Intel Mobile Communications 104001 Wireless Bluetooth module User Manual rok104001 ds a7 v55 rok104001 ds a7 v55

Intel Mobile Communications GmbH Wireless Bluetooth module rok104001 ds a7 v55 rok104001 ds a7 v55

Users Manual

Never stop thinking. Data Sheet, DS3, June, 2003Wireless SolutionsROK104001BluetoothTM System Module
Edition 2003-06-16Published by Infineon Technologies AG,St.-Martin-Strasse 53,81669 München, Germany© Infineon Technologies AG 2003.All Rights Reserved.Attention please!The information herein is given to describe certain components and shall not be considered as warranted characteristics.Terms of delivery and rights to technical change reserved.We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein.Infineon Technologies is an approved CECC manufacturer.InformationFor further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (www.infineon.com).WarningsDue to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office.Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.For questions on technology, delivery and prices please contact the InfineonTechnologies Offices in Germany or the Infineon Technologies Companies andRepresentatives worldwide: see our webpage at http://www.infineon.com.ROK104001 Revision History: 2003-06-16 DS3Previous Version: 2003-05-16 DS2Page Subjects (major changes since last revision)Updated Information on FCC and R&TTE Approval,Updated section 3.6.8 on Power Management 2003-JuneDocument has been updated: 2003-MayDocument’s layout has been changed: 2003-Feb.
ROK104001 Data Sheet 3DS1, 2003-02-01 1Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51.1 Key Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61.2 Reference documents for ECP firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . 62Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72.1 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72.2 Pin Definition and Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113.1 Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113.2 Design Sections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123.2.1 Radio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123.2.2 Baseband . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123.2.3 Voltage Regulation Section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123.2.4 Crystal Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133.2.5 Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133.3 Module HW Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133.3.1 Host Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133.3.1.1 UARTs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133.4 Other Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143.4.1 Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143.4.2 General Purpose I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143.4.3 PCM Voice Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143.4.4 Antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163.5 Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163.5.1 Firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163.5.2 Bluetooth Module Stack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173.5.3 LM & HCI Firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173.5.4 Host Controller Interface (HCI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173.5.5 Link Manager (LM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183.6 Design Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193.6.1 Power-up Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193.6.2 RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193.6.3 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193.6.4 Antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203.6.5 Shielding / EMC Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203.6.5.1 PCB Design Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213.6.5.2 Pad Size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223.6.5.3 Spurious Emissions Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . 233.6.6 Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233.6.7 Additional Decoupling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233.6.8 Power Management Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233.7 Assembly Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243.7.1 Solder Paste . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
ROK104001Data Sheet 4DS1, 2003-02-01 3.7.2 Soldering Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243.7.3 Placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253.7.4 Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253.8 FCC Modular Approval . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253.9 R&TTE Approval . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 264Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274.2 DC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 285Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 355.1 Module Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 355.2 Reel Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 366Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 376.1 Pinout (bottom view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 386.2 Footprint, Land View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 387Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 398Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 399Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Type PackageROK104001 LGA-87BluetoothTM System Module ROK104001Preliminary Data Data Sheet 5DS2, 2003-05-16 1OverviewThe Bluetooth 1.1 System Module ROK104001 is acomplete FCC and R&TTE type approved product forfast implementation and cuts your time-to-market. It is acompact and cost effective radio/baseband module thatcan be implemented in any kind of electronic device. Themodule includes a baseband processor with 4Mbit Flashmemory, a radio solution, interfaces to antenna andapplication, supporting circuitry, together with basicBluetooth software for signaling at HCI level (Host Controller Interface) or ECP level(Embedded Communication Platform). The antenna filter is specially designed for applications in a GSM environment such asinside a mobile phone. The ROK104001 also has a very high threshold for high signallevels in-band, which makes it very suitable to be in an IEEE 802.11b environment. As the ROK104001 is a generic product, it can be used for many different types ofapplications that require Bluetooth capability such as•Computers and peripherals•Handheld devices and accessories•Inustrial and medical sensors•Access points and home base stations•Applications where short time-to-market is required
ROK104001OverviewData Sheet 6DS2, 2003-05-16 1.1 Key Features•A small and complete class 2 Bluetooth system•Forms full Bluetooth functionality with only the addition of an antenna•Point to multipoint, 7 slaves for HCI firmware and 3 slaves for ECP firmware•Power management: PARK, SNIFF & HOLD as well as system power saving•Excellent high signal level performance in-band•Exceptional out-band blocking in all GSM bands•Multiple interfaces UART, PCM, bi-directional serial interface/GPIO•Capability of embedded solutions•Qualified to Bluetooth spec. 1.1•FCC and R&TTE type approved•Supports all Bluetooth profiles1.2 Reference documents for ECP firmware•ECI Protocol Specification•ECI Driver User Manual•ECI Driver Release Notes•ECI Firmware Release NotesThese documents can be provided through your Infineon Technologies sales contact.
ROK104001Pin Description Data Sheet 7DS2, 2003-05-16 2Pin Description2.1 Pin ConfigurationFigure1 ROK104001, Bottom ViewERA00099VTRPNMLKJHG01234567
ROK104001Pin DescriptionData Sheet 8DS2, 2003-05-16 2.2 Pin Definition and FunctionTable1 Pin Definition and FunctionPin Symbol Type 1) DescriptionG0-2 GND Power Mechanical connection to ground G3-4 N.C. Mechanical connection - treat as no connect. Pad required. G5-7 GND Power Mechanical connection to groundH0 N.C. Mechanical connection - treat as no connect. Pad required.H1 GND Power Mechanical connection to groundH2 D- BD, PHY, IOP2 USB data pin (USB function is not supported)H3 D+ BD, PHY, IOP2 USB data pin (USB function is not supported)H4 ON DI, Power When tied to VDD, the module is HW enabledH5 GND Power Ground H6 GND Power Mechanical connection to groundH7 N.C. Mechanical connection - treat as no connect. Pad required.J0 N.C. Mechanical connection - treat as no connect. Pad required.J1 UART2Tx DO, IOP1 Tx data from UART 2 - not supported by HCI FWJ2 UART2CTS DIU, IOP1 Flow control signal, Clear To Send data to UART 2 - not supported by HCI FWJ3 UART1CTS DIU, IOP2 Flow control signal, Clear To Send data to UART 1J4 VDDIO Power External supply rail to the input / output portsJ5 VDD Power Supply VoltageJ6 GND Power Ground J7 N.C. Mechanical connection - treat as no connect. Pad required.K0 N.C. Mechanical connection - treat as no connect. Pad required. K1-2 N.C. Not connectedK3 UART1RTS DO, IOP2 Flow control signal, Request To Send data from UART 1K4 UART1Tx DO, IOP2 Tx data from UART 1K5 N.C. Not connectedK6 GND Power Signal ground K7 N.C. Mechanical connection - treat as no connect. Pad required.L0 N.C. Mechanical connection - treat as no connect. Pad required.L1 PCMRx BDU, IOP2 (input default) PCM receive data (default) L2 PCMSYNC BD, IOP2 PCM data sampling rateL3 WAKEUP DO, IOP2 Indicates that the module wants to be attached (USB function is not supported)L4 GND Power Ground L5 N.C. Not connected
ROK104001Pin Description Data Sheet 9DS2, 2003-05-16 L6 GND Power Ground L7 N.C. Mechanical connection - treat as no connect. Pad required.M0 GND Power Mechanical connection to groundM1 PCMCLK BD, IOP2 PCM clock that sets the PCM data rateM2 EXTINT DID, IOP1 External interrupt for embedded purposesM3 UART1Rx DIU, IOP2 Receive data to UART 1M4 N.C. Not connected M5 PWRAVAIL DID, IOP1 Indicates whether external power is available; used in conjunction with PWRFAIL - not supported by HCI FW M6 N.C. - VTP4 DO Not connected - vendor test point #4M7 GND Power Mechanical connection to groundN0 N.C. Mechanical connection - do not connectN1 PCMTx BD, IOP2 (output default) PCM transmit data (default) N2 UART2Rx DIU, IOP1 Receive data to UART 2 - not supported by HCI FWN3 GPIOB5 BD, IOP2 General purpose signal #5 input / default output for embedded purposesN4 GPIOB4 BD, IOP1 General purpose signal #4 input / default output for embedded purposesN5 UART2RTS DO, IOP1 Flow control signal, Request To Send data from UART 2 - not supported by HCI FWN6 N.C. - VTP3 DI Not connected -vendor test point #3N7 VDD-RFDIG AO Output from internal regulator connected to digital section of the radio. Shall be connected to a minimum capacitance of 2.2µF.P0 N.C. Mechanical connection - treat as no connect. Pad required.P1 GPIOB3 BD, IOP1 General purpose signal #3 input / default output for embedded purposesP2 EXTSYSWAKEUP DI, IOP1 Can be used as an external interrupt to control the EBC - for embedded purposesP3 SERIALCLK BD3, IOP1 Bidirectional serial interface / GPIO clock signalP4 DETACH DIU, IOP2 Indicates that the USB host wants to detach the module (USB function is not supported)P5 N.C. - VTP2 DO Not connected - vendor test point #2P6 GPIOB6 BD, IOP1 General purpose signal #6 input / default output for embedded purposesP7 N.C. Mechanical connection - treat as no connect. Pad required.R0 N.C. - VTP5 AONot connected - vendor test point (VDD_DIG) #5R1-2 GND Power Ground R3 RESET DI, IOP1 Reset signal, active low (must be fed from an open drain output)Table1 Pin Definition and Function (cont’d)Pin Symbol Type 1) Description
ROK104001Pin DescriptionData Sheet 10 DS2, 2003-05-16 R4 GPIOB2 BD, IOP1 General purpose signal #2 input / default output for embedded purposesR5 PWRFAIL DIU, IOP1 Indicates a poer fail condition; used in conjunction with PWRAVAIL - not supported by HCI FWR6 GPIOB7 BD, IOP1 General purpose signal #7 input / default output for embedded purposesR7 N.C. Mechanical connection - treat as no connect. Pad required.T0 N.C. Mechanical connection - treat as no connect. Pad required.T1 GND Power Ground T2 ANT BD, RF 50 Ω antenna connectionT3 GND Power Ground T4 N.C. Not connectedT5 N.C. - VTP1Not connected - vendor test point #1T6SERIALDATABD, IOP1 Serial interface - data signalT7 N.C. Mechanical connection - treat as no connect. Pad required. V0-1 GND Power Mechanical connection to ground(V2) (No pad) V3-7 GND Power Mechanical connection to ground1) AO = Analogue output padBD = Bi-directional padBDU = Bi-directional pad with pull-upDI = Input padDIU = Input pad with pull-upDID = Input pad with pull-downDO = Digital OutputGND = VSS power supply padIOP1 = IO group VDD_DIG power supply padIOP2 = IO group VDD_IO power supply padPOW = Core power supply padPHY = USB transceiver pad shared with UART1 RI and DCD pins (USB function is not supported)RF = Radio Frequency padTable1 Pin Definition and Function (cont’d)Pin Symbol Type 1) Description
ROK104001Functional Description Data Sheet 11 DS2, 2003-05-16 3Functional Description3.1 Functional Block DiagramFigure2 Block DiagramThe ROK104001 is a complete Bluetooth module that has been specified and designedaccording to the Bluetooth System v1.1. Its implementation is based on a high-UART1UART2PCMSerialInterfaceFlashMemoryEBC(ARM7)EmbeddedControlRadio ControlPBM 990 80VoltageRegulationAntennaFilterRa dioASICLoopFilter13 MHzCrystalRx-BalunTx-BalunAntennaSwitchUART1RxDUART1TxDUART1RTSUART1CTSUART2RxDUART2TxDUART2RTSUART2CTSPCMRxPCMTxPCMCLKPCMSYNCSERIALCLKSERIALDATAONVDDVDDIOVDD _RFDIGEXTINTEXTSYSWAKEUPGPIOB2GPIOB3GPIOB4GPIOB5GPIOB6GPIOB7PWRFAILPWRAVAILRESETANT>1µF2.2µFShall bepositionedas closeas possibletomodule.Only required forPMstop mode functionDETACH
ROK104001Functional DescriptionData Sheet 12 DS2, 2003-05-16 performance integrated radio IC working with the baseband controller PBM 990 80, withintegrated flash memory and surrounding secondary components.ROK104001 consists of three major parts; a baseband controller, firmware, and a radio.Multi slot data and voice packets are supported. Communication between the moduleand the host controller is carried out on UART and PCM interfaces. ROK104001 iscompliant with BT version 1.1 and is a Class 2 BT Module. ROK 104 001 is testedaccording to R&TTE and FCC type approval requirements.3.2 Design SectionsROK104001 has five major design sections. Figure 2 illustrates the interaction of thevarious sections. The functionality of each section will be briefly explained.3.2.1 RadioThe radio functionality is achieved by an Infineon Technologies Radio IC, a short-rangemicrowave frequency radio transceiver for Bluetooth communication links based onRFCMOS technology.3.2.2 BasebandThe baseband functionality is achieved by using Infineon Technologies PBM 990 80,providing the baseband functionality and Flash memory. The baseband contains aBluetooth core (EBC); an ARM 7 processor, I/O ports (PCM and UART) and RAMmemory. Firmware is downloaded into the flash memory. The interfaces that areimplemented on the baseband chip are UART, PCM and serial clock interface (bi-directional serial interface / GPIO). PBM99080 provides the link-setup and control routines for the layers above.Furthermore, PBM99080 also provides Bluetooth security like encryption,authentication and key management.Please refer to the PBM99080 data sheet for further information regarding basebandfunctionallity.3.2.3 Voltage Regulation SectionThere are three inputs to the voltage regulation section (VDD, VDD_IO, ON). VDD can befed with 3.1V to 4.75V. The power regulator on the module creates 2.7 V regulatedsupply. A separate power supply rail (VDD_IO) is provided for the I/O ports, UART and PCM.VDD_IO can either be connected to VDD or to a dedicated supply rail, which is the same asthe logical interface of the host.The ON input is the only signal that is required to activate the module.
ROK104001Functional Description Data Sheet 13 DS2, 2003-05-16 3.2.4 Crystal Oscillator An internal crystal oscillator supplies radio IC and Baseband with a stable frequency. Noexternal oscillator or crystal is required.3.2.5 Flash MemoryROK104001 is delivered with 4Mbit Flash memory. Firmware (F/W), in terms of linkmanager and applicable upper layer stack parts, resides in the Flash and is available asimage file formats. 3.3 Module HW Interfaces3.3.1 Host InterfacesTo enable a host system to access the Bluetooth radio link, a Host Controller Interface(HCI) has been defined. The host system controls and distributes data to and from theBluetooth Link Manager with a set of commands. These commands are carriedphysically on either the UART or USB interface (not supported by firmware).3.3.1.1 UARTsThe UART implemented on the baseband is an industry standard and supports thefollowing baud rates: 300, 600, 900, 1200, 1800, 2400, 4800, 9600, 19200, 38400,57600, 115200, 230400, 460800 and 921600 bits/s. 128-byte FIFOs are associated withthe UART1.Four signals will be provided for the UART interface. TxD & RxD are used for data flow,and RTS & CTS shall be used for flow control. The module is a DCE. There are two on-chip UART interfaces, UART1 and UART2.UART1 has 128-byte FIFOs and full modem control support and is used for data in andout transmission at bit rates up to 921 kbit/s. UART1 is setup to a DTE configuration.UART2 has 16-byte FIFOs and is used for control and/or boot.Start-detect and Auto-baud functionality is available for both UARTs.
ROK104001Functional DescriptionData Sheet 14 DS2, 2003-05-16 Note: These settings can be changed from the HCI level using Ericsson specificcommands. For HCI and ECP firmware, UART2 is disabled since UART1 isdefault.3.4 Other Interfaces3.4.1 Serial InterfaceThe bi-directional serial interface / GPIO interface function is based on software usingtwo GPIO’s. The interface has a capacity of handling approximately 100 kbit/s.A master serial I/F is available on the module. This is used to control external serialinterface devices. The controls of the serial interface pins are performed by Ericssonspecific HCI commands available in the FW implementation. See Application Note. Thisenables application in a stand-alone ROK 104 001 module to also control other devicesvia the serial interface.3.4.2 General Purpose I/O The ROK104001 architecture supports up to 8 General Purpose I/O’s. 2 GPIO’s aredefault, that is used as the serial interface.3.4.3 PCM Voice InterfaceUses the standard PCM interface, which has a sample rate of 8 kHz (PCMSYNC). ThePCM I/F can be set in master or slave mode (providing or receiving the PCMSYNC andPCMCLK).PCM clock (PCMCLK) is variable between 200kHz and 2.048 MHz in slave mode.During the master mode, the PCMCLK is set at 2 MHz. PCM data can be linear PCM(13-16bit), µ-Law (8 bit) or A-Law (8 bit). Over the air the encoding is programmable to be CVSD, A-Law or µ-Law.Table2 HCI Default Settings UART1, UART2Speed 57600 bit/sData bit 8 bitStop bit OneParity NoneFlow CTS/RTS
ROK104001Functional Description Data Sheet 15 DS2, 2003-05-16 The PCM line interface can act either as slave or master. When the PCM line interfaceis slave the frequency range of PCMCLK (in) is 200 kHz to 2.048 MHz. When the PCMline interface is master PCMCLK (out) is always 2 MHz.Each PCM symbol on the PCMTx or PCMRx line is organized as an 8 or 16-bit sequenceof bits, arriving synchronous to PCMCLK in (if the PCM line interface is slave) orPCMCLK out (if the PCM line interface is master). The symbol starts with its mostsignificant bit arriving after a positive edge on the PCMCLK in (or out), one clock cycleafter a PCMSYNC in (or out) positive transition. The symbol is then transferred by onebit each PCMCLK in (or out) clock cycle until the least significant bit is transferred. TheEBC then samples the arriving bit at falling edges of PCMCLK in (or out).The PCM symbols are transmitted bit by bit starting with the MSB, one clock cycle aftera positive edge on the PCMCLK in (if the PCM line interface is slave) or PCMCLK out (ifthe PCM line interface is master), one clock cycle after a PCMSYNC (in or out) positivetransition. The rest of the bits are then transferred by one bit each PCMCLK (in or out)cycle, and are synchronized with the rising edge of this clock.Figure3 PCM Master Mode Timing DiagramZZ0,1 orZ0,1 orZtPCH ContinuousPCMclockContinuousPCMclockDelayed PCMsyncPCMSYNC outPCMCLKoutPCMXinPCMXouttPDIHtPDIStPDOVtPSHtPSVtPCLMSB MSB-1D1D0D1D0MSB MSB-1
ROK104001Functional DescriptionData Sheet 16 DS2, 2003-05-16 Figure4 PCM Slave Mode Timing Diagram3.4.4 AntennaThe ANT pin should be connected to a 50 Ω antenna interface, thereby supporting thebest signal strength performance, VSWR should not be higher than 2:1. InfineonTechnologies can recommend application specific antennas.3.5 SoftwareThe Bluetooth link is partitioned into a hardware part and a software part. The softwarerelates to the Bluetooth protocol stack. Depending on the level of integration, there willbe two different firmware models available, including hardware specific drivers for theBluetooth core, UARTs, GPIO and bidirectional serial interface / GPIO. The level ofintegration follows the two main scenarios:•LM & HCI firmware for HCI based applications, where the upper layer stack isintegrated in a host processor external to the ROK104001•Embedded Communication Platform (ECP) where LM and upper layer Bluetoothstack resides in the ROK 104001, communicating with an external host processorthrough an easy to use ECI-interface (Embedded Communication Interface). Forfurther documentation on ECP and ECI, please refer to ECI-driver documentation.3.5.1 FirmwareThe module includes firmware for the host controller interface, HCI, and the linkmanager, LM. The FW resides in the Flash and is available in load format (*.mfl) and inbinary format (*.bin). 0,1 orZZ Z0,1 orZtPCHContinuousPCMclocktPSWtPSSContinuousPCMclockPCMSYNC inPCMCLKinPCMXinPCMXouttPDIHtPDIStPDOVtPSHtPCLMSB MSB-1D1D0D1D0MSB MSB-1
ROK104001Functional Description Data Sheet 17 DS2, 2003-05-16 3.5.2 Bluetooth Module StackThe Host Controller Interface (HCI) handles the communication by the transport layerthrough the UART interface with the host. The Baseband and radio provide a secure andreliable radio link for higher layers. The following sections describe the Bluetooth modulestack in more detail, see also Figure5. It is implemented in accordance with andcomplies with the Specification of the Bluetooth System v1.1.Figure5 HW/HCI FW Parts Included in the Bluetooth Module from Infineon3.5.3 LM & HCI FirmwareIn this configuration the customer will access the LM through a Host Controller Interface(HCI) protocol distributed over UART.3.5.4 Host Controller Interface (HCI)The HCI provides a uniform command I/F to the Baseband and Link Manager and alsoto HW status registers. The HCI I/F is accessed through UART. There are three differenttypes of HCI packets:•HCI command packet - from host to Bluetooth module HCI•HCI event packets - from Bluetooth module HCI to host•HCI data packets - going both waysIt is not necessary to make use of all different commands and events for an application.If the application is aimed at a pre-specified profile, the capabilities of such a profile arenecessary to adjust to - see Specification of the Bluetooth System v1.1. Profiles andApplication Notea) With the HCI UART Transport Layer on top of HCI, the module will communicate witha host through the UART I/F. The PCM I/F is also available for communicating voice.Please refer to the Specification of the Bluetooth System v1.1 part H: 1-4 for in-depthinformation regarding the HCI and different transport layers.ERA00103AudioHCILink ManagerBasebandRadio
ROK104001Functional DescriptionData Sheet 18 DS2, 2003-05-16 Figure6 Host Controller Interface3.5.5 Link Manager (LM)The Link Manager in each Bluetooth module can communicate with another LinkManager by using the Link Manager Protocol (LMP) which is a peer to peer protocol, seeFigure7. The LMP messages have the highest priority and are used for link-setup,security, control and power saving modes. The receiving Link Manager filters out themessage and does not need to acknowledge the message to the transmitting LM due tothe reliable link provided by the Baseband and radio. LM to LM communication can takeplace without actions taken by the host. Discovery of features at other Bluetooth enableddevices nearby can be found and saved for later use by the host. Please refer to theSpecification of the Bluetooth System v1.1 part C for in-depth information regarding the LMP.ERA00104PBM 990 80LMHCIUARTPBM 990 80Running:•LM•HCIOS:OSEUARTRunning:•Host Stack•ApplicationOS:CustomerHost SystemController
ROK104001Functional Description Data Sheet 19 DS2, 2003-05-16 Figure7 Link Manager3.6 Design Guidelines3.6.1 Power-up SequenceThere is no need for a power up sequence if VDD, ON and VDD_IO are tied together. Apower up sequence, if used, shall be applied accordingly: GND, VDD_IO supply rail, VDDsupply; and finally the ON signal should be applied in order to initiate the internalregulator.The power-down sequence is similar to the power-up procedure but in the reverseformat. Therefore, the disconnection of the signals shall be as follows: ON, VDD, VDD_IO,and finally GND.3.6.2 RESETThe assignment of the RESET input is to generate a reset signal to ROK104001.During power-up the reset signal is set ‘low’ so that power supply glitches are avoided.Therefore, no reset input is required after power-up.3.6.3 PowerThere are three inputs to the Voltage Management section (VDD, VDD_IO, ON). VDD is thesupply voltage that is typically 3.3 V.A separate power supply rail (VDD_IO) is provided for the I/O ports, UART and PCM.VDD_IO can either be connected to VDD or to a dedicated supply rail, which is the same asthe logical interface of the host. The ON signal is controlling the internal regulators on or off.ERA00105LMLCRFLMLCRFPhysical layerLMP
ROK104001Functional DescriptionData Sheet 20 DS2, 2003-05-16 An input capacitor whose capacitance is > 1 µF is required between the VDD supply andground (the amount of capacitance may be increased without limit), see Figure2. Thiscapacitor must be located as close as possible to the VDD pad returned to a cleananalogue ground. Any good quality ceramic, tantalum, or film capacitor may be used atthe input.Important: Tantalum capacitors can suffer catastrophic failure due to surge current whenconnected to a low-impedance source of power (like a battery or very large capacitor). Ifa Tantalum capacitor is used at the input, it must be guaranteed by the manufacturer tohave a surge current rating sufficient for the application.There are no requirements for ESR on the input capacitor, but tolerance andtemperature coefficient must be considered when selecting the capacitor to ensure thatthe capacitance will be > 1 µF over the entire operating temperature range.3.6.4 AntennaThe antenna output routing should be 50 Ω (VSWR ≤ 2:1) all the way to the antenna inorder to maintain the radio performance listed in this data sheet. For the routingunderneath the module, the modules ground plane should be considered. The typeapproval for FCC and R&TTE have been done with an antenna gain of 1.6dBi.3.6.5 Shielding / EMC RequirementsThe module has its own RF shielding and is approved according to the standards by FCCand R&TTE. If the approval number is not visible on the outside when the module isutilised in the final product, an exterior label must state that there is a transmitter moduleinside the product (see Section 3.8).Figure8 Side view of a recommended layout for a 4 layer PCBROK 104 001CCGND vias GND viasRoute 1/GNDGNDRoute 2GND
ROK104001Functional Description Data Sheet 21 DS2, 2003-05-16 Although the module has its own shielding extra precautionsregarding layout routingshould be taken. It is strongly recommended that all the routing from the module shall beencapsulated between GND layers. Refer to figure 8 for an example with a 4-layer PCB.Figure9 Top view of a recommended layoutAdditionally, GND vias can be positioned around the module and its surroundingcomponents so that any high frequency signal cannot effect any other part of theapplication board. This also protects the module from high frequency components thatcould be positioned in the near vicinity. It is recommended to have a distance of 3 mmbetween the earth vias. Refer to figure 9 as an example.3.6.5.1 PCB Design RulesAs can be seen from figure10, the GND vias that surround the module should not havea large impact of the ability to route the signals to the module.3mmROK104 001CCDGND vias
ROK104001Functional DescriptionData Sheet 22 DS2, 2003-05-16 Figure10 Typical PCB layout design rules3.6.5.2 Pad SizeIt is recommended that the pads on the PCB should have a diameter of 0.7 - 0.9 mm.The surface finish on the PCB pads should be Nickel/Gold or a flat Tin/Lead surface orOSP (Organic Surface Protection).Total Thickness of PCB 1,6 3,2 mmVia hole ø0,3 0,6 mmCatch Pad ø (Internal Layers) 0,7 1,2 mmGND vias distance 3 3 mmNo. of possibletracks betweenGND viasMaximum trackwidth for 1.6mmthick PCBMaximum trackwidth for 3.2mmthick PCB1767 600 um2460 360 um3329 257 um4256 200 um5209 164 um6177 138 um7153 120 um8135 106 um9121 95 um10 110 86 um11 100 78 um
ROK104001Functional Description Data Sheet 23 DS2, 2003-05-16 3.6.5.3 Spurious Emissions Measurement3.6.6 GroundGround should be distributed with very low impedance as a ground plane. Connect allGND pins to the ground plane.3.6.7 Additional DecouplingA capacitor whose capacitance of 2.2 µF is required between the VDD_RFDIG output andground, see block diagram Figure2. This capacitor must be located as close as possibleto the VDD_RFDIG pad and returned to a clean analogue ground. Any good quality ceramic,tantalum, or film capacitor may be used at the input.3.6.8 Power Management Stop ModeNote that from revision R2C of HCI-firmware and from R3B-revision of ECP-firmware,the Power Management stop mode is disabled by default. In order to enable thisfunction, the 'HCI Command Store In Flash' has to be used (User ID: 131& Flash Data:0001). In order to utilize the power management stop mode features in the firmware; a schottkydiode must be assembled between the DETACH pad and the EXTSYSWAKEUP pad,-80-75-70-65-60-55-50-45Level [dBm]1G 2G 3G 4G 5G 6G 7GFrequency [Hz]MES VLB030214-9_pre PKLIM EN 300328 RX 1-12G Peak Limit (dBm)LIM EN 300328 RX 1-12G2 Limit_2=(Peak Limit)-6 (dBm)
ROK104001Functional DescriptionData Sheet 24 DS2, 2003-05-16 see block diagram Figure2. The cathode shall be assembled to DETACH and theanode to EXTSYSWAKEUP.Power management stop mode is disabled by grounding the DETACH pin. A ‘high’logical level will enable power management; a pull-up resistor is assembled on themodule.3.7 Assembly Guidelines3.7.1 Solder PasteThe ROK104001 module is made for surface mounting with land grid array (LGA)solder joints. To assemble the module, solder paste (eutectic Tin/Lead) must be printedat the target surface. Preferred solder paste height is 100 - 127 µm (4 - 5 mil). 3.7.2 Soldering ProfileIt must be noted that the module should not be allowed to be hanging upside down in thereflow operation. This means that the module has to be assembled on the side of thePCB that is soldered last. The reflow process should be a regular surface mountsoldering profile (full convection strongly preferred), the ramp-up should not be higherthan 3°C/s and with a peak temperature of 210 - 225°C during 10 - 20 seconds. Maxsloping rate should not be higher than 4°C/s (see example of reflow profile in Figure11).
ROK104001Functional Description Data Sheet 25 DS2, 2003-05-16 Figure11 Eutectic SnPb-Solder Profile3.7.3 PlacementThe recommended pickup coordinates for the ROK104001 shield is based on a nozzlewith inner diameter 2 mm and outer diameter 3.17 mm. The center of the shield is theorigin of coordinates, (0,0) for (x,y), giving the pickup coordinates (-1 mm,0) for (x,y).3.7.4 StorageKeep the component in its dry pack when not yet using the reel. After removal from thedry pack ensure that the modules are soldered onto the PCB within 48 hours. 3.8 FCC Modular ApprovalThis device complies with part 15 of the FCC Rules. Operation is subject to the followingtwo conditions: (1) This device may not cause harmful interference, and (2) this devicemust accept any interference received, including interference that may cause undesiredoperation.Changes or modifications not expressly approved by the party responsible forcompliance could void the user’s authority to operate the equipment.ERA00106120 s max.0050 100 150 200 25050100150200250stT°C183°C60-125 s10-20 sMax. rising 3°C/s Max. sloping 4°C/sTemperature Profile
ROK104001Functional DescriptionData Sheet 26 DS2, 2003-05-16 The modular transmitter is labeled with its own FCC ID number, but, if the FCC ID is notvisible when the module is installed inside another device, then the outside of the deviceinto which the module is installed must also display a label referring to the enclosedmodule. The exterior label can use wording such as the following: “Contains TransmitterModule FCC ID: Q23104001” or “Contains FCC ID: Q23104001”. Any similar wordingthat expresses the same meaning may be used.When reusing the Modular Approval, antenna related measurements might need to beredone.The antenna used for modular approval was a max 1.6dBi half-wave antennafrom gigAnt (PCB Swivel 6076019). When using an other antenna a class II permissivechange will be needed.3.9 R&TTE ApprovalThis device complies with the requirements in the European Union and EFTA accordingto the following test specifications:EN 300 328EN 60950 and EU standardEN 301 489 -1/17The R&TTE Approval for the ROK 104001-device is valid in the 19 member states of EUand EFTA. The R&TTE-organizations of respective member state must be given 4weeks of notice before a product based on this approval is allowed to be released tomarket. Each state has its specific form to be filled in and submitted, for the respectiveR&TTE organization to respond to. In the absence of any response within four weeks,the product is allowed to be released to the market.
ROK104001Electrical Characteristics Data Sheet 27 DS2, 2003-05-16 4Electrical Characteristics4.1 Absolute Maximum RatingsTable3 Absolute Maximum RatingsParameter Symbol Values Unitmin. max.TemperatureStorage temperature TStg -40 +125 °CMaximum temperature -40 +85 °COperating temperature -20 +75 °CPower Supply1)1) VDDIO supply voltage must be powered on prior to or simultaneously as the VDD supply voltage. Deviationsfrom this power up sequence might damage the device.Supply voltage VDD -0.3 5.25 VSupply voltage (921k baud rate with turbo ON and ECP firmware)VDD -0.3 4.75 VI/O Supply voltage VDD_IO -0.8 3.6 VBaseband Digital I/OsIO voltage range VIOP1 -0.3 +2.8 VIO voltage range VIOP2 -0.3 VDD_IO+ 0.3VInput clamp current VI < VSSIO or VI > VDDIO IIC -20 +20 mAOutput clamp current VO < VSSIO or VO > VDDIO IOC -20 +20 mAAntenna PortMatching on ANT pad (VSWR) 10 NAInput RF power - In-band- Out of band1515dBmdBm
ROK104001Electrical CharacteristicsData Sheet 28 DS2, 2003-05-16 4.2 DC SpecificationsTable4 DC SpecificationsUnless otherwise noted, the specification applies for HCI firmware TAmb = -20 to +75°C, 3.10 < VDD < 4.75 V, ON = 3.3V, VSWR ≤ 21)Parameter Note/ Test Condition Symbol Values Unitmin. typ. max.Digital Inputs Low level input voltage, digital inputGuaranteed input low except ON signalVIL_IOP1 VSSIO - 0.3 0.85 VVIL_IOP2 VSSIO - 0.3 0.3 x VDD_IOVON signal only VIL 00.4 VHigh level input voltage, digital inputRESET#2)Guaranteed input high except ON signalVIH_IOP1 1.96 2.8 VVIH_IOP 0.7 x VDD_IOVDD_IO + 0.3 VON signal only VIH 1.4 VDD VInput pin internal pull-up resistorInput pin internal pull-down resistor(internal resistor on baseband chip)(internal resistor on baseband chip)RPURPD301050208040kΩΩDigital OutputsLow level output voltageIOL = 800 µA VOL 0VSSIO + 0.1 VHigh level output voltageIOH = -800 µA VOH_IOP1 2.4 2.8 VVOH_IOP2VDD_IO - 0.1VDD_IOVCurrent ConsumptionInput leakage cur-rent, any digital in-put or bidirectional pin in input modeVI = VSSIO -1 +1 µAVI = VDDIOOutput leakage current, tri-stateVO = VSSIO -1 +1 µAVO = VDDIOHW Shutdown3) 65 µA
ROK104001Electrical Characteristics Data Sheet 29 DS2, 2003-05-16 Idle state with stop mode4)during first 4 s. 1100 µAafter 4 s. 270 µAPage Scan with stop mode5) 3mAInquiry and Page Scan with stop mode5)3mAHold mode5) during first 4 s. 1100 µAafter 4 s. 270 µAPark mode5) 4.2 mASniff mode6) 4.2 mAConnection Mode7) 57600bps460800bpsor 921600bpswith TURBO off8)921600bpswith TURBO on8)93100125mAmAmAVDDIO supply ICC_IO 2mA1) Parameter errors may occur if VSWR > 2.2) RESET# signal must be fed from an open drain output.3) Current consumption is based upon where the ‘ON’ signal is low and ‘VDDIO’ is grounded.4) After HCI command.5) Inquiry and page mode current is measured during 1.28 s.6) Sniff max & min interval: 1.28 s; Sniff attempt & Timeout: 19.375 ms.7) Average current consumption measured during DH5 packet whilst in remote loop back configuration.8) The HCI command turbo on has a typical throughput of 610 kbit/s but when the turbo command is off the baudrate is reduced to 510 kbit/s.Table4 DC Specifications (cont’d)Unless otherwise noted, the specification applies for HCI firmware TAmb = -20 to +75°C, 3.10 < VDD < 4.75 V, ON = 3.3V, VSWR ≤ 21)Parameter Note/ Test Condition Symbol Values Unitmin. typ. max.
ROK104001Electrical CharacteristicsData Sheet 30 DS2, 2003-05-16 Table5 Timing PerformanceType Parameter/ ConditionSymbol Values Unitmin. typ. max.Digital input pins requirements1)1) Static data - All baseband input and bi-directional pins can be connected to any external driving circuit beforeturning on the supply, without damaging the device. However, it cannot be guaranteed that ROK104001 doesnot load the external driver in this case, unless the baseband core supply voltage is completely dischargedprior to this event.All digital input and bi-directional input pins2)2) Rise and fall times are measured between 10 % to 90 % of the VDDIO level.Rise time tr 10 nsFall time tr 10 nsDigital output pins characteristics1)All digital output and bi-directional output pins2)Rise timeCLOAD = 25 pFtR3.5 20 nsFall timeCLOAD = 25 pFtF3.5 15 nsSystemClock frequency fSYS_CLK 13.0000 MHzClock frequency tolerance3)3) Tolerance for the system clock takes into account aging effects of the crystal.-20 +20 ppmStart-up time from power on 250 msRESET# signal duration4)4) RESET# signal must be fed from an open drain output.Sink current > 1 mA1ms
ROK104001Electrical Characteristics Data Sheet 31 DS2, 2003-05-16 Table6 ACL PacketsParameter Condition Values Unitmin. typ. max.Symmetric transfer rate DM1 packet 108 108 kb/sDH1 packet 172 172 kb/sDM3 packet 258 258 kb/sDH3 packet 390 390 kb/sDM5 packet 286 286 kb/sDH5 packet 433 433 kb/sAsymmetric transfer rateForward modeDM1 packet 108 108 kb/sDH1 packet 172 172 kb/sDM3 packet 387 387 kb/sDH3 packet 585 585 kb/sDM5 packet 477 477 kb/sDH5 packet1) 610 723 kb/sAsymmetric transfer rateReverse modeDM1 packet 108 108 kb/sDH1 packet 172 172 kb/sDM3 packet 54 54 kb/sDH3 packet 86 86 kb/sDM5 packet 36 36 kb/sDH5 packet 57 57 kb/s1) The HCI command turbo on has a typical throughput of 610 kbit/s but when the turbo command is off the baudrate is reduced to 510 kbit/s. HCI turbo on command is only valid during 921k UART baud rate.Table7 SCO PacketsParameter Condition Values Unitmin. typ. max.Maximum transfer rate HV1 packet 64.0 kb/sHV2 packet 64.0 kb/sHV3 packet 64.0 kb/sDV packet 57.6 kb/s
ROK104001Electrical CharacteristicsData Sheet 32 DS2, 2003-05-16 Table8 PCM interface Requirements and CharacteristicsParameter Symbol Values Unitmin. typ. max.PCM Master mode (PCMCLK and PCMSYNC are outputs)PCM clock frequency fPC 2000 kHzPCM clock high period tPCH 200 nsPCM clock low period tPCL 200 nsPCMSYNC pulse valid from PCMCLK rising edge tPSV 100 nsPCMSYNC pulse hold time from PCMCLK falling edgetPSH 200 nsPCMX data out valid from PCMCLK rising edge tPDOV 100 nsPCMX data in setup time to PCMCLK falling edge tPDIS 100 nsPCMX data in hold time from PCMCLK falling edgetPIDH 100 nsPCM Slave mode (PCMCLK and PCMSYNC are inputs)PCM clock frequency fPC 200 2048 kHzPCM clock high period tPCH 200 nsPCM clock low period tPCL 200 nsPCMSYNC setup time to PCMCLK falling edge tPSS 100 nsPCMSYNC hold time from PCMCLK falling edge tPSH 100 nsPCMSYNC pulse width tPSW 1/fPC nsPCMX data out valid from PCMCLK rising edge tPDOV 100 nsPCMX data in setup time to PCMCLK falling edge tPDIS 100 nsPCMX data in hold time from PCMCLK falling edgetPIDH 100 nsTable9 RF SpecificationsParameter Condition Values Unitmin. typ. max.GeneralFrequency range2.402 2.480GHzDouble sided IF bandwidth 1MHz
ROK104001Electrical Characteristics Data Sheet 33 DS2, 2003-05-16 Antenna load 50 ΩVSWR Rx mode 2:1VSWR1) Tx mode 2:1Receiver Performance Sensitivity level DH1 Connection160 kHz deviationw.r.t. BER < 0.1 %-75 -71 dBmMax input level -20 +13 dBmRSSi accuracy Pin = -40 dBm -6 0+6 dBPin = -60 dBm -6 0+6 dBC/Ico-channel2) 3) 12 14 dBC/I1MHz2) 3) -3 0dBC/I2MHz2) 4) -35 -30 dBC/I>3MHz2) 4) -50 -30 dBC/Iimage2) 4) -20 -9 dBAdjacent (1 MHz) interference to inband image frequencyC/Iimage+/-1MHz2) 4)-30 -20 dBOut-of-band blocking 30-1850 MHz +5 +15 dBm1850-1910 MHz +4 +15 dBm1911-2000 MHz 0+9 dBm2001-2399 MHz -27 -8 dBm2484-2999 MHz -27 -9 dBm3.0-12.75 GHz -10 +3 dBmIntermodulation rejection2) 5) -39 -30 dBmSpurious emissions 30 MHz to 1 GHz -57 dBm1 GHz to 12.75 GHz -47 dBmTransmitter PerformanceFrequency deviation 140 160 175 kHzTx power -4 +1 +4 dBmInitial frequency error -75 0 75 kHz20 dB bandwidth with peak detector 1000 kHzTable9 RF Specifications (cont’d)Parameter Condition Values Unitmin. typ. max.
ROK104001Electrical CharacteristicsData Sheet 34 DS2, 2003-05-16 Tx carrier drift 2402 to 2482 MHz 1 slot (366 µs) -25 25 kHz3 slots (1598 µs) -40 40 kHz5 slots (2862 µs) -40 40 kHzTx carrier drift 2480 to 2402 MHz 1 slot (366 µs) -25 25 kHz3 slots (1598 µs) -40 40 kHz5 slots (2862 µs) -40 40 kHzDrift rate -20 20 kHzAdjacent channel power +2 MHz -20 dBm-2 MHz -20 dBm+3 MHz -40 dBm-3 MHz -40 dBm+4 MHz -40 dBm-4 MHz -40 dBm+13 MHz -40 dBm-13 MHz -40 dBmSpurious emissions 30 MHz - 1 GHz -36 dBm1 GHz - 12.75 GHz -30 dBm1.8 GHz - 1.9 GHz -47 dBm5.15 GHz - 5.3 GHz -47 dBm1) During the Tx mode, the VSWR specification states the limits that are acceptable before any other RFparameters are strongly affected, i.e. frequency deviation and drift.2) Specification only valid for normal test conditions TAMB = 15 - 35 C.3) Carrier signal level of -60 dBm, interferer Bluetooth modulated.4) Carrier signal level of -67 dBm, interferer Bluetooth modulated.5) Carrier: -64 dBm @ 2441 MHz, 1st interferer: CW @ 2446 MHz, 2nd interferer: BT mod. @ 2451 MHz.Table9 RF Specifications (cont’d)Parameter Condition Values Unitmin. typ. max.
ROK104001Marking Data Sheet 35 DS2, 2003-05-16 5Marking5.1 Module MarkingEach module shall be marked with the following information printed on the shield.Table10Marking Description1: Infineon logotype2: <ROK104001/21 R1A>Product number with suffix and revision state acc to purchase order3: <bbbbbb> Batch number4: <yyww2> Manufacturing year (yy), week (ww) and factory code (2)5:Bluetooth logotype. 6: CE-logo. 7:FCC ID: Q23104001 FCC No.
ROK104001MarkingData Sheet 36 DS2, 2003-05-16 Figure12 Module Marking5.2 Reel MarkingThe reel, reel box and dry pack has a label with the following information:•Infineon product number with revision•Customer product number with revision•Quantity•Reel-ID. (Batch No)•Factory code•Manufacturing date•Country of origin•Infineon logotype1-6 above is also printed in BAR-code format
ROK104001Package Outlines Data Sheet 37 DS2, 2003-05-16 6Package OutlinesFigure13 ROK104001 Mechanical Dimensions (maximum values) and Footprint, Bottom ViewERA0010815.5 ±0.2 2 max.1.271.270.8 typ.0.8051.410.5±0.2You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products.Dimensions in mm
ROK104001Package OutlinesData Sheet 38 DS2, 2003-05-16 6.1 Pinout (bottom view)Please refer to Figure4 for the positioning of each pad.6.2 Footprint, Land View Figure14 ROK104001 Mechanical Dimensions of Footprint,Land Pattern View (seen from above the component)Table117GND N.C. N.C. N.C. VDD_RFDIG GND N.C. N.C. N.C. N.C. GND6GND SERIALDATA GPIOB7 GPIOB6 N.C. - VTP3 N.C. - VTP4 GND GND GND GND GND5GND N.C. - VTP1PWRFAILN.C. - VTP2UART2RTSPWRAVAIL N.C. N.C. VDD GND GND4GND N.C. GPIOB2DETACHGPIOB4 N.C. GNDUART1TxVDDIO ON N.C.3GND GND RESET SERIALCLK GPIOB5UART1Rx WAKEUPUART1RTS UART1CTSD+ N.C.2ANT GND EXTSYSWAKEUP UART2RxEXTINTPCMSYNCN.C.UART2CTSD- GND1GND GND GND GPIOB3 PCMTXPCMCLKPCMRx N.C.UART2TxGND GND0GND N.C.N.C. - VTP5N.C. N.C. GND N.C. N.C. N.C. N.C. GNDVTRPNMLKJHGERA00109VTRPNMLKJHG76543210Pad Size: ø0.8 mmPitch: 1.27 mmG0
ROK104001Ordering Information Data Sheet 39 DS2, 2003-05-16 7Ordering InformationPlease contact Infineon Technologies for further information.8PackagingThe modules will be delivered in a tape & reel and dry pack, protecting them from ESDand mechanical shock.The tape width is 24 mm and the pitch is 12 mm. The diameter of the reel is 13 inchesand it contains 1500 modules.9AbbreviationsASIC - Application Specific Integrated CircuitBER - Bit Error RateCMOS - Complementary Metal Oxide SemiconductorDCE - Data Circuit terminating EquipmentHCI - Host Controller InterfaceIC - Integrated Circuit ISM - Industrial Scientific and MedicalLGA - Land Grid ArrayPCB - Printed Circuit BoardPCM - Pulse Code ModulationRx - ReceiveSIG - Special Interest GroupTx - TransmitUART - Universal Asynchronous Receiver TransmitterUSB - Universal Serial Bus

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