 3-5 3-6 3-6 3-6 3-7 3-7 Chapter 4 Interface Locations and Pinouts 4.1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 1322x Sensor Node Reference Manual, Rev. 1.1 Freescale Semiconductor 4.2 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.2.1 Supply Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.2.2 On/Off Switch and Power On Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.2.3 Power Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.3 RF Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.4 USB Connector (“B” Receptacle). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5 LEDs, Switch, Buttons and Joystick. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.6 Debug/Development Connector (ARM JTAG Interface). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.7 Audio Subsystem Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.8 GPIO Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.9 FLASH Memory Recovery Jumpers and Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.10 ADC Voltage References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.11 Jumper Selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2 4-2 4-2 4-2 4-2 4-3 4-3 4-4 4-5 4-5 4-6 4-7 4-8 Chapter 5 Schematic, Board Layout, and Bill of Material 1322x Sensor Node Reference Manual, Rev. 1.1 ii Freescale Semiconductor About This Book This manual describes Freescale’s 1322x Sensor Node evaluation board. The 1322x Sensor Node contains Freescale’s third-generation MC1322x ZigBee platform which incorporates a complete, low power, 2.4 GHz radio frequency transceiver, 32-bit ARM7 core based MCU, hardware acceleration for both the IEEE 802.15.4 MAC and AES security, and a full set of MCU peripherals into a 99-pin LGA Platform-in-Package (PiP). Audience This manual is intended for system designers. Organization This document is organized into 4 chapters. Chapter 1 Safety Information — Highlights some of the FCC requirements. Chapter 2 1322x Sensor Node Overview and Description — This chapter introduces 1322x Sensor Node which is an IEEE, 802.15.4 compliant evaluation board based on the Freescale MC1322x device. Chapter 3 System Overview and Functional Block Descriptions — This section provides an overview of the 1322x Sensor Node and system block diagrams. Chapter 4 Interface Locations and Pinouts — This chapter provides a description of the interface locations and pinout of the 1322x Sensor Node PCB. Chapter 5 Schematic and Bill of Materials — This chapter provides the schematic, board layout, and Bill of Materials (BOM). Revision History The following table summarizes revisions to this document since the previous release (Rev 1.0). Revision History Location Chapter 1 Revision Updated FCC information. 1322x-Sensor Node Reference Manual, Rev. 1.1 Freescale Semiconductor iii Definitions, Acronyms, and Abbreviations The following list defines the acronyms and abbreviations used in this document. ADC Analog to Digital Converter AES Advanced Encryption Standard ARM Advanced RISC Machine CTS Clear to Send DAC Digital to Analog Converter DMA Direct Memory Access I2C Inter-Integrated Circuit is a multi-master serial computer bus ISM Industrial Scientific Medical 2.4 GHz radio frequency band JTAG Joint Test Action Group LGA Land Grid Array MAC Media Access Controller MCU Microcontroller Unit NEXUS An embedded processor development tool interface that helps design engineers identify software and hardware-level issues. SN Sensor Node pcb Printed circuit board PiP Platform in Package PWM Pulse-width modulation RTS Request to Send SMA Connector SubMiniature version “A” connector SPI Serial Peripheral Interface SSI Synchronous Serial Interface TACT Switch A switch that provides a slight “snap” or “click” to the user to indicate function. TELCO Telephone Company USB Universal Serial Bus VCP Virtual Com Port 1322x-Sensor Node Reference Manual, Rev. 1.1 iv Freescale Semiconductor Chapter 1 Safety1322x Sensor Node Information 1.1 FCC Guidelines This equipment is for use by developers for evaluation purposes only and must not be incorporated into any other device or system. This device may not be sold to the general public. Integrators will be responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC authorization. FCC approval of this device only covers the original configuration of this device as supplied. Any modifications to this product, including changes shown in this manual, may violate the rules of the Federal Communications Commission and make operation of the product unlawful. NOTE: The statement above applies also to the Industry Canada Approval. 1.2 FCC Labeling FCC labels are physically located on the back of the board. 1.2.1 47 C.F.R. Sec. 15.21 This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. 1322x Sensor Node Reference Manual, Rev. 1.1 Freescale Semiconductor 1-1 Safety1322x Sensor Node Information 1.2.2 47 C.F.R. Sec.15.105(b) This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. The antenna(s) used for this equipment must be installed to provide a separation distance of at least 8 inches (20cm) from all persons. This device complies with Part 15 of the FCC Rules. Operation is subject to the following three conditions: 1. This device may not cause harmful interference. 2. This device must accept any interference received, including interference that may cause undesired operation. 3. This device is susceptible to electrostatic discharge (ESD) and surge phenomenon. 1.2.3 47 C.F.R. Sec.15.203 An intentional radiator shall be designed to ensure that no antenna other than that furnished by the responsible party shall be used with the device. The use of a permanently attached antenna or of an antenna that uses a unique coupling to the intentional radiator shall be considered sufficient to comply with the provisions of this Section. The manufacturer may design the unit so that a broken antenna can be replaced by the user, but the use of a standard antenna jack or electrical connector is prohibited. This requirement does not apply to carrier current devices or to devices operated under the provisions of Sections 15.211, 15.213, 15.217, 15.219, or 15.221. Further, this requirement does not apply to intentional radiators that must be professionally installed, such as perimeter protection systems and some field disturbance sensors, or to other intentional radiators which, in accordance with Section 15.31(d), must be measured at the installation site. However, the installer shall be responsible for ensuring that the proper antenna is employed so that the limits in this Part are not exceeded. 1.3 Regulatory Approval For Canada This Class B digital apparatus complies with Canadian ICES-003 and RSS 210, Issue 7. Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada. NOTE: Section 1.1 of this manual also applies to the Industry Canada Approval 1.4 Disposal Instructions This product may be subject to special disposal requirements. For product disposal instructions, refer to www.freescale.com/productdisposal. 1322x Sensor Node Reference Manual, Rev. 1.1 1-2 Freescale Semiconductor Chapter 2 1322x Sensor Node Module Overview and Description 2.1 Introduction The 1322x Sensor Node is an IEEE 802.15.4 compliant evaluation board based on the Freescale MC1322X device. The heart of the 1322x Sensor Node is Freescale’s MC1322x 99-pin LGA Platform-in-Package (PiP) solution that can be used for wireless applications ranging from simple proprietary point-to-point connectivity to complete ZigBee mesh networking. The MC1322x is designed to provide a highly integrated, total solution, with premier processing capabilities and very low power consumption. The 1322x Sensor Node provides a platform to evaluate the MC1322x device, develop software and applications, and demonstrate IEEE 802.15.4 and ZigBee networking capabilities. The Sensor Node surrounds the core device with capabilities that provide a complete 802.15.4 radio, user interface, debugging capabilities, connection to personal computers (PCs) and other devices, sensors, and portability. Figure 2-1. 1322x Sensor Node 1322x Sensor Node Reference Manual, Rev. 1.1 Freescale Semiconductor 2-1 1322x Sensor Node Module Overview and Description 2.2 Features The 1322x Sensor Node provides the following features: • Full IEEE 802.15.4 compliant wireless node; ZigBee capable with Freescale’s BeeStack software stack • Based on Freescale’s third-generation MC1322x ZigBee platform which incorporates a complete, low power, 2.4 GHz radio frequency transceiver, 32-bit ARM7 core based MCU, hardware acceleration for both the IEEE 802.15.4 MAC and AES security, and a full set of MCU peripherals into a 99-pin LGA Platform-in-Package (PiP) • MC1322x provides a highly integrated, low cost RF node — On-board balun and antenna switch in package — Typical -95 dBm sensitivity — Typical 0 dBm output power, with max approximately +3 dBm — Printed F-antenna • USB interface is bus-powered and full-speed compatible to the USB 2.0 and 1.1 specifications • Audio subsystem — 2.5mm audio jack for microphone and mono earpiece — Input amplifier and anti-aliasing filter for an electret microphone — Output path to second order analog filter from either 10-bit serial DAC or PWM as output signal sources — I2C controlled 32-position linear nonvolatile volume control for audio circuit — Audio output amplifier for both earpiece or on-board dynamic speaker (switched by headset jack) • Freescale pressure sensor with 0-10 kPA range • Temperature sensor with the full operating temperature range of the board with a ±3°C accuracy. • Freescale XYZ tri-axis accelerometer for measuring changes in forces applied to the board (typical sensitivity of 800 mV/g @ 1.5g) • 20-pin connector for standard JTAG debug/development interface • Power management circuit with on-board regulation for multiple power sources — Can be powered from USB interface, DC power jack or two AA batteries — On/Off power switch — Power-on green LED • User interface switches and LEDs — 4-directional TACT switch with center push for application purposes — 4 pushbuttons for application purposes — 4 processor controlled red LEDs for application purposes — Reset switch • 26-pin user header for selected General Purpose Input Output signals and data interfaces • System clock options 1322x Sensor Node Reference Manual, Rev. 1.1 2-2 Freescale Semiconductor 1322x Sensor Node Module Overview and Description — Default 24 MHz crystal reference oscillator (13 to 26 MHz crystal optional) — Reference oscillator can be driven from an external source — Optional 32.768 kHz crystal oscillator for accurate real-time delays (not mounted) 2.3 Board Level Specifications Table 2-1. 1322x Sensor Node Specifications Parameter Units MIN TYP Notes/Conditions MAX General Size (Enclosure: X, Y, Z) Size (PCB: X, Y) Layer build (PCB) 95x60x40 mm 85x50 mm 0.8 / 0.032 mm / in Dielectric material (PCB) 4-Layer FR4 Power Voltage supply (DC) 4.4 12 Voltage supply (USB) 4.4 5.25 3.2 100 mA Voltage supply (Batteries) Current consumption USB 2.0/1.1 standard specification Temperature Operating temperature (see note) -20 +25 +85 °C Storage temperature -30 +25 +85 °C USB interface USB 2.0 and 1.1 full-speed compatible Audio Audio (Input sensitivity) -40 dB Accepts electret microphone element Audio (Output) Attenuation Temperature Sensor LM61BIM3 (National Semi) See data sheet Pressure Sensor MPXV5010GC6U (Freescale Semi) See data sheet Tri-axis Low-g Accelerometer MMA7260QR2 (Freescale Semi) See data sheet RF 802.15.4 Frequency range 2405 2480 MHz All 16 channels in the 2450 MHz band 1322x Sensor Node Reference Manual, Rev. 1.1 Freescale Semiconductor 2-3 1322x Sensor Node Module Overview and Description Table 2-1. 1322x Sensor Node Specifications (continued) Parameter Units Range (outdoor / line of sight) 700 Notes/Conditions Meter <1% PER for 20-byte packets (point-to-point in communications with 1322X Sensor Reference Board) RF Transmitter 802.15.4 Output power -30 Harmonics 2nd harmonics 3rd harmonics +3 dBm -38 -35 dBm dBm Over range of Pout from IC control in 2 dB steps. Note: On channel 26, output power should not exceed -4 dBm (power setting 0x0E) to meet FCC Part 15 requirements. Harmonics are compliant to ETSI and FCC regulatory approval standards RF Receiver 802.15.4 sensitivity -95 dBm <1% PER for 20-byte packets Proprietary high-speed mode sensitivity -80 dBm <1% PER for a minimum data payload of 400 packets Regulatory Approval FCC Product is approved accordingly to the FCC part 15 standard CE (ETSI) Product is approved accordingly to the EN 300 328 V1.7.1 (2006-10) standard CE (EMC) Product is approved accordingly to the EN 301 489-1 V1.6.1 (2005-09) and EN 301 489-17 V1.2.1 (2002-08) standards Safety UL Product is approved accordingly to the IEC 60950-1 and EN 60950-1, First Edition standards Environment RoHS Product complies with the EU Directive 2002/95/EC of 27 January 2003 WEEE Product complies with the EU Directive 2002/95/EC of 27 January 2003 1322x Sensor Node Reference Manual, Rev. 1.1 2-4 Freescale Semiconductor Chapter 3 System Overview and Functional Block Descriptions This section provides an overview of the Sensor Node and block diagrams. 3.1 System Block Diagram The following is the 1322x Sensor Node system level block diagram. PCB F-Antenna DC Adaptor 2xAA Battery Power Management ADC VCC Audio Mic Input w/ Amp / LP Filter Mic USB Bus Power TMR3 - PWM Power Measurements JTAG Force (g) Pressure (kPa) Temp (ºC) 13-26MHz Clk Debug Interface 20-Pin JTAG Conn XYZ Sensor MMA7260Q Pressure Sensor MPX5010G Temperature Sensor LM61 Ext Clock Source SSI Audio Output DAC DAC101S101 Audio Output Amp / LP Filter Audio Volume Control MAX5434 Audio Amp NCP4896 JTAG ADC GPIO GPIO 26-Pin Header User Apps UART USB Interface FT232RQ USB Conn GPIO 4 Push Buttons, Joystick, Reset Switch, On/Off Switch MC13224V/225V Advanced ZigBee™- Compliant PiP Earphone Speaker ADC ADC GPIO 4 Red LEDs, 1 Green LED Clk 24 MHz 32.768 KHz Figure 3-1. 1322x Sensor Node Block Diagram 1322x Sensor Node Reference Manual, Rev. 1.1 Freescale Semiconductor 3-1 System Overview and Functional Block Descriptions 3.2 System Overview The heart of the 1322x Sensor Node is Freescale’s MC1322x 99-pin LGA Platform-in-Package (PiP) solution that can be used for wireless applications ranging from simple proprietary point-to-point connectivity to complete ZigBee mesh networking. The MC1322x is designed to provide a highly integrated, total solution, with premier processing capabilities and very low power consumption. The MC1322x MCU resources offer superior processing power for ZigBee and IEEE 802.15.4 applications. A full 32-bit ARM7TDMI-S core operates up to 26 MHz. A 128 Kbyte FLASH memory is mirrored into a 96 Kbyte RAM for upper stack and applications software. In addition, an 80 Kbyte ROM is available for boot software, peripheral device drivers, standardized IEEE 802.15.4 MAC and communications stack software. A full set of peripherals and Direct Memory Access (DMA) capability for transceiver packet data complement the processor core. 24 MHz (typ) 32.768 KHz (optional) BATTERY DETECT CLOCK & RESET MODULE (CRM) DUAL 12-BIT ADC MODULE RADIO INTERFACE MODULE (RIF) ANALOG TRANSMITTER BALUN RF TX/RX SWITCH ANALOG RECEIVER JTAG/ Nexus DEBUG DIGITAL MODEM TX MODEM RX MODEM 802.15.4 MAC ACCELERATOR (MACA) IEEE 802.15.4 TRANSCEIVER MC13225 Platform-in-Package (PiP) IEEE 802.15.4/ZIGBEE SOLUTION Buck Regulator ANALOG POWER MANAGEMENT VOLTAGE REGULATION ADVANCED SECURITY MODULE (ASM) SPI FLASH MODULE (SPIF) 128KBYTE NON-VOLATILE MEMORY (SERIAL FLASH) ARM7 TDMI-S 32-BIT CPU BUS INTERFACE & MEMORY ARBITRATOR ARM INTERRUPT CONTROLLER (AITC) 96KBYTE SRAM (24K WORDS x 32 BITS) 80KBYTE ROM (20KWORDS x 32 BITS) TIMER MODULE (TMR) (4 Tmr Blocks) UART MODULE (UART0) UART MODULE (UART1) SYNC SERIAL INTERFACE (SSI/i2S) KEYBOARD INTERFACE (KBI) UP TO 64 IO PINS RF OSCILLATOR CLOCK GENERATION INTER-IC BUS MODULE (I2C) SERIAL PERIPHERAL INTERFACE (SPI) GPIO and IO CONTROL Figure 3-2. MC1322x Block Diagram On-board peripherals include the following: • Two dedicated UART modules capable of 2 Mbps with CTS/RTS support • SPI port with programmable master and slave operation • Keyboard interface capability. • Two 12-bit analog-to-digital converters (ADCs) with 8 input channels • Four independent 16-bit timers with PWM capability. • Inter-integrated circuit (I2C) interface • Synchronous Serial Interface (SSI) with I2S and SPI capability and FIFO data buffering 1322x Sensor Node Reference Manual, Rev. 1.1 3-2 Freescale Semiconductor System Overview and Functional Block Descriptions The RF radio interface provides for low cost and high density as shown in Figure 3-3. An onboard balun along with a TX/RX switch allows direct connection to a single-ended 50-Ω antenna. The integrated PA provides programmable output power typically from -30 dBm to +4 dBm, and the RX LNA provides -95 dBm sensitivity. This solution also has onboard bypass capacitors and crystal load capacitors for the smallest footprint in the industry. All components are integrated into the package except the crystal and antenna. PA BALUN ANALOG TRANSMITTER RF TX/RX SWITCH LNA ANALOG RECEIVER Figure 3-3. MC1322x RF Interface Augmenting the core device on the Sensor Node are: • Low-cost 2.4 GHz ISM Band radio • 2.0 USB connection • User interface with pushbuttons, and LEDs • Versatile power sources and management • Debug / development port • Audio subsystem • Pressure, temperature, and accelerometer sensors • GPIO connector for system expansion Users are encouraged to reference the board schematic for the topics covered in the following sections. 3.3 Power Management and Measurement To allow maximum versatility, the Sensor Node can be powered via a DC source (typically an AC-DC converter; nominally 5 Vdc), the USB node, or an onboard battery pack with 2 AA alkaline batteries. • The DC source or USB will automatically shutdown the battery supply. • The DC source and the USB power are regulated to 3.3 V, however, the raw battery pack voltage directly supplies the circuitry • All sources are isolated via diodes. • An on/off switch and a power-on LED are provided (see Section 4.2.2, “On/Off Switch and Power On Indicator”). 1322x Sensor Node Reference Manual, Rev. 1.1 Freescale Semiconductor 3-3 System Overview and Functional Block Descriptions • 3.4 Zero-ohm resistors are provided to allow isolation and measurement of various system components (see Section 4.2.3, “Power Measurement”) Low-cost 2.4 GHz ISM Band radio The MC1322x provides an onboard balun, antenna switch, and LNA. The only external component required for the radio is an antenna. The Sensor Node provides a pcb printed metal F-antenna for a complete solution. Figure 3-4 shows the RF network external to the MC1322x. • Typical nominal output power is 0 dBm, with +4 dBm max • Typical sensitivity is -95 dBm. • Frequency range is 2405 to 2480 MHz • Typical range (outdoors, line of sight) is 300 meters C1 Not Mounted RF 10pF RF_RX_TX L1 3.9nH Not Mounted C3 1pF Not Mounted ANT1 F_Antenna RF_GND Figure 3-4. Sensor Node RF Network. 3.5 USB Interface For many applications or demonstrations it is desirable to connect the Sensor Node to a PC or other device. A USB port is provided with a USB “B” receptacle plug. The port is connected to a FTDI FT232R USB UART device that appears as a Virtual COM port (VCP) to the PC. PC drivers are available with the module. The USB interface is configured as a “Bus Powered” device and will therefore draw all required power from the USB interface. The device is USB 2.0 full speed compatible. 3.6 User Interface The Sensor Node provides multiple means for user interface for both debug and demonstration. • Four individual pushbuttons can be used as input, and a 4-direction tactile joystick switch with center push is wired in parallel with the individual pushbuttons. These pushbuttons have interrupt generation capability. • Four individual LEDs can be used as indicators for debug or status. 1322x Sensor Node Reference Manual, Rev. 1.1 3-4 Freescale Semiconductor System Overview and Functional Block Descriptions 3.7 Debug/Development Interface There is a standard JTAG debug port (for pinouts see Section 4.6, “Debug/Development Connector (ARM JTAG Interface)”). A 20-pin connector is provided for a standard JTAG debug interface that only requires a simple interface cable to connect to the PC and uses standard ARM software development tools. 3.8 Sensors The SN provides a temperature sensor, a pressure sensor, and a three axis low-g accelerometer. All three sensors provide analog voltage outputs and require use of the MC13224/225 ADCs. • • • 3.8.1 NOTE There are two VREFH voltages. ADC2_VREFH is tied to the device VCC and moves with the VCC voltage, i.e., either the regulated voltage or the battery voltage. ADC2_VREFH is useful if the application wants the ADC reference to scale with the supply voltage (as for audio), however, it is unreliable for a fixed voltage reference such as the temperature sensor. In contrast, ADC1_VREFH is tied to a fixed 1.5 V reference (see Section 4.10, “ADC Voltage References”). This fixed reference should be used for battery operation where a known voltage is required. All sensor voltage outputs are conditioned with RC filtering to help eliminate noise. The user is referenced to the individual data sheets for each of the sensors for detailed information. Temperature Sensor The temperature sensor is a National Semiconductor LM61BIM3. Its accuracy is ±3°C, and its output voltage is typically 0.600 Vdc at 0°C with a slope of +10 mV/°C. The sensor requires only one ADC input and is constantly powered. 1.200 Temp Vo (Vdc) 1.000 0.800 0.600 0.400 0.200 0.000 10 20 30 40 50 60 Temp (Degrees C) Figure 3-5. Typical Voltage Out vs. Temperature for LM61B 1322x Sensor Node Reference Manual, Rev. 1.1 Freescale Semiconductor 3-5 System Overview and Functional Block Descriptions 3.8.2 Pressure Sensor The pressure sensor is a Freescale Semiconductor MPXV5010GC6U fully integrated device. It provides a high level analog output signal that is proportional to the applied pressure. Its accuracy is ±5%, and its output voltage is typically 0.200 Vdc at 0 offset pressure with a slope of +450 mV/kPa (1.0 kPa [kiloPascal] equals 0.145 psi.). The sensor requires only one ADC input and is constantly powered . The pressure sensor has an axial port (upright tube) for connecting tubing for a pressure source. The outside dimension of the tube is 3.0 mm nominal, and the tube is accessible through the top of the plastic enclosure. 3.8.3 Three-axis Accelerometer The three-axis accelerometer is the MMA7260QR2 device from Freescale Semiconductor. The MMA7260QR2 is specified for sensitivity in four ranges (1.5g/2g/4g/6g). The range is selectable via control lines. Consult the data sheet for sensitivity and other information. Each axis requires an ADC input (three total), and the accelerometer can be powered down. 3.9 Audio Subsystem The audio subsystem provides means for simple output sounds/tones or for TELCO voice quality audio. • A 2.5mm stereo jack is provided to interface to a typical telephone-type headset with an electret microphone and a single earphone. • Audio input - The audio input is taken from the headset electret microphone (mic). — An onboard 10 k-ohm resistor circuit biases the mic for an ~1 Vdc operating voltage. — The mic AC signal is filtered and amplified through a active low-pass filter with a voltage gain of about 30 (~30 dB). The filter topology is a multiple feedback (MFB) 3-pole, linear phase design. The target cutoff frequency is 3.6 kHz. The filter is intended as an anti-aliasing filter for sampled data. — The input amplifier output is sampled via the onboard MC1322x ADC. The sampling frequency is programmable. • Audio output source - The audio output can be sourced from both a serial 10-bit DAC and a PWM timer output. — The 10-bit serial DAC uses the SSI port to send provide the digital sample data. — The PWM timer output is typically modulated to create a Class-D amplifier. Secondarily, a simple 50% duty cycle signal can provide simple tones. — The audio output source is jumper selectable via J7 • Audio output processing - The DAC or PWM out signal is filtered through an active 2-pole LPF. From the filter the signal passes through a passive attenuator, and then is amplified and driven to either an on-board speaker or the headset earphone. — The attenuator provides a volume control that is controlled via a software 32 linear tap programmable, non-volatile digital potentiometer. The interface to the potentiometer is the I2C port. 1322x Sensor Node Reference Manual, Rev. 1.1 3-6 Freescale Semiconductor System Overview and Functional Block Descriptions — The onboard speaker is automatically disconnected if a headset is plugged-in. 3.10 GPIO Connector The GPIO connector (J2) provides a number of data interfaces and GPIO for external system expansion, Section 4.8, “GPIO Connector” gives details. • • • 3.11 Some of the GPIO are shared with onboard devices. The user should take care to avoid conflict. Power supply voltage is provided — Current draw should be limited to 50 mA. — A separate regulated voltage can be enabled Provision is made to supply an external reference clock if desired. Clocks The MC1322x Sensor Mode provides for two system clock sources. • MC1322x Reference Oscillator - The default frequency for the reference oscillator is 24 MHz and the mounted crystal X1 is a 24 MHz device that meets MC1322x specifications. There are two additional options for the module — X1 can be replaced by a 13-26 MHz crystal (it must meet MC1322x specifications), however, the onboard PLL must be used in this case. The pcb provides for PLL filter components, but these are not populated. — An external clock source can be supplied as the reference source (typically 24 MHz). The frequency must be accurate to +/-40ppm. The external clock source is supplied through GPIO Connector J2, and crystal X1 must be removed and capacitor C58 mounted (see Chapter 5, “Schematic, Board Layout, and Bill of Material”, Sheet 1). — 32.768 kHz Crystal Oscillator - Provision is also made for an optional secondary 32.768 kHz crystal X2. This oscillator can be used for a low power accurate timebase. The module comes without this crystal and its load capacitors C7 and C12 unmounted (see Chapter 5, “Schematic, Board Layout, and Bill of Material”, Sheet 1). 1322x Sensor Node Reference Manual, Rev. 1.1 Freescale Semiconductor 3-7 System Overview and Functional Block Descriptions 1322x Sensor Node Reference Manual, Rev. 1.1 3-8 Freescale Semiconductor Chapter 4 Interface Locations and Pinouts This chapter provides a description of the interface location and pinout of the 1322x Sensor Node printed circuit board (PCB). 4.1 Overview This section details the locations (as shown in Figure 4-1) and descriptions of switches, jumpers, and connectors on the 1322x Sensor Node circuit board which is the main board for the 1322x Sensor Node. Users should refer to the figures in the subsequent sections while moving through this chapter. Users should also reference the circuit board schematic in Chapter 5, “Schematic, Board Layout, and Bill of Material”, for additional information. GPIO Connector JTAG Connector Buzzer Audio Connector USB DC Supply On-Off Switch Tact Switches Joystick Figure 4-1. 1322x Sensor Node PCB Top View 1322x Sensor Node Reference Manual, Rev. 1.1 Freescale Semiconductor 4-1 Interface Locations and Pinouts 4.2 Power Management The module can be powered from the DC power jack, the USB port, or the battery pack. 4.2.1 Supply Sources Table 4-1 lists the supply sources, connectors, and voltages. Board maximum current draw is rated at 100 mA. Table 4-1. Power Supply Sources Source Connector Min (Volts) Typical (Volts) Max (Volts) DC Source J5 4.4 12 USB J6 4.4 5.25 AA Battery Pack BC1 ~2.0 3.2 4.2.2 Notes Use DC only source. The connector is a 2 mm DC power jack; positive center conductor. Two AA cells. Battery pack is automatically disabled by either DC source or USB. Accessible through the door on the bottom of the plastic enclosure. On/Off Switch and Power On Indicator The following are used with the power management: • Switch SW7 - 4-pole slide switch disconnects ALL sources • Green LED D5 - indicates power from any source 4.2.3 Power Measurement It is possible to isolate various circuit blocks to measure current draw via 0-ohm resistors. The resistors are all mounted as default. Below is a list of the supplies. • R68 -> VCC (Output from main on-board regulator) • R65 -> VBATT (Supply for MC1322x) • R37 -> V_PRE (Supply for pressure sensor) • R38 -> V_XYZ (Supply for accelerometer) • R43 -> V_AUD (Supply for audio circuit) • R44 -> V_TMP (Supply for temp sensor) • R64 -> 3V (Output from on-board regulator for GPIO customer access), or alternately, R66 (not mounted) can enable separate regulator U12. 4.3 RF Circuitry The printed metal F-antenna (ANT1) is the only option for this module. 1322x Sensor Node Reference Manual, Rev. 1.1 4-2 Freescale Semiconductor Interface Locations and Pinouts 4.4 USB Connector (“B” Receptacle) The USB connector is designated as J6. Figure 4-2 shows the connector pinout. Figure 4-2. USB Connector Pinout 4.5 LEDs, Switch, Buttons and Joystick The Sensor Node contains a total of four red LEDs and one green LED • The four red LEDs are driven by the MCU and controlled by the software application. • As previously discussed, the green LED is directly connected to the on-board regulation and acts as “Power On” indication. As also previously discussed SW7 is an on/off slide switch that connects the power supplies. There are five pushbuttons total. • One pushbutton (SW5) is separate and provides a master hardware Reset. • Four additional pushbuttons are connected to the MCU GPIO for software application. These buttons all have interrupt generation capability A joystick (SW6) is also provided. • The joystick is a “4-direction TACT Switch with Center Push”. • The 4-directional TACT switches are connected in parallel with the four user pushbuttons. • The center push switch is separate and does not have interrupt generation capability Table 4-2. Switch and LED Summary Item GPIO Connection Feature PWR (green) VCC ‘Power On’ indication LED1 (red) KBI_1 Application specific LED2 (red) KBI_2 Application specific LED3 (red) KBI_3 Application specific LED4 (red) TX_ON Application specific 1322x Sensor Node Reference Manual, Rev. 1.1 Freescale Semiconductor 4-3 Interface Locations and Pinouts Table 4-2. Switch and LED Summary (continued) Item 4.6 GPIO Connection Feature SW1 (pushbutton) KBI_4 Interrupt functionality. In parallel with SW6 (right). SW2 (pushbutton) KBI_5 Interrupt functionality. In parallel with SW6 (down). SW3 (pushbutton) KBI_6 Interrupt functionality. In parallel with SW6 (left). SW4 (pushbutton) KBI_7 Interrupt functionality. In parallel with SW6 (up). SW5 (RST) RESETB HW reset SW6 (right) KBI_4 Interrupt functionality. In parallel with SW1. SW6 (down) KBI_5 Interrupt functionality. In parallel with SW2. SW6 (left) KBI_6 Interrupt functionality. In parallel with SW3. SW6 (up) KBI_7 Interrupt functionality. In parallel with SW4. SW6 (center) KBI_0_HST_WK Host wake up output functionality. No interrupt functionality Debug/Development Connector (ARM JTAG Interface) The MC1322x supports connection to a subset of the defined ARM JTAG connector. The JTAG interface is a standard 2.54mm/0.1inch spacing, 20-pin debug interface (J1). The 20-pin connector is clearly separated from the GPIO pin header (J2) and located at the rear side of the module. The 20-pin connector has Pin 1 marking for correct plug-in of the development cable. Table 4-3 shows the device pins that are connected to the associated JTAG header pin outs if the JTAG connector is used. Table 4-3. ARM JTAG 20-Pin Connector Assignments (J1) Name1 Pin # Pin # Name VCC VCC NC2 GND TDI GND TMS GND TCK 10 GND RTCK 11 12 GND TDO 13 14 GND RESET3 15 16 GND NC 17 18 GND NC 19 20 GND NC means No Connect. MC1322x does not support separate JATG reset TRST. 3 VCC through a 100k-ohm pullup. 1322x Sensor Node Reference Manual, Rev. 1.1 4-4 Freescale Semiconductor Interface Locations and Pinouts 4.7 Audio Subsystem Connections The audio subsystem uses the following connections: • 2.5mm stereo jack J3 - for headset mic and earphone • Jumper J7 - selects audio output source. See Figure 4-3 for connections AUD FILTER INPUT J7 SERIAL DAC PWM TSM-103-01-L-SV Audio Select 1-2 DAC 3-2 PWM Figure 4-3. J7 Audio Output Source Jumper 4.8 GPIO Connector The GPIO connector (J2) is a standard 2.54mm/0.1inch spacing, 26-pin header. The connector provides access to MCU GPIO, an external clock source connection, a timer output, ADC inputs, the SSI port, a UART port, the SPI port, the I2C port, and the serial DAC output. Power is also provided on the connector. • VCC is the main supply voltage. Current draw should be limited to 50 mA. • CLKIN can be used to supply an external reference clock (nominally 24 MHz). The onboard crystal must be removed and an ac-coupling capacitor added. • Some of the GPIO are shared with onboard devices. Check for any conflict. • The serial DAC output is available at the connector. The DAC output should not be selected as the output audio source (J7) when used off board. Table 4-4. GPIO Connector J2 Pinouts Pin Name Function Notes TMR1 Timer I/O or GPIO Hardwired to accelerometer G-SEL1. CLKIN Source for external clock to reference oscillator • 13-26 MHz reference clock with <40 ppm accuracy • Onboard crystal must be removed • Enable signal to MC1322x by adding C58, 10pF; see schematic VCC Voltage supply from module 3V output from on-board regulation GND System ground ADC1 ADC Analog Input Channel or GPIO ADC2 ADC Analog Input Channel or GPIO Hardwired to accelerometer XOUT. Disable accelerometer. ADC3 ADC Analog Input Channel or GPIO Hardwired to accelerometer YOUT. Disable accelerometer. ADC4 ADC Analog Input Channel or GPIO Hardwired to accelerometer ZOUT. Disable accelerometer 1322x Sensor Node Reference Manual, Rev. 1.1 Freescale Semiconductor 4-5 Interface Locations and Pinouts Table 4-4. GPIO Connector J2 Pinouts (continued) ADC5 ADC Analog Input Channel or GPIO Hardwired to pressure out. 10 DAC_OUT Serial DAC Output Jumper J7 selects DAC output as audio output source 11 SSI_TX SSI Port or GPIO Hardwired to serial DAC 12 SSI_RX SSI Port or GPIO 13 SSI_FSYN SSI Port or GPIO Hardwired to serial DAC 14 SSI_BITCLK SSI Port or GPIO Hardwired to serial DAC 15 KBI_0_HST_WK Hardwired to “center” on joystick 16 KBI_4 Hardwired to “right” on joystick and SW1 17 UART2_TX UART2 or GPIO 18 UART2_RX UART2 or GPIO 19 UART2_RTS UART2 or GPIO 20 UART2_CTS UART2 or GPIO 21 I2C_SCL I2C Port or GPIO Hardwired to audio volume circuit. MAX5434L device has I2C address 0x50 22 I2C_SDA I2C Port or GPIO Hardwired to audio volume circuit. MAX5434L device has I2C address 0x50 23 SPI_SCK SPI Port or GPIO 24 SPI_SS SPI Port or GPIO 25 SPI_MOSI SPI Port or GPIO 26 SPI_MISO SPI Port or GPIO 4.9 FLASH Memory Recovery Jumpers and Erase The MC1322x has an onboard serial FLASH that stores the memory image that gets loaded into RAM at boot. If it becomes necessary to change or update the image in FLASH, there are two possible means of doing so: • JTAG Debug Port - Using the JTAG debug port and the ARM debug tools, the FLASH image can be changed. • Load new FLASH image via UART1 port NOTE The 1322x Sensor Node provides access for UART1 through the USB connection. If users need to employ UART1 with the Test Tool running on a PC, they must access the UART through the USB port as a virtual COM port. — The Freescale BeeKit IDE suite download provides a software tool called “Test Tool”. This application runs on a PC and can be used with a client running on the MC1322x to test the platform. 1322x Sensor Node Reference Manual, Rev. 1.1 4-6 Freescale Semiconductor Interface Locations and Pinouts — Test Tool also has the capability to load a new image into the FLASH. NOTE The FLASH must first be cleared before loading a new image. The 1322x Sensor Node has two jumper sites (J19 and J20, Figure 4-4) that must be used to erase the FLASH: 1. Short Jumper J19 Pin 1 to Pin 2 with a shorting bar. 2. Short Jumper J20 Pin 1 to Pin 2 with another shorting bar. 3. Turn on power, push the reset button and wait a few seconds. 4. Turn off power and remove the jumpers. 5. The board is now ready for boot operation. After the FLASH is erased, the module can be loaded with a new image through the USB port using Test Tool. Refer to the Test Tool User’s Guide as supplied with Test Tool in the BeeKit download. VCC C2 100nF R103 10K TP3 ADC2_VREFH J19 VCC TP103 J20 Recovery Mode HDR_2X1 ADC2_VREFH -> "0" ADC2_VREFL -> "1" HDR_2X1 ADC2_VREFL R104 10K Figure 4-4. FLASH Erase Headers 4.10 ADC Voltage References Two ADC reference voltages are provided: • The reference voltage for ADC2_VREFH is tied to VCC which is regulated when the board is supplied from the DC source or the USB port. However, this voltage moves with VCC when power is supplied via the battery source. • A fixed voltage reference for ADC1_VREFH is provided (see Figure 4-5). — The fixed voltage is 1.5 Vdc. — The LM285M (U17) is programmed via R120 and R121 to provide a constant reference — The reference can be enabled via Jumper J18. — This reference is useful for battery operation where a known, fixed high reference voltage for the ADC is required. 1322x Sensor Node Reference Manual, Rev. 1.1 Freescale Semiconductor 4-7 Interface Locations and Pinouts VCC J18 HDR_2X1 R1 10K Not Mounted 1.5V U17 ADC1_VREFH R120 120K 1% LM285M R121 24.9K 1% Figure 4-5. ADC Voltage 1.5 Vdc Voltage Reference 4.11 Jumper Selection Table 4-5 lists all the possible jumper selections for the Sensor Node. The jumpers available on the board are: • J7 - Selects audio output source • J18 - Sets fixed ADC reference voltage • J19, J20- Clears MC1322x onboard FLASH. See Table 4-5. Table 4-5. Sensor Node Jumper Selection Pin Header J7 J18 Pin Number Connection Default Setting Description 1-2 Connect to enable audio path from DAC Not mounted 2-3 Connect to enable audio path from PWM Mounted 1-2 Connect to enable ADC 1.5V reference Not mounted Connect both to recover/clear FLASH. See Section 4.9, “FLASH Memory Recovery Jumpers and Erase” Not mounted J19, J20 1-2, 1-2 1322x Sensor Node Reference Manual, Rev. 1.1 4-8 Freescale Semiconductor Freescale Semiconductor TP4 3 4 2 1 R6 390R ADC2 ADC4 DAC_OUT SSI_RX SSI_BITCK SWITCH1 UART2_RX UART2_CTS I2C_SDA SPI_SS SPI_MISO 90122-26 10 12 14 16 18 20 22 24 26 J2 11 13 15 17 19 21 23 25 11 13 15 17 19 21 23 25 VCC HDR_2X1 J20 GPIO Pin Header R71 10K Not Mounted 10 12 14 16 18 20 22 24 26 VCC R9 390R R73 10K VCC 0R R64 VCC VCC C48 4.7uF LM285M Not Mounted U17 R66 1.5V Vout Vin U12 R105 0R ADC1_VREFL ADC1_VREFH 1K 1K 1K 1K C7 22pF Not Mounted X2 32.768kHz Not Mounted R70 10pF 1K Not Mounted Not Mounted C54 C51 R69 10pF 1K Not Mounted Not Mounted TP2 External Clock Source SSI_TX SSI_RX SSI_BITCK SSI_FSYN R125 R124 R123 R122 ADC1_VREFH ADC2_VREFH C12 22pF Not Mounted X1 24.00MHz SWITCH4 SWITCH3 SWITCH2 SWITCH1 LED3 LED2 LED1 SWITCH5 SPI_SCK SPI_MOSI SPI_MISO SPI_SS UART2_TX UART2_RX UART2_RTS UART2_CTS ADC1_VREFL R4 ADC2_VREFL 0R Not Mounted R3 0R C49 1uF V_MAIN SKRHA Ce Co NC1 NC2 SW6 SWITCH3 SWITCH4 Note: SWITCH 5 does not have interrupt capability SWITCH2 SWITCH5 SWITCH1 CLKIN UART1_RX UART1_TX JTAG RTCK Disable UART1_CTS VCC ADC1 ADC2 ADC3 ADC4 ADC5 JTAG RTCK Enable UART1_RTS TMR1 RTCK Joystick DAC_OUT I2C_SDA I2C_SCL GND1 2 GND2 4 C50 100nF LT1129CST-3.3 TP11 R121 24.9K 1% R120 120K 1% R1 10K SCLK SYNC Din VOL_SDA VOL_SCL DAC_OUT AUDIO_PWM G-SEL2 G-SEL1 G_SLEEP Sensor/Audio HDR_2X1 J18 SW5 DTSM63N RESET MBR0520LT1 0R Not Mounted D11 TP46 ADC2_VREFL 3 4 2 1 Reset Button SW4 DTSM63N SWITCH4 R14 1K R11 220R D5 LGR971 POWER ADC2_VREFH ADC1 ADC3 ADC5 SSI_TX SSI_FSYN SWITCH5 UART2_TX UART2_RTS I2C_SCL SPI_SCK SPI_MOSI TMR1 R104 10K TP103 TP3 3 4 2 1 TP8 VCC Power ON D4 LHR974 LED4 SW3 DTSM63N SWITCH3 R103 10K 3 4 2 1 Note: SSI_FSYN becomes CLKO under test conditions VCC J19 R8 390R TP7 SW2 DTSM63N SWITCH2 C2 100nF 3 4 HDR_2X1 1-2 ADC2_VREFH -> "0" 3-4 ADC2_VREFL -> "1" CLKIN D3 LHR974 LED3 Push Buttons 2 1 R7 390R TP6 D2 LHR974 LED2 LEDs SW1 DTSM63N SWITCH1 TP5 D1 LHR974 LED1 Recovery Mode RESET SWITCH4 SWITCH3 SWITCH2 SWITCH1 LED4 LED3 LED2 LED1 USB / Power Supply V_AUD V_TMP V_AUD V_TMP V_AUD V_TMP XOUT YOUT ZOUT PRESS_OUT TEMP_OUT AUDIO_MIC 04 - Sensor/Audio Schematic V_PRE V_XYZ UART1_TX UART1_RX UART1_CTS UART1_RTS V_XYZ V_PRE V_PRE V_XYZ UART1_TX UART1_RX UART1_CTS UART1_RTS 05 - USB/Power Supply Schematic 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 84 85 86 87 88 93 94 95 96 97 104 105 106 115 47 48 TP10 TP9 50 49 TP1 35 36 37 38 39 40 41 42 34 33 31 32 27 28 29 30 21 22 20 19 17 18 16 15 13 14 23 24 25 26 62 61 63 64 MC13225 NC1 NC2 NC3 NC4 NC5 NC6 NC7 NC8 NC9 NC10 GND_FLAG_1 GND_FLAG_2 GND_FLAG_3 GND_FLAG_4 GND_FLAG_5 GND_FLAG_6 GND_FLAG_7 GND_FLAG_8 GND_FLAG_9 GND_FLAG_10 GND_FLAG_11 GND_FLAG_12 GND_FLAG_13 GND_FLAG_14 GND_FLAG_15 GND_FLAG_16 GND_FLAG_17 GND_FLAG_18 GND_FLAG_19 XTAL_32_IN XTAL_32_OUT XTAL_24_IN XTAL_24_OUT KBI_7 KBI_6 KBI_5 KBI_4 KBI_3 KBI_2 KBI_1 KBI_0_HST_WK SSI_TX SSI_RX SSI_BITCK SSI_FSYN SPI_SCK SPI_MOSI SPI_MISO SPI_SS I2C_SDA I2C_SCL UART1_TX UART1_RX UART1_RTS UART1_CTS UART2_TX UART2_RX UART2_RTS UART2_CTS TMR3 TMR2 TMR1 TMR0 ADC1_VREFL ADC2_VREFL ADC1_VREFH ADC2_VREFH ADC0 ADC1 ADC2 ADC3 ADC4 ADC5 ADC6 ADC7_RTCK U1 NC11 NC12 NC13 NC14 NC15 NC16 NC17 NC18 NC19 NC20 NC21 NC22 NC23 NC24 NC25 NC26 NC27 NC28 NC29 NC30 NC31 NC32 NC33 NC34 NC35 NC36 NC37 NC38 NC39 NC40 NC41 NC42 NC43 NC44 NC45 NC46 DIG_REG NVM_REG LREG_BK_FB COIL_BK VBATT RESETB TMS TCK TDI TDO EVTI_B EVTO_B MSEO1_B MSEO0_B MCKO/IO50 RDY_B MDO07 MDO06 MDO05 MDO04 MDO03 MDO02 MDO01 MDO00 RF_PLL_FLT VREG_ANA PA_POS PA_NEG RF_GND ANT_2 ANT_1 TX_ON RX_ON RF_RX_TX 80 81 82 83 89 90 91 92 98 99 100 101 107 108 109 110 116 117 118 119 125 126 127 128 134 135 136 137 138 139 140 141 142 143 144 145 124 133 44 43 45 51 12 11 10 132 123 113 114 131 122 129 130 120 121 111 112 102 103 46 55 54 53 58 57 56 52 59 60 C8 100pF TP44 0R R65 10pF VCC C11 1nF R12 100K VCC C1 Not Mounted C3 1pF Not Mounted TP45 C4 27nF Not Mounted L1 3.9nH Not Mounted C10 C9 1uF 10nF Not Mounted Not Mounted C5 180nF Not Mounted R5 240R Not Mounted LED4 RF RESET 10 12 14 16 18 20 10 12 14 16 18 20 Date: Size REF3 1Ref REF2 1Ref REF1 1Ref MH3 MH2 MH1 C6 100nF FIUO: --- PUBI: --- Thursday, March 27, 2008 Sheet of SOURCE: SCH-23451 PDF: SPF-23451 Main Schematic 1322X-SRB FCP: _X_ VCC Document Number Page Title: ICAP Classification: Drawing Title: ZZ1 Label 1322X-SRB JDP7049_3 PCB1 90122-20 11 13 15 17 19 J1 JTAG Debug nTRST 3 11 RTCK 13 15 DBGRQ17 DBGACK19 VCC ANT1 F_Antenna Rev Chapter 5 Schematic, Board Layout, and Bill of Material Figure 5-1. Sensor Node Schematic (1 of 3) 1322x Sensor Node Reference Manual, Rev. 1.1 5-1 A V_AUD TEMP_OUT V_TMP PRESS_OUT V_PRE G_SLEEP XOUT YOUT ZOUT G-SEL1 G-SEL2 V_XYZ V_AUD V_TMP V_PRE V_PRE C31 100nF TP21 R35 1K V_TMP NC5 NC4 NC3 NC2 NC1 MPXV5010G GND Vo Vs+ Vo GND LM61 17 12 15 14 13 C30 100nF V_TMP C23 100nF V_PRE MMA7260Q EP SleepMode XOUT YOUT ZOUT g-Select 1 g-Select 2 U3 R74 10K Not Mounted V_XYZ Vs+ U5 U7 Temperature Sensor R31 1K R17 R16 R18 Pressure Sensor C26 100nF TP18 0R 1K 1K 1K R108 C18 100nF TP14 XYZ Sensor C17 100nF TP13 C16 100nF TP12 V_XYZ N/C1 N/C2 N/C3 N/C4 N/C5 N/C6 N/C7 N/C8 VSS VDD 16 11 10 NC1 NC2 BUZ1 NDT-03C STX-2550-5NTR J3 Mic. Biasing C15 100nF V_XYZ TP25 TP50 R24 100K C24 1uF V_AUD 22uF 13K R61 V_AUD C44 1uF C19 11K R85 R25 1K R23 TP49 100K TP20 R57 4.7K R56 4.7K V_AUD TP48 TP17 10UF C14 V_AUD TP15 TP23 R15 4.7K V_AUD 11 5-2 R58 27K R20 200K A3 B3 B1 B2 C3 100K NCP4896 VP1 INM NC OUTA SD SE/BTL OUTB GND BYP U6 R26 47pF C20 C25 1uF A2 C2 A1 C1 Audio Amplifier 270pF C46 U14A MC33204DTBG C75 4.7nF 27K R59 C27 100nF 47K R29 14 C47 3.3nF U14D MC33204DTBG 13 - 12 + 10UF C32 100nF C22 8.2K R60 VCC SDA SCL GND TP51 C21 100nF Audio Amp Audio Amp Enable R34 Disable 0R Not Mounted 51K V_AUD C33 22nF 10K R87 V_AUD R33 0R V_AUD TP24 TP22 MAX5434 U13 Audio Select 1-2 DAC 3-2 PWM R32 0R Not Mounted R67 27K TSM-103-01-L-SV R30 220R TP19 1.8K R86 220nF C45 J7 C28 47nF Audio Filter TP27 R88 VCC VCC R107 4.7K 4 R109 6 R111 R106 4.7K DAC101S101 VDD Din Vout SCLK GND SYNC U4 Audio DAC U14B MC33204DTBG 6 - 5 + 100pF C74 U14C MC33204DTBG 10 TP16 0R 0R R110 0R C13 100nF V_AUD 0R R84 FCP: _X_ FIUO: --- of Sheet SOURCE: SCH-23451 PDF: SPF-23451 Thursday, March 27, 2008 Date: PUBI: --- Document Number Sensor/Audio Schematic 1322X-SRB Size Page Title: ICAP Classification: Drawing Title: VOL_SDA VOL_SCL AUDIO_PWM Din SCLK SYNC DAC_OUT AUDIO_MIC Rev Schematic, Board Layout, and Bill of Material Figure 5-2. Sensor Node Schematic (2 of 3) 1322x Sensor Node Reference Manual, Rev. 1.1 Freescale Semiconductor A USB-B VUSB DataData+ GND SHIELD1 SHIELD2 J6 15pF C42 15pF C43 500mA RT2 SW7-4 MFP461N-RA R50 R51 60OHM L2 0R 0R 2462 BC1 C52 10nF C40 100nF TP38 C53 4.7uF R40 10K C41 100nF V_USB LT1129CST-3.3 GND1 GND2 Vin Vout U9 TP36 Power Management USB Interface C34 1uF V_MAIN 2xAA Cells MBR0520LT1 D8 MBR0520LT1 SW7-1 MFP461N-RA MBR0520LT1 TP26 D7 D6 SW7-2 MFP461N-RA DJ-005 J5 V_USB 10 11 12 Freescale Semiconductor 17 20 26 12 13 23 27 28 18 15 14 16 19 FT232R GND1 GND2 GND3 TEST NC1 NC2 NC3 NC4 OSCI OSCO RESET USBDM USBDP 3V3OUT AGND EP NC5 NC6 CBUS4 CBUS3 CBUS2 CBUS1 CBUS0 TxD RxD RTS CTS DTR DSR DCD RI VCCIO 24 33 25 29 11 10 21 22 30 32 31 TP39 TP40 TP41 TP42 TP43 0R R68 UART1_RX UART1_TX UART1_RTS UART1_CTS 0R R44 0R R43 0R R38 0R R37 V_TMP V_AUD V_XYZ V_PRE TP34 TP33 TP31 TP30 Power Measurement VCC TP32 TP47 C37 4.7uF C38 100nF Q1 ZXM61P02F RT1 500mA D10 MBR0520LT1 TP29 SW7-3 MFP461N-RA C36 4.7uF VCC U10 R42 100K C35 100nF D9 MBR0520LT1 TP28 V_TMP V_AUD V_XYZ V_PRE FCP: _X_ FIUO: --- of Sheet Thursday, March 27, 2008 Date: SOURCE: SCH-23451 PDF: SPF-23451 Document Number PUBI: --- Size USB/Power Supply 1322X-SRB ICAP Classification: Drawing Title: Page Title: Rev Schematic, Board Layout, and Bill of Material Figure 5-3. Sensor Node Schematic (3 of 3) 1322x Sensor Node Reference Manual, Rev. 1.1 5-3 Schematic, Board Layout, and Bill of Material Figure 5-4. Sensor Node PCB Component Location (Top View) Figure 5-5. Sensor Node PCB Test Points (Bottom View) 1322x Sensor Node Reference Manual, Rev. 1.1 5-4 Freescale Semiconductor Schematic, Board Layout, and Bill of Material Figure 5-6. Sensor Node PCB Layout (Top View) Figure 5-7. Sensor Node PCB Layout (Bottom View) 1322x Sensor Node Reference Manual, Rev. 1.1 Freescale Semiconductor 5-5 Schematic, Board Layout, and Bill of Material Table 5-1. Bill of Materials QTY Part Reference Description Value Voltage Tolerance Manufacturer Manufacturer Part Number ANT1 F_Antenna PCB F ANTENNA NOT A PART NOT A PART BUZ1 SMD Speaker NDT-03C Star Micronics NDT-03C BC1 PCB Battery Holder 2xAA 2462 Keystone 2462 C1,C51,C 54 Ceramic Capacitor 10pF C0G 50V 5% Murata GRM1555C1H100JZ01 C14,C32 CAP CER 10UF 6.3V 20% X5R 0603 6.3V 20% PANASONIC ECJ1VB0J106M C24,C25, C44 Ceramic Capacitor 1uF X5R 6.3V 10% Murata GRM155R60J105KE19B C10 Ceramic Capacitor 1uF X5R 6.3V 10% Murata GRM155R60J105KE19B C11 Ceramic Capacitor 1nF X7R 50V 10% Murata GRM155R71H102KA01D C19 Ceramic Capacitor 22uF X5R 6.3V 20% Murata GRM21BR60J226ME39L 19 C2,C6,C1 Ceramic Capacitor 100nF 3,C15,C16 X5R ,C17,C18, C21,C22, C23,C26, C27,C30, C31,C35, C38,C40, C41,C50 10V 10% Murata GRM155R61A104KA01D C20 Ceramic Capacitor 47pF C0G 50V 5% Murata GRM1555C1H470JZ01D C28 Ceramic Capacitor 47nF X7R 25V 10% Murata GRM155R71E473KA88 C3 Ceramic Capacitor 1pF C0G 50V 0.25pF Murata GRM1555C1H1R0CZ01D C33 Ceramic Capacitor 22nF X7R 25V 10% Murata GRM155R71E223KA61D C34,C49 Ceramic Multilayer 1uF Capacitor X7R NoPb 16V 15% Murata GRM21BR71C105 C36,C37, C48 Ceramic Multilayer 4.7uF Capacitor X5R 16V 15% Phycomp 2222 781 13672 10uF 1322x Sensor Node Reference Manual, Rev. 1.1 5-6 Freescale Semiconductor Schematic, Board Layout, and Bill of Material Table 5-1. Bill of Materials QTY Part Reference Description Value Voltage Tolerance Manufacturer Manufacturer Part Number C4 Ceramic Multilayer 27nF Capacitor X7R 10V 5% Vishay VJ0402Y273JXQCW1BC C42,C43 Ceramic Capacitor 15pF C0G 50V 5% Murata GRM1555C1H150JZ01J C45 Ceramic Capacitor 220nF X7R 10V 10% Murata GRM188R71A224KA01 C46 Ceramic Capacitor 270pF C0G 50V 5% Murata GRM1555C1H271JA01 C47 Ceramic Capacitor 3.3nF C0G 50V 15% Murata GRM155R71H332KA01 C5 Ceramic Multilayer 180nF Capacitor X7R 16V 5% Vishay VJ0603Y184JXJCW1BC C53 Ceramic Multilayer 4.7uF Capacitor X5R 10V 10% Murata GRM219R61A475KE34D C7,C12 Ceramic Capacitor 22pF C0G 50V 5% Murata GRM1555C1H220JZ01J C8,C74 Ceramic Capacitor 100pF C0G 50V 5% Murata GRM1555C1H101JZ01 C52 Ceramic Capacitor 10nF X7R 25V 10% Murata GRM155R71E103KA01D C75 Ceramic Capacitor 4.7nF X7R 25V Murata GRM155R71E472KA01D C9 Ceramic Capacitor 10nF X7R 25V Murata GRM155R71E103KA01D D1,D2,D3, SMD Red topled D4 LHR974 OSRAM Q62702P5182 D5 SMD Green topled LGR971 OSRAM Q65110P5179 D6,D7,D8, SMD Power D9,D10,D Schottky Rectifier 11 MBR0520LT1 J3 2.5mm Audio stereo jack with switch STX-2550-5NTR Kycon STX-2550-5NTR J7 Single Row Straight Pin Header SMD w. Plastic Pick & Place Pad TSM-103-01-L-S Samtec TSM-103-01-L-SV-P-TR J19,J20 HDR 1X2 TH 100MIL SP 330H AU TSW-102-07-S-S SAMTEC TSW-102-07-S-S 20V 10% On MBR0520LT1G Semiconductor 1322x Sensor Node Reference Manual, Rev. 1.1 Freescale Semiconductor 5-7 Schematic, Board Layout, and Bill of Material Table 5-1. Bill of Materials QTY Part Reference Description Value Voltage Tolerance J18 HDR 1X2 TH 100MIL SP 330H AU TSW-102-07-S-S L1 HF Chip coil 3.9nH L2 Chip Ferrite Bead 500mA Q1 P-channel MOSFET ZXM61P02F 20V R1,R40,R Fixed resistor 73,R87,R1 RC31 03,R104 10K 50V 17 R3,R33,R Fixed resistor 37,R38,R4 RC31 3,R44,R50 ,R51,R64, R65,R68, R84,R105, R108,R10 9,R110,R1 11 0R R4,R32,R 34,R66 Fixed resistor RC31 R11,R30 Manufacturer Manufacturer Part Number SAMTEC TSW-102-07-S-S Murata LQG15HS3N9S02D Murata BLM11P600Sxx Zetex ZXM61P02F 2% Philips 2322 705 50103 50V 2% Philips 2322 705 91002 0R 50V 2% Philips 2322 705 91002 Fixed resistor RC31 220R 50V 2% Philips 2322 705 50221 R12,R23, R24,R26, R42 Fixed resistor RC31 100K 50V 2% Philips 2322 705 50104 R14,R16, R17,R18, R25,R31, R35 Fixed resistor RC31 1K 50V 2% Philips 2322 705 50102 R69,R70 Fixed resistor RC31 1K 50V 2% Philips 2322 705 50102 R15,R56, Fixed resistor R57,R106, RC31 R107 4.7K 50V 2% Philips 2322 705 50472 R20 Fixed resistor RC31 200K 50V 2% YAGEO AMERICA RC0402JR-07200KL R71,R74 Fixed resistor RC31 10K 50V 2% Philips 2322 705 50103 R29 Fixed resistor RC31 47K 50V 2% Philips 2322 705 50473 R5 Fixed resistor RC31 240R 50V 2% Philips 2322 705 50241 5% 1322x Sensor Node Reference Manual, Rev. 1.1 5-8 Freescale Semiconductor Schematic, Board Layout, and Bill of Material Table 5-1. Bill of Materials QTY Part Reference R58,R59, R67 Description Fixed resistor RC31 Value Voltage Tolerance Manufacturer Manufacturer Part Number 27K 50V 2% Philips 2322 705 50273 R6,R7,R8, Fixed resistor R9 RC31 390R 50V 2% Philips 2322 705 50391 R60 Fixed resistor RC31 8.2K 50V 2% Philips 2322 705 50822 R61 Fixed resistor RC31 13K 50V 2% Philips 2322 705 50133 R85 Fixed resistor RC32 11K 50V KOA SPEER RK73H1ETTP1102F R86 Fixed resistor RC33 1.8K 50V KOA SPEER RK73H1ETTP1801F R88 Fixed resistor RC34 51K 200V KOA SPEER RK73H1ETTP5102F R120 RES MF 120K 1/16W 1% 0402 120K 1% KOA SPEER RK73H1ETTP1203F R121 RES MF 24.9K 1/16W 1% 0402 24.9K 1% KOA SPEER RK73H1ETTP2492F R122,R12 RES MF 1.0K 3,R124,R1 1/16W 5% 0402 25 1K 5% VISHAY INTERTECHN OLOGY CRCW04021K00JNED RT1,RT2 500mA Tyco Electronics microSMD050F SW1,SW2, SMD Tact Switch SW3,SW4, 2.6N (7.0mm) SW5 Diptronic DTSM-63N-V-B SW6 4-directional TACT SKRHA switch with center push SMD ALPS SKRHAAE010 SW7 Miniature Slide Switch 4 pole MFP461N-RA Knitter-Switch MFP461N-RA U1 ZigBee Wireless Transceiver and ARM7 processor MC13225 Freescale MC13225 U10 USB UART, PB-free FT232R FTDI FT232RQ U13 Digitally Controlled MAX5434 Potentiometer, 50Kohm Maxim MAX5434LEZT+T Polyswitch Overcurrent Protection Device DTSM63N 13.2V 1322x Sensor Node Reference Manual, Rev. 1.1 Freescale Semiconductor 5-9 Schematic, Board Layout, and Bill of Material Table 5-1. Bill of Materials QTY Part Reference Description Value Voltage Tolerance Manufacturer Manufacturer Part Number U3 +/-1.5g to 6g Three MMA7260Q axis low-g accelerometer Freescale MMA7260QR2 U4 10-bit Low Power DAC101S101 DAC with rail to rail output National DAC101S101CIMK-NoPB Semiconductor U5 Integrated Pressure Sensor MPXV5010G Freescale U6 Audio class AB amplifier, 1,0W NCP4896 On NCP4896FCT1G Semiconductor U7 Temperature Sensor 2,7V LM61 National LM61BIM3 Semiconductor U9,U12 LDO voltage regulator 3V3 LT1129CST-3.3 Linear Technology U14 IC LIN OPAMP MC33204DTBG QUAD 2.2MHZ 1.8-12V TSSOP14 ON MC33204DTBG SEMICONDUC TOR U17 IC VREG ADJ 1.24-5.3V 20MA SOIC8 LM285M National LM285M/NOPB Semiconductor X1 Crystal SMD 24.00MHz +-10ppm NDK NX3225SA-24MHz (for OA/AV and BlueTooth) / S1-3085-1510-9 X2 Crystal SMD 32.768kHz +-20ppm Abracon ABS25-32.768KHZ-T J1 Dual Row Right Angle pin header 0.38um gold 90122-20 Molex 90122-0770 J2 Dual Row Right Angle pin header 0.38um gold 90122-26 Molex 90122-0773 J5 DC Power Jack PCB, 2mm DJ-005 Taitek 2DC-0005-D100 J6 USB-series "B" receptacle USB-B AMP 292304-1 MPXV5010GC6U LT1129CST-3.3 1322x Sensor Node Reference Manual, Rev. 1.1 5-10 Freescale Semiconductor
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File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.6 Linearized : No Page Mode : UseOutlines XMP Toolkit : 3.1-702 Producer : Acrobat Distiller 7.0.5 (Windows) Creator Tool : FrameMaker 7.1 Modify Date : 2008:07:24 18:37:14-06:00 Create Date : 2008:07:17 09:39:37Z Metadata Date : 2008:07:24 18:37:14-06:00 Format : application/pdf Title : untitled Document ID : uuid:3189bef4-0300-4407-85db-b52812eabbfd Instance ID : uuid:1d867b17-5f26-4520-a4e0-5d68c29ea769 Page Count : 38 Creator : FrameMaker 7.1EXIF Metadata provided by EXIF.tools