Honeywell Analytics Asia Pacific RMBLEM5 Bluetooth Low Energy Module - RMBLE-M5 User Manual RMBLE M5 RMBLE M5 REV2 20160923
Honeywell Analytics Asia Pacific Co., Ltd. Bluetooth Low Energy Module - RMBLE-M5 RMBLE M5 RMBLE M5 REV2 20160923
Contents
- 1. Host user manual
- 2. Module manual
- 3. Host User manual
- 4. RMBLE-M5 User Manual_RMBLE_M5_REV2 20160923
- 5. Sensepoint_XRL_installation_manual_eng_2017-05-08
- 6. User Manual_20180405_v1 - Host_BW ULTRA UM_Manual
RMBLE-M5 User Manual_RMBLE_M5_REV2 20160923

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Honeywell Confidential and Proprietary Revision –1.0 Page 1 of 12
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Bluetooth Low Energy Module
RMBLE-M5
Document Information
Info
Content
Author(s)
Kong Juan
Revision
1.0
Document Status
Draft
Date
February 26, 2015
Distribution
Internal Use Only
Approvals
Name
Date
Signature
James Liu
Zhao Pengjun

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Release Histroy
Rev.
Date
Author
Descripition
1.0
February 26, 2015
Kong Juan
Initial draft
2.0
September 23,2016
Wang Kai
add M5 TX power

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Contents
1. Section1: ............................................................................................................................................... 4
1.1 Summary: ................................................................................................................................ 4
1.2 Key Features:.......................................................................................................................... 4
2. Section2: ............................................................................................................................................... 5
2.1 Overview: ................................................................................................................................ 5
2.2 Block Diagram: ...................................................................................................................... 5
2.3 Pin Definition: ........................................................................................................................ 6
3. Section3: ............................................................................................................................................... 7
3.1 Voltage: .................................................................................................................................... 7
3.2 Digital Levels: ......................................................................................................................... 7
3.3 Current Consumption: .......................................................................................................... 8
3.4 RF Specification: .................................................................................................................... 8
4. Section4: ............................................................................................................................................... 9
4.1 Typical Reference Schematic: ............................................................................................. 9
4.2 PCB layout footprint: ............................................................................................................ 9
4.3 Physical/Environmental Characteristics: ...................................................................... 11
4.4 Ordering Information: ........................................................................................................ 11
5. Section5: ............................................................................................................................................. 11
5.1 Wireless Regulatory Approvals: .......................................... Error! Bookmark not defined.
5.2 Intrinsic Safety design: ....................................................................................................... 11
Reference ............................................................................................................................................ 12

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1. Section1:
1.1 Summary:
RMBLE-M5 is a highly-integrated Bluetooth low-energy (BLE) module, which
offers a complete solution containing all hardware features necessary for
development of wireless application.
1.2 Key Features:
• Ultra compact size (18.8 x 13.5 mm)
• Embedded 512 Kb EEPROM
• I2C, SPI, and UART interfaces
• Low power consumption
• Embedded antenna design
• FCC and CE compliant
• RoHS compliant, certified lead- and halogen-free
• BT4.1 compliant

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2. Section2:
2.1 Overview:
RMBLE-M5 uses a radio technology called frequency-hopping spread spectrum
(FHSS). The transmitted data are divided into packets and each packet is
transmitted on one of the 40 channels, channel spacing 2MHz. The first channel
starts at 2402 MHz and continues up to 2480 MHz. RMBLE can coexist with
DSSS based Wi-Fi very well due to different transmit protocol.
RMBLE-M5 offers superior radio performance, based on Broadcom
BCM20732S/BCM20737S.
2.2 Block Diagram:
Note1: 32.768 KHz is an optional crystal. Not mounted on RMBLE-M5.

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2.3 Pin Definition:
Connector
Pin
Pin Name
Description
I/O
1
SPI_CLK
Master SPI clock line,
reserved
O
2
SPI_MISO
Master SPI master in slave
out line, reserved
I
3
SPI_MOSI
Master SPI master out slave
in line, reserved
O
4-7
NA
No connection
8
RESET
Active-low system reset
I/O
9
GND
Ground
10
NA
No connection
11
I2C_CLK
PU clock signal for an
external I2C device
I/O
12
I2C_DATA
PU data signal for an external
I2C device
I/O
13
BL_UART_RX
Peripheral UART RX
I
14
BL_UART_TX
Peripheral UART TX
O
15,16
NA
No connection
17
GPIO
General Purpose Digital
Input/Output
18,19
NA
No connection
20
GPIO/LED
Status Indicate: output
continuous 0/1 signal when
not sleep. Output 0 when in
sleep.
O
21
SPI_CS
Master SPI chip select line,
reserved
22
GND
Ground
23
GND
Ground

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24
VCC
Digital supply voltage
I
25
VCC
Digital supply voltage
I
26-30
NA
No connection
31,32
ADC
ADC Input, reserved
33
NA
No connection
34
VCC
Digital supply voltage
or no connection
35
GND
Ground
36
GPIO
General Purpose Digital
Input/Output
37
NA
No connection
38
PRGM_UART_RX
HCI, PRGM_ UART RX
I
39
PRGM_UART_TX
HCI, PRGM_ UART TX
O
40
NA
No connection
41-42
GPIO
General Purpose Digital
Input/Output
43
WakeUp
WakeUp the Module,
Active low
I
Note: All pins not used above, leave them no connection.
3. Section3:
3.1 Voltage:
Power supply for the RMBLE-M5 module will be provided by the host power pins.
Symbol
Min
Typ
Max
Unit
VCC
1.62
3.3
3.63
V
3.2 Digital Levels:
Symbol
Min
Typ
Max
Unit
VIH
0.75VCC
-
VCC
V
VIL
0
-
0.4
V
VOH
VCC-0.4
-
VCC
V
VOL
0
-
0.4
V

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3.3 Current Consumption:
Condition: 25deg.C. The default voltage is 3.3V.
Item
Condition
Min
Nom
Max
Unit
Receive
Receiver and baseband
are both operating, 100%
25
mA
Transmit
Transmitter and baseband
are both operating, 100%,
Tx power setting: 3dBm
Single carrier
26
mA
Normal
Normal current
(Average)
5
mA
Sleep
300
uA
3.4 RF Specification:
The RF performance of RMBLE-M5 is given as follows. The default voltage is
3.3V.
Parameter
Condition
Min
Nom
Max
Unit
Frequency Range
2402
2480
MHz
Channel Space
2
MHz
RX sensitivity
Packet: 200, Payload,
PRBS9 Length: 37
Bytes, Dirty Transmitter:
off. PER 30.8%
-94(1)
dBm
MAX Input
-10
dBm
TX Power
(BCM20737S)
-20
4
dBm
TX Power
(RMBLE-M5)
-11
dBm
Distance
Communicate with
Iphone5, LOS, 1.5m
high
20
m
Note (1): Rx sensitivity and Tx power is specification of BCM20737S chip (1)

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4. Section4:
4.1 Typical Reference Schematic:
4.2 PCB layout footprint:
The below diagram shows the PCB layout recommended for RMBLE-M5 module.
Top view

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Please don’t place GND plane in the keep-out area, and minimize the area metal
traces occupied in the area.
It is recommended to have a 0.4 mm gap (T) between the module's upper
surface and the plastic housing.

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4.3 Physical/Environmental Characteristics:
Parameters
Value
Comments
Size
18.8x13.6x2.0 mm
Operating Temperature
-40~+60 ℃
Operating Humidity
No more than 80%
4.4 Ordering Information:
Part Number
Part Name
Description
A01-1110-000
RMBLE-M5
Bluetooth Low Energy Module
5. Section5:
5.1 Intrinsic Safety design:
RMBLE-M5 module is designed following intrinsic safety: Ex ia IIC T4/ CID1
grade A, B, C, D T4

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Total capacitance Cmax=1.5uF
Total inductance Lmax=0nH
No voltage boosters and no un-encapsulated fuses shall be used.
If resistors are used, each resistor shall have value of 1K ohm minimum,
and package of 0402 minimum.
Reference
(1) MMP20732S-TRM105-R/20737S-DS100-R
(2) 904-E800-139 RAE BLE communication Protocol.doc
(3) How to upgrade firmware for BLE module.pdf
(4) How to use HON own android app to test BLE module.pdf
(5) More detail please visit the teamroom :
http://teams.honeywell.com/sites/HARAEWireless/SitePages/Home.aspx