Insight SiP ISP130301 Bluetooth Low Energy Module User Manual 00 isp ble DS130301 R5

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Document ID	2330333
Application ID	a4MK2nn9T44UlifPJzh9SQ==
Document Description	User manual_00_isp_ble_DS130301_R5
Short Term Confidential	No
Permanent Confidential	No
Supercede	No
Document Type	User Manual
Display Format	Adobe Acrobat PDF - pdf
Filesize	97.41kB (1217579 bits)
Date Submitted	2014-07-21 00:00:00
Date Available	2015-01-18 00:00:00
Creation Date	2014-06-30 15:53:29
Producing Software	Microsoft® Office Word 2007
Document Lastmod	2014-06-30 15:53:29
Document Title	User manual_00_isp_ble_DS130301_R5
Document Creator	Microsoft® Office Word 2007
Document Author:	Gen

BLE MODULE
ISP130301
ISP130301
Bluetooth Low Energy Module
with Integrated Antenna
Key Features
Single Mode BLE v4.0 Slave or Master
Proprietary 2.4 GHz protocols
Based on Nordic Semiconductor nRF51 family
2.4GHz low energy RF Transceiver
32bit ARM Cortex M0 CPU with 256kB Flash
Analog and Digital peripherals
Ultra Low Power Consumption
Single 2.1 to 3.6 V supply
Very small size 8.0 x 11.0 x 1.2 mm
Temperature -25 to 75 °C
Fully integrated RF matching and Antenna
Integrated 16 MHz and 32.768 kHz Clocks
Certifications
FCC certification pending
CE certification pending
IC certification pending
Bluetooth SIG certified
RoHS compliant
Applications
Space constrained BLE Slave Devices
Sport and fitness sensors
Health care sensors
Out of Range (OOR) sensors
Personal User Interface Devices (PUID)
Remote controls
General Description
This module is based on nRF51822 Nordic
Semiconductor 2.4GHz wireless System on Chip
(SoC) integrating a 2.4 GHz transceiver, a 32 bit
ARM Cortex™-M0 CPU, a flash memory, and
analog and digital peripherals. It can support BLE
and a range of proprietary 2.4 GHz protocols, such
as Gazell from Nordic Semiconductor.
Fully qualified BLE stacks for nRF51822 are
implemented in the S100 series of SoftDevices
which can be freely downloaded. ISP130301 can
then be used in Master and Slave modes for BLE
and for both ends of other proprietary protocols.
The ANT protocol can be handled on request.
The module is specifically designed for both PC
peripherals and ultra low power applications such
as sports and wellness sensors. Ultra low power
consumption and advanced power management
enables battery lifetimes up to several years on a
coin cell battery. Even though its very small size
8x11x1.2mm, the module integrates decoupling
capacitors, 16 MHz and 32 kHz crystals, load
capacitors, DC-DC converter, RF matching circuit
and antenna in addition to the wireless SoC.
The module forms a standalone BLE node
for which only the addition of a suitable DC power source is necessary for proximity or Out of Range
applications. Sensor applications require only the further addition of the appropriate sensors. As the
module has several end applications, the antenna was designed to be compatible with several ground
plane sizes such as USB dongle or cell phone.
June 30, 2014
Document Ref: isp_ble_DS130301_R5
Page 1/14
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party with out written permission.
Specification subject to change without notice.
BLE MODULE
ISP130301
Contents
1. Electrical Specifications ........................................................................................................... Page 1-2
2. RF Performances .................................................................................................................... Page 1-6
3. Product Development Tools .................................................................................................... Page 1-9
4. Mechanical Outlines .............................................................................................................. Page 1-10
5. Quality & User Information..................................................................................................... Page 1-13
6. Packaging & Storage ............................................................................................................. Page 1-14
1. Electrical Specifications
Electrical Performance
The specifications of the module follow those of the nRF51822. The following high level parameters are
given for the module.
The operating temperature range is -25 to +75 °C with the following performances.
Parameter
Value
Unit
2.1 to 3.6
12.6
mA
Peak current,
transmitter active +4 dBm Output Power
16
mA
Peak current,
transmitter active 0 dBm Output Power
10.5
mA
Current drain, connection-less state
0.5
µA
Current drain between connection events
2.3
µA
Supply voltage
Supply Voltage
Current consumption
Static levels
Peak current, receiver active (supply at 2.1V)
The EUT is intended to be supplied by a current limited power source.
Pin Assignment
The module uses an LGA format with a double row of pads on a 0.65 mm pitch. The pad layout follows
the QFN Jedec standard for 2 row LGA parts.
Pads 1 thru 56 are signal pins 0.4 x 0.4 mm, Pad 57 is an exposed metal pad that is connected to
ground. The NC pads are 0.8 x 0.8 or 0.4 x 0.4 mm and are to be connected to isolated metal pads on
the application PCB for mechanical stability and reliability (drop test).
June 30, 2014
Document Ref: isp_ble_DS130301_R5
Page 2/14
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party with out written permission.
Specification subject to change without notice.
BLE MODULE
ISP130301
Pin
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Name
P0_07
NC
P0_09
NC
P0_13
NC
P0_19
NC
P0_17
NC
P0_20
VSS
NC
VSS
NC
VSS
NC
VSS
NC
VSS
NC
VSS
VSS
OUT_MOD
Pin function
Digital I/O
Not Connected
Digital I/O
Not Connected
Digital I/O
Not Connected
Digital I/O
Not Connected
Digital I/O
Not Connected
Digital I/O
Ground
Not Connected
Ground
Not Connected
Ground
Not Connected
Ground
Not Connected
Ground
Not Connected
Ground
Ground
Module I/O
25
26
VDD_PA
OUT_ANT
PA supply
Antenna I/O
27
28
29
30
31
32
33
VSS
VSS
VCC_nRF
VSS
SWDCLK
P0_18
SWDIOnRESET
P0_16
P0_15
P0_14
P0_12
P0_10
P0_11
P0_05-AIN6
Ground
Ground
Power
Ground
Digital Output
Digital I/O
Digital I/O
34
35
36
37
38
39
40
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Analog input
Description
General purpose I/O pin
Isolated pad on application PCB for mechanical stability
General purpose I/O pin
Isolated pad on application PCB for mechanical stability
General purpose I/O pin
Isolated pad on application PCB for mechanical stability
General purpose I/O pin
Isolated pad on application PCB for mechanical stability
General purpose I/O pin
Isolated pad on application PCB for mechanical stability
General purpose I/O pin
Should be connected to ground plane on application PCB
Isolated pad on application PCB for mechanical stability
Should be connected to ground plane on application PCB
Isolated pad on application PCB for mechanical stability
Should be connected to ground plane on application PCB
Isolated pad on application PCB for mechanical stability
Should be connected to ground plane on application PCB
Isolated pad on application PCB for mechanical stability
Should be connected to ground plane on application PCB
Isolated pad on application PCB for mechanical stability
Should be connected to ground plane on application PCB
Should be connected to ground plane on application PCB
This pin is the RF I/O pin of the BLE module. It should be connected
to Pin 26 OUT_ANT for normal operation. During certification the pin
may be connected via to an RF connector for module measurement
using a Bluetooth test setup.
PA supply indicates Transmit mode (Active High)
This pin is connected to the internal antenna. It should be
connected to Pin 24 OUT_MOD for normal operation. During
certification the pin may be connected to an RF connector for
antenna measurement
Should be connected to ground plane on application PCB
Should be connected to ground plane on application PCB
Power supply (2.1 – 3.6V). VDD in nRF51822 doc.
Should be connected to ground plane on application PCB
HW debug and flash programming I/O
General purpose I/O pin
System reset (active low). Also HW debug and flash
programming I/O
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
ADC input 6
June 30, 2014
Document Ref: isp_ble_DS130301_R5
Page 3/14
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party with out written permission.
Specification subject to change without notice.
BLE MODULE
ISP130301
Pin
41
Name
P0_06-AIN7AREF1
42
P0_03-AIN4
43
P0_04-AIN5
44
P0_01-AIN2
45
46
P0_31
P0_02-AIN3
47
48
P0_30
P0_00AREF0
P0_29
P0_28
P0_24
P0_23
P0_21
P0_22
P0_25
P0_08
GND_EP
49
50
51
52
53
54
55
56
57
56
NC
54
55
52
53
50
51
Pin function
Digital I/O
Analog input
Analog input
Digital I/O
Analog input
Digital I/O
Analog input
Digital I/O
Analog input
Digital I/O
Digital I/O
Analog input
Digital I/O
Digital I/O
Analog input
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Ground
48
49
46
47
44
45
42
43
Description
General purpose I/O pin
ADC input 7
ADC Reference voltage
General purpose I/O pin
ADC input 4
General purpose I/O pin
ADC input 5
General purpose I/O pin
ADC input 2
General purpose I/O pin
General purpose I/O pin
ADC input 3
General purpose I/O pin
General purpose I/O pin
ADC Reference voltage
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
Exposed metal pad. Should be connected to ground plane on
application PCB
40
NC
41
39
38
36
37
35
57
EP GND
34
33
32
31
10
30
11
29
13
NC
12
15
14
17
16
19
18
21
20
23
22
25
24
TOP VIEW
27
26
28
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
ISP130301pad placement and pin assignment
for the LGA QFN package
NC
NC
NC
NC
NC
NC
NC
June 30, 2014
Document Ref: isp_ble_DS130301_R5
Page 4/14
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party with out written permission.
Specification subject to change without notice.
BLE MODULE
ISP130301
Electrical Schematic
Electrical schematic showing ISP130301 module connections
June 30, 2014
Document Ref: isp_ble_DS130301_R5
Page 5/14
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party with out written permission.
Specification subject to change without notice.
BLE MODULE
ISP130301
2. RF Performances
RF Specifications according to standards
Value
BT V4
Std limit
Unit
Condition
-20 to +4
-20 to 10
dBm
Channels
0 to 39
Better than
+/-20
+/- 50
Hz
Channels
0 to 39
-93
-70
dBm
Level for BER
<0,1% ideal Tx
> 200
Open field @1m
height
EIRP
4.6
dBm
Antenna Gain
0.6
dBi
Rx sensitivity
51.4
dBµV/m
Parameter
Output Power
RF Frequency tolerance
Rx sensitivity
Max range
Typical Antenna Return Loss
Module mounted on a USB dongle ground plane
June 30, 2014
Document Ref: isp_ble_DS130301_R5
Page 6/14
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party with out written permission.
Specification subject to change without notice.
BLE MODULE
ISP130301
Radiation Pattern in 3 planes
Module mounted on a USB dongle ground plane
=90°
-10
-10
-20
-20
-30
-30
-40
-40
=0°
=0°
gain (dBi) @ 2.45GHz
gain (dBi) @ 2.45GHz
=0°
=90°
-10
-20
-30
-40
=90°
gain (dBi) @ 2.45GHz
Ground Plane Effect Simulation
USB dongle
ground plane
(size : 18 x 30 mm²)
Cell phone config 1
ground plane
(size : 40 x 100 mm²)
Cell phone config 1 with
side ground plane
(size : 40 x 100 mm²)
June 30, 2014
Document Ref: isp_ble_DS130301_R5
Page 7/14
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party with out written permission.
Specification subject to change without notice.
BLE MODULE
ISP130301
Cell phone config 2 with
side ground plane
(size : 40 x 100 mm²)
Cell phone config 3 with
side ground plane
(size : 40 x 100 mm²)
June 30, 2014
Document Ref: isp_ble_DS130301_R5
Page 8/14
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party with out written permission.
Specification subject to change without notice.
BLE MODULE
ISP130301
3. Product Development Tools
Interface
ISP130301 integrates a full microprocessor interface with up to 32 General Purpose I/O pins (GPIO) and
several functions (2 x SPI, 2 x I2C, UART, 8 x ADC, SWDIO interface).
Hardware
The following development kit is recommended for using and testing ISP130301 module:
Insight SiP Development Kit (ISP130301-DK1), need to be purchased separately
Development Tools and Software
The following development tools and software are recommended for using and testing ISP130301
module:
Nordic Semiconductor nRFgo Studio (downloadable from www.nordicsemi.com after purchasing
ISP130301-DK1)
Nordic Semiconductor Master Control Panel (downloadable from www.nordicsemi.com after
purchasing ISP130301-DK1)
Keil MDK-ARM Lite (downloadable for free from https://www.keil.com/demo/eval/arm.htm)
Segger J-Link Lite (downloadable for free from http://www.segger.com/jlink-software.html)
S100 nRF51822 SoftDevice: fully qualified Bluetooth low energy stacks for nRF51822 integrated in
ISP130301 module. The S100 series of SoftDevices (object code, no source) can be downloaded
from www.nordicsemi.com after purchasing ISP130301-DK1
nRF51 Software Development Kit (SDK): nRF51 SDK can be downloaded from www.nordicsemi.com
after purchasing ISP130301-DK1. It contains example of source codes applications (C language):
- Precompiled HEX files
- Source code
- Keil ARM project files
June 30, 2014
Document Ref: isp_ble_DS130301_R5
Page 9/14
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party with out written permission.
Specification subject to change without notice.
BLE MODULE
ISP130301
4. Mechanical Outlines
Mechanical Dimensions
Dimensional drawing for 8 x 11 x 1.2 mm, 57-Pad LGA Package
5 mm
PIN 1 INDICATOR
C 0.3 mm
0.3 mm
0.4 mm
0.8 mm
0.1 mm
0.275 mm
0.65 mm
3 mm
0.8 mm
11 mm
0.4 mm
1.0 mm
0.4 mm
0.4 mm
0.4 mm
8 mm
1.2 mm
June 30, 2014
Document Ref: isp_ble_DS130301_R5
Page 10/14
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party with out written permission.
Specification subject to change without notice.
BLE MODULE
ISP130301
SMT Assembly Guidelines
Recommended PCB Land Pattern and Solder Mask layout
June 30, 2014
Document Ref: isp_ble_DS130301_R5
Page 11/14
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party with out written permission.
Specification subject to change without notice.
BLE MODULE
ISP130301
Antenna Keep-Out Zone
Recommended metal keep out areas for optimal antenna performance:
no metal, no traces and no components on any layer except mechanical LGA pads.
June 30, 2014
Document Ref: isp_ble_DS130301_R5
Page 12/14
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party with out written permission.
Specification subject to change without notice.
BLE MODULE
ISP130301
5. Quality & User information
USA – User information
This intends to inform how to specify the FCC ID of our module “ISP130301” on the product. Based on
the Public Notice from FCC, the host device should have a label which indicates that it contains our
module. The label should use wording such as: “Contains FCC ID: XXXXX-ISP130301”.
Any similar wording that expresses the same meaning may be used.
The label of the host device should also include the below FCC Statement. When it is not possible, this
information should be included in the User Manual of the host device:
“This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions.
(1) This device may not cause harmful interference
(2) This device must accept any interference received, including interference that may cause undesired
operation.
Caution: Any Changes or modifications not expressly approved by the party responsible for compliance
could void the user’s authority to operate the equipment.”
CANADA – User information
This intends to inform how to specify the IC ID of our module “ISP130301” on the product. According to
Canadian standards “RSS-210” and “RSS-Gen”, the host device should have a label which indicates that
it contains our module.
The label should use wording such as: “Contains IC: XXXXXX-ISP130301”.
Any similar wording that expresses the same meaning may be used.
The label of the host device should also include the below IC Statement. When it is not possible, this
information should be included in the User Manual of the host device:
“This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the
following two conditions: (1) this device may not cause interference, and (2) this device must accept any
interference, including interference that may cause undesired operation of the device.
Cette notice nous informe comment spécifier le IC ID de notre module ISP130301. Selon les normes
Canadiennes "RSS-210" et "RSS-Gen", le dispositif doit avoir une étiquette mentionnant qu’il contient
notre module. L’étiquette doit être sous la forme : "IC :XXXXXX-ISP130301".
Tout libellé similaire exprimant le même sens peut être utilisé.
L’étiquette du dispositif devra également inclure la déclaration ci-dessous. Si cela n’est pas possible,
cette information devra être précisée dans le manuel de l’utilisateur :
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts
de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire
de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le
brouillage est susceptible d'en compromettre le fonctionnement.”
June 30, 2014
Document Ref: isp_ble_DS130301_R5
Page 13/14
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party with out written permission.
Specification subject to change without notice.
BLE MODULE
ISP130301
6. Packaging & Storage
Package marking
S P
3 0 3 0 1 C
Y W W
ISP130301C
YYWW
5 mm max
IC
ISP130301
YY
WW
Product number
Hardware version
Two digit year number
Two digit week number
Moisture Sensitivity
All plastic packages absorb moisture. During typical solder reflow operations when SMDs are mounted
onto a PCB, the entire PCB and device population are exposed to a rapid change in ambient
temperature. Any absorbed moisture is quickly turned into superheated steam. This sudden change in
vapor pressure can cause the package to swell. If the pressure exerted exceeds the flexural strength of
the plastic mold compound, then it is possible to crack the package. Even if the package does not crack,
interfacial delamination can occur.
Since the device package is sensitive to moisture absorption, it is recommended to bake the product
before assembly. The baking process for dry packing is 24 hours at 125°C.
June 30, 2014
Document Ref: isp_ble_DS130301_R5
Page 14/14
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party with out written permission.
Specification subject to change without notice.

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Author                          : Gen
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Create Date                     : 2014:06:30 15:53:29+02:00
Modify Date                     : 2014:06:30 15:53:29+02:00
Producer                        : Microsoft® Office Word 2007

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