Huawei MU709 Series HSPA LGA Module Hardware Guide (V100R001 09, English)
2018-05-24
User Manual: Huawei
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Page Count: 86
- Revision History
- Scope
- 1 Introduction
- 2 Overall Description
- 3 Description of the Application Interfaces
- 3.1 About This Chapter
- 3.2 LGA Interface
- 3.3 Power Interface
- 3.4 Signal Control Interface
- 3.5 UART Interface
- 3.6 USB Interface
- 3.7 USIM Card Interface
- 3.8 Audio Interface
- 3.9 General Purpose I/O Interface
- 3.10 JTAG Interface
- 3.11 RF Antenna Interface
- Table 3-14 Definition of the antenna pads
- Figure 3-19 RF signal trace design about MAIN_ANT for reference (the same for AUX_ANT)
- Figure 3-20 RF signal layout design about MAIN_ANT for reference (the same for AUX_ANT)
- Figure 3-21 Complete structure of the microstrip
- Figure 3-22 Complete structure of the stripline
- Figure 3-23 Pad for the RF interface
- Figure 3-24 RF Pad design for MU709
- 3.12 Reserved Interface
- 3.13 NC Interface
- 3.14 Test Points Design
- 4 RF Specifications
- 5 Electrical and Reliability Features
- 5.1 About This Chapter
- 5.2 Absolute Ratings
- 5.3 Operating and Storage Temperatures and Humidity
- 5.4 Power Supply Features
- 5.4.1 Input Power Supply
- 5.4.2 Power Consumption
- Table 5-5 Averaged power off DC power consumption
- Table 5-6 Averaged standby DC power consumption
- Table 5-7 Averaged Data Transmission DC power consumption of MU709s-2 (HSPA/WCDMA)
- Table 5-8 Averaged Data Transmission DC power consumption of MU709s-6 (HSPA/WCDMA)
- Table 5-9 Averaged DC power consumption of MU709 module (GPRS/EDGE)
- 5.5 Reliability Features
- 5.6 EMC and ESD Features
- 6 Mechanical Specifications
- 6.1 About This Chapter
- 6.2 Storage Requirement
- 6.3 Moisture Sensitivity
- 6.4 Dimensions and Interfaces
- 6.5 Packaging
- 6.6 Customer PCB Design
- 6.7 Thermal Design Solution
- 6.8 Assembly Processes
- 6.9 Rework
- 6.9.1 Process of Rework
- 6.9.2 Preparations of Rework
- 6.9.3 Removing of the Module
- 6.9.4 Welding Area Treatment
- Step 1 Remove the old solder by using a soldering iron and solder braid that can wet the solder.
- Step 2 Clean the pad and remove the flux residuals.
- Step 3 Solder pre-filling: Before the module is installed on a board, apply some solder paste to the pad of the module by using the rework fixture and stencil or apply some solder paste to the pad on the PCB by using a rework stencil.
- 6.9.5 Module Installation
- 6.9.6 Specifications of Rework
- 7 Certifications
- 8 Safety Information
- 8.1 Interference
- 8.2 Medical Device
- 8.3 Area with Inflammables and Explosives
- 8.4 Traffic Security
- 8.5 Airline Security
- 8.6 Safety of Children
- 8.7 Environment Protection
- 8.8 WEEE Approval
- 8.9 RoHS Approval
- 8.10 Laws and Regulations Observance
- 8.11 Care and Maintenance
- 8.12 Emergency Call
- 8.13 Regulatory Information
- 9 Appendix A Circuit of Typical Interface
- 10 Appendix B Acronyms and Abbreviations