Huawei MU739 HSPA LGA Module Hardware Guide (V100R001 11, English)

2015-10-09

• Revision History
• 1 Introduction
• 2 Overall Description
  • 2.1 About This Chapter
  • 2.2 Function Overview
    • Table 2-1 Features
  • 2.3 Circuit Block Diagram
    • Figure 2-1 Circuit block diagram of the MU739 module
  • 2.4 Application Block Diagram
    • Figure 2-2 Application block diagram of the MU739 module
• 3 Description of the Application Interfaces
  • 3.1 About This Chapter
  • 3.2 LGA Interface
    • Figure 3-1 Bottom view of sequence of LGA interface pins
    • Table 3-1 Definitions of pins on the LGA interface
  • 3.3 Power Interface
    • 3.3.1 Overview
      • Table 3-2 Definitions of the pins on the power supply interface
    • 3.3.2 VBAT Interface
      • Figure 3-2 Recommended power circuit of MU739 module
  • 3.4 Signal Control Interface
    • 3.4.1 Overview
      • Table 3-3 Pins on the signal control interface
    • 3.4.2 Input Signal Control Pins
      • TURN ON
        • Figure 3-3 Connections of ON2_N pin
      • Power On Time
        • Figure 3-4 Power on timing sequence
        • Table 3-4 Power on timing
      • Power Off Time
        • Figure 3-5 Power supply time sequence for power cycling
      • RESET
        • Figure 3-6 Connections of RESET_BB_N and RESET_PMU_N pins
        • Figure 3-7 Reset timing
        • Table 3-5 Reset timing
      • W_DISABLE_N
        • Figure 3-8 W_DISABLE_N timing
      • WAKEUP_IN
        • Figure 3-9 WAKEUP_IN timing
      • USIM_DET
        • Table 3-6 Function of the USIM_DET pin
        • Figure 3-10 Connections of the USIM_DET pin
      • BODYSAR_N
        • Figure 3-11 Connections of the BodySAR_N pin
    • 3.4.3 Output Signal Control Pins
      • Table 3-7 List of the LED# pin
      • Figure 3-12 Driving circuit
      • Figure 3-13 LED Typical Electro-Optical Characteristics Curves
      • SLEEP_STATUS
      • WAKEUP_OUT
        • Figure 3-14 Connections of the WAKEUP_OUT pin
      • RESOUT_N
  • 3.5 USB Interface
    • Table 3-8 Definition of the USB interface
    • Figure 3-15 Recommended circuit of USB interface
  • 3.6 USIM Card Interface
    • 3.6.1 Overview
      • Table 3-9 USIM card interface signals
    • 3.6.2 Circuit Recommended for the USIM Card Interface
      • Figure 3-16 Circuit of the USIM card interface
  • 3.7 Audio Interface
    • Table 3-10 I2S interface signals
  • 3.8 JTAG Interface
    • Table 3-11 Signals on the JTAG interface
  • 3.9 RF Antenna Interface
    • Table 3-12 Signals on RF Antenna interface
  • 3.10 Reserved Interface
    • Table 3-13 Reserved pins
  • 3.11 NC Interface
    • Table 3-14 NC pins
• 4 RF Specifications
  • 4.1 About This Chapter
  • 4.2 Operating Frequencies
    • Table 4-1 RF bands
  • 4.3 Conducted RF Measurement
    • 4.3.1 Test Environment
    • 4.3.2 Test Standards
  • 4.4 Conducted Rx Sensitivity and Tx Power
    • 4.4.1 Conducted Receive Sensitivity
      • Table 4-2 MU739 conducted Rx sensitivity (Unit: dBm)
    • 4.4.2 Conducted Transmit Power
      • Table 4-3 MU739 conducted Tx power (Unit: dBm)
  • 4.5 Antenna Design Requirements
    • 4.5.1 Antenna Design Indicators
      • Antenna Efficiency
      • S11 or VSWR
      • Isolation
      • Envelope Correlation Coefficient
      • Polarization
      • Radiation Pattern
      • Gain and Directivity
    • 4.5.2 Interference
    • 4.5.3 GSM/WCDMA Antenna Requirements
• 5 Electrical and Reliability Features
  • 5.1 About This Chapter
  • 5.2 Absolute Ratings
    • Table 5-1 Absolute maximum ratings for the MU739 module
  • 5.3 Operating and Storage Temperature and Humidity
    • Table 5-2 Operating and storage temperature and humidity for the MU739 module
  • 5.4 Power Supply Features
    • 5.4.1 Input Power Supply
      • Table 5-3 Requirements for input power for the MU739 module
      • Figure 5-1 Power Supply During Burst Emission
      • Table 5-4 Requirements for input current of the MU739 module
    • 5.4.2 Power Consumption
      • Table 5-5 Averaged standby DC power consumption of MU739 (WCDMA/HSDPA/GSM)
      • Table 5-6 Averaged Data Transmission DC power consumption of MU739 (WCDMA/HSPA+)
      • Table 5-7 Averaged DC power consumption of MU739 (GPRS/EDGE)
  • 5.5 Reliability Features
    • Table 5-8 Test conditions and results of the reliability of the MU739 module
  • 5.6 EMC and ESD Features
• 6 Process Design
  • 6.1 About This Chapter
  • 6.2 Storage Requirement
  • 6.3 Moisture Sensitivity
    • Table 6-1 Baking parameters
  • 6.4 Dimensions
    • Figure 6-1 Dimensions (Unit: mm)
  • 6.5 Packaging
    • Figure 6-2 ESD pallet (Unit: mm)
    • Figure 6-3 Description of the packaging
  • 6.6 Label
    • Figure 6-4 MU739 label
  • 6.7 Customer PCB Design
    • 6.7.1 PCB Surface Finish
    • 6.7.2 PCB Pad Design
      • Figure 6-5 PCB pad design (Top View) (Unit: mm)
    • 6.7.3 Solder Mask
    • 6.7.4 Requirements on PCB Layout
      • Figure 6-6 PCB Layout (unit: mm)
  • 6.8 Thermal Design Solution
    • Figure 6-7 Adding heat sink to the module for optimal heat dissipation
    • Figure 6-8 Adding enclosure to enhance the heat dissipation of the module
  • 6.9 Assembly Processes
    • 6.9.1 General Description of Assembly Processes
    • 6.9.2 Stencil Design
    • 6.9.3 Reflow Profile
      • Figure 6-9 Reflow profile
      • Table 6-2 Reflow parameters
  • 6.10 Specification of Rework
    • 6.10.1 Process of Rework
    • 6.10.2 Preparations of Rework
    • 6.10.3 Removing the Module
      • Figure 6-10 Equipment used for rework
    • 6.10.4 Welding Area Treatmtent
      • Step 1 Remove the old solder by using a soldering iron and solder braid that can wet the solder.
      • Step 2 Clean the pad and remove the flux residuals.
      • Step 3 Solder pre-filling: Before the module is installed on a board, apply some solder paste to the pad of the module by using the rework fixture and stencil or apply some solder paste to the pad on the PCB by using a rework stencil.
    • 6.10.5 Module Installation
    • 6.10.6 Specifications of Rework
      • Figure 6-11 Temperature graph of rework
• 7 Certifications
  • 7.1 About This Chapter
  • 7.2 Certifications
    • Table 7-1 Product Certifications
• 8 Safety Information
  • 8.1 Interference
  • 8.2 Medical Device
  • 8.3 Area with Inflammables and Explosives
  • 8.4 Traffic Security
  • 8.5 Airline Security
  • 8.6 Safety of Children
  • 8.7 Environment Protection
  • 8.8 WEEE Approval
  • 8.9 RoHS Approval
  • 8.10 Laws and Regulations Observance
  • 8.11 Care and Maintenance
  • 8.12 Emergency Call
  • 8.13 Regulatory Information
    • 8.13.1 CE Approval (European Union)
    • 8.13.2 FCC Statement
• 9 Appendix A Circuit of Typical Interface
• 10 Appendix B Acronyms and Abbreviations