Honeywell Analytics Asia Pacific RMBLEM5 Bluetooth Low Energy Module - RMBLE-M5 User Manual RMBLE M5 RMBLE M5 REV2 20160923

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Document ID	3521457
Application ID	XAYDIKswp1yFtIwRmQGjhA==
Document Description	RMBLE-M5 User Manual_RMBLE_M5_REV2 20160923
Short Term Confidential	No
Permanent Confidential	No
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Document Type	User Manual
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Date Submitted	2017-08-22 00:00:00
Date Available	2018-02-20 00:00:00
Creation Date	2016-09-23 11:29:35
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Document Lastmod	2016-09-23 11:29:35
Document Title	RMBLE-M5 User Manual_RMBLE_M5_REV2 20160923
Document Creator	Microsoft® Word 2013
Document Author:	yuanli

RAE Systems by Honeywell
Bluetooth Low Energy Module
RMBLE-M5
Document Information
Info
Content
Author(s)
Kong Juan
Revision
1.0
Document Status
Draft
Date
February 26, 2015
Distribution
Internal Use Only
Approvals
Name
Date
Signature
James Liu
Zhao Pengjun
Copyright © 2016 Honeywell Analytics, All rights reserved.
Honeywell Confidential and Proprietary
Revision –1.0
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RAE Systems by Honeywell
Release Histroy
Rev.
Date
Author
Descripition
1.0
February 26, 2015
Kong Juan
Initial draft
2.0
September 23,2016
Wang Kai
add M5 TX power
Copyright © 2016 Honeywell Analytics, All rights reserved.
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Revision –1.0
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RAE Systems by Honeywell
Contents
1.
2.
3.
4.
5.
Section1: ............................................................................................................................................... 4
1.1
Summary: ................................................................................................................................ 4
1.2
Key Features:.......................................................................................................................... 4
Section2: ............................................................................................................................................... 5
2.1
Overview: ................................................................................................................................ 5
2.2
Block Diagram: ...................................................................................................................... 5
2.3
Pin Definition: ........................................................................................................................ 6
Section3: ............................................................................................................................................... 7
3.1
Voltage:.................................................................................................................................... 7
3.2
Digital Levels: ......................................................................................................................... 7
3.3
Current Consumption: .......................................................................................................... 8
3.4
RF Specification: .................................................................................................................... 8
Section4: ............................................................................................................................................... 9
4.1
Typical Reference Schematic: ............................................................................................. 9
4.2
PCB layout footprint: ............................................................................................................ 9
4.3
Physical/Environmental Characteristics: ...................................................................... 11
4.4
Ordering Information:........................................................................................................ 11
Section5: ............................................................................................................................................. 11
5.1
Wireless Regulatory Approvals:.......................................... Error! Bookmark not defined.
5.2
Intrinsic Safety design: ....................................................................................................... 11
Reference ............................................................................................................................................ 12
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RAE Systems by Honeywell
1. Section1:
1.1
Summary:
RMBLE-M5 is a highly-integrated Bluetooth low-energy (BLE) module, which
offers a complete solution containing all hardware features necessary for
development of wireless application.
1.2
Key Features:
• Ultra compact size (18.8 x 13.5 mm)
• Embedded 512 Kb EEPROM
• I2C, SPI, and UART interfaces
• Low power consumption
• Embedded antenna design
• FCC and CE compliant
• RoHS compliant, certified lead- and halogen-free
• BT4.1 compliant
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RAE Systems by Honeywell
2. Section2:
2.1
Overview:
RMBLE-M5 uses a radio technology called frequency-hopping spread spectrum
(FHSS). The transmitted data are divided into packets and each packet is
transmitted on one of the 40 channels, channel spacing 2MHz. The first channel
starts at 2402 MHz and continues up to 2480 MHz. RMBLE can coexist with
DSSS based Wi-Fi very well due to different transmit protocol.
RMBLE-M5
offers
superior
radio
performance,
based
on
Broadcom
BCM20732S/BCM20737S.
2.2
Block Diagram:
Note1: 32.768 KHz is an optional crystal. Not mounted on RMBLE-M5.
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RAE Systems by Honeywell
2.3
Pin Definition:
Connector
Pin
Pin Name
Description
I/O
SPI_CLK
SPI_MISO
SPI_MOSI
4-7
10
11
NA
RESET
GND
NA
I2C_CLK
12
I2C_DATA
13
14
15,16
17
BL_UART_RX
BL_UART_TX
NA
GPIO
18,19
20
NA
GPIO/LED
21
SPI_CS
22
23
GND
GND
Master SPI clock line,
reserved
Master SPI master in slave
out line, reserved
Master SPI master out slave
in line, reserved
No connection
Active-low system reset
Ground
No connection
PU clock signal for an
external I2C device
PU data signal for an external
I2C device
Peripheral UART RX
Peripheral UART TX
No connection
General Purpose Digital
Input/Output
No connection
Status Indicate: output
continuous 0/1 signal when
not sleep. Output 0 when in
sleep.
Master SPI chip select line,
reserved
Ground
Ground
I/O
I/O
I/O
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RAE Systems by Honeywell
24
25
26-30
31,32
33
34
VCC
VCC
NA
ADC
NA
VCC
Digital supply voltage
Digital supply voltage
No connection
ADC Input, reserved
No connection
Digital supply voltage
or no connection
35
GND
Ground
36
GPIO
General Purpose Digital
Input/Output
37
NA
No connection
38
PRGM_UART_RX
HCI, PRGM_ UART RX
39
PRGM_UART_TX
HCI, PRGM_ UART TX
40
NA
No connection
41-42
GPIO
General Purpose Digital
Input/Output
43
WakeUp
WakeUp the Module,
Active low
Note: All pins not used above, leave them no connection.
3. Section3:
3.1
Voltage:
Power supply for the RMBLE-M5 module will be provided by the host power pins.
Symbol
Min
Typ
Max
Unit
VCC
1.62
3.3
3.63
3.2
Digital Levels:
Symbol
Min
Typ
Max
Unit
VIH
0.75VCC
VCC
VIL
0.4
VOH
VCC-0.4
VCC
VOL
0.4
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RAE Systems by Honeywell
3.3
Current Consumption:
Condition: 25deg.C. The default voltage is 3.3V.
Item
Condition
Receive
Receiver and baseband
are both operating, 100%
25
mA
Transmit
Transmitter and baseband
are both operating, 100%,
Tx power setting: 3dBm
Single carrier
Normal current
(Average)
26
mA
mA
300
uA
Normal
Min
Nom
Sleep
3.4
Max
Unit
RF Specification:
The RF performance of RMBLE-M5 is given as follows. The default voltage is
3.3V.
Parameter
Condition
Frequency Range
Min
Nom
2402
Max
Unit
2480
MHz
Channel Space
MHz
RX sensitivity
-94(1)
dBm
-10
dBm
Packet: 200, Payload,
PRBS9 Length: 37
Bytes, Dirty Transmitter:
off. PER 30.8%
MAX Input
TX Power
(BCM20737S)
TX Power
(RMBLE-M5)
Distance
-20
Communicate with
20
Iphone5, LOS, 1.5m
high
Note (1): Rx sensitivity and Tx power is specification of BCM20737S chip (1)
dBm
-11
dBm
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RAE Systems by Honeywell
4. Section4:
4.1
Typical Reference Schematic:
4.2
PCB layout footprint:
The below diagram shows the PCB layout recommended for RMBLE-M5 module.
Top view
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RAE Systems by Honeywell
Please don’t place GND plane in the keep-out area, and minimize the area metal
traces occupied in the area.
It is recommended to have a 0.4 mm gap (T) between the module's upper
surface and the plastic housing.
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RAE Systems by Honeywell
4.3
Physical/Environmental Characteristics:
Parameters
Size
Operating Temperature
Operating Humidity
4.4
Value
Comments
18.8x13.6x2.0 mm
-40~+60 ℃
No more than 80%
Ordering Information:
Part Number
A01-1110-000
Part Name
RMBLE-M5
Description
Bluetooth Low Energy Module
5. Section5:
5.1
Intrinsic Safety design:
RMBLE-M5 module is designed following intrinsic safety: Ex ia IIC T4/ CID1
grade A, B, C, D T4
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Revision –1.0
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RAE Systems by Honeywell




Total capacitance Cmax=1.5uF
Total inductance Lmax=0nH
No voltage boosters and no un-encapsulated fuses shall be used.
If resistors are used, each resistor shall have value of 1K ohm minimum,
and package of 0402 minimum.
Reference
(1)
(2)
(3)
(4)
(5)
MMP20732S-TRM105-R/20737S-DS100-R
904-E800-139 RAE BLE communication Protocol.doc
How to upgrade firmware for BLE module.pdf
How to use HON own android app to test BLE module.pdf
More detail please visit the teamroom :
http://teams.honeywell.com/sites/HARAEWireless/SitePages/Home.aspx
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Page Count                      : 12
Language                        : en-US
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Author                          : yuanli
Creator                         : Microsoft® Word 2013
Create Date                     : 2016:09:23 11:29:35+08:00
Modify Date                     : 2016:09:23 11:29:35+08:00
Producer                        : Microsoft® Word 2013

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