Huawei MU709 Series HSPA LGA Module Hardware Guide (V100R001 09, English)

2018-05-24

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HUAWEI MU709 Series HSPA+ LGA Module

Hardware Guide

Issue

Date

2017-12-15

Copyright © Huawei Technologies Co., Ltd. 2017. All rights reserved.
No part of this manual may be reproduced or transmitted in any form or by any means without prior written
consent of Huawei Technologies Co., Ltd. and its affiliates ("Huawei").
The product described in this manual may include copyrighted software of Huawei and possible licensors.
Customers shall not in any manner reproduce, distribute, modify, decompile, disassemble, decrypt, extract,
reverse engineer, lease, assign, or sublicense the said software, unless such restrictions are prohibited by
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,
, and
are trademarks or registered trademarks of Huawei Technologies Co., Ltd.
Other trademarks, product, service and company names mentioned may be the property of their respective
owners.

Notice
Some features of the product and its accessories described herein rely on the software installed, capacities
and settings of local network, and therefore may not be activated or may be limited by local network operators
or network service providers.
Thus, the descriptions herein may not exactly match the product or its accessories which you purchase.
Huawei reserves the right to change or modify any information or specifications contained in this manual
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HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide

About This Document

About This Document
Revision History
Document
Version

Date

2014-07-16

2014-09-11

Chapter

Descriptions
Creation

All

Deleted the Description of RESIN_N pin.

3.4.3

Updated Section 3.4.3: Reset the Module.

2014-09-18

3.4.3

Updated Section 3.4.3: Reset the Module.

2015-02-05

All

Added the Description of MU709s-6 Module.

2015-05-20

3.3.2

Updated Section 3.3.2: Power Supply VBAT
Interface.

2015-11-30

3.2

Updated the description of PS_HOLD signal
in Table 3-1.

3.3.2

Updated Section 3.3.2: Power Supply VBAT
Interface.

3.14

Added the description of PS_HOLD signal in
Section 3.14 Test Points Design.

3.5

Updated Section 3.5: UART Interface

6.5

Updated Section: 6.5 Packaging

Updated Table 2-1 Features

3.7.1

Updated Table 3-10 USIM card interface
signals

3.7.2

Updated Figure 3-15 Circuit of the USIM
card interface

3.7.2

Updated Figure 3-16 Connections of the
USIM_DET pin

5.6

Updated EMC and ESD Features

6.4

Updated Dimensions (Unit: mm)

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2016-09-07

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Hardware Guide

Document
Version

Date

2017-06-28

2017-12-15

About This Document

Chapter

Descriptions

6.5

Updated Packaging

6.6.2

Updated Figure 6-4 LGA module Footprint
design (Unit: mm)

6.8.2

Updated Stencil Design

6.9.3

Updated Equipment used for rework

8.13.1

Updated section 8.13.1 EU Regulatory
Conformance


Deleted Privacy Policy



Added Software Update

Scope
MU709s-2
MU709s-6

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Contents

Contents
1 Introduction.................................................................................................................................... 8
2 Overall Description ...................................................................................................................... 9
2.1 About This Chapter........................................................................................................................... 9
2.2 Function Overview............................................................................................................................ 9
2.3 Circuit Block Diagram ..................................................................................................................... 10
2.4 Application Block Diagram ............................................................................................................. 12

3 Description of the Application Interfaces .............................................................................. 13
3.1 About This Chapter ......................................................................................................................... 13
3.2 LGA Interface ................................................................................................................................. 13
3.3 Power Interface .............................................................................................................................. 23
3.3.1 Overview ................................................................................................................................ 23
3.3.2 Power Supply VBAT Interface ............................................................................................... 24
3.3.3 Output Power Supply Interface ............................................................................................. 25
3.4 Signal Control Interface .................................................................................................................. 25
3.4.1 Overview ................................................................................................................................ 25
3.4.2 Power-on/off Pin .................................................................................................................... 26
3.4.3 RESIN_N ............................................................................................................................... 28
3.4.4 WAKEUP_IN Signal............................................................................................................... 29
3.4.5 WAKEUP_OUT Signal........................................................................................................... 30
3.4.6 SLEEP_STATUS Signal ........................................................................................................ 30
3.4.7 LED_MODE Signal ................................................................................................................ 31
3.5 UART Interface ............................................................................................................................... 32
3.5.1 Overview ................................................................................................................................ 32
3.5.2 Circuit Recommended for the UART Interface ...................................................................... 33
3.6 USB Interface ................................................................................................................................. 34
3.7 USIM Card Interface ...................................................................................................................... 35
3.7.1 Overview ................................................................................................................................ 35
3.7.2 Circuit Recommended for the USIM Card Interface .............................................................. 36
3.8 Audio Interface ............................................................................................................................... 38
3.9 General Purpose I/O Interface ....................................................................................................... 40
3.10 JTAG Interface ............................................................................................................................. 41
3.11 RF Antenna Interface.................................................................................................................... 41

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3.12 Reserved Interface ....................................................................................................................... 44
3.13 NC Interface ................................................................................................................................. 44
3.14 Test Points Design ........................................................................................................................ 45

4 RF Specifications ......................................................................................................................... 46
4.1 About This Chapter ......................................................................................................................... 46
4.2 Operating Frequencies ................................................................................................................... 46
4.3 Conducted RF Measurement ......................................................................................................... 47
4.3.1 Test Environment ................................................................................................................... 47
4.3.2 Test Standards ....................................................................................................................... 47
4.4 Conducted Rx Sensitivity and Tx Power ........................................................................................ 47
4.4.1 Conducted Receive Sensitivity .............................................................................................. 47
4.4.2 Conducted Transmit Power ................................................................................................... 48
4.5 Antenna Design Requirements ...................................................................................................... 49
4.5.1 Antenna Design Indicators..................................................................................................... 49
4.5.2 Interference ........................................................................................................................... 52
4.5.3 Antenna Requirements .......................................................................................................... 52

5 Electrical and Reliability Features ........................................................................................... 54
5.1 About This Chapter ......................................................................................................................... 54
5.2 Absolute Ratings ............................................................................................................................ 54
5.3 Operating and Storage Temperatures and Humidity ...................................................................... 54
5.4 Power Supply Features .................................................................................................................. 55
5.4.1 Input Power Supply ............................................................................................................... 55
5.4.2 Power Consumption .............................................................................................................. 56
5.5 Reliability Features ......................................................................................................................... 60
5.6 EMC and ESD Features ................................................................................................................. 63

6 Mechanical Specifications ......................................................................................................... 65
6.1 About This Chapter ......................................................................................................................... 65
6.2 Storage Requirement ..................................................................................................................... 65
6.3 Moisture Sensitivity ........................................................................................................................ 65
6.4 Dimensions and Interfaces ............................................................................................................. 66
6.5 Packaging ....................................................................................................................................... 66
6.6 Customer PCB Design ................................................................................................................... 68
6.6.1 PCB Surface Finish ............................................................................................................... 68
6.6.2 PCB Pad Design .................................................................................................................... 69
6.6.3 Solder Mask ........................................................................................................................... 69
6.6.4 Requirements on PCB Layout ............................................................................................... 69
6.7 Thermal Design Solution ................................................................................................................ 70
6.8 Assembly Processes ...................................................................................................................... 72
6.8.1 Overview ................................................................................................................................ 72
6.8.2 Stencil Design ........................................................................................................................ 72
6.8.3 Reflow Profile ........................................................................................................................ 72

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6.9 Rework ........................................................................................................................................... 74
6.9.1 Process of Rework ................................................................................................................ 74
6.9.2 Preparations of Rework ......................................................................................................... 74
6.9.3 Removing of the Module........................................................................................................ 74
6.9.4 Welding Area Treatment ........................................................................................................ 75
6.9.5 Module Installation ................................................................................................................. 75
6.9.6 Specifications of Rework ....................................................................................................... 75

7 Certifications ................................................................................................................................ 77
7.1 About This Chapter ......................................................................................................................... 77
7.2 Certifications ................................................................................................................................... 77

8 Safety Information ...................................................................................................................... 78
8.1 Interference .................................................................................................................................... 78
8.2 Medical Device ............................................................................................................................... 78
8.3 Area with Inflammables and Explosives ......................................................................................... 78
8.4 Traffic Security................................................................................................................................ 79
8.5 Airline Security................................................................................................................................ 79
8.6 Safety of Children ........................................................................................................................... 79
8.7 Environment Protection .................................................................................................................. 79
8.8 WEEE Approval .............................................................................................................................. 79
8.9 RoHS Approval ............................................................................................................................... 79
8.10 Laws and Regulations Observance ............................................................................................. 80
8.11 Care and Maintenance ................................................................................................................. 80
8.12 Emergency Call ............................................................................................................................ 80
8.13 Regulatory Information ................................................................................................................. 80
8.13.1 EU Regulatory Conformance .............................................................................................. 80
8.13.2 FCC Statement .................................................................................................................... 81

9 Appendix A Circuit of Typical Interface ................................................................................ 82
10 Appendix B Acronyms and Abbreviations .......................................................................... 83

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Introduction

This document describes the hardware application interfaces and air interfaces
provided by HUAWEI MU709 series (MU709s-2 and MU709s-6) HSPA+ LGA module
(hereinafter referred to as the MU709 module).
This document helps hardware engineer to understand the interface specifications,
electrical features and related product information of the MU709 module.

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Overall Description

2.1 About This Chapter
This chapter gives a general description of the MU709 module and provides:


Function Overview



Circuit Block Diagram



Application Block Diagram

2.2 Function Overview
Table 2-1 Features
Feature

Description

Physical
Dimensions



Dimensions (L × W × H): 30 mm × 30 mm × 2.27 mm



Weight: about 5 g

Operating
Bands

MU709s-2:


WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 8



GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz

MU709s-6:


WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 2, Band 5



GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz

Operating
Temperature

Normal operating temperature: –20°C to +70°C

Storage
Temperature

–40°C to +85°C

Humidity

RH5% to RH95%

Power
Voltage

DC 3.3 V to 4.2 V (typical value is 3.8 V)

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Extended operating temperature[1]: –40°C to +85°C

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Overall Description

Feature

Description

AT
Commands

See the HUAWEI MU709 Series HSPA+ Module AT Command
Interface Specification.

Application
Interface
(145-pin LGA
interface)

One standard USIM (Class B and Class C) interface
Audio interface: PCM interface
USB 2.0 (High Speed)
UART interface:


8-wire UART0 x 1, up to 920 kbit/s



2-wire UART1 x 1 (This is only used for debugging)

GPIO
LED x 1
Power on/off interface
Hardware reset interface
JTAG interface
SLEEP_STATUS
WAKEUP_IN
WAKEUP_OUT
Antenna
Interface

WWAN MAIN antenna pad x1

SMS

New message alert

WWAN AUX antenna pad x 1

Management of SMS: read SMS, write SMS, send SMS, delete
SMS and list SMS
Supports MO and MT: Point-to-point
Data Services

GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s
EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s
WCDMA PS: UL 384 kbit/s; DL 384 kbit/s
HSPA+: UL 5.76 Mbit/s; DL 21.6 Mbit/s

[1]: When the MU709 module work in the range from –40°C to –20°C or +70°C to +85°C, NOT
all their RF performances comply with 3GPP specifications.

2.3 Circuit Block Diagram
Figure 2-1 shows the circuit block diagram of the MU709 module. The major
functional units of the MU709 module contain the following parts:


Power management



Baseband controller



Nand flash



RF Circuit

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Overall Description

Figure 2-1 Circuit block diagram of the MU709 module
Nand flash

AUX_ANT

MAIN_ANT

USIM_DET

USIM_Switch

Jamming Detection

RFIC and
Front end circuits

JTAG
WAKE

PCM
USB
UART

GND
LED
GPIO

USIM
Power on/off

VBAT

LGA Interface

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Overall Description

2.4 Application Block Diagram
Figure 2-2 Application block diagram of the MU709 module

UART Interface:

The module supports 2 UART interfaces. One is 8-wire
UART0, and the other is 2-wire UART1 (only for debugging).

USB Interface:

The USB interface supports USB 2.0 high speed standard.

USIM Interface:

The USIM interface provides the interface for a USIM card.

External Power
Supply:

DC 3.8 V is recommended.

Audio Interface:

The module supports one PCM interface.

LED:

Indicates the work status.

RF Pad:

RF antenna interface.

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Description of the Application Interfaces

3.1 About This Chapter
This chapter mainly describes the external application interfaces of the MU709
module, including:


LGA Interface



Power Interface



Signal Control Interface



UART Interface



USB Interface



USIM Card Interface



Audio Interface



General Purpose I/O Interface



JTAG Interface



RF Antenna Interface



Reserved Interface



NC Interface



Test Points Design

3.2 LGA Interface
The MU709 module uses the 145-pin LGA as their external interface. For details
about the module and dimensions, see 6.4 Dimensions and Interfaces .

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Description of the Application Interfaces

Figure 3-1 shows the sequence of pins on the 145-pin signal interface of the MU709
module.
Figure 3-1 Sequence of LGA interface (Top view)

Table 3-1 shows the definitions of pins on the 145-pin signal interface of the MU709
module.

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Description of the Application Interfaces

Table 3-1 Definitions of pins on the LGA interface
Pin
No.

Pin Name

Pad
Type

UART1_TX

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

UART1 transmit output
for debugging.

VOH

1.35

1.8

2.1

VOL

0.45

Not connected

UART1_RX

UART1 receive data input
for debugging.

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VOH

1.35

1.8

2.1

VOL

0.45

The pin is output
when the
module is used
as PCM master;
input when the
module is used
as PCM slave.

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VOH

1.35

1.8

2.1

VOL

0.45

VOH

1.35

1.8

2.1

VOL

0.45

VOH

2.25

3.0

3.3

VOL

0.75

VIH

2.1

3.0

3.3

VIL

–0.3

1.05

VOH

2.25

3.0

3.3

VOL

0.75

VIH

2.1

3.0

3.3

VIL

–0.3

1.05

VIH

1.26

1.8

2.1

PCM_SYNC

PCM_DIN

PCM_DOUT

PCM_CLK

SD_DATA1

I/O

PCM sync

PCM data in

PCM data out

PCM clock

SD Card data signal.
Only used for debugging.
Please reserve this pin as
the test point.

SD_DATA2

I/O

SD Card data signal.
Only used for debugging.
Please reserve this pin as
the test point.

WAKEUP_I
N

Sleep authorization
signal.

The pin is output
when the
module is used
as PCM master;
input when the
module is used
as PCM slave.
-

H: Sleep mode is

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Pin
No.

Pin Name

Pad
Type

Description of the Application Interfaces

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

disabled.

VIL

–0.3

0.63

The signal is
internally pulled
down. The
module will be
waked up when
it is externally
pulled up.

3.3

3.8

4.2

3.3

3.8

4.2

VIH

1.26

1.8

2.1

VIL

–0.3

Only used for
debugging.

0.63

VOH

1.35

1.8

2.1

L: Module is in sleep
state.

VOL

0.45

L: Sleep mode is enabled
(default value).

VBAT

Power supply input.

Comments

The rising time of VBAT
must be greater than 100
us
13

VBAT

Power supply input
The rising time of VBAT
must be greater than 100
us

PS_HOLD

SLEEP_STA
TUS

Power supply hold signal
to the module.

Sleep status indicator.

Please reserve
the test point.

H: Module is in wakeup
state.

Not connected

Reserved

Reserved, please keep
this pin open.

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Pin
No.

Pin Name

Pad
Type

Reserved

JTAG_TMS

Description of the Application Interfaces

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

Reserved, please keep
this pin open.

JTAG test mode select.

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

Reserved

Reserved, please keep
this pin open.

VCC_EXT1

1.8 V Power output

1.75

1.8

1.85

Not connected

USIM_VCC

Power supply for USIM
card.

–0.3

1.8

1.98

USIM_VCC=1.8
V

–0.3

3.0

3.3

USIM_VCC=3.0
V

Reserved

Reserved, please keep
this pin open.

JTAG_TRST
_N

JTAG reset

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

Not connected

JTAG_TCK

JTAG clock input

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

Reserved

Reserved, please keep
this pin open.

Reserved

Reserved, please keep
this pin open.

Reserved

Reserved, please keep
this pin open.

Reserved

Reserved, please keep
this pin open.

Not connected

GND

Ground

NOT USED

Do not design PAD

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Description of the Application Interfaces

Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

GND

Ground

GPIO2

I/O

General Purpose I/O
pins.

VOH

1.35

1.8

2.1

VOL

0.45

The function of
this pin has not
been defined.

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

GND

Ground

NOT USED

Do not design PAD

GND

Ground

GPIO5/USIM
Switch

I/O

General Purpose I/O pins
(Default) or USIM Switch
control signal.

VOH

1.35

1.8

2.1

VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

The function of
this pin can be
defined as GPIO
or USIM Switch,
while the USIM
Switch should
be enabled by
AT command.

GND

Ground

NOT USED

Do not design PAD

GND

Ground

GND

Ground

Reserved

Reserved, please keep
this pin open.

Reserved

Reserved, please keep
this pin open.

Reserved

Reserved, please keep
this pin open.

Reserved

Reserved, please keep
this pin open.

Reserved

Reserved, please keep
this pin open.

Reserved

Reserved, please keep
this pin open.

SD_DATA3

I/O

SD Card data signal.

VOH

2.25

3.0

3.3

VOL

0.75

VIH

2.1

3.0

3.3

VIL

–0.3

1.05

Only used for debugging.
Please reserve the test
point.

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Description of the Application Interfaces

Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

SD_CLK

SD Card CLK signal.

VOH

2.25

3.0

3.3

Please reserve the test
point.

VOL

0.75

SD Card data signal.

VOH

2.25

3.0

3.3

VOL

0.75

VIH

2.1

3.0

3.3

VIL

–0.3

1.05

VOH

2.25

3.0

3.3

Please reserve the test
point.

VOL

0.75

USIM Detection

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

The signal is
internally pulled
up. Keep
USIM_DET
floating, if it is
not used.

VOH

1.35

1.8

2.1

VOL

0.45

VOH

1.35

1.8

2.1

VOL

0.45

VOH

1.35

1.8

2.1

VOL

0.45

VOH

1.35

1.8

2.1

VOL

0.45

VOH

1.35

1.8

2.1

VOL

0.45

VOH

1.35

1.8

2.1

VOL

0.45

VOH

1.35

1.8

2.1

VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

Only used for debugging.

SD_DATA0

I/O

Only used for debugging.
Please reserve the test
point.

SD_CMD

SD Card CMD signal.
Only used for debugging.

USIM_DET

WAKEUP_O
UT
JTAG_TDO

UART0_DS
R
UART0_RTS

UART0_DC
D
UART0_TX

UART0_RIN
G
UART0_RX

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Module to wake up the
host.
JTAG test data output

UART0 data set ready

UART0 ready for receive

UART0 data carrier
detect
UART0 transmit output

UART0 ring indicator

UART0 receive data input

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Pin
No.
79

Pin Name
UART0_DT
R
UART0_CTS

POWER_ON
_OFF

Description of the Application Interfaces

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

Data terminal ready

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

UART0 clear to send

System power-on or
power-off

Not connected

USB_DM

I/O

USB Data- defined in the
USB 2.0 Specification

USB_DP

I/O

USB Data+ defined in the
USB 2.0 Specification.

JTAG_TDI

JTAG test data input

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VOH

0.7x
USIM
_VCC

3.3

USIM_VCC=1.8
V or 3.0 V

VOL

0.2x
USIM
_VCC

VOH

0.7 x
USIM
_VCC

3.3

VOL

0.2 x
USIM
_VCC

VIH

0.65x
USIM
_VCC

3.30

VIL

0.25x
USIM
_VCC

VOH

0.7 x
USIM
_VCC

3.3

USIM_RESE
T

USIM_DATA

USIM_CLK

I/O

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USIM card reset

USIM card data

USIM card clock

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V or 3.0 V

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Hardware Guide
Pin
No.

Pin Name

Pad
Type

Description

Description of the Application Interfaces

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

VOL

0.2 x
USIM
_VCC

Comments

Reserved

Reserved, please keep
this pin open.

SD_VCC

SD Card Power.

2.9

3.0

3.1

Only used for debugging.
Please reserve the test
point.
93

Not connected

100

RESIN_N

Reset module.

VIH

1.26

1.8

2.1

VIL

-0.3

0.63

101

LED_MODE

Mode indicator
Current sink
Drive strength: 10 mA

102

Reserved

Reserved, please keep
this pin open.

103

Not connected

104

Reserved

Reserved, please keep
this pin open.

105

GPIO1

I/O

General Purpose I/O
pins.

VOH

1.35

1.8

2.1

VOL

0.45

The function of
this pin has not
been defined.

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

106

GND

Ground

107

MAIN_ANT

RF main antenna pad

108

GND

Ground

109

GPIO4

I/O

General Purpose I/O

VOH

1.35

1.8

2.1

The function of

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Pin
No.

Pin Name

Pad
Type

Description of the Application Interfaces

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

pins.

VOL

0.45

this pin has not
been defined.

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

110

GND

Ground

111

Not connected

112

GND

Ground

113

GPIO3/Jam
ming-detecti
on

I/O

General Purpose I/O pins
(Default) or
Jamming-detection.

VOH

1.35

1.8

2.1

VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

The function of
this pin can be
defined as GPIO
or
Jamming-detecti
on, while the
Jamming-detecti
on should be
enabled by AT
command.

114

GND

Ground

115

AUX_ANT

RF AUX antenna pad

116

GND

Ground

117

Not connected

118

Not connected

119

Not connected

120

Not connected

121

GND

Thermal Ground Pad

122

GND

Thermal Ground Pad

123

GND

Thermal Ground Pad

124

GND

Thermal Ground Pad

125

GND

Thermal Ground Pad

126

GND

Thermal Ground Pad

127

GND

Thermal Ground Pad

128

GND

Thermal Ground Pad

129

GND

Thermal Ground Pad

130

GND

Thermal Ground Pad

131

GND

Thermal Ground Pad

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Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

132

GND

Thermal Ground Pad

133

GND

Thermal Ground Pad

134

GND

Thermal Ground Pad

135

GND

Thermal Ground Pad

136

GND

Thermal Ground Pad

137

GND

Thermal Ground Pad

138

GND

Thermal Ground Pad

139

GND

Thermal Ground Pad

140

GND

Thermal Ground Pad

141

GND

Thermal Ground Pad

142

GND

Thermal Ground Pad

143

GND

Thermal Ground Pad

144

GND

Thermal Ground Pad

145

GND

Thermal Ground Pad



I indicates pins for digital signal input; O indicates pins for digital signal output; PI indicates
power input pins; PO indicates power output pins.



VIL indicates low-level input voltage; VIH indicates high-level input voltage; VOL indicates
low-level output voltage; VOH indicates high-level output voltage.



The NC (Not Connected) pins are floating and there are no signal connected to these pins.



The Reserved pins are internally connected to the module. Therefore, these pins should not
be used, otherwise they may cause problems. Please contact us for more details about this
information.

3.3 Power Interface
3.3.1 Overview
The power supply part of the MU709 module contains:


VBAT pins for the power supply



VCC_EXT1 pin for external power output with 1.8 V



USIM_VCC pin for USIM card power output



SD_VCC pin for SD card power output for debugging.

Table 3-2 lists the definitions of the pins on the power supply interface.

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Table 3-2 Definitions of the pins on the power supply interface
Pin No.

Pin
Name

Pad
Type

Min.
(V)

Typ.
(V)

Max.
(V)

3.3

3.8

4.2

1.75

1.8

1.85

–0.3

1.8

1.98

–0.3

3.0

3.3

2.9

3.0

3.1

Description

Parameter

Power supply
input.

12 and 13

VBAT

The rising time of
VBAT must be
greater than 100
us

48, 50, 52,
54, 56, 58,
59, 106,
108, 110,
112, 114
and 116

GND

VCC_E
XT1

Pin for external
power output

USIM_
VCC

SD_VC
C

Power supply for
USIM card

SD Card Power.

Comments

USIM_VCC
=1.8 V
USIM_VCC
=3.0 V

Only used for
debugging.
Please reserve
the test point.

121–145

GND

Thermal Ground
Pad

3.3.2 Power Supply VBAT Interface
When the MU709 module works normally, power is supplied through the VBAT pins
and the voltage ranges from 3.3 V to 4.2 V (typical value: 3.8 V). The 145-pin LGA
provides two VBAT pins and some GND pins for external power input. To ensure that
the MU709 module works normally, all the pins must be used efficiently.
When the MU709 module is used for different external applications, pay special
attention to the design for the power supply. When the MU709 module works at 2G
mode and transmits signals at the maximum power, the transient current may reach
the transient peak value of about 2.75 A due to the differences in actual network
environments. In this case, the VBAT voltage drops. If you want wireless good
performance, please make sure that the voltage does not decrease below 3.3 V in any
case. Otherwise, exceptions such as restart of the MU709 module may occur.
A low-dropout (LDO) regulator or switch power with current output of more than 3 A is
recommended for external power supply. Furthermore, five 220 µF or above energy
storage capacitors are connected in parallel at the power interface of the MU709

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module. In addition, to reduce the impact of channel impedance on voltage drop, you
are recommended to try to shorten the power supply circuit of the VBAT interface.
It is recommended that customers add the EMI ferrite bead (FBMJ1608HS280NT
manufactured by TAIYO YUDEN or MPZ1608S300ATAH0 manufactured by TDK is
recommended) to directly isolate DTE from DCE in the power circuit. Figure 3-2
shows the recommended power circuit of MU709 module.
Figure 3-2 Recommended power circuit of MU709 module

When the system power restarts, a discharge circuit is recommended to make sure
the power voltage drops below 1.80 V for 1s at least.
The rising time of VBAT should be 100 µs at least. Otherwise, the module will be powered off.

3.3.3 Output Power Supply Interface
Output power supply interface is VCC_EXT1, USIM_VCC and SD_VCC.
Through VCC_EXT1, the module can supply 1.8 V power externally with an output
current of 10 mA (typical value) for external level conversion or other applications. If
the module is in sleep mode, the output power supply interface is in the low power
consumption state (< 500 μA). If the module is in power down mode, the output power
supply is in the disabled state.
Through the USIM_VCC power supply interface, the module can supply 1.8 V or 3 V
power to the USIM card.
The SD_VCC is SD card power that only used for debugging. Please reserve the test
point.

3.4 Signal Control Interface
3.4.1 Overview
The signal control part of the interface on the MU709 module consists of the following:


Power on/off (POWER_ON_OFF) pin



System reset (RESIN_N) pin



WAKEUP_IN signal (WAKEUP_IN) pin



WAKEUP_OUT signal (WAKEUP_OUT) pin

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

SLEEP_STATUS signal (SLEEP_STATUS) pin



LED signal (LED_MODE) pin

Table 3-3 lists the pins on the signal control interface.
Table 3-3 Definitions of the pins on the signal control interface
Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

POWER_
ON_OFF

System power-on and
power-off

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

RESIN_N

Reset module.

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

Sleep authorization
signal

VIH

1.26

1.8

2.1

H: Sleep mode is
disabled

VIL

–0.3

0.63

VOH

1.35

1.8

2.1

VOL

0.45

VOH

1.35

1.8

2.1

L: Module is in sleep
state

VOL

0.45

Mode indicator

100

WAKEUP_
IN

L: Sleep mode is
enabled (default
value)

WAKEUP_
OUT

Module to wake up
the host.
H: Wake up the host,
the module hold 1s
high-level-voltage
pulse and then output
low-level-voltage

Comments

The signal
is internally
pulled
down. The
module will
be waked
up when it
is
externally
pulled up.
-

L: Do not wake up the
host (default value)
15

101

SLEEP_S
TATUS

LED_MOD
E

Sleep status indicator
H: Module is in wake
state

Current sink
Drive strength: 10 mA

3.4.2 Power-on/off Pin
The MU709 module can be controlled to power on/off by the POWER_ON_OFF pin.

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Table 3-4 Two states of POWER_ON_OFF
Item

Pin state

Description

Low (when MU709
module is in power off
state.)

MU709 module is powered on.

Low (when MU709
module is in power on
state.)

MU709 module is powered off.

POWER_ON_OFF pin should be pulled down for
1.0s at least.

POWER_ON_OFF pin should be pulled down for
4.0s at least.

Figure 3-3 Connections of the POWER_ON_OFF pin

Power-On Time Sequence
After VBAT has been applied and is stable, the POWER_ON_OFF signal is pulled
down, and then the module will boot up.
During power on timing, please make sure the VBAT is stable.
Figure 3-4 Power on timing sequence

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Table 3-5 Power on timing
Parameter

Comments

Time (Nominal values)

Units

TPON

POWER_ON_OFF turn on time.

> 1.0

TPD+

POWER_ON_OFF Valid to USB
D+ high

About 7.0

If the DTE needs to detect the PID/VID of module during the BIOS phase, the
detection time should exceed the TPD+ time.

Power-Off Time Sequence
Figure 3-5 Power off timing sequence

Table 3-6 Power off timing
Parameter

Comments

Time (Nominal values)

Units

TPOFF

POWER_ON_OFF turn off time.

> 4.0

TPD+

POWER_ON_OFF Valid to USB
D+ low

> 4.0

3.4.3 RESIN_N
The RESIN_N pin is used to reset the module's system. When the software stops
responding, the RESIN_N pin can be pulled down to reset the hardware.

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Figure 3-6 Connections of the RESIN_N pin

As the RESIN_N and POWER_ON_OFF signals are relatively sensitive, it is
recommended that you install a 10 nF–0.1 µF capacitor near the RESIN_N and
POWER_ON_OFF pins of the interface for filtering. In addition, when you design a
circuit on the PCB of the interface board, it is recommended that the circuit length not
exceed 20 mm and that the circuit be kept at a distance of 2.54 mm (100 mil) at least
from the PCB edge. Furthermore, you need to wrap the area adjacent to the signal
wire with a ground wire. Otherwise, the module may be reset due to interference.
The MU709 module supports hardware reset function. If the software of the MU709
module stops responding, you can reset the hardware through the RESIN_N signal as
shown in Figure 3-7 .When a low-level pulse is supplied through the RESIN_N pin, the
hardware will be reset. After the hardware is reset, the software starts powering on the
module and reports relevant information according to the actual settings. For example,
the AT command automatically reports ^SYSSTART.
Figure 3-7 Reset pulse timing

The RESIN_N pin must not be pulled down for more than 1s. Otherwise, the module will be
powered off.

3.4.4 WAKEUP_IN Signal
WAKEUP_IN pin is the authorization signal of MU709 entering sleep mode. It is
internally pulled down, so it can be floating if not used.
Table 3-3 shows the definition of the WAKEUP_IN signal.
The module cannot enter sleep mode when this pin is pulled up (1.8 V), and the
module should be waked up when the pin is pulled up for 1s.

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Figure 3-8 Connections of the WAKEUP_IN pin

3.4.5 WAKEUP_OUT Signal
The WAKEUP_OUT signal is used to wake up the external devices.
Table 3-3 shows the definition of the WAKEUP_OUT signal.
Figure 3-9 shows recommended circuit of the WAKEUP_OUT pin.
Figure 3-9 Connections of the WAKEUP_OUT pin

3.4.6 SLEEP_STATUS Signal
SLEEP_STATUS signal is used to indicate the sleep status of MU709 module. The
external devices can get to know whether the module is in sleep mode by reading
SLEEP_STATUS pin.
When SLEEP_STATUS pin is in high level, MU709 module is in wakeup state.
When SLEEP_STATUS pin is in low level, MU709 module is in sleep state.

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Figure 3-10 shows recommended circuit of the SLEEP_STATUS pin.
Figure 3-10 Connections of the SLEEP_STATUS pin

3.4.7 LED_MODE Signal
MU709 module provides an LED_MODE signal to indicate the work status.
Table 3-7 State of the LED_MODE pin
No.

Operating Status

LED_MODE

No service/Restricted service

Outputs: low (0.1s)-high (0.1s)-low
(0.1s)-high (1.7s)

2s cycle
2

Outputs: low (0.1s)-high (1.9s)
2s cycle
Outputs: low

Figure 3-11 shows the recommended circuits of the LED_MODE pin. According to
LED feature, you can adjust the LED brightness by adjusting the resistance of resistor
R. The mode indicator (LED_MODE) is current sink. Drive strength: 10 mA.

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Figure 3-11 Driving circuit

Module
(DCE)

VBAT

LED_MODE

3.5 UART Interface
3.5.1 Overview
The MU709 module provides the UART0 (8-wire UART) interface for one
asynchronous communication channel. As the UART0 interface supports signal
control through standard modem handshake, AT commands are entered and serial
communication is performed through the UART0 interface. The UART have the
following features:


Full-duplex



7-bit or 8-bit data



1-bit or 2-bit stop bit



Odd parity check, even parity check, or non-check



Baud rate clock generated by the system clock



Direct memory access (DMA) transmission



Supported baud rate: 9600 bit/s, 19200 bit/s, 38400 bit/s, 57600 bit/s, 115200
bit/s (default), 230400 bit/s, 460800 bit/s and 921600 bit/s

The 2-wire UART1 is for debugging only. Customers should layout two test points,
which are required for system troubleshooting and analysis.
Table 3-8 lists the UART interface signals.
Table 3-8 UART interface signals
Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

UART1_TX

UART1 transmit output for
debugging.

VOH

1.35

1.8

2.1

VOL

0.45

UART1 receive data input for

VIH

1.26

1.8

2.1

UART1_RX

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Pin
No.

Pad
Type

Pin Name

UART0_TX

UART0_RX

UART0_RING

UART0_RTS

UART0_DTR

UART0_CTS

UART0_DCD

UART0_DSR

Description of the Application Interfaces

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

debugging

VIL

–0.3

0.63

UART0 transmit output

VOH

1.35

1.8

2.1

VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VOH

1.35

1.8

2.1

VOL

0.45

VOH

1.35

1.8

2.1

VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VOH

1.35

1.8

2.1

VOL

0.45

VOH

1.35

1.8

2.1

VOL

0.45

UART0 receive data input

UART0 ring indicator

UART0 ready for receive

UART0 data terminal ready

UART0 clear to send

UART0 data carrier detect

UART0 data set ready

3.5.2 Circuit Recommended for the UART Interface
Figure 3-12 Connection of the UART interface in the MU709 module (DCE) with the host
(DTE)

Module
(DCE)

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UART0_TX
UART0_RX
UART0_RTS
UART0_CTS

RXD
TXD
CTS
RTS

UART0_DTR

DTR

UART0_DSR

DSR

UART0_DCD

DCD
RING

UART0_RING
UART1_TX

test point

UART1_RX

test point

Application
Device
(DTE)

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The RS-232 chip (must support 921600 bit/s) can be used to connect the MU709
module with UART0. In this connection, the Complementary Metal Oxide
Semiconductor (CMOS) logic level and the Electronic Industries Association (EIA)
level are converted mutually.


The UART0 cannot wake up the module from the sleep status, and you can pull up the
WAKE_IN signal for 1s instead.



The level of RS-232 transceivers must match that of the MU709 module.

3.6 USB Interface
The MU709 module is compliant with USB 2.0 high speed protocol. The USB interface
is powered directly from the VBAT supply. The USB signal lines are compatible with
the USB 2.0 signal specifications. Figure 3-13 shows the circuit of the USB interface.
Table 3-9 Definition of the USB interface
Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.(
V)

Typ.(
V)

Max.(
V)

USB_DM

I/O

USB Data- defined in the
USB 2.0 Specification

USB_DP

I/O

USB Data+ defined in the
USB 2.0 Specification

According to USB protocol, for bus timing or electrical characteristics of MU709 USB
signal, please refer to the chapter 7.3.2 of Universal Serial Bus Specification 2.0.
Figure 3-13 Recommended circuit of USB interface

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

USB_DM and USB_DP are required to control the differential impedance 90 Ω (±10%).



The length of the gap between USB_DM and USB_DP should not exceed 5 mil.



The USB differential signal trace must be as short as possible, and laid out away from
high-speed clock signals and other periodic signals as far as possible.



Minimize through-holes and turning angles on the USB signal trace to reduce signal
reflection and impedance change.



Do not route the USB signal trace under the following components: crystal, oscillator, clock
circuit, electromagnetic component, and IC that uses or generates clocks.



Avoid stubs on the USB signal trace because stubs generate reflection and affect the signal
quality.



Route the USB signal trace on a complete reference plane (GND) and avoid crossing
inter-board gaps because inter-board gaps cause a large reflow channel area and increase
inductance and radiation. In addition, avoid signal traces on different layers.



The USB signal trace must be far away from core logical components because the high
current pulse generated during the state transitions process of core components may
impose interference on signals.



The USB signal trace must be far away from board edges with a minimum distance of 20 × h
(h indicates the vertical distance between the trace and the reference layer) to avoid signal
radiation.



C1 and C2 are ready for dealing with filter differential mode interference and C3 is ready for
dealing with filter common mode interference. You can choose the value of the C1, C2 and
C3 according to the actual PCB which is integrated 30 mm × 30 mm LGA module

3.7 USIM Card Interface
3.7.1 Overview
The MU709 module provides a USIM card interface complying with the ISO 7816-3
standard and support both Class B and Class C USIM cards.
Table 3-10 USIM card interface signals
Pin
No.

Pin Name

USIM_RE
SET

USIM_DA
TA

Pad
Type

I/O

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Description

Parameter

Min.(V)

Typ.
(V)

Max.(V)

VOH

0.7 x
USIM_VCC

3.3

VOL

0.2 x
USIM_
VCC

VOH

0.7 x
USIM_VCC

3.3

VOL

0.2 x
USIM_
VCC

VIH

0.65 x
USIM_VCC

3.30

USIM card
reset

USIM card
data

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Comments

USIM_VC
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3.0 V

HUAWEI MU709 Series HSPA+ LGA Module
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Pin
No.

USIM_CLK

Pad
Type

Pin Name

Description

Parameter

Min.(V)

Typ.
(V)

Max.(V)

VIL

0.25 x
USIM_
VCC

VOH

0.7 x
USIM_VCC

3.3

VOL

0.2 x
USIM_
VCC

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

–0.3

1.8

1.98

USIM_VC
C=1.8 V

–0.3

3.0

3.3

USIM_VC
C=3.0 V

USIM card
clock

I
USIM_DE
T

USIM
Detection

USIM_VC
C

Power
supply for
USIM card

Description of the Application Interfaces

Comments

USIM_VC
C=1.8 V or
3.0 V

The signal
is internally
pulled up.
Keep
USIM_DE
T floating,
if it is not
used.

3.7.2 Circuit Recommended for the USIM Card Interface
As the MU709 module is not equipped with a USIM socket, you need to place a USIM
socket on the user interface board. Figure 3-14 shows the circuit of the USIM card
interface.
Figure 3-14 Circuit of the USIM card interface
ESD protection

Module
(DCE)

1 kΩ

USIM-DET
0Ω

USIM-VCC

0Ω

USIM-DATA

0Ω

USIM-RESET
470 pF

Issue 09 (2017-12-15)

USIM

0Ω

USIM-CLK

33 pF 33 pF 33 pF 100 nF

1 µF

33 pF

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Figure 3-15 Pin definition of USIM Socket

Pin 1:

USIM_VCC

Pin 2:

USIM_RESET

Pin 3:

USIM_CLK

Pin 5:

GND

Pin 6:

VPP(Programming Voltage)

Pin 7:

USIM_DATA

Pin 9:

USIM_DET

Figure 3-16 Connections of the USIM_DET pin

1.8 V

Module
(DCE)

USIM_DET

USIM Socket
1 kΩ

470 pF

CD is a pin detecting USIM card in the USIM socket.


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If the USIM card is present, USIM_DET pin should be high, and the CD is open.

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If the USIM card is absent, USIM_DET pin should be low, and the CD is
connected to ground.



To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic
compatibility (EMC) authentication, the USIM socket should be placed near the
LGA interface (it is recommended that the PCB circuit connects the LGA interface
and the USIM socket does not exceed 100 mm), because a long circuit may lead to
wave distortion, thus affecting signal quality.



It is recommended that you wrap the area adjacent to the USIM_CLK and
USIM_DATA signal wires with ground. The Ground pin of the USIM socket and the
Ground pin of the USIM card must be well connected to the power Ground pin
supplying power to the MU709 module.



A 100 nF capacitor and 1 μF capacitor are placed between the USIM_VCC and
GND pins in a parallel manner (If USIM_VCC circuit is too long, that the larger
capacitance such as 4.7 μF can be employed if necessary). Three 33 pF
capacitors are placed between the USIM_DATA and Ground pins, the
USIM_RESET and Ground pins, and the USIM_CLK and Ground pins in parallel to
filter interference from RF signals.



It is recommended to take electrostatic discharge (ESD) protection measures near
the USIM socket. The TVS diode with Vrwm of 5 V and junction capacitance less
than 10 pF must be placed as close as possible to the USIM socket, and the
Ground pin of the ESD protection component is well connected to the power
Ground pin that supplies power to the MU709 module.



It is recommended to place a 1 kΩ resistor in series on the USIM_DET interface for
ESD protection if USIM_DET is used.

3.8 Audio Interface
MU709 module provides one PCM digital audio interface. Table 3-11 lists the signals
on the digital audio interface.
Table 3-11 Signals on the digital audio interface
Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

PCM_SYNC

PCM sync

VOH

1.35

1.80

2.10

VOL

0.45

The pin is output when the
module is used as PCM
master; input when the
module is used as PCM
slave.

VIH

1.26

1.80

2.10

VIL

–0.30

0.63

VOH

1.35

1.80

2.10

PCM_DIN

PCM_DOUT

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PCM data in

PCM data out

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Pin
No.

Pin Name

PCM_CLK

Pad
Type

Description

PCM clock

Description of the Application Interfaces

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

VOL

0.45

VOH

1.35

1.80

2.10

VOL

0.45

Comments

The pin is output when the
module is used as PCM
master; input when the
module is used as PCM
slave.

The MU709 PCM interface enables communication with an external codec to support
linear format.
Figure 3-17 Circuit diagram of the interface of the PCM (MU709 is used as PCM master)

Figure 3-18 Circuit diagram of the interface of the PCM (MU709 is used as PCM slave)

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

It is recommended that a TVS be used on the related interface, to prevent electrostatic
discharge and protect IC (Integrated Circuit) components.



The signal level of CODEC must match that of the module.

3.9 General Purpose I/O Interface
The MU709 module provides GPIO pins for customers to use controlling signals which
are worked at 1.8 V CMOS logic levels. Customers can use AT command to control
the state of logic levels of 5 GPIO output signal. See the HUAWEI MU709 Series
HSPA+ Module AT Command Interface Specification.
Table 3-12 Signals on the GPIO interface
Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

GPIO5/USIM
Switch

I/O

General Purpose I/O
pins (Default) or USIM
Switch control signal.

VOH

1.35

1.8

2.1

VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

The function of
this pin can be
defined as GPIO
or USIM Switch,
while the USIM
Switch should
be enabled by
AT command.

VOH

1.35

1.8

2.1

VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VOH

1.35

1.8

2.1

VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

113

51,
105,
109

GPIO3/Jammi
ng-detection

GPIO

Issue 09 (2017-12-15)

I/O

General Purpose I/O
pins (Default) or
Jamming-detection.

General Purpose I/O
pins.

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The function of
this pin can be
defined as GPIO
or
Jamming-detecti
on, while the
Jamming-detecti
on should be
enabled by AT
command.

The function of
these pins has
not been
defined.

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3.10 JTAG Interface
The MU709 module provides Joint Test Action Group (JTAG) interface. Table 3-13
shows the signals on the JTAG interface. It is recommended that route out the 5 pins
as test points on the DTE for tracing and debugging.
Table 3-13 Signals on the JTAG interface
Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.(V)

Typ.(V)

Max.(V)

JTAG_TMS

JTAG test mode select

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VOH

1.35

1.8

2.1

VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

JTAG_TRST_N

JTAG_TCK

JTAG_TDO

JTAG_TDI

JTAG reset

JTAG clock input

JTAG test data output

JTAG test data input

3.11 RF Antenna Interface
The MU709 module provides two antenna pads (MAIN_ANT and AUX_ANT) for
connecting the external antennas.
Table 3-14 Definition of the antenna pads
Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

107

MAIN_ANT

RF MAIN antenna pad

115

AUX_ANT

RF AUX antenna pad

Route the antenna pad as close as possible to antenna connector. In addition, the
impedance of RF signal traces must be 50 Ω.

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Figure 3-19 RF signal trace design about MAIN_ANT for reference (the same for
AUX_ANT)

Figure 3-20 RF signal layout design about MAIN_ANT for reference (the same for
AUX_ANT)

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For the PCB designed by the user, the impedance of all the RF signal tracks must be
50 Ω. Generally, the impedance depends on the medium factor, track width, and
distance from the floor.
In order to reflect the rules of design, the following figures indicate the complete
structure of the microstrip and stripline with an impedance of 50 Ω as well as the
reference design for stack.
Figure 3-21 Complete structure of the microstrip

Figure 3-22 Complete structure of the stripline

Figure 3-23 Pad for the RF interface

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Figure 3-24 RF Pad design for MU709

Please use impedance simulation tool to calculate RF MAIN pad impedance. The RF
MAIN pad dimension of the module is 1.1 mm (L) x 0.9 mm (W). You can get the
impedance with lower than 50 Ω calculated by the impedance simulation tool. Since
the target impedance is 50 Ω for RF trace, the recommended solution is that to carve
out the copper area of the second layer that projected by the RF MAIN pad at top
layer. How many layers should be carved out depend on the PCB permittivity, track
width, and distance from the floor of your own PCB. Our target is to make the RF
MAIN pad impedance as closer to 50 Ω as possible.

3.12 Reserved Interface
The module provides some reserved pins. All reserved pins cannot be used by the
customer. All of them should be Not Connected.
Table 3-15 Reserved pin
Pin No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

28, 29, 31, 35, 43–46,
60–65, 91, 102 and 104

Reserved

Reserved, please
keep this pin open.

3.13 NC Interface
The module has some NC pins. There is no signal connected to these pins.

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Table 3-16 NC pin
Pin No.

Pin Name

Pad Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

2, 3, 16–27, 33, 37–41,
47, 82–84, 93–99, 103,
111, 117–120

Not connected

3.14 Test Points Design
In the process of debugging when the module is embedded into the integrated
equipment, test points play an important role. Some problems related to the module
can be quickly resolved when test points are properly designed.
1.

The test points below must be designed in the customer board:



JTAG test points: it is the most common method of debugging.



USB test points: USB is the most important communication channel between
module and AP (host). Not only test points should be placed, but also a 0 ohm
series resistor should be placed on USB_D+/USB_D- signal. The resistor can be
welded off when necessary, then the USB of module is cut off from AP and can be
connected to PC to do some analyses.



POWER_ON_OFF, RESIN_N: they are some of the most important signals, test
points should be placed.



UART1: UART1 is used for printing the log information.



SD signals: SD signals are used for debugging.



VBAT: not only test points should be placed, but also a series magnetic bead
should be placed on VBAT signal. The magnetic bead can be welded off when
necessary, then the power of module is cut off from customer board and can be
connected to external power to do analyses about problems related to power
interference.



VCC_EXT1: to judge whether the module is powered on or not, just test the
VCC_EXT1.



PS_HOLD: the pin is only used for debugging, please reserve this pin as the test
point.

The test points below should be placed according to the requirement in the
customer board: SLEEP_STATUS, GPIO, PCM, USIM, UART1, WAKEUP_IN
and WAKEUP_OUT, except the two cases below:

Issue 09 (2017-12-15)

−

The corresponding signal is not used.

−

The corresponding signal is used, but there is already another place where
this signal can be tested, such as SIM socket pin.

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4.1 About This Chapter
This chapter describes the RF specifications of the MU709 module, including:


Operating Frequencies



Conducted RF Measurement



Conducted Rx Sensitivity and Tx Power



Antenna Design Requirements

4.2 Operating Frequencies
Table 4-1 and Table 4-2 show the RF bands supported by MU709 module.
Table 4-1 RF bands of MU709s-2
Operating Band

UMTS Band 1

1920 MHz–1980 MHz

2110 MHz–2170 MHz

UMTS Band 8

880 MHz–915 MHz

925 MHz–960 MHz

GSM 850

824 MHz–849 MHz

869 MHz–894 MHz

GSM 900

880 MHz–915 MHz

925 MHz–960 MHz

GSM 1800

1710 MHz–1785 MHz

1805 MHz–1880 MHz

GSM 1900

1850 MHz–1910 MHz

1930 MHz–1990 MHz

Table 4-2 RF bands of MU709s-6
Operating Band

UMTS Band 1

1920 MHz–1980 MHz

2110 MHz–2170 MHz

UMTS Band 2

1850 MHz–1910 MHz

1930 MHz–1990 MHz

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Operating Band

UMTS Band 5

824 MHz–849 MHz

869 MHz–894 MHz

GSM 850

824 MHz–849 MHz

869 MHz–894 MHz

GSM 900

880 MHz–915 MHz

925 MHz–960 MHz

GSM 1800

1710 MHz–1785 MHz

1805 MHz–1880 MHz

GSM 1900

1850 MHz–1910 MHz

1930 MHz–1990 MHz

4.3 Conducted RF Measurement
4.3.1 Test Environment
Test instrument

R&S CMU200

Power supply

KEITHLEY 2306

RF cable for testing

L08-C014-350 of DRAKA COMTEQ or Rosenberger
Cable length: 29 cm



The compensation for different frequency bands relates to the cable and the test
environment.



The instrument compensation needs to be set according to the actual cable conditions.

4.3.2 Test Standards
Huawei modules meet 3GPP test standards. Each module passes strict tests at the
factory and thus the quality of the modules is guaranteed.

4.4 Conducted Rx Sensitivity and Tx Power
4.4.1 Conducted Receive Sensitivity
The conducted receive sensitivity is a key parameter that indicates the receiver
performance of MU709 module.
Table 4-3 MU709s-2 conducted Rx sensitivity
Band

Test Value (Unit: dBm)

Note

GSM 850

–110.5

BER Class II < 2.44%

GSM 900

–109

BER Class II < 2.44%

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Band

Test Value (Unit: dBm)

Note

GSM 1800

–108.5

BER Class II < 2.44%

GSM 1900

–108.5

BER Class II < 2.44%

WCDMA Band 1 Main RX

–110

BER < 0.1%

WCDMA Band 8 Main RX

–111.5

BER < 0.1%

Table 4-4 MU709s-6 conducted Rx sensitivity
Band

Test Value (Unit: dBm)

Note

GSM 850

–110.5

BER Class II < 2.44%

GSM 900

–109

BER Class II < 2.44%

GSM 1800

–108.5

BER Class II < 2.44%

GSM 1900

–108.5

BER Class II < 2.44%

WCDMA Band 1 Main RX

–110

BER < 0.1%

WCDMA Band 2 Main RX

–110.5

BER < 0.1%

WCDMA Band 5 Main RX

–111.5

BER < 0.1%

The test values are the average of some test samples.

4.4.2 Conducted Transmit Power
The conducted transmit power is another indicator that measures the performance of
MU709. The conducted transmit power refers to the maximum power that the module
tested at the antenna pad can transmit. According to the 3GPP protocol, the required
transmit power varies with the power class.
Table 4-5 and Table 4-6 list the required ranges of the conducted transmit power of
MU709 module.
Table 4-5 MU709s-2 conducted Tx power
Band
GSM 850

GSM 900

GSM 1800

Issue 09 (2017-12-15)

Typical Value (Unit: dBm)

Note (Unit: dB)

GMSK(1Tx Slot)

32.5

±1.5

8PSK(1Tx Slot)

±2

GMSK(1Tx Slot)

32.5

±1.5

8PSK(1Tx Slot)

±2

GMSK(1Tx Slot)

29.5

±1.5

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Band

RF Specifications

Typical Value (Unit: dBm)

Note (Unit: dB)

8PSK(1Tx Slot)

±2

GMSK(1Tx Slot)

29.5

±1.5

8PSK(1Tx Slot)

±2

WCDMA Band 1

23.2

±1

WCDMA Band 8

23.2

-1.5/+1

GSM 1900

Table 4-6 MU709s-6 conducted Tx power
Band

Typical Value (Unit: dBm)

Note (Unit: dB)

GMSK(1Tx Slot)

32.5

±1.5

8PSK(1Tx Slot)

±2

GMSK(1Tx Slot)

32.5

±1.5

8PSK(1Tx Slot)

±2

GMSK(1Tx Slot)

29.5

±1.5

8PSK(1Tx Slot)

±2

GMSK(1Tx Slot)

29.5

±1.5

8PSK(1Tx Slot)

±2

WCDMA Band 1

23.2

±1

WCDMA Band 2

23.2

±1

WCDMA Band 5

23.4

-1.5/+1

GSM 850

GSM 900

GSM 1800

GSM 1900

4.5 Antenna Design Requirements
4.5.1 Antenna Design Indicators
Antenna Efficiency
Antenna efficiency is the ratio of the input power to the radiated or received power of
an antenna. The radiated power of an antenna is always lower than the input power
due to the following antenna losses: return loss, material loss, and coupling loss. The
efficiency of an antenna relates to its electrical dimensions. To be specific, the
antenna efficiency increases with the electrical dimensions. In addition, the
transmission line from the antenna port of MU709 to the antenna is also part of the
antenna. The line loss increases with the line length and the frequency. It is
recommended that the line loss is as low as possible.

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The following antenna efficiency (free space) is recommended for MU709 to ensure
high radio performance of the module:


Efficiency of the primary antenna: ≥ 40% (below 960 MHz); ≥ 50% (over 1710
MHz)



Efficiency of the diversity antenna: ≥ half of the efficiency of the primary
antenna in receiving band

In addition, the efficiency should be tested with the transmission line.

S11(VSWR) and S21
S11 indicates the degree to which the input impedance of an antenna matches the
reference impedance (50 Ω). S11 shows the resonance feature and impedance
bandwidth of an antenna. Voltage Standing Wave Ratio (VSWR) is another
expression of S11. S11 relates to the antenna efficiency. S11 can be measured with a
vector analyzer.
The following S11 values are recommended for the antenna of the module:


S11 of the primary antenna ≤ –6 dB



S11 of the diversity antenna ≤ –6 dB

In addition, S11 is less important than the efficiency, and S11 has weak correlation to
wireless performance.
S21 indicates the isolation between two antennas.

Isolation
For a wireless device with multiple antennas, the power of different antennas is
coupled with each other. Antenna isolation is used to measure the power coupling.
The power radiated by an antenna might be received by an adjacent antenna, which
decreases the antenna radiation efficiency and affects the running of other devices. To
avoid this problem, evaluate the antenna isolation as sufficiently as possible at the
early stage of antenna design.
Antenna isolation depends on the following factors:


Distance between antennas



Antenna type



Antenna direction

The primary antenna must be placed as near as possible to the module to minimize
the line length. The diversity antenna needs to be installed perpendicularly to the
primary antenna. The diversity antenna can be placed farther away from the module.
Antenna isolation can be measured with a two-port vector network analyzer.
The following antenna isolation is recommended for the antennas:


Isolation between the primary and diversity antennas ≤ –12 dB



Isolation between the primary (diversity) antenna and the Wi-Fi antenna ≤ –15 dB

Polarization
The polarization of an antenna is the orientation of the electric field vector that rotates
with time in the direction of maximum radiation.

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The linear polarization is recommended for the antenna of MU709.

Radiation Pattern
The radiation pattern of an antenna reflects the radiation features of the antenna in the
remote field region. The radiation pattern of an antenna commonly describes the
power or field strength of the radiated electromagnetic waves in various directions
from the antenna. The power or field strength varies with the angular coordinates (θ
and φ), but is independent of the radial coordinates.
The radiation pattern of half wave dipole antennas is omnidirectional in the horizontal
plane, and the incident waves of base stations are often in the horizontal plane. For
this reason, the receiving performance is optimal.
The following radiation patterns are recommended for the antenna of MU709.
Primary/diversity antenna: omnidirectional
In addition, the diversity antenna’s pattern should be complementary with the primary
antenna's pattern.

Envelope Correlation Coefficient
ECC is short for Envelope Correlation Coefficient. It is the cross-correlation value of
the complex patterns of the master and diversity antenna. It indicates how similar the
magnitude and the phase patterns of the two antennas are. If two antennas have no
similarity, the ECC should be zero. Actually, the less ECC, the better diversity
performance.
The following ECC is recommended for MU709 LGA module.


ECC ≤ 0.5 (working frequency below 0.96 GHz)



ECC ≤ 0.3 (working frequency above 1.4 GHz)

Gain and Directivity
The radiation pattern of an antenna represents the field strength of the radiated
electromagnetic waves in all directions, but not the power density that the antenna
radiates in the specific direction. The directivity of an antenna, however, measures the
power density that the antenna radiates.
Gain, as another important parameter of antennas, correlates closely to the directivity.
The gain of an antenna takes both the directivity and the efficiency of the antenna into
account. The appropriate antenna gain prolongs the service life of relevant batteries.
The following antenna gain is recommended for MU709. Gain of the
primary/diversity antenna ≤ 2.5 dBi

Issue 09 (2017-12-15)



The antenna consists of the antenna body and the relevant RF transmission line. Take the
RF transmission line into account when measuring any of the preceding antenna indicators.



Huawei cooperates with various famous antenna suppliers who are able to make
suggestions on antenna design, for example, Amphenol, Skycross, etc.

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4.5.2 Interference
Besides the antenna performance, the interference on the user board also affects the
radio performance (especially the TIS) of the module. To guarantee high performance
of the module, the interference sources on the user board must be properly controlled.
On the user board, there are various interference sources, such as the LCD, CPU,
audio circuits, and power supply. All the interference sources emit interference signals
that affect the normal operation of the module. For example, the module sensitivity
can be decreased due to interference signals. Therefore, during the design, you need
to consider how to reduce the effects of interference sources on the module. You can
take the following measures: Use an LCD with optimized performance; shield the LCD
interference signals; shield the signal cable of the board; or design filter circuits.
Huawei is able to make technical suggestions on radio performance improvement of
the module.

4.5.3 Antenna Requirements
The antenna for MU709 module must fulfill the following requirements:
Table 4-7 MU709s-2 module antenna requirements
GSM/WCDMA Antenna Requirements
Frequency range

Depending on frequency band(s) provided by the network
operator, the customer must use the most suitable
antenna for that/those band(s)

Bandwidth of primary
antenna

70 MHz in GSM 850
80 MHz in GSM 900
170 MHz in GSM 1800
140 MHz in GSM 1900
80 MHz in WCDMA Band 8
250 MHz in WCDMA Band 1

Bandwidth of
secondary antenna

35 MHz in WCDMA Band 8

Gain

≤ 2.5 dBi

Impedance

50 Ω

VSWR absolute max

≤ 3:1

VSWR recommended

≤ 2:1

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Table 4-8 MU709s-6 module antenna requirements
GSM/WCDMA Antenna Requirements
Frequency range

Depending on frequency band(s) provided by the network
operator, the customer must use the most suitable
antenna for that/those band(s)

Bandwidth of primary
antenna

70 MHz in GSM 850
80 MHz in GSM 900
170 MHz in GSM 1800
140 MHz in GSM 1900
70 MHZ in WCDMA Band 5
140 MHz in WCDMA Band 2
250 MHz in WCDMA Band 1

Bandwidth of
secondary antenna

25 MHz in WCDMA Band 5
60 MHz in WCDMA Band 2
60 MHz in WCDMA Band 1

Gain

≤ 2.5 dBi

Impedance

50 Ω

VSWR absolute max

≤ 3:1

VSWR recommended

≤ 2:1

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Electrical and Reliability Features

5.1 About This Chapter
This chapter describes the electrical and reliability features in the MU709 module,
including:


Absolute Ratings



Operating and Storage Temperatures



Power Supply Features



Reliability Features



EMC and ESD Features

5.2 Absolute Ratings

Table 5-1 lists the absolute ratings for the MU709 module. Using the MU709 module
beyond these conditions may result in permanent damage to the module.
Table 5-1 Absolute ratings
Symbol

Specification

Min.

Max.

Unit

VBAT

External power voltage

–0.3

4.5

Digital input voltage

–0.3

2.3

5.3 Operating and Storage Temperatures and Humidity
Table 5-2 lists the operating and storage temperatures for the MU709 module.

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Table 5-2 Operating and storage temperatures
Specification

Min.

Max.

Unit

Normal working temperature

–20

+70

°C

Extended temperature[1]

–40

+85

°C

Storage temperature

–40

+85

°C

Humidity

[1]: When the MU709 module works in the range from –40°C to –20°C or +70°C to +85°C, NOT
all their RF performances comply with 3GPP specifications.

5.4 Power Supply Features
5.4.1 Input Power Supply
Table 5-3 lists the requirements for input power of the MU709 module.
Table 5-3 Requirements for input power
Parameter

Min.

Typ.

Max.

Ripple

Unit

VBAT

3.3

3.8

4.2

0.1

Figure 5-1 Power Supply During Burst Emission

The VBAT minimum value must be guaranteed during the burst (with 2.75 A Peak in GPRS or
GSM mode).

Table 5-4 Requirements for input current
Power

Peak (Maximum)

Normal (Maximum)

VBAT

2750 mA

1100 mA

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5.4.2 Power Consumption
The power consumption in different scenarios are respectively listed in Table 5-5 to
Table 5-9 .
The power consumption listed in this section is tested when the power supply is
normal voltage (3.8 V) and all of Test values are measured at room temperature.
Table 5-5 Averaged power off DC power consumption
Description

Test Value (Unit: µA)

Notes/Configuration

Typical
Power off

Normal voltage (3.8 V) is ON while
power on event is not triggered.

Table 5-6 Averaged standby DC power consumption
Description

Bands

Test Value (Unit: mA)

Notes/Configuration

Typical
Sleep

HSPA/WCDMA

UMTS bands

2.7

Module is powered up
DRX cycle=7 (1.28s)
Module is registered on the
network.
USB is in suspend.

GPRS/EDGE

GSM bands

2.4

Module is powered up
MFRMS=5 (1.175s)
Module is registered on the
network.
USB is in suspend.

Idle

HSPA/WCDMA

UMTS bands

Module is powered up
DRX cycle=7 (1.28s)
Module is registered on the
network, no data is
transmitted
USB is in active.

GPRS/EDGE

GSM bands

Module is powered up
MFRMS=5 (1.175s)
Module is registered on the
network.
no data is transmitted
USB is in active.

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Table 5-7 Averaged Data Transmission DC power consumption of MU709s-2
(HSPA/WCDMA)
Description

Band

Test Value
(Unit: mA)

Notes/Configuration

WCDMA

Band 1

210

0 dBm Tx Power

(IMT 2100)

270

10 dBm Tx Power

590

23.5 dBm Tx Power

Band 8

220

0 dBm Tx Power

(900 MHz)

280

10 dBm Tx Power

610

23.5dBm Tx Power

Band 1

230

0 dBm Tx Power

(IMT 2100)

300

10 dBm Tx Power

610

23.5 dBm Tx Power

Band 8

230

0 dBm Tx Power

(900 MHz)

300

10 dBm Tx Power

620

23.5 dBm Tx Power

HSPA

Table 5-8 Averaged Data Transmission DC power consumption of MU709s-6
(HSPA/WCDMA)
Description

Band

Test Value
(Unit: mA)

Notes/Configuration

WCDMA

Band 1

192

0 dBm Tx Power

(IMT 2100)

228

10 dBm Tx Power

557

23.5 dBm Tx Power

Band 2

189

0 dBm Tx Power

(1900 MHz)

233

10 dBm Tx Power

600

23.5 dBm Tx Power

Band 5

188

0 dBm Tx Power

(850 MHz)

211

10 dBm Tx Power

521

23.5 dBm Tx Power

Band 1

201

0 dBm Tx Power

(IMT 2100)

235

10 dBm Tx Power

577

23.5 dBm Tx Power

HSPA

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Description

Electrical and Reliability Features

Band

Test Value
(Unit: mA)

Notes/Configuration

Band 2

192

0 dBm Tx Power

(1900 MHz)

241

10 dBm Tx Power

607

23.5 dBm Tx Power

Band 5

191

0 dBm Tx Power

(850 MHz)

223

10 dBm Tx Power

542

23.5 dBm Tx Power

Table 5-9 Averaged DC power consumption of MU709 module (GPRS/EDGE)
Description

Test Value

Units

PCL

Configuration

GPRS 850

270

1 Up/1 Down

400

2 Up/1 Down

550

4 Up/1 Down

170

GPRS 900

300

4 Up/1 Down

260

1 Up/1 Down

370

2 Up/1 Down

520

4 Up/1 Down
mA

1 Up/1 Down

200

2 Up/1 Down

280

4 Up/1 Down

220

1 Up/1 Down

300

2 Up/1 Down

400

4 Up/1 Down
mA

1 Up/1 Down

180

2 Up/1 Down

240

4 Up/1 Down

210
310

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1 Up/1 Down
2 Up/1 Down

150

GPRS 1900

200

160

GPRS 1800

1 Up/1 Down
2 Up/1 Down

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Description

Test Value

Units

Electrical and Reliability Features

PCL

400
150

EDGE 850

1 Up/1 Down

4 Up/1 Down

220

1 Up/1 Down

300

2 Up/1 Down

420

4 Up/1 Down
mA

1 Up/1 Down

200

2 Up/1 Down

290

4 Up/1 Down

220

1 Up/1 Down

290

2 Up/1 Down

420

4 Up/1 Down
mA

1 Up/1 Down

200

2 Up/1 Down

280

4 Up/1 Down

200

1 Up/1 Down

260

2 Up/1 Down

360

4 Up/1 Down
mA

1 Up/1 Down

230

2 Up/1 Down

340

4 Up/1 Down

200

1 Up/1 Down

250

2 Up/1 Down

360

4 Up/1 Down

180

Issue 09 (2017-12-15)

250

180

EDGE 1900

2 Up/1 Down

170

EDGE 1800

4 Up/1 Down

180

170

EDGE 900

Configuration

1 Up/1 Down

240

2 Up/1 Down

340

4 Up/1 Down

HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide

Electrical and Reliability Features



All power consumption test configuration can be referenced by GSM Association Official
Document TS.09: Battery Life Measurement and Current Consumption Technique.



Test condition: For Max. Tx. power, see 4.4.2 Conducted Transmit Power, which are listed in
Table 4-5 , for Max. data throughput, see 2.2 Function Overview, which are listed in Table
2-1 .

5.5 Reliability Features
Table 5-10 lists the test conditions and results of the reliability of the MU709 module.
Table 5-10 Test conditions and results of the reliability of the MU709 module
Item
Stress

Test Condition
Low-tempera
ture storage

High-temper
ature storage

Low-tempera
ture
operating

High-temper
ature
operating

Temperature
cycle
operating

Damp heat
cycling

Issue 09 (2017-12-15)



Temperature: –40ºC



Operation mode: no
power, no package



Test duration: 24 h



Temperature: 85ºC



Operation mode: no
power, no package



Test duration: 24 h



Temperature: –40ºC



Operation mode: working
with service connected



Test duration: 24 h



Temperature: 85ºC



Operation mode: working
with service connected



Test duration: 24 h



High temperature: 85ºC



Low temperature: –40ºC



Operation mode: working
with service connected

Standard
JESD22-A1
19-C

Sample size
3 pcs/group

Results
Visual inspection:
ok
Function test: ok
RF specification: ok

JESD22-A1
03-C

3 pcs/group

Visual inspection:
ok
Function test: ok
RF specification: ok

IEC600682-1

3 pcs/group

Visual inspection:
ok
Function test: ok
RF specification: ok

JESD22-A1
08-C

3 pcs/group

Visual inspection:
ok
Function test: ok
RF specification: ok

JESD22-A1
05-B

3pcs/group

Visual inspection:
ok
Function test: ok
RF specification: ok



Test duration: 30 cycles;1
h+1 h/cycle



High temperature: 55ºC



Low temperature: 25ºC



Humidity: 95%±3%

Function test: ok



Operation mode: working
with service connected

RF specification: ok



Test duration: 6 cycles;
12 h+12 h/cycle

JESD22-A1
01-B

3 pcs/group

Visual inspection:
ok

HUAWEI MU709 Series HSPA+ LGA Module
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Item

Test Condition
Thermal
shock

Salty fog test



Low temperature: –40ºC



High temperature: 85ºC



Temperature change
interval: < 20s



Operation mode: no
power



Test duration: 100 cycles;
15 min+15 min/cycle



Temperature: 35°C



Density of the NaCl
solution: 5%±1%



Operation mode: no
power, no package



Test duration:

Electrical and Reliability Features

Standard

Sample size

Results

JESD22-A1
06-B

3 pcs/group

Visual inspection:
ok
Function test: ok
RF specification: ok

JESD22-A1
07-B

3 pcs/group

Visual inspection:
ok
Function test: ok
RF specification: ok

Spraying interval: 8 h
Exposing period after
removing the salty fog
environment: 16 h
Sine
vibration

Shock test

Issue 09 (2017-12-15)



Frequency range: 5 Hz to
200 Hz



Acceleration: 1 Grms

Function test: ok



Frequency scan rate: 0.5
oct/min

RF specification: ok



Operation mode: working
with service connected



Test duration: 3 axial
directions. 2 h for each
axial direction.



Half-sine wave shock



Peak acceleration: 30
Grms



Shock duration: 11 ms



Operation mode: working
with service connected



Test duration: 6 axial
directions. 3 shocks for
each axial direction.

JESD22-B1
03-B

JESD-B104
-C

3 pcs/group

Visual inspection:
ok

Visual inspection:
ok
Function test: ok
RF specification: ok

HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide
Item
Drop test

Life

High
temperature
operating life

High
temperature
& high
humidity

Temperature
cycle-Non
operating

Electrical and Reliability Features

Test Condition

Standard

Sample size

Results



IEC600682-32

3 pcs/group

Visual inspection:
ok

0.8 m in height. Drop the
module on the marble
terrace with one surface
facing downwards, six
surfaces should be
tested.



Operation mode: no
power, no package



Temperature: 85ºC



Operation mode: working
with service connected



Test duration: 168 h, 336
h, 500 h, 1000 h for
inspection point



High temperature: 85ºC



Humidity: 85%



Operation mode: powered
on and no working



Test duration: 168 h, 336
h, 500 h, 1000 h for
inspection point



High temperature: 85ºC



Low temperature: –40ºC



Temperature change
slope: 6ºC/min



Operation mode: no
power



Test duration: 168 h,

Function test: ok
RF specification: ok

JESD22-A1
08-B

50 pcs/group

Visual inspection:
ok
Function test: ok
RF specification: ok

JESD22-A1
10-B

50 pcs/group

Visual inspection:
ok
Function test: ok
RF specification: ok

JESD22-A1
04-C

50 pcs/group

Visual inspection:
ok
Function test: ok
RF specification: ok

336 h, 500 h, 1000 h for
inspection point
ESD

HBM
(Human
Body Model)



2 kV (Class 1 B)



Operation mode: no
power

JESD22-A1
14-D

3 pcs/group

Visual inspection:
ok
Function test: ok
RF specification: ok

ESD with
DVK (or
embedded in
the host)



Contact Voltage: ±2 kV,
±4 kV



Air Voltage: ±2 kV, ±4 kV,
±8 kV



Operation mode: working
with service connected

IEC610004-2

2 pcs

Visual inspection:
ok
Function test: ok
RF specification: ok

Groups ≥ 2

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Electrical and Reliability Features

5.6 EMC and ESD Features
The following are the EMC design comments:


Attention should be paid to static control in the manufacture, assembly, packaging,
handling and storage process to reduce electrostatic damage to HUAWEI
module.



RSE (Radiated Spurious Emission) may exceed the limit defined by EN301489 if
the antenna port is protected by TVS (Transient Voltage Suppressor), which is
resolved by making some adjustment on RF match circuit.



TVS should be added on the USB port for ESD protection, and the parasitic
capacitance of TVS on D+/D- signal should be less than 2 pF. Common-mode
inductor should be added in parallel on D+/D- signal.



TVS should be added on the USIM interface for ESD protection. The parasitic
capacitance of TVS on USIM signal should be less than 10 pF;



Resistors in parallel and a 10nF capacitance should be added on RESIN_N and
POWER_ON_OFF signal to avoid shaking, and the distance between the
capacitor and the related pins should be less than 100 mil.



A TVS should be added to the module power supply. It is recommended that the
TVS's Clamping Voltage (VCL) be smaller than 12 V and Peak Pulse Power (PPP)
at least 100 W.



PCB routing should be V-type rather than T-type for TVS (Transient Voltage
Suppressor).



An integrated ground plane is necessary for EMC design.

The following are the requirements of ESD environment control:


The electrostatic discharge protected area (EPA) must have an ESD floor whose
surface resistance and system resistance are greater than 1 x 104 Ω while less
than 1 x 109 Ω.



The EPA must have a sound ground system without loose ground wires, and the
ground resistance must be less than 4 Ω.



The workbench for handling ESD sensitive components must be equipped with
common ground points, the wrist strap jack, and ESD pad. The resistance
between the jack and common ground point must be less than 4 Ω. The surface
resistance and system resistance of the ESD pad must be less than 1 x 109 Ω.



The EPA must use the ESD two-circuit wrist strap, and the wrist strap must be
connected to the dedicated jack. The crocodile clip must not be connected to the
ground.



The ESD sensitive components, the processing equipment, test equipment, tools,
and devices must be connected to the ground properly. The indexes are as
follows:



Issue 09 (2017-12-15)

−

Hard ground resistance < 4 Ω

−

1 x 105 Ω ≤ Soft ground resistance < 1 x 109 Ω

−

1 x 105 Ω ≤ ICT fixture soft ground resistance < 1 x 1011 Ω

−

The electronic screwdriver and electronic soldering iron can be easily oxidized.
Their ground resistance must be less than 20 Ω.

The parts of the equipment, devices, and tools that touch the ESD sensitive
components and moving parts that are close to the ESD sensitive components
must be made of ESD materials and have sound ground connection. The parts

HUAWEI MU709 Series HSPA+ LGA Module
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Electrical and Reliability Features

that are not made of ESD materials must be handled with ESD treatment, such
as painting the ESD coating or ionization treatment (check that the friction voltage
is less than 100 V).


Key parts in the production equipment (parts that touch the ESD sensitive
components or parts that are within 30 cm away from the ESD sensitive
components), including the conveyor belt, conveyor chain, guide wheel, and SMT
nozzle, must all be made of ESD materials and be connected to the ground
properly (check that the friction voltage is less than 100 V).



Engineers that touch IC chips, boards, modules, and other ESD sensitive
components and assemblies must wear ESD wrist straps, ESD gloves, or ESD
finger cots properly. Engineers that sit when handling the components must all
wear ESD wrist straps.



Noticeable ESD warning signs must be attached to the packages and placement
areas of ESD sensitive components and assemblies.



Boards and IC chips must not be stacked randomly or be placed with other ESD
components.



Effective shielding measures must be taken on the ESD sensitive materials that
are transported or stored outside the EPA.
HUAWEI MU709 module does not include any protection against overvoltage.

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Mechanical Specifications

6.1 About This Chapter
This chapter describes the process design and mechanical specifications:


Storage Requirement



Moisture Sensitivity



Dimensions and Interfaces



Packaging



Customer PCB Design



Thermal Design Solution



Assembly Processes



Rework

6.2 Storage Requirement
The module must be stored and sealed properly in vacuum package under a
temperature below 40°C and the relative humidity less than 90% in order to ensure
the weldability within 12 months.

6.3 Moisture Sensitivity


The moisture sensitivity is level 3.



After unpacking, the module must be assembled within 168 hours under the
environmental conditions that the temperature is lower than 30°C and the relative
humidity is less than 60%. If the preceding conditions cannot be met, the module
needs to be baked according to the parameters specified in Table 6-1 .

Table 6-1 Baking parameters
Baking Temperature

Baking Condition

Baking Duration

Remarks

125°C±5°C

Relative humidity ≤ 60%

8 hours

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Mechanical Specifications

Moving, storing, and processing the product must comply with IPC/JEDEC J-STD-033.

6.4 Dimensions and Interfaces
Figure 6-1 shows the dimensions in details.
Figure 6-1 Dimensions (Unit: mm)

6.5 Packaging
HUAWEI LGA module uses five layers ESD pallet, anti-vibration foam and vacuum
packing into cartons. The tray specification complies with Jedec_Tray_DGuide4-10D.

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Mechanical Specifications

Figure 6-2 ESD pallet (unit: mm)

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Mechanical Specifications

The following figure shows the packaging.

6.6 Customer PCB Design
6.6.1 PCB Surface Finish
The PCB surface finish recommended is Electroless Nickel Immersion Gold (ENIG).
Organic Solderability Preservative (OSP) may also be used, ENIG preferred.

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Mechanical Specifications

6.6.2 PCB Pad Design
To achieve assembly yields and solder joints of high reliability, it is recommended that
the PCB pad size be designed as follows:
Figure 6-3 MU709 Footprint design (Unit: mm)

6.6.3 Solder Mask
NSMD is recommended. In addition, the solder mask of the NSMD (Non-solder Mask
Defined) pad design is larger than the pad so the reliability of the solder joint can be
improved.
The solder mask must be 100 µm–150 µm larger than the pad, that is, the single side
of the solder mask must be 50 µm–75 µm larger than the pad. The specific size
depends on the processing capability of the PCB manufacturer.

6.6.4 Requirements on PCB Layout


To reduce deformation, a thickness of at least 1.0 mm is recommended.



Other devices must be located more than 3 mm (5 mm recommended) away from
the two parallel sides of the LGA module (rework requirement), and other sides
with 0.6 mm. The minimum distance between the LGA module and the PCB edge
is 0.3 mm.



When the PCB layout is double sided, the module must be placed on the second
side for assembly; so as to avoid module dropped from PCB or component
(located in module) re-melding defects caused by uneven weight.

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Mechanical Specifications

Figure 6-4 PCB Layout (Unit: mm)

6.7 Thermal Design Solution
When the module works in the maximum power condition, the module has high power
consumption (for details, see Power Consumption). To improve the module reliability
and stability, focus on the thermal design of the device to speed up heat dissipation.
For thermal characteristics of the MU709 module, you can refer to Operating and
Storage Temperatures.
Take the following heat dissipation measures:


The copper size on the PCB should be 70 mm x 70 mm or larger.



All copper ground layers of the PCB must be connected to each other through
via-holes.



Increase the quantity of the PCB ground planes.



The ground planes should be as continuous as possible.



If a fan is deployed, place the module at the cold air inlet.



Use heat sink, thermal conductive material and product enclosure to enhance the
heat dissipation of the module.

Issue 09 (2017-12-15)

−

Use anodized heat sink on the shielding case or the customer PCB on bottom
side for optimal heat dissipation. The recommended heat sink dimensions are
70 mm x 70 mm x1 mm or larger.

−

The material of the heat sink should adopt the higher thermal conductivity
metallic materials, e.g. Al or Cu.

−

The recommended thermal conductivity of the thermal conductive material is
1.0 W/m-k or higher (recommended manufacturers: Laird or Bergquist).

−

Conductive material should obey the following rule: after the heat sink is
fastened to the shielding case, the compression amount of the thermal
conductive material accounts for 15% to 30% of the thermal conductive
material size.

HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide

Mechanical Specifications

−

Conductive material should be as thin as possible.

−

The recommended material of the enclosure is metallic materials, especially
you can add pin fin on the enclosure surface.

−

If the heat sink is installed above the shielding case, you should attach the
thermal conductive material between the shielding case and the heat sink; if
the heat sink is installed below the bottom side of the customer PCB, you
should attach the thermal conductive material between the customer PCB and
the heat sink, as shown in Figure 6-5 and Figure 6-6 . Preferably, we
recommend the heat sink be installed below the bottom side of the customer
PCB.

−

Use more pin fins to enlarge heat dissipation area.

Figure 6-5 Adding heat sink to the module for optimal heat dissipation
Shielding case
Module PCB

Heat sink
Conductive material
Customer PCB

Shielding case
Module PCB

Customer PCB
Conductive material
Heat sink

Figure 6-6 Adding enclosure to enhance the heat dissipation of the module
Shielding case
Module PCB

Enclosure
Conductive material
Heat sink

Customer PCB

Shielding case
Heat sink
Conductive material

Customer PCB

Enclosure
Module PCB

Issue 09 (2017-12-15)

HUAWEI MU709 Series HSPA+ LGA Module
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Mechanical Specifications

6.8 Assembly Processes
6.8.1 Overview


Tray modules are required at SMT lines, because LGA modules are placed on
ESD pallets.



Reflow ovens with at least seven temperature zones are recommended.



Use reflow ovens or rework stations for soldering, because LGA modules have
large solder pads and cannot be soldered manually.

6.8.2 Stencil Design
It is recommended that the stencil for the LGA module be 0.15 mm in thickness. For
the stencil design, see the following figure:
Figure 6-7 Recommended stencil design of LGA module (unit: mm)

The stencil design has been qualified for HUAWEI motherboard assembly, customers can
adjust the parameters by their motherboard design and process situation to assure LGA
soldering quality and no defect.

6.8.3 Reflow Profile
The LGA module must be reflowed on the top side of customer's development board.
For the soldering temperature of the LGA module, see the following figure.

Issue 09 (2017-12-15)

HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide

Mechanical Specifications

Figure 6-8 Reflow profile
°C
300

235°C 217°C)

(t3–t4): 45s–80s

Peak reflow temperature:
235°C–245°C

Cooling zone

Cooling rate: 2°C/s ≤ Slope ≤ 5°C/s

Issue 09 (2017-12-15)

HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide

Mechanical Specifications

6.9 Rework
6.9.1 Process of Rework

6.9.2 Preparations of Rework


Remove barrier or devices that can’t stand high temperature before rework.



If the device to be reworked is beyond the storage period, bake the device
according to Table 6-1 .

6.9.3 Removing of the Module
The solder is molten and reflowed through heating during the module removing
process. The heating rate must be quick but controllable in order to melt all the solder
joints simultaneously. Pay attention to protect the module, PCB, neighboring devices,
and their solder joints against heating or mechanical damages.

Issue 09 (2017-12-15)



The LGA module has many solder pads and the pads are large. Therefore, common
soldering irons and heat guns cannot be used in the rework. Rework must be done using
either infrared heating rework stations or hot air rework stations. Infrared heating rework
stations are preferred, because they can heat components without touching them. In
addition, infrared heating rework stations produce less solder debris and less impact on
modules, while hot air rework stations may cause shift of other components not to be
reworked.



You must not reuse the module after disassembly from PCB during rework.



It is proposed that a special clamp is used to remove the module.

HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide

Mechanical Specifications

Figure 6-9 Equipment used for rework

6.9.4 Welding Area Treatment
Step 1 Remove the old solder by using a soldering iron and solder braid that can wet the
solder.
Step 2 Clean the pad and remove the flux residuals.
Step 3 Solder pre-filling: Before the module is installed on a board, apply some solder paste
to the pad of the module by using the rework fixture and stencil or apply some solder
paste to the pad on the PCB by using a rework stencil.
It is recommended that a fixture and a mini-stencil be made to apply the solder paste in the
rework.

6.9.5 Module Installation
Install the module precisely on the motherboard and ensure the right installation
direction of the module and the reliability of the electrical connection with the PCB. It is
recommended that the module be preheated in order to ensure that the temperature
of all parts to be soldered is uniform during the reflow process. The solder quickly
reflows upon heating so the parts are soldered reliably. The solder joints undergo
proper reflow duration at a preset temperature to form a favorable Inter-metallic
Compound (IMC).


It is recommended that a special clamp be used to pick the module when the module is
installed on the pad after applied with some solder.



A special rework device must be used for the rework.

6.9.6 Specifications of Rework
Temperature parameter of rework: for either the removing or welding of the module,
the heating rate during the rework must be equal to or smaller than 3°C/s, and the
peak temperature between 240°C–250°C. The following parameters are
recommended during the rework.

Issue 09 (2017-12-15)

HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide

Mechanical Specifications

Figure 6-10 Temperature graph of rework

Issue 09 (2017-12-15)

HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide

Certifications

7.1 About This Chapter
This chapter gives a general description of certifications of the MU709 module.

7.2 Certifications
Table 7-1 shows certifications of the MU709 module have been implemented. For more
demands, please contact us for more details about this information.

Table 7-1 Product Certifications
Certification

Model name
MU709s-2

MU709s-6



RoHS



CCC



GCF



WEEE



FCC



PTCRB



Anetel



A-tick



NCC



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HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide

Safety Information

Read the safety information carefully to ensure the correct and safe use of your
wireless device. Applicable safety information must be observed.

8.1 Interference
Power off your wireless device if using the device is prohibited. Do not use the
wireless device when it causes danger or interference with electric devices.

8.2 Medical Device


Power off your wireless device and follow the rules and regulations set forth by
the hospitals and health care facilities.



Some wireless devices may affect the performance of the hearing aids. For any
such problems, consult your service provider.



Pacemaker manufacturers recommend that a minimum distance of 15 cm be
maintained between the wireless device and a pacemaker to prevent potential
interference with the pacemaker. If you are using an electronic medical device,
consult the doctor or device manufacturer to confirm whether the radio wave
affects the operation of this device.

8.3 Area with Inflammables and Explosives
To prevent explosions and fires in areas that are stored with inflammable and
explosive devices, power off your wireless device and observe the rules. Areas stored
with inflammables and explosives include but are not limited to the following:


Gas station



Fuel depot (such as the bunk below the deck of a ship)



Container/Vehicle for storing or transporting fuels or chemical products



Area where the air contains chemical substances and particles (such as granule,
dust, or metal powder)



Area indicated with the "Explosives" sign

Issue 09 (2017-12-15)

HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide

Safety Information



Area indicated with the "Power off bi-direction wireless equipment" sign



Area where you are generally suggested to stop the engine of a vehicle

8.4 Traffic Security


Observe local laws and regulations while using the wireless device. To prevent
accidents, do not use your wireless device while driving.



RF signals may affect electronic systems of motor vehicles. For more information,
consult the vehicle manufacturer.



In a motor vehicle, do not place the wireless device over the air bag or in the air
bag deployment area. Otherwise, the wireless device may hurt you owing to the
strong force when the air bag inflates.

8.5 Airline Security
Observe the rules and regulations of airline companies. When boarding or
approaching a plane, power off your wireless device. Otherwise, the radio signal of
the wireless device may interfere with the plane control signals.

8.6 Safety of Children
Do not allow children to use the wireless device without guidance. Small and sharp
components of the wireless device may cause danger to children or cause suffocation
if children swallow the components.

8.7 Environment Protection
Observe the local regulations regarding the disposal of your packaging materials,
used wireless device and accessories, and promote their recycling.

8.8 WEEE Approval
The wireless device is in compliance with the essential requirements and other
relevant provisions of the Waste Electrical and Electronic Equipment Directive
2012/19/EU (WEEE Directive).

8.9 RoHS Approval
The wireless device is in compliance with the restriction of the use of certain
hazardous substances in electrical and electronic equipment Directive 2011/65/EU
(RoHS Directive).

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HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide

Safety Information

8.10 Laws and Regulations Observance
Observe laws and regulations when using your wireless device. Respect the privacy
and legal rights of the others.

8.11 Care and Maintenance
It is normal that your wireless device gets hot when you use or charge it. Before you
clean or maintain the wireless device, stop all applications and power off the wireless
device.


Use your wireless device and accessories with care and in clean environment.
Keep the wireless device from a fire or a lit cigarette.



Protect your wireless device and accessories from water and vapour and keep
them dry.



Do not drop, throw or bend your wireless device.



Clean your wireless device with a piece of damp and soft antistatic cloth. Do not
use any chemical agents (such as alcohol and benzene), chemical detergent, or
powder to clean it.



Do not leave your wireless device and accessories in a place with a considerably
low or high temperature.



Use only accessories of the wireless device approved by the manufacture.
Contact the authorized service center for any abnormity of the wireless device or
accessories.



Do not dismantle the wireless device or accessories. Otherwise, the wireless
device and accessories are not covered by the warranty.



The device should be installed and operated with a minimum distance of 20 cm
between the radiator and your body.

8.12 Emergency Call
This wireless device functions through receiving and transmitting radio signals.
Therefore, the connection cannot be guaranteed in all conditions. In an emergency,
you should not rely solely on the wireless device for essential communications.

8.13 Regulatory Information
The following approvals and notices apply in specific regions as noted.

8.13.1 EU Regulatory Conformance
Statement
Hereby, Huawei Technologies Co., Ltd. declares that this device is in compliance with
the essential requirements and other relevant provisions of Directive 2014/53/EU.

Issue 09 (2017-12-15)

HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide

Safety Information

The most recent, effective version of the DoC (Declaration of Conformity) can be
viewed at http://consumer.huawei.com/certification.
This device may be operated in all member states of the EU.
Observe national and local regulations where the device is used.
This device may be restricted for use, depending on the local network.

Frequency Bands and Power
(a) Frequency bands in which the radio equipment operates: Some bands may not be
available in all countries or all areas. Please contact the local carrier for more details.
(b) Maximum radio-frequency power transmitted in the frequency bands in which the
radio equipment operates: The maximum power for all bands is less than the highest
limit value specified in the related Harmonized Standard.
The frequency bands and transmitting power (radiated and/or conducted) nominal
limits applicable to this radio equipment are as follows:
MU709s-2

GSM 900: 37 dBm, GSM 1800: 34 dBm, WCDMA 900/2100: 25.7 dBm

MU709s-6

GSM 900: 37 dBm, GSM 1800: 34 dBm, WCDMA 2100: 25.7 dBm

Software Information
Software updates will be released by the manufacturer to fix bugs or enhance
functions after the product has been released. All software versions released by the
manufacturer have been verified and are still compliant with the related rules.
All RF parameters (for example, frequency range and output power) are not
accessible to the user, and cannot be changed by the user.
For the most recent information about accessories and software, please see the DoC
(Declaration of Conformity) at http://consumer.huawei.com/certification.

8.13.2 FCC Statement
Federal Communications Commission Notice (United States): Before a wireless
device model is available for sale to the public, it must be tested and certified to the
FCC that it does not exceed the limit established by the government-adopted
requirement for safe exposure.
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) this device may not cause harmful interference, and (2)
this device must accept any interference received, including interference that may
cause undesired operation.
Warning: Changes or modifications made to this equipment not expressly approved
by HUAWEI may void the FCC authorization to operate this equipment.

Issue 09 (2017-12-15)

HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide

Appendix A Circuit of Typical Interface

J301

22pF

MAIN_ANT

C372

22pF

AUX_ANT

L313

L310

C371

GND

USIM_DATA

These are impedance matching
circuit, the specific capacitance
and inductance value needs to
be adjusted, based on the
characteristic impedance of
the practical PCB.

33pF

**33n

0Ω

**33n

R344

WL629D3_T01_TR_A
D310

22pF

SMA6251A1_060_20GHT50GH_50

C379
33pF

1uF

100nF

GND

SMF05CTC
6

C370

C362

C360

2 3 4 5

3
6
P3 P6

33pF

C365

2
5
P2 P5

0Ω
C361

R343

J302

1
4
P1 P4

C363

USIM_RESET
USIM_CLK

0Ω

R341
USIM_VCC
R342
0Ω

GND

J303
C366

L314

22pF

L311

1
2 3 4 5
SMA6251A1_060_20GHT50GH_50

LGA

94
95

Issue 09 (2017-12-15)

R330

C322
1uF

180K

C316

1 R327

100nF

C318

C317

VBAT-P-1

22uF

GND1
SHDN/RT

2.2uF

1uF

COMP

C310

30K

C319

LX1

5V-P-3
R331

R325

LX2

VDD

GND2

75K

PVDD2

ILIM
GND1

22pF

PGND

L303

GND2
PVDD1

FAULT

**10K

OUT

220pF

20K

C313 47K

R326

R324

U304
HPA00615DRVR

22uF

100nF

3
2
4
1

USB_DUSB_D+
R138

WAKEUP_IN_TO_MODULE

**10K
3C

VCC_EXT1

WAKEUP_IN_FROM_HOST

R117
**2.2K

**NPN-BEC
Q109
BC847ALT1
2

VBAT-P-1

RV303

C352

**220uF

C351

WAKEUP_IN_TO_MODULE

33
35

C354

L320

12
13

32
31
92

C321

C320
4.7uF
C307

C308

100nF

C306

80
75
73
79
77
74
78
76

11
71

U301
RT8015AGQW

2
150uF

22uF

C305

1MEG

100nF

C353

C354
RV302

**6.8pF

RV301

**6.8pF

C303

C304

C302

220uF

WAKEUP_IN
WAKEUP_OUT

R328

C350

NC
RESERVED

5V-P-2

62
63
64
65

85
86
84

**2.2pF

5V-P-3

NC
NC
NC
NC

VBAT
VBAT

USIM_CLK
USIM_DATA
USIM_DET
USIM_RESET
USIM_VCC

220uF

NC
NC

USB_DM
USB_DP
NC

C357

C353 and C354 are ready for dealing with filter differentia
l mode interference and C357 is ready for dealing with
filter common mode interference. You can choose
the value of the C353, C354 and C357 according to the actual
PCB which is integrated 30mm×30mm LGA Module.

220uF

41
40
39
38

RESERVED

USB_DUSB_D+

0
0

82
83

LED_MODE

NC
NC
UART1_RX
UART1_TX

GND

R301
R302

UART0_CTS
UART0_DCD
UART0_DSR
UART0_DTR
UART0_RING
UART0_RTS
UART0_RX
UART0_TX

5V-P-2

1
2
3
4
5

220uF C355

0.47K 101

NC
NC
NC
NC
NC

RESERVED
RESERVED
RESERVED
RESERVED

90
89
70
88
34

GND1

GND7

C356

R340

18
19
20
21
22

NC
NC
NC
NC
NC

USIM_CLK
USIM_DATA
USIM_DET
USIM_RESET
USIM_VCC

GND6

100nF

D311

23
24
25
26
27

NC
JTAG_TCK
JTAG_TDI
JTAG_TDO
JTAG_TMS
JTAG_TRST_N

68
9
10
66

SD_DATA0
SD_DATA1
SD_DATA2
SD_DATA3

D+

GND5

C357

VBAT

93
42
87
72
30
36

RESERVED
RESERVED

67
69

SD_CLK
SD_CMD

D-

GND4

10uF

LGA120H-3030A
Note: Pin 49, pin 53 and pin 57 do not
have pad in MU709s-2 module.

60
61

MU709_MISC

SLEEP_STATUS
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
GPIO
GPIO/SIM Switch
GPIO
GPIO
GPIO/Jamming Detection

117
118
119
120

VBUS

GND3

150uF

125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145

GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND

NC
NC
PS_HOLD

NC
NC
NC
NC

GND2

150uF

U302

GND
NOT used MU709_MISC
GND
GND
NOT used
GND
GND
NOT used
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND

MISC Interface of

48
49
50
52
53
54
56
57
58
59
106
108
110
112
114
116
121
122
123
124

15
28
29
43
44
45
46
51
55
105
109
113

U302

6
7
8
9
10
11

C358

17
16
14

RESERVED
RESERVED

5
8
6
7

33pF

102
104

PCM_SYNC
PCM_CLK
PCM_DIN
PCM_DOUT

99
98

C301

NC
NC

C358

POWER_ON_OFF
NC
NC
NC
RESIN_N

96
97

R345

81
103
47
37
100

NC
NC

150uF

POWER_ON_OFF_CTL

MAIN_ANT
AUX_ANT
NC

GND

USB_CONNECTOR

LGA120H-3030A

107
115
111

MISC Interface of

MAIN_ANT
AUX_ANT

**33n

GND

Note:"**" means that this component is not welded, but need to reserve component solder pad.

HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide

Appendix B Acronyms and
Abbreviations

Acronym or Abbreviation

Expansion

3GPP

Third Generation Partnership Project

8PSK

8 Phase Shift Keying

ADC

Analog To Digital Converter

AMPR

Additional Maximum Power Reduction

Access Point

AUX

Auxiliary

Band Class

BER

Bit Error Rate

BLER

Block Error Rate

BIOS

Basic Input Output System

CCC

China Compulsory Certification

CDMA

Code Division Multiple Access

European Conformity

CMOS

Complementary Metal Oxide Semiconductor

CPU

Central Processing Unit

Circuit Switched

Direct Current

DCE

Data Communication Equipment

Down Link

DMA

Direct Memory Access

Issue 09 (2017-12-15)

HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide

Appendix B Acronyms and
Abbreviations

Acronym or Abbreviation

Expansion

DTE

Data Terminal Equipment

DRX

Discontinuous Reception

DVK

Development Kit

ECC

Envelope Correlation Coefficient

EDGE

Enhanced Data Rate for GSM Evolution

EIA

Electronic Industries Association

EMC

Electromagnetic Compatibility

ENIG

Electroless Nickel Immersion Gold

EPA

Electrostatic Discharge Protected Area

ESD

Electrostatic Discharge

European Union

EVDO

Evolution Data Optimized

FCC

Federal Communications Commission

FDD

Frequency Division Duplex

GMSK

Gaussian Minimum Shift Keying

GPIO

General Purpose I/O

GPRS

General Packet Radio Service

GPS

Global Positioning System

GSM

Global System for Mobile Communication

GLONASS/GNSS

Global Navigation Satellite System

HBM

Human Body Model

HSDPA

High Speed Downlink Packet Access

HSPA

Enhanced High Speed Packet Access

HSUPA

High Speed Up-link Packet Access

Integrated Circuit

IMC

Inter Metallic Compound

IMT

International Mobile Telephony

ISO

International Standards Organization

JTAG

Joint Test Action Group

LCD

Liquid Crystal Display

Issue 09 (2017-12-15)

HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide

Appendix B Acronyms and
Abbreviations

Acronym or Abbreviation

Expansion

LCP

Liquid Crystal Polyester

LDO

Low Dropout Regulator

LED

Light Emitting Diode

LGA

Land Grid Array

LPF

Low Pass Filter

LTE

Long Term Evolution

MCP

Multi Chip Package

MCS

Modulation and Coding Scheme

MPR

Maximum Power Reduction

Mobile Originated

Mobile Terminated

Not Connected

NTC

Negative Temperature Coefficient

NSMD

Non Solder Mask Defined

Open Collector

Power Amplifier

PBCCH

Packet Broadcast Control Channel

PCB

Printed Circuit Board

PCL

Power Control Level

PCM

Pulse Code Modulation

PDU

Protocol Data Unit

PID

Product Identity

PMU

Power Management Unit

Packet Switched

QPSK

Quadrature Phase Shift Keying

Radio Frequency

Relative Humidity

RHCP

Right Hand Circular Polarization

RoHS

Restriction of the Use of Certain Hazardous
Substances

RSE

Radiated Spurious Emission

Issue 09 (2017-12-15)

HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide

Appendix B Acronyms and
Abbreviations

Acronym or Abbreviation

Expansion

RUIM

Removable User Identity Module

Receive

SAW

Surface Acoustic Wave

SCI

Slot Cycle Index

SIMO

Single Input Multiple Output

SMS

Short Message Service

SMT

Surface Mounting Technology

TBD

To Be Determined

TDD

Time Division Duplex

TD-SCDMA

Time Division-Synchronous Code Division Multiple
Access

TIS

Total Isotropic Sensitivity

TTFF

Time to First Fix

TVS

Transient Voltage Suppressor

Transmit

UART

Universal Asynchronous Receiver Transmitter

Up Link

UMTS

Universal Mobile Telecommunications System

USB

Universal Serial Bus

USIM

Universal Subscriber Identity Module

VID

Vendor Identity

VPP

Voltage Programming Power

VSWR

Voltage Standing Wave Ratio

WEEE

Waste Electrical and Electronic Equipment

WCDMA

Wideband Code Division Multiple Access

WWAN

Wireless Wide Area Network

Issue 09 (2017-12-15)

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