HUNAN FN LINK TECHNOLOGY F11AMIM13-B1 WIFI Module User Manual

FN-LINK TECHNOLOGY LIMITED WIFI Module Users Manual

15_F11AMIM13-B1 UserMan,r1

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Document ID3322979
Application IDM44J5V2K1kf2ZaPMxmcWig==
Document Description15_F11AMIM13-B1 UserMan,r1
Short Term ConfidentialNo
Permanent ConfidentialNo
SupercedeNo
Document TypeUser Manual
Display FormatAdobe Acrobat PDF - pdf
Filesize60.33kB (754150 bits)
Date Submitted2017-03-20 00:00:00
Date Available2017-03-20 00:00:00
Creation Date2015-11-02 17:53:38
Document Lastmod2016-12-12 13:12:18
Document TitleUsers Manual
Document CreatorWPS Office
Document Author: YlmF

FN-LINK TECHNOLOGY LIMITED
A Building,HuiXin industrial park,No 31,
YongHe road, Fuyong town, Bao'an
District,Shenzhen City, CHINA
TEL: 86-0755-29558186
FAX: 86-0755-29558196
Website: www.fn-link.com
Product Specification
IEEE 802.11 b/g/n 2.4GHz 1T1R WiFi Module
Project Name
RTL8711AM IoT Module
Model NO
F11AMIM13-B1
Customer
Customer’s Part NO
Approved: William Tan
Checked: Jim Hu
Drafted: Neal Yu
Feedback of customer’s Confirmation
We accept the specification after Confirmed.
Customer
Customer signature
Approved Date
FN-LINK TECHNOLOGY LIMITED
CONTENTS
REVESION HISTORY....................................................................................................................................3
INTRODUCTIONS.......................................................................................................................................... 4
1.1
OVERVEIW.............................................................................................................................................. 4
1.2
PRODUCT FEATURES..........................................................................................................................4
BLOCK DIAGRAM..........................................................................................................................................5
GENERAL SPECIFICATION.........................................................................................................................6
MECHANICAL AND ELECTRICAL SPECIFICATION.............................................................................. 7
4.1
OUTLINE DRAWING..............................................................................................................................7
4.2
PIN DEFINITION.....................................................................................................................................9
4.3
PCB LAY-OUT REFERENCE..............................................................................................................11
4.4
RECOMMENDED REFLOW PROFILE............................................................................................ 12
4.5
NOTICE.................................................................................................................................................. 12
Page2/12
FN-LINK TECHNOLOGY LIMITED
0. Revision History
REV NO
Rev0.1
Date
2015-03-20
Modifications
First Released
Draft
Approved
Neal Yu
William Tan
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FN-LINK TECHNOLOGY LIMITED
1. Introduction
1.1 Overview
F11AMIM13-B1 is a highly integrated module with low power 802.11n Wireless LAN(WLAN) network
controller. It combines an ARM-CM3 MCU, WLAN MAC, a 1T1R capable WLAN baseband, and RF
function. It also provides a bunch of configurable GPIOs which are configured as digital peripherals for
different applications and control usage.
F11AMIM13 integrates internal memories for complete WIFI protocol functions.
1.2 Product Features
General
 24mm*18mm*1.6mm
 CMOS MAC, Baseband PHY, and RF in the module for 802.11b/g/n compatible WLAN
 Complete 802.11n solution for 2.4G band
 150Mbps receive PHY rate and 150Mbps transmit PHY rate using 40MHz bandwidth
Standards Supported
 802.11b/g/n compatible WLAN
 802.11e QoS Enhancement(WMM)
 802.11i(WPA,WP2). Open, shared key, and pair-wise key authentication services
 WiFi Direct support
 Light Weight TCP/IP protocol
WLAN PHY Features
 802.11n OFDM
 One Transmit and one Receive path(1T1R)
 20MHz and 40MHz bandwidth transmission
 Short Guard Interval(400ns)
 Maximum data rate 54Mbps in 802.11g and 150Mbps in 802.11n
Host Interface
 2 x UART
 1x I2C
 1x SPI
 3x PWM
 1x ADC
 GPIO
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FN-LINK TECHNOLOGY LIMITED
2. Block diagram
The general block diagram for the module is shown in Figure 1
Figure 1
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FN-LINK TECHNOLOGY LIMITED
3. General specification
General features
Main Chipset
Realtek RTL8711AM
Host Interface
UART,I2C,SPI,PWM,ADC
WiFi Standards
802.11b/g/n
Other RF Standards
None
Dimension
L24.0mm*W18.0mm*H0.8mm
Operating conditions
Operating Voltage
3.3±10% Vdc
Operating Temperature
0°C to +70°C
Storage Temperature
-40°C to +80°C
RF features
Operating Frequency
2.400~2.4835GHz
Channels
WiFi:
USA/Canada: channel 1~11;
Europe/China/Australia: channel 1~13;
Japan: channel 1~14
Modulation
WiFi:
802.11b(DSSS): CCK(11, 5.5Mbps), DQPSK(2Mbps), DBPSK(1Mbps);
802.11g(OFDM): BPSK(9,6Mbps), QPSK(18,12Mbps),
16QAM(36,24Mbps), 64QAM(54,48Mbps);
802.11n(OFDM): BPSK, QPSK, 16QAM, 64QAM(150Mbps)
PHY Data rates
WiFi:
802.11b: 11,5.5,2,1 Mbps
802.11g: 54,48,36,24,18,12,9,6 Mbps
802.11n: up to 150Mbps
Output Power
WiFi:
802.11b 16±2dBm
802.11g 14±2dBm
802.11n 13±2dBm
EVM
802.11b EVM≦35%
802.11g EVM≦-25dB
802.11n EVM≦-28dB
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FN-LINK TECHNOLOGY LIMITED
WiFi:
802.11b@8% PER
1Mbps -88dBm
2Mbps -87dBm
5.5Mbps -85dBm
11Mbps -82dBm
802.11g@10% PER
6Mbps -86dBm
9Mbps -85dBm
12Mbps -84dBm
18Mbps -82dBm
24Mbps -80dBm
36Mbps -77dBm
48Mbps -73dBm
54Mbps -71dBm
Sensitivity
802.11n_HT20@10% PER
MCS 0 -83dBm
MCS 1 -82dBm
MCS 2 -80dBm
MCS 3 -78dBm
MCS 4 -75dBm
MCS 5 -71dBm
MCS 6 -69dBm
MCS 7 -67dBm
Other features
Antenna
Internal Antenna
Network Architecture
WiFi:
Ad-hoc mode (Peer-to-Peer )
Infrastructure mode
WiFi Direct
Security
802.11i(WPA,WP2). Open, shared key, and pair-wise key
authentication services
4. Mechanical and Electrical Specification
4.1 Outline Drawing(Unit: mm)
Top Side
Bottom Side
Note:There Will be Changes in Layout ,But the Outline Will not Change,The Follow-up Will be Updated
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FN-LINK TECHNOLOGY LIMITED
(Top View)
Page8/12
FN-LINK TECHNOLOGY LIMITED
4.2 Pin Definition(Top View)
Pin Assignment
Pin#
Name
Description
GND
Ground
GND
Ground
NC
Not Connected
NC
Not Connected
NC
Not Connected
NC
Not Connected
VDDIO
GPIOE and GPIOC group IO power
NC
Not Connected
GPIO_4
GPIO Pin
10
GPIO_3
GPIO Pin
11
GPIOE_2/PWM2
GPIO Pin, PWM(multiplexing)
12
GPIOE_1/PWM1
GPIO Pin, PWM(multiplexing)
13
GPIOE_0
GPIO Pin
14
NC
Not Connected
15
ADC_CH2
AD converter input
16
NC
Not Connected
17
GND
Ground
18
CHIP_EN
1: Enable Chip
0: Disable chip in shutdown mode
19
NC
Not Connected
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FN-LINK TECHNOLOGY LIMITED
20
NC
Not Connected
21
NC
Not Connected
22
GPIOA_3
GPIO Pin
23
NC
Not Connected
24
GPIOA_5
GPIO Pin
25
GPIOA_6/UART0_RXD
GPIO Pin, UART0_IN(multiplexing)
26
GPIOA_7/UART0_TXD
GPIO Pin, UART0_OUT(multiplexing)
27
GND
Ground
28
NC
Not Connected
29
NC
Not Connected
30
GND
Ground
31
NC
Not Connected
32
NC
Not Connected
33
GND
Ground
34
VD33
3.3V Power Supply
35
GND
Ground
36
GPIOC_3/SPI0_MISO
GPIO Pin, SPI0_MISO(multiplexing)
37
GPIOC_2/SPI0_MOSI
GPIO Pin, SPI0_MOSI(multiplexing)
38
GPIOC_1/SPI0_CLK
GPIO Pin, SPI0_CLK(multiplexing)
39
GPIOC_0/PWM0
GPIO Pin, PWM(multiplexing)
40
GPIOC_4/SPI0_CS1
GPIO Pin, SPI0_CS1(multiplexing)
41
GPIOC_5
GPIO Pin
42
GPIOB_3/I2C_SDA
GPIO Pin
43
GPIOB_2/I2C_SCL
GPIO Pin
44
GPIOB_1/UART1_RXD
GPIO Pin, UART1_IN(multiplexing)
45
GPIOB_0/UART1_TXD
GPIO Pin, UART1_OUT(multiplexing)
46
NC
Not Connected
47
NC
Not Connected
48
GND
Ground
49
NFCIP_1
NFC input differential signal
50
NFCIN_1
NFC input differential signal
51
RF_1
WL RF signal
52
GND
Ground
53
GND
Ground
54
GND
Ground
Page10/12
FN-LINK TECHNOLOGY LIMITED
4.3 PCB Lay-out Reference
Page11/12
FN-LINK TECHNOLOGY LIMITED
4.4 Recommended Reflow Profile
Referred to IPC/JEDEC standard.
Peak Temperature : <250°C
Number of Times : ≤2 times
4.5 Patch WIFI modules installed before the notice:
WIFI module installed note:
1. Please press 1 : 1 and then expand outward proportion to 0.7 mm, 0.12 mm thickness When open a
stencil
2. Take and use the WIFI module, please insure the electrostatic protective measures.
3. Reflow soldering temperature should be according to the customer the main size of the products,
such as the temperature set at 250 + 5 ℃ for the MID motherboard.
About the module packaging, storage and use of matters needing attention are as follows:
1. The module of the reel and storage life of vacuum packing: 1). Shelf life: 8 months, storage
environment conditions: temperature in: < 40 ℃, relative humidity: < 90% r.h.
2. The module vacuum packing once opened, time limit of the assembly:
Card: 1) check the humidity display value should be less than 30% (in blue), such as: 30% ~ 40%
(pink), or greater than 40% (red) the module have been moisture absorption.
2.) factory environmental temperature humidity control: ≦ 30 ℃, ≦ 60% r.h..
3). Once opened, the workshop the preservation of life for 168 hours.
3. Once opened, such as when not used up within 168 hours:
1). The module must be again to remove the module moisture absorption.
2). The baking temperature: 125 ℃, 8 hours.
3.) After baking, put the right amount of desiccant to seal packages.
Page12/12
WARING:
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) T his devic e ma y n ot ca use h armful interference. ( 2) T his device must accept any interfer ence
received, including interference that may cause undesired operation.
NOTE: This equipment has been tested and found to comp ly with the limits for a Class B digital dev ice,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interfe rence in a residential installation. This eq uipment ge nerates uses and ca n rad iate r adio
frequency energy and, if not installed and used in accordance with the instructions, may cause harmful
interference to radio communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause ha rmful interference to radio or televi sion reception,
which can be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
---Reorient or relocate the receiving antenna.
---Increase the separation between the equipment and receiver.
---Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
---Consult the dealer or an experienced radio/TV technician for help.
WARNING: Changes or modifications not expressly approved by the party responsible for comp liance
could void the user's authority to operate the equipment.
LABEL OF THE END PRODUCT:
The final end prod uct must be lab elled in a visible are a with the foll owing "Co ntains TX F CC ID:
2AATL-F11AMIM13-B1". If the size of the end product is smaller than 8x10cm, then additional FCC part
15.19 statement is required to be available in the users manual: This device complies with Part 15 of the
FCC Rules. Operati on is sub ject to the following two conditions: (1) this d evice may not cause harmfu l
interference, and (2) this device must accept any interference received, including interference that may
cause undesired operation.
RF Exposure
This device has been eval uated and sho wn compli ant with the F CC R F Exposur e limits under fix ed
exposure c onditions ( antennas are greater than 20cm fro m a p erson's body) when i nstalled in certa in
specific OEM configurations.
IMPORTANT NOTE:
This device is intended only for OEM integrators under the following conditions:
(1) According to F CC Part 15 Subpart C Se ction 15.212, the rad io elements of the mod ular transmitter
must have the ir o wn s hielding. Ho wever, d ue to t here is no shiel ding for this W IFI/BT module, this
module is granted as a Limited Modular Approval.
(2) This modul e has be en d esigned to op erate with E xternal anten na(I-PEX connector ) havi ng a
maximum gain of 0dBi. The module is only certif ied with the installed antenna. An y change of the
antenna will void the certification.
(3) Integration is typically strictly restricted to Grantee himself or dedicated OEM integrators under control
of the Grantee . The modul e will be res ponsible to satisfy SAR/RF Exp osure req uirements, when the
module int egrated into any (portable, mob ile, fix ed) h ost device. T his modu le is int ended for OEM
integrator on ly and the OEM integr ators an d instructe d to ensure th at the e nd us er h as no ma nual
instructions to remove or install the device. T he OEM i ntegrator is still res ponsible for the FC C
compliance requirement of the end product, which integrates this module.
The module has no sh ielding an d tested s tand a lone. This modu le is te sted an d ap proved as Limit ed
modular ap proval with stand alon e configuration, an y OE M incorpor ated this radio m odule into a ny
system are require additional testing and evaluation.
EU Regulatory Conformance
Hereby, we (F N-Link T echnology Limited) declared that thi s device is in compliance with the essenti al
requirements and other relevant provisions of Directive 1999/5/EC.

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Title                           : 产品特点:
Create Date                     : 2015:11:02 17:53:38Z
Creator Tool                    : WPS Office
Modify Date                     : 2016:12:12 13:12:18+08:00
Metadata Date                   : 2016:12:12 13:12:18+08:00
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Author                          : YlmF
EXIF Metadata provided by EXIF.tools
FCC ID Filing: 2AATL-F11AMIM13-B1

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