Huawei ME909s Series LTE LGA Module Hardware Guide (V100R001 04, English)
2016-12-28
User Manual: Huawei
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- Copyright © Huawei Technologies Co., Ltd. 2016. All rights reserved.
- Trademarks and Permissions
- Notice
- DISCLAIMER
- Import and Export Regulations
- Privacy Policy
- Revision History
- Scope
- 1 Introduction
- 2 Overall Description
- 3 Description of the Application Interfaces
- 3.1 About This Chapter
- 3.2 LGA Interface
- 3.3 Power Interface
- 3.4 Signal Control Interface
- 3.5 UART Interface
- 3.6 USB Interface
- 3.7 USIM Card Interface
- 3.8 Audio Interface
- 3.9 GPIO Interface
- 3.10 ADC Interface
- 3.11 JTAG Interface
- 3.12 RF Antenna Interface
- Table 3-16 Definition of the antenna pads
- Figure 3-25 RF signal trace design about MAIN_ANT for reference (the same for AUX_ANT)
- Figure 3-26 RF signal layout design about MAIN_ANT for reference (the same for AUX_ANT)
- Figure 3-27 Complete structure of the microstrip
- Figure 3-28 Complete structure of the stripline
- Figure 3-29 Pad for the RF interface
- Figure 3-30 RF Pad design for ME909s LGA
- 3.13 Reserved Interface
- 3.14 NC Interface
- 3.15 Test Points Design
- 4 RF Specifications
- 4.1 About This Chapter
- 4.2 Operating Frequencies
- 4.3 Conducted RF Measurement
- 4.4 Conducted Rx Sensitivity and Tx Power
- 4.5 Antenna Design Requirements
- 4.6 Suggestions about LTE and 2.4 GHz Wi-Fi Co-existence
- 4.6.1 Theory Analysis
- 4.6.2 Suggestions about the Interference
- 1. It is recommended that the system should be added Wi-Fi SAW filter to guarantee good attenuation in the LTE transmit Band (including Band 38, Band 40, Band 41), otherwise, LTE Band output power will block Wi-Fi receiver.
- 2. The good isolation between LTE antenna and Wi-Fi antenna is more than 25 dB.
- 3. Two ways above can help to make the isolation to be 60 dB. If they are still not enough, some channels may need to be disabled.
- 5 Electrical and Reliability Features
- 5.1 About This Chapter
- 5.2 Absolute Ratings
- 5.3 Operating and Storage Temperatures
- 5.4 Power Supply Features
- 5.4.1 Input Power Supply
- 5.4.2 Power Consumption
- Table 5-5 Averaged power off DC power consumption
- Table 5-6 Averaged standby DC power consumption of ME909s-821 LGA module
- Table 5-7 Averaged standby DC power consumption of ME909s-120 LGA module
- Table 5-8 Averaged Data Transmission DC power consumption of ME909s-821 LGA module (LTE/HSPA/WCDMA/TD-SCDMA)
- Table 5-9 Averaged Data Transmission DC power consumption of ME909s-120 LGA module (WCDMA/HSDPA/LTE)
- Table 5-10 Averaged DC power consumption of ME909s-821 LGA module (GPRS/EDGE)
- Table 5-11 Averaged DC power consumption of ME909s-120 LGA module (GPRS/EDGE)
- 5.5 Reliability Features
- 5.6 EMC and ESD Features
- 6 Mechanical Specifications
- 6.1 About This Chapter
- 6.2 Storage Requirement
- 6.3 Moisture Sensitivity
- 6.4 Dimensions
- 6.5 Packaging
- 6.6 Customer PCB Design
- 6.7 Thermal Design Solution
- 6.8 Assembly Processes
- 6.9 Specification of Rework
- 6.9.1 Process of Rework
- 6.9.2 Preparations of Rework
- 6.9.3 Removing of the Module
- 6.9.4 Welding Area Treatment
- Step 1 Remove the old solder by using a soldering iron and solder braid that can wet the solder.
- Step 2 Clean the pad and remove the flux residuals.
- Step 3 Solder pre-filling: Before the module is installed on a board, apply some solder paste to the pad of the module by using the rework fixture and stencil or apply some solder paste to the pad on the PCB by using a rework stencil.
- 6.9.5 Module Installation
- 6.9.6 Specifications of Rework
- 7 Certifications
- 8 Safety Information
- 8.1 About This Chapter
- 8.2 Interference
- 8.3 Medical Device
- 8.4 Area with Inflammables and Explosives
- 8.5 Traffic Security
- 8.6 Airline Security
- 8.7 Safety of Children
- 8.8 Environment Protection
- 8.9 WEEE Approval
- 8.10 RoHS Approval
- 8.11 Laws and Regulations Observance
- 8.12 Care and Maintenance
- 8.13 Emergency Call
- 8.14 Regulatory Information
- 9 Appendix A Circuit of Typical Interface
- 10 Appendix B Acronyms and Abbreviations