HB Wireless Communication Technology CG757560 RF module User Manual S200 SPEC

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Document ID	3185042
Application ID	QUQNrvCX2aXEl4nY6mRJSQ==
Document Description	Users Manual
Short Term Confidential	No
Permanent Confidential	No
Supercede	No
Document Type	User Manual
Display Format	Adobe Acrobat PDF - pdf
Filesize	55.37kB (692161 bits)
Date Submitted	2016-11-03 00:00:00
Date Available	2016-11-14 00:00:00
Creation Date	2016-11-03 17:38:05
Producing Software	Microsoft® Office Word 2007
Document Lastmod	2016-11-03 17:38:05
Document Title	S200 SPEC
Document Creator	Microsoft® Office Word 2007
Document Author:	AcSiP Technology Corp.

HongBo
HM7601 SIP Module
User Manual
Product
Version
Date
Document History
Date
Oct. 18th,2015
Revised Contents
Preliminary version
Revised by
Version
Derrick
1.0
INDEX
1. Description................................................................................................................................................. 4
1-1. Block Diagram ....................................................................................................................................... 5
1-2. Specification .......................................................................................................................................... 6
2. Electrical Characteristics............................................................................................................................ 7
2-1. Absolute Maximum Ratings ................................................................................................................. 7
2-2. Recommended Operation Conditions ................................................................................................. 7
2-3. Current consumption ............................................................................................................................ 7
2-4. RF Characteristics .................................................................................................................................. 8
2-4-1. RF Tx Specification ........................................................................................................................... 8
2-4-2. RF Rx Specification ......................................................................................................................... 10
2-5. SDIO Host Interface Protocol Timing ......................................................................................................
2-5-1. SDIO 25MHz Timing Waveform ..........................................................................................................
2-5-2. SDIO 50MHz Timing Waveform ..........................................................................................................
3. Pin Definition ........................................................................................................................................... 11
3-1. Pin Description ...................................................................................................................................... 11
3-2. Pin Assignment ..................................................................................................................................... 11
3-3. Mechanical Dimensions ....................................................................................................................... 12
4. Regulation ................................................................................................................................................ 13
5. Recommended Reflow Profile ................................................................................................................ 13
6. SiP Module Preparation .......................................................................................................................... 14
6-1. Handling .............................................................................................................................................. 14
6-2. SMT Preparation ................................................................................................................................. 14
7. Package Information ............................................................................................................................... 15
7-1. Product Making................................................................................................................................... 15
7-2. Tray Dimension ........................................................................................................................................
7-3. Packing Information............................................................................................................................ 16
7-4. Humidity Indicator Card ..................................................................................................................... 17
1. Description
HM7601 is a low-cost Wi-Fi SIP module, which fully supports the features and functional compliance of IEEE
802.11b/g/n standards. It supports up to 150Mbps high-speed wireless network connections. Also, it is
designed to provide excellent performance with low power consumption as well as a cost-effective solution.
The module is able to be developed for Wi-Fi USB dongle, Wi-Fi camera, wireless module for IoT products..etc.
Feature

Small dimension : 11mm X 11mm X 2.0mm

Host interface : USB 2.0

Support Orthogonal Frequency Division Multiplexing(OFDM), Complementary Code Keying(CCK), and Direct
Sequence Spread Spectrum(DSSS) to provide a variety of data rates

Integrated switching regulator enables direct connection to battery

Support AP /STA / ad-hoc mode / Wi-Fi direct

IEEE 802.11n (HT20 MCS7), IEEE 802.11g(OFDM 54Mbps) and IEEE 802.11b(DSSS 11Mbps)

Support Wi-Fi Direct (WFA P-2-P Standard)

Security: WFA WPA/WPA2 personal, WPS2.0, WAPI

QoS: WFA WMM, WMM PS

Compatible with Windows XP, Vista, W7 32/64, W8 32/64, W8.1 32/64

Linux and MAC OS X

Plug and play, easy set-up installation
1-1. Block Diagram
A simplified block diagram of the HM7601 SiP module is shown in the figure below.
USB Interface
Crystal
40MHz
Interface Signals
MT7601
WL/2.4G/TRx
Balun
ANT
Filter
AI7601H
External 3.3V
1-2. Specification
Model Name
HM7601
Product Description
Wi-Fi SiP Module
Network Standard
IEEE 802.11b/g/n Compliant
Host Interface
USB 2.0
Operation Conditions
Operating Voltage
3.3V typ.
Temperature
Operating : 0℃ ~ 70℃
Storage : -40℃ ~ 125℃
Humidity
Operating : 10 ~ 95% (Non-Condensing)
Storage : 5 ~ 95% (Non-Condensing)
Dimension
11mm X 11mm X 2.0mm
Package
Half hole stamp type
Electrical Specifications
Frequency
2.4GHz ISM radio band
Channel
1~14
Modulation
DSSS, OFDM, 64-QAM, 16-QAM, QPSK, BPSK, CCK, DQPSK, DBPSK
Security
 WFA WPA/WPA2 personal
 WPS2.0
 WAPI
Operation System
Windows XP, Vista, W7 32/64, W8 32/64, W8.1 32/64 ; Linux and MAC
OS X
2. Electrical Characteristics
2-1. Absolute Maximum Ratings
Symbol
VDD33
Parameter
Min.
Max.
Unit
-0.3
3.6
Min.
Typ.
Max.
Unit
2.97
3.3
3.63
Power supply
2-2. Recommended Operation Conditions
Symbol
VDD33
Parameter
Power supply
2-3. Current consumption
Description
Performance
Typ.
Units
Sleep mode
1.1
μA
RX Active, BW40, MCS7
151
mA
RX Listen
mA
RX Power saving, DTIM=1
15
mA
TX HT40, MCS7@15dBm
210
mA
TX CCK, 11M@19dBm
242
mA
Note: All result is measured at the antenna port and VDD33 is 3.3V.
2-4. RF Characteristics
2-4-1. RF Tx Specification (@module O/P)
802.11b Transmit
Item
Condition
Min.
Frequency range
Tx Power Level
Channel 1
1~11Mbps DSSS
16
Max.
Unit
Channel 14
20
dBm
10
ppm
11MHz→22MHz
-30
dBr
＞22MHz
-50
dBr
Frequency tolerance
Spectral Mask
Typ.
18
-10
Tx power-on
10%→90%
0.2
uS
Tx power-down
90%→10%
0.2
uS
Modulation accuracy
1/2/5.5/11 Mbps
20
Typ.
Max.
Unit
802.11g Transmit
Item
Condition
Frequency range
Tx Power Level
Channel 1
6~54Mbps OFDM
Frequency tolerance
Modulation accuracy
Spectral Mask
Spectral flatness
Min.
14
Channel 14
16
-10
18
dBm
10
ppm
54Mbps
<-30
-25
dB
48 Mbps
<-30
-22
dB
36 Mbps
<-30
-19
dB
24 Mbps
<-30
-16
dB
18 Mbps
<-30
-13
dB
12 Mbps
<-30
-10
dB
9 Mbps
<-30
-8
dB
6 Mbps
<-30
-5
dB
11MHz
-20
dBr
20MHz
-28
dBr
30MHz
-40
dBr
±10 sub-carrier
-2
dB
±17→±26 sub-carrier
-4
dB
802.11n Transmit
Item
Condition
Frequency range
Tx Power Level
Spectral Mask
Spectral flatness
Typ.
Channel 1
HT20 MCS0~7
Frequency tolerance
Modulation accuracy
Min.
13
Max.
Unit
Channel 14
15
-10
17
dBm
10
ppm
MCS 7
<-30
-28
dB
MCS 6
<-30
-25
dB
MCS 5
<-30
-22
dB
MCS 4
<-30
-19
dB
MCS 3
<-30
-16
dB
MCS 2
<-30
-13
dB
MCS 1
<-30
-10
dB
MCS 0
<-30
-5
dB
11MHz
-20
dBr
20MHz
-28
dBr
30MHz
-45
dBr
±10 sub-carrier
-2
dB
±17→±28 sub-carrier
-4
dB
2-4-2. RF Rx Specification (@module O/P)
802.11b Receiver
Item
Condition
Min.
Frequency range
Min. input
(PER<8%)
Max. input level
Typ.
Channel 1
Max.
Unit
Channel 14
11Mbps
-84
-76
dBm
5.5Mbps
-87
-76
dBm
2Mbps
-89
-80
dBm
1Mbps
-92
-80
dBm
11Mbps
dBm
802.11g Receiver
Item
Condition
Frequency range
Min. input
(PER<10%)
Max. input level
Min.
Typ.
Channel 1
Max.
Unit
Channel 14
54Mbps
-71
-65
dBm
48Mbps
-72
-66
dBm
36Mbps
-77
-70
dBm
24Mbps
-80
-74
dBm
18Mbps
-83
-77
dBm
12Mbps
-85
-79
dBm
9Mbps
-87
-81
dBm
6Mbps
-88
-82
dBm
6/54Mbps
0/-10
dBm
802.11n HT20 Receiver
Item
Condition
Frequency range
Min. input
(PER<10%)
Max. input level
Min.
Typ.
Channel 1
Max.
Unit
Channel 14
MCS 7
-70
-64
dBm
MCS 6
-71
-65
dBm
MCS 5
-73
-66
dBm
MCS 4
-77
-70
dBm
MCS 3
-80
-74
dBm
MCS 2
-83
-77
dBm
MCS 1
-85
-79
dBm
MCS 0
-87
-82
dBm
MCS0/MCS7
-10/-14
dBm
10
3. Pin Definition
3-1. Pin Description
Pin
Definition
I/O
Description
VDD33
Power
Main power supply
GND
Power
Ground
DP
AIO
D+ data input/output
DM
AIO
D- data input/output
WL_GPIO5
DIO
LED indicator control signal
WL_GPIO2
DIO
WPS button control signal
GND
Power
ANT_Module
RF
GND
Power
Ground
2.4GHz RF output
Ground
11
3-2. Pin Assignment and Mechanical Dimensions
The SiP module will conform to the following pin map, shown in the following diagram (top view)
TOP View
Pin1
Pin9
UNIT: mm
12
4. Regulation
The SiP module was pre-scanned with module level to comply with following standards:
• US/CAN: FCC CFR47 Part 15.247
• Europe: ETS 300-328 V1.6.1
5. Recommended Reflow Profile
13
6. SiP Module Preparation
6-1. Handling
Handling the module must wear the anti-static wrist strap to avoid ESD damage. After each module is aligned
and tested, it should be transport and storage with anti -static tray and packing. This protective package must
be remained in suitable environment until the module is assembled and soldered onto the main board.
6-2. SMT Preparation
1. Calculated shelf life in sealed bag: 6 months at<40℃ and <90% relative humidity (RH).
2. Peak package body temperature: 250℃.
3. After bag was opened, devices that will be subjected to reflow solder or other high temperature process
must.
A.
Mounted within: 168 hours of factory conditions<30℃/60%RH.
B.
Stored at≦10%RH with N2 flow box.
4. Devices require baking, before mounting, if:
A.
Package bag does not keep in vacuumed while first time open.
B.
Humidity Indicator Card is >10% when read at 23±5℃.
C.
Expose at 3A condition over 8 hours or Expose at 3B condition over 24 hours.
5. If baking is required, devices may be baked for 12 hours at 125±5℃.
14
7. Federal Communications Commission (FCC) Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)
This device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to
Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference to
radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the interference
by one of the following measures:

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.

Connect the equipment into an outlet on a circuit different from that
to which the receiver is connected.

Consult the dealer or an experienced radio/TV technician for help.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1) this device may not cause harmful interference and
2) this device must accept any interference received, including interference that may cause undesired
operation of the device.
FCC RF Radiation Exposure Statement:
1. This Transmitter must not be co-located or operating in conjunction with any other antenna or
15
transmitter.
2. This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with a minimum distance of 20 centimeters between
the radiator and your body.
End Product Labeling:
This module is designed to comply with the FCC statement, FCC ID :2AJICCG757560
The host system using this module, should have label in a visible area indicated the following texts:
"Contains FCC ID :2AJICCG757560".
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the ed product which integrates this module.
The end user manual shall include all required regulatory information/warning as shown in this manual.
16

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PDF Version                     : 1.5
Linearized                      : No
Page Count                      : 16
Language                        : zh-TW
Tagged PDF                      : Yes
Title                           : S200 SPEC
Author                          : AcSiP Technology Corp.
Creator                         : Microsoft® Office Word 2007
Create Date                     : 2016:11:03 17:38:05+08:00
Modify Date                     : 2016:11:03 17:38:05+08:00
Producer                        : Microsoft® Office Word 2007

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