Huawei ME909s Series LTE LGA Module Hardware Guide (V100R001 04, English)
2016-12-28
User Manual: Huawei
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HUAWEI ME909s Series LTE LGA Module Hardware Guide Issue 04 Date 2016-12-21 Copyright © Huawei Technologies Co., Ltd. 2016. All rights reserved. No part of this manual may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd. and its affiliates ("Huawei"). The product described in this manual may include copyrighted software of Huawei and possible licensors. Customers shall not in any manner reproduce, distribute, modify, decompile, disassemble, decrypt, extract, reverse engineer, lease, assign, or sublicense the said software, unless such restrictions are prohibited by applicable laws or such actions are approved by respective copyright holders. Trademarks and Permissions , , and are trademarks or registered trademarks of Huawei Technologies Co., Ltd. LTE is a trade mark of ETSI. Other trademarks, product, service and company names mentioned may be the property of their respective owners. Notice Some features of the product and its accessories described herein rely on the software installed, capacities and settings of local network, and therefore may not be activated or may be limited by local network operators or network service providers. Thus, the descriptions herein may not exactly match the product or its accessories which you purchase. Huawei reserves the right to change or modify any information or specifications contained in this manual without prior notice and without any liability. DISCLAIMER ALL CONTENTS OF THIS MANUAL ARE PROVIDED “AS IS”. EXCEPT AS REQUIRED BY APPLICABLE LAWS, NO WARRANTIES OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE, ARE MADE IN RELATION TO THE ACCURACY, RELIABILITY OR CONTENTS OF THIS MANUAL. 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HUAWEI ME909s Series LTE LGA Module Hardware Guide About This Document About This Document Revision History Document Version Date 01 2015-08-14 02 2016-02-20 03 Issue 04 (2016-12-21) 2016-09-06 Chapter Descriptions Initial release 2.4 Deleted Application Block Diagram 2.2 Updated Table 2-1 Features 3.2 Updated LGA Interface 3.5 Updated UART Interface 3.9 Updated GPIO Interface 4.2 Updated the NOTE of Operating Frequencies 4.5.3 Updated Antenna Requirements 5.6 Updated EMC and ESD Features 6.5 Updated Packaging 2 Updated Table 2-1 Features 3.2 Updated Figure 3-1 Sequence of LGA interface (Top view) 3.4.8 Updated Figure 3-15 Connections of the USIM_DET pin 3.7 Updated Figure 3-19 Circuit of the USIM card interface 5.4.2 Updated Table 5-6 Averaged standby DC power consumption of ME909s-821 LGA module 6.6.2 Updated Figure 6-4 LGA module Footprint design (Unit: mm) 6.8.2 Updated Figure 6-8 Recommended stencil design of LGA module (Unit: mm) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 3 HUAWEI ME909s Series LTE LGA Module Hardware Guide Document Version 04 Date 2016-12-21 About This Document Chapter Descriptions 6.9.3 Updated Figure 6-10 Equipment used for rework 3.2 Updated Table 3-1 Definitions of pins on the LGA interface 5.5 Updated Table 5-12 Test conditions and results of the reliability of the ME909s LGA module Scope ME909s-821 ME909s-120 Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 4 HUAWEI ME909s Series LTE LGA Module Hardware Guide Contents Contents 1 Introduction ........................................................................................................................... 8 2 Overall Description ............................................................................................................... 9 2.1 About This Chapter.......................................................................................................................... 9 2.2 Function Overview .......................................................................................................................... 9 2.3 Circuit Block Diagram .................................................................................................................... 11 3 Description of the Application Interfaces ......................................................................... 13 3.1 About This Chapter........................................................................................................................ 13 3.2 LGA Interface ................................................................................................................................ 13 3.3 Power Interface ............................................................................................................................. 24 3.3.1 Overview............................................................................................................................... 24 3.3.2 Power Supply VBAT Interface............................................................................................... 25 3.3.3 Output Power Supply Interface ............................................................................................. 27 3.4 Signal Control Interface................................................................................................................. 27 3.4.1 Overview............................................................................................................................... 27 3.4.2 Power-on/off Pin ................................................................................................................... 29 3.4.3 RESIN_N .............................................................................................................................. 31 3.4.4 WAKEUP_IN Signal .............................................................................................................. 32 3.4.5 WAKEUP_OUT Signal .......................................................................................................... 33 3.4.6 SLEEP_STATUS Signal........................................................................................................ 33 3.4.7 LED_MODE Signal ............................................................................................................... 34 3.4.8 USIM_DET Pin ..................................................................................................................... 35 3.5 UART Interface.............................................................................................................................. 37 3.5.1 Overview............................................................................................................................... 37 3.5.2 Circuit Recommended for the UART Interface...................................................................... 38 3.6 USB Interface ................................................................................................................................ 39 3.7 USIM Card Interface ..................................................................................................................... 40 3.7.1 Overview............................................................................................................................... 40 3.7.2 Circuit Recommended for the USIM Card Interface.............................................................. 41 3.8 Audio Interface .............................................................................................................................. 42 3.9 GPIO Interface .............................................................................................................................. 44 3.10 ADC Interface .............................................................................................................................. 47 3.11 JTAG Interface............................................................................................................................. 47 Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 5 HUAWEI ME909s Series LTE LGA Module Hardware Guide Contents 3.12 RF Antenna Interface .................................................................................................................. 48 3.13 Reserved Interface ...................................................................................................................... 51 3.14 NC Interface ................................................................................................................................ 51 3.15 Test Points Design....................................................................................................................... 52 4 RF Specifications ................................................................................................................. 53 4.1 About This Chapter........................................................................................................................ 53 4.2 Operating Frequencies .................................................................................................................. 53 4.3 Conducted RF Measurement ........................................................................................................ 55 4.3.1 Test Environment .................................................................................................................. 55 4.3.2 Test Standards ...................................................................................................................... 55 4.4 Conducted Rx Sensitivity and Tx Power ....................................................................................... 55 4.4.1 Conducted Receive Sensitivity ............................................................................................. 55 4.4.2 Conducted Transmit Power .................................................................................................. 57 4.5 Antenna Design Requirements ...................................................................................................... 58 4.5.1 Antenna Design Indicators .................................................................................................... 58 4.5.2 Interference .......................................................................................................................... 61 4.5.3 Antenna Requirements ......................................................................................................... 61 4.6 Suggestions about LTE and 2.4 GHz Wi-Fi Co-existence ............................................................. 62 4.6.1 Theory Analysis .................................................................................................................... 62 4.6.2 Suggestions about the Interference ...................................................................................... 63 5 Electrical and Reliability Features ..................................................................................... 64 5.1 About This Chapter........................................................................................................................ 64 5.2 Absolute Ratings ........................................................................................................................... 64 5.3 Operating and Storage Temperatures ........................................................................................... 64 5.4 Power Supply Features ................................................................................................................. 65 5.4.1 Input Power Supply............................................................................................................... 65 5.4.2 Power Consumption ............................................................................................................. 66 5.5 Reliability Features ........................................................................................................................ 75 5.6 EMC and ESD Features ................................................................................................................ 78 6 Mechanical Specifications .................................................................................................. 81 6.1 About This Chapter........................................................................................................................ 81 6.2 Storage Requirement .................................................................................................................... 81 6.3 Moisture Sensitivity ....................................................................................................................... 81 6.4 Dimensions ................................................................................................................................... 82 6.5 Packaging ..................................................................................................................................... 82 6.6 Customer PCB Design .................................................................................................................. 85 6.6.1 PCB Surface Finish .............................................................................................................. 85 6.6.2 PCB Pad Design................................................................................................................... 85 6.6.3 Solder Mask .......................................................................................................................... 85 6.6.4 Requirements on PCB Layout .............................................................................................. 85 6.7 Thermal Design Solution ............................................................................................................... 86 Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 6 HUAWEI ME909s Series LTE LGA Module Hardware Guide Contents 6.8 Assembly Processes ..................................................................................................................... 88 6.8.1 General Description of Assembly Processes ........................................................................ 88 6.8.2 Stencil Design ....................................................................................................................... 88 6.8.3 Reflow Profile ....................................................................................................................... 89 6.9 Specification of Rework ................................................................................................................. 90 6.9.1 Process of Rework................................................................................................................ 90 6.9.2 Preparations of Rework ........................................................................................................ 91 6.9.3 Removing of the Module....................................................................................................... 91 6.9.4 Welding Area Treatment ....................................................................................................... 92 6.9.5 Module Installation................................................................................................................ 92 6.9.6 Specifications of Rework....................................................................................................... 92 7 Certifications ........................................................................................................................ 93 7.1 About This Chapter........................................................................................................................ 93 7.2 Certifications ................................................................................................................................. 93 8 Safety Information .............................................................................................................. 94 8.1 About This Chapter........................................................................................................................ 94 8.2 Interference ................................................................................................................................... 94 8.3 Medical Device .............................................................................................................................. 94 8.4 Area with Inflammables and Explosives ........................................................................................ 95 8.5 Traffic Security .............................................................................................................................. 95 8.6 Airline Security .............................................................................................................................. 95 8.7 Safety of Children.......................................................................................................................... 95 8.8 Environment Protection ................................................................................................................. 96 8.9 WEEE Approval............................................................................................................................. 96 8.10 RoHS Approval............................................................................................................................ 96 8.11 Laws and Regulations Observance ............................................................................................. 96 8.12 Care and Maintenance ................................................................................................................ 96 8.13 Emergency Call ........................................................................................................................... 97 8.14 Regulatory Information ................................................................................................................ 97 8.14.1 CE Approval (European Union) .......................................................................................... 97 9 Appendix A Circuit of Typical Interface ........................................................................... 98 10 Appendix B Acronyms and Abbreviations ..................................................................... 99 Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 7 HUAWEI ME909s Series LTE LGA Module Hardware Guide Introduction 1 Introduction This document describes the hardware application interfaces and air interfaces provided by HUAWEI ME909s Series (ME909s-821 and ME909s-120) LTE LGA Module (hereinafter referred to as the ME909s LGA module). This document helps hardware engineer to understand the interface specifications, electrical features and related product information of the ME909s LGA module. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 8 HUAWEI ME909s Series LTE LGA Module Hardware Guide 2 Overall Description Overall Description 2.1 About This Chapter This chapter gives a general description of the ME909s LGA module and provides: Function Overview Circuit Block Diagram 2.2 Function Overview Table 2-1 Features Feature Description Physical Dimensions ME909s-821 Dimensions (L × W × H): 30 mm × 30 mm × 2.57 mm Weight: about 5 g ME909s-120 Operating Bands Issue 04 (2016-12-21) Dimensions (L × W × H): 30 mm × 30 mm × 2.52 mm Weight: about 5 g ME909s-821 FDD LTE: Band 1, Band 3, Band 8, all bands with diversity TDD LTE: Band 38, Band 39, Band 40, Band 41, all bands with diversity DC-HSPA+/HSPA+/HSPA/WCDMA: Band 1, Band 5, Band 8, Band 9, all bands with diversity TD-SCDMA: Band 34, Band 39 GSM/GPRS/EDGE: 1800 MHz/900 MHz Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 9 HUAWEI ME909s Series LTE LGA Module Hardware Guide Feature Overall Description Description ME909s-120 FDD LTE: Band 1, Band 2, Band 3, Band 4, Band 5, Band 7, Band 8, Band 20, all bands with diversity WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 2, Band 5, Band 8, all bands with diversity GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz Operating Temperature Normal operating temperature: –30°C to +75°C Storage Temperature –40°C to +85°C Humidity RH5% to RH95% Power Voltage DC 3.2 V to 4.2 V (typical value is 3.8 V) AT Commands See the HUAWEI ME909s Series LTE Module AT Command Interface Specification. Application Interface (145-pin LGA interface) One standard USIM (Class B and Class C) interface [1] Extended operating temperature : –40°C to +85°C Audio interface: PCM interface USB 2.0 (High Speed) UART interface: 8-wire UART0 x 1 2-wire UART2 x 1 (This is only used for debugging) GPIO ADC x 2 LED x 1 Power on/off interface Hardware reset interface JTAG interface SLEEP_STATUS WAKEUP_IN WAKEUP_OUT USIM_DET Antenna Interface WWAN MAIN antenna pad x 1 WWAN AUX antenna pad x 1 SMS New message alert Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 10 HUAWEI ME909s Series LTE LGA Module Hardware Guide Feature Overall Description Description Management of SMS: read SMS, write SMS, send SMS, delete SMS and list SMS Supports MO and MT: Point-to-point Data Services ME909s-821 GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s WCDMA CS: UL 64 kbit/s; DL 64 kbit/s WCDMA PS: UL 384 kbit/s; DL 384 kbit/s HSPA+: UL 5.76 Mbit/s; DL 21.6 Mbit/s DC-HSPA+: UL 5.76 Mbit/s; DL 42 Mbit/s TD-HSPA: UL 2.2 Mbit/s; DL 2.8 Mbit/s TD-SCDMA PS: UL 384 kbit/s; DL 2.8 Mbit/s LTE FDD: UL 50 Mbit/s; DL 150 Mbit/s @20M BW cat4 LTE TDD: UL 10 Mbit/s; DL 112 Mbit/s @20M BW cat4 (Uplink-downlink configuration 2, 1:3) ME909s-120 GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s WCDMA CS: UL 64 kbit/s; DL 64 kbit/s WCDMA PS: UL 384 kbit/s; DL 384 kbit/s HSPA+: UL 5.76 Mbit/s; DL 21.6 Mbit/s DC-HSPA+: UL 5.76 Mbit/s; DL 42 Mbit/s LTE FDD: UL 50 Mbit/s; DL 150 Mbit/s @20M BW cat4 Operating Android 2.x/3.x/4.x Systems Linux (Kernel 2.6.29 or later) Windows 7/8/8.1/10 Windows CE 5.0/6.0/7.0 [1]: When the ME909s LGA module works in the range from –40°C to –30°C or +75°C to +85°C, NOT all their RF performances comply with 3GPP specifications. 2.3 Circuit Block Diagram The ME909s LGA module is developed based on Huawei's Balong Hi6921M platform. Figure 2-1 shows the circuit block diagram of the module. The major functional units of the module contain the following parts: Power Management Baseband Controller Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 11 HUAWEI ME909s Series LTE LGA Module Hardware Guide Nand Flash RF Circuit Overall Description Figure 2-1 Circuit block diagram of the ME909s LGA module Nand flash PMU AUX_ANT RFIC and Front end circuits MAIN_ANT WAKEUP_OUT USIM_Switch USIM_DET JTAG WAKEUP_IN USB UART USIM PCM GPIO GND ADC LED Power on/off RESET VBAT Baseband Controller LGA Interface Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 12 HUAWEI ME909s Series LTE LGA Module Hardware Guide 3 Description of the Application Interfaces Description of the Application Interfaces 3.1 About This Chapter This chapter mainly describes the external application interfaces of the ME909s LGA module, including: LGA Interface Power Interface Signal Control Interface UART Interface USB Interface USIM Card Interface Audio Interface GPIO Interface ADC Interface JTAG Interface RF Antenna Interface Reserved Interface NC Interface Test Points Design 3.2 LGA Interface The ME909s LGA module uses the 145-pin LGA as their external interface. For details about the module and dimensions, see 6.4 Dimensions . Figure 3-1 shows the sequence of pins on the 145-pin signal interface of the ME909s LGA module. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 13 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces Figure 3-1 Sequence of LGA interface (Top view) ADC Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 14 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces Figure 3-2 Appearance of the module (Without Label) Table 3-1 shows the definitions of pins on the 145-pin signal interface of the ME909s LGA module. Table 3-1 Definitions of pins on the LGA interface Pin No. Pin Name Pad Type Description Parameter Min. (V) Typ. (V) Max. (V) Comments 1 Reserved - Reserved, please keep this pin open. - - - - - 2 Reserved - Reserved, please keep this pin open. - - - - - 3 Reserved - Reserved, please keep this pin open. - - - - - 4 Reserved - Reserved, please keep this pin open. - - - - - 5 PCM_SYNC[1] O PCM sync VOH 1.35 1.8 1.98 - VOL 0 - 0.45 VIH 1.17 1.8 1.98 VIL –0.3 - 0.63 VOH 1.35 1.8 1.98 VOL 0 - 0.45 VOH 1.35 1.8 1.98 VOL 0 - 0.45 VOH 2.25 3.0 3.15 VOL 0 3.0 0.375 Only used for debugging. VIH 1.875 3.0 3.15 Please 6 7 8 9 PCM_DIN PCM_DOUT PCM_CLK[1] SD_DATA1 Issue 04 (2016-12-21) I O O I/O PCM data in PCM data out PCM clock SD Card data signal. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. - - - 15 HUAWEI ME909s Series LTE LGA Module Hardware Guide Pin No. 10 11 Pin Name SD_DATA2 WAKEUP_IN Pad Type I/O I Description SD Card data signal. Sleep authorization signal. H: Sleep mode is disabled. Description of the Application Interfaces Parameter Min. (V) Typ. (V) Max. (V) Comments VIL –0.3 3.0 0.721 5 reserve this pin as the test point. VOH 2.25 3.0 3.15 VOL 0 3.0 0.375 VIH 1.875 3.0 3.15 VIL –0.3 3.0 0.721 5 VIH 1.17 1.8 1.98 VIL –0.3 - 0.63 - 3.2 3.8 4.2 - - 3.2 3.8 4.2 - - L: Sleep mode is enabled (default value). 12 VBAT PI Power supply input for RF. The rising time of VBAT must be greater than 100 µs 13 VBAT PI Power supply input The rising time of VBAT must be greater than 100 µs 14 Reserved I Reserved, please keep this pin open. - - - - - 15 SLEEP_STAT US O Sleep status indicator. VOH 1.35 1.8 1.98 - VOL 0 - 0.45 H: Module is in wakeup state. L: Module is in sleep state. 16 Reserved - Reserved, please keep this pin open. - - - - - 17 Reserved - Reserved, please keep this pin open. - - - - - 18 Reserved - Reserved, please keep this pin open. - - - - - 19 Reserved - Reserved, please keep this pin open. - - - - - 20 Reserved - Reserved, please keep this pin open. - - - - - Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 16 HUAWEI ME909s Series LTE LGA Module Hardware Guide Pin No. Pin Name Pad Type 21 Reserved 22 Description of the Application Interfaces Description Parameter Min. (V) Typ. (V) Max. (V) Comments - Reserved, please keep this pin open. - - - - - Reserved - Reserved, please keep this pin open. - - - - - 23 Reserved - Reserved, please keep this pin open. - - - - - 24 Reserved - Reserved, please keep this pin open. - - - - - 25 NC - Not connected - - - - - 26 NC - Not connected - - - - - 27 Reserved - Reserved, please keep this pin open. - - - - - 28 UART2_TX O UART2 transmit output VOH 1.35 1.8 1.98 VOL 0 - 0.45 Only used for debugging. VIH 1.17 1.8 1.98 VIL –0.3 - 0.63 VIH 1.17 1.8 1.98 VIL –0.3 - 0.63 29 30 UART2_RX JTAG_TMS I I UART2 receive data input JTAG test mode select. Please reserve this pin as the test point. - 31 Reserved - Reserved, please keep this pin open. - - - - - 32 VCC_EXT1 PO 1.8 V Power output - 1.62 1.8 1.98 - 33 Reserved - Reserved, please keep this pin open. - - - - - 34 USIM_VCC PO Power supply for USIM card. - 1.75 1.8 1.98 USIM_VCC= 1.8 V 2.75 3.0 3.3 USIM_VCC= 3.0 V 35 Reserved - Reserved, please keep this pin open. - - - - - 36 JTAG_TRST_ N I JTAG reset VIH 1.17 1.8 1.98 - VIL –0.3 - 0.63 37 Reserved - Reserved, please keep this pin open. - - - - - 38 NC - Not connected - - - - - Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 17 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces Pin No. Pin Name Pad Type Description Parameter Min. (V) Typ. (V) Max. (V) Comments 39 NC - Not connected - - - - - 40 NC - Not connected - - - - - 41 NC - Not connected - - - - - 42 JTAG_TCK I JTAG clock input VIH 1.17 1.8 1.98 - VIL –0.3 - 0.63 VOH 1.35 1.8 1.98 VOL 0 - 0.45 VIH 1.17 1.8 1.98 VIL –0.3 - 0.63 43 GPIO1 I/O General Purpose I/O pins. The function of these pins has not been defined. 44 Reserved - Reserved, please keep this pin open. - - - - - 45 Reserved - Reserved, please keep this pin open. - - - - - 46 GPIO2 I/O General Purpose I/O pins. VOH 1.35 1.8 1.98 VOL 0 - 0.45 VIH 1.17 1.8 1.98 The function of these pins has not been defined. VIL –0.3 - 0.63 47 NC - Not connected - - - - - 48 GND - Ground - - - - - 49 NOT USED - Do not design PAD - - - - - 50 GND - Ground - - - - - 51 GPIO3 I/O General Purpose I/O pins. VOH 1.35 1.8 1.98 VOL 0 - 0.45 VIH 1.17 1.8 1.98 The function of these pins has not been defined. VIL –0.3 - 0.63 52 GND - Ground - - - - - 53 NOT USED - Do not design PAD - - - - - 54 GND - Ground - - - - - 55 GPIO4/USIM_ Switch I/O General Purpose I/O pins (Default) or USIM VOH 1.35 1.8 1.98 The function of this pin can be used Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 18 HUAWEI ME909s Series LTE LGA Module Hardware Guide Pin No. Pin Name Pad Type Description of the Application Interfaces Description Parameter Min. (V) Typ. (V) Max. (V) Switch control signal. VOL 0 - 0.45 VIH 1.17 1.8 1.98 VIL –0.3 - 0.63 Comments as GPIO or USIM Switch, while the USIM Switch should be enabled by AT command. 56 GND - Ground - - - - - 57 NOT USED - Do not design PAD - - - - - 58 GND - Ground - - - - - 59 GND - Ground - - - - - 60 Reserved - Reserved, please keep this pin open. - - - - - 61 Reserved - Reserved, please keep this pin open. - - - - - 62 Reserved - Reserved, please keep this pin open. - - - - - 63 Reserved - Reserved, please keep this pin open. - - - - - 64 Reserved - Reserved, please keep this pin open. - - - - - 65 Reserved - Reserved, please keep this pin open. - - - - - 66 SD_DATA3 I/O SD Card data signal. VOH 2.25 3.0 3.15 VOL 67 68 SD_CLK SD_DATA0 Issue 04 (2016-12-21) O I/O SD Card CLK signal. SD Card data signal. 0 3.0 0.375 VIH 1.875 3.0 3.15 VIL –0.3 3.0 0.721 5 VOH 2.25 3.00 3.15 VOL 0 - 0.375 VOH 2.25 3.0 3.15 VOL 0 3.0 0.375 VIH 1.875 3.0 3.15 Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. Only used for debugging. Please reserve this pin as the test point. 19 HUAWEI ME909s Series LTE LGA Module Hardware Guide Pin No. 69 70 Pin Name SD_CMD USIM_DET Pad Type O I Description of the Application Interfaces Parameter Min. (V) Typ. (V) Max. (V) VIL –0.3 3.0 0.721 5 VOH 2.25 3.00 3.15 VOL 0 - 0.375 VIH 1.62 1.8 1.98 VIL 0 - 0.18 VOH 1.35 1.8 1.98 VOL 0 - 0.45 VOH 1.35 1.8 1.98 VOL 0 - 0.45 VOH 1.35 1.8 1.98 VOL 0 - 0.45 VOH 1.35 1.8 1.98 VOL 0 - 0.45 VOH 1.35 1.8 1.98 VOL 0 - 0.45 VOH 1.35 1.8 1.98 VOL 0 - 0.45 VOH 1.35 1.8 1.98 VOL 0 - 0.45 UART0 receive data input VIH 1.17 1.8 1.98 VIL –0.3 - 0.63 UART0 Data Terminal Ready VIH 1.17 1.8 1.98 VIL –0.3 - 0.63 VIH 1.17 1.8 1.98 VIL –0.3 - 0.63 VIH 1.62 1.8 1.98 VIL 0 - 0.18 Description SD Card cmd signal. USIM hot swap detection pin. When it is High, USIM is present. When it is Low, USIM is absent. 71 72 73 74 75 76 77 78 79 80 81 WAKEUP_OU T JTAG_TDO UART0_DSR UART0_RTS UART0_DCD UART0_TX UART0_RING UART0_RX UART0_DTR UART0_CTS POWER_ON_ OFF Issue 04 (2016-12-21) O O O O O O O I I I I Module to wake up the host. JTAG test data output UART0 data set Ready UART0 request to send UART0 Data Carrier Detect UART0 transmit output UART0 Ring Indicator UART0 Clear to Send System power-on or power-off Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. Comments The signal is internally pulled up. Keep USIM_DET floating, if it is not used. - - - - - - - - - - The signal is internally pulled up. 20 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces Pin No. Pin Name Pad Type Description Parameter Min. (V) Typ. (V) Max. (V) Comments 82 NC - Not connected - - - - - 83 NC - Not connected - - - - - 84 NC - Not connected - - - - - 85 USB_DM I/O USB Data- defined in the USB 2.0 Specification - - - - - 86 USB_DP I/O USB Data+ defined in the USB 2.0 Specification. - - - - - 87 JTAG_TDI I JTAG test data input VIH 1.17 1.8 1.98 - VIL –0.3 - 0.63 VOH 0.7x USIM _VCC - 3.3 VOL 0 - 0.2x USIM _VCC VOH 0.7 x USIM _VCC - 3.3 VOL 0 - 0.2 x USIM _VCC VIH 0.65x USIM _VCC - 3.30 VIL 0 - 0.25x USIM _VCC VOH 0.7 x USIM _VCC - 3.3 VOL 0 - 0.2 x USIM _VCC 88 89 90 USIM_RESET USIM_DATA USIM_CLK O I/O O USIM card reset USIM card data USIM card clock USIM_VCC= 1.8 V or 3.0 V USIM_VCC= 1.8 V or 3.0 V USIM_VCC= 1.8 V or 3.0 V 91 Reserved - Reserved, please keep this pin open. - - - - - 92 SD_VCC PO SD Card power signal. - 2.85 3.00 3.15 - 93 JTAG_RTCK O JTAG return clock, Pin VOH 1.35 1.8 2.1 - Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 21 HUAWEI ME909s Series LTE LGA Module Hardware Guide Pin No. Pin Name Pad Type Description of the Application Interfaces Description Parameter Min. (V) Typ. (V) Max. (V) for trace connection, it is a reserved test point for customers. VOL 0 - 0.45 Comments 94 Reserved - Reserved, please keep this pin open. - - - - - 95 Reserved - Reserved, please keep this pin open. - - - - - 96 Reserved - Reserved, please keep this pin open. - - - - - 97 Reserved - Reserved, please keep this pin open. - - - - - 98 Reserved - Reserved, please keep this pin open. - - - - - 99 Reserved - Reserved, please keep this pin open. - - - - - 100 RESIN_N I Reset module. VIH 1.62 1.8 1.98 VIL 0 - 0.18 The signal is internally pulled up. - - - - 101 LED_MODE O Mode indicator current sink Drive strength: 10 mA 102 ADC_1 AI Conversion interface for analog signals to digital signals - 0 - 2.5 - 103 Reserved - Reserved, please keep this pin open. - - - - - 104 ADC_2 AI Conversion interface for analog signals to digital signals - 0 - 2.5 - 105 GPIO5 I/O General Purpose I/O pins. VOH 1.35 1.8 1.98 VOL 0 - 0.45 VIH 1.17 1.8 1.98 The function of these pins has not been defined. VIL –0.3 - 0.63 106 GND - Ground - - - - - 107 MAIN_ANT - RF main antenna pad - - - - - 108 GND - Ground - - - - - 109 GPIO6 I/O General Purpose I/O VOH 1.35 1.8 1.98 The function Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 22 HUAWEI ME909s Series LTE LGA Module Hardware Guide Pin No. Pin Name Pad Type Description of the Application Interfaces Description Parameter Min. (V) Typ. (V) Max. (V) pins. VOL 0 - 0.45 VIH 1.17 1.8 1.98 VIL –0.3 - 0.63 Comments of these pins has not been defined. 110 GND - Ground - - - - - 111 NC - Not connected - - - - - 112 GND - Ground - - - - - 113 GPIO7 I/O General Purpose I/O pins VOH 1.35 1.8 1.98 VOL 0 - 0.45 The function of these pins has not been defined. VIH 1.17 1.8 1.98 VIL –0.3 - 0.63 114 GND - Ground - - - - - 115 AUX_ANT - RF AUX antenna pad - - - - - 116 GND - Ground - - - - - 117 NC - Not connected - - - - - 118 NC - Not connected - - - - - 119 NC - Not connected - - - - - 120 NC - Not connected - - - - - 121 GND - Thermal Ground Pad - - - - - 122 GND - Thermal Ground Pad - - - - - 123 GND - Thermal Ground Pad - - - - - 124 GND - Thermal Ground Pad - - - - - 125 GND - Thermal Ground Pad - - - - - 126 GND - Thermal Ground Pad - - - - - 127 GND - Thermal Ground Pad - - - - - 128 GND - Thermal Ground Pad - - - - - 129 GND - Thermal Ground Pad - - - - - 130 GND - Thermal Ground Pad - - - - - 131 GND - Thermal Ground Pad - - - - - 132 GND - Thermal Ground Pad - - - - - 133 GND - Thermal Ground Pad - - - - - Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 23 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces Pin No. Pin Name Pad Type Description Parameter Min. (V) Typ. (V) Max. (V) Comments 134 GND - Thermal Ground Pad - - - - - 135 GND - Thermal Ground Pad - - - - - 136 GND - Thermal Ground Pad - - - - - 137 GND - Thermal Ground Pad - - - - - 138 GND - Thermal Ground Pad - - - - - 139 GND - Thermal Ground Pad - - - - - 140 GND - Thermal Ground Pad - - - - - 141 GND - Thermal Ground Pad - - - - - 142 GND - Thermal Ground Pad - - - - - 143 GND - Thermal Ground Pad - - - - - 144 GND - Thermal Ground Pad - - - - - 145 GND - Thermal Ground Pad - - - - - P indicates power pins; PI indicates input power pins; PO indicates output power pins; I indicates pins for digital signal input; O indicates pins for digital signal output; AI indicates pins for analog signal input. VIL indicates Low-level Input voltage; VIH indicates High-level Input voltage; VOL indicates Low-level Output voltage; VOH indicates High-level Output voltage. The NC (Not Connected) pins are floating and there are no signal connected to these pins. The Reserved pins are internally connected to the module. Therefore, these pins should not be used, otherwise they may cause problems. Please contact with us for more details about this information. [1]: PCM_SYNC and PCM_CLK: Output, when ME909s LGA module is used as PCM master. 3.3 Power Interface 3.3.1 Overview The power supply part of the ME909s LGA module contains: VBAT pins for the power supply VCC_EXT1 pin for external power output with 1.8 V USIM_VCC pin for USIM card power output SD_VCC pin for SD card power output Table 3-2 lists the definitions of the pins on the power supply interface. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 24 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces Table 3-2 Definitions of the pins on the power supply interface Pin No. Pin Name Pad Type Description Parameter Min. (V) Typ. (V) Max. (V) Comments Power supply input for RF. 12 and 13 VBAT PI The rising time of VBAT must be greater than 100 µs - 3.2 3.8 4.2 - 32 VCC_EXT1 PO 1.8 V Power output - 1.62 1.8 1.98 - 1.75 1.8 1.98 USIM_VCC= 1.8 V 2.75 3.0 3.3 USIM_VCC= 3.0 V 34 USIM_VCC PO Power supply for USIM card 92 SD_VCC PO SD Card Power. - 2.85 3.00 3.15 - 48, 50, 52, 54, 56, 58, 59, 106, 108, 110, 112, 114 and 116 GND - GND - - - - - 121–145 GND - Thermal Ground Pad - - - - - 3.3.2 Power Supply VBAT Interface When the ME909s LGA module works normally, power is supplied through the VBAT pins and the voltage ranges from 3.2 V to 4.2 V (typical value: 3.8 V). The 145-pin LGA provides two VBAT pins and GND pins for external power input. To ensure that the ME909s LGA module works normally, all the pins must be used efficiently. When the ME909s LGA module is used for different external applications, pay special attention to the design for the power supply. When the ME909s LGA module works at 2G mode and transmits signals at the maximum power, the transient current may reach the transient peak value of about 2.75 A due to the differences in actual network environments. In this case, the VBAT voltage drops. If you want wireless good performance, please make sure that the voltage does not decrease below 3.2 V in any case. Otherwise, exceptions such as restart of the ME909s LGA module may occur. A low-dropout (LDO) regulator or switch power with current output of more than 3 A is recommended for external power supply. Furthermore, five 220 µF or above energy storage capacitors are connected in parallel at the power interface of the ME909s LGA module. In addition, to reduce the impact of channel impedance on voltage drop, you are recommended to try to shorten the power supply circuit of the VBAT interface. It is recommended that customers add the EMI ferrite bead (FBMJ1608HS280NT manufactured by TAIYO YUDEN or MPZ1608S300ATAH0 manufactured by TDK is recommended) to directly isolate DTE from DCE in the power circuit. Figure 3-3 shows the recommended power circuit of ME909s LGA module. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 25 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces Figure 3-3 Recommended power circuit of ME909s LGA module When the system power restarts, a discharge circuit is recommended to make sure the power voltage drops below 1.8 V and stays for 100 ms at least. If POWER_ON_OFF is asserted when the VBAT ranges from 1.8 V to 3.2 V, the module may enter an unexpected status. Figure 3-4 Power supply time sequence for power cycling Parameter Remarks Time (Min.) Unit Toff Power off time 100 ms The rising time of VBAT should be 100 µs at least. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 26 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces 3.3.3 Output Power Supply Interface Output power supply interfaces are VCC_EXT, USIM_VCC and SD_VCC. Through the VCC_EXT, the module can supply 1.8 V power externally with an output current of 10 mA (typical value) for external level conversion or other applications. If the module is in power down mode, the output power supply is in the disabled state. Through the USIM_VCC, the module can supply 1.8 V or 3.0 V power to the USIM card. The SD_VCC is SD card power that only used for debugging. Please reserve the test point. 3.4 Signal Control Interface 3.4.1 Overview The signal control part of the interface on the ME909s LGA module consists of the following: Power-on/off (POWER_ON_OFF) pin System reset (RESIN_N) pin WAKEUP_IN signal (WAKEUP_IN) pin WAKEUP_OUT signal (WAKEUP_OUT) pin SLEEP_STATUS signal (SLEEP_STATUS) pin LED signal (LED_MODE) pin USIM_DET signal (USIM_DET) pin Table 3-3 lists the pins on the signal control interface. Table 3-3 Definitions of the pins on the signal control interface Pin No. Pin Name Pad Type Description Parameter Min. (V) Typ. (V) Max. (V) Comments 81 POWER_ON_OFF I System power-on and power-off VIH 1.62 1.8 1.98 VIL 0 - 0.18 The signal is internally pulled up. VIH 1.62 1.8 1.98 VIL 0 - 0.18 The signal is internally pulled up。 VIH 1.17 1.8 1.98 - VIL –0.3 - 0.63 100 11 RESIN_N WAKEUP_IN[1] I I Reset module. Sleep authorization signal H: Sleep mode is disabled L: Sleep mode is enabled (default value) Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 27 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces Pin No. Pin Name Pad Type Description Parameter Min. (V) Typ. (V) Max. (V) Comments 71 WAKEUP_OUT[2] O Module to wake up the host. VOH 1.35 1.8 1.98 - VOL 0 - 0.45 VOH 1.35 1.8 1.98 - VOL 0 - 0.45 - - - - - - VIH 1.62 1.8 1.98 VIL 0 - 0.18 The signal is internally pulled up. Keep USIM_DET floating, if it is not used. H: Wake up the host, the module hold 1s high-level-voltage pulse and then output low-level-voltage L: Do not wake up the host (default value) 15 SLEEP_STATUS[3] O Sleep status indicator H: Module is in wake state L: Module is in sleep state 101 LED_MODE O Mode indicator current sink Drive strength: 10 mA 70 USIM_DET I USIM hot swap detection pin. When it is High, USIM is present. When it is Low, USIM is absent. [1]: The WAKEUP_IN pin can be used to wake up the module. [2]: WAKEUP_OUT: When the module is not in sleep mode, this pin's drive current is 4 mA. When the module is in sleep mode, this pin's output level is low and drive current smaller than 0.1 mA. The resistance is maintained at 5 kΩ–15 kΩ, as shown in Figure 3-5 . The output level may be changed if there is a stronger pull-up. It is recommended that customers take Figure 3-12 for reference to design their circuit. [3]: SLEEP_STATUS: When the module is not in sleep mode, this pin's drive current is 4 mA. When the module is in sleep mode, this pin's output level is low and drive current smaller than 0.1 mA. The resistance is maintained at 5 kΩ–15 kΩ, as shown in Figure 3-5 . The output level may be changed if there is a stronger pull-up. It is recommended that customers take Figure 3-13 for reference to design their circuit. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 28 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces Figure 3-5 Maintaining the resistance in sleep mode Module (Modem) BB Chip R=5–15 K 3.4.2 Power-on/off Pin The ME909s LGA module can be controlled to power on/off by the POWER_ON_OFF pin. Table 3-4 Two states of POWER_ON_OFF Item Pin state Description 1 Low (when ME909s LGA module is in power off state.) ME909s LGA module is powered on. Low (when ME909s LGA module is in power on state.) ME909s LGA module is powered off. 2 Issue 04 (2016-12-21) POWER_ON_OFF pin should be pulled down for 1.0s at least. POWER_ON_OFF pin should be pulled down for 4.0s at least. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 29 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces Figure 3-6 Connections of the POWER_ON_OFF pin Power-On Time Sequence After VBAT has been applied and is stable, the POWER_ON_OFF signal is pulled down, and then the module will boot up. During power on timing, please make sure the VBAT is stable. Figure 3-7 Power on timing sequence Table 3-5 Power on timing Parameter Comments Time (Nominal values) Units TPON POWER_ON_OFF turn on time. > 1.0 s TPD+ POWER_ON_OFF valid to USB D+ high About 7.0 s If the DTE needs to detect the PID/VID of module during the BIOS phase, the detection time should exceed the TPD+ time. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 30 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces Power-Off Time Sequence Figure 3-8 Power off timing sequence Table 3-6 Power off timing Parameter Comments Time (Nominal values) Units TPOFF POWER_ON_OFF turn off time. > 4.0 s TPD+ POWER_ON_OFF valid to USB D+ low > 4.0 s 3.4.3 RESIN_N The RESIN_N pin is used to reset the module's system. When the software stops responding, the RESIN_N pin can be pulled down to reset the hardware. Figure 3-9 Connections of the RESIN_N pin Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 31 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces As the RESIN_N and POWER_ON_OFF signals are relatively sensitive, it is recommended that you install a 10 nF–0.1 µF capacitor near the RESIN_N and POWER_ON_OFF pins of the interface for filtering. In addition, when you design a circuit on the PCB of the interface board, it is recommended that the circuit length not exceed 20 mm and that the circuit be kept at a distance of 2.54 mm (100 mil) at least from the PCB edge. Furthermore, you need to wrap the area adjacent to the signal wire with a ground wire. Otherwise, the module may be reset due to interference. The ME909s LGA module supports hardware reset function. If the software of the ME909s LGA module stops responding, you can reset the hardware through the RESIN_N signal as shown in Figure 3-10 .When a low-level pulse is supplied through the RESIN_N pin, the hardware will be reset. After the hardware is reset, the software starts powering on the module and reports relevant information according to the actual settings. For example, the AT command automatically reports ^SYSSTART. Figure 3-10 Reset pulse timing 3.4.4 WAKEUP_IN Signal WAKEUP_IN pin is the authorization signal of ME909s LGA module entering sleep mode. If this pin is not connected, it will keep in low level by default. Table 3-3 shows the definition of the WAKEUP_IN signal. The module cannot enter sleep mode when this pin is pulled up (1.8 V), and the module should be waked up when the pin is pulled up. Figure 3-11 Connections of the WAKEUP_IN pin Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 32 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces 3.4.5 WAKEUP_OUT Signal The WAKEUP_OUT pin is used to wake up the external devices. When WAKEUP_OUT pin is in high level, the module can wake up the host. When WAKEUP_OUT pin is in low level, the module cannot wake up the host. (default) Figure 3-12 Connections of the WAKEUP_OUT pin 3.4.6 SLEEP_STATUS Signal The SLEEP_STATUS pin is used to indicate the sleep status of the module. When SLEEP_STATUS pin is in high level, the module is in wakeup state. When SLEEP_STATUS pin is in low level, the module is in sleep state. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 33 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces Figure 3-13 Connections of the SLEEP_STATUS pin 3.4.7 LED_MODE Signal ME909s LGA module provides an LED_MODE signal to indicate the work status. Table 3-7 State of the LED_MODE pin No. Operating Status LED_MODE No service/Restricted service Outputs: low (0.1s)-high (0.1s)-low (0.1s)-high (1.7s) 1 2s cycle 2 3 Register to the network Dial-up successfully Outputs: low (0.1s)-high (1.9s) 2s cycle Outputs: low Figure 3-14 shows the recommended circuits of LED_MODE. The brightness of LED can be adjusted by adjusting the resistance of the resistor. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 34 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces Figure 3-14 Driving circuit Module (DCE) VBAT R LED_MODE 3.4.8 USIM_DET Pin ME909s LGA module supports USIM hot swap function. ME909s LGA module provides an input pin (USIM_DET) to detect whether the USIM card is present or not. This pin is a level trigger pin, and it is internally pulled up. If the module does not support USIM card hot swap, keep USIM_DET floating. Table 3-8 Function of the USIM_DET pin No. USIM_DET Function 1 High level USIM card insertion. If the USIM card is present, USIM_DET should be High. 2 Low level USIM card removal. If the USIM card is absent, USIM_DET should be Low. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 35 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces Figure 3-15 Connections of the USIM_DET pin Module (DCE) 1.8 V USIM Deck USIM_DET BB Chip 1 kΩ CD 470 pF CD is a pin detecting of USIM in the USIM socket, in normal, there will be a detect pin in the USIM socket. It is recommended not to add a diode on the USIM_DET pin outside the module. The normal SHORT USIM connector should be employed. The logic of USIM_DET is shown as Figure 3-16 . High represents that USIM is inserted; Low represents that USIM is removed. When USIM is inserted (hot), USIM_DET will change from Low to High; When USIM is removed (hot), USIM_DET will change from High to Low; The module will detect the level of USIM_DET to support the hot swap. Figure 3-16 Logic of USIM_DET WWAN Module 1.8V USIM Connector Switch USIM installed= Not Connected USIM not installed= GND Issue 04 (2016-12-21) USIM_DET Modem Processor Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 36 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces 3.5 UART Interface 3.5.1 Overview The ME909s LGA module provides the UART0 (8-wire UART) interface for one asynchronous communication channel. As the UART0 interface supports signal control through standard modem handshake, AT commands are entered and serial communication is performed through the UART0 interface. The UART2 (2-wire UART) interface is provided for only debugging by the ME909s LGA module. The UART have the following features: Full-duplex 7-bit or 8-bit data 1-bit or 2-bit stop bit Odd parity check, even parity check, or non-check Baud rate clock generated by the system clock Direct memory access (DMA) transmission UART0 supports baud rate: 300 bit/s, 600 bit/s, 1200 bit/s, 2400 bit/s ,4800 bit/s, 9600 bit/s, 19200 bit/s, 38400 bit/s, 57600 bit/s, 115200 bit/s (default), 230400 bit/s, 1000000 bit/s, 3000000 bit/s Baud rate auto adaptive change is supported. AP (Access Point) must choose one default Baud rate to communicate with module in the beginning. The 2-wire UART is for debugging only. Customers should layout two test points for them, which are required for system troubleshooting and analysis. Table 3-9 UART interface signals Pin No. Pin Name Pad Type Description Parameter Min. (V) Typ. (V) Max. (V) Comments 76 UART0_TX O UART0 transmit output VOH 1.35 1.8 1.98 - VOL 0 - 0.45 - VIH 1.17 1.8 1.98 - VIL –0.3 - 0.63 - VOH 1.35 1.8 1.98 - VOL 0 - 0.45 - VOH 1.35 1.8 1.98 - VOL 0 - 0.45 - VIH 1.17 1.8 1.98 - VIL –0.3 - 0.63 - VIH 1.17 1.8 1.98 - VIL –0.3 - 0.63 - VOH 1.35 1.8 1.98 - 78 77 74 79 80 75 UART0_RX UART0_RING UART0_RTS UART0_DTR UART0_CTS UART0_DCD Issue 04 (2016-12-21) I O O I I O UART0 receive data input UART0 ring indicator UART0 request to send UART0 data terminal ready UART0 clear to send UART0 data carrier Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 37 HUAWEI ME909s Series LTE LGA Module Hardware Guide Pin No. 73 28 29 Pin Name Pad Type UART0_DSR UART2_TX O O UART2_RX I Description of the Application Interfaces Description Parameter Min. (V) Typ. (V) Max. (V) Comments detect VOL 0 - 0.45 - UART0 data set ready VOH 1.35 1.8 1.98 - VOL 0 - 0.45 - VOH 1.35 1.8 1.98 Only used for debugging. VOL 0 - 0.45 VIH 1.17 1.8 1.98 VIL –0.3 - 0.63 UART2 transmit output UART2 receive data input Please reserve this pin as the test point. 3.5.2 Circuit Recommended for the UART Interface Figure 3-17 Connection of the UART interface in the ME909s LGA module (DCE) with the host (DTE) The RS-232 chip (must support 921600 bit/s) can be used to connect the module with UART. In this connection, the CMOS (Complementary Metal Oxide Semiconductor) logic level and the EIA (Electronic Industries Association) level are converted mutually. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 38 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces The UART cannot wake up the module from the sleep status, and you can pull up the WAKEUP_IN signal for 1s instead. It is recommended to set the pins related to UART2 interface as test points on the DTE board for debugging. The level of RS-232 transceivers must match that of the ME909s LGA module. 3.6 USB Interface The ME909s LGA module is compliant with USB 2.0 High speed protocol. The USB interface is powered directly from the VBAT supply. The USB signal lines are compatible with the USB 2.0 signal specifications. Figure 3-18 shows the circuit of the USB interface. Table 3-10 Definition of the USB interface Pin No. Pin Name Pad Type Description Parameter Min. (V) Typ. (V) Max. (V) Comments 85 USB_DM I/O USB Data- defined in the USB 2.0 Specification - - - - - 86 USB_DP I/O USB Data+ defined in the USB 2.0 Specification - - - - - According to USB protocol, for bus timing or electrical characteristics of ME909s LGA USB signal, please refer to the chapter 7.3.2 of Universal Serial Bus Specification 2.0. Figure 3-18 Recommended circuit of USB interface USB_DM and USB_DP are required to control the differential impedance 90 Ω (±10%). The length of the gap between USB_DM and USB_DP should not exceed 5 mil. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 39 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces The USB differential signal trace must be as short as possible, and laid out away from high-speed clock signals and other periodic signals as far as possible. Minimize through-holes and turning angles on the USB signal trace to reduce signal reflection and impedance change. Do not route the USB signal trace under the following components: crystal, oscillator, clock circuit, electromagnetic component, and IC that uses or generates clocks. Avoid stubs on the USB signal trace because stubs generate reflection and affect the signal quality. Route the USB signal trace on a complete reference plane (GND) and avoid crossing inter-board gaps because inter-board gaps cause a large reflow channel area and increase inductance and radiation. In addition, avoid signal traces on different layers. The USB signal trace must be far away from core logical components because the high current pulse generated during the state transitions process of core components may impose interference on signals. The USB signal trace must be far away from board edges with a minimum distance of 20 × h (h indicates the vertical distance between the trace and the reference layer) to avoid signal radiation. C1 and C2 are ready for dealing with filter differential mode interference and C3 is ready for dealing with filter common mode interference. You can choose the value of the C1, C2 and C3 according to the actual PCB which is integrated 30 mm × 30 mm LGA module 3.7 USIM Card Interface 3.7.1 Overview The ME909s LGA module provides a USIM card interface complying with the ISO 7816-3 standard and supports both Class B and Class C USIM cards. Table 3-11 USIM card interface signals Pin No. 88 89 Pin Name USIM_RESET USIM_DATA Issue 04 (2016-12-21) Pad Type O I/O Description Parameter Min.(V) Typ.(V) Max.(V) VOH 0.7 x USIM_V CC - 3.3 VOL 0 - 0.2 x USIM_V CC VOH 0.7 x USIM_V CC - 3.3 VOL 0 - 0.2 x USIM_V CC VIH 0.65 x USIM_V CC - 3.30 USIM card reset USIM card data Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. Comments USIM_VCC= 1.8 V or 3.0 V USIM_VCC= 1.8 V or 3.0 V 40 HUAWEI ME909s Series LTE LGA Module Hardware Guide Pin No. 90 Pin Name USIM_CLK Pad Type O Description Parameter Min.(V) Typ.(V) Max.(V) VIL 0 - 0.25 x USIM_V CC VOH 0.7 x USIM_V CC - 3.3 0 - 0.2 x USIM_V CC 1.75 1.8 1.98 USIM_VCC= 1.8 V 2.75 3.0 3.3 USIM_VCC= 3.0 V 1.62 1.8 1.98 USIM card clock VOL 34 70 USIM_VCC PO USIM_DET I Power supply for USIM card USIM hot swap detection pin. When it is High, USIM is present. Description of the Application Interfaces Comments USIM_VCC= 1.8 V or 3.0 V - VIH VIL 0 - 0.18 When it is Low, USIM is absent. The signal is internally pulled up. Keep USIM_DET floating, if it is not used. 3.7.2 Circuit Recommended for the USIM Card Interface As the ME909s LGA module is not equipped with a USIM socket, you need to place a USIM socket on the user interface board. Figure 3-19 shows the circuit of the USIM card interface. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 41 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces Figure 3-19 Circuit of the USIM card interface ESD protection Module (DCE) 1 kΩ USIM-DET 0Ω USIM-VCC USIM 0Ω USIM-CLK 0Ω USIM-DATA 0Ω USIM-RESET 470 pF 33 pF 33 pF 33 pF 1 µF 33 pF To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic compatibility (EMC) authentication, the USIM socket should be placed near the LGA interface (it is recommended that the PCB circuit connects the LGA interface and the USIM socket does not exceed 100 mm), because a long circuit may lead to wave distortion, thus affecting signal quality. It is recommended that you wrap the area adjacent to the USIM_CLK and USIM_DATA signal wires with ground. The Ground pin of the USIM socket and the Ground pin of the USIM card must be well connected to the power Ground pin supplying power to the ME909s LGA module. A 100 nF capacitor and 1 μF capacitor are placed between the USIM_VCC and GND pins in a parallel manner (If USIM_VCC circuit is too long, that the larger capacitance such as 4.7 μF can be employed if necessary). Three 33 pF capacitors are placed between the USIM_DATA and Ground pins, the USIM_RESET and Ground pins, and the USIM_CLK and Ground pins in parallel to filter interference from RF signals. It is recommended to take electrostatic discharge (ESD) protection measures near the USIM card socket. The TVS diode with Vrwm of 5 V and junction capacitance less than 10 pF must be placed as close as possible to the USIM socket, and the Ground pin of the ESD protection component is well connected to the power Ground pin that supplies power to the ME909s LGA module. It is recommended to place a 1 kΩ resistor in series on the USIM_DET interface for ESD protection if USIM_DET is used. 3.8 Audio Interface ME909s LGA module provides one PCM digital audio interface. Table 3-12 lists the signals on the digital audio interface. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 42 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces Table 3-12 Signals on the digital audio interface Pin No. Pin Name Pad Type Description Parameter Min. (V) Typ. (V) Max. (V) Comments 5 PCM_SYNC O PCM sync VOH 1.35 1.8 1.98 - VOL 0 - 0.45 - VIH 1.17 1.8 1.98 - VIL –0.3 - 0.63 - VOH 1.35 1.8 1.98 - VOL 0 - 0.45 - VOH 1.35 1.8 1.98 - VOL 0 - 0.45 - 6 7 8 PCM_DIN I PCM_DOUT PCM_CLK O O PCM data in PCM data out PCM clock The ME909s LGA PCM interface enables communication with an external codec to support linear format. Figure 3-20 Circuit diagram of the interface of the PCM (ME909s LGA module is used as PCM master) Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 43 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces Figure 3-21 Circuit diagram of the interface of the PCM (ME909s LGA module is used as PCM slave) The signal level of CODEC must match that of the module. ME909s LGA module supports both master and slave mode. PCM_CLK: Output when PCM is in master mode; Input when PCM is in slave mode. PCM_SYNC: Output when PCM is in master mode; Input when PCM is in slave mode. It is recommended that a TVS be used on the related interface, to prevent electrostatic discharge and protect integrated circuit (IC) components. 3.9 GPIO Interface The ME909s LGA module provides GPIO pins for customers to use as controlling signals which are worked at 1.8 V CMOS logic levels. Customers can use AT command to control the state of logic levels of GPIO output signal. See the HUAWEI ME909s Series LTE Module AT Command Interface Specification. Table 3-13 Signals on the GPIO interface Pin No. Pin Name Pad Type Description Parameter Min. (V) Typ. (V) Max. (V) Comments 55 GPIO5/USIM Switch I/O General Purpose I/O pins (Default) or USIM Switch control signal. VOH 1.35 1.8 1.98 VOL 0 - 0.45 VIH 1.17 1.8 1.98 VIL –0.3 - 0.63 The function of this pin can be defined as GPIO or USIM Switch, while the USIM Switch should be enabled by AT command. VOH 1.35 1.8 1.98 The function of 113 GPIO3 Issue 04 (2016-12-21) I/O General Purpose I/O Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 44 HUAWEI ME909s Series LTE LGA Module Hardware Guide Pin No. 51 105 109 43 46 Pin Name GPIO2 Pad Type I/O GPIO1 I/O GPIO4 I/O GPIO1 I/O GPIO2 I/O Description of the Application Interfaces Description Parameter Min. (V) Typ. (V) Max. (V) Comments pins (Default) VOL 0 - 0.45 VIH 1.17 1.8 1.98 these pins has not been defined. VIL –0.3 - 0.63 VOH 1.35 1.8 1.98 VOL 0 - 0.45 VIH 1.17 1.8 1.98 VIL –0.3 - 0.63 VOH 1.35 1.8 1.98 VOL 0 - 0.45 VIH 1.17 1.8 1.98 VIL –0.3 - 0.63 VOH 1.35 1.8 1.98 VOL 0 - 0.45 VIH 1.17 1.8 1.98 VIL –0.3 - 0.63 VOH 1.35 1.8 1.98 VOL 0 - 0.45 VIH 1.17 1.8 1.98 VIL –0.3 - 0.63 VOH 1.35 1.8 1.98 VOL 0 - 0.45 VIH 1.17 1.8 1.98 VIL –0.3 - 0.63 General Purpose I/O pins. General Purpose I/O pins. General Purpose I/O pins. General Purpose I/O pins. General Purpose I/O pins. When the GPIO interface is used for input, the module will not respond in sleep mode (it will resume response after being waken up from sleep mode by the WAKEUP_IN pin) and the module is configured to pull-down inside. In sleep mode, the pull-down resistance is 5 kΩ–15 kΩ. For the peripheral circuits, see Figure 3-22 . Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 45 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces Figure 3-22 Reference peripheral circuits when the GPIO interface is used for input When the GPIO interface is used for output and the module is not in sleep mode, the drive current is 4 mA. When the module is in sleep mode, the drive current is small er than 0.1 mA. The resistance is maintained at 5 kΩ–15 kΩ, as shown in Figure 3-23 . The output level may be changed if there is a stronger pull-up or pull-down. For the peripheral circuits, see Figure 3-24 . Figure 3-23 Maintaining the resistance in sleep mode Module (Modem) Module (Modem) 1.8 V BB Chip BB Chip Low output level in sleep mode Issue 04 (2016-12-21) High output level in sleep mode Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 46 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces Figure 3-24 Reference peripheral circuits when the GPIO interface is used for output GPIO 3.10 ADC Interface The ME909s LGA module provides two ADC interfaces. Customers can query their voltage through AT^ADCREADEX command. For details, you can see HUAWEI ME909s Series LTE Module AT Command Interface Specification. Table 3-14 Signals on the ADC interface PIN No. Pin Name Pad Type Description Min. (V) Typ. (V) Max. (V) Comments 102 ADC_1 AI Conversion interface for analog signals to digital signals 0 - 2.5 - 104 ADC_2 AI Conversion interface for analog signals to digital signals 0 - 2.5 - 3.11 JTAG Interface The ME909s LGA module provides Joint Test Action Group (JTAG) interface. Table 3-15 shows the signals on the JTAG interface. It is recommended that route out the 6 pins as test points on the DTE for tracing and debugging. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 47 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces Table 3-15 Signals on the JTAG interface Pin No. Pin Name Pad Type Description Parameter Min. (V) Typ. (V) Max. (V) Comments 30 JTAG_TMS I JTAG test mode select VIH 1.17 1.8 1.98 - VIL –0.3 - 0.63 - VIH 1.17 1.8 1.98 - VIL –0.3 - 0.63 - VIH 1.17 1.8 1.98 - VIL –0.3 - 0.63 - VOH 1.35 1.8 1.98 - VOL 0 - 0.45 - VIH 1.17 1.8 1.98 - VIL –0.3 - 0.63 - VOH 1.35 1.8 2.1 - VOL 0 - 0.45 - 36 42 72 87 93 JTAG_TRST_N I JTAG_TCK I JTAG_TDO O JTAG_TDI I JTAG_RTCK O JTAG reset JTAG clock input JTAG test data output JTAG test data input JTAG return clock, Pin for trace connection, it is a reserved test point for customers. 3.12 RF Antenna Interface The ME909s LGA module provides two antenna pads (MAIN_ANT and AUX_ANT) for connecting the external antennas. Table 3-16 Definition of the antenna pads Pin No. Pin Name Pad Type Description Parameter Min. (V) Typ. (V) Max. (V) Comments 107 MAIN_ANT - RF MAIN antenna pad - - - - - 115 AUX_ANT - RF AUX antenna pad - - - - - Route the antenna pad as close as possible to antenna connector. In addition, the impedance of RF signal traces must be 50 Ω. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 48 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces Figure 3-25 RF signal trace design about MAIN_ANT for reference (the same for AUX_ANT) Figure 3-26 RF signal layout design about MAIN_ANT for reference (the same for AUX_ANT) Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 49 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces For the PCB designed by the user, the impedance of all the RF signal tracks must be 50 Ω. Generally, the impedance depends on the medium factor, track width, and distance from the floor. In order to reflect the rules of design, the following figures indicate the complete structure of the microstrip and stripline with an impedance of 50 Ω as well as the reference design for stack. Figure 3-27 Complete structure of the microstrip Figure 3-28 Complete structure of the stripline Figure 3-29 Pad for the RF interface Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 50 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces Figure 3-30 RF Pad design for ME909s LGA Please use impedance simulation tool to calculate RF MAIN pad impedance. The RF MAIN pad dimension of the module is 1.1 mm (L) x 0.9 mm (W). You can get the impedance with lower than 50 Ω calculated by the impedance simulation tool. Since the target impedance is 50 Ω for RF trace, the recommended solution is that to carve out the copper area of the second layer that projected by the RF MAIN pad at top layer. How many layers should be carved out depend on the PCB permittivity, track width, and distance from the floor of your own PCB. Our target is to make the RF MAIN pad impedance as closer to 50 Ω as possible. 3.13 Reserved Interface The ME909s LGA module provides some reserved pins. All reserved pins cannot be used by the customer. Table 3-17 Reserved pin Pin No. Pin Name Pad Type Description Parameter Min. (V) Typ. (V) Max. (V) Comments 1-4,14, 16-24, 27, 31, 33, 35, 37, 44, 45, 60–65, 91, 94–99 and 103 Reserved - Reserved, please keep this pin open. - - - - - 3.14 NC Interface The ME909s LGA module provides some NC pins. All NC pins should not be connected. Please keep these pins open. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 51 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description of the Application Interfaces Table 3-18 NC pin Pin No. Pin Name Pad Type Description Parameter Min. (V) Typ. (V) Max. (V) Comments 25, 26, 38–41, 47, 82–84, 111, 117–120 NC - Not connected - - - - - 3.15 Test Points Design In the process of debugging when the module is embedded into the integrated equipment, test points play an important role. Some problems related to the module can be quickly resolved when test points are properly designed. 1. 2. Issue 04 (2016-12-21) The test points below must be designed in the customer board: − JTAG test points: It is the most common method of debugging. − USB test points: USB is the most important communication channel between module and AP (host). Not only test points should be placed, but also a 0 ohm series resistor should be placed on USB_D+/USB_D- signal. The resistor can be welded off when necessary, then the USB of module is cut off from AP and can be connected to PC to do some analyses. − POWER_ON_OFF, RESIN_N: They are some of the most important signals, test points should be placed. − UART2: UART2 is used for printing the log information. − SD signals: SD signals are used for debugging. − VBAT: Not only test points should be placed, but also a series magnetic bead should be placed on VBAT signal. The magnetic bead can be welded off when necessary, then the power of module is cut off from customer board and can be connected to external power to do analyses about problems related to power interference. − VCC_EXT1: to judge whether the module is powered on or not, just test the VCC_EXT1. The test points below should be placed according to the requirement in the customer board: ADC, SLEEP_STATUS, GPIO, PCM, SIM, UART2, WAKEUP_IN and WAKEUP_OUT, except the two cases below: − The corresponding signal is not used. − The corresponding signal is used, but there is already someplace else can be tested, such as SIM socket pin. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 52 HUAWEI ME909s Series LTE LGA Module Hardware Guide RF Specifications 4 RF Specifications 4.1 About This Chapter This chapter describes the RF specifications of the ME909s LGA module, including: Operating Frequencies Conducted RF Measurement Conducted Rx Sensitivity and Tx Power Antenna Design Requirements Suggestions about LTE and 2.4 GHz Wi-Fi Co-existence 4.2 Operating Frequencies Table 4-1 and Table 4-2 show the RF bands supported by ME909s LGA module. Table 4-1 RF bands of the ME909s-821 LGA module Operating Band Tx Rx UMTS Band 1 1920 MHz–1980 MHz 2110 MHz–2170 MHz UMTS Band 5 824 MHz–849 MHz 869 MHz–894 MHz UMTS Band 8 880 MHz–915 MHz 925 MHz–960 MHz UMTS Band 9 1749.9 MHz–1784.9 MHz 1844.9 MHz–1879.9 MHz GSM 900 880 MHz–915 MHz 925 MHz–960 MHz GSM 1800 1710 MHz–1785 MHz 1805 MHz–1880 MHz LTE Band 1 1920 MHz–1980 MHz 2110 MHz–2170 MHz LTE Band 3 1710 MHz–1785 MHz 1805 MHz–1880 MHz LTE Band 8 880 MHz–915 MHz 925 MHz–960 MHz LTE Band 38 2570 MHz–2620 MHz 2570 MHz–2620 MHz LTE Band 39 1880 MHz–1920 MHz 1880 MHz–1920 MHz Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 53 HUAWEI ME909s Series LTE LGA Module Hardware Guide RF Specifications Operating Band Tx Rx LTE Band 40[1] 2300 MHz–2400 MHz 2300 MHz–2400 MHz LTE Band 41 [2] 2496 MHz–2690 MHz 2496 MHz–2690 MHz TD-SCDMA Band 34 2010 MHz–2025 MHz 2010 MHz–2025 MHz TD-SCDMA Band 39 1880 MHz–1920 MHz 1880 MHz–1920 MHz [1]: The module may not meet the RF performance requirements at frequency 2390–2400 MHz in the LTE B40 band. [2]: The module may not meet the RF performance requirements at frequency 2496–2555 MHz or 2655–2690 MHz in the LTE B41 band. Table 4-2 RF bands of the ME909s-120 LGA module Operating Band Tx Rx UMTS Band 1 1920 MHz–1980 MHz 2110 MHz–2170 MHz UMTS Band 2 1850 MHz–1910 MHz 1930 MHz–1990 MHz UMTS Band 5 824 MHz–849 MHz 869 MHz–894 MHz UMTS Band 8 880 MHz–915 MHz 925 MHz–960 MHz GSM 850 824 MHz–849 MHz 869 MHz–894 MHz GSM 900 880 MHz–915 MHz 925 MHz–960 MHz GSM 1800 1710 MHz–1785 MHz 1805 MHz–1880 MHz GSM 1900 1850 MHz–1910 MHz 1930 MHz–1990 MHz LTE Band 1 1920 MHz–1980 MHz 2110 MHz–2170 MHz LTE Band 2 1850 MHz–1910 MHz 1930 MHz–1990 MHz LTE Band 3 1710 MHz–1785 MHz 1805 MHz–1880 MHz LTE Band 4 1710 MHz–1755 MHz 2110 MHz–2155 MHz LTE Band 5 824 MHz–849 MHz 869 MHz–894 MHz LTE Band 7 2500 MHz–2570 MHz 2620 MHz–2690 MHz LTE Band 8 880 MHz–915 MHz 925 MHz–960 MHz LTE Band 20 832 MHz–862 MHz 791 MHz–821 MHz Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 54 HUAWEI ME909s Series LTE LGA Module Hardware Guide RF Specifications 4.3 Conducted RF Measurement 4.3.1 Test Environment Test instrument R&S CMU200, R&S CMW500, Agilent E5515C, Starpoint SP6010 Power supply KEITHLEY 2306; Aglient66319D RF cable for testing L08-C014-350 of DRAKA COMTEQ or Rosenberger Cable length: 29 cm The compensation for different frequency bands relates to the cable and the test environment. The instrument compensation needs to be set according to the actual cable conditions. 4.3.2 Test Standards Huawei modules meet 3GPP test standards. Each module passes strict tests at the factory and thus the quality of the modules is guaranteed. 4.4 Conducted Rx Sensitivity and Tx Power 4.4.1 Conducted Receive Sensitivity The conducted receive sensitivity is a key parameter that indicates the receiver performance of ME909s LGA module. Table 4-3 and Table 4-4 list the typical tested values of the ME909s LGA module. Table 4-3 ME909s-821 LGA module conducted Rx sensitivity Band Test Value (Unit: dBm) Note GSM 900 –109 BER Class II < 2.44% GSM 1800 –107 BER Class II < 2.44% UMTS Band 1 –110.5 BER < 0.1% UMTS Band 5 –110.5 BER < 0.1% UMTS Band 8 –110.5 BER < 0.1% UMTS Band 9 –110.5 BER < 0.1% LTE Band 1 –103 FDD QPSK throughput > 95%, 10 MHz Bandwidth LTE Band 3 –102.5 FDD QPSK throughput > 95%, 10 MHz Bandwidth Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 55 HUAWEI ME909s Series LTE LGA Module Hardware Guide RF Specifications Test Value Band Note (Unit: dBm) LTE Band 8 –102.5 FDD QPSK throughput > 95%, 10 MHz Bandwidth LTE Band 38 –101.5 TDD QPSK throughput > 95%, 10 MHz Bandwidth LTE Band 39 –102 TDD QPSK throughput > 95%, 10 MHz Bandwidth LTE Band 40 –101 TDD QPSK throughput > 95%, 10 MHz Bandwidth LTE Band 41 –101 TDD QPSK throughput > 95%, 10 MHz Bandwidth TD-SCMDA Band 34 –112 BER < 0.1% TD-SCMDA Band 39 –112.5 BER < 0.1% Table 4-4 ME909s-120 LGA module conducted Rx sensitivity Band Test Value (Unit: dBm) Note GSM 850 –109 BER Class II < 2.44% GSM 900 –109 BER Class II < 2.44% GSM 1800 –108.5 BER Class II < 2.44% GSM 1900 –109 BER Class II < 2.44% UMTS Band 1 –111.5 BER < 0.1% UMTS Band 2 –111.5 BER < 0.1% UMTS Band 5 –111.5 BER < 0.1% UMTS Band 8 –111.5 BER < 0.1% LTE Band 1 –102.5 Throughput ≥ 95%, 10 MHz Bandwidth LTE Band 2 –102.5 Throughput ≥ 95%, 10 MHz Bandwidth LTE Band 3 –102 Throughput ≥ 95%, 10 MHz Bandwidth LTE Band 4 –102 Throughput ≥ 95%, 10 MHz Bandwidth LTE Band 5 –102.5 Throughput ≥ 95%, 10 MHz Bandwidth LTE Band 7 –102.5 Throughput ≥ 95%, 10 MHz Bandwidth LTE Band 8 –102.5 Throughput ≥ 95%, 10 MHz Bandwidth LTE Band 20 –102.5 Throughput ≥ 95%, 10 MHz Bandwidth Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 56 HUAWEI ME909s Series LTE LGA Module Hardware Guide RF Specifications The test values are the average of some test samples. LTE sensitivity is tested in SIMO (Main + AUX). 4.4.2 Conducted Transmit Power The conducted transmit power is another indicator that measures the performance of ME909s LGA module. The conducted transmit power refers to the maximum power that the module tested at the antenna pad can transmit. According to the 3GPP protocol, the required transmit power varies with the power class. Table 4-5 and Table 4-6 list the required ranges of the conducted transmit power of ME909s LGA module. Table 4-5 ME909s-821 LGA module conducted Tx power Band Typical Value (Unit: dBm) Note (Unit: dB) GMSK (1Tx Slot) 32.5 ±1.5 8PSK (1Tx Slot) 27 ±1.5 GMSK (1Tx Slot) 29.5 ±1.5 8PSK (1Tx Slot) 26 ±1.5 UMTS Band 1 23.5 ±1 UMTS Band 5 23.5 ±1 UMTS Band 8 23.5 ±1 UMTS Band 9 23.5 ±1 TD-SCDMA Band 34 23.5 ±1 TD-SCDMA Band 39 23.5 ±1 TDD LTE Band 38 23 ±1.5 TDD LTE Band 39 23 ±1.5 TDD LTE Band 40 23 ±1.5 TDD LTE Band 41 23 ±1.5 FDD LTE Band 1 23 ±1.5 FDD LTE Band 3 23 ±1.5 FDD LTE Band 8 23 ±1.5 GSM 900 GSM 1800 Table 4-6 ME909s-120 LGA module conducted Tx power Band GSM 850 Issue 04 (2016-12-21) GMSK (1Tx Slot) Typical Value (Unit: dBm) Note (Unit: dB) 32.5 ±1.5 Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 57 HUAWEI ME909s Series LTE LGA Module Hardware Guide Band RF Specifications Typical Value (Unit: dBm) Note (Unit: dB) 8PSK (1Tx Slot) 27 ±1.5 GMSK (1Tx Slot) 32.5 ±1.5 8PSK (1Tx Slot) 27 ±1.5 GMSK (1Tx Slot) 29.5 ±1.5 8PSK (1Tx Slot) 26 ±1.5 GMSK (1Tx Slot) 29.5 ±1.5 8PSK (1Tx Slot) 26 ±1.5 UMTS Band 1 23.5 ±1 UMTS Band 2 23.5 ±1 UMTS Band 5 23.5 ±1 UMTS Band 8 23.5 ±1 LTE Band 1 23 ±1.5 LTE Band 2 23 ±1.5 LTE Band 3 23 ±1.5 LTE Band 4 23 ±1.5 LTE Band 5 23 ±1.5 LTE Band 7 23 ±1.5 LTE Band 8 23 ±1.5 LTE Band 20 23 ±1.5 GSM 900 GSM 1800 GSM 1900 Maximum Power Reduction (MPR and AMPR) of LTE is according to 3GPP TS 36.521-1. 4.5 Antenna Design Requirements 4.5.1 Antenna Design Indicators Antenna Efficiency Antenna efficiency is the ratio of the input power to the radiated or received power of an antenna. The radiated power of an antenna is always lower than the input power due to the following antenna losses: return loss, material loss, and coupling loss. The efficiency of an antenna relates to its electrical dimensions. To be specific, the antenna efficiency increases with the electrical dimensions. In addition, the transmission line from the antenna port of ME909s LGA to the antenna is also part of Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 58 HUAWEI ME909s Series LTE LGA Module Hardware Guide RF Specifications the antenna. The line loss increases with the line length and the frequency. It is recommended that the line loss is as low as possible. The following antenna efficiency (free space) is recommended for ME909s LGA to ensure high radio performance of the module: Efficiency of the primary antenna: ≥ 40% (below 960 MHz); ≥ 50% (over 1710 MHz) Efficiency of the diversity antenna: ≥ half of the efficiency of the primary antenna in receiving band In addition, the efficiency should be tested with the transmission line. S11 (VSWR) S11 indicates the degree to which the input impedance of an antenna matches the reference impedance (50 Ω). S11 shows the resonance feature and impedance bandwidth of an antenna. Voltage standing wave ratio (VSWR) is another expression of S11. S11 relates to the antenna efficiency. S11 can be measured with a vector analyzer. The following S11 value is recommended for the antenna of ME909s LGA module: S11 of the primary antenna: ≤ –6 dB S11 of the diversity antenna: ≤ –6 dB In addition, S11 is less important than the efficiency, and S11 has weak correlation to wireless performance. Isolation For a wireless device with multiple antennas, the power of different antennas is coupled with each other. Antenna isolation is used to measure the power coupling. The power radiated by an antenna might be received by an adjacent antenna, which decreases the antenna radiation efficiency and affects the running of other devices. To avoid this problem, evaluate the antenna isolation as sufficiently as possible at the early stage of antenna design. Antenna isolation depends on the following factors: Distance between antennas Antenna type Antenna direction The primary antenna must be placed as near as possible to the ME909s LGA to minimize the cable length. The diversity antenna needs to be installed perpendicularly to the primary antenna. The diversity antenna can be placed farther away from the ME909s LGA. Antenna isolation can be measured with a two-port vector network analyzer. The following antenna isolation is recommended for the antennas on laptops: Isolation between the primary and diversity antennas: ≤ –12 dB Isolation between the primary (diversity) antenna and the Wi-Fi antenna: ≤ –15 dB Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 59 HUAWEI ME909s Series LTE LGA Module Hardware Guide RF Specifications Polarization The polarization of an antenna is the orientation of the electric field vector that rotates with time in the direction of maximum radiation. The linear polarization is recommended for the antenna of ME909s LGA. Radiation Pattern The radiation pattern of an antenna reflects the radiation features of the antenna in the remote field region. The radiation pattern of an antenna commonly describes the power or field strength of the radiated electromagnetic waves in various directions from the antenna. The power or field strength varies with the angular coordinates (θ and φ), but is independent of the radial coordinates. The radiation pattern of half wave dipole antennas is omnidirectional in the horizontal plane, and the incident waves of base stations are often in the horizontal plane. For this reason, the receiving performance is optimal. The following radiation patterns are recommended for the antenna of ME909s LGA. Primary/diversity antenna: omnidirectional In addition, the diversity antenna’s pattern should be complementary with the primary antenna's pattern. Gain and Directivity The radiation pattern of an antenna represents the field strength of the radiated electromagnetic waves in all directions, but not the power density that the antenna radiates in the specific direction. The directivity of an antenna, however, measures the power density that the antenna radiates. Gain, as another important parameter of antennas, correlates closely to the directivity. The gain of an antenna takes both the directivity and the efficiency of the antenna into account. The appropriate antenna gain prolongs the service life of relevant batteries. The following antenna gain is recommended for ME909s LGA. Gain of the primary/diversity antenna ≤ 2.5 dBi ECC of the Antenna ECC is short for Envelope Correlation Coefficient. It is the cross-correlation value of the complex patterns of the master and diversity antenna. It indicates how similar the magnitude and the phase patterns of the two antennas are. If two antennas have no similarity, the ECC should be zero. Actually, the less ECC, the better diversity performance. The following ECC is recommended for ME909s LGA module. ECC ≤ 0.5 (working frequency below 0.96 GHz) ECC ≤ 0.3 (working frequency above 1.4 GHz) Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 60 HUAWEI ME909s Series LTE LGA Module Hardware Guide RF Specifications The antenna consists of the antenna body and the relevant RF transmission line. Take the RF transmission line into account when measuring any of the preceding antenna indicators. Huawei cooperates with various famous antenna suppliers who are able to make suggestions on antenna design, for example, Amphenol, Skycross, etc. 4.5.2 Interference Besides the antenna performance, the interference on the user board also affects the radio performance (especially the TIS) of the module. To guarantee high performance of the module, the interference sources on the user board must be properly controlled. On the user board, there are various interference sources, such as the LCD, CPU, audio circuits, and power supply. All the interference sources emit interference signals that affect the normal operation of the module. For example, the module sensitivity can be decreased due to interference signals. Therefore, during the design, you need to consider how to reduce the effects of interference sources on the module. You can take the following measures: Use an LCD with optimized performance; shield the LCD interference signals; shield the signal line of the board; or design filter circuits. Huawei is able to make technical suggestions on radio performance improvement of the module. 4.5.3 Antenna Requirements The antenna for ME909s LGA module must fulfill the following requirements: Table 4-7 ME909s LGA module antenna requirements Antenna Requirements Frequency range Depending on frequency band(s) provided by the network operator, the customer must use the most suitable antenna for that/those band(s) Bandwidth of primary antenna ME909s-821 250 MHz in UMTS Band 1; LTE Band 1 170 MHz in GSM 1800; LTE Band 3 70 MHz in UMTS Band 5; 80 MHz in GSM 900; UMTS Band 8; LTE Band 8 130 MHz in UMTS Band 9 50 MHz in LTE Band 38 40 MHz in LTE Band 39 100 MHz in LTE Band 40 194 MHz in LTE Band 41 15 MHz in TD-SCDMA Band 34 40 MHz in TD-SCDMA Band 39 ME909s-120 250 MHz in UMTS Band 1; LTE Band 1 140 MHz in GSM 1900; UMTS Band 2; LTE Band 2 170 MHz in GSM 1800; LTE Band 3 Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 61 HUAWEI ME909s Series LTE LGA Module Hardware Guide RF Specifications Antenna Requirements 445 MHz in LTE Band 4 70 MHz in GSM 850; UMTS Band 5; LTE Band 5 190MHz in LTE Band 7 80 MHz in GSM 900; UMTS Band 8; LTE Band 8 71 MHz in LTE Band 20 Bandwidth of secondary antenna ME909s-821 60 MHz in UMTS Band 1; LTE Band 1 75 MHz in LTE Band 3 25 MHz in UMTS Band 5 35 MHz in UMTS Band 8; LTE Band 8 30 MHz in UMTS Band 9 50 MHz in LTE Band 38 40 MHz in LTE Band 39 100 MHz in LTE Band 40 194 MHz in LTE Band 41 ME909s-120 60 MHz in UMTS Band 1; LTE Band 1 60 MHz in UMTS Band 2; LTE Band 2 75 MHz in LTE Band 3 45 MHz in LTE Band 4 25 MHz in UMTS Band 5; LTE Band 5 70 MHz in LTE Band 7 35 MHz in UMTS Band 8; LTE Band 8 30 MHz in LTE Band 20 Gain ≤ 2.5 dBi Impedance 50 Ω VSWR absolute max ≤ 3:1 VSWR recommended ≤ 2:1 4.6 Suggestions about LTE and 2.4 GHz Wi-Fi Co-existence 4.6.1 Theory Analysis The band gap between LTE Band 38/40/41 and Wi-Fi (2.4 G) is very narrow just as shown as below. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 62 HUAWEI ME909s Series LTE LGA Module Hardware Guide 2401MHz B40 TX/RX 2300MHz 2495MHz WIFI TX/RX 2400MHz RF Specifications 2570MHz 2500MHz 2620MHz B38 TX/RX B7 uplink B7 downlink B41 TX/RX 2496MHz 2690MHz The two systems interfere with each other because of nonlinear characteristic of LTE Band 38/40/41 and Wi-Fi transmitter. The main impacts are as follows: 1. LTE Band transmitter spurious in Wi-Fi Band impacts on the sensitivity of Wi-Fi receiver. 2. LTE Band output power can block Wi-Fi receiver. 3. Wi-Fi transmitter spurious in LTE Band impacts on the sensitivity of LTE Bands. 4. Wi-Fi output power can block LTE Band receiver. According to the theoretical analysis, in order to achieve the co-existence between Wi-Fi and LTE, the rejection between Wi-Fi and LTE Band 41 or Band 40 needs to be over 60 dB. (The analysis is based on the Wi-Fi chip Broadcom BCM432XX, the co-existence design depends on the customer’s Wi-Fi chipset specification.) In fact, the current devices cannot meet this requirement, so we need to increase the isolation between antennas and disable some channels. 4.6.2 Suggestions about the Interference These risks have been taken into consideration in the design of the ME909s LGA module. The system design also should be paid attention: 1. It is recommended that the system should be added Wi-Fi SAW filter to guarantee good attenuation in the LTE transmit Band (including Band 38, Band 40, Band 41), otherwise, LTE Band output power will block Wi-Fi receiver. 2. The good isolation between LTE antenna and Wi-Fi antenna is more than 25 dB. 3. Two ways above can help to make the isolation to be 60 dB. If they are still not enough, some channels may need to be disabled. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 63 HUAWEI ME909s Series LTE LGA Module Hardware Guide 5 Electrical and Reliability Features Electrical and Reliability Features 5.1 About This Chapter This chapter describes the electrical and reliability features in the ME909s LGA module, including: Absolute Ratings Operating and Storage Temperatures Power Supply Features Reliability Features EMC and ESD Features 5.2 Absolute Ratings Table 5-1 lists the absolute ratings for the ME909s LGA module. Using the ME909s LGA module beyond these conditions may result in permanent damage to the module. Table 5-1 Absolute ratings Symbol Specification Min. Max. Unit VBAT External power voltage –0.3 4.5 V VI Digital input voltage –0.3 2.3 V 5.3 Operating and Storage Temperatures Table 5-2 lists the operating and storage temperatures for the ME909s LGA module. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 64 HUAWEI ME909s Series LTE LGA Module Hardware Guide Electrical and Reliability Features Table 5-2 Operating and storage temperatures Specification Min. Max. Unit Normal working temperatures –30 +75 °C –40 +85 °C –40 +85 °C Extended temperatures [1] Ambient temperature for storage [1]: When the ME909s LGA module works in the range from –40°C to –30°C or +75°C to +85°C, NOT all their RF performances comply with 3GPP specifications. 5.4 Power Supply Features 5.4.1 Input Power Supply Table 5-3 lists the requirements for input power of the ME909s LGA module. Table 5-3 Requirements for input power Parameter Min. Typ. Max. Ripple Unit VBAT 3.2 3.8 4.2 0.05 V Figure 5-1 Power Supply During Burst Emission The VBAT minimum value must be guaranteed during the burst (with 2.75 A Peak in GPRS or GSM mode). Table 5-4 Requirements for input current Power Peak (GSM 1 slot) Normal (WCDMA) Normal (LTE 23 dbm) VBAT 2750 mA 1100 mA 1100 mA Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 65 HUAWEI ME909s Series LTE LGA Module Hardware Guide Electrical and Reliability Features 5.4.2 Power Consumption The power consumptions of ME909s LGA module in different scenarios are respectively listed in Table 5-5 to Table 5-11 . The power consumption listed in this section is tested when the power supply of ME909s LGA module is 3.8 V, and all of test values are measured at room temperature. Table 5-5 Averaged power off DC power consumption Description Test Value (Unit: µA) Notes/Configuration Typical Power off Normal voltage (3.8 V) is ON while power on event is not triggered. 65 Table 5-6 Averaged standby DC power consumption of ME909s-821 LGA module Description Bands Test Value (Unit: mA) Notes/Configuration Typical Sleep LTE LTE bands 1.9 Module is powered up. Paging cycle=256 (2.56s) Module is registered on the network. USB is in suspend TD-SCDMA TD-SCDMA bands 2.5 Module is powered up. DRX cycle=8 (2.56s) Module is registered on the network. USB is in suspend HSPA+/WCDMA UMTS bands 1.7 Module is powered up DRX cycle=8 (1.28s) Module is registered on the network. USB is in suspend GPRS/EDGE GSM bands 2.1 Module is powered up MFRMS=5 (1.175s) Module is registered on the network. USB is in suspend. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 66 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description Bands Electrical and Reliability Features Test Value (Unit: mA) Notes/Configuration Typical Idle LTE LTE bands 48 Module is powered up. Paging cycle=256 (2.56s) Module is registered on the network, no data is transmitted. USB is in active. TD-SCDMA TD-SCDMA bands 50 Module is powered up. DRX cycle=8 (2.56s) Module is registered on the network. USB is in active HSPA+/WCDMA UMTS bands 55 Module is powered up DRX cycle=8 (1.28s) Module is registered on the network, no data is transmitted USB is in active. GPRS/EDGE GSM bands 55 Module is powered up MFRMS=5 (1.175s) Module is registered on the network, no data is transmitted USB is in active. Table 5-7 Averaged standby DC power consumption of ME909s-120 LGA module Description Bands Test Value (Unit: mA) Notes/Configuration Typical Sleep LTE LTE bands 1.85 Module is powered up. Paging cycle=256 (2.56s) Module is registered on the network. USB is in suspend. HSPA/WCDMA UMTS bands 1.5 Module is powered up DRX cycle=8 (1.28s) Module is registered on the network. USB is in suspend. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 67 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description Bands Electrical and Reliability Features Test Value (Unit: mA) Notes/Configuration Typical GPRS/EDGE GSM bands 1.87 Module is powered up MFRMS=5 (1.175s) Module is registered on the network. USB is in suspend. Idle LTE LTE bands 48 Module is powered up. Paging cycle=256 (2.56s) Module is registered on the network, no data is transmitted. USB is in active. HSPA/WCDMA UMTS bands 47 Module is powered up DRX cycle=8 (1.28s) Module is registered on the network, no data is transmitted USB is in active. GPRS/EDGE GSM bands 48 Module is powered up MFRMS=5 (1.175s) Module is registered on the network. no data is transmitted USB is in active. Table 5-8 Averaged Data Transmission DC power consumption of ME909s-821 LGA module (LTE/HSPA/WCDMA/TD-SCDMA) Description Band Test Value (Unit: mA) Notes/Configuration Typical WCDMA Band 1 188 0 dBm Tx Power (IMT 2100) 216 10 dBm Tx Power 603 23.5 dBm Tx Power Band 5 181 0 dBm Tx Power (850MHz) 199 10 dBm Tx Power 501 23.5 dBm Tx Power 188 0 dBm Tx Power Band 8 Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 68 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description Band Electrical and Reliability Features Test Value (Unit: mA) Notes/Configuration Typical (900 MHz) HSPA TDD LTE 207 10 dBm Tx Power 504 23.5 dBm Tx Power Band 9 212 0 dBm Tx Power (J1700) 289 10 dBm Tx Power 719 23.5 dBm Tx Power Band 1 179 0 dBm Tx Power (IMT 2100) 213 10 dBm Tx Power 578 23.5 dBm Tx Power Band 5 172 0 dBm Tx Power (850MHz) 189 10 dBm Tx Power 439 23.5 dBm Tx Power Band 8 177 0 dBm Tx Power (900 MHz) 201 10 dBm Tx Power 489 23.5 dBm Tx Power Band 9 221 0 dBm Tx Power (J1700) 300 10 dBm Tx Power 743 23.5 dBm Tx Power 195 0 dBm Tx Power 242 10 dBm Tx Power 400 23 dBm Tx Power 182 0 dBm Tx Power 213 10 dBm Tx Power 273 23 dBm Tx Power 195 0 dBm Tx Power 242 10 dBm Tx Power 438 23 dBm Tx Power 195 0 dBm Tx Power 246 10 dBm Tx Power 405 23 dBm Tx Power 263 0 dBm Tx Power Band 38 Band 39 Band 40 Band 41 FDD LTE Issue 04 (2016-12-21) Band 1 Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 69 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description Band Electrical and Reliability Features Test Value (Unit: mA) Notes/Configuration Typical Band 3 Band 8 TD-SCDMA Band 34 Band 39 315 10 dBm Tx Power 623 23 dBm Tx Power 268 0 dBm Tx Power 338 10 dBm Tx Power 807 23 dBm Tx Power 264 0 dBm Tx Power 298 10 dBm Tx Power 520 23 dBm Tx Power 84 0 dBm Tx Power 87 10 dBm Tx Power 132 23 dBm Tx Power 95 0 dBm Tx Power 101 10 dBm Tx Power 133 23 dBm Tx Power Table 5-9 Averaged Data Transmission DC power consumption of ME909s-120 LGA module (WCDMA/HSDPA/LTE) Description Band Test Value (Unit: mA) Notes/Configuration Typical WCDMA Band 1 190 0 dBm Tx Power (IMT 2100) 225 10 dBm Tx Power 690 23.5 dBm Tx Power Band 2 187 0 dBm Tx Power (PCS 1900) 220 10 dBm Tx Power 670 23.5 dBm Tx Power 180 0 dBm Tx Power 215 10 dBm Tx Power 555 23.5 dBm Tx Power 185 0 dBm Tx Power Band 5 (850 MHz) Band 8 Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 70 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description Band Electrical and Reliability Features Test Value (Unit: mA) Notes/Configuration Typical (900 MHz) HSDPA LTE 220 10 dBm Tx Power 635 23.5 dBm Tx Power Band 1 205 0 dBm Tx Power (IMT2100) 243 10 dBm Tx Power 631 23.5 dBm Tx Power Band 2 202 0 dBm Tx Power (PCS 1900) 238 10 dBm Tx Power 580 23.5 dBm Tx Power Band 5 200 0 dBm Tx Power (850 MHz) 235 10 dBm Tx Power 535 23.5 dBm Tx Power Band 8 205 0 dBm Tx Power (900 MHz) 247 10 dBm Tx Power 575 23.5 dBm Tx Power 270 0 dBm Tx Power 330 10 dBm Tx Power 725 23 dBm Tx Power 275 0 dBm Tx Power 330 10 dBm Tx Power 715 23 dBm Tx Power 273 0 dBm Tx Power 340 10 dBm Tx Power 735 23 dBm Tx Power 276 0 dBm Tx Power 340 10 dBm Tx Power 705 23 dBm Tx Power 280 0 dBm Tx Power 642 10 dBm Tx Power Band 1 Band 2 Band 3 Band 4 Band 5 Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 71 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description Band Electrical and Reliability Features Test Value (Unit: mA) Notes/Configuration Typical Band 7 Band 8 Band 20 725 23 dBm Tx Power 280 0 dBm Tx Power 340 10 dBm Tx Power 725 23 dBm Tx Power 278 0 dBm Tx Power 330 10 dBm Tx Power 645 23 dBm Tx Power 280 0 dBm Tx Power 330 10 dBm Tx Power 665 23 dBm Tx Power Table 5-10 Averaged DC power consumption of ME909s-821 LGA module (GPRS/EDGE) Description Test Value Units PCL Configuration GPRS 900 314 mA 5 1 Up/1 Down 468 2 Up/1 Down 627 4 Up/1 Down 169 GPRS 1800 1 Up/1 Down 2 Up/1 Down 430 4 Up/1 Down 190 mA 0 1 Up/1 Down 275 2 Up/1 Down 363 4 Up/1 Down mA 10 1 Up/1 Down 133 2 Up/1 Down 190 4 Up/1 Down 213 292 Issue 04 (2016-12-21) 10 257 107 EDGE 900 mA mA 8 1 Up/1 Down 2 Up/1 Down Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 72 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description Test Value Units Electrical and Reliability Features PCL 390 121 EDGE 1800 Configuration 4 Up/1 Down mA 15 1 Up/1 Down 157 2 Up/1 Down 238 4 Up/1 Down 161 mA 2 1 Up/1 Down 225 2 Up/1 Down 295 4 Up/1 Down 108 mA 10 1 Up/1 Down 136 2 Up/1 Down 194 4 Up/1 Down Table 5-11 Averaged DC power consumption of ME909s-120 LGA module (GPRS/EDGE) Description Test Value Units PCL Configuration GPRS 850 307 mA 5 1 Up/1 Down 455 2 Up/1 Down 625 4 Up/1 Down 172 GPRS 900 1 Up/1 Down 2 Up/1 Down 435 4 Up/1 Down 315 mA 5 1 Up/1 Down 445 2 Up/1 Down 615 4 Up/1 Down mA 10 1 Up/1 Down 257 2 Up/1 Down 430 4 Up/1 Down 210 mA 0 1 Up/1 Down 285 2 Up/1 Down 380 4 Up/1 Down 112 Issue 04 (2016-12-21) 10 258 175 GPRS 1800 mA mA 10 1 Up/1 Down Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 73 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description GPRS 1900 Test Value 195 4 Up/1 Down 230 1 Up/1 Down 440 4 Up/1 Down mA 10 1 Up/1 Down 145 2 Up/1 Down 205 4 Up/1 Down 210 mA 8 1 Up/1 Down 295 2 Up/1 Down 387 4 Up/1 Down mA 15 1 Up/1 Down 165 2 Up/1 Down 245 4 Up/1 Down 205 mA 8 1 Up/1 Down 287 2 Up/1 Down 382 4 Up/1 Down mA 15 1 Up/1 Down 165 2 Up/1 Down 245 4 Up/1 Down 170 mA 2 1 Up/1 Down 230 2 Up/1 Down 310 4 Up/1 Down mA 10 1 Up/1 Down 135 2 Up/1 Down 195 4 Up/1 Down 187 mA 2 1 Up/1 Down 248 2 Up/1 Down 335 4 Up/1 Down 114 145 Issue 04 (2016-12-21) 0 2 Up/1 Down 108 EDGE 1900 mA 323 125 EDGE 1800 Configuration 2 Up/1 Down 125 EDGE 900 PCL 145 115 EDGE 850 Units Electrical and Reliability Features mA 10 1 Up/1 Down 2 Up/1 Down Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 74 HUAWEI ME909s Series LTE LGA Module Hardware Guide Description Test Value Electrical and Reliability Features Units PCL 205 Configuration 4 Up/1 Down All power consumption test configuration can be referenced by GSM Association Official Document TS.09: Battery Life Measurement and Current Consumption Technique. LTE test condition: 10/20 MHz bandwidth, QPSK, 1 RB when testing max. Tx power and full RB when testing 0 dBm or 10 dBm. Test condition: For Max. Tx. power, see 4.4.2 Conducted Transmit Power, which are listed in Table 4-5 and Table 4-6 , for Max. data throughput, see 2.2 Function Overview, which are listed in Table 2-1 . 5.5 Reliability Features Table 5-12 lists the test conditions and results of the reliability of the ME909s LGA module. Table 5-12 Test conditions and results of the reliability of the ME909s LGA module Item Stress Test Condition Low-temperature storage High-temperature storage Low-temperature operating High-temperature operating Temperature: –40ºC Operation mode: no power, no package Test duration: 24 h Temperature: 85ºC Operation mode: no power, no package Test duration: 24 h Temperature: –40ºC Operation mode: working with service connected Test duration: 24 h Temperature: 85ºC Operation mode: working with service connected Issue 04 (2016-12-21) Standard Sample size Results JESD22-A1 19-C 3 pcs/group Visual inspection: OK Function test: OK RF specification: OK JESD22-A1 03-C 3 pcs/group Visual inspection: OK Function test: OK RF specification: OK IEC60068-2 -1 3 pcs/group Visual inspection: OK Function test: OK RF specification: OK JESD22-A1 08-C 3 pcs/group Visual inspection: OK Function test: OK RF specification: OK Test duration: 24 h Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 75 HUAWEI ME909s Series LTE LGA Module Hardware Guide Item Temperature cycle operating Damp heat cycling Thermal shock Salty fog test Electrical and Reliability Features Test Condition Standard Sample size Results High temperature: 85ºC JESD22-A1 05-B 3pcs/group Visual inspection: OK Low temperature: –40ºC Operation mode: working with service connected Test duration: 30 cycles;1 h+1 h/cycle High temperature: 55ºC Low temperature: 25ºC Humidity: 95%±3% Operation mode: working with service connected Test duration: 6 cycles; 12 h+12 h/cycle Low temperature: –40ºC High temperature: 85ºC Temperature change interval: < 30s Operation mode: no power Test duration: 100 cycles; 15 min+15 min/cycle Temperature: 35°C Density of the NaCl solution: 5%±1% Operation mode: no power, no package Test duration: Function test: OK RF specification: OK JESD22-A1 01-B 3 pcs/group Visual inspection: OK Function test: OK RF specification: OK JESD22-A1 06-B 3 pcs/group Visual inspection: OK Function test: OK RF specification: OK JESD22-A1 07-B 3 pcs/group Visual inspection: OK Function test: OK RF specification: OK Spraying interval: 8 h Exposing period after removing the salty fog environment: 16 h Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 76 HUAWEI ME909s Series LTE LGA Module Hardware Guide Item Sine vibration Shock test Drop test Life High temperature operating life Test Condition Standard Sample size Results Frequency range: 5 Hz to 200 Hz JESD22-B1 03-B 3 pcs/group Visual inspection: OK Acceleration: 1 Grms Frequency scan rate: 0.5 oct/min Operation mode: working with service connected Test duration: 3 axial directions. 2 h for each axial direction. Half-sine wave shock Peak acceleration: 30 Grms Shock duration: 11 ms Operation mode: working with service connected Test duration: 6 axial directions. 3 shocks for each axial direction. 0.8 m in height. Drop the module on the marble terrace with one surface facing downwards, six surfaces should be tested. Operation mode: no power, no package Temperature: 85ºC Operation mode: working with service connected Issue 04 (2016-12-21) Electrical and Reliability Features Function test: OK RF specification: OK JESD-B104 -C 3 pcs/group Visual inspection: OK Function test: OK RF specification: OK IEC60068-2 -32 3 pcs/group Visual inspection: OK Function test: OK RF specification: OK JESD22-A1 08-B 50 pcs/group Visual inspection: OK Function test: OK RF specification: OK Test duration: 168 h, 336 h, 500 h, 1000 h for inspection point Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 77 HUAWEI ME909s Series LTE LGA Module Hardware Guide Item High temperature & high humidity Temperature cycle-Non operating Electrical and Reliability Features Test Condition Standard Sample size Results High temperature: 85ºC JESD22-A1 10-B 50 pcs/group Visual inspection: OK Humidity: 85% Operation mode: powered on and no working Test duration: 168 h, 336 h, 500 h, 1000 h for inspection point High temperature: 85ºC Low temperature: –40ºC Temperature change slope: 6ºC/min Operation mode: no power Test duration: 168 cycle, Function test: OK RF specification: OK JESD22-A1 04-C 50 pcs/group Visual inspection: OK Function test: OK RF specification: OK 336 cycle, 500 cycle, 668cycle for inspection point ESD HBM (Human Body Model) ESD with DVK (or embedded in the host) 1 kV (Class 1 B) Operation mode: no power Contact Voltage: ±2 kV, ±4 kV Air Voltage: ±2 kV, ±4 kV, ±8 kV Operation mode: working with service connected JESD22-A1 14-D 3 pcs/group Visual inspection: OK Function test: OK RF specification: OK IEC61000-4 -2 2 pcs Visual inspection: OK Function test: OK RF specification: OK Groups ≥ 2 5.6 EMC and ESD Features The following are the EMC design comments: Issue 04 (2016-12-21) Attention should be paid to static control in the manufacture, assembly, packaging, handling and storage process to reduce electrostatic damage to HUAWEI module. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 78 HUAWEI ME909s Series LTE LGA Module Hardware Guide Electrical and Reliability Features RSE (Radiated Spurious Emission) may exceed the limit defined by EN301489 if the antenna port is protected by TVS (Transient Voltage Suppressor), which is resolved by making some adjustment on RF match circuit. TVS should be added on the USB port for ESD protection, and the parasitic capacitance of TVS on D+/D- signal should be less than 2 pF. Common-mode inductor should be added in parallel on D+/D- signal. TVS should be added on the USIM interface for ESD protection. The parasitic capacitance of TVS on USIM signal should be less than 10 pF; Resistors in parallel and a 10nF capacitance should be added on RESIN_N and POWER_ON_OFF signal to avoid shaking, and the distance between the capacitor and the related pins should be less than 100 mil. A TVS should be added to the module power supply. It is recommended that the TVS's Clamping Voltage (VCL) be smaller than 12 V and Peak Pulse Power (PPP) at least 100 W. PCB routing should be V-type rather than T-type for TVS (Transient Voltage Suppressor). An integrated ground plane is necessary for EMC design. The following are the requirements of ESD environment control: The electrostatic discharge protected area (EPA) must have an ESD floor whose surface resistance and system resistance are greater than 1 x 10 4 Ω while less than 1 x 109 Ω. The EPA must have a sound ground system without loose ground wires, and the ground resistance must be less than 4 Ω. The workbench for handling ESD sensitive components must be equipped with common ground points, the wrist strap jack, and ESD pad. The resistance between the jack and common ground point must be less than 4 Ω. The surface resistance and system resistance of the ESD pad must be less than 1 x 10 9 Ω. The EPA must use the ESD two-circuit wrist strap, and the wrist strap must be connected to the dedicated jack. The crocodile clip must not be connected to the ground. The ESD sensitive components, the processing equipment, test equipment, tools, and devices must be connected to the ground properly. The indexes are as follows: − Hard ground resistance < 4 Ω − 1 x 105 Ω ≤ Soft ground resistance < 1 x 109 Ω − 1 x 105 Ω ≤ ICT fixture soft ground resistance < 1 x 1011 Ω − The electronic screwdriver and electronic soldering iron can be easily oxidized. Their ground resistance must be less than 20 Ω. The parts of the equipment, devices, and tools that touch the ESD sensitive components and moving parts that are close to the ESD sensitive components must be made of ESD materials and have sound ground connection. The parts that are not made of ESD materials must be handled with ESD treatment, such as painting the ESD coating or ionization treatment (check that the friction voltage is less than 100 V). Key parts in the production equipment (parts that touch the ESD sensitive components or parts that are within 30 cm away from the ESD sensitive components), including the conveyor belt, conveyor chain, guide wheel, and SMT nozzle, must all be made of ESD materials and be connected to the ground properly (check that the friction voltage is less than 100 V). Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 79 HUAWEI ME909s Series LTE LGA Module Hardware Guide Electrical and Reliability Features Engineers that touch IC chips, boards, modules, and other ESD sensitive components and assemblies must wear ESD wrist straps, ESD gloves, or ESD finger cots properly. Engineers that sit when handling the components must all wear ESD wrist straps. Noticeable ESD warning signs must be attached to the packages and placement areas of ESD sensitive components and assemblies. Boards and IC chips must not be stacked randomly or be placed with other ESD components. Effective shielding measures must be taken on the ESD sensitive materials that are transported or stored outside the EPA. HUAWEI ME909s LGA module does not include any protection against overvoltage. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 80 HUAWEI ME909s Series LTE LGA Module Hardware Guide 6 Mechanical Specifications Mechanical Specifications 6.1 About This Chapter This chapter describes the process design and mechanical specifications: Storage Requirement Moisture Sensitivity Dimensions Packaging Customer PCB Design Thermal Design Solution Assembly Processes Specification of Rework 6.2 Storage Requirement The module must be stored and sealed properly in vacuum package under a temperature below 40°C and the relative humidity less than 90% in order to ensure the weldability within 12 months. 6.3 Moisture Sensitivity The moisture sensitivity is level 3. After unpacking, the module must be assembled within 168 hours under the environmental conditions that the temperature is lower than 30°C and the relative humidity is less than 60%. If the preceding conditions cannot be met, the module needs to be baked according to the parameters specified in Table 6-1 . Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 81 HUAWEI ME909s Series LTE LGA Module Hardware Guide Mechanical Specifications Table 6-1 Baking parameters Baking Temperature Baking Condition Baking Duration Remarks 125°C±5°C Relative humidity ≤ 60% 8 hours - Moving, storing, and processing the product must comply with IPC/JEDEC J-STD-033. 6.4 Dimensions Figure 6-1 shows the dimensions in details. Figure 6-1 Dimensions (Unit: mm) 6.5 Packaging HUAWEI LGA module uses five layers ESD pallet, anti-vibration foam and vacuum packing into cartons. The tray specification complies with Jedec_Tray_DGuide4-10D. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 82 HUAWEI ME909s Series LTE LGA Module Hardware Guide Mechanical Specifications Figure 6-2 ESD pallet (Unit: mm) Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 83 HUAWEI ME909s Series LTE LGA Module Hardware Guide Mechanical Specifications Figure 6-3 The packaging Module quantity per tray: 4 x 9 = 36 pcs/tray Use vacuum packages; five trays per carton; module quantity per carton: 5 x 36 = 180 pcs/carton. 8 middle cartons per large carton; Module quantity per large carton: 180 x 8 = 1440 pcs/carton. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 84 HUAWEI ME909s Series LTE LGA Module Hardware Guide Mechanical Specifications 6.6 Customer PCB Design 6.6.1 PCB Surface Finish The PCB surface finish recommended is Electroless Nickel, immersion Gold (ENIG). Organic Solderability Preservative (OSP) may also be used, ENIG preferred. 6.6.2 PCB Pad Design To achieve assembly yields and solder joints of high reliability, it is recommended that the PCB pad size be designed as follows: Figure 6-4 ME909s LGA module Footprint design (Unit: mm) 6.6.3 Solder Mask NSMD is recommended. In addition, the solder mask of the NSMD (Non-solder Mask Defined) pad design is larger than the pad so the reliability of the solder joint can be improved. The solder mask must be 100 µm–150 µm larger than the pad, that is, the single side of the solder mask must be 50 µm–75 µm larger than the pad. The specific size depends on the processing capability of the PCB manufacturer. 6.6.4 Requirements on PCB Layout Issue 04 (2016-12-21) To reduce deformation, a thickness of at least 1.0 mm is recommended. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 85 HUAWEI ME909s Series LTE LGA Module Hardware Guide Mechanical Specifications Other devices must be located more than 3 mm (5 mm recommended) away from the two parallel sides of the LGA module (rework requirement), and other sides with 0.6 mm. The minimum distance between the LGA module and the PCB edge is 0.3 mm. When the PCB layout is double sided, the module must be placed on the second side for assembly; so as to avoid module dropped from PCB or component (located in module) re-melding defects caused by uneven weight. Figure 6-5 PCB Layout (Unit: mm) 6.7 Thermal Design Solution When the module works in the maximum power condition, the module has high power consumption (for details, see Power Consumption). To improve the module reliability and stability, focus on the thermal design of the device to speed up heat dissipation. For thermal characteristics of the ME909s LGA module, you can refer to Operating and Storage Temperatures. Take the following heat dissipation measures: The copper size on the PCB should be 70 mm x 70 mm or larger. All copper ground layers of the PCB must be connected to each other through via-holes. Increase the quantity of the PCB ground planes. The ground planes should be as continuous as possible. If a fan is deployed, place the module at the cold air inlet. Use heat sink, thermal conductive material and product enclosure to enhance the heat dissipation of the module. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 86 HUAWEI ME909s Series LTE LGA Module Hardware Guide Mechanical Specifications − Use anodized heat sink on the shielding case or the customer PCB on bottom side for optimal heat dissipation. The recommended heat sink dimensions are 70 mm x 70 mm x1 mm or larger. − The material of the heat sink should adopt the higher thermal conductivity metallic materials, e.g. Al or Cu. − The recommended thermal conductivity of the thermal conductive material is 1.0 W/m-k or higher (recommended manufacturers: Laird or Bergquist). − Conductive material should obey the following rule: after the heat sink is fastened to the shielding case, the compression amount of the thermal conductive material accounts for 15% to 30% of the thermal conductive material size. − Conductive material should be as thin as possible. − The recommended material of the enclosure is metallic materials, especially you can add pin fin on the enclosure surface. − If the heat sink is installed above the shielding case, you should attach the thermal conductive material between the shielding case and the heat sink; if the heat sink is installed below the bottom side of the customer PCB, you should attach the thermal conductive material between the customer PCB and the heat sink, as shown in Figure 6-6 and Figure 6-7 . Preferably, we recommend the heat sink be installed below the bottom side of the customer PCB. − Use more pin fins to enlarge heat dissipation area. Figure 6-6 Adding heat sink to the module for optimal heat dissipation Shielding case Module PCB Heat sink Conductive material Customer PCB Shielding case Module PCB Customer PCB Conductive material Heat sink Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 87 HUAWEI ME909s Series LTE LGA Module Hardware Guide Mechanical Specifications Figure 6-7 Adding enclosure to enhance the heat dissipation of the module Shielding case Module PCB Enclosure Conductive material Heat sink Customer PCB Shielding case Heat sink Conductive material Customer PCB Enclosure Module PCB 6.8 Assembly Processes 6.8.1 General Description of Assembly Processes Tray modules are required at SMT lines, because LGA modules are placed on ESD pallets. Reflow ovens with at least seven temperature zones are recommended. Use reflow ovens or rework stations for soldering, because LGA modules have large solder pads and cannot be soldered manually. 6.8.2 Stencil Design It is recommended that the stencil for the LGA module be 0.15 mm in thickness. For the stencil design, see the following figure: Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 88 HUAWEI ME909s Series LTE LGA Module Hardware Guide Mechanical Specifications Figure 6-8 Recommended stencil design of LGA module (Unit: mm) The stencil design has been qualified for HUAWEI motherboard assembly, customers can adjust the parameters by their motherboard design and process situation to assure LGA soldering quality and no defect. 6.8.3 Reflow Profile The LGA module must be reflowed on the top side of the customer's development board. For the soldering temperature of the LGA module, see the following figure. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 89 HUAWEI ME909s Series LTE LGA Module Hardware Guide Mechanical Specifications Figure 6-9 Reflow profile °C 300 235°C217°C) (t3–t4): 45s–80s Peak reflow temperature: 235°C–245°C Cooling zone Cooling rate: 2°C/s ≤ Slope ≤ 5°C/s 6.9 Specification of Rework 6.9.1 Process of Rework Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 90 HUAWEI ME909s Series LTE LGA Module Hardware Guide Mechanical Specifications 6.9.2 Preparations of Rework Remove barrier or devices that can’t stand high temperature before rework. If the device to be reworked is beyond the storage period, bake the device according to Table 6-1 . 6.9.3 Removing of the Module The solder is molten and reflowed through heating during the module removing process. The heating rate must be quick but controllable in order to melt all the solder joints simultaneously. Pay attention to protect the module, PCB, neighboring devices, and their solder joints against heating or mechanical damages. The LGA module has many solder pads and the pads are large. Therefore, common soldering irons and heat guns cannot be used in the rework. Rework must be done using either infrared heating rework stations or hot air rework stations. Infrared heating rework stations are preferred, because they can heat components without touching them. In addition, infrared heating rework stations produce less solder debris and less impact on modules, while hot air rework stations may cause shift of other components not to be reworked. You must not reuse the module after disassembly from PCB during rework. It is proposed that a special clamp is used to remove the module. Figure 6-10 Equipment used for rework Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 91 HUAWEI ME909s Series LTE LGA Module Hardware Guide Mechanical Specifications 6.9.4 Welding Area Treatment Step 1 Remove the old solder by using a soldering iron and solder braid that can wet the solder. Step 2 Clean the pad and remove the flux residuals. Step 3 Solder pre-filling: Before the module is installed on a board, apply some solder paste to the pad of the module by using the rework fixture and stencil or apply some solder paste to the pad on the PCB by using a rework stencil. It is recommended that a fixture and a mini-stencil be made to apply the solder paste in the rework. 6.9.5 Module Installation Install the module precisely on the motherboard and ensure the right installation direction of the module and the reliability of the electrical connection with the PCB. It is recommended that the module be preheated in order to ensure that the temperature of all parts to be soldered is uniform during the reflow process. The solder quickly reflows upon heating so the parts are soldered reliably. The solder joints undergo proper reflow duration at a preset temperature to form a favorable Inter-metallic Compound (IMC). It is recommended that a special clamp be used to pick the module when the module is installed on the pad after applied with some solder. A special rework device must be used for the rework. 6.9.6 Specifications of Rework Temperature parameter of rework: for either the removing or welding of the module, the heating rate during the rework must be equal to or smaller than 3°C/s, and the peak temperature between 240°C–250°C. The following parameters are recommended during the rework. Figure 6-11 Temperature graph of rework Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 92 HUAWEI ME909s Series LTE LGA Module Hardware Guide Certifications 7 Certifications 7.1 About This Chapter This chapter gives a general description of certifications of the ME909s LGA module. 7.2 Certifications Figure 7-1 shows certifications the ME909s LGA module have been implemented. For more demands, please contact us for more details about this information. Figure 7-1 Product Certifications of ME909s LGA module Certification Model name ME909s -821 ME909s -120 CE - √ RoHS √ √ CCC √ - GCF - √ WEEE √ √ Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 93 HUAWEI ME909s Series LTE LGA Module Hardware Guide 8 Safety Information Safety Information 8.1 About This Chapter Read the safety information carefully to ensure the correct and safe use of your wireless device. Applicable safety information must be observed. Interference Medical Device Area with Inflammables and Explosives Traffic Security Airline Security Safety of Children Environment Protection WEEE Approval RoHS Approval Laws and Regulations Observance Care and Maintenance Emergency Call Regulatory Information 8.2 Interference Power off your wireless device if using the device is prohibited. Do not use the wireless device when it causes danger or interference with electric devices. 8.3 Medical Device Power off your wireless device and follow the rules and regulations set forth by the hospitals and health care facilities. Some wireless devices may affect the performance of the hearing aids. For any such problems, consult your service provider. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 94 HUAWEI ME909s Series LTE LGA Module Hardware Guide Safety Information Pacemaker manufacturers recommend that a minimum distance of 15 cm be maintained between the wireless device and a pacemaker to prevent potential interference with the pacemaker. If you are using an electronic medical device, consult the doctor or device manufacturer to confirm whether the radio wave affects the operation of this device. 8.4 Area with Inflammables and Explosives To prevent explosions and fires in areas that are stored with inflammable and explosive devices, power off your wireless device and observe the rules. Areas stored with inflammables and explosives include but are not limited to the following: Gas station Fuel depot (such as the bunk below the deck of a ship) Container/Vehicle for storing or transporting fuels or chemical products Area where the air contains chemical substances and particles (such as granule, dust, or metal powder) Area indicated with the "Explosives" sign Area indicated with the "Power off bi-direction wireless equipment" sign Area where you are generally suggested to stop the engine of a vehicle 8.5 Traffic Security Observe local laws and regulations while using the wireless device. To prevent accidents, do not use your wireless device while driving. RF signals may affect electronic systems of motor vehicles. For more information, consult the vehicle manufacturer. In a motor vehicle, do not place the wireless device over the air bag or in the air bag deployment area. Otherwise, the wireless device may hurt you owing to the strong force when the air bag inflates. 8.6 Airline Security Observe the rules and regulations of airline companies. When boarding or approaching a plane, power off your wireless device. Otherwise, the radio signal of the wireless device may interfere with the plane control signals. 8.7 Safety of Children Do not allow children to use the wireless device without guidance. Small and sharp components of the wireless device may cause danger to children or cause suffocation if children swallow the components. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 95 HUAWEI ME909s Series LTE LGA Module Hardware Guide Safety Information 8.8 Environment Protection Observe the local regulations regarding the disposal of your packaging materials, used wireless device and accessories, and promote their recycling. 8.9 WEEE Approval The wireless device is in compliance with the essential requirements and other relevant provisions of the Waste Electrical and Electronic Equipment Directive 2012/19/EU (WEEE Directive). 8.10 RoHS Approval The wireless device is in compliance with the restriction of the use of certain hazardous substances in electrical and electronic equipment Directive 2011/65/EU (RoHS Directive). 8.11 Laws and Regulations Observance Observe laws and regulations when using your wireless device. Respect the privacy and legal rights of the others. 8.12 Care and Maintenance It is normal that your wireless device gets hot when you use or charge it. Before you clean or maintain the wireless device, stop all applications and power off the wireless device. Use your wireless device and accessories with care and in clean environment. Keep the wireless device from a fire or a lit cigarette. Protect your wireless device and accessories from water and vapour and keep them dry. Do not drop, throw or bend your wireless device. Clean your wireless device with a piece of damp and soft antistatic cloth. Do not use any chemical agents (such as alcohol and benzene), chemical detergent, or powder to clean it. Do not leave your wireless device and accessories in a place with a considerably low or high temperature. Use only accessories of the wireless device approved by the manufacture. Contact the authorized service center for any abnormity of the wireless device or accessories. Do not dismantle the wireless device or accessories. Otherwise, the wireless device and accessories are not covered by the warranty. The device should be installed and operated with a minimum distance of 20 cm between the radiator and your body. Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 96 HUAWEI ME909s Series LTE LGA Module Hardware Guide Safety Information 8.13 Emergency Call This wireless device functions through receiving and transmitting radio signals. Therefore, the connection cannot be guaranteed in all conditions. In an emergency, you should not rely solely on the wireless device for essential communications. 8.14 Regulatory Information The following approvals and notices apply in specific regions as noted. 8.14.1 CE Approval (European Union) The wireless device is approved to be used in the member states of the EU. The wireless device is in compliance with the essential requirements and other relevant provisions of the Radio and Telecommunications Terminal Equipment Directive 1999/5/EC (R&TTE Directive). Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 97 HUAWEI ME909s Series LTE LGA Module Hardware Guide Appendix A Circuit of Typical Interface HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide 9 Appendix A Circuit of Typical Interface Appendix A Circuit of Typical Interface J301 33pF 0Ω L313 L310 These are impedance matching circuit, the specific capacitance and inductance value needs to be adjusted, based on the characteristic impedance of the practical PCB. 33pF **33n WL629D3_T01_TR_A D310 C371 22pF 22pF SMA6251A1_060_20GHT50GH_50 **33n 4 5 C365 2 34 5 R344 3 C370 1uF C379 C362 100nF 2 C361 33pF SMF05CTC 1 6 C360 33pF J302 1 1P1 P44 2P2 P55 3P3 P66 0Ω 0Ω C363 0Ω R341 R342 R343 J303 C372 22pF L311 22pF L314 C366 1 2345 **33n **33n SMA6251A1_060_20GHT50GH_50 LGA120H-3030A 94 95 Issue 04 (2016-12-21) C321 RESERVED RESERVED VCC_EXT1 RESERVED R330 4 5V-P-3 1 R331 2 30K 5 7 EN 2 1 1uF C322 4.7uF 100nF ILIM GND1 2.2uF C318 22uF C316 C319 75K 22uF C317 C310 R325 22pF 100nF 180K 1uF R327 0 20K C313 47K R326 C307 C308 R324 100nF 100nF C306 22uF C305 1 150uF 2 LX1 GND1 SHDN/RT 220pF VCC_EXT1 33pF WAKEUP_IN_TO_MODULE **10K 3C R138 WAKEUP_IN_FROM_HOST B1 R117 **2.2K **NPN-BEC Q109 BC847ALT1 E2 1 2 RV303 1 2 1 2 **220uF C352 11 71 32 31 92 OUT FAULT VCC_EXT1 33 35 WAKEUP_IN_TO_MODULE WAKEUP_IN WAKEUP_OUT IN L320 12 13 1 RESERVED RESERVED U304 HPA00615DRVR **10K C320 C354 C353 RV302 **6.8pF RV301 **6.8pF C304 C303 1 150uF 2 COMP 85 86 84 220uF C351 NC NC NC NC VBAT VBAT 2 NC NC SD_VCC Issue 06 (2015-11-30) LX2 FB 3 2 4 1 220uF C354 41 40 39 38 PGND PVDD2 LED_MODE RESERVED 3 L303 PVDD1 VDD 220uF C350 82 83 USB_DM USB_DP NC 6 1MEG U301 RT8015AGQW 80 75 73 79 77 74 78 76 1 91 RESERVED RESERVED RESERVED RESERVED 62 63 64 65 2 0.47K 101 RESERVED RESERVED RESERVED RESERVED RESERVED 0 R328 220uF C355 R340 RESERVED RESERVED NC NC RESERVED RESERVED RESERVED RESERVED RESERVED UART0_CTS UART0_DCD UART0_DSR UART0_DTR UART0_RING UART0_RTS UART0_RX UART0_TX C357 **2.2pF GND2 USIM_CLK USIM_DATA USIM_DET USIM_RESET USIM_VCC 90 89 70 88 34 C356 D311 18 19 20 21 22 JTAG_RTCK JTAG_TCK JTAG_TDI JTAG_TDO JTAG_TMS JTAG_TRST_N 0 0 C353 and C354 are ready for dealing with filter fferentia di l mode interference and C357 is ready for dealing with filter common mode interference. You can choose the value of the C353, C354 and C357 according to the actual PCB which is integrated 30mm×30mmALG Module. 68 9 10 66 100nF 23 24 25 26 27 LGA120H-3030A VBAT Note: Pin 49, pin 53 and pin 57 do not have pad in ME909s module. RESERVED RESERVED USIM_CLK USIM_DATA USIM_DET USIM_RESET USIM_VCC 67 69 C357 93 42 87 72 30 36 SD_CLK SD_CMD SD_DATA0 SD_DATA1 SD_DATA2 SD_DATA3 10uF 60 61 ME909s_MISC SLEEP_STATUS C302 43 44 45 46 51 55 105 109 113 RESERVED RESERVED RESERVED UART2_TX UART2_RX GPIO1 RESERVED RESERVED GPIO2 GPIO3 GPIO4/USIM Switch GPIO5 GPIO6 GPIO7/Jamming Detection 1 Test point128 Test point229 1 ME909s_MISC 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND 117 118 119 120 150uF 2 U302 5 8 6 7 150uF 2 15 GND NOT used GND GND NOT used GND GND NOT used GND GND GND GND GND GND GND GND GND GND GND GND NC NC NC NC R301 R302 99 98 C358 17 16 14 48 49 50 52 53 54 56 57 58 59 106 108 110 112 114 116 121 122 123 124 U302 ADC_1 ADC_2 PCM_SYNC PCM_CLK PCM_DIN PCM_DOUT 96 97 33pF e RESERVED RESERVED C301 102 104 b RESERVED RESERVED POWER_ON_OFF RESERVED NC RESERVED RESIN_N 1 C358 MAIN_ANT AUX_ANT NC 150uF 2 c 1K R345 81 103 47 37 100 C123 107 115 111 Note:"**" means that this component is not welded, but need to reserve component solder pad. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 81 98 HUAWEI ME909s Series LTE LGA Module Hardware Guide 10 Appendix B Acronyms and Abbreviations Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion 3GPP Third Generation Partnership Project 8PSK 8 Phase Shift Keying AP Access Point AUX Auxiliary BER Bit Error Rate BIOS Basic Input Output System CCC China Compulsory Certification CE European Conformity CMOS Complementary Metal Oxide Semiconductor CSD Circuit Switched Data DC Direct Current DCE Data Communication Equipment DL Down Link DMA Direct Memory Access DTE Data Terminal Equipment EDGE Enhanced Data Rate for GSM Evolution EIA Electronic Industries Association EMC Electromagnetic Compatibility ESD Electrostatic Discharge EU European Union Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 99 HUAWEI ME909s Series LTE LGA Module Hardware Guide Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion FCC Federal Communications Commission GMSK Gaussian Minimum Shift Keying GPIO General-purpose I/O GPRS General Packet Radio Service GSM Global System for Mobile Communication HBM Human Body Model HSDPA High-Speed Downlink Packet Access HSPA Enhanced High Speed Packet Access HSUPA High Speed Up-link Packet Access IMC Inter-metallic Compound ISO International Standards Organization JTAG Joint Test Action Group LED Light-Emitting Diode LGA Land Grid Array MO Mobile Originated MT Mobile Terminated NC Not Connected NSMD Non-solder Mask Defined PCB Printed Circuit Board PCM Pulse Code Modulation PDU Protocol Data Unit PMU Power Management Unit PID Product Identity RF Radio Frequency RoHS Restriction of the Use of Certain Hazardous Substances SMS Short Message Service TIS Total Isotropic Sensitivity TVS Transient Voltage Suppressor UART Universal Asynchronous Receiver-Transmitter UL Up Link Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 100 HUAWEI ME909s Series LTE LGA Module Hardware Guide Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion UMTS Universal Mobile Telecommunications System USB Universal Serial Bus USIM Universal Subscriber Identity Module VIP Vendor Identity VSWR Voltage Standing Wave Ratio WEEE Waste Electrical and Electronic Equipment WCDMA Wideband Code Division Multiple Access WWAN Wireless Wide Area Network LTE Long Term Evolution Issue 04 (2016-12-21) Huawei Proprietary and Confidential Copyright © Huawei Technologies Co., Ltd. 101
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