Huawei MU739 HSPA LGA Module Hardware Guide (V100R001 11, English)

HUAWEI MU739 HSPA+ LGA Module Hardware Guide-(V100R001_11, English)

2015-10-09

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HUAWEI MU739 HSPA+ LGA Module

Hardware Guide

Issue

Date

2015-10-08

Copyright © Huawei Technologies Co., Ltd. 2015. All rights reserved.
No part of this manual may be reproduced or transmitted in any form or by any means without prior written
consent of Huawei Technologies Co., Ltd. and its affiliates ("Huawei").
The product described in this manual may include copyrighted software of Huawei and possible licensors.
Customers shall not in any manner reproduce, distribute, modify, decompile, disassemble, decrypt, extract,
reverse engineer, lease, assign, or sublicense the said software, unless such restrictions are prohibited by
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,
, and
are trademarks or registered trademarks of Huawei Technologies Co., Ltd.
Other trademarks, product, service and company names mentioned may be the property of their respective
owners.

Notice
Some features of the product and its accessories described herein rely on the software installed, capacities
and settings of local network, and therefore may not be activated or may be limited by local network operators
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Thus, the descriptions herein may not exactly match the product or its accessories which you purchase.
Huawei reserves the right to change or modify any information or specifications contained in this manual
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HUAWEI MU739 HSPA+ LGA Module
Hardware Guide

About This Document

About This Document
Revision History
Version

Date

2011-12-21

2012-01-04

Updated Figure 6-1

2012-02-29

Updated USB_VBUS voltage range

Updated Appendix A Circuit of Typical
Interface

3.9

Deleted General Purpose I/O Interface in issue
03

Updated Appendix A Circuit of Typical
Interface

2012-07-17

Chapter

Descriptions
Creation

2012-08-23

Added the process design

2013-05-08

4.5.2

Updated Table 4-3

4.6.1

Updated Antenna Design Indicators

4.6.3

Updated GSM/WCDMA Antenna
Requirements

7.2

Updated Table 7-1

7.3

Deleted Environmental Protection Certification
and Test

7.4

Deleted National Compulsory Certification

7.5

Deleted GCF and PTCRB

8.8

Updated WEEE Approval

8.9

Updated RoHS Approval

8.11

Updated Care and Maintenance

8.13

Deleted Specific Absorption Rate (SAR)

8.13

Updated Regulatory Information

2.2

Updated Table 2-1 Features

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2014-07-29

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Version

Date

About This Document

Chapter

Descriptions

2.3

Updated Figure 2-1 Circuit block diagram of
the MU739 module

2.4

Updated Figure 2-2 Application block diagram
of the MU739 module

Updated definitions of pins

4.2

Deleted 4.2 Antenna Installation Guidelines

4.4

Updated Table 4-2 MU739 conducted Rx
sensitivity (Unit: dBm) and Table 4-3 MU739
conducted Tx power (Unit: dBm)

4.5.4

Deleted 4.5.4 Radio Test Environment

5.4

Deleted 5.4 Electrical Features of Application
Interfaces

5.4.2

Updated 5.4.2 Power Consumption

5.5

Updated 5.5 Reliability Features

5.6

Updated 5.6 EMC and ESD Features

6.5

Updated 6.5 Packaging

6.6

Updated 6.6 Label

Updated 9 Appendix A Circuit of Typical
Interface

2014-08-08

Updated 9 Appendix A Circuit of Typical
Interface

2014-10-28

2.3

Updated Figure 2-1 Circuit block diagram of
the MU739 module

3.4.2

Added the description of power off time

5.2

Updated the maximum voltage of VBAT in
Table 5-1

5.5

Updated the life test results of the reliability of
the MU739 module in Table 5-8

6.4

Updated Figure 6-1 Dimensions of MU739
(Unit: mm)

6.6

Updated Figure 6-4 MU739 label

6.7.2

Updated Figure 6-5 PCB pad design (Top
View)

6.7.4

Updated requirements on PCB layout

6.8

Added thermal design solution

6.9.2

Updated the stencil design of MU739

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Version

Issue 11 (2015-10-08)

Date

2015-10-08

About This Document

Chapter

Descriptions

6.9.3

Updated reflow profile

Updated the description about reserved pins
and NC pins

6.4

Updated dimensions

6.9.2

Updated the recommended thickness of the
stencil

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Contents

Contents
1 Introduction .............................................................................................................................. 9
2 Overall Description................................................................................................................ 10
2.1 About This Chapter.....................................................................................................................10
2.2 Function Overview .....................................................................................................................10
2.3 Circuit Block Diagram ................................................................................................................. 11
2.4 Application Block Diagram ..........................................................................................................13

3 Description of the Application Interfaces........................................................................... 14
3.1 About This Chapter.....................................................................................................................14
3.2 LGA Interface .............................................................................................................................14
3.3 Power Interface ..........................................................................................................................22
3.3.1 Overview ...........................................................................................................................22
3.3.2 VBAT Interface...................................................................................................................23
3.4 Signal Control Interface ..............................................................................................................24
3.4.1 Overview ...........................................................................................................................24
3.4.2 Input Signal Control Pins....................................................................................................26
3.4.3 Output Signal Control Pins .................................................................................................31
3.5 USB Interface.............................................................................................................................33
3.6 USIM Card Interface...................................................................................................................34
3.6.1 Overview ...........................................................................................................................34
3.6.2 Circuit Recommended for the USIM Card Interface ............................................................35
3.7 Audio Interface ...........................................................................................................................37
3.8 JTAG Interface ...........................................................................................................................37
3.9 RF Antenna Interface .................................................................................................................38
3.10 Reserved Interface ...................................................................................................................38
3.11 NC Interface .............................................................................................................................38

4 RF Specifications .................................................................................................................... 40
4.1 About This Chapter.....................................................................................................................40
4.2 Operating Frequencies ...............................................................................................................40
4.3 Conducted RF Measurement......................................................................................................41
4.3.1 Test Environment ...............................................................................................................41
4.3.2 Test Standards ...................................................................................................................41
4.4 Conducted Rx Sensitivity and Tx Power .....................................................................................41

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4.4.1 Conducted Receive Sensitivity ...........................................................................................41
4.4.2 Conducted Transmit Power ................................................................................................42
4.5 Antenna Design Requirements ...................................................................................................42
4.5.1 Antenna Design Indicators .................................................................................................42
4.5.2 Interference .......................................................................................................................45
4.5.3 GSM/WCDMA Antenna Requirements ...............................................................................45

5 Electrical and Reliability Features ....................................................................................... 47
5.1 About This Chapter.....................................................................................................................47
5.2 Absolute Ratings ........................................................................................................................47
5.3 Operating and Storage Temperature and Humidity......................................................................48
5.4 Power Supply Features ..............................................................................................................48
5.4.1 Input Power Supply ............................................................................................................48
5.4.2 Power Consumption...........................................................................................................49
5.5 Reliability Features.....................................................................................................................53
5.6 EMC and ESD Features .............................................................................................................56

6 Process Design ........................................................................................................................ 59
6.1 About This Chapter.....................................................................................................................59
6.2 Storage Requirement .................................................................................................................59
6.3 Moisture Sensitivity ....................................................................................................................59
6.4 Dimensions ................................................................................................................................60
6.5 Packaging ..................................................................................................................................61
6.6 Label ..........................................................................................................................................62
6.7 Customer PCB Design ...............................................................................................................63
6.7.1 PCB Surface Finish ...........................................................................................................63
6.7.2 PCB Pad Design ................................................................................................................63
6.7.3 Solder Mask ......................................................................................................................64
6.7.4 Requirements on PCB Layout ............................................................................................64
6.8 Thermal Design Solution ............................................................................................................65
6.9 Assembly Processes ..................................................................................................................67
6.9.1 General Description of Assembly Processes ......................................................................67
6.9.2 Stencil Design ....................................................................................................................67
6.9.3 Reflow Profile ....................................................................................................................68
6.10 Specification of Rework ............................................................................................................69
6.10.1 Process of Rework ...........................................................................................................69
6.10.2 Preparations of Rework ....................................................................................................69
6.10.3 Removing the Module ......................................................................................................69
6.10.4 Welding Area Treatmtent ..................................................................................................70
6.10.5 Module Installation ...........................................................................................................70
6.10.6 Specifications of Rework ..................................................................................................70

7 Certifications........................................................................................................................... 72
7.1 About This Chapter.....................................................................................................................72

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7.2 Certifications ..............................................................................................................................72

8 Safety Information ................................................................................................................. 73
8.1 Interference................................................................................................................................73
8.2 Medical Device...........................................................................................................................73
8.3 Area with Inflammables and Explosives ......................................................................................73
8.4 Traffic Security ...........................................................................................................................74
8.5 Airline Security ...........................................................................................................................74
8.6 Safety of Children.......................................................................................................................74
8.7 Environment Protection ..............................................................................................................74
8.8 WEEE Approval .........................................................................................................................74
8.9 RoHS Approval ..........................................................................................................................74
8.10 Laws and Regulations Observance ..........................................................................................75
8.11 Care and Maintenance .............................................................................................................75
8.12 Emergency Call ........................................................................................................................75
8.13 Regulatory Information .............................................................................................................75
8.13.1 CE Approval (European Union) ........................................................................................75
8.13.2 FCC Statement ................................................................................................................76

9 Appendix A Circuit of Typical Interface............................................................................. 77
10 Appendix B Acronyms and Abbreviations ....................................................................... 79

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Introduction

This document describes the hardware application interfaces and air interfaces that
are provided when the HUAWEI MU739 HSPA+ LGA Module (hereinafter referred to
as the MU739 module) is used.
This document helps you to understand the interface specifications, electrical features
and related product information of the MU739 module.

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Overall Description

2.1 About This Chapter
This chapter gives a general description of the MU739 module and provides:


Function Overview



Circuit Block Diagram



Application Block Diagram

2.2 Function Overview
Table 2-1 Features
Feature

Description

Physical Features




Operating Bands

Dimensions (L × W × H): 30 mm × 20 mm × 2.0 mm
Weight: about 3.1 g



WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 2, Band
4, Band 5, Band 8



GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900
MHz

Operating
Temperature

Normal working temperature: –10°C to +55°C

Ambient Temperature
for Storage

–40°C to +85°C

Moisture

RH5% to RH95%

Power Voltage

3.3 V to 4.2 V (3.8 V is recommended.)

AT Commands

See the HUAWEI MU739 HSPA+ LGA Module AT
Command Interface Specification.

Application Interface

USIM card (3.0 V or 1.8 V)

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Extreme working temperature[1]: –20°C to +70°C

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Feature

Description

(114-pin LGA
interface)

USIM hot swap function

Overall Description

Audio: one I2S interface
USB 2.0 (high speed)
Power on/off
Reset
LED control signals
Antenna pads x 2
W_DISABLE_N pin
BODYSAR_N pin
Power pins
SMS

New message alert, text message receiving, and text
message sending
Management of text messages: read messages, delete
messages, storage status and message list
Supporting MO and MT.
Point-to-point and cell broadcast
Supporting formats of TEXT and PDU

Data Services

GSM CS: UL 14.4 kbit/s; DL 14.4 kbit/s
GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s
EDGE: DL 236.8 kbit/s; UL 236.8 kbit/s
WCDMA CS: UL 64 kbit/s; DL 64 kbit/s
WCDMA PS: UL 384 kbit/s; DL 384 kbit/s
HSPA+: UL 5.76 Mbit/s; DL 21.6 Mbit/s

[1]: When the MU739 module works from –20°C to –10°C or + 55°C to +70°C, NOT all its RF
performances comply with the 3GPP RF specifications.

2.3 Circuit Block Diagram
Figure 2-1 shows the circuit block diagram of the MU739 module. The application
block diagram and major functional units of the MU739 module contain the following
parts:


Baseband controller



Power manager



Multi-chip package (MCP) memory

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

Radio frequency (RF) transceiver



RF interface



RF PA

Overall Description

Figure 2-1 Circuit block diagram of the MU739 module

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Overall Description

2.4 Application Block Diagram
Figure 2-2 Application block diagram of the MU739 module

USB Interface

The USB interface supports USB 2.0 high speed standard.

USIM Interface

The USIM interface provides the interface for a USIM card.
The USIM card can be inserted into the host side.

Power Supply

DC 3.8 V is recommended.

Audio Interface

The module supports one I2S interface.

RF Pad

RF antenna interface

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Description of the Application Interfaces

3.1 About This Chapter
This chapter mainly describes the external application interfaces of the MU739
module, including:


LGA Interface



Power Interface



Signal Control Interface



USB Interface



USIM Card Interface



Audio Interface



JTAG Interface



RF Antenna Interface



Reserved Interface



NC Interface

3.2 LGA Interface
The MU739 module uses a 114-pin LGA as its external interface. For details about the
module and dimensions of the LGA, see 6.4 Dimensions.
Figure 3-1 shows the sequence of pins on the 114-pin signal interface of the MU739
module.

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Description of the Application Interfaces

Figure 3-1 Bottom view of sequence of LGA interface pins
77

37
36

114

113

112

111

110

109

34
33

61
108

107

106

104

105

103

64
102

101

100

62
63

31
30

23
22

72
84

21
76

74
20

Power pads

GND pads

Control pads

RF pads

MIPI pads

USIM pads

USB pads

Audio pads

GPIO pads

NC pads

JTAG pads

HSIC pads

Reserved pads

Table 3-1 shows the definitions of pins on the 114-pin signal interface of the MU739
module.

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Description of the Application Interfaces

Table 3-1 Definitions of pins on the LGA interface
Pin
No.

Pin Name

Pad Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

Not connected

VOH

1.35

1.8

2.1

JTAG_TDO

JTAG Serial Data Out
VOL

0.45

Not connected

Reserved

Reserved, please keep
this pin open.

Not connected

JTAG_TRST
_N

1.26

1.8

2.1

JTAG Reset/Module
enable

VIH

VIL

–0.3

0.63

VOH

1.35

1.8

2.1

VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

RESOUT_N

Output to indicate the
module's hardware is
ready or not.
H: Hardware is ready

L: Hardware is not ready
10

JTAG_TMS

JTAG_TDI

JTAG_TCK

JTAG State machine
control signal

JTAG Serial Data Input
-

JTAG clock input

Reserved

Reserved, please keep
this pin open.

Reserved

Reserved, please keep
this pin open.

Reserved

Reserved, please keep
this pin open.

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

USIM hot swap detection.
16

USIM_DET

Rising edge for insertion;
falling edge for removal.
H: USIM is present.
L: USIM is absent.

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Pin
No.

Pin Name

SLEEP_STA
TUS

Pad Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Indicates the sleep status
of MU739

VOH

1.35

1.8

2.1

VOL

0.45

1.75

1.8

1.98

USIM_PW
R=1.8 V

2.75

2.85

3.3

USIM_PW
R=2.85 V

H: MU739 is awake.
L: MU739 is in sleep.

Reserved

Reserved, please keep
this pin open.

Reserved

Reserved, please keep
this pin open.

USIM_VCC

Description of the Application Interfaces

Power supply for USIM
card

Comments
-

Reserved

Reserved, please keep
this pin open.

Reserved

Reserved, please keep
this pin open.

USB_DP

I/O

High-speed USB D+

USB_DM

I/O

High-speed USB D-

VOH

0.7 x
USIM
_PW
R

3.3

USIM_RST

Reserved

USIM_CLK

Reserved

Issue 11 (2015-10-08)

USIM Reset

Reserved, please keep
this pin open.

VOL

0.2 x
USIM
_PW
R

VOH

0.7 x
USIM
_PW
R

3.3

USIM Clock

Reserved, please keep
this pin open.

VOL

0.2 x
USIM
_PW
R

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USIM_PW
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2.85 V

HUAWEI MU739 HSPA+ LGA Module
Hardware Guide
Pin
No.

Pin Name

Pad Type

Description

Description of the Application Interfaces

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

VOH

0.7 x
USIM
_PW
R

3.3

0.2 x
USIM
_PW
R

VOL
29

USIM_DATA

I/O

USIM Data Input/Output
VIH

0.7 x
USIM
_PW
R

3.3

Comments

USIM_PW
R=1.8 V or
2.85 V

VIL

0.2 x
USIM
_PW
R

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

Reserved

Reserved, please keep
this pin open.

RESET_PM
U_N

PMU reset, low active

USB_VBUS

Power supply for USB

3.3

5.0

Reserved

Reserved, please keep
this pin open.

Hardware pin for
BODYSAR_N Detection,
active low.

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

BODYSAR_
N

H: No TX power backoff
(default).
L: TX power backoff.

Reserved

Reserved, please keep
this pin open.

1.8 V power output

1.7

1.8

1.9

VIH

1.26

1.8

2.1

VCC_EXT1

W_DISABLE
_N

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Flight mode
H: The RF will be turned

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Pin
No.

Pin Name

Pad Type

Description of the Application Interfaces

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

L: The RF will be turned
off.

VIL

–0.3

0.63

Description
on (default).

VCC_IN

1.8 V power input

1.7

1.8

1.9

Reserved

Reserved, please keep
this pin open.

H: MU739 cannot enter
sleep mode.

VIH

1.26

1.8

2.1

L: Permit MU739 to enter
sleep mode (default).

VIL

–0.3

0.63

VOH

1.35

1.8

2.1

VOL

0.45

WAKEUP_IN

WAKEUP_O
UT
Reserved

Reserved

LED#

Module to wake up the
host

Reserved, please keep
this pin open.

VOH

1.35

1.8

2.1

Network status indication
VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

Reserved

Reserved, please keep
this pin open.

ON2_N

Turn on the module, low
active

VBAT_PMU

Battery supply, power
supply for Baseband and
Transceiver

3.3

3.8

4.2

Reserved

Reserved, please keep
this pin open.

VBAT_PA

3.3

3.8

4.2

VBAT_PA

Battery supply, power
supply for PA

3.3

3.8

4.2

RESET_BB_
N

1.26

1.8

2.1

Baseband reset, low
active

VIH

VIL

–0.3

0.63

Reserved

Reserved, please keep
this pin open.

I2S_CLK0

Serial clock

VOH

1.35

1.8

2.1

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Battery supply, power
supply for PA

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Pin
No.

Pin Name

I2S_RX

I2S_TX

I2S_WA0

Pad Type

Description

Description of the Application Interfaces

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VOH

1.35

1.8

2.1

VOL

0.45

VOH

1.35

1.8

2.1

VOL

0.45

Serial receive data

Serial transmit data

Word alignment select

Reserved

Reserved, please keep
this pin open.

Not connected

GND

Ground

GND

Ground

GND

Ground

MAIN_ANT

Main antenna

GND

Ground

GND

Ground

GND

Ground

Not connected

GND

Ground

GND

Ground

AUX_ANT

Diversity antenna

GND

Ground

GND

Ground

Not connected

GND

Ground

GND

Ground

GND

Ground

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Description of the Application Interfaces

Pin
No.

Pin Name

Pad Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

GND

Ground

GND

Ground

GND

Ground

GND

Ground

GND

Ground

GND

Ground

GND

Ground

GND

Ground

GND

Ground

GND

Ground

GND

Ground

GND

Ground

GND

Ground

GND

Ground

GND

Ground

GND

Ground

GND

Ground

GND

Ground

100

GND

Ground

101

GND

Ground

102

GND

Ground

103

GND

Ground

104

GND

Ground

105

GND

Ground

106

GND

Ground

107

GND

Ground

108

GND

Ground

109

GND

Ground

110

GND

Ground

111

GND

Ground

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Pin
No.

Pin Name

Pad Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

112

GND

Ground

113

GND

Ground

114

GND

Ground



I indicates pins for digital signal input; O indicates pins for digital signal output; PI indicates
power input pins; PO indicates power output pins.



VIL indicates Low-level Input voltage; VIH indicates High-level Input voltage; VOL indicates
Low-level Output voltage; VOH indicates High-level Output voltage.



The NC (Not Connected) pins are floating and there are no signal connected to these pins.



The Reserved pins are internally connected to the module. Therefore, these pins should not
be used, otherwise they may cause problems. Please contact with us for more details about
this information.

3.3 Power Interface
3.3.1 Overview
The power supply part of the MU739 module contains:


VBAT pin for the power supply



USIM_VCC pin for USIM card power output



USB_VBUS pin for USB power supply



VCC_EXT1 pin for 1.8 V power output



VCC_IN pin for pin 41–46 voltage supply

Table 3-2 lists the definitions of the pins on the power supply interface.
Table 3-2 Definitions of the pins on the power supply interface
Pin No.

Pin Name

Pad Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

VBAT_PMU

Battery supply, power
supply for Baseband
and Transceiver

3.3

3.8

4.2

51, 52

VBAT_PA

Battery supply, power
supply for PA

3.3

3.8

4.2

1.75

1.8

1.98

USIM_PW
R=1.8 V

2.75

2.85

3.3

USIM_PW
R=2.85 V

USIM_VCC

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Power supply for
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Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

It is connected to
VBAT_PMU (default).

3.3

5.0

1.8 V power output

1.7

1.8

1.9

VCC_IN

1.8 V power input

1.7

1.8

1.9

GND

Ground

Pin No.

Pin Name

Pad Type

USB_VBUS

VCC_EXT1

40
62–64,
66–68,
70, 71,
73, 74,
79–114

Description
Power supply for USB

3.3.2 VBAT Interface
When the MU739 module works normally, power is supplied through the VBAT_PMU
and VBAT_PA pins and the voltage ranges from 3.3 V to 4.2 V (typical value is 3.8 V).
The 114-pin LGA module provides one VBAT_PMU pin, two VBAT_PA pins and
forty-six GND pins. To ensure that the MU739 module works normally, all the pins
must be connected.
When the MU739 module is used for different applications, special attention should be
paid to the design of the power supply. When the MU739 module transmits at the
maximum power, the transient peak current may reach 2.75 A. In this case, the
VBAT_PA voltage drops. Make sure that the voltage does not decrease below 3.3 V in
any case. Otherwise, exceptions such as reset of the MU739 module may occur.
A low-dropout (LDO) regulator or switch-mode power supply with load current larger
than 3 A is recommended. At least three 220 µF capacitors should be installed to
VBAT_PA pins. And the trace of the power supply should be as short and wide as
possible.
It is recommended to employ a ferrite bead in series on VBAT to improve the EMI
performance. FBMJ1608HS280NT manufactured by TAIYO YUDEN or
MPZ1608S300ATAH0 manufactured by TDK is recommended.
Figure 3-2 shows the recommended power circuit of MU739 module.

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Figure 3-2 Recommended power circuit of MU739 module
VBAT

VBAT_PA

Ferrite bead

+
330 pF 100 nF

1 μF 22 μF 220 μF 220 μF 220 μF

Module
(Modem)

VBAT

VBAT_PMU

Ferrite bead

330 pF

100 nF

1 μF

22 μF

3.4 Signal Control Interface
3.4.1 Overview
The signal control part of the interface in the MU739 module consists of the following:


Power on pins (ON2_N)



RESOUT_N pin



PMU reset pin (RESET_PMU_N)



Baseband reset pin (RESET_BB_N)




Network status LED pin (LED#)
W_DISABLE_N signal pin



WAKEUP_IN signal pin



WAKEUP_OUT signal pin



SLEEP_STATUS signal pin

Table 3-3 lists the pins on the signal control interface.
Table 3-3 Pins on the signal control interface
Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

1.26

1.8

2.1

ON2_N

Turn on the module, low
active

VIH

VIL

–0.3

0.63

VOH

1.35

1.8

2.1

RESOUT_N

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Output to indicate the
module's hardware is
ready or not.

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Pin
No.

Pin Name

Pad
Type

Description of the Application Interfaces

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VOH

1.35

1.8

2.1

VOL

0.45

H: MU739 can’t enter
sleep mode.

VIH

1.26

1.8

2.1

L: Permit MU739 to enter
sleep mode (default).

VIL

–0.3

0.63

VOH

1.35

1.8

2.1

VOL

0.45

VOH

1.35

1.8

2.1

VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

Description
H: Hardware is ready
L: Hardware is not ready

RESET_PMU_
N

RESET_BB_N

PMU reset, low active

Baseband reset, low
active
Flight mode

W_DISABLE_
N

H: The RF will be turned
on (default).
L: The RF will be turned
off.

LED#

WAKEUP_IN

WAKEUP_OU
T

SLEEP_STAT
US

Network status indication

Module to wake up the
host
Indicates the sleep status
of MU739

H: MU739 is awake.
L: MU739 is in sleep.
USIM hot swap detection.

USIM_DET

Rising edge for insertion;
falling edge for removal.
H: USIM is present.
L: USIM is absent.
Hardware pin for
BODYSAR_N Detection,
active low.

BODYSAR_N

H: No TX power backoff
(default).
L: TX power backoff.

It is recommended to use a resistor of 0 Ω in the AP side to isolate signals transmitted from
above pins in Table 3-3 .

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3.4.2 Input Signal Control Pins
The MU739 module implements power-on and resets the hardware through the input
signal control pins. The power-on and reset control parts of the interface of the MU739
module include ON2_N interface signal and the baseband reset interface signal
RESET_BB_N and the PMU reset signal RESET_PMU_N.

TURN ON
The ON2_N pin is used to implement turning on the module.
The ON2_N pin is low level active.
ON2_N can be controlled by a host processor GPIO (with internal pull-up under reset),
when tied to GND, this input can be used to force an automatic booting up when
power is applied or after a hard reset is performed.
Figure 3-3 Connections of ON2_N pin

Micro Control
(AP)

ON2_N

Module
(Modem)

2.2 kΩ

ON_N
e

Power On Time
It is recommended to power on module use the ON2_N pin.
After VBAT_PMU has been applied and been stable, the module will wait for an
on-event and if the on signal is available, the module will be powered on.
During power on timing, please make sure the VBAT_PMU is stable.
ON2_N can power on the module.
Figure 3-4 Power on timing sequence

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Table 3-4 Power on timing
Parameter

Comments

Time (Min value)

Unit

TON2_N

ON2_N turn on time

µs

Power Off Time
Figure 3-5 Power supply time sequence for power cycling

Parameter

Remarks

Time(Min.)

Unit

Toff

Power off time

100

MU739 does not support hardware shutting down, and it can only be powered off by cutting off
the power supply.

RESET
The RESET_PMU_N pin is used to make a hard reset.


Active low with internal pull-up (200 kΩ)



Initiate power down of the modem system (baseband, PMU, RF&clocks)

The RESET_BB_N pin is used to make a software reset.

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

Active low without pull-up or pull-down



Resets baseband sub-system.

Description of the Application Interfaces

As the RESET_PMU_N and RESET_BB_N signals are relatively sensitive; it is
recommended that you install a 33 pF capacitor near these pins of the interfaces for
filtering. In addition, when you design a circuit on the PCB of the interface board, it is
recommended that the circuit length not exceed 20 mm and that the circuit be kept at
a distance of 2.54 mm (100 mil) at least from the PCB edge. Furthermore, it is
recommended to wrap the area adjacent to the signal wire with a ground wire.
Otherwise, the module may be reset due to interference.
Figure 3-6 Connections of RESET_BB_N and RESET_PMU_N pins

It is recommended to reset module using the RESET_BB_N.
When a low-level pulse is supplied through the RESET_PMU_N or RESET_BB_N for
about 20 ms, the module will be reset.
Figure 3-7 Reset timing
RESET_BB_N

Tpd=20 ms

RESET_PMU_N

Table 3-5 Reset timing
Parameter

Comments

Time (Typical value)

Unit

Tpd

Reset time

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W_DISABLE_N
When W_DISABLE_N is low, the RF will be turned OFF;
When W_DISABLE_N is high, the RF will be turned ON.
Figure 3-8 W_DISABLE_N timing
RF ON
W_DISABLE_N
RF OFF

RF ON

WAKEUP_IN

RF OFF

W_DISABLE_N

This is the authorization signal of MU739 entering sleep mode.
If this signal is pulled up to high (1.8 V) level, MU739 cannot enter sleep mode.
If this signal is low or open, MU739 is allowed to enter sleep mode normally.
Figure 3-9 WAKEUP_IN timing
MU739 can not enter
sleep mode.
WAKEUP_IN

MU739 is allowed to enter
sleep mode normally.

USIM_DET
MU739 supports USIM Hot Swap function.
MU739 provides an input pin (USIM_DET) to detect whether the USIM card is present
or not. This pin is an edge trigger pin.
Table 3-6 Function of the USIM_DET pin
No.

USIM_DET

Function

Rising edge

USIM Card insertion.
If the USIM Card is present, USIM_DET should be high.

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Falling edge

USIM Card removal.
If the USIM Card is absent, USIM_DET should be low.

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Figure 3-10 Connections of the USIM_DET pin

Module

USIM Socket

VCC_EXT1
100k
CD
USIM_DET

470pF

CD is a pin detecting USIM in the USIM socket, in normal, there will be a detect pin in
the USIM Socket.

The Normal SHORT USIM connector should be employed. The logic of USIM_DET is
shown as below. High represents that USIM is inserted; Low represents that USIM is
removed.

USIM Connector Switch
USIM installed=
Not Connected
USIM_DET

USIM not
installed=
GND
When USIM is inserted (hot), USIM_DET will change from Low to High;
When USIM is removed (hot), USIM_DET will change from High to Low;
MU739 will detect the rising or falling edge of USIM_DET to react the hot swap.

BODYSAR_N
The BODYSAR_N signal is used to monitor the proximity sensor's output and trigger
the power backoff actions. It is low active.
There are some essential preconditions:

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

MU739 cannot provide any control signal for the proximity sensor; any control or
programming required by the P sensor should be handled by the PC side.



MU739 can only provide one pin (pin 34) as the input, and this pin is the one and
only connection between the proximity sensors.



As for the one pin connection, voltage level translation and back biasing
protection issues should be handled by the PC side.

Figure 3-11 Connections of the BodySAR_N pin

The diode should be a Schottky diode with extremely low forward voltage.
The key parameters of the diode are as below:
IR<1 μA (at 125°C), VF<0.4 V (when If=1 mA)
SBR0230T5 (Diodes) or RB520S30T1G (ON) is recommended.

3.4.3 Output Signal Control Pins
The MU739 module provides an LED control pin (LED#).
The pulse signal output through this pin controls the status of the LED on the user
interface board to display the RF status.
Table 3-7 List of the LED# pin
No.

Operating Status

LED_STATUS

RF function is turned on

Output high

RF function is turned off

Output low

Figure 3-12 shows the recommended circuits of the LED# pin. According to LED
feature, you can adjust the LED brightness by adjusting the impedance of resistor.

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Figure 3-12 Driving circuit
VBAT
LED

Module
(Modem)

22 kΩ

LED#

e
100 nF

It is recommended to use the triode of DTC144EET1G, LDTC144EET1G or
PDTC144EE.115 in Figure 3-12 .
The brightness of the LED depends on the current value, and for most of the indicator
lights the current from 2 mA to 5 mA is already enough.
Figure 3-13 LED Typical Electro-Optical Characteristics Curves

SLEEP_STATUS
The SLEEP_STATUS signal is used to indicate the status of MU739. The AP can get
to know whether the module is in sleep or not by reading this pin.
When SLEEP_STATUS signal is high, MU739 is in normal work status.
When SLEEP_STATUS signal is low, MU739 is in sleep status.

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WAKEUP_OUT
The WAKEUP_OUT signal is used to wake up the AP.
WAKEUP_OUT signal is low by default. When a phone call or an SMS is coming, the
MU739 module will output a high pulse which lasts for 1s.
Within the duration of the high pulse, if a new phone call or an SMS is coming, the
MU739 module will output the high pulse over again.
Table 3-3 shows the definition of the WAKEUP_OUT signal.
Figure 3-14 Connections of the WAKEUP_OUT pin

Micro Control
(AP)
Module
(Modem)

VCC_EXT
22 kΩ

100 kΩ

WAKEUP_OUT
e
100 nF

It is recommended to use the triode of DTC144EET1G, LDTC144EET1G or
PDTC144EE.115 in Figure 3-14 .

RESOUT_N
RESOUT_N is an output of the module and is used to indicate the hardware of
module is ready. Once system powers on, the RESOUT_N signal can be routed to the
AP processor to allow the AP to monitor and detect resets of the modem system.
During reset, RESOUT_N is an output signal, logic low. RESOUT_N would be
monitored by a host processor GPIO (with internal pull-up).

3.5 USB Interface
The MU739 is compliant with USB 2.0 high speed protocol. The USB interface is
powered from the USB_VBUS supply. The USB input/output lines are compatible with
the USB 2.0 VBAT signal specifications. Figure 3-15 shows the circuit of the USB
interface.
Table 3-8 Definition of the USB interface
Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

USB_DP

I/O

High-speed USB D+

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Pin
No.

Pin Name

Pad
Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

USB_DM

I/O

High-speed USB D-

USB_VBUS

Power supply for USB

3.3

5.0

According to USB protocol, for bus timing or electrical characteristics of MU739 USB
signal please refer to the chapter 7.3.2 of Universal Serial Bus Specification 2.0.
Figure 3-15 Recommended circuit of USB interface



The layout design of this circuit on the AP board should comply with the USB 2.0 high speed
protocol, with differential impedance control to 90 Ω.



It is recommended that set USB_DP and USB_DM pins as test points and then place these
test points on the AP for debug.

3.6 USIM Card Interface
3.6.1 Overview
The MU739 module provides a USIM card interface complying with the ISO 7816-3
standard and supports automatic detection of a 3.0 V USIM card or a 1.8 V USIM card.
Table 3-9 lists the USIM card interface signals.
Table 3-9 USIM card interface signals
Pin
No.

Pin Name

USIM_VCC

Issue 11 (2015-10-08)

Pad Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

1.75

1.8

1.98

USIM_PWR
=1.8 V

2.75

2.85

3.3

USIM_PWR
=2.85 V

Power supply for
USIM card

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Pin
No.

Pin Name

Pad Type

USIM_RST

USIM_CLK

USIM_DATA

I/O

Description

USIM_DET

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

VOH

0.7 x
USIM_
PWR

3.3

VOL

0.2 x
USIM_
PWR

VOH

0.7 x
USIM_
PWR

3.3

VOL

0.2 x
USIM_
PWR

VOH

0.7 x
USIM_
PWR

3.3

VOL

0.2 x
USIM_
PWR

USIM Reset

USIM Clock

USIM Data
Input/Output

USIM hot swap
detection.
16

Description of the Application Interfaces

VIH

0.7 x
USIM_
PWR

3.3

VIL

0.2 x
USIM_
PWR

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

Comments

USIM_PWR
=1.8 V or
2.85 V

Rising edge for
insertion; falling
edge for removal.
H: USIM is present.
L: USIM is absent.

3.6.2 Circuit Recommended for the USIM Card Interface
As the MU739 module is not equipped with a USIM card socket, you need to place a
USIM card socket on the user interface board. The USIM card signals are transmitted
outwards through the 114-pin LGA interface. Figure 3-16 shows the circuit of the
USIM card interface.
There is no pull-up resistor on USIM_DATA inside the MU739 module, so an external resistor
(4.7 kΩ recommended) must be added between USIM_DATA and USIM_VCC.

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Figure 3-16 Circuit of the USIM card interface
ESD protection

VCC_EXT1_1V8
4.7 kΩ

Module
(Modem)

4.7 kΩ

USIM_VCC
USIM_DET
USIM

USIM_CLK
USIM_DATA

USIM_RST

33 pF

33 pF 33 nF

1 µF 33 pF



The ESD protection component should choose low capacitance. The capacitance
of the component should be less than 10 pF.



To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic
compatibility (EMC) authentication, the USIM socket should be placed near the
LGA interface (it is recommended that the PCB circuit connects the LGA interface
and the USIM socket does not exceed 100 mm), because a long circuit may lead to
wave distortion, thus affecting signal quality.



It is recommended that you wrap the area adjacent to the USIM_CLK and
USIM_DATA signal wires with ground. The Ground pin of the USIM socket and the
Ground pin of the USIM card must be well connected to the power Ground pin
supplying power to the MU739 module.



A 1 uF capacitor and a 33 pF capacitor are placed between the USIM_VCC and
Ground pins in parallel. Three 33 pF capacitors are placed between the
USIM_DATA and Ground pins, the USIM_RST and Ground pins, and the
USIM_CLK and Ground pins in parallel to filter interference from RF signals.



It is recommended to take electrostatic discharge (ESD) protection measures near
the USIM card socket. Transient voltage suppressor diode should be placed as
close as possible to the USIM socket, and the Ground pin of the ESD protection
component is well connected to the power Ground pin that supplies power to the
MU739 module.

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3.7 Audio Interface
MU739 provides one I2S interface to support the audio function, and it can be only
used in the master mode. If customers need the audio function in their product, please
contact with us for more details.
Table 3-10 I2S interface signals
Pin
No.

Pin Name

Pad Type

Description

I2S_CLK0

Serial clock

I2S_RX

I2S_TX

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

VOH

1.35

1.8

2.1

VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VOH

1.35

1.8

2.1

VOL

0.45

VOH

1.35

1.8

2.1

VOL

0.45

Serial receive data

I2S_WA0

Parameter

Serial transmit data

Word alignment select

3.8 JTAG Interface
MU739 module provides one JTAG interface (Joint Test Action Group). It is
recommended that set the 5 pins related to JTAG interface as test points on the AP for
tracing and debugging.
Table 3-11 Signals on the JTAG interface
Pin
No.

Pin Name

Pad Type

Description

JTAG_TDO

JTAG Serial Data Out

11
12

JTAG_TRST
_N

JTAG_TMS

JTAG_TDI
JTAG_TCK

Issue 11 (2015-10-08)

I
I

JTAG Reset/Module
enable
JTAG State machine
control signal

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

VOH

1.35

1.8

2.1

VOL

0.45

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VIH

1.26

1.8

2.1

VIL

–0.3

0.63

VIH

1.26

1.8

2.1

JTAG Serial Data Input
JTAG clock input

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Pin
No.

Pin Name

Pad Type

Description

Description of the Application Interfaces

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

VIL

–0.3

0.63

Comments

It is suggested to place the above 5 test points on the AP board for debug.

3.9 RF Antenna Interface
MU739 module provides 2 antenna interfaces for connecting the external antennas.
Table 3-12 Signals on RF Antenna interface
Pin
No.

Pin Name

Pad Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

MAIN_ANT

Main antenna

AUX_ANT

Diversity antenna

3.10 Reserved Interface
The module provides some reserved pins. All of reserved pins cannot be used by the
customer. Please keep these pins open.
Table 3-13 Reserved pins
Pin No.
6, 13-15,18,19, 21,
22, 26, 28, 30, 33,
35-37, 41, 44, 45,
47, 50, 54, 59

Pin Name

Reserved

Pad Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

Reserved,
please keep
this pin
open.

3.11 NC Interface
The MU739 module has some NC pins. There are no signal connected to these pins.

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Table 3-14 NC pins
Pin No.

Pin Name

Pad Type

Description

Parameter

Min.
(V)

Typ.
(V)

Max.
(V)

Comments

1, 3-5, 7, 60, 61, 69,
75-78

Not
connected

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RF Specifications

4.1 About This Chapter
This chapter describes the RF specifications of the MU739 module, including:


Operating Frequencies



Conducted RF Measurement



Conducted Rx Sensitivity and Tx Power



Antenna Design Requirements

4.2 Operating Frequencies
Table 4-1 shows the RF bands supported by MU739.
Table 4-1 RF bands
Operating Band

WCDMA Band 1

1920 MH–1980 MHz

2110 MHz–2170 MHz

WCDMA Band 2

1850 MHz–1910 MHz

1930 MHz–1990 MHz

WCDMA Band 4

1710 MHz–1755 MHz

2110 MHz–2155 MHz

WCDMA Band 5

824 MHz–849 MHz

869 MHz–894 MHz

WCDMA Band 8

880 MHz–915 MHz

925 MHz–960 MHz

GSM 850

824 MHz–849 MHz

869 MHz–894 MHz

GSM 900

880 MHz–915 MHz

925 MHz–960 MHz

GSM 1800

1710 MHz–1785 MHz

1805 MHz–1880 MHz

GSM 1900

1850 MHz–1910 MHz

1930 MHz–1990 MHz

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4.3 Conducted RF Measurement
4.3.1 Test Environment
Test instrument

R&S CMU200

Power supply

Keithley 2303, Agilent 66319

RF cable for testing

Rosenberger Precision Microwave Cable



The compensation for different frequency bands relates to the cable and the test
environment.



The instrument compensation needs to be set according to the actual cable conditions.

4.3.2 Test Standards
Huawei modules meet 3GPP test standards. Each module passes strict tests at the
factory and thus the quality of the modules is guaranteed.

4.4 Conducted Rx Sensitivity and Tx Power
4.4.1 Conducted Receive Sensitivity
The conducted receive sensitivity is a key parameter that indicates the receiver
performance of MU739.
Table 4-2 MU739 conducted Rx sensitivity (Unit: dBm)
Band

Typical Value

Note

GSM 850

–109.5

BER Class II < 2.44%

GSM 900

–109

BER Class II < 2.44%

GSM 1800

–109

BER Class II < 2.44%

GSM 1900

–108.5

BER Class II < 2.44%

WCDMA Band 1

–110

BER < 0.1%

WCDMA Band 2

–110

BER < 0.1%

WCDMA Band 4

–110

BER < 0.1%

WCDMA Band 5

–110

BER < 0.1%

WCDMA Band 8

–110

BER < 0.1%

The test values are the average of some test samples.

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4.4.2 Conducted Transmit Power
The conducted transmit power is another indicator that measures the performance of
MU739. The conducted transmit power refers to the maximum power that the module
tested at the antenna port can transmit. According to the 3GPP protocol, the required
transmit power varies with the power class.
Table 4-3 MU739 conducted Tx power (Unit: dBm)
Band

Typical Value

Note

GMSK (1Tx Slot)

32.5

±1 dB

8PSK (1Tx Slot)

26.5

±1 dB

GMSK (1Tx Slot)

32.5

±1 dB

8PSK (1Tx Slot)

26.5

±1 dB

GMSK (1Tx Slot)

29.5

±1 dB

8PSK (1Tx Slot)

25.5

±1 dB

GMSK (1Tx Slot)

29.5

±1 dB

8PSK (1Tx Slot)

25.5

±1 dB

WCDMA Band 1

23.5

±1 dB

WCDMA Band 2

23.5

±1 dB

WCDMA Band 4

23.5

±1 dB

WCDMA Band 5

23.5

±1 dB

WCDMA Band 8

23.5

±1 dB

GSM 850

GSM 900

GSM 1800

GSM 1900

4.5 Antenna Design Requirements
4.5.1 Antenna Design Indicators
Antenna Efficiency
Antenna efficiency is the ratio of the input power to the radiated or received power of
an antenna. The radiated power of an antenna is always lower than the input power
due to the following antenna losses: return loss, material loss, and coupling loss. The
efficiency of an antenna relates to its electrical dimensions. To be specific, the
antenna efficiency increases with the electrical dimensions. In addition, the
transmission cable from the antenna port of MU739 to the antenna is also part of the
antenna. The cable loss increases with the cable length and the frequency. It is
recommended that the cable loss be as low as possible.
The following antenna efficiency (free space) is recommended for MU739 to ensure
high radio performance of the module:

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

Efficiency of the primary antenna: ≥ 40% (below 960 MHz); ≥ 50% (over 1710
MHz)



Efficiency of the diversity antenna: ≥ half of the efficiency of the primary antenna
in receiving band

In addition, the efficiency should be tested with the transmission cable.

S11 or VSWR
S11 indicates the degree to which the input impedance of an antenna matches the
reference impedance (50 Ω). S11 shows the resonance feature and impedance
bandwidth of an antenna. Voltage standing wave ratio (VSWR) is another expression
of S11. S11 relates to the antenna efficiency. S11 can be measured with a vector
analyzer.
The following S11 values are recommended for the antenna of MU739:


S11 of the primary antenna ≤ –6 dB



S11 of the diversity antenna ≤ –6 dB

In addition, S11 is less important than the efficiency, and S11 has weak correlation to
the wireless performance.

Isolation
For a wireless device with multiple antennas, the power of different antennas is
coupled with each other. Antenna isolation is used to measure the power coupling.
The power radiated by an antenna might be received by an adjacent antenna, which
decreases the antenna radiation efficiency and affects the running of other devices. To
avoid this problem, evaluate the antenna isolation as sufficiently as possible at the
early stage of antenna design.
Antenna isolation depends on the following factors:


Distance between antennas



Antenna type



Antenna direction

The primary antenna must be placed as near as possible to the MU739 to minimize
the cable length. The diversity antenna needs to be installed perpendicularly to the
primary antenna. The diversity antenna can be placed farther away from the MU739.
Antenna isolation can be measured with a two-port vector network analyzer.
The following antenna isolation is recommended for the antennas on laptops:


Isolation between the primary and diversity antennas ≤ –12 dB



Isolation between the primary (diversity) antenna and the Wi-Fi antenna ≤ –15 dB

Envelope Correlation Coefficient
The envelope correlation coefficient indicates the correlation between different
antennas in a multi-antenna system (primary antenna, diversity antenna, and MIMO
antenna). The correlation coefficient shows the similarity of radiation patterns, that is,
amplitude and phase, of the antennas. The ideal correlation coefficient of a diversity
antenna system or a MIMO antenna system is 0. A small value of the envelope
correlation coefficient between the primary antenna and the diversity antenna

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RF Specifications

indicates a high diversity gain. The envelope correlation coefficient depends on the
following factors:


Distance between antennas



Antenna type



Antenna direction

The antenna correlation coefficient differs from the antenna isolation. Sufficient
antenna isolation does not represent a satisfactory correlation coefficient. For this
reason, the two indicators need to be evaluated separately.
For the antennas on laptops, the recommended envelope correlation coefficient
between the primary antenna and the diversity antenna is smaller than 0.5.

Polarization
The polarization of an antenna is the orientation of the electric field vector that rotates
with time in the direction of maximum radiation.
The linear polarization is recommended for the antenna of MU739.

Radiation Pattern
The radiation pattern of an antenna reflects the radiation features of the antenna in the
remote field region. The radiation pattern of an antenna commonly describes the
power or field strength of the radiated electromagnetic waves in various directions
from the antenna. The power or field strength varies with the angular coordinates (θ
and φ), but is independent of the radial coordinates.
The radiation pattern of half wave dipole antennas is omnidirectional in the horizontal
plane, and the incident waves of base stations are often in the horizontal plane. For
this reason, the receiving performance is optimal.
The following radiation patterns are recommended for the antenna of MU739.
Primary antenna: omnidirectional
The radiation pattern of an antenna reflects the radiation features of the antenna in the
remote field region. The radiation pattern of an antenna commonly describes the
power or field strength of the radiated electromagnetic waves in various directions
from the antenna. The power or field strength varies with the angular coordinates (θ
and φ), but is independent of the radial coordinates.
The radiation pattern of half wave dipole antennas is omnidirectional in the horizontal
plane, and the incident waves of base stations are often in the horizontal plane. For
this reason, the receiving performance is optimal.
The following radiation patterns are recommended for the antenna of MU739:
Primary/Diversity/WIFI antenna: omnidirectional.
In addition, the diversity antenna’s pattern should be complementary with the primary
antenna’s pattern.

Gain and Directivity
The radiation pattern of an antenna represents the field strength of the radiated
electromagnetic waves in all directions, but not the power density that the antenna

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radiates in the specific direction. The directivity of an antenna, however, measures the
power density that the antenna radiates.
Gain, as another important parameter of antennas, correlates closely to the directivity.
The gain of an antenna takes both the directivity and the efficiency of the antenna into
account. The appropriate antenna gain prolongs the service life of relevant batteries.
The following antenna gain is recommended for MU739:


Gain of the primary antenna ≤ 2.5 dBi



Gain of the diversity antenna ≤ 2.5 dBi


The antenna consists of the antenna body and the relevant RF transmission cable. Take the
RF transmission cable into account when measuring any of the preceding antenna
indicators.



Huawei cooperates with various famous antenna suppliers who are able to make
suggestions on antenna design, for example, Amphenol, Skycross, etc.

4.5.2 Interference
Besides the antenna performance, the interference on the user board also affects the
radio performance (especially the TIS) of the module. To guarantee high performance
of the module, the interference sources on the user board must be properly controlled.
On the user board, there are various interference sources, such as the LCD, CPU,
audio circuits, and power supply. All the interference sources emit interference signals
that affect the normal operation of the module. For example, the module sensitivity
can be decreased due to interference signals. Therefore, during the design, you need
to consider how to reduce the effects of interference sources on the module. You can
take the following measures: Use an LCD with optimized performance; shield the LCD
interference signals; shield the signal cable of the board; or design filter circuits.
Huawei is able to make technical suggestions on radio performance improvement of
the module.

4.5.3 GSM/WCDMA Antenna Requirements
The antenna for MU739 must fulfill the following requirements:
GSM/WCDMA Antenna Requirements
Frequency range

Depending on frequency band(s) provided by the network
operator, the customer must use the most suitable
antenna for that/those band (s)

Bandwidth of primary
antenna

70 MHz in GSM 850
80 MHz in GSM 900
170 MHz in GSM 1800
140 MHz in GSM 1900
250 MHz in WCDMA Band 1
140 MHz in WCDMA Band 2
445 MHz in WCDMA Band 4
70 MHZ in WCDMA Band 5
80 MHz in WCDMA Band 8

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GSM/WCDMA Antenna Requirements
Bandwidth of diversity
antenna

60 MHz in WCDMA Band 1
60 MHz in WCDMA Band 2
45 MHz in WCDMA Band 4
25 MHz in WCDMA Band 5
35 MHz in WCDMA Band 8

Gain

≤ 2.5 dBi

Impedance

50 Ω

VSWR absolute max

≤ 3:1

VSWR recommended

≤ 2:1

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Electrical and Reliability Features

5.1 About This Chapter
This chapter describes the electrical and reliability features of the interfaces in the
MU739 module, including:


Absolute Ratings



Operating and Storage Temperature and Humidity



Power Supply Features



Reliability Features



EMC and ESD Features

5.2 Absolute Ratings

Table 5-1 lists the absolute ratings for the MU739 module. Using the MU739 module
beyond these conditions may result in permanent damage to the module.
Table 5-1 Absolute maximum ratings for the MU739 module
Symbol

Specification

Minimum
Value

Maximum
Value

Unit

VBAT

External power voltage

–0.3

4.5

Data pin voltage

–0.3

3.6

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5.3 Operating and Storage Temperature and Humidity
Table 5-2 lists the operating and storage temperature and humidity for the MU739
module.
Table 5-2 Operating and storage temperature and humidity for the MU739 module
Specification

Minimum Value

Maximum Value

Unit

Normal working temperature

–10

+55

°C

Extreme working
temperature[1]

–20

+70

°C

Ambient temperature for
storage

–40

+85

°C

Humidity

[1]: When the MU739 module works from –20°C to –10°C or +55°C to +70°C, certain RF
performances do not comply with the 3GPP RF specifications.

5.4 Power Supply Features
5.4.1 Input Power Supply
Table 5-3 lists the requirements for input power of the MU739 module.
Table 5-3 Requirements for input power for the MU739 module
Parameter

Minimum
Value

Typical
Value

Maximum
Value

Ripple

Unit

VBAT

3.3

3.8

4.2

0.05

Figure 5-1 Power Supply During Burst Emission

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The VBAT Minimum Value must be guaranteed during the burst (with 2.75 A Peak in GSM,
GPRS or EGPRS mode).

Table 5-4 Requirements for input current of the MU739 module
Power

Peak (Maximum)

Normal (Maximum)

3.8 V

2750 mA

1100 mA

5.4.2 Power Consumption
The power consumptions of MU739 in different scenarios are respectively listed in
Table 5-5 , Table 5-6 and Table 5-7 .
The power consumption listed in this section are tested when the power supply of
MU739 module is normal voltage (3.8 V), and all of test values are measured at room
temperature.
Table 5-5 Averaged standby DC power consumption of MU739 (WCDMA/HSDPA/GSM)
Description

Bands

Test Value (mA)

Notes/Configuration

Typical
Sleep

HSPA+/
WCDMA

UMTS bands

1.9

Module is powered up.
DRX cycle=8 (2.56s)
Module is registered on
the network.
USB is in suspend.

GPRS/E
DGE

GSM bands

2.0

Module is powered up.
MFRMS=5 (1.175s)
Module is registered on
the network.
USB is in suspend.

Radio Off

All bands

1.4

Module is powered up.
RF is disabled.
USB is in suspend.

Idle

HSPA+/
WCDMA

UMTS bands

Module is powered up.
DRX cycle=8 (2.56s)
Module is registered on
the network, and no data
is transmitted.
USB is in active.

GPRS/E
DGE

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MFRMS=5 (1.175s)

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Description

Electrical and Reliability Features

Bands

Test Value (mA)

Notes/Configuration

Typical
Module is registered on
the network, and no data
is transmitted.
USB is in active.
Radio Off

All bands

Module is powered up.
RF is disabled.
USB is in active.

Table 5-6 Averaged Data Transmission DC power consumption of MU739
(WCDMA/HSPA+)
Description

Band

Test Value (mA)

Notes/Configuration

Typical
WCDMA

Band 1

175

0 dBm Tx Power

(IMT2100)

215

10 dBm Tx Power

570

23.5 dBm Tx Power

175

0 dBm Tx Power

220

10 dBm Tx Power

700

23.5 dBm Tx Power

Band 4

170

0 dBm Tx Power

(AWS)

210

10 dBm Tx Power

600

23.5 dBm Tx Power

170

0 dBm Tx Power

205

10 dBm Tx Power

560

23.5 dBm Tx Power

Band 8

165

0 dBm Tx Power

(900 MHz)

205

10 dBm Tx Power

600

23.5 dBm Tx Power

190

0 dBm Tx Power

230

10 dBm Tx Power

700

23.5 dBm Tx Power

197

0 dBm Tx Power

Band 2
(PCS 1900)

Band 5
(850 MHz)

HSPA+

Band 1
(IMT2100)

Band 2

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Band

Electrical and Reliability Features

Test Value (mA)

Notes/Configuration

Typical
(PCS 1900)

240

10 dBm Tx Power

720

23.5 dBm Tx Power

Band 4

195

0 dBm Tx Power

(AWS)

230

10 dBm Tx Power

620

23.5 dBm Tx Power

Band 5

191

0 dBm Tx Power

(850 MHz)

220

10 dBm Tx Power

600

23.5 dBm Tx Power

Band 8

190

0 dBm Tx Power

(900 MHz)

225

10 dBm Tx Power

625

23.5 dBm Tx Power

Table 5-7 Averaged DC power consumption of MU739 (GPRS/EDGE)
Description

Test Value (mA)

PCL

Notes/Configuration

1 Up/1 Down

Typical
GPRS850

230
395

2 Up/1 Down

650

4 Up/1 Down

GPRS900

2 Up/1 Down

165

4 Up/1 Down

225

1 Up/1 Down

390

2 Up/1 Down

620

4 Up/1 Down
10

1 Up/1 Down

125

2 Up/1 Down

165

4 Up/1 Down

190

310

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1 Up/1 Down

125

GPRS1800

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2 Up/1 Down

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Description

Test Value (mA)

Electrical and Reliability Features

PCL

Notes/Configuration

Typical
410
90

GPRS1900

145

4 Up/1 Down

180

410

4 Up/1 Down
10

1 Up/1 Down

110

2 Up/1 Down

145

4 Up/1 Down

175

1 Up/1 Down

285

2 Up/1 Down

460

4 Up/1 Down
15

1 Up/1 Down

175

2 Up/1 Down

270

4 Up/1 Down

175

1 Up/1 Down

280

2 Up/1 Down

445

4 Up/1 Down
15

1 Up/1 Down

175

2 Up/1 Down

265

4 Up/1 Down

160

1 Up/1 Down

260

2 Up/1 Down

415

4 Up/1 Down
10

1 Up/1 Down

155

2 Up/1 Down

230

4 Up/1 Down

155

250

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1 Up/1 Down
2 Up/1 Down

110

EDGE1900

295

120

EDGE1800

1 Up/1 Down
2 Up/1 Down

120

EDGE900

110

EDGE850

4 Up/1 Down

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2 Up/1 Down

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Description

Test Value (mA)

Electrical and Reliability Features

PCL

Notes/Configuration

Typical
410
110

4 Up/1 Down
10

1 Up/1 Down

155

2 Up/1 Down

230

4 Up/1 Down



All power consumption test configuration can be referenced by GSM Association Official
Document TS.09: Battery Life Measurement and Current Consumption Technique.



Test condition: For Max Tx power, see 4.4.2 Conducted Transmit Power, they are listed in
Table 4-3 ; for Max data throughput, see 2.2 Function Overview, they are listed in Table 2-1
Features.

5.5 Reliability Features
Table 5-8 lists the test conditions and results of the reliability of the MU739 module.
Table 5-8 Test conditions and results of the reliability of the MU739 module
Item
Stress

Test Condition
Low-temperature
storage

High-temperature
storage

Low-temperature
operating

High-temperature
operating



Temperature: –40ºC



Operation mode: no
power, no package



Test duration: 24 h



Temperature: 85ºC



Operation mode: no
power, no package



Test duration: 24 h



Temperature: –20ºC



Operation mode:
working with service
connected



Test duration: 24 h



Temperature: 70ºC



Operation mode:
working with service
connected



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Standard

Sample size

Results

JESD22A119-C

3 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

JESD22A103-C

3 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

IEC60068
-2-1

3 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

JESD22A108-C

3 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

Test duration: 24 h

HUAWEI MU739 HSPA+ LGA Module
Hardware Guide
Item
Damp heat
cycling

Thermal shock

Salty fog test

Electrical and Reliability Features

Test Condition

Standard

Sample size

Results



High temperature:
55ºC

JESD22A101-B

3 pcs/group

Visual inspection: ok



Low temperature:
25ºC



Humidity: 95%±3%



Operation mode:
working with service
connected



Test duration: 6
cycles; 12 h+12
h/cycle



Low temperature:
–40ºC



High temperature:
85ºC



Temperature change
interval: < 20s



Operation mode: no
power



Test duration: 100
cycles; 15 min+15
min/cycle



Temperature: 35°C



Density of the NaCl
solution: 5%±1%



Operation mode: no
power, no package



Test duration:

Function test: ok
RF specification: ok

JESD22A106-B

3 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

JESD22A107-B

3 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

Spraying interval: 8 h
Exposing period after
removing the salty fog
environment: 16 h
Sine vibration

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

Frequency range: 5
Hz to 200 Hz



Acceleration: 1 Grms



Frequency scan rate:
0.5 oct/min



Operation mode:
working with service
connected



Test duration: 3 axial
directions. 2 h for
each axial direction.

JESD22B103-B

3 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

HUAWEI MU739 HSPA+ LGA Module
Hardware Guide
Item
Shock test

Drop test

Life

High temperature
operating life

High temperature
& high humidity

Issue 11 (2015-10-08)

Electrical and Reliability Features

Test Condition

Standard

Sample size

Results



Half-sine wave shock

Visual inspection: ok

Peak acceleration: 30
Grms

JESD-B1
04-C

3 pcs/group



Shock duration: 11 ms



Operation mode:
working with service
connected



Test duration: 6 axial
directions. 3 shocks
for each axial
direction.



0.8 m in height. Drop
the module on the
marble terrace with
one surface facing
downwards, six
surfaces should be
tested.



Operation mode: no
power, no package



Temperature: 70ºC



Operation mode:
working with service
connected

Function test: ok
RF specification: ok

IEC60068
-2-32

3 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

JESD22A108-B

50 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok



Test duration: 168 h,
336 h, 500 h, 1000 h
for inspection point



High temperature:
85ºC



Humidity: 85%

RF specification: ok



Operation mode:
powered on and no
working

Cross section: ok



Test duration: 168 h,
336 h, 500 h, 1000 h
for inspection point

JESD22A110-B

50 pcs/group

Visual inspection: ok
Function test: ok

HUAWEI MU739 HSPA+ LGA Module
Hardware Guide
Item
Temperature
cycle

Electrical and Reliability Features

Test Condition

Standard

Sample size

Results



High temperature:
85ºC

JESD22A104-C

50 pcs/group

Visual inspection: ok



Low temperature:
–40ºC



Temperature change
slope: 6ºC/min



Operation mode: no
power



Test duration: 168 h,

Function test: ok
RF specification: ok
Cross section: ok

336 h, 500 h, 1000 h
for inspection point

ESD

HBM (Human
Body Model)

ESD with DVK (or
embedded in the
host)



1 kV (Class 1 B)



Operation mode: no
power



Contact Voltage: ±2
kV, ±4 kV



Air Voltage : ±2 kV, ±4
kV, ±8 kV



Operation mode:
working with service
connected

JESD22A114-D

3 pcs/group

Visual inspection: ok
Function test: ok
RF specification: ok

IEC61000
-4-2

2 pcs

Visual inspection: ok
Function test: ok
RF specification: ok

Groups ≥ 2

5.6 EMC and ESD Features
The following are the EMC design comments:


Attention should be paid to static control in the manufacture, assembly, packaging,
handling, and storage process to reduce electrostatic damage to HUAWEI
module.



RSE (Radiated Spurious Emission) may exceed the limit defined by EN301489 if
the antenna port is protected by TVS (Transient Voltage Suppressor), which is
resolved by making some adjustments on RF match circuit.



TVS should be added on the USB port for ESD protection, and the parasitic
capacitance of TVS on D+/D- signal should be less than 2 pF. Common-mode
inductor should be added in parallel on D+/D- signal.



TVS should be added on the USIM interface for ESD protection. The parasitic
capacitance of TVS on USIM signal should be less than 10 pF.

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Electrical and Reliability Features



Resistors in parallel and a 10 nF capacitor should be added on RESET_BB_N
signal to avoid shaking, and the distance between the capacitor and the related
pin should be less than 100 mil.



PCB routing should be V-type rather than T-type for TVS.



An integrated ground plane is necessary for EMC design.

The following are the requirements of ESD environment control:


The electrostatic discharge protected area (EPA) must have an ESD floor whose
surface resistance and system resistance are greater than 1 x 104 Ω while less
than 1 x 109 Ω.



The EPA must have a sound ground system without loose ground wires, and the
ground resistance must be less than 4 Ω.



The workbench for handling ESD sensitive components must be equipped with
common ground points, the wrist strap jack, and ESD pad. The resistance
between the jack and common ground point must be less than 4 Ω. The surface
resistance and system resistance of the ESD pad must be less than 1 x 109 Ω.



The EPA must use the ESD two-circuit wrist strap, and the wrist strap must be
connected to the dedicated jack. The crocodile clip must not be connected to the
ground.



The ESD sensitive components, the processing equipment, test equipment, tools,
and devices must be connected to the ground properly. The indexes are as
follows:
−

Hard ground resistance < 4 Ω

−

1 x 105 Ω ≤ Soft ground resistance < 1 x 109 Ω

−

1 x 105 Ω ≤ ICT fixture soft ground resistance < 1 x 1011 Ω

−

The electronic screwdriver and electronic soldering iron can be easily oxidized.
Their ground resistance must be less than 20 Ω.



The parts of the equipment, devices, and tools that touch the ESD sensitive
components and moving parts that are close to the ESD sensitive components
must be made of ESD materials and have sound ground connection. The parts
that are not made of ESD materials must be handled with ESD treatment, such
as painting the ESD coating or ionization treatment (check that the friction voltage
is less than 100 V).



Key parts in the production equipment (parts that touch the ESD sensitive
components or parts that are within 30 cm away from the ESD sensitive
components), including the conveyor belt, conveyor chain, guide wheel, and SMT
nozzle, must all be made of ESD materials and be connected to the ground
properly (check that the friction voltage is less than 100 V).



Engineers that touch IC chips, boards, modules, and other ESD sensitive
components and assemblies must wear ESD wrist straps, ESD gloves, or ESD
finger cots properly. Engineers that sit when handling the components must all
wear ESD wrist straps.



Noticeable ESD warning signs must be attached to the packages and placement
areas of ESD sensitive components and assemblies.



Boards and IC chips must not be stacked randomly or be placed with other ESD
components.



Effective shielding measures must be taken on the ESD sensitive materials that
are transported or stored outside the EPA.

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Electrical and Reliability Features

HUAWEI MU739 Module does not include any protection against overvoltage.

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Process Design

6.1 About This Chapter
This chapter describes the process design and mechanical specifications:


Storage Requirement



Moisture Sensitivity



Dimensions



Packaging



Label



Customer PCB Design



Thermal Design Solution



Assembly Processes



Specification of Rework

6.2 Storage Requirement
The module must be stored and sealed properly in vacuum package under a
temperature below 40°C and the relative humidity less than 90% in order to ensure
the weldability within 12 months.

6.3 Moisture Sensitivity


The moisture sensitivity is level 3.



After unpacking, the module must be assembled within 168 hours under the
environmental conditions that the temperature is lower than 30°C and the relative
humidity is less than 60%. If the preceding conditions cannot be met, the module
needs to be baked according to the parameters specified in Table 6-1 .

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Table 6-1 Baking parameters
Baking

Baking Condition

Baking Duration

Remarks

Relative humidity ≤ 60%

8 hours

Temperature
125°C±5°C

Moving, storing, and processing the product must comply with IPC/JEDEC J-STD-033.

6.4 Dimensions
Figure 6-1 shows the dimensions of MU739 in details.
Figure 6-1 Dimensions (Unit: mm)

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6.5 Packaging
The module uses five layers ESD pallet, anti-vibration foam and vacuum packing into
cartons.
Figure 6-2 ESD pallet (Unit: mm)

The following figure shows the packaging.

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Process Design

Figure 6-3 Description of the packaging

6.6 Label
The label is made from deformation-resistant, fade-resistant, and
high-temperature-resistant material and is able to endure the high temperature of
260°C.

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Figure 6-4 MU739 label

The picture mentioned above is only for reference.

6.7 Customer PCB Design
6.7.1 PCB Surface Finish
The PCB surface finish recommended is Electroless Nickel, immersion Gold (ENIG).
Organic Solderability Preservative (OSP) may also be used, ENIG preferred.

6.7.2 PCB Pad Design
To achieve assembly yields and solder joints of high reliability, it is recommended that
the PCB pad size be designed as follows:
The sizes of the solder pads on customers' PCBs are the same as those of the
module package's solder pads. For details, see the following figure.

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Process Design

Figure 6-5 PCB pad design (Top View) (Unit: mm)

6.7.3 Solder Mask
NSMD is recommended. In addition, the solder mask of the NSMD pad design is
larger than the pad so the reliability of the solder joint can be improved.
The solder mask must be 100 µm–150 µm larger than the pad, that is, the single side
of the solder mask must be 50 µm–75 µm larger than the pad. The specific size
depends on the processing capability of the PCB manufacturer.

6.7.4 Requirements on PCB Layout


To reduce deformation, a thickness of at least 1.0 mm is recommended.



Other devices must be located more than 3 mm (5 mm recommended) away from
the two parallel sides of the LGA module (rework requirement),and other sides
with 0.6 mm. The minimum distance between the LGA module and the PCB edge
is 0.3 mm.

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

Process Design

When the PCB layout is double sided, the LGA module must be placed on the
second side for assembly; so as to avoid module dropped from PCB or
component (located in module) re-melding defects caused by uneven weight.

Figure 6-6 PCB Layout (unit: mm)

6.8 Thermal Design Solution
When the module works in the maximum power condition, the module has high power
consumption (for details, see 5.4.2 Power Consumption). To improve the module
reliability and stability, focus on the thermal design of the device to speed up heat
dissipation. For thermal characteristics of the MU739 module, you can refer to 5.3
Operating and Storage Temperature and Humidity.
Take the following heat dissipation measures:


The copper size on the PCB should be 70 mm x 70 mm or larger.



All copper ground layers of the PCB must be connected to each other through
via-holes.



Increase the quantity of the PCB ground planes.



The ground planes should be as continuous as possible.



If a fan is deployed, place the module at the cold air inlet.



Use heat sink, thermal conductive material and product enclosure to enhance the
heat dissipation of the module.

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−

Use anodized heat sink on the shielding case or the customer PCB on bottom
side for optimal heat dissipation. The recommended heat sink dimensions are
70 mm x 70 mm x1 mm or larger.

−

The material of the heat sink should adopt the higher thermal conductivity
metallic materials, e.g. Al or Cu.

−

The recommended thermal conductivity of the thermal conductive material is
1.0 W/m-k or higher (recommended manufacturers: Laird or Bergquist).

−

Conductive material should obey the following rule: after the heat sink is
fastened to the shielding case, the compression amount of the thermal
conductive material accounts for 15% to 30% of the thermal conductive
material size.

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Hardware Guide

Process Design

−

Conductive material should be as thin as possible.

−

The recommended material of the enclosure is metallic materials, especially
you can add pin fin on the enclosure surface.

−

If the heat sink is installed above the shielding case, you should attach the
thermal conductive material between the shielding case and the heat sink; if
the heat sink is installed below the bottom side of the customer PCB, you
should attach the thermal conductive material between the customer PCB and
the heat sink, as shown in Figure 6-7 and Figure 6-8 . Preferably, we
recommend the heat sink be installed below the bottom side of the customer
PCB.

−

Use more pin fins to enlarge heat dissipation area.

Figure 6-7 Adding heat sink to the module for optimal heat dissipation
Shielding case
Module PCB

Heat sink
Conductive material
Customer PCB

Shielding case
Module PCB

Customer PCB
Conductive material
Heat sink

Figure 6-8 Adding enclosure to enhance the heat dissipation of the module
Shielding case
Module PCB
Customer PCB

Enclosure
Conductive material
Heat sink

Shielding case

Customer PCB

Heat sink
Conductive material
Enclosure

Module PCB

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6.9 Assembly Processes
6.9.1 General Description of Assembly Processes


Tray modules are required at SMT lines, because the module is placed on ESD
pallets.



Reflow ovens with at least seven temperature zones are recommended.



Only twice reflow are allowed. Use reflow ovens or rework stations for soldering,
because the module has large solder pads and cannot be soldered manually.

6.9.2 Stencil Design
It is recommended that the stencil for the module be 0.15 mm in thickness. For the
stencil design, see the following figure:

PCB PADS

Stencil design

Unit: mm

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Process Design

The stencil design has been qualified for HUAWEI mainboard assembly, customers can adjust
the parameters by their motherboard design and process situation to assure LGA soldering
quality and no defect.

6.9.3 Reflow Profile
The LGA module must be reflowed on the top side of customer's development board.
For the soldering temperature of the LGA module, see the following figure.
Figure 6-9 Reflow profile

Table 6-2 Reflow parameters
Temperature Zone

Time

Key Parameter

Preheat zone
(40°C–165°C)

Heating rate: 0.5°C/s–2°C/s

Soak zone

(t1–t2): 60s–100s

Reflow zone (> 217°C)

(t3–t4): 45s–80s

Peak reflow temperature:
235°C–245°C

Cooling zone

Cooling rate: 2°C/s ≤ Slope ≤ 5°C/s

(165°C–217°C)

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6.10 Specification of Rework
6.10.1 Process of Rework

Huawei provides the rework scheme to assemble and remove the module. After the
rework, customers can evaluate the reliability based on their own requirement.

6.10.2 Preparations of Rework


Remove barrier or devices that cannot stand high temperature before rework.



If the device to be reworked is beyond the storage period, bake the device
according to Table 6-1 .

6.10.3 Removing the Module
The solder is molten and reflowed through heating during the module removing
process. The heating rate must be quick but controllable in order to melt all the solder
joints simultaneously. Pay attention to protect the module, PCB, neighboring devices,
and their solder joints against heating or mechanical damages.

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

The module has many solder pads and the pads are large. Therefore, common soldering
irons and heat guns cannot be used in the rework. Rework must be done using either
infrared heating rework stations or hot air rework stations. Infrared heating rework stations
are preferred, because they can heat components without touching them. In addition,
infrared heating rework stations produce less solder debris and less impact on the module,
while hot air rework stations may cause shift of other components not to be reworked.



You must not reuse the module after disassembly from PCB during rework.



It is proposed that a special clamp is used to remove the module.

HUAWEI MU739 HSPA+ LGA Module
Hardware Guide

Process Design

Figure 6-10 Equipment used for rework

6.10.4 Welding Area Treatmtent
Step 1 Remove the old solder by using a soldering iron and solder braid that can wet the
solder.
Step 2 Clean the pad and remove the flux residuals.
Step 3 Solder pre-filling: Before the module is installed on a board, apply some solder paste
to the pad of the module by using the rework fixture and stencil or apply some solder
paste to the pad on the PCB by using a rework stencil.
It is recommended that a fixture and a mini-stencil be made to apply the solder paste in the
rework.

6.10.5 Module Installation
Install the module precisely on the module and ensure the right installation direction of
the module and the reliability of the electrical connection with the PCB. It is
recommended that the module be preheated in order to ensure that the temperature
of all parts to be soldered is uniform during the reflow process. The solder quickly
reflows upon heating so the parts are soldered reliably. The solder joints undergo
proper reflow duration at a preset temperature to form a favorable Intermetallic
Compound (IMC).


It is recommended that a special clamp be used to pick the module when the module is
installed on the pad after applied with some solder.



A special rework device must be used for the rework.

6.10.6 Specifications of Rework
Temperature parameter of rework: for either the removing or welding of the module,
the heating rate during the rework must be equal to or smaller than 3°C/s, and the
peak temperature between 240°C–250°C. The following parameters are
recommended during the rework.

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Process Design

Figure 6-11 Temperature graph of rework

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Certifications

7.1 About This Chapter
This chapter gives a general description of certifications of MU739.

7.2 Certifications
Table 7-1 shows certifications the MU739 has been implemented. For more demands, please
contact us for more details about this information.

Table 7-1 Product Certifications
Certification

Model name
MU739



FCC



CCC



NCC

A-TICK



Jate & Telec

EU RoHS



PVC-Free

GCF



PTCRB



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Safety Information

Read the safety information carefully to ensure the correct and safe use of your
wireless device. Applicable safety information must be observed.

8.1 Interference
Power off your wireless device if using the device is prohibited. Do not use the
wireless device when it causes danger or interference with electric devices.

8.2 Medical Device


Power off your wireless device and follow the rules and regulations set forth by
the hospitals and health care facilities.



Some wireless devices may affect the performance of the hearing aids. For any
such problems, consult your service provider.



Pacemaker manufacturers recommend that a minimum distance of 15 cm be
maintained between the wireless device and a pacemaker to prevent potential
interference with the pacemaker. If you are using an electronic medical device,
consult the doctor or device manufacturer to confirm whether the radio wave
affects the operation of this device.

8.3 Area with Inflammables and Explosives
To prevent explosions and fires in areas that are stored with inflammable and
explosive devices, power off your wireless device and observe the rules. Areas stored
with inflammables and explosives include but are not limited to the following:


Gas station



Fuel depot (such as the bunk below the deck of a ship)



Container/Vehicle for storing or transporting fuels or chemical products



Area where the air contains chemical substances and particles (such as granule,
dust, or metal powder)



Area indicated with the "Explosives" sign

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Safety Information



Area indicated with the "Power off bi-direction wireless equipment" sign



Area where you are generally suggested to stop the engine of a vehicle

8.4 Traffic Security


Observe local laws and regulations while using the wireless device. To prevent
accidents, do not use your wireless device while driving.



RF signals may affect electronic systems of motor vehicles. For more information,
consult the vehicle manufacturer.



In a motor vehicle, do not place the wireless device over the air bag or in the air
bag deployment area. Otherwise, the wireless device may hurt you owing to the
strong force when the air bag inflates.

8.5 Airline Security
Observe the rules and regulations of airline companies. When boarding or
approaching a plane, power off your wireless device. Otherwise, the radio signal of
the wireless device may interfere with the plane control signals.

8.6 Safety of Children
Do not allow children to use the wireless device without guidance. Small and sharp
components of the wireless device may cause danger to children or cause suffocation
if children swallow the components.

8.7 Environment Protection
Observe the local regulations regarding the disposal of your packaging materials,
used wireless device and accessories, and promote their recycling.

8.8 WEEE Approval
The wireless device is in compliance with the essential requirements and other
relevant provisions of the Waste Electrical and Electronic Equipment Directive
2012/19/EU (WEEE Directive).

8.9 RoHS Approval
The wireless device is in compliance with the restriction of the use of certain
hazardous substances in electrical and electronic equipment Directive 2011/65/EU
(RoHS Directive).

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Safety Information

8.10 Laws and Regulations Observance
Observe laws and regulations when using your wireless device. Respect the privacy
and legal rights of the others.

8.11 Care and Maintenance
It is normal that your wireless device gets hot when you use or charge it. Before you
clean or maintain the wireless device, stop all applications and power off the wireless
device.


Use your wireless device and accessories with care and in clean environment.
Keep the wireless device from a fire or a lit cigarette.



Protect your wireless device and accessories from water and vapour and keep
them dry.



Do not drop, throw or bend your wireless device.



Clean your wireless device with a piece of damp and soft antistatic cloth. Do not
use any chemical agents (such as alcohol and benzene), chemical detergent, or
powder to clean it.



Do not leave your wireless device and accessories in a place with a considerably
low or high temperature.



Use only accessories of the wireless device approved by the manufacture.
Contact the authorized service center for any abnormity of the wireless device or
accessories.



Do not dismantle the wireless device or accessories. Otherwise, the wireless
device and accessories are not covered by the warranty.



The device should be installed and operated with a minimum distance of 20 cm
between the radiator and your body.

8.12 Emergency Call
This wireless device functions through receiving and transmitting radio signals.
Therefore, the connection cannot be guaranteed in all conditions. In an emergency,
you should not rely solely on the wireless device for essential communications.

8.13 Regulatory Information
The following approvals and notices apply in specific regions as noted.

8.13.1 CE Approval (European Union)
The wireless device is approved to be used in the member states of the EU. The
wireless device is in compliance with the essential requirements and other relevant
provisions of the Radio and Telecommunications Terminal Equipment Directive
1999/5/EC (R&TTE Directive).

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Safety Information

8.13.2 FCC Statement
Federal Communications Commission Notice (United States): Before a wireless
device model is available for sale to the public, it must be tested and certified to the
FCC that it does not exceed the limit established by the government-adopted
requirement for safe exposure.
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) this device may not cause harmful interference, and (2)
this device must accept any interference received, including interference that may
cause undesired operation.
Warning: Changes or modifications made to this equipment not expressly approved
by HUAWEI may void the FCC authorization to operate this equipment.

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Appendix A Circuit of Typical Interface

Appendix A Circuit of Typical Interface
LGA Module and ANT Interface
J201
MAIN_ANT

RESET_BB_N

RESET_PMU_N

JTAG_TCK
JTAG_TDI
JTAG_TDO
JTAG_TMS
JTAG_TRST_N

USIM_DATA_0
USIM_RST
USIM_VCC

9
12
11
2
10
8
27
29
25
20
7
5
1
3

USB

USB_DM

USB_DP

24
23

ON2_N

RESOUT_N
JTAG_TCK
JTAG_TDI
JTAG_TDO
JTAG_TMS
JTAG_TRST_N
USIM_CLK
USIM_IO
USIM_RST
USIM_VCC
NC
NC
NC
NC
USB_DM
USB_DP

27N

L205

L206

27N
L204

These components values should be adjusted according to actual PCB layout and routings

VBAT_PA_DCDC

C219

C218

C217

C202

330P100NF 1UF

C204

VBAT

L201

-100

close to pin 51/52

22U 220U 220U 220U

VBAT_PMU

VBAT

L202

330P 100NF 1UF

C216

RESERVED

3
0

USB_VBUS is for USB

BODYSAR_N

USB_VBUS

should be connected to VBAT_PMU if use USB;
keep NC if don't need USB

RESERVED
RESERVED
RESERVED

61 NC
62
63
64
66
67
68
70
71
73
74
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114

Control signal

36
35
33
34

W_DISABLE_N

RESERVED
RESERVED
RESERVED
RESERVED

ON2_N

USIM_CLK

USIM

LED#
RESERVED

26
28
30
37

RESET_BB_N

RESOUT_N

JTAG

46
45

NC
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
GND10
GND11
GND12
GND13
GND14
GND15
GND16
GND17
GND18
GND19
GND20
GND21
GND22
GND23
GND24
GND25
GND26
GND27
GND28
GND29
GND30
GND31
GND32
GND33
GND34
GND35
GND36
GND37
GND38
GND39
GND40
GND41
GND42
GND43
GND44
GND45
GND46
GND47

WAKEUP_OUT

RESET

I2S_WA0
RESERVED

WAKEUP_IN

47 NC
50 NC

VCC_IN

75
76
77
78
60
4
32

100PF

2
0

ON signal

I2S_RX
I2S_TX

RESERVED
RESERVED

Power suuply

VCC_EXT1_1V8

C203

58
59

NC1
NC2
NC3
NC4
NC
NC
USB_VBUS

VBAT_PMU

C206

56
57

I2S_CLK0
RESERVED

W_DISABLE_N

C213

3 2

VBAT_PA_DCDC

C207

I2S_RX

RESERVED
RESERVED

VCC_IN
WAKEUP_IN
WAKEUP_OUT

J202
AUX_ANT

22U

-100

close to pin 49

VCC_EXT1_1V8

close to pin 38

4.7UF

100NF

VCC_IN

VCC_EXT1_1V8

R201

100NF

C211

RESERVED
RESERVED

I2S_WA0

BODYSAR_N

AUX_ANT

22
21

55
54

LED #

LED

MAIN_ANT

RESERVED
RESERVED

I2S_CLK0

I2S_TX

15
14

19
18

I2S

VCC_EXT1

27N

RESERVED

51
52
49

L203

AUX_ANT

VBAT_PA
VBAT_PA
VBAT_PMU

USIM_DET

C201

MAIN_ANT

RESERVED
RESERVED

SLEEP_STATUS

C205

ANT

MU739

C209

41
44
17
16
6

C210

USIM_DET

C208

SLEEP_STATUS

100PF

C212

4.7UF
close to pin 40

Issue 11 (2015-10-08)

HUAWEI MU739 HSPA+ LGA Module
Hardware Guide

Appendix A Circuit of Typical Interface

ON2_N: Low level active
ON2_N

VBAT_PMU

ON signal from AP
O2N_AP

2.2K

1 R301
B

LED

C 3
NPN-BEC
Q301

3 C R316

200

2.2K

R314

100NF

B 1

NPN-BEC
Q308
E2

LED#

C305

ON2_N can be controlled by a host processor
GPIO(with internal PU under reset) also

RESET_BB_N

C 3

C301

1 BR306

NPN-BEC
Q303

RESET signal from AP

2.2K

RESET_BB_N_AP
VIO_AP

33PF

power supply from AP

R307
2 E

R321

VIO_AP

Q304

W_DISABLE_N

3 C

R308

2.2K

W_DISABLE_AP

W_DISABLE signal from AP

SLEEP_STATUS

2.2K

R320 B 1

NPN-BEC
Q320

100NF

R312
100K
3 C

R318
1 B

SLEEP_STATUS_AP

Sleep status to AP

wakeup signal to AP

NPN-BEC
Q306

100NF

C303

R311 B 1

33PF

NPN-BEC
Q309
2E

2.2K

WAKEUP_OUT_N_AP

C 3

RESET_OUT would be monitored by a host processor GPIO (with internal PU)also.

C306

WAKEUP_OUT

10K

power supply from AP

100K

RESOUT_N_AP

VIO_AP

C340

C 3

10K
1K

RESOUT_N

VCC_EXT1

proximity sensor input

BODYSAR_N
Diode

VCC_EXT1

4.7 k

ESD protection

4.7 k

USIM_VCC
USIM_DET
USIM

USIM_CLK
USIM_DATA
USIM_RST

33 pF

Issue 11 (2015-10-08)

33 pF 33 pF 33 pF

1 µF

33 pF

HUAWEI MU739 HSPA+ LGA Module
Hardware Guide

Appendix B Acronyms and Abbreviations

Appendix B Acronyms and
Abbreviations

Acronym or Abbreviation

Expansion

CCC

China Compulsory Certification

European Conformity

Coding Scheme

CSD

Circuit Switched Data

Direct Current

DMA

Direct Memory Access

EBU

External Bus Unit

EIA

Electronic Industries Association

EMC

Electromagnetic Compatibility

ESD

Electrostatic Discharge

European Union

FCC

Federal Communications Commission

FDD-TDMA

Frequency Division Duplexing–Time Division
Multiple Access

GMSK

Gaussian Minimum Shift Keying

GPIO

General-purpose I/O

GPRS

General Packet Radio Service

GSM

Global System for Mobile Communication

HSDPA

High Speed Downlink Packet Access

HSPA+

Enhanced High Speed Packet Access

HSUPA

High Speed Up-link Packet Access

Issue 11 (2015-10-08)

HUAWEI MU739 HSPA+ LGA Module
Hardware Guide

Appendix B Acronyms and Abbreviations

Acronym or Abbreviation

Expansion

IPC

Inter Processor Communications

ISO

International Standards Organization

I2S

I2C Sound

LCP

Liquid Crystal Polyester

LDO

Low-Dropout

LED

Light-Emitting Diode

LGA

Land Grid Array

MCP

Multi-chip Package

MIPI

Mobile Industry Processor Interface

NTC

Negative Temperature Coefficient

Power Amplifier

PBCCH

Packet Broadcast Control Channel

PCB

Printed Circuit Board

PDU

Protocol Data Unit

PMU

Power Management Unit

Radio Frequency

RoHS

Restriction of the Use of Certain Hazardous
Substances

RTC

Real-time Clock

TTL

Transistor-transistor Logic

TVS

Transient Voltage Suppressor

UMTS

Universal Mobile Telecommunications System

USB

Universal Serial Bus

USIM

Universal Subscriber Identity Module

VSWR

Voltage Standing Wave Ratio

WCDMA

Wideband Code Division Multiple Access

Issue 11 (2015-10-08)

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HUAWEI MU739 HSPA+ LGA Module Hardware Guide-(V100R001_11, English)

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