Huawei MU709 Series HSPA LGA Module Hardware Guide (V100R001 09, English)

HUAWEI MU709 Series HSPA+ LGA Module

Hardware Guide

Issue

09

Date

2017-12-15

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HUAWEI MU709 Series HSPA+ LGA Module

Hardware Guide

About This Document

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3

About This Document

Revision History

Document

Version

Date

Chapter

Descriptions

01

2014-07-16

Creation

02

2014-09-11

All

Deleted the Description of RESIN_N pin.

3.4.3

Updated Section 3.4.3: Reset the Module.

03

2014-09-18

3.4.3

Updated Section 3.4.3: Reset the Module.

04

2015-02-05

All

Added the Description of MU709s-6 Module.

05

2015-05-20

3.3.2

Updated Section 3.3.2: Power Supply VBAT

Interface.

06

2015-11-30

3.2

Updated the description of PS_HOLD signal

in Table 3-1.

3.3.2

Updated Section 3.3.2: Power Supply VBAT

Interface.

3.14

Added the description of PS_HOLD signal in

Section 3.14 Test Points Design.

3.5

Updated Section 3.5: UART Interface

6.5

Updated Section: 6.5 Packaging

07

2016-09-07

2

Updated Table 2-1 Features

3.7.1

Updated Table 3-10 USIM card interface

signals

3.7.2

Updated Figure 3-15 Circuit of the USIM

card interface

3.7.2

Updated Figure 3-16 Connections of the

USIM_DET pin

5.6

Updated EMC and ESD Features

6.4

Updated Dimensions (Unit: mm)

HUAWEI MU709 Series HSPA+ LGA Module

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About This Document

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Document

Version

Date

Chapter

Descriptions

6.5

Updated Packaging

6.6.2

Updated Figure 6-4 LGA module Footprint

design (Unit: mm)

6.8.2

Updated Stencil Design

6.9.3

Updated Equipment used for rework

08

2017-06-28

8.13.1

Updated section 8.13.1 EU Regulatory

Conformance

09

2017-12-15

 Deleted Privacy Policy

 Added Software Update

Scope

MU709s-2

MU709s-6

HUAWEI MU709 Series HSPA+ LGA Module

Hardware Guide

Contents

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Contents

1 Introduction.................................................................................................................................... 8

2 Overall Description ...................................................................................................................... 9

2.1 About This Chapter ........................................................................................................................... 9

2.2 Function Overview............................................................................................................................ 9

2.3 Circuit Block Diagram ..................................................................................................................... 10

2.4 Application Block Diagram ............................................................................................................. 12

3 Description of the Application Interfaces .............................................................................. 13

3.1 About This Chapter ......................................................................................................................... 13

3.2 LGA Interface ................................................................................................................................. 13

3.3 Power Interface .............................................................................................................................. 23

3.3.1 Overview ................................................................................................................................ 23

3.3.2 Power Supply VBAT Interface ............................................................................................... 24

3.3.3 Output Power Supply Interface ............................................................................................. 25

3.4 Signal Control Interface .................................................................................................................. 25

3.4.1 Overview ................................................................................................................................ 25

3.4.2 Power-on/off Pin .................................................................................................................... 26

3.4.3 RESIN_N ............................................................................................................................... 28

3.4.4 WAKEUP_IN Signal............................................................................................................... 29

3.4.5 WAKEUP_OUT Signal ........................................................................................................... 30

3.4.6 SLEEP_STATUS Signal ........................................................................................................ 30

3.4.7 LED_MODE Signal ................................................................................................................ 31

3.5 UART Interface ............................................................................................................................... 32

3.5.1 Overview ................................................................................................................................ 32

3.5.2 Circuit Recommended for the UART Interface ...................................................................... 33

3.6 USB Interface ................................................................................................................................. 34

3.7 USIM Card Interface ...................................................................................................................... 35

3.7.1 Overview ................................................................................................................................ 35

3.7.2 Circuit Recommended for the USIM Card Interface .............................................................. 36

3.8 Audio Interface ............................................................................................................................... 38

3.9 General Purpose I/O Interface ....................................................................................................... 40

3.10 JTAG Interface ............................................................................................................................. 41

3.11 RF Antenna Interface.................................................................................................................... 41

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Contents

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3.12 Reserved Interface ....................................................................................................................... 44

3.13 NC Interface ................................................................................................................................. 44

3.14 Test Points Design ........................................................................................................................ 45

4 RF Specifications ......................................................................................................................... 46

4.1 About This Chapter ......................................................................................................................... 46

4.2 Operating Frequencies ................................................................................................................... 46

4.3 Conducted RF Measurement ......................................................................................................... 47

4.3.1 Test Environment ................................................................................................................... 47

4.3.2 Test Standards ....................................................................................................................... 47

4.4 Conducted Rx Sensitivity and Tx Power ........................................................................................ 47

4.4.1 Conducted Receive Sensitivity .............................................................................................. 47

4.4.2 Conducted Transmit Power ................................................................................................... 48

4.5 Antenna Design Requirements ...................................................................................................... 49

4.5.1 Antenna Design Indicators..................................................................................................... 49

4.5.2 Interference ........................................................................................................................... 52

4.5.3 Antenna Requirements .......................................................................................................... 52

5 Electrical and Reliability Features ........................................................................................... 54

5.1 About This Chapter ......................................................................................................................... 54

5.2 Absolute Ratings ............................................................................................................................ 54

5.3 Operating and Storage Temperatures and Humidity ...................................................................... 54

5.4 Power Supply Features .................................................................................................................. 55

5.4.1 Input Power Supply ............................................................................................................... 55

5.4.2 Power Consumption .............................................................................................................. 56

5.5 Reliability Features ......................................................................................................................... 60

5.6 EMC and ESD Features ................................................................................................................. 63

6 Mechanical Specifications ......................................................................................................... 65

6.1 About This Chapter ......................................................................................................................... 65

6.2 Storage Requirement ..................................................................................................................... 65

6.3 Moisture Sensitivity ........................................................................................................................ 65

6.4 Dimensions and Interfaces ............................................................................................................. 66

6.5 Packaging ....................................................................................................................................... 66

6.6 Customer PCB Design ................................................................................................................... 68

6.6.1 PCB Surface Finish ............................................................................................................... 68

6.6.2 PCB Pad Design .................................................................................................................... 69

6.6.3 Solder Mask ........................................................................................................................... 69

6.6.4 Requirements on PCB Layout ............................................................................................... 69

6.7 Thermal Design Solution ................................................................................................................ 70

6.8 Assembly Processes ...................................................................................................................... 72

6.8.1 Overview ................................................................................................................................ 72

6.8.2 Stencil Design ........................................................................................................................ 72

6.8.3 Reflow Profile ........................................................................................................................ 72

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6.9 Rework ........................................................................................................................................... 74

6.9.1 Process of Rework ................................................................................................................ 74

6.9.2 Preparations of Rework ......................................................................................................... 74

6.9.3 Removing of the Module........................................................................................................ 74

6.9.4 Welding Area Treatment ........................................................................................................ 75

6.9.5 Module Installation ................................................................................................................. 75

6.9.6 Specifications of Rework ....................................................................................................... 75

7 Certifications ................................................................................................................................ 77

7.1 About This Chapter ......................................................................................................................... 77

7.2 Certifications ................................................................................................................................... 77

8 Safety Information ...................................................................................................................... 78

8.1 Interference .................................................................................................................................... 78

8.2 Medical Device ............................................................................................................................... 78

8.3 Area with Inflammables and Explosives ......................................................................................... 78

8.4 Traffic Security ................................................................................................................................ 79

8.5 Airline Security ................................................................................................................................ 79

8.6 Safety of Children ........................................................................................................................... 79

8.7 Environment Protection .................................................................................................................. 79

8.8 WEEE Approval .............................................................................................................................. 79

8.9 RoHS Approval ............................................................................................................................... 79

8.10 Laws and Regulations Observance ............................................................................................. 80

8.11 Care and Maintenance ................................................................................................................. 80

8.12 Emergency Call ............................................................................................................................ 80

8.13 Regulatory Information ................................................................................................................. 80

8.13.1 EU Regulatory Conformance .............................................................................................. 80

8.13.2 FCC Statement .................................................................................................................... 81

9 Appendix A Circuit of Typical Interface ................................................................................ 82

10 Appendix B Acronyms and Abbreviations .......................................................................... 83

HUAWEI MU709 Series HSPA+ LGA Module

Hardware Guide

Introduction

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1 Introduction

This document describes the hardware application interfaces and air interfaces

provided by HUAWEI MU709 series (MU709s-2 and MU709s-6) HSPA+ LGA module

(hereinafter referred to as the MU709 module).

This document helps hardware engineer to understand the interface specifications,

electrical features and related product information of the MU709 module.

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Hardware Guide

Overall Description

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2 Overall Description

2.1 About This Chapter

This chapter gives a general description of the MU709 module and provides:

- Function Overview

- Circuit Block Diagram

- Application Block Diagram

2.2 Function Overview

Table 2-1 Features

Feature

Description

Physical

Dimensions

- Dimensions (L × W × H): 30 mm × 30 mm × 2.27 mm

- Weight: about 5 g

Operating

Bands

MU709s-2:

- WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 8

- GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz

MU709s-6:

- WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 2, Band 5

- GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz

Operating

Temperature

Normal operating temperature: –20°C to +70°C

Extended operating temperature[1]: –40°C to +85°C

Storage

Temperature

–40°C to +85°C

Humidity

RH5% to RH95%

Power

Voltage

DC 3.3 V to 4.2 V (typical value is 3.8 V)

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Overall Description

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Feature

Description

AT

Commands

See the HUAWEI MU709 Series HSPA+ Module AT Command

Interface Specification.

Application

Interface

(145-pin LGA

interface)

One standard USIM (Class B and Class C) interface

Audio interface: PCM interface

USB 2.0 (High Speed)

UART interface:

- 8-wire UART0 x 1, up to 920 kbit/s

- 2-wire UART1 x 1 (This is only used for debugging)

GPIO

LED x 1

Power on/off interface

Hardware reset interface

JTAG interface

SLEEP_STATUS

WAKEUP_IN

WAKEUP_OUT

Antenna

Interface

WWAN MAIN antenna pad x1

WWAN AUX antenna pad x 1

SMS

New message alert

Management of SMS: read SMS, write SMS, send SMS, delete

SMS and list SMS

Supports MO and MT: Point-to-point

Data Services

GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s

EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s

WCDMA PS: UL 384 kbit/s; DL 384 kbit/s

HSPA+: UL 5.76 Mbit/s; DL 21.6 Mbit/s

[1]: When the MU709 module work in the range from –40°C to –20°C or +70°C to +85°C , NOT

all their RF performances comply with 3GPP specifications.

2.3 Circuit Block Diagram

Figure 2-1 shows the circuit block diagram of the MU709 module. The major

functional units of the MU709 module contain the following parts:

- Power management

- Baseband controller

- Nand flash

- RF Circuit

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Overall Description

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Figure 2-1 Circuit block diagram of the MU709 module

BB RFIC and

Front end circuits

LGA Interface

VBAT

USIM

Power on/off

GPIO

GND

PCM

USB

UART

JTAG

WAKE

Jamming Detection

USIM_Switch

USIM_DET

MAIN_ANT

AUX_ANT

LED

Nand flash

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2.4 Application Block Diagram

Figure 2-2 Application block diagram of the MU709 module

UART Interface:

The module supports 2 UART interfaces. One is 8-wire

UART0, and the other is 2-wire UART1 (only for debugging).

USB Interface:

The USB interface supports USB 2.0 high speed standard.

USIM Interface:

The USIM interface provides the interface for a USIM card.

External Power

Supply:

DC 3.8 V is recommended.

Audio Interface:

The module supports one PCM interface.

LED:

Indicates the work status.

RF Pad:

RF antenna interface.

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Description of the Application Interfaces

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3 Description of the Application Interfaces

3.1 About This Chapter

This chapter mainly describes the external application interfaces of the MU709

module, including:

- LGA Interface

- Power Interface

- Signal Control Interface

- UART Interface

- USB Interface

- USIM Card Interface

- Audio Interface

- General Purpose I/O Interface

- JTAG Interface

- RF Antenna Interface

- Reserved Interface

- NC Interface

- Test Points Design

3.2 LGA Interface

The MU709 module uses the 145-pin LGA as their external interface. For details

about the module and dimensions, see 6.4 Dimensions and Interfaces .

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Description of the Application Interfaces

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Figure 3-1 shows the sequence of pins on the 145-pin signal interface of the MU709

module.

Figure 3-1 Sequence of LGA interface (Top view)

Table 3-1 shows the definitions of pins on the 145-pin signal interface of the MU709

module.

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Description of the Application Interfaces

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Table 3-1 Definitions of pins on the LGA interface

No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

1

UART1_TX

O

UART1 transmit output

for debugging.

VOH

1.35

1.8

2.1

-

VOL

0

-

0.45

-

2

NC

-

Not connected

-

3

NC

-

Not connected

-

4

UART1_RX

I

UART1 receive data input

for debugging.

VIH

1.26

1.8

2.1

-

VIL

–0.3

-

0.63

-

5

PCM_SYNC

O

PCM sync

VOH

1.35

1.8

2.1

The pin is output

when the

module is used

as PCM master;

input when the

module is used

as PCM slave.

VOL

0

-

0.45

6

PCM_DIN

I

PCM data in

VIH

1.26

1.8

2.1

-

VIL

–0.3

-

0.63

7

PCM_DOUT

O

PCM data out

VOH

1.35

1.8

2.1

-

VOL

0

-

0.45

8

PCM_CLK

O

PCM clock

VOH

1.35

1.8

2.1

The pin is output

when the

module is used

as PCM master;

input when the

module is used

as PCM slave.

VOL

0

-

0.45

9

SD_DATA1

I/O

SD Card data signal.

Only used for debugging.

Please reserve this pin as

the test point.

VOH

2.25

3.0

3.3

-

VOL

0

-

0.75

VIH

2.1

3.0

3.3

VIL

–0.3

-

1.05

10

SD_DATA2

I/O

SD Card data signal.

Only used for debugging.

Please reserve this pin as

the test point.

VOH

2.25

3.0

3.3

-

VOL

0

-

0.75

VIH

2.1

3.0

3.3

VIL

–0.3

-

1.05

11

WAKEUP_I

N

I

Sleep authorization

signal.

H: Sleep mode is

VIH

1.26

1.8

2.1

-

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

disabled.

L: Sleep mode is enabled

(default value).

VIL

–0.3

-

0.63

The signal is

internally pulled

down. The

module will be

waked up when

it is externally

pulled up.

12

VBAT

PI

Power supply input.

The rising time of VBAT

must be greater than 100

us

-

3.3

3.8

4.2

-

13

VBAT

PI

Power supply input

The rising time of VBAT

must be greater than 100

us

-

3.3

3.8

4.2

-

14

PS_HOLD

I

Power supply hold signal

to the module.

VIH

1.26

1.8

2.1

Only used for

debugging.

Please reserve

the test point.

VIL

–0.3

-

0.63

15

SLEEP_STA

TUS

O

Sleep status indicator.

H: Module is in wakeup

state.

L: Module is in sleep

state.

VOH

1.35

1.8

2.1

-

VOL

0

-

0.45

-

16

NC

-

Not connected

-

17

NC

-

Not connected

-

18

NC

-

Not connected

-

19

NC

-

Not connected

-

20

NC

-

Not connected

-

21

NC

-

Not connected

-

22

NC

-

Not connected

-

23

NC

-

Not connected

-

24

NC

-

Not connected

-

25

NC

-

Not connected

-

26

NC

-

Not connected

-

27

NC

-

Not connected

-

28

Reserved

-

Reserved, please keep

this pin open.

-

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

29

Reserved

-

Reserved, please keep

this pin open.

-

30

JTAG_TMS

I

JTAG test mode select.

VIH

1.26

1.8

2.1

-

VIL

–0.3

-

0.63

-

31

Reserved

-

Reserved, please keep

this pin open.

-

32

VCC_EXT1

PO

1.8 V Power output

-

1.75

1.8

1.85

-

33

NC

-

Not connected

-

34

USIM_VCC

PO

Power supply for USIM

card.

-

–0.3

1.8

1.98

USIM_VCC=1.8

V

–0.3

3.0

3.3

USIM_VCC=3.0

V

35

Reserved

-

Reserved, please keep

this pin open.

-

36

JTAG_TRST

_N

I

JTAG reset

VIH

1.26

1.8

2.1

-

VIL

–0.3

-

0.63

-

37

NC

-

Not connected

-

38

NC

-

Not connected

-

39

NC

-

Not connected

-

40

NC

-

Not connected

-

41

NC

-

Not connected

-

42

JTAG_TCK

I

JTAG clock input

VIH

1.26

1.8

2.1

-

VIL

–0.3

-

0.63

-

43

Reserved

-

Reserved, please keep

this pin open.

-

44

Reserved

-

Reserved, please keep

this pin open.

-

45

Reserved

-

Reserved, please keep

this pin open.

-

46

Reserved

-

Reserved, please keep

this pin open.

-

47

NC

-

Not connected

-

48

GND

-

Ground

-

49

NOT USED

-

Do not design PAD

-

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

50

GND

-

Ground

-

51

GPIO2

I/O

General Purpose I/O

pins.

VOH

1.35

1.8

2.1

The function of

this pin has not

been defined.

VOL

0

-

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

-

0.63

52

GND

-

Ground

-

53

NOT USED

-

Do not design PAD

-

54

GND

-

Ground

-

55

GPIO5/USIM

Switch

I/O

General Purpose I/O pins

(Default) or USIM Switch

control signal.

VOH

1.35

1.8

2.1

The function of

this pin can be

defined as GPIO

or USIM Switch,

while the USIM

Switch should

be enabled by

AT command.

VOL

0

-

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

-

0.63

56

GND

-

Ground

-

57

NOT USED

-

Do not design PAD

-

58

GND

-

Ground

-

59

GND

-

Ground

-

60

Reserved

-

Reserved, please keep

this pin open.

-

61

Reserved

-

Reserved, please keep

this pin open.

-

62

Reserved

-

Reserved, please keep

this pin open.

-

63

Reserved

-

Reserved, please keep

this pin open.

-

64

Reserved

-

Reserved, please keep

this pin open.

-

65

Reserved

-

Reserved, please keep

this pin open.

-

66

SD_DATA3

I/O

SD Card data signal.

Only used for debugging.

Please reserve the test

point.

VOH

2.25

3.0

3.3

-

VOL

0

-

0.75

-

VIH

2.1

3.0

3.3

-

VIL

–0.3

-

1.05

-

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

67

SD_CLK

O

SD Card CLK signal.

Only used for debugging.

Please reserve the test

point.

VOH

2.25

3.0

3.3

-

VOL

0

-

0.75

-

68

SD_DATA0

I/O

SD Card data signal.

Only used for debugging.

Please reserve the test

point.

VOH

2.25

3.0

3.3

-

VOL

0

-

0.75

-

VIH

2.1

3.0

3.3

-

VIL

–0.3

-

1.05

-

69

SD_CMD

O

SD Card CMD signal.

Only used for debugging.

Please reserve the test

point.

VOH

2.25

3.0

3.3

-

VOL

0

-

0.75

-

70

USIM_DET

I

USIM Detection

VIH

1.26

1.8

2.1

The signal is

internally pulled

up. Keep

USIM_DET

floating, if it is

not used.

VIL

–0.3

-

0.63

71

WAKEUP_O

UT

O

Module to wake up the

host.

VOH

1.35

1.8

2.1

-

VOL

0

-

0.45

-

72

JTAG_TDO

O

JTAG test data output

VOH

1.35

1.8

2.1

-

VOL

0

-

0.45

-

73

UART0_DS

R

O

UART0 data set ready

VOH

1.35

1.8

2.1

-

VOL

0

-

0.45

-

74

UART0_RTS

O

UART0 ready for receive

VOH

1.35

1.8

2.1

-

VOL

0

-

0.45

-

75

UART0_DC

D

O

UART0 data carrier

detect

VOH

1.35

1.8

2.1

-

VOL

0

-

0.45

-

76

UART0_TX

O

UART0 transmit output

VOH

1.35

1.8

2.1

-

VOL

0

-

0.45

-

77

UART0_RIN

G

O

UART0 ring indicator

VOH

1.35

1.8

2.1

-

VOL

0

-

0.45

-

78

UART0_RX

I

UART0 receive data input

VIH

1.26

1.8

2.1

-

VIL

–0.3

-

0.63

-

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

79

UART0_DT

R

I

Data terminal ready

VIH

1.26

1.8

2.1

-

VIL

–0.3

-

0.63

-

80

UART0_CTS

I

UART0 clear to send

VIH

1.26

1.8

2.1

-

VIL

–0.3

-

0.63

-

81

POWER_ON

_OFF

I

System power-on or

power-off

VIH

1.26

1.8

2.1

-

VIL

–0.3

-

0.63

-

82

NC

-

Not connected

-

83

NC

-

Not connected

-

84

NC

-

Not connected

-

85

USB_DM

I/O

USB Data- defined in the

USB 2.0 Specification

-

86

USB_DP

I/O

USB Data+ defined in the

USB 2.0 Specification.

-

87

JTAG_TDI

I

JTAG test data input

VIH

1.26

1.8

2.1

-

VIL

–0.3

-

0.63

-

88

USIM_RESE

T

O

USIM card reset

VOH

0.7x

USIM

_VCC

-

3.3

USIM_VCC=1.8

V or 3.0 V

VOL

0

-

0.2x

USIM

_VCC

89

USIM_DATA

I/O

USIM card data

VOH

0.7 x

USIM

_VCC

-

3.3

USIM_VCC=1.8

V or 3.0 V

VOL

0

-

0.2 x

USIM

_VCC

VIH

0.65x

USIM

_VCC

-

3.30

VIL

0

-

0.25x

USIM

_VCC

90

USIM_CLK

O

USIM card clock

VOH

0.7 x

USIM

_VCC

-

3.3

USIM_VCC=1.8

V or 3.0 V

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

VOL

0

-

0.2 x

USIM

_VCC

91

Reserved

-

Reserved, please keep

this pin open.

-

92

SD_VCC

PO

SD Card Power.

Only used for debugging.

Please reserve the test

point.

-

2.9

3.0

3.1

-

93

NC

-

Not connected

-

94

NC

-

Not connected

-

95

NC

-

Not connected

-

96

NC

-

Not connected

-

97

NC

-

Not connected

-

98

NC

-

Not connected

-

99

NC

-

Not connected

-

100

RESIN_N

I

Reset module.

VIH

1.26

1.8

2.1

-

VIL

-0.3

-

0.63

101

LED_MODE

O

Mode indicator

Current sink

Drive strength: 10 mA

-

102

Reserved

-

Reserved, please keep

this pin open.

-

103

NC

-

Not connected

-

104

Reserved

-

Reserved, please keep

this pin open.

-

105

GPIO1

I/O

General Purpose I/O

pins.

VOH

1.35

1.8

2.1

The function of

this pin has not

been defined.

VOL

0

-

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

-

0.63

106

GND

-

Ground

-

107

MAIN_ANT

-

RF main antenna pad

-

108

GND

-

Ground

-

109

GPIO4

I/O

General Purpose I/O

VOH

1.35

1.8

2.1

The function of

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

pins.

VOL

0

-

0.45

this pin has not

been defined.

VIH

1.26

1.8

2.1

VIL

–0.3

-

0.63

110

GND

-

Ground

-

111

NC

-

Not connected

-

112

GND

-

Ground

-

113

GPIO3/Jam

ming-detecti

on

I/O

General Purpose I/O pins

(Default) or

Jamming-detection.

VOH

1.35

1.8

2.1

The function of

this pin can be

defined as GPIO

or

Jamming-detecti

on, while the

Jamming-detecti

on should be

enabled by AT

command.

VOL

0

-

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

-

0.63

114

GND

-

Ground

-

115

AUX_ANT

-

RF AUX antenna pad

-

116

GND

-

Ground

-

117

NC

-

Not connected

-

118

NC

-

Not connected

-

119

NC

-

Not connected

-

120

NC

-

Not connected

-

121

GND

-

Thermal Ground Pad

-

122

GND

-

Thermal Ground Pad

-

123

GND

-

Thermal Ground Pad

-

124

GND

-

Thermal Ground Pad

-

125

GND

-

Thermal Ground Pad

-

126

GND

-

Thermal Ground Pad

-

127

GND

-

Thermal Ground Pad

-

128

GND

-

Thermal Ground Pad

-

129

GND

-

Thermal Ground Pad

-

130

GND

-

Thermal Ground Pad

-

131

GND

-

Thermal Ground Pad

-

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

132

GND

-

Thermal Ground Pad

-

133

GND

-

Thermal Ground Pad

-

134

GND

-

Thermal Ground Pad

-

135

GND

-

Thermal Ground Pad

-

136

GND

-

Thermal Ground Pad

-

137

GND

-

Thermal Ground Pad

-

138

GND

-

Thermal Ground Pad

-

139

GND

-

Thermal Ground Pad

-

140

GND

-

Thermal Ground Pad

-

141

GND

-

Thermal Ground Pad

-

142

GND

-

Thermal Ground Pad

-

143

GND

-

Thermal Ground Pad

-

144

GND

-

Thermal Ground Pad

-

145

GND

-

Thermal Ground Pad

-

- I indicates pins for digital signal input; O indicates pins for digital signal output; PI indicates

power input pins; PO indicates power output pins.

- VIL indicates low-level input voltage; VIH indicates high-level input voltage; VOL indicates

low-level output voltage; VOH indicates high-level output voltage.

- The NC (Not Connected) pins are floating and there are no signal connected to these pins.

- The Reserved pins are internally connected to the module. Therefore, these pins should not

be used, otherwise they may cause problems. Please contact us for more details about this

information.

3.3 Power Interface

3.3.1 Overview

The power supply part of the MU709 module contains:

- VBAT pins for the power supply

- VCC_EXT1 pin for external power output with 1.8 V

- USIM_VCC pin for USIM card power output

- SD_VCC pin for SD card power output for debugging.

Table 3-2 lists the definitions of the pins on the power supply interface.

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Table 3-2 Definitions of the pins on the power supply interface

Pin No.

Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

12 and 13

VBAT

PI

Power supply

input.

The rising time of

VBAT must be

greater than 100

us

-

3.3

3.8

4.2

48, 50, 52,

54, 56, 58,

59, 106,

108, 110,

112, 114

and 116

GND

-

GND

-

32

VCC_E

XT1

PO

Pin for external

power output

-

1.75

1.8

1.85

-

34

USIM_

VCC

PO

Power supply for

USIM card

-

–0.3

1.8

1.98

USIM_VCC

=1.8 V

–0.3

3.0

3.3

USIM_VCC

=3.0 V

92

SD_VC

C

PO

SD Card Power.

Only used for

debugging.

Please reserve

the test point.

-

2.9

3.0

3.1

121–145

GND

-

Thermal Ground

Pad

-

3.3.2 Power Supply VBAT Interface

When the MU709 module works normally, power is supplied through the VBAT pins

and the voltage ranges from 3.3 V to 4.2 V (typical value: 3.8 V). The 145-pin LGA

provides two VBAT pins and some GND pins for external power input. To ensure that

the MU709 module works normally, all the pins must be used efficiently.

When the MU709 module is used for different external applications, pay special

attention to the design for the power supply. When the MU709 module works at 2G

mode and transmits signals at the maximum power, the transient current may reach

the transient peak value of about 2.75 A due to the differences in actual network

environments. In this case, the VBAT voltage drops. If you want wireless good

performance, please make sure that the voltage does not decrease below 3.3 V in any

case. Otherwise, exceptions such as restart of the MU709 module may occur.

A low-dropout (LDO) regulator or switch power with current output of more than 3 A is

recommended for external power supply. Furthermore, five 220 µF or above energy

storage capacitors are connected in parallel at the power interface of the MU709

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module. In addition, to reduce the impact of channel impedance on voltage drop, you

are recommended to try to shorten the power supply circuit of the VBAT interface.

It is recommended that customers add the EMI ferrite bead (FBMJ1608HS280NT

manufactured by TAIYO YUDEN or MPZ1608S300ATAH0 manufactured by TDK is

recommended) to directly isolate DTE from DCE in the power circuit. Figure 3-2

shows the recommended power circuit of MU709 module.

Figure 3-2 Recommended power circuit of MU709 module

When the system power restarts, a discharge circuit is recommended to make sure

the power voltage drops below 1.80 V for 1s at least.

The rising time of VBAT should be 100 µs at least. Otherwise, the module will be powered off.

3.3.3 Output Power Supply Interface

Output power supply interface is VCC_EXT1, USIM_VCC and SD_VCC.

Through VCC_EXT1, the module can supply 1.8 V power externally with an output

current of 10 mA (typical value) for external level conversion or other applications. If

the module is in sleep mode, the output power supply interface is in the low power

consumption state (< 500 μA). If the module is in power down mode, the output power

supply is in the disabled state.

Through the USIM_VCC power supply interface, the module can supply 1.8 V or 3 V

power to the USIM card.

The SD_VCC is SD card power that only used for debugging. Please reserve the test

point.

3.4 Signal Control Interface

3.4.1 Overview

The signal control part of the interface on the MU709 module consists of the following:

- Power on/off (POWER_ON_OFF) pin

- System reset (RESIN_N) pin

- WAKEUP_IN signal (WAKEUP_IN) pin

- WAKEUP_OUT signal (WAKEUP_OUT) pin

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- SLEEP_STATUS signal (SLEEP_STATUS) pin

- LED signal (LED_MODE) pin

Table 3-3 lists the pins on the signal control interface.

Table 3-3 Definitions of the pins on the signal control interface

No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

81

POWER_

ON_OFF

I

System power-on and

power-off

VIH

1.26

1.8

2.1

VIL

–0.3

-

0.63

100

RESIN_N

I

Reset module.

VIH

1.26

1.8

2.1

VIL

–0.3

-

0.63

11

WAKEUP_

IN

I

Sleep authorization

signal

H: Sleep mode is

disabled

L: Sleep mode is

enabled (default

value)

VIH

1.26

1.8

2.1

The signal

is internally

pulled

down. The

module will

be waked

up when it

is

externally

pulled up.

VIL

–0.3

-

0.63

71

WAKEUP_

OUT

O

Module to wake up

the host.

H: Wake up the host,

the module hold 1s

high-level-voltage

pulse and then output

low-level-voltage

L: Do not wake up the

host (default value)

VOH

1.35

1.8

2.1

-

VOL

0

-

0.45

15

SLEEP_S

TATUS

O

Sleep status indicator

H: Module is in wake

state

L: Module is in sleep

state

VOH

1.35

1.8

2.1

-

VOL

0

-

0.45

-

101

LED_MOD

E

O

Mode indicator

Current sink

Drive strength: 10 mA

-

3.4.2 Power-on/off Pin

The MU709 module can be controlled to power on/off by the POWER_ON_OFF pin.

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Table 3-4 Two states of POWER_ON_OFF

Item

Pin state

Description

1

Low (when MU709

module is in power off

state.)

MU709 module is powered on.

POWER_ON_OFF pin should be pulled down for

1.0s at least.

2

Low (when MU709

module is in power on

state.)

MU709 module is powered off.

POWER_ON_OFF pin should be pulled down for

4.0s at least.

Figure 3-3 Connections of the POWER_ON_OFF pin

Power-On Time Sequence

After VBAT has been applied and is stable, the POWER_ON_OFF signal is pulled

down, and then the module will boot up.

During power on timing, please make sure the VBAT is stable.

Figure 3-4 Power on timing sequence

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Table 3-5 Power on timing

Parameter

Comments

Time (Nominal values)

Units

TPON

POWER_ON_OFF turn on time.

> 1.0

s

TPD+

POWER_ON_OFF Valid to USB

D+ high

About 7.0

s

If the DTE needs to detect the PID/VID of module during the BIOS phase, the

detection time should exceed the TPD+ time.

Power-Off Time Sequence

Figure 3-5 Power off timing sequence

Table 3-6 Power off timing

Parameter

Comments

Time (Nominal values)

Units

TPOFF

POWER_ON_OFF turn off time.

> 4.0

s

TPD+

POWER_ON_OFF Valid to USB

D+ low

> 4.0

s

3.4.3 RESIN_N

The RESIN_N pin is used to reset the module's system. When the software stops

responding, the RESIN_N pin can be pulled down to reset the hardware.

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Figure 3-6 Connections of the RESIN_N pin

As the RESIN_N and POWER_ON_OFF signals are relatively sensitive, it is

recommended that you install a 10 nF–0.1 µF capacitor near the RESIN_N and

POWER_ON_OFF pins of the interface for filtering. In addition, when you design a

circuit on the PCB of the interface board, it is recommended that the circuit length not

exceed 20 mm and that the circuit be kept at a distance of 2.54 mm (100 mil) at least

from the PCB edge. Furthermore, you need to wrap the area adjacent to the signal

wire with a ground wire. Otherwise, the module may be reset due to interference.

The MU709 module supports hardware reset function. If the software of the MU709

module stops responding, you can reset the hardware through the RESIN_N signal as

shown in Figure 3-7 .When a low-level pulse is supplied through the RESIN_N pin, the

hardware will be reset. After the hardware is reset, the software starts powering on the

module and reports relevant information according to the actual settings. For example,

the AT command automatically reports ^SYSSTART.

Figure 3-7 Reset pulse timing

The RESIN_N pin must not be pulled down for more than 1s. Otherwise, the module will be

powered off.

3.4.4 WAKEUP_IN Signal

WAKEUP_IN pin is the authorization signal of MU709 entering sleep mode. It is

internally pulled down, so it can be floating if not used.

Table 3-3 shows the definition of the WAKEUP_IN signal.

The module cannot enter sleep mode when this pin is pulled up (1.8 V), and the

module should be waked up when the pin is pulled up for 1s.

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Figure 3-8 Connections of the WAKEUP_IN pin

3.4.5 WAKEUP_OUT Signal

The WAKEUP_OUT signal is used to wake up the external devices.

Table 3-3 shows the definition of the WAKEUP_OUT signal.

Figure 3-9 shows recommended circuit of the WAKEUP_OUT pin.

Figure 3-9 Connections of the WAKEUP_OUT pin

3.4.6 SLEEP_STATUS Signal

SLEEP_STATUS signal is used to indicate the sleep status of MU709 module. The

external devices can get to know whether the module is in sleep mode by reading

SLEEP_STATUS pin.

When SLEEP_STATUS pin is in high level, MU709 module is in wakeup state.

When SLEEP_STATUS pin is in low level, MU709 module is in sleep state.

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Figure 3-10 shows recommended circuit of the SLEEP_STATUS pin.

Figure 3-10 Connections of the SLEEP_STATUS pin

3.4.7 LED_MODE Signal

MU709 module provides an LED_MODE signal to indicate the work status.

Table 3-7 State of the LED_MODE pin

No.

Operating Status

LED_MODE

1

No service/Restricted service

Outputs: low (0.1s)-high (0.1s)-low

(0.1s)-high (1.7s)

2s cycle

2

Register to the network

Outputs: low (0.1s)-high (1.9s)

2s cycle

3

Dial-up successfully

Outputs: low

Figure 3-11 shows the recommended circuits of the LED_MODE pin. According to

LED feature, you can adjust the LED brightness by adjusting the resistance of resistor

R. The mode indicator (LED_MODE) is current sink. Drive strength: 10 mA.

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Figure 3-11 Driving circuit

LED_MODE

Module

(DCE)

RVFIF

VBAT

3.5 UART Interface

3.5.1 Overview

The MU709 module provides the UART0 (8-wire UART) interface for one

asynchronous communication channel. As the UART0 interface supports signal

control through standard modem handshake, AT commands are entered and serial

communication is performed through the UART0 interface. The UART have the

following features:

- Full-duplex

- 7-bit or 8-bit data

- 1-bit or 2-bit stop bit

- Odd parity check, even parity check, or non-check

- Baud rate clock generated by the system clock

- Direct memory access (DMA) transmission

- Supported baud rate: 9600 bit/s, 19200 bit/s, 38400 bit/s, 57600 bit/s, 115200

bit/s (default), 230400 bit/s, 460800 bit/s and 921600 bit/s

The 2-wire UART1 is for debugging only. Customers should layout two test points,

which are required for system troubleshooting and analysis.

Table 3-8 lists the UART interface signals.

Table 3-8 UART interface signals

No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

1

UART1_TX

O

UART1 transmit output for

debugging.

VOH

1.35

1.8

2.1

VOL

0

-

0.45

4

UART1_RX

I

UART1 receive data input for

VIH

1.26

1.8

2.1

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

debugging

VIL

–0.3

-

0.63

76

UART0_TX

O

UART0 transmit output

VOH

1.35

1.8

2.1

VOL

0

-

0.45

78

UART0_RX

I

UART0 receive data input

VIH

1.26

1.8

2.1

VIL

–0.3

-

0.63

77

UART0_RING

O

UART0 ring indicator

VOH

1.35

1.8

2.1

VOL

0

-

0.45

74

UART0_RTS

O

UART0 ready for receive

VOH

1.35

1.8

2.1

VOL

0

-

0.45

79

UART0_DTR

I

UART0 data terminal ready

VIH

1.26

1.8

2.1

VIL

–0.3

-

0.63

80

UART0_CTS

I

UART0 clear to send

VIH

1.26

1.8

2.1

VIL

–0.3

-

0.63

75

UART0_DCD

O

UART0 data carrier detect

VOH

1.35

1.8

2.1

VOL

0

-

0.45

73

UART0_DSR

O

UART0 data set ready

VOH

1.35

1.8

2.1

VOL

0

-

0.45

3.5.2 Circuit Recommended for the UART Interface

Figure 3-12 Connection of the UART interface in the MU709 module (DCE) with the host

(DTE)

UART0_RX

UART0_TX

UART0_RTS

UART0_CTS

UART1_RX

UART1_TX

UART0_DTR

UART0_DSR

UART0_DCD

UART0_RING

Module

(DCE)

test point

RXD

TXD

CTS

RTS

DTR

DSR

DCD Application

Device

(DTE)

RING

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The RS-232 chip (must support 921600 bit/s) can be used to connect the MU709

module with UART0. In this connection, the Complementary Metal Oxide

Semiconductor (CMOS) logic level and the Electronic Industries Association (EIA)

level are converted mutually.

- The UART0 cannot wake up the module from the sleep status, and you can pull up the

WAKE_IN signal for 1s instead.

- The level of RS-232 transceivers must match that of the MU709 module.

3.6 USB Interface

The MU709 module is compliant with USB 2.0 high speed protocol. The USB interface

is powered directly from the VBAT supply. The USB signal lines are compatible with

the USB 2.0 signal specifications. Figure 3-13 shows the circuit of the USB interface.

Table 3-9 Definition of the USB interface

No.

Pin Name

Pad

Type

Description

Parameter

Min.(

V)

Typ.(

V)

Max.(

V)

85

USB_DM

I/O

USB Data- defined in the

USB 2.0 Specification

-

86

USB_DP

I/O

USB Data+ defined in the

USB 2.0 Specification

-

According to USB protocol, for bus timing or electrical characteristics of MU709 USB

signal, please refer to the chapter 7.3.2 of Universal Serial Bus Specification 2.0.

Figure 3-13 Recommended circuit of USB interface

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- USB_DM and USB_DP are required to control the differential impedance 90 Ω (±10%).

- The length of the gap between USB_DM and USB_DP should not exceed 5 mil.

- The USB differential signal trace must be as short as possible, and laid out away from

high-speed clock signals and other periodic signals as far as possible.

- Minimize through-holes and turning angles on the USB signal trace to reduce signal

reflection and impedance change.

- Do not route the USB signal trace under the following components: crystal, oscillator, clock

circuit, electromagnetic component, and IC that uses or generates clocks.

- Avoid stubs on the USB signal trace because stubs generate reflection and affect the signal

quality.

- Route the USB signal trace on a complete reference plane (GND) and avoid crossing

inter-board gaps because inter-board gaps cause a large reflow channel area and increase

inductance and radiation. In addition, avoid signal traces on different layers.

- The USB signal trace must be far away from core logical components because the high

current pulse generated during the state transitions process of core components may

impose interference on signals.

- The USB signal trace must be far away from board edges with a minimum distance of 20 × h

(h indicates the vertical distance between the trace and the reference layer) to avoid signal

radiation.

- C1 and C2 are ready for dealing with filter differential mode interference and C3 is ready for

dealing with filter common mode interference. You can choose the value of the C1, C2 and

C3 according to the actual PCB which is integrated 30 mm × 30 mm LGA module

3.7 USIM Card Interface

3.7.1 Overview

The MU709 module provides a USIM card interface complying with the ISO 7816-3

standard and support both Class B and Class C USIM cards.

Table 3-10 USIM card interface signals

No.

Pin Name

Pad

Type

Description

Parameter

Min.(V)

Typ.

(V)

Max.(V)

Comments

88

USIM_RE

SET

O

USIM card

reset

VOH

0.7 x

USIM_VCC

-

3.3

USIM_VC

C=1.8 V or

3.0 V

VOL

0

-

0.2 x

USIM_

VCC

89

USIM_DA

TA

I/O

USIM card

data

VOH

0.7 x

USIM_VCC

-

3.3

USIM_VC

C=1.8 V or

3.0 V

VOL

0

-

0.2 x

USIM_

VCC

VIH

0.65 x

USIM_VCC

-

3.30

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No.

Pin Name

Pad

Type

Description

Parameter

Min.(V)

Typ.

(V)

Max.(V)

Comments

VIL

0

-

0.25 x

USIM_

VCC

90

USIM_CLK

O

USIM card

clock

VOH

0.7 x

USIM_VCC

-

3.3

USIM_VC

C=1.8 V or

3.0 V

VOL

0

-

0.2 x

USIM_

VCC

70

USIM_DE

T

I

USIM

Detection

VIH

1.26

1.8

2.1

The signal

is internally

pulled up.

Keep

USIM_DE

T floating,

if it is not

used.

VIL

–0.3

-

0.63

34

USIM_VC

C

PO

Power

supply for

USIM card

-

–0.3

1.8

1.98

USIM_VC

C=1.8 V

–0.3

3.0

3.3

USIM_VC

C=3.0 V

3.7.2 Circuit Recommended for the USIM Card Interface

As the MU709 module is not equipped with a USIM socket, you need to place a USIM

socket on the user interface board. Figure 3-14 shows the circuit of the USIM card

interface.

Figure 3-14 Circuit of the USIM card interface

USIM

Module

(DCE)

33 pF 33 pF 33 pF 33 pF

ESD protection

USIM-VCC

USIM-DET

USIM-CLK

USIM-DATA

USIM-RESET

100 nF 1 µF

0 Ω

470 pF

1 kΩ

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Figure 3-15 Pin definition of USIM Socket

Pin 1:

USIM_VCC

Pin 2:

USIM_RESET

Pin 3:

USIM_CLK

Pin 5:

GND

Pin 6:

VPP(Programming Voltage)

Pin 7:

USIM_DATA

Pin 9:

USIM_DET

Figure 3-16 Connections of the USIM_DET pin

Module

(DCE)

1.8 V

USIM_DET

USIM Socket

470 pF

CD

1 kΩ

CD is a pin detecting USIM card in the USIM socket.

- If the USIM card is present, USIM_DET pin should be high, and the CD is open.

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- If the USIM card is absent, USIM_DET pin should be low, and the CD is

connected to ground.

- To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic

compatibility (EMC) authentication, the USIM socket should be placed near the

LGA interface (it is recommended that the PCB circuit connects the LGA interface

and the USIM socket does not exceed 100 mm), because a long circuit may lead to

wave distortion, thus affecting signal quality.

- It is recommended that you wrap the area adjacent to the USIM_CLK and

USIM_DATA signal wires with ground. The Ground pin of the USIM socket and the

Ground pin of the USIM card must be well connected to the power Ground pin

supplying power to the MU709 module.

- A 100 nF capacitor and 1 μF capacitor are placed between the USIM_VCC and

GND pins in a parallel manner (If USIM_VCC circuit is too long, that the larger

capacitance such as 4.7 μF can be employed if necessary). Three 33 pF

capacitors are placed between the USIM_DATA and Ground pins, the

USIM_RESET and Ground pins, and the USIM_CLK and Ground pins in parallel to

filter interference from RF signals.

- It is recommended to take electrostatic discharge (ESD) protection measures near

the USIM socket. The TVS diode with Vrwm of 5 V and junction capacitance less

than 10 pF must be placed as close as possible to the USIM socket, and the

Ground pin of the ESD protection component is well connected to the power

Ground pin that supplies power to the MU709 module.

- It is recommended to place a 1 kΩ resistor in series on the USIM_DET interface for

ESD protection if USIM_DET is used.

3.8 Audio Interface

MU709 module provides one PCM digital audio interface. Table 3-11 lists the signals

on the digital audio interface.

Table 3-11 Signals on the digital audio interface

No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

5

PCM_SYNC

O

PCM sync

VOH

1.35

1.80

2.10

The pin is output when the

module is used as PCM

master; input when the

module is used as PCM

slave.

VOL

0

-

0.45

6

PCM_DIN

I

PCM data in

VIH

1.26

1.80

2.10

-

VIL

–0.30

-

0.63

7

PCM_DOUT

O

PCM data out

VOH

1.35

1.80

2.10

-

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No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

VOL

0

-

0.45

8

PCM_CLK

O

PCM clock

VOH

1.35

1.80

2.10

The pin is output when the

module is used as PCM

master; input when the

module is used as PCM

slave.

VOL

0

-

0.45

The MU709 PCM interface enables communication with an external codec to support

linear format.

Figure 3-17 Circuit diagram of the interface of the PCM (MU709 is used as PCM master)

Figure 3-18 Circuit diagram of the interface of the PCM (MU709 is used as PCM slave)

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- It is recommended that a TVS be used on the related interface, to prevent electrostatic

discharge and protect IC (Integrated Circuit) components.

- The signal level of CODEC must match that of the module.

3.9 General Purpose I/O Interface

The MU709 module provides GPIO pins for customers to use controlling signals which

are worked at 1.8 V CMOS logic levels. Customers can use AT command to control

the state of logic levels of 5 GPIO output signal. See the HUAWEI MU709 Series

HSPA+ Module AT Command Interface Specification.

Table 3-12 Signals on the GPIO interface

No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

Comments

55

GPIO5/USIM

Switch

I/O

General Purpose I/O

pins (Default) or USIM

Switch control signal.

VOH

1.35

1.8

2.1

The function of

this pin can be

defined as GPIO

or USIM Switch,

while the USIM

Switch should

be enabled by

AT command.

VOL

0

-

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

-

0.63

113

GPIO3/Jammi

ng-detection

I/O

General Purpose I/O

pins (Default) or

Jamming-detection.

VOH

1.35

1.8

2.1

The function of

this pin can be

defined as GPIO

or

Jamming-detecti

on, while the

Jamming-detecti

on should be

enabled by AT

command.

VOL

0

-

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

-

0.63

51,

105,

109

GPIO

I/O

General Purpose I/O

pins.

VOH

1.35

1.8

2.1

The function of

these pins has

not been

defined.

VOL

0

-

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

-

0.63

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3.10 JTAG Interface

The MU709 module provides Joint Test Action Group (JTAG) interface. Table 3-13

shows the signals on the JTAG interface. It is recommended that route out the 5 pins

as test points on the DTE for tracing and debugging.

Table 3-13 Signals on the JTAG interface

No.

Pin Name

Pad

Type

Description

Parameter

Min.(V)

Typ.(V)

Max.(V)

30

JTAG_TMS

I

JTAG test mode select

VIH

1.26

1.8

2.1

VIL

–0.3

-

0.63

36

JTAG_TRST_N

I

JTAG reset

VIH

1.26

1.8

2.1

VIL

–0.3

-

0.63

42

JTAG_TCK

I

JTAG clock input

VIH

1.26

1.8

2.1

VIL

–0.3

-

0.63

72

JTAG_TDO

O

JTAG test data output

VOH

1.35

1.8

2.1

VOL

0

-

0.45

87

JTAG_TDI

I

JTAG test data input

VIH

1.26

1.8

2.1

VIL

–0.3

-

0.63

3.11 RF Antenna Interface

The MU709 module provides two antenna pads (MAIN_ANT and AUX_ANT) for

connecting the external antennas.

Table 3-14 Definition of the antenna pads

No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

107

MAIN_ANT

-

RF MAIN antenna pad

-

115

AUX_ANT

-

RF AUX antenna pad

-

Route the antenna pad as close as possible to antenna connector. In addition, the

impedance of RF signal traces must be 50 Ω.

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Figure 3-19 RF signal trace design about MAIN_ANT for reference (the same for

AUX_ANT)

Figure 3-20 RF signal layout design about MAIN_ANT for reference (the same for

AUX_ANT)

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For the PCB designed by the user, the impedance of all the RF signal tracks must be

50 Ω. Generally, the impedance depends on the medium factor, track width, and

distance from the floor.

In order to reflect the rules of design, the following figures indicate the complete

structure of the microstrip and stripline with an impedance of 50 Ω as well as the

reference design for stack.

Figure 3-21 Complete structure of the microstrip

Figure 3-22 Complete structure of the stripline

Figure 3-23 Pad for the RF interface

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Figure 3-24 RF Pad design for MU709

Please use impedance simulation tool to calculate RF MAIN pad impedance. The RF

MAIN pad dimension of the module is 1.1 mm (L) x 0.9 mm (W). You can get the

impedance with lower than 50 Ω calculated by the impedance simulation tool. Since

the target impedance is 50 Ω for RF trace, the recommended solution is that to carve

out the copper area of the second layer that projected by the RF MAIN pad at top

layer. How many layers should be carved out depend on the PCB permittivity, track

width, and distance from the floor of your own PCB. Our target is to make the RF

MAIN pad impedance as closer to 50 Ω as possible.

3.12 Reserved Interface

The module provides some reserved pins. All reserved pins cannot be used by the

customer. All of them should be Not Connected.

Table 3-15 Reserved pin

Pin No.

Pin Name

Pad

Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

28, 29, 31, 35, 43–46,

60–65, 91, 102 and 104

Reserved

-

Reserved, please

keep this pin open.

-

3.13 NC Interface

The module has some NC pins. There is no signal connected to these pins.

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Table 3-16 NC pin

Pin No.

Pin Name

Pad Type

Description

Parameter

Min.

(V)

Typ.

(V)

Max.

(V)

2, 3, 16–27, 33, 37–41,

47, 82–84, 93–99, 103,

111, 117–120

NC

-

Not connected

-

3.14 Test Points Design

In the process of debugging when the module is embedded into the integrated

equipment, test points play an important role. Some problems related to the module

can be quickly resolved when test points are properly designed.

1. The test points below must be designed in the customer board:

- JTAG test points: it is the most common method of debugging.

- USB test points: USB is the most important communication channel between

module and AP (host). Not only test points should be placed, but also a 0 ohm

series resistor should be placed on USB_D+/USB_D- signal. The resistor can be

welded off when necessary, then the USB of module is cut off from AP and can be

connected to PC to do some analyses.

- POWER_ON_OFF, RESIN_N: they are some of the most important signals, test

points should be placed.

- UART1: UART1 is used for printing the log information.

- SD signals: SD signals are used for debugging.

- VBAT: not only test points should be placed, but also a series magnetic bead

should be placed on VBAT signal. The magnetic bead can be welded off when

necessary, then the power of module is cut off from customer board and can be

connected to external power to do analyses about problems related to power

interference.

- VCC_EXT1: to judge whether the module is powered on or not, just test the

VCC_EXT1.

- PS_HOLD: the pin is only used for debugging, please reserve this pin as the test

point.

2. The test points below should be placed according to the requirement in the

customer board: SLEEP_STATUS, GPIO, PCM, USIM, UART1, WAKEUP_IN

and WAKEUP_OUT, except the two cases below:

− The corresponding signal is not used.

− The corresponding signal is used, but there is already another place where

this signal can be tested, such as SIM socket pin.

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4 RF Specifications

4.1 About This Chapter

This chapter describes the RF specifications of the MU709 module, including:

- Operating Frequencies

- Conducted RF Measurement

- Conducted Rx Sensitivity and Tx Power

- Antenna Design Requirements

4.2 Operating Frequencies

Table 4-1 and Table 4-2 show the RF bands supported by MU709 module.

Table 4-1 RF bands of MU709s-2

Operating Band

Tx

Rx

UMTS Band 1

1920 MHz–1980 MHz

2110 MHz–2170 MHz

UMTS Band 8

880 MHz–915 MHz

925 MHz–960 MHz

GSM 850

824 MHz–849 MHz

869 MHz–894 MHz

GSM 900

880 MHz–915 MHz

925 MHz–960 MHz

GSM 1800

1710 MHz–1785 MHz

1805 MHz–1880 MHz

GSM 1900

1850 MHz–1910 MHz

1930 MHz–1990 MHz

Table 4-2 RF bands of MU709s-6

Operating Band

Tx

Rx

UMTS Band 1

1920 MHz–1980 MHz

2110 MHz–2170 MHz

UMTS Band 2

1850 MHz–1910 MHz

1930 MHz–1990 MHz

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Operating Band

Tx

Rx

UMTS Band 5

824 MHz–849 MHz

869 MHz–894 MHz

GSM 850

824 MHz–849 MHz

869 MHz–894 MHz

GSM 900

880 MHz–915 MHz

925 MHz–960 MHz

GSM 1800

1710 MHz–1785 MHz

1805 MHz–1880 MHz

GSM 1900

1850 MHz–1910 MHz

1930 MHz–1990 MHz

4.3 Conducted RF Measurement

4.3.1 Test Environment

Test instrument

R&S CMU200

Power supply

KEITHLEY 2306

RF cable for testing

L08-C014-350 of DRAKA COMTEQ or Rosenberger

Cable length: 29 cm

- The compensation for different frequency bands relates to the cable and the test

environment.

- The instrument compensation needs to be set according to the actual cable conditions.

4.3.2 Test Standards

Huawei modules meet 3GPP test standards. Each module passes strict tests at the

factory and thus the quality of the modules is guaranteed.

4.4 Conducted Rx Sensitivity and Tx Power

4.4.1 Conducted Receive Sensitivity

The conducted receive sensitivity is a key parameter that indicates the receiver

performance of MU709 module.

Table 4-3 MU709s-2 conducted Rx sensitivity

Band

Test Value (Unit: dBm)

Note

GSM 850

–110.5

BER Class II < 2.44%

GSM 900

–109

BER Class II < 2.44%

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Band

Test Value (Unit: dBm)

Note

GSM 1800

–108.5

BER Class II < 2.44%

GSM 1900

–108.5

BER Class II < 2.44%

WCDMA Band 1 Main RX

–110

BER < 0.1%

WCDMA Band 8 Main RX

–111.5

BER < 0.1%

Table 4-4 MU709s-6 conducted Rx sensitivity

Band

Test Value (Unit: dBm)

Note

GSM 850

–110.5

BER Class II < 2.44%

GSM 900

–109

BER Class II < 2.44%

GSM 1800

–108.5

BER Class II < 2.44%

GSM 1900

–108.5

BER Class II < 2.44%

WCDMA Band 1 Main RX

–110

BER < 0.1%

WCDMA Band 2 Main RX

–110.5

BER < 0.1%

WCDMA Band 5 Main RX

–111.5

BER < 0.1%

The test values are the average of some test samples.

4.4.2 Conducted Transmit Power

The conducted transmit power is another indicator that measures the performance of

MU709. The conducted transmit power refers to the maximum power that the module

tested at the antenna pad can transmit. According to the 3GPP protocol, the required

transmit power varies with the power class.

Table 4-5 and Table 4-6 list the required ranges of the conducted transmit power of

MU709 module.

Table 4-5 MU709s-2 conducted Tx power

Band

Typical Value (Unit: dBm)

Note (Unit: dB)

GSM 850

GMSK(1Tx Slot)

32.5

±1.5

8PSK(1Tx Slot)

27

±2

GSM 900

GMSK(1Tx Slot)

32.5

±1.5

8PSK(1Tx Slot)

27

±2

GSM 1800

GMSK(1Tx Slot)

29.5

±1.5

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Band

Typical Value (Unit: dBm)

Note (Unit: dB)

8PSK(1Tx Slot)

26

±2

GSM 1900

GMSK(1Tx Slot)

29.5

±1.5

8PSK(1Tx Slot)

26

±2

WCDMA Band 1

23.2

±1

WCDMA Band 8

23.2

-1.5/+1

Table 4-6 MU709s-6 conducted Tx power

Band

Typical Value (Unit: dBm)

Note (Unit: dB)

GSM 850

GMSK(1Tx Slot)

32.5

±1.5

8PSK(1Tx Slot)

27

±2

GSM 900

GMSK(1Tx Slot)

32.5

±1.5

8PSK(1Tx Slot)

27

±2

GSM 1800

GMSK(1Tx Slot)

29.5

±1.5

8PSK(1Tx Slot)

26

±2

GSM 1900

GMSK(1Tx Slot)

29.5

±1.5

8PSK(1Tx Slot)

26

±2

WCDMA Band 1

23.2

±1

WCDMA Band 2

23.2

±1

WCDMA Band 5

23.4

-1.5/+1

4.5 Antenna Design Requirements

4.5.1 Antenna Design Indicators

Antenna Efficiency

Antenna efficiency is the ratio of the input power to the radiated or received power of

an antenna. The radiated power of an antenna is always lower than the input power

due to the following antenna losses: return loss, material loss, and coupling loss. The

efficiency of an antenna relates to its electrical dimensions. To be specific, the

antenna efficiency increases with the electrical dimensions. In addition, the

transmission line from the antenna port of MU709 to the antenna is also part of the

antenna. The line loss increases with the line length and the frequency. It is

recommended that the line loss is as low as possible.

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The following antenna efficiency (free space) is recommended for MU709 to ensure

high radio performance of the module:

- Efficiency of the primary antenna: ≥ 40% (below 960 MHz); ≥ 50% (over 1710

MHz)

- Efficiency of the diversity antenna: ≥ half of the efficiency of the primary

antenna in receiving band

In addition, the efficiency should be tested with the transmission line.

S11(VSWR) and S21

S11 indicates the degree to which the input impedance of an antenna matches the

reference impedance (50 Ω). S11 shows the resonance feature and impedance

bandwidth of an antenna. Voltage Standing Wave Ratio (VSWR) is another

expression of S11. S11 relates to the antenna efficiency. S11 can be measured with a

vector analyzer.

The following S11 values are recommended for the antenna of the module:

- S11 of the primary antenna ≤ –6 dB

- S11 of the diversity antenna ≤ –6 dB

In addition, S11 is less important than the efficiency, and S11 has weak correlation to

wireless performance.

S21 indicates the isolation between two antennas.

Isolation

For a wireless device with multiple antennas, the power of different antennas is

coupled with each other. Antenna isolation is used to measure the power coupling.

The power radiated by an antenna might be received by an adjacent antenna, which

decreases the antenna radiation efficiency and affects the running of other devices. To

avoid this problem, evaluate the antenna isolation as sufficiently as possible at the

early stage of antenna design.

Antenna isolation depends on the following factors:

- Distance between antennas

- Antenna type

- Antenna direction

The primary antenna must be placed as near as possible to the module to minimize

the line length. The diversity antenna needs to be installed perpendicularly to the

primary antenna. The diversity antenna can be placed farther away from the module.

Antenna isolation can be measured with a two-port vector network analyzer.

The following antenna isolation is recommended for the antennas:

- Isolation between the primary and diversity antennas ≤ –12 dB

- Isolation between the primary (diversity) antenna and the Wi-Fi antenna ≤ –15 dB

Polarization

The polarization of an antenna is the orientation of the electric field vector that rotates

with time in the direction of maximum radiation.

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The linear polarization is recommended for the antenna of MU709.

Radiation Pattern

The radiation pattern of an antenna reflects the radiation features of the antenna in the

remote field region. The radiation pattern of an antenna commonly describes the

power or field strength of the radiated electromagnetic waves in various directions

from the antenna. The power or field strength varies with the angular coordinates (θ

and φ), but is independent of the radial coordinates.

The radiation pattern of half wave dipole antennas is omnidirectional in the horizontal

plane, and the incident waves of base stations are often in the horizontal plane. For

this reason, the receiving performance is optimal.

The following radiation patterns are recommended for the antenna of MU709.

Primary/diversity antenna: omnidirectional

In addition, the diversity antenna’s pattern should be complementary with the primary

antenna's pattern.

Envelope Correlation Coefficient

ECC is short for Envelope Correlation Coefficient. It is the cross-correlation value of

the complex patterns of the master and diversity antenna. It indicates how similar the

magnitude and the phase patterns of the two antennas are. If two antennas have no

similarity, the ECC should be zero. Actually, the less ECC, the better diversity

performance.

The following ECC is recommended for MU709 LGA module.

- ECC ≤ 0.5 (working frequency below 0.96 GHz)

- ECC ≤ 0.3 (working frequency above 1.4 GHz)

Gain and Directivity

The radiation pattern of an antenna represents the field strength of the radiated

electromagnetic waves in all directions, but not the power density that the antenna

radiates in the specific direction. The directivity of an antenna, however, measures the

power density that the antenna radiates.

Gain, as another important parameter of antennas, correlates closely to the directivity.

The gain of an antenna takes both the directivity and the efficiency of the antenna into

account. The appropriate antenna gain prolongs the service life of relevant batteries.

The following antenna gain is recommended for MU709. Gain of the

primary/diversity antenna ≤ 2.5 dBi

- The antenna consists of the antenna body and the relevant RF transmission line. Take the

RF transmission line into account when measuring any of the preceding antenna indicators.

- Huawei cooperates with various famous antenna suppliers who are able to make

suggestions on antenna design, for example, Amphenol, Skycross, etc.

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4.5.2 Interference

Besides the antenna performance, the interference on the user board also affects the

radio performance (especially the TIS) of the module. To guarantee high performance

of the module, the interference sources on the user board must be properly controlled.

On the user board, there are various interference sources, such as the LCD, CPU,

audio circuits, and power supply. All the interference sources emit interference signals

that affect the normal operation of the module. For example, the module sensitivity

can be decreased due to interference signals. Therefore, during the design, you need

to consider how to reduce the effects of interference sources on the module. You can

take the following measures: Use an LCD with optimized performance; shield the LCD

interference signals; shield the signal cable of the board; or design filter circuits.

Huawei is able to make technical suggestions on radio performance improvement of

the module.

4.5.3 Antenna Requirements

The antenna for MU709 module must fulfill the following requirements:

Table 4-7 MU709s-2 module antenna requirements

GSM/WCDMA Antenna Requirements

Frequency range

Depending on frequency band(s) provided by the network

operator, the customer must use the most suitable

antenna for that/those band(s)

Bandwidth of primary

antenna

70 MHz in GSM 850

80 MHz in GSM 900

170 MHz in GSM 1800

140 MHz in GSM 1900

80 MHz in WCDMA Band 8

250 MHz in WCDMA Band 1

Bandwidth of

secondary antenna

35 MHz in WCDMA Band 8

60 MHz in WCDMA Band 1

Gain

≤ 2.5 dBi

Impedance

50 Ω

VSWR absolute max

≤ 3:1

VSWR recommended

≤ 2:1

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Table 4-8 MU709s-6 module antenna requirements

GSM/WCDMA Antenna Requirements

Frequency range

Depending on frequency band(s) provided by the network

operator, the customer must use the most suitable

antenna for that/those band(s)

Bandwidth of primary

antenna

70 MHz in GSM 850

80 MHz in GSM 900

170 MHz in GSM 1800

140 MHz in GSM 1900

70 MHZ in WCDMA Band 5

140 MHz in WCDMA Band 2

250 MHz in WCDMA Band 1

Bandwidth of

secondary antenna

25 MHz in WCDMA Band 5

60 MHz in WCDMA Band 2

60 MHz in WCDMA Band 1

Gain

≤ 2.5 dBi

Impedance

50 Ω

VSWR absolute max

≤ 3:1

VSWR recommended

≤ 2:1

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5 Electrical and Reliability Features

5.1 About This Chapter

This chapter describes the electrical and reliability features in the MU709 module,

including:

- Absolute Ratings

- Operating and Storage Temperatures

- Power Supply Features

- Reliability Features

- EMC and ESD Features

5.2 Absolute Ratings

Table 5-1 lists the absolute ratings for the MU709 module. Using the MU709 module

beyond these conditions may result in permanent damage to the module.

Table 5-1 Absolute ratings

Symbol

Specification

Min.

Max.

Unit

VBAT

External power voltage

–0.3

4.5

V

VI

Digital input voltage

–0.3

2.3

V

5.3 Operating and Storage Temperatures and Humidity

Table 5-2 lists the operating and storage temperatures for the MU709 module.

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Table 5-2 Operating and storage temperatures

Specification

Min.

Max.

Unit

Normal working temperature

–20

+70

°C

Extended temperature[1]

–40

+85

°C

Storage temperature

–40

+85

°C

Humidity

5

95

%

[1]: When the MU709 module works in the range from –40°C to –20°C or +70°C to +85°C , NOT

all their RF performances comply with 3GPP specifications.

5.4 Power Supply Features

5.4.1 Input Power Supply

Table 5-3 lists the requirements for input power of the MU709 module.

Table 5-3 Requirements for input power

Parameter

Min.

Typ.

Max.

Ripple

Unit

VBAT

3.3

3.8

4.2

0.1

V

Figure 5-1 Power Supply During Burst Emission

The VBAT minimum value must be guaranteed during the burst (with 2.75 A Peak in GPRS or

GSM mode).

Table 5-4 Requirements for input current

Power

Peak (Maximum)

Normal (Maximum)

VBAT

2750 mA

1100 mA

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5.4.2 Power Consumption

The power consumption in different scenarios are respectively listed in Table 5-5 to

Table 5-9 .

The power consumption listed in this section is tested when the power supply is

normal voltage (3.8 V) and all of Test values are measured at room temperature.

Table 5-5 Averaged power off DC power consumption

Description

Test Value (Unit: µA )

Notes/Configuration

Typical

Power off

30

Normal voltage (3.8 V) is ON while

power on event is not triggered.

Table 5-6 Averaged standby DC power consumption

Description

Bands

Test Value (Unit: mA)

Notes/Configuration

Typical

Sleep

HSPA/WCDMA

UMTS bands

2.7

Module is powered up

DRX cycle=7 (1.28s)

Module is registered on the

network.

USB is in suspend.

GPRS/EDGE

GSM bands

2.4

Module is powered up

MFRMS=5 (1.175s)

Module is registered on the

network.

USB is in suspend.

Idle

HSPA/WCDMA

UMTS bands

50

Module is powered up

DRX cycle=7 (1.28s)

Module is registered on the

network, no data is

transmitted

USB is in active.

GPRS/EDGE

GSM bands

50

Module is powered up

MFRMS=5 (1.175s)

Module is registered on the

network.

no data is transmitted

USB is in active.

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Table 5-7 Averaged Data Transmission DC power consumption of MU709s-2

(HSPA/WCDMA)

Description

Band

Test Value

(Unit: mA)

Notes/Configuration

WCDMA

Band 1

(IMT 2100)

210

0 dBm Tx Power

270

10 dBm Tx Power

590

23.5 dBm Tx Power

Band 8

(900 MHz)

220

0 dBm Tx Power

280

10 dBm Tx Power

610

23.5dBm Tx Power

HSPA

Band 1

(IMT 2100)

230

0 dBm Tx Power

300

10 dBm Tx Power

610

23.5 dBm Tx Power

Band 8

(900 MHz)

230

0 dBm Tx Power

300

10 dBm Tx Power

620

23.5 dBm Tx Power

Table 5-8 Averaged Data Transmission DC power consumption of MU709s-6

(HSPA/WCDMA)

Description

Band

Test Value

(Unit: mA)

Notes/Configuration

WCDMA

Band 1

(IMT 2100)

192

0 dBm Tx Power

228

10 dBm Tx Power

557

23.5 dBm Tx Power

Band 2

(1900 MHz)

189

0 dBm Tx Power

233

10 dBm Tx Power

600

23.5 dBm Tx Power

Band 5

(850 MHz)

188

0 dBm Tx Power

211

10 dBm Tx Power

521

23.5 dBm Tx Power

HSPA

Band 1

(IMT 2100)

201

0 dBm Tx Power

235

10 dBm Tx Power

577

23.5 dBm Tx Power

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Description

Band

Test Value

(Unit: mA)

Notes/Configuration

Band 2

(1900 MHz)

192

0 dBm Tx Power

241

10 dBm Tx Power

607

23.5 dBm Tx Power

Band 5

(850 MHz)

191

0 dBm Tx Power

223

10 dBm Tx Power

542

23.5 dBm Tx Power

Table 5-9 Averaged DC power consumption of MU709 module (GPRS/EDGE)

Description

Test Value

Units

PCL

Configuration

GPRS 850

270

mA

5

1 Up/1 Down

400

2 Up/1 Down

550

4 Up/1 Down

170

mA

10

1 Up/1 Down

200

2 Up/1 Down

300

4 Up/1 Down

GPRS 900

260

mA

5

1 Up/1 Down

370

2 Up/1 Down

520

4 Up/1 Down

160

mA

10

1 Up/1 Down

200

2 Up/1 Down

280

4 Up/1 Down

GPRS 1800

220

mA

0

1 Up/1 Down

300

2 Up/1 Down

400

4 Up/1 Down

150

mA

10

1 Up/1 Down

180

2 Up/1 Down

240

4 Up/1 Down

GPRS 1900

210

mA

0

1 Up/1 Down

310

2 Up/1 Down

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Description

Test Value

Units

PCL

Configuration

400

4 Up/1 Down

150

mA

10

1 Up/1 Down

180

2 Up/1 Down

250

4 Up/1 Down

EDGE 850

220

mA

8

1 Up/1 Down

300

2 Up/1 Down

420

4 Up/1 Down

170

mA

15

1 Up/1 Down

200

2 Up/1 Down

290

4 Up/1 Down

EDGE 900

220

mA

8

1 Up/1 Down

290

2 Up/1 Down

420

4 Up/1 Down

170

mA

15

1 Up/1 Down

200

2 Up/1 Down

280

4 Up/1 Down

EDGE 1800

200

mA

2

1 Up/1 Down

260

2 Up/1 Down

360

4 Up/1 Down

180

mA

10

1 Up/1 Down

230

2 Up/1 Down

340

4 Up/1 Down

EDGE 1900

200

mA

2

1 Up/1 Down

250

2 Up/1 Down

360

4 Up/1 Down

180

mA

10

1 Up/1 Down

240

2 Up/1 Down

340

4 Up/1 Down

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- All power consumption test configuration can be referenced by GSM Association Official

Document TS.09: Battery Life Measurement and Current Consumption Technique.

- Test condition: For Max. Tx. power, see 4.4.2 Conducted Transmit Power, which are listed in

Table 4-5 , for Max. data throughput, see 2.2 Function Overview, which are listed in Table

2-1 .

5.5 Reliability Features

Table 5-10 lists the test conditions and results of the reliability of the MU709 module.

Table 5-10 Test conditions and results of the reliability of the MU709 module

Item

Test Condition

Standard

Sample size

Results

Stress

Low-tempera

ture storage

- Temperature: –40ºC

- Operation mode: no

power, no package

- Test duration: 24 h

JESD22-A1

19-C

3 pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

High-temper

ature storage

- Temperature: 85ºC

- Operation mode: no

power, no package

- Test duration: 24 h

JESD22-A1

03-C

3 pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

Low-tempera

ture

operating

- Temperature: –40ºC

- Operation mode: working

with service connected

- Test duration: 24 h

IEC60068-

2-1

3 pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

High-temper

ature

operating

- Temperature: 85ºC

- Operation mode: working

with service connected

- Test duration: 24 h

JESD22-A1

08-C

3 pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

Temperature

cycle

operating

- High temperature: 85ºC

- Low temperature: –40ºC

- Operation mode: working

with service connected

- Test duration: 30 cycles;1

h+1 h/cycle

JESD22-A1

05-B

3pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

Damp heat

cycling

- High temperature: 55ºC

- Low temperature: 25ºC

- Humidity: 95%±3%

- Operation mode: working

with service connected

- Test duration: 6 cycles;

12 h+12 h/cycle

JESD22-A1

01-B

3 pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

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Item

Test Condition

Standard

Sample size

Results

Thermal

shock

- Low temperature: –40ºC

- High temperature: 85ºC

- Temperature change

interval: < 20s

- Operation mode: no

power

- Test duration: 100 cycles;

15 min+15 min/cycle

JESD22-A1

06-B

3 pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

Salty fog test

- Temperature: 35°C

- Density of the NaCl

solution: 5%±1%

- Operation mode: no

power, no package

- Test duration:

Spraying interval: 8 h

Exposing period after

removing the salty fog

environment: 16 h

JESD22-A1

07-B

3 pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

Sine

vibration

- Frequency range: 5 Hz to

200 Hz

- Acceleration: 1 Grms

- Frequency scan rate: 0.5

oct/min

- Operation mode: working

with service connected

- Test duration: 3 axial

directions. 2 h for each

axial direction.

JESD22-B1

03-B

3 pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

Shock test

- Half-sine wave shock

- Peak acceleration: 30

Grms

- Shock duration: 11 ms

- Operation mode: working

with service connected

- Test duration: 6 axial

directions. 3 shocks for

each axial direction.

JESD-B104

-C

3 pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

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Item

Test Condition

Standard

Sample size

Results

Drop test

- 0.8 m in height. Drop the

module on the marble

terrace with one surface

facing downwards, six

surfaces should be

tested.

- Operation mode: no

power, no package

IEC60068-

2-32

3 pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

Life

High

temperature

operating life

- Temperature: 85ºC

- Operation mode: working

with service connected

- Test duration: 168 h, 336

h, 500 h, 1000 h for

inspection point

JESD22-A1

08-B

50 pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

High

temperature

& high

humidity

- High temperature: 85ºC

- Humidity: 85%

- Operation mode: powered

on and no working

- Test duration: 168 h, 336

h, 500 h, 1000 h for

inspection point

JESD22-A1

10-B

50 pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

Temperature

cycle-Non

operating

- High temperature: 85ºC

- Low temperature: –40ºC

- Temperature change

slope: 6ºC/min

- Operation mode: no

power

- Test duration: 168 h,

336 h, 500 h, 1000 h for

inspection point

JESD22-A1

04-C

50 pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

ESD

HBM

(Human

Body Model)

- 2 kV (Class 1 B)

- Operation mode: no

power

JESD22-A1

14-D

3 pcs/group

Visual inspection:

ok

Function test: ok

RF specification: ok

ESD with

DVK (or

embedded in

the host)

- Contact Voltage: ±2 kV,

±4 kV

- Air Voltage: ±2 kV, ±4 kV,

±8 kV

- Operation mode: working

with service connected

IEC61000-

4-2

2 pcs

Visual inspection:

ok

Function test: ok

RF specification: ok

Groups ≥ 2

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5.6 EMC and ESD Features

The following are the EMC design comments:

- Attention should be paid to static control in the manufacture, assembly, packaging,

handling and storage process to reduce electrostatic damage to HUAWEI

module.

- RSE (Radiated Spurious Emission) may exceed the limit defined by EN301489 if

the antenna port is protected by TVS (Transient Voltage Suppressor), which is

resolved by making some adjustment on RF match circuit.

- TVS should be added on the USB port for ESD protection, and the parasitic

capacitance of TVS on D+/D- signal should be less than 2 pF. Common-mode

inductor should be added in parallel on D+/D- signal.

- TVS should be added on the USIM interface for ESD protection. The parasitic

capacitance of TVS on USIM signal should be less than 10 pF;

- Resistors in parallel and a 10nF capacitance should be added on RESIN_N and

POWER_ON_OFF signal to avoid shaking, and the distance between the

capacitor and the related pins should be less than 100 mil.

- A TVS should be added to the module power supply. It is recommended that the

TVS's Clamping Voltage (VCL) be smaller than 12 V and Peak Pulse Power (PPP)

at least 100 W.

- PCB routing should be V-type rather than T-type for TVS (Transient Voltage

Suppressor).

- An integrated ground plane is necessary for EMC design.

The following are the requirements of ESD environment control:

- The electrostatic discharge protected area (EPA) must have an ESD floor whose

surface resistance and system resistance are greater than 1 x 104 Ω while less

than 1 x 109 Ω.

- The EPA must have a sound ground system without loose ground wires, and the

ground resistance must be less than 4 Ω.

- The workbench for handling ESD sensitive components must be equipped with

common ground points, the wrist strap jack, and ESD pad. The resistance

between the jack and common ground point must be less than 4 Ω. The surface

resistance and system resistance of the ESD pad must be less than 1 x 109 Ω.

- The EPA must use the ESD two-circuit wrist strap, and the wrist strap must be

connected to the dedicated jack. The crocodile clip must not be connected to the

ground.

- The ESD sensitive components, the processing equipment, test equipment, tools,

and devices must be connected to the ground properly. The indexes are as

follows:

− Hard ground resistance < 4 Ω

− 1 x 105 Ω ≤ Soft ground resistance < 1 x 109 Ω

− 1 x 105 Ω ≤ ICT fixture soft ground resistance < 1 x 1011 Ω

− The electronic screwdriver and electronic soldering iron can be easily oxidized.

Their ground resistance must be less than 20 Ω.

- The parts of the equipment, devices, and tools that touch the ESD sensitive

components and moving parts that are close to the ESD sensitive components

must be made of ESD materials and have sound ground connection. The parts

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that are not made of ESD materials must be handled with ESD treatment, such

as painting the ESD coating or ionization treatment (check that the friction voltage

is less than 100 V).

- Key parts in the production equipment (parts that touch the ESD sensitive

components or parts that are within 30 cm away from the ESD sensitive

components), including the conveyor belt, conveyor chain, guide wheel, and SMT

nozzle, must all be made of ESD materials and be connected to the ground

properly (check that the friction voltage is less than 100 V).

- Engineers that touch IC chips, boards, modules, and other ESD sensitive

components and assemblies must wear ESD wrist straps, ESD gloves, or ESD

finger cots properly. Engineers that sit when handling the components must all

wear ESD wrist straps.

- Noticeable ESD warning signs must be attached to the packages and placement

areas of ESD sensitive components and assemblies.

- Boards and IC chips must not be stacked randomly or be placed with other ESD

components.

- Effective shielding measures must be taken on the ESD sensitive materials that

are transported or stored outside the EPA.

HUAWEI MU709 module does not include any protection against overvoltage.

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6 Mechanical Specifications

6.1 About This Chapter

This chapter describes the process design and mechanical specifications:

- Storage Requirement

- Moisture Sensitivity

- Dimensions and Interfaces

- Packaging

- Customer PCB Design

- Thermal Design Solution

- Assembly Processes

- Rework

6.2 Storage Requirement

The module must be stored and sealed properly in vacuum package under a

temperature below 40°C and the relative humidity less than 90% in order to ensure

the weldability within 12 months.

6.3 Moisture Sensitivity

- The moisture sensitivity is level 3.

- After unpacking, the module must be assembled within 168 hours under the

environmental conditions that the temperature is lower than 30°C and the relative

humidity is less than 60%. If the preceding conditions cannot be met, the module

needs to be baked according to the parameters specified in Table 6-1 .

Table 6-1 Baking parameters

Baking Temperature

Baking Condition

Baking Duration

Remarks

125°C ±5°C

Relative humidity ≤ 60%

8 hours

-

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Moving, storing, and processing the product must comply with IPC/JEDEC J-STD-033.

6.4 Dimensions and Interfaces

Figure 6-1 shows the dimensions in details.

Figure 6-1 Dimensions (Unit: mm)

6.5 Packaging

HUAWEI LGA module uses five layers ESD pallet, anti-vibration foam and vacuum

packing into cartons. The tray specification complies with Jedec_Tray_DGuide4-10D.

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Figure 6-2 ESD pallet (unit: mm)

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The following figure shows the packaging.

6.6 Customer PCB Design

6.6.1 PCB Surface Finish

The PCB surface finish recommended is Electroless Nickel Immersion Gold (ENIG).

Organic Solderability Preservative (OSP) may also be used, ENIG preferred.

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6.6.2 PCB Pad Design

To achieve assembly yields and solder joints of high reliability, it is recommended that

the PCB pad size be designed as follows:

Figure 6-3 MU709 Footprint design (Unit: mm)

6.6.3 Solder Mask

NSMD is recommended. In addition, the solder mask of the NSMD (Non-solder Mask

Defined) pad design is larger than the pad so the reliability of the solder joint can be

improved.

The solder mask must be 100 µm–150 µm larger than the pad, that is, the single side

of the solder mask must be 50 µm–75 µm larger than the pad. The specific size

depends on the processing capability of the PCB manufacturer.

6.6.4 Requirements on PCB Layout

- To reduce deformation, a thickness of at least 1.0 mm is recommended.

- Other devices must be located more than 3 mm (5 mm recommended) away from

the two parallel sides of the LGA module (rework requirement), and other sides

with 0.6 mm. The minimum distance between the LGA module and the PCB edge

is 0.3 mm.

- When the PCB layout is double sided, the module must be placed on the second

side for assembly; so as to avoid module dropped from PCB or component

(located in module) re-melding defects caused by uneven weight.

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Figure 6-4 PCB Layout (Unit: mm)

6.7 Thermal Design Solution

When the module works in the maximum power condition, the module has high power

consumption (for details, see Power Consumption). To improve the module reliability

and stability, focus on the thermal design of the device to speed up heat dissipation.

For thermal characteristics of the MU709 module, you can refer to Operating and

Storage Temperatures.

Take the following heat dissipation measures:

- The copper size on the PCB should be 70 mm x 70 mm or larger.

- All copper ground layers of the PCB must be connected to each other through

via-holes.

- Increase the quantity of the PCB ground planes.

- The ground planes should be as continuous as possible.

- If a fan is deployed, place the module at the cold air inlet.

- Use heat sink, thermal conductive material and product enclosure to enhance the

heat dissipation of the module.

− Use anodized heat sink on the shielding case or the customer PCB on bottom

side for optimal heat dissipation. The recommended heat sink dimensions are

70 mm x 70 mm x1 mm or larger.

− The material of the heat sink should adopt the higher thermal conductivity

metallic materials, e.g. Al or Cu.

− The recommended thermal conductivity of the thermal conductive material is

1.0 W/m-k or higher (recommended manufacturers: Laird or Bergquist).

− Conductive material should obey the following rule: after the heat sink is

fastened to the shielding case, the compression amount of the thermal

conductive material accounts for 15% to 30% of the thermal conductive

material size.

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− Conductive material should be as thin as possible.

− The recommended material of the enclosure is metallic materials, especially

you can add pin fin on the enclosure surface.

− If the heat sink is installed above the shielding case, you should attach the

thermal conductive material between the shielding case and the heat sink; if

the heat sink is installed below the bottom side of the customer PCB, you

should attach the thermal conductive material between the customer PCB and

the heat sink, as shown in Figure 6-5 and Figure 6-6 . Preferably, we

recommend the heat sink be installed below the bottom side of the customer

PCB.

− Use more pin fins to enlarge heat dissipation area.

Figure 6-5 Adding heat sink to the module for optimal heat dissipation

Module PCB Heat sink

Conductive material

Customer PCB

Module PCB

Heat sink

Conductive material

Customer PCB

Shielding case

Figure 6-6 Adding enclosure to enhance the heat dissipation of the module

Module PCB

Heat sink

Conductive material

Customer PCB Enclosure

Shielding case

Heat sink

Conductive material

Customer PCB Enclosure

Module PCB

Shielding case

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6.8 Assembly Processes

6.8.1 Overview

- Tray modules are required at SMT lines, because LGA modules are placed on

ESD pallets.

- Reflow ovens with at least seven temperature zones are recommended.

- Use reflow ovens or rework stations for soldering, because LGA modules have

large solder pads and cannot be soldered manually.

6.8.2 Stencil Design

It is recommended that the stencil for the LGA module be 0.15 mm in thickness. For

the stencil design, see the following figure:

Figure 6-7 Recommended stencil design of LGA module (unit: mm)

The stencil design has been qualified for HUAWEI motherboard assembly, customers can

adjust the parameters by their motherboard design and process situation to assure LGA

soldering quality and no defect.

6.8.3 Reflow Profile

The LGA module must be reflowed on the top side of customer's development board.

For the soldering temperature of the LGA module, see the following figure.

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Figure 6-8 Reflow profile

240

300

180

217

165

120

60

0s

°C

60s~100s 45s~80s

235°C<Tmax<245°C

Table 6-2 Reflow parameters

Temperature Zone

Time

Key Parameter

Preheat zone

(40°C–165°C)

-

Heating rate: 0.5°C/s–2°C/s

Soak zone

(165°C –217°C)

(t1–t2): 60s–100s

-

Reflow zone (> 217°C)

(t3–t4): 45s–80s

Peak reflow temperature:

235°C –245°C

Cooling zone

Cooling rate: 2°C/s ≤ Slope ≤ 5°C/s

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6.9 Rework

6.9.1 Process of Rework

6.9.2 Preparations of Rework

- Remove barrier or devices that can’t stand high temperature before rework.

- If the device to be reworked is beyond the storage period, bake the device

according to Table 6-1 .

6.9.3 Removing of the Module

The solder is molten and reflowed through heating during the module removing

process. The heating rate must be quick but controllable in order to melt all the solder

joints simultaneously. Pay attention to protect the module, PCB, neighboring devices,

and their solder joints against heating or mechanical damages.

- The LGA module has many solder pads and the pads are large. Therefore, common

soldering irons and heat guns cannot be used in the rework. Rework must be done using

either infrared heating rework stations or hot air rework stations. Infrared heating rework

stations are preferred, because they can heat components without touching them. In

addition, infrared heating rework stations produce less solder debris and less impact on

modules, while hot air rework stations may cause shift of other components not to be

reworked.

- You must not reuse the module after disassembly from PCB during rework.

- It is proposed that a special clamp is used to remove the module.

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Figure 6-9 Equipment used for rework

6.9.4 Welding Area Treatment

Step 1 Remove the old solder by using a soldering iron and solder braid that can wet the

solder.

Step 2 Clean the pad and remove the flux residuals.

Step 3 Solder pre-filling: Before the module is installed on a board, apply some solder paste

to the pad of the module by using the rework fixture and stencil or apply some solder

paste to the pad on the PCB by using a rework stencil.

It is recommended that a fixture and a mini-stencil be made to apply the solder paste in the

rework.

6.9.5 Module Installation

Install the module precisely on the motherboard and ensure the right installation

direction of the module and the reliability of the electrical connection with the PCB. It is

recommended that the module be preheated in order to ensure that the temperature

of all parts to be soldered is uniform during the reflow process. The solder quickly

reflows upon heating so the parts are soldered reliably. The solder joints undergo

proper reflow duration at a preset temperature to form a favorable Inter-metallic

Compound (IMC).

- It is recommended that a special clamp be used to pick the module when the module is

installed on the pad after applied with some solder.

- A special rework device must be used for the rework.

6.9.6 Specifications of Rework

Temperature parameter of rework: for either the removing or welding of the module,

the heating rate during the rework must be equal to or smaller than 3°C/s, and the

peak temperature between 240°C–250°C. The following parameters are

recommended during the rework.

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Figure 6-10 Temperature graph of rework

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Certifications

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7 Certifications

7.1 About This Chapter

This chapter gives a general description of certifications of the MU709 module.

7.2 Certifications

Table 7-1 shows certifications of the MU709 module have been implemented. For more

demands, please contact us for more details about this information.

Table 7-1 Product Certifications

Certification

Model name

MU709s-2

MU709s-6

CE



RoHS



CCC



-

GCF



WEEE



FCC

-



PTCRB

-



Anetel

-



A-tick

-



NCC



-

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Safety Information

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8 Safety Information

Read the safety information carefully to ensure the correct and safe use of your

wireless device. Applicable safety information must be observed.

8.1 Interference

Power off your wireless device if using the device is prohibited. Do not use the

wireless device when it causes danger or interference with electric devices.

8.2 Medical Device

- Power off your wireless device and follow the rules and regulations set forth by

the hospitals and health care facilities.

- Some wireless devices may affect the performance of the hearing aids. For any

such problems, consult your service provider.

- Pacemaker manufacturers recommend that a minimum distance of 15 cm be

maintained between the wireless device and a pacemaker to prevent potential

interference with the pacemaker. If you are using an electronic medical device,

consult the doctor or device manufacturer to confirm whether the radio wave

affects the operation of this device.

8.3 Area with Inflammables and Explosives

To prevent explosions and fires in areas that are stored with inflammable and

explosive devices, power off your wireless device and observe the rules. Areas stored

with inflammables and explosives include but are not limited to the following:

- Gas station

- Fuel depot (such as the bunk below the deck of a ship)

- Container/Vehicle for storing or transporting fuels or chemical products

- Area where the air contains chemical substances and particles (such as granule,

dust, or metal powder)

- Area indicated with the "Explosives" sign

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- Area indicated with the "Power off bi-direction wireless equipment" sign

- Area where you are generally suggested to stop the engine of a vehicle

8.4 Traffic Security

- Observe local laws and regulations while using the wireless device. To prevent

accidents, do not use your wireless device while driving.

- RF signals may affect electronic systems of motor vehicles. For more information,

consult the vehicle manufacturer.

- In a motor vehicle, do not place the wireless device over the air bag or in the air

bag deployment area. Otherwise, the wireless device may hurt you owing to the

strong force when the air bag inflates.

8.5 Airline Security

Observe the rules and regulations of airline companies. When boarding or

approaching a plane, power off your wireless device. Otherwise, the radio signal of

the wireless device may interfere with the plane control signals.

8.6 Safety of Children

Do not allow children to use the wireless device without guidance. Small and sharp

components of the wireless device may cause danger to children or cause suffocation

if children swallow the components.

8.7 Environment Protection

Observe the local regulations regarding the disposal of your packaging materials,

used wireless device and accessories, and promote their recycling.

8.8 WEEE Approval

The wireless device is in compliance with the essential requirements and other

relevant provisions of the Waste Electrical and Electronic Equipment Directive

2012/19/EU (WEEE Directive).

8.9 RoHS Approval

The wireless device is in compliance with the restriction of the use of certain

hazardous substances in electrical and electronic equipment Directive 2011/65/EU

(RoHS Directive).

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8.10 Laws and Regulations Observance

Observe laws and regulations when using your wireless device. Respect the privacy

and legal rights of the others.

8.11 Care and Maintenance

It is normal that your wireless device gets hot when you use or charge it. Before you

clean or maintain the wireless device, stop all applications and power off the wireless

device.

- Use your wireless device and accessories with care and in clean environment.

Keep the wireless device from a fire or a lit cigarette.

- Protect your wireless device and accessories from water and vapour and keep

them dry.

- Do not drop, throw or bend your wireless device.

- Clean your wireless device with a piece of damp and soft antistatic cloth. Do not

use any chemical agents (such as alcohol and benzene), chemical detergent, or

powder to clean it.

- Do not leave your wireless device and accessories in a place with a considerably

low or high temperature.

- Use only accessories of the wireless device approved by the manufacture.

Contact the authorized service center for any abnormity of the wireless device or

accessories.

- Do not dismantle the wireless device or accessories. Otherwise, the wireless

device and accessories are not covered by the warranty.

- The device should be installed and operated with a minimum distance of 20 cm

between the radiator and your body.

8.12 Emergency Call

This wireless device functions through receiving and transmitting radio signals.

Therefore, the connection cannot be guaranteed in all conditions. In an emergency,

you should not rely solely on the wireless device for essential communications.

8.13 Regulatory Information

The following approvals and notices apply in specific regions as noted.

8.13.1 EU Regulatory Conformance

Statement

Hereby, Huawei Technologies Co., Ltd. declares that this device is in compliance with

the essential requirements and other relevant provisions of Directive 2014/53/EU.

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The most recent, effective version of the DoC (Declaration of Conformity) can be

viewed at http://consumer.huawei.com/certification.

This device may be operated in all member states of the EU.

Observe national and local regulations where the device is used.

This device may be restricted for use, depending on the local network.

Frequency Bands and Power

(a) Frequency bands in which the radio equipment operates: Some bands may not be

available in all countries or all areas. Please contact the local carrier for more details.

(b) Maximum radio-frequency power transmitted in the frequency bands in which the

radio equipment operates: The maximum power for all bands is less than the highest

limit value specified in the related Harmonized Standard.

The frequency bands and transmitting power (radiated and/or conducted) nominal

limits applicable to this radio equipment are as follows:

MU709s-2

GSM 900: 37 dBm, GSM 1800: 34 dBm, WCDMA 900/2100: 25.7 dBm

MU709s-6

GSM 900: 37 dBm, GSM 1800: 34 dBm, WCDMA 2100: 25.7 dBm

Software Information

Software updates will be released by the manufacturer to fix bugs or enhance

functions after the product has been released. All software versions released by the

manufacturer have been verified and are still compliant with the related rules.

All RF parameters (for example, frequency range and output power) are not

accessible to the user, and cannot be changed by the user.

For the most recent information about accessories and software, please see the DoC

(Declaration of Conformity) at http://consumer.huawei.com/certification.

8.13.2 FCC Statement

Federal Communications Commission Notice (United States): Before a wireless

device model is available for sale to the public, it must be tested and certified to the

FCC that it does not exceed the limit established by the government-adopted

requirement for safe exposure.

This device complies with Part 15 of the FCC Rules. Operation is subject to the

following two conditions: (1) this device may not cause harmful interference, and (2)

this device must accept any interference received, including interference that may

cause undesired operation.

Warning: Changes or modifications made to this equipment not expressly approved

by HUAWEI may void the FCC authorization to operate this equipment.

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Appendix A Circuit of Typical Interface

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9Appendix A Circuit of Typical Interface

R330

**10K

U304

0HPA00615DRVR

5

3

6

4 7

2

1

OUT

ILIM

GND2

EN

IN

FAULT

GND1

R331 30K

L303 2.2uF

2

1

R328 1MEG

C322

1uF

C321

100nF

C320

4.7uF

C308

100nF

C307

100nF

C306

22uF

C305

150uF

12

+

C318

22uF

C316

100nF

C304

150uF

12

+

C319

22uF

C317

1uF

R327 180K

R32620K R325

75K

U301

0

RT8015AGQW

9

8

10

11

7

6 5

4

3

2

1

SHDN/RT

GND1

LX1

LX2

PGNDPVDD1

PVDD2

GND2

COMP

VDD

FB

C313220pF

C310

22pF

C303

150uF

12

+

C302

150uF

12

+

C301

150uF

12

+

R324

47K

U302

LGA120H-3030A

145

144

143

142

141

140

139

138

137

136

135

134

133

132

131

130

129

128

127

124

123

122

121

116

114

112

110

108

106

59

58

57

56

54

53

52

50

GND

48

NOT used

49

GND

NOT used

GND

NOT used

GND

GND 125

GND 126

GND

MISC Interface of

MU709_MISC

5V-P-2

VBAT-P-1

5V-P-3

USB_D+

USB_D-

C358

POWER_ON_OFF_CTL

USIM_CLK

MAIN_ANT

AUX_ANT

USIM_DATA

USIM_RESET

USIM_DET

USIM_VCC

U302

LGA120H-3030A

71

11

35

33

92

31

32

13

12

84

86

85

1

4

2

3

76

78

74

77

79

73

75

80

98

99

65

64

63

62

34

88

70

89

90

66

10

9

68

69

67

5

7

6

8

120

119

118

117

83

82

38

39

40

41

91

101

22

21

20

19

18

27

26

25

24

23

36

30

72

87

42

93

61

60

94

95

113

109

105

55

51

46

45

44

43

29

28

15

14

16

17

97

96

104

102

100

37

47

103

81

111

115

107 MAIN_ANT

AUX_ANT

POWER_ON_OFF

NC

RESIN_N

RESERVED

NC

PS_HOLD

SLEEP_STATUS

RESERVED

NC

RESERVED

GPIO

GPIO/SIM Switch

GPIO

GPIO/Jamming Detection

RESERVED

UART0_DSR

UART0_DTR

UART0_DCD

RESERVED

NC

JTAG_TCK

JTAG_TDI

JTAG_TDO

JTAG_TMS

JTAG_TRST_N

NC

RESERVED

NC

PCM_CLK

PCM_DIN

PCM_DOUT

PCM_SYNC

SD_CLK

SD_CMD

SD_DATA0

SD_DATA1

SD_DATA2

SD_DATA3

USIM_CLK

USIM_DATA

USIM_RESET

USIM_VCC

RESERVED

UART0_RING

NC

UART0_CTS

UART0_RTS

UART0_RX

UART0_TX

UART1_RX

UART1_TX

USB_DM

USB_DP

NC

VBAT

NC

RESERVED

WAKEUP_IN

WAKEUP_OUT

MISC Interface of

MU709_MISC

LGA

C370

1uF

C360

33pF

C361

33pF 33pF

D310

SMF05CTC

61

3 4

2 5

C363

33pF

J301

WL629D3_T01_TR_A

1

2

3

4

5

6

P6

P5

P4

P3

P2

P1

C362

100nF

GND

USIM_CLK USIM_DATA

USIM_RESET

C379

USIM_VCC

Note:"**" means that this component is not welded, but need to reserve component solder pad.

NC

LED_MODE

These are impedance matching

circuit, the specific capacitance

and inductance value needs to

be adjusted, based on the

characteristic impedance of

the practical PCB.

USB_CONNECTOR

7

6

3

2

1

9

5

4

11

10

8GND4

GND6

GND7

ID

GND1

GND5

VBUS

D-

D+

GND2

GND3

RV301

RV302

R301 0

R302 0

C353

**6.8pF

**6.8pF C354

C357 **2.2pF

GND

5V-P-2

USB_D+

USB_D-

C353 and C354 are ready for dealing with filter differentia

l mode interference and C357 is ready for dealing with

filter common mode interference. You can choose

the value of the C353, C354 and C357 according to the actual

PCB which is integrated 30mm×30mm LGA Module.

L320

C350

220uF

12

+

C351

220uF

12

+

C352**220uF

12

+

C355220uF

12

+

C354220uF

12

+

VBAT-P-1

C356

C357

C358

33pF

10uF

100nF

R117

**2.2K

Q109

BC847ALT1

**NPN-BEC

23

1B

C

**10KR138

VCC_EXT1 WAKEUP_IN_TO_MODULE

WAKEUP_IN_TO_MODULE

WAKEUP_IN_FROM_HOST

Note: Pin 49, pin 53 and pin 57 do not

have pad in MU709s-2 module.

0 Ω

b

c

e

R341

R342

R343 R344

R345 1K

0.47K

R340

VBAT

D311

NC

RV303

C372

C366

L310

L313

L314

L311

SMA6251A1_060_20GHT50GH_50

1

432 5

**33n

**33n **33n

GND

AUX_ANT

2 5

J302

C371

SMA6251A1_060_20GHT50GH_50

1

43

C365

J303

GND

MAIN_ANT

22pF

22pF 22pF

USIM_DET

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Appendix B Acronyms and

Abbreviations

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10 Appendix B Acronyms and

Abbreviations

Acronym or Abbreviation

Expansion

3GPP

Third Generation Partnership Project

8PSK

8 Phase Shift Keying

ADC

Analog To Digital Converter

AMPR

Additional Maximum Power Reduction

AP

Access Point

AUX

Auxiliary

BC

Band Class

BER

Bit Error Rate

BLER

Block Error Rate

BIOS

Basic Input Output System

CCC

China Compulsory Certification

CDMA

Code Division Multiple Access

CE

European Conformity

CMOS

Complementary Metal Oxide Semiconductor

CPU

Central Processing Unit

CS

Circuit Switched

DC

Direct Current

DCE

Data Communication Equipment

DL

Down Link

DMA

Direct Memory Access

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Appendix B Acronyms and

Abbreviations

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Acronym or Abbreviation

Expansion

DTE

Data Terminal Equipment

DRX

Discontinuous Reception

DVK

Development Kit

ECC

Envelope Correlation Coefficient

EDGE

Enhanced Data Rate for GSM Evolution

EIA

Electronic Industries Association

EMC

Electromagnetic Compatibility

ENIG

Electroless Nickel Immersion Gold

EPA

Electrostatic Discharge Protected Area

ESD

Electrostatic Discharge

EU

European Union

EVDO

Evolution Data Optimized

FCC

Federal Communications Commission

FDD

Frequency Division Duplex

GMSK

Gaussian Minimum Shift Keying

GPIO

General Purpose I/O

GPRS

General Packet Radio Service

GPS

Global Positioning System

GSM

Global System for Mobile Communication

GLONASS/GNSS

Global Navigation Satellite System

HBM

Human Body Model

HSDPA

High Speed Downlink Packet Access

HSPA

Enhanced High Speed Packet Access

HSUPA

High Speed Up-link Packet Access

IC

Integrated Circuit

IMC

Inter Metallic Compound

IMT

International Mobile Telephony

ISO

International Standards Organization

JTAG

Joint Test Action Group

LCD

Liquid Crystal Display

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Appendix B Acronyms and

Abbreviations

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Acronym or Abbreviation

Expansion

LCP

Liquid Crystal Polyester

LDO

Low Dropout Regulator

LED

Light Emitting Diode

LGA

Land Grid Array

LPF

Low Pass Filter

LTE

Long Term Evolution

MCP

Multi Chip Package

MCS

Modulation and Coding Scheme

MPR

Maximum Power Reduction

MO

Mobile Originated

MT

Mobile Terminated

NC

Not Connected

NTC

Negative Temperature Coefficient

NSMD

Non Solder Mask Defined

OC

Open Collector

PA

Power Amplifier

PBCCH

Packet Broadcast Control Channel

PCB

Printed Circuit Board

PCL

Power Control Level

PCM

Pulse Code Modulation

PDU

Protocol Data Unit

PID

Product Identity

PMU

Power Management Unit

PS

Packet Switched

QPSK

Quadrature Phase Shift Keying

RF

Radio Frequency

RH

Relative Humidity

RHCP

Right Hand Circular Polarization

RoHS

Restriction of the Use of Certain Hazardous

Substances

RSE

Radiated Spurious Emission

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Appendix B Acronyms and

Abbreviations

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Acronym or Abbreviation

Expansion

RUIM

Removable User Identity Module

RX

Receive

SAW

Surface Acoustic Wave

SCI

Slot Cycle Index

SIMO

Single Input Multiple Output

SMS

Short Message Service

SMT

Surface Mounting Technology

TBD

To Be Determined

TDD

Time Division Duplex

TD-SCDMA

Time Division-Synchronous Code Division Multiple

Access

TIS

Total Isotropic Sensitivity

TTFF

Time to First Fix

TVS

Transient Voltage Suppressor

TX

Transmit

UART

Universal Asynchronous Receiver Transmitter

UL

Up Link

UMTS

Universal Mobile Telecommunications System

USB

Universal Serial Bus

USIM

Universal Subscriber Identity Module

VID

Vendor Identity

VPP

Voltage Programming Power

VSWR

Voltage Standing Wave Ratio

WEEE

Waste Electrical and Electronic Equipment

WCDMA

Wideband Code Division Multiple Access

WWAN

Wireless Wide Area Network

Huawei MU709 Series HSPA LGA Module Hardware Guide (V100R001 09, English)

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