HUNAN FN LINK TECHNOLOGY F23BDSM43 WiFi+BT Module User Manual
FN-LINK TECHNOLOGY LIMITED WiFi+BT Module Users Manual
15_F23BDSM43 UserMan,r1.pdf
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| Document ID | 3089860 |
| Application ID | jo3P9eUZysUzFZR9S/ZC7w== |
| Document Description | 15_F23BDSM43 UserMan,r1.pdf |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 70.33kB (879145 bits) |
| Date Submitted | 2016-08-05 00:00:00 |
| Date Available | 2016-08-05 00:00:00 |
| Creation Date | 2016-07-05 13:31:45 |
| Document Lastmod | 2016-08-01 17:09:31 |
| Document Title | Users Manual |
| Document Creator | WPS Office |
| Document Author: | YlmF |
FN-LINK TECHNOLOGY LIMITED 5th Floor, A Building, Haoye Logistics Park, Shugang Channel, Bao'an District, Shenzhen City, CHINA TEL: 86-0755-29558186 FAX: 86-0755-29558196 Website: www.fn-link.com Product Specification IEEE 802.11 b/g/n 2.4GHz 1T1R WiFi with Bluetooth v2.1+EDR/Bluetooth 3.0/4.0 (Single Antenna) Project Name WiFi+BT Module Model NO F23BDSM43 Approved: William Tan Checked: Jim Hu Drafted: Neal Yu CONTENTS FN-LINK TECHNOLOGY LIMITED REVESION HISTORY.................................................................................................................................... 3 INTRODUCTIONS.......................................................................................................................................... 4 1.1 OVERVEIW.............................................................................................................................................. 4 1.2 PRODUCT FEATURES..........................................................................................................................4 1.3 BLOCK DIAGRAM.................................................................................................................................. 5 GENERAL SPECIFICATION......................................................................................................................... 6 ELECTRICAL CHARACTERISTICS............................................................................................................ 8 3.1 POWER SUPPLY DC CHARACTERISTICS......................................................................................8 3.2 DIGITAL I/O PIN DC CHARACTERISTICS........................................................................................ 8 3.3 SDIO INTERFACE AC CHARACTERISTICS.................................................................................... 8 3.4 SDIO INTERFACE POWER-ON SEQUENCE.................................................................................. 9 3.5 UART INTERFACE POWER-ON SEQUENCE............................................................................... 10 PIN DEFINITION........................................................................................................................................... 11 MECHANICAL SPECIFICATION............................................................................................................... 14 5.1 OUTLINE DRAWING........................................................................................................................... 14 5.2 RECOMMENDED REFLOW PROFILE............................................................................................ 15 5.3 NOTICE.................................................................................................................................................. 15 PACKAGE...................................................................................................................................................... 16 http://www.fn-link.com Page2/17 FN-LINK TECHNOLOGY LIMITED 0. Revision History REV NO Date REV 1.0 2016-03-05 http://www.fn-link.com Modifications First Released Draft Approved Neal Yu William Tan Page3/17 1. Introduction FN-LINK TECHNOLOGY LIMITED 1.1 Overview F23BDSM43 is a small size and low profile WiFi + BT Combo module, The size is 12mm*17mm. It can be easily manufactured on SMT process and highly suitable for tablet PC, ultra book, mobile device and consumer products. It provides SDIO interface for WiFi to connect with host processor and high speed UART interface for BT. It also has a PCM interface for audio data transmission with direct link to external audio codec via BT controller. The WiFi throughput can go up to 150Mbps in theory by using 1x1 802.11 b/g/n MIMO technology and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.0. F23BDSM43 uses Realtek RTL8723BS. It is a highly integrated 802.11b/g/n 1T1R WLAN, an integrated Bluetooth 2.1/3.0/4.0 module. It combines a WLAN MAC, a 1T1R capable WLAN baseband, BT protocol Stack(LM, LL, and LE), BT baseband, modem, and WLAN/BT RF in the module. The NF23BDSM43 provides a complete solution for a high throughput performance integrated wireless LAN and Bluetooth controller. 1.2 Product Features General 12mm*17mm 802.11b/g/n 1T1R WLAN and Bluetooth module Host Interface Complies with SDIO 1.1/2.0/3.0 for WLAN with clock rate up to 100MHz (DDR50) Complies with HS-UART with configurable baud rate for Bluetooth WLAN Features CMOS MAC, Baseband PHY, and RF in a single chip for 802.11b/g/n compatible WLAN Complete 802.11n solution for 2.4GHz band One Transmit and one Receive path (1T1R) Short Guard Interval (400ns) Maximum data rate 54Mbps in 802.11g; and 150Mbps in 802.11n 802.11i (WPA, WPA2). Open, shared key, and pair-wise key authentication services BT Features Compatible with Bluetooth v2.1+EDR and v3.0 Systems Supports Bluetooth 4.0 Low Energy(BLE) Integrated MCU to execute Bluetooth protocol stack PCM interface for audio data transmission via Bluetooth controller Supports AFH to dynamically detect channel quality to improve transmission quality http://www.fn-link.com Page4/17 FN-LINK TECHNOLOGY LIMITED 1.3 Block diagram The general block diagram for the module is shown in Figure 1 Figure 1 http://www.fn-link.com Page5/17 FN-LINK TECHNOLOGY LIMITED 2. General specification General features Main Chipset Realtek RTL8723BS Host Interface SDIO for WLAN UART for BT WiFi Standards 802.11b/g/n BT Standards Bluetooth 2.1/3.0/4.0 Dimension L17.0mm*W12.0mm*H1.7mm Operating conditions Operating Voltage 3.3±10% Vdc Operating Temperature 0°C to +70°C Storage Temperature -40°C to +80°C RF features Operating Frequency 2.400～2.4835GHz WiFi: USA/Canada: channel 1~11; Channels Modulation BT: Channel 0~78 WiFi: 802.11b(DSSS): CCK(11, 5.5Mbps), DQPSK(2Mbps), DBPSK(1Mbps); 802.11g(OFDM): BPSK(9,6Mbps), QPSK(18,12Mbps), 16QAM(36,24Mbps), 64QAM(54,48Mbps); 802.11n(OFDM): BPSK, QPSK, 16QAM, 64QAM(150Mbps) BT: 8DPSK, π /4 DQPSK, GFSK PHY Data rates Output Power WiFi: 802.11b: 11,5.5,2,1 Mbps 802.11g: 54,48,36,24,18,12,9,6 Mbps 802.11n: up to 150Mbps BT: 1 Mbps for Basic Rate 2,3 Mbps for Enhanced Data Rate WiFi: 802.11b <16dBm 802.11g <15dBm 802.11n <14dBm BT: Max <10dBm http://www.fn-link.com Page6/17 FN-LINK TECHNOLOGY LIMITED EVM 802.11b EVM≦35% 802.11g EVM≦-25dB 802.11n EVM≦-28dB WiFi: 802.11b@8% PER 1Mbps -88dBm 2Mbps -87dBm 5.5Mbps -85dBm 11Mbps -82dBm Sensitivity 802.11g@10% PER 6Mbps -86dBm 9Mbps -85dBm 12Mbps -84dBm 18Mbps -82dBm 24Mbps -80dBm 36Mbps -77dBm 48Mbps -73dBm 54Mbps -71dBm 802.11n_HT20@10% PER MCS 0 -83dBm MCS 1 -82dBm MCS 2 -80dBm MCS 3 -78dBm MCS 4 -75dBm MCS 5 -71dBm MCS 6 -69dBm MCS 7 -67dBm BT: -89dBm @ 1Mbps -86dBm @ 2Mbps -83dBm @ 3Mbps Other features Antenna Chip Antenna (Single Antenna) Network Architecture WiFi: Ad-hoc mode (Peer-to-Peer ) Infrastructure mode Software AP WiFi Direct BT: Pico Net, Scatter Net Security WiFi: WPA, WPA-PSK, WPA2, WPA2-PSK, WEP 64bit & 128bit, IEEE 802.11x, IEEE 802.11i BT: Simple Paring OS Supported Android /Linux/ Win CE /XP/WIN7/iOS http://www.fn-link.com Page7/17 FN-LINK TECHNOLOGY LIMITED 3. Electrical Characteristics 3.1 Power Supply DC Characteristics Symbol Parameter Minimum Typical Maximum Unit VIN33 3.3V Supply Voltage 3.0 3.3 3.6 VDDIO DC supply for digital I/O 1.62 1.8-3.3 3.6 Typical Maximum Unit 3.2 Digital I/O Pin 1.8V DC Characteristics Symbol Parameter Minimum VIH Input high voltage 1.7 1.8 2.0 VIL Input low voltage 0.8 VOH Output high voltage 1.62 1.8 VOL Output low voltage 0.18 Typical Maximum Unit 3.3 Digital I/O Pin 3.3V DC Characteristics Symbol Parameter Minimum VIH Input high voltage 2.0 3.3 3.6 VIL Input low voltage 0.9 VOH Output high voltage 2.97 3.3 VOL Output low voltage 0.33 3.4 SDIO/GSPI Interface AC Characteristics Figure 2. SDIO Interface Timing SDIO Interface Timing Parameters NO Parameter fPP Clock Frequency TWL Clock Low Time TWH Clock High Time TISU Input Setup Time TIH Input Hold Time TODLY Output Delay Time http://www.fn-link.com Mode MIN MAX Unit Default HS DEF 10 25 50 MHz MHz ns HS ns DEF 10 ns HS ns DEF ns HS ns DEF ns HS ns DEF 14 ns HS 14 ns Page8/17 FN-LINK TECHNOLOGY LIMITED 3.4 SDIO Interface Power-On Sequence After power-on, the SDIO interface is selected by the RTL8723BS automatically when a valid SDIO command is received. To attain better SDIO host compatibility, the following power-on sequence is Recommended. Figure 3. SDIO Interface Power-On Sequence SDIO Interface Power-On Sequence Symbol Description T33ramp’ 3.3V Power Pre-Charge Ramp Up Duration Before Formal Power Up. We recommend that a 3.3V power-on and then power-off sequence is executed by the host controller before the formal power on sequence. This procedure can eliminate host card detection issues when power ramp up duration is too long, or when a system warm reboot fails. Toff The duration 3.3V is cut off before formal power up. T33ramp The 3.3V main power ramp up duration. T12ramp The internal 1.2V ramp up duration. TPOR The duration from when the power-on reset releases and the power management unit executes power on tasks. A power on reset will detect both 3.3V and 1.2V power ramp up after a predetermined duration. Tnon_rdy SDIO Not Ready Duration. In this state, the RTL8723BS-VD may respond to commands without the ready bit being set. After the ready bit is set, the host will initiate complete card detection procedure. We recommend that the card detection procedures are divided into two phases: A 3.3V power pre-charge phase and a formal power-up phase. During the 3.3V power pre-charge phase, the power ramp up duration is not limited. The 3.3V power is cut off and is turned on after the Toff period. The ramp up time is specified in the T33ramp duration. After main 3.3V ramp up and 1.2V ramp up, the power management unit is enabled by the power ready detection circuit. The power management unit enables the SDIO block. eFUSE is then autoloaded to SDIO circuits during the Tnon_rdy duration. After the autoload has completed, the SDIO sets the ready bit. After CMD5/5/3/7 procedures, card detection is executed. When the driver has loaded, normal CMD52 and CMD53 are used. http://www.fn-link.com Page9/17 FN-LINK TECHNOLOGY LIMITED SDIO Interface Power-On Timing Parameters Symbol MIN Typical T33ramp’ Toff T33ramp T12ramp TPOR Tnon_rdy MAX Unit No Limit ms 250 500 1000 ms 0.1 0.5 2.5 ms 0.1 0.5 1.5 ms ms 10 ms 3.5 UART Interface Power-On Sequence Figure 4. UART Power On Sequence With Hardware Flow Control UART Interface Power-On Sequence Symbol Description T33ramp’ 3.3V Power Pre-Charge Ramp Up Duration Before Formal Power Up. We recommend that a 3.3V power-on and then power-off sequence is executed by the host controller before the formal power on sequence. This procedure can eliminate host card detection issues when power ramp up duration is too long, or when a system warm reboot fails. Toff The duration 3.3V is cut off before formal power up. T33ramp The 3.3V main power ramp up duration. T12ramp The internal 1.2V ramp up duration. TPOR The duration from when the power-on reset releases and the power management unit executes power on tasks. A power on reset will detect both 3.3V and 1.2V power ramp up after a predetermined duration. Tnon_rdy UART Not Ready Duration. In this state, the RTL8723BS-VD will not respond to any commands. We recommend that the card detection procedures are divided into two phases: A 3.3V power pre-charge phase and a formal power-up phase. During the 3.3V power pre-charge phase, the power ramp up duration is not limited. The 3.3V power is cut off and is turned on after the Toff period. The ramp up time is specified in the T33ramp duration. After main 3.3V ramp up and 1.2V ramp up, the power management unit is enabled by the power ready detection circuit. The power management unit enables the Bluetooth block. The Bluetooth firmware http://www.fn-link.com Page10/17 FN-LINK TECHNOLOGY LIMITED theninitializes all circuits, included the UART. In addition to wait the Tnon_rdy time, if the host supports UART hardware flow control it can detect RTS signals and follow the formal UART flow control handshake. UART Interface Power On Timing Parameters Symbol MIN Typical T33ramp’ Toff T33ramp T12ramp TPOR Tnon_rdy MAX Unit No Limit ms 250 500 1000 ms 0.1 0.5 2.5 ms 0.1 0.5 1.5 ms ms 10 ms 4. Pin Definition(Top View) Pin Assignment Pin# Name Description Remark GND Ground ANT1 Antenna 1 GND Ground PCM_IN PCM data Input High level: 1.8V PCM_OUT PCM data Output High level: 1.8V PCM_CLK PCM Clock PCM_SYNC PCM Synchronization control GND Ground BT_WAKE_HOST_DEV 10 HST_WAKE_BT http://www.fn-link.com Host wake up BT, active high Page11/17 FN-LINK TECHNOLOGY LIMITED 11 UART_CTS High-Speed UART CTS 12 UART_IN High-Speed UART Data In VDDIO 13 UART_OUT High-Speed UART Data Out VDDIO 14 GND Ground VDDIO 15 SD_CLK SDIO Clock Input VDDIO 16 SD_CMD SDIO Command Line VDDIO 17 SD_D0 SDIO Data Line 0 VDDIO 18 SD_D1 SDIO Data Line 1 VDDIO 19 SD_D2 SDIO Data Line 2 VDDIO 20 SD_D3 SDIO Data Line 3 VDDIO 21 GND Ground 22 3.3V 3.3V Power Supply 23 VDDIO Digital IO Supply Voltage 24 SUSCLK_IN External sleep clock input(32.768kHz) 25 WLAN_WAKE_HOST 26 WL_ENABLE Wlan Radio-off 27 BT_RESET BT Radio-off Function 28 GND Ground 29 ANT2 Antenna 2 30 GND ground VDDIO VDDIO Function VDDIO VDDIO 5.Mechanical Specification 5.1 Outline Drawing(Unit: mm) (Top Side) http://www.fn-link.com (Bottom Side) Page12/17 Top View http://www.fn-link.com FN-LINK TECHNOLOGY LIMITED Page13/17 FN-LINK TECHNOLOGY LIMITED 5.2 Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <250°C Number of Times : ≤2 times 5.3 Patch WIFI modules installed before the notice: WIFI module installed note: 1. Please press 1 : 1 and then expand outward proportion to 0.7 mm, 0.12 mm thickness When open a stencil 2. Take and use the WIFI module, please insure the electrostatic protective measures. 3. Reflow soldering temperature should be according to the customer the main size of the products, such as the temperature set at 250 + 5 ℃ for the MID motherboard. About the module packaging, storage and use of matters needing attention are as follows: 1. The module of the reel and storage life of vacuum packing: 1). Shelf life: 8 months, storage environment conditions: temperature in: < 40 ℃, relative humidity: < 90% r.h. 2. The module vacuum packing once opened, time limit of the assembly: Card: 1) check the humidity display value should be less than 30% (in blue), such as: 30% ~ 40% (pink), or greater than 40% (red) the module have been moisture absorption. 2.) factory environmental temperature humidity control: ≦ 30 ℃, ≦ 60% r.h.. 3). Once opened, the workshop the preservation of life for 168 hours. 3. Once opened, such as when not used up within 168 hours: 1). The module must be again to remove the module moisture absorption. 2). The baking temperature: 125 ℃, 8 hours. 3.) After baking, put the right amount of desiccant to seal packages. http://www.fn-link.com Page14/17 FN-LINK TECHNOLOGY LIMITED 6. Package 6.1 Reel Packaging 2000pcs/reel http://www.fn-link.com Page15/17 FN-LINK TECHNOLOGY LIMITED FCC Statement: This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: ---Reorient or relocate the receiving antenna. ---Increase the separation between the equipment and receiver. ---Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. ---Consult the dealer or an experienced radio/TV technician for help. WARNING: Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. LABEL OF THE END PRODUCT: The final end product must be labelled in a visible area with the following "Contains TX FCC ID: 2AATL-F23BDSM43". If the size of the end product is smaller than 8x10cm, then additional FCC part 15.19 statement is required to be available in the users manual: This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. RF Exposure This device has been evaluated and shown compliant with the FCC RF Exposure limits under fixed exposure conditions (antennas are greater than 20cm from a person's body) when installed in certain specific OEM configurations. This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Due to missing shielding the module is strictly limited to integration by the Grantee himself or his dedicated OEM integrator under control of the Grantee. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. http://www.fn-link.com Page16/17 FN-LINK TECHNOLOGY LIMITED IMPORTANT NOTE: This device is intended only for OEM integrators under the following conditions: (1) According to FCC Part 15 Subpart C Section 15.212, the radio elements of the modular transmitter must have their own shielding. However, due to there is no shielding for this WIFI/BT module, this module is granted as a Limited Modular Approval. (2) This module has been designed to operate with a Integral Chip antenna having a maximum gain of 1.5dBi. Only this type of antenna may be used. (3) Integration is typically strictly restricted to Grantee himself or dedicated OEM integrators under control of the Grantee. In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter. then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. The module will be responsible to satisfy SAR/RF Exposure requirements, when the module integrated into any (portable, mobile, fixed) host device. This module is intended for OEM integrator only and the OEM integrators and instructed to ensure that the end user has no manual instructions to remove or install the device. The OEM integrator is still responsible for the FCC compliance requirement of the end product, which integrates this module. The module has no shielding and tested stand alone. This module is tested and approved as Limited modular approval with stand alone configuration, any OEM incorporated this radio module into any system are require additional testing and evaluation. The module is only certified with the installed antenna. Any change of the antenna will void the certification. The host device including this RF module need to undergo separate certification. The OEM integrator has to be aware not to provide information to the end use regarding how to install or remove this RF module in the user's manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warming as shown in this manual. http://www.fn-link.com Page17/17
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