Intel Mobile Communications 31307 Wireless Bluetooth module User Manual Product Overview Singlestone PA33

Intel Mobile Communications GmbH Wireless Bluetooth module Product Overview Singlestone PA33

Users Manual

Preliminary Data Sheet, 11/2001 CONFIDENTIAL Never stop thinking.Secure Mobile Solutions Preliminary Product Overview T3130-7V10PO1-7600 Apr-2004PBA 313 07Singlestone
Singlestone PBA 313 07 Preliminary Product Overview 4/2004 2 For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the InfineonTechnologies Companies and Representatives worldwide: see our webpage at http://www.infineon.com ABM®, AOP®, ARCOFI®, ARCOFI®-BA, ARCOFI®-SP, DigiTape®, EPIC®-1, EPIC®-S, ELIC®, FALC®54, FALC®56, FALC®-E1,FALC®-LH, IDEC®, IOM®, IOM®-1, IOM®-2,IPAT®-2, ISAC®-P, ISAC®-S, ISAC®-S TE, ISAC®-P TE, ITAC®, IWE®, MUSAC®-A,OCTAT®-P, QUAT®-S, SICAT®, SICOFI®, SICOFI®-2, SICOFI®-4, SICOFI®-4µC, SLICOFI®, are registered trademarks ofInfineon Technologies AG. ACE™, ASM™, ASP™, POTSWIRE™, QuadFALC™, SCOUT™ are trademarks of Infineon Technologies AG. BLUETOOTHTM is a trademark owned by its proprietor and used by Infineon Technologies AG under license. Edition 4/2004 Published by Infineon Technologies WS Sweden AB, Isafjordsgatan 16 SE-164 81 Kista © Infineon Technologies AG All Rights Reserved. Attention please! The information presented in this document does not constitute a part of any quotation or contract. Infineon Technologiesespecially emphazises the following: As far as patents or other rights of third parties are concerned, liability is expressly excluded for applications, processes andcircuits implemented within components or assemblies. The information describes the type of component and shall not be considered as assured characteristics or representation. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question pleasecontact your nearest Infineon Technologies Office. Infineon Technologies AG is an approved CECC manufacturer. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. Byagreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for anycosts incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components1 of the Infineon Technologies AG, may only be used in life-support devices or systems 2 with the expresswritten approval of Infineon Technologies AG. 1 A critical component is a component used in a life-support device or system whose failure can reasonably be expected tocause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain andsustain human life, such as, for example, in medical, air traffic, defense, or life-sustaining automotive applications. If they fail, itis reasonable to assume that the health of the user or another person may be endangered. Exclusion of Warranty and Liability The Software is provided "as is" and Infineon gives no warranty - expressly or implied - of any kind, including, but not limited to,warranties of merchantability or fitness for a particular purpose, nor does Infineon assume any liability whatsoever as to theperformance of the Software. In addition, Infineon assumes no responsibility for the ability of the customer to use this Software for the purpose it was providedfor, nor does Infineon assume responsibility for any claims, including, but not limited to, claims of infringement of intellectualproperty rights of third parties, arising from the customer's use of the Software.
Singlestone PBA 313 07 Preliminary Product Overview 4/2004 3 Table of Contents 1Introduction...................................................................................................................... 5 2General Device Overview.............................................................................................. 6 2.1 General Features.............................................................................................................7 2.2 Block diagram.................................................................................................................8 2.3 Typical application .........................................................................................................8 2.4 Mechanical dimension and pad arrangement.................................................................9 2.5 Module pin-out..............................................................................................................10 2.6 Functional Block Diagram ............................................................................................11 2.7 System Integration and Applications............................................................................12 2.7.1 General description..................................................................................................12 3Electrical Specifications .............................................................................................13 3.1 Absolute Maximum Ratings..........................................................................................13 3.2 Operating conditions....................................................................................................13 3.3 Latch-up immunity........................................................................................................13 3.4 Quality ..........................................................................................................................13 3.5 Capacitance..................................................................................................................14 3.6 Current consumption....................................................................................................14 3.7 DC Characteristics of Digital Part.................................................................................15 3.7.1 Pull Up characteristics on ResetQ.............................................................................16 3.8 Operational Range for RF part......................................................................................16 3.9 AC/DC Characteristics of RF part..................................................................................16 3.9.1 Transmitter Characteristics.......................................................................................17 3.9.2 RSSI.......................................................................................................................17 3.9.3 Receiver Characteristics...........................................................................................18 3.10 Characteristics of externally supplied 32.768kHz clock signal...............................18 4Assembly and design guidelines .............................................................................19 4.1 General description of the module ...............................................................................19 4.2 Printed Circuit Board design.........................................................................................19 4.3 Solder paste printing ....................................................................................................19 4.4 Assembly......................................................................................................................20 4.4.1 Component placement .............................................................................................20 4.4.2 Pin mark..................................................................................................................20 4.5 Soldering profile...........................................................................................................21 4.6 Antenna ........................................................................................................................21 4.7 Shielding / EMC requirements.......................................................................................21 4.8 Safety............................................................................................................................21 5Type approvals and Qualification.............................................................................22 5.1 Bluetooth Qualification.................................................................................................22
Singlestone PBA 313 07 Preliminary Product Overview 4/2004 4 5.2 FCC Modular Approval..................................................................................................22 5.3 R&TTE Approval...........................................................................................................22 6Module marking.............................................................................................................23 7Package...........................................................................................................................24 8References......................................................................................................................25
Singlestone PBA 313 07 Preliminary Product Overview 4/2004 51 IntroductionThe module is built around the BlueMoon Single Cellular chip (PMB 8761) which contains the radio,baseband, link manager and HCI functionality. For additional information regarding the PMB8761 suchas firmware features, complete description of Infineon specific HCI commands and events, pleaserefer to the latest version of the Data sheet for PMB8761, T8761-XV01Dx-7600.
Singlestone PBA 313 07 Preliminary Product Overview 4/2004 62 General Device OverviewInfineon’s Singlestone - PBA 313 07 is a ready-to-use Class2 Bluetooth module solution targeted fordata and audio applications in the 10 meters personal area range.BLUETOOTH wireless technology is an open industry standard for short range wirelesscommunication with both data and voice transmission capability (up to 723 kbit/s data asymmetricallyor up to 3 voice channels simultaneously). Singlestone is a Bluetooth 1.1 pre-qualified component, soany further development and qualification efforts for the user are minimized. It is already hardwareprepared for the upcoming Bluetooth 1.2 Standard, which will improve the quality of voice connections,support the co-existence with WLAN solutions using the same frequency band and accelerate theconnection setup.Integrating the baseband, link manager and RF-transceiver, Singlestone closes the gap between theBluetooth air interface (external antenna, 2.4 GHz ISM band) and the standardized host-controller-interface (HCI), which is physically realized as a full-duplex UART port (HW-handshake optional). Inparallel, the PCM interface is suitable for audio connections.Around Infineon’s BlueMoon Single Cellular – PMB 8761 Bluetooth chip, all essential components fora complete Bluetooth solution are integrated in the Singlestone module. A 26 MHz temperaturecompensated crystal oscillator (TCXO) provides the highly accurate Bluetooth clock, an E²PROMholds the application specific configuration data which is loaded after power-up reset, and anintegrated balun-filter component ensures optimized RF matching between the chip and the externalantenna. Only a 32.768 kHz real-time clock, which is available in most target applications, must beprovided to the Singlestone module.Bluetooth stack software supporting the extended feature set of Infineon’s BlueMoon family and acomprehensive portfolio of Bluetooth profiles are available from our SW partners ported to a variety ofhost architectures.The device is designed for a broad range of wireless applications in the consumer, automotive andindustrial segments, as well as for interconnection of cellular phones, desktop PCs, laptops, andPDAs. The device is available in a shielded LGA package (11.85 x 10.6 mm²) with 8x9 pads.
Singlestone PBA 313 07 Preliminary Product Overview 4/2004 7 2.1 General Features General• Low power consumption, programmable Power down mode• Chip in advanced low power CMOS technology• External supply-voltage 3.0V..4.75 V, recommended 3.3 V +/- 5 %• Extended temperature range – 40°C .. +85°C Interfaces• UART for UART-HCI with HW-handshake (Baudrate up to 3 Mbaud)• PCM interface (slave- and master-mode; programmable PCM slot allocation)• JTAG• GPIO for control of external devices Digital-Section• Digital demodulation gives best performance in sensitivity, co- and adjacent channel performance• Digital offset compensation and symbol synchronization / frame synchronization• GFSK-modulator (over-sampling at typ. 9-bit-resolution) with amplitude adjustment and high-performance A/D-converter for RX-data• Digital part (Noise-shaper, Gaussian impulse filter) of Σ∆-Fractional-N-PLL• CVSD transcoder for voice conformant to BLUETOOTH wireless technology• A-law, u-Law and linear PCM also possible• Baseband and Linkmanager Firmware up to HCI in internal ROM• 4 kbit E2PROM for storing Bluetooth device data RF and Analog Section• Analog part of Σ∆-Fractional-N-PLL for receive and transmit path (multi-modulus-divider, phasedetector and charge pump) on chip• Fully integrated and balanced VCO with integrated varactors and inductors.• On chip 2.5 GHz RF driver amplifier up to + 5 dBm output power (Fine tuning in the range of -16 - +5 dBm in 1.5 dB steps)• Integrated LNA• Fully integrated Balun, switch and antenna filter giving one single-ended RF interface, no additionalexternal RF components• Chip-integrated supply voltage regulator for VCO• On module 26 MHz reference clock• On module voltage regulator for single supply voltage.• Typical sensitivity -83 dBm• Typical output power +2.5 dBm Software• Baseband, Link Manager and HCI functionality is incorporated by ProBlue Firmware in chip-integrated ROM.• Infineon specific HCI+ commands to support enhanced features• Configuration data (e.g. Bluetooth device address) are loaded from internal E2PROM after reset.Optionally, configuration data may be provided by the host via HCI+ command. Package• LGA 9 x 8 pads
Singlestone PBA 313 07 Preliminary Product Overview 4/2004 82.2 Block diagram V supply Singlestone – PBA 313 07 EEPROM I 2 C PMB8761 Bluemoon Single Cellular Voltage Regulator PCM UART HCI Clock 26 MHz Low Power Clock 32.768 kHz Balun Antenna Filter Antenna Figure 2-1: Block diagram of the PBA 313 07 Singlestone module2.3 Typical application UART PCM V Supply Host application CLK32 PBA 313 07 Bluetooth Module Singlestone Figure 2-2: Typical application diagram
Singlestone PBA 313 07 Preliminary Product Overview 4/2004 92.4 Mechanical dimension and pad arrangementBelow shows the module’s pad layout. All dimensions are in mm. A B C D E F G H J76543210 Figure 2-3 Mechanical dimensions, pad arrangement.Dimension min. typ. max. UnitLength 11.65 11.85 12.05 mmWidth 10.40 10.6 10.80 mmHeight 1.6 1.8 2.0 mm Table 2-1 Mechanical dimensions with tolerances
Singlestone PBA 313 07 Preliminary Product Overview 4/2004 102.5 Module pin-outTable 2-2 represents the functional description of Singlestone’s connecting pads. Functionally non-used pads (NC) are used as sacrifice pads or test pads, and must not be connected in an application. Pin Location Symbol Input/ Output During Reset After Reset Function Comments D6 UARTIN I Tristate Tristate UART-Input E6 UARTOUT O Pull-Up Pull-Up UART-Output (Pull-Up controlled byFW) E5 UARTRTS O Pull-Down Pull-Down UART-Request to Send (Pull-Down/-Up controlled by FW) B5 UARTCTS I Tristate Tristate UART-Clear to Send D5 WAKEUP_HOST O Pull-Down Pull-Down Wake-up signal for host ) (Pull-Down controlled by FW) C2 PCMIN I Tristate Tristate PCM input D3 PCMOUT O Pull-Down Pull-Down PCM output (Pull-Down/-Upcontrolled by FW) B0 PCMFR I/O Pull-Down Pull-Down PCM frame (8kHz)(Pull-Down/-Upcontrolled by FW) C1 PCMCLK I/O Pull-Down Pull-Down PCM clock (>64kHz) (Pull-Down/-Up controlled by FW) C3 GPIO (=GPIO0) I/O Pull-Down Pull-Down General purpose Input/Output (Pull-Down/Up controlled by FW) G2 TRST I Pull-Down Pull-Down Test Reset (JTAG) B4 TCK I Input Input Test Clock (JTAG) C4 TMS I Pull-Up Pull-Up Test Mode Set (JTAG) D4 TDI I Pull-Up Pull-Up Test Data Input (JTAG) B3 TDO O Tristate Tristate Test Data Output (JTAG) F2 RESETQ I Pull-Up Pull-Up Reset line (0:reset, 1:active) F3 WAKEUP_BT I Input Input Wake-up signal from low powermode E2 CLK32 I Input Input 32.768 kHz clock input J5 ANT A RF input /output 50 ohms. F0 VSUPPLY S Power Supply G7 NC (VDD) Regulated supply voltage for testpurposes. Important that is leavedNC. A0, A1, A4, A5 GND C5, C6 GND D1 GND E0, E1 GND E3, E4 GND F4, F5 GND G1, G6 GND H0, H4, H5, H6 GND J0, J4, J6 GND A2, A3 , A6, A7 NC B1, B2, B6, B7 NC C0, C7 NC D0, D2, D7 NC E7 NC F1, F6, F7 NC G0, G3, G4, G5,G7 NC H1, H2, H3, H7 NC J1, J2, J3, J7 NC Table 2-2 Module pin-out
Singlestone PBA 313 07 Preliminary Product Overview 4/2004 112.6 Functional Block Diagram JTAG GPIO 26 MHz XO Digital Baseband Section Data- RAM/ Control- RAM (Buffers) Loop Filter Demodulator Antenna Switch Analog RF-Section I 2 C- Interface Analog Baseband Section Σ∆-Clocks-PLL Power management unit Digital Link Control Section RF Frequency Synthesizer (Analog part of Σ∆ - Fractional-N-PLL) & Transmitter UART Σ∆ Fract.-N- PLL Control Information PCM- Interface A/ µ -Law CVSD Par a Ser Baseband- Control CRC/FEC CRC/FEC Ser a Par Frame- Sync Symbol- Recov. Offset- Canc. Timers/ RF-Interface Impulse Shaping Bluetooth Link-Control/ Link-Manager/ HCI-UART Clocks Timer Watch- dog Inter- rupts Ports I²C UART Receiver LNA PCM Interface 32.768 kHz Encryption Balun + filter E2PROM VSUPPLY (3.0V – 4.75V) WAKEUP PMB8761 BlueMoon Single Cellular Figure 2-4: Singlestone PBA 313 07 Block diagram
Singlestone PBA 313 07 Preliminary Product Overview 4/2004 122.7 System Integration and Applications2.7.1 General description On the RF-side, Singlestone provides a 50 Ohm single-ended input/output to be directly connected toan external antenna. The design of the antenna is open to a broad spectrum (e.g. PCB antenna,ceramic antenna, external antenna) and can be optimized to the target application requirements. The HCI-interface is implemented as a full-duplex UART port which can be configured to be used in 2-line or 4-line mode (with or without hardware handshake). If hardware handshake is not used then theUARTCTS pin must be grounded. The PCM interface is able to serve one Bluetooth SCO channel for voice data. Optionally, SCOchannels may be linked to the host via the HCI-UART interface. Both the UART- and PCM-interfaces are assigned to the regulated voltage (2.7V) powered byVSUPPLY. VSUPPLY must be in the range of 3.0 to 4.75 V. General purpose input/output lines (GPIOs) can be controlled via HCI+ commands. Configuration data (e.g. Bluetooth device address) are loaded from internal E2PROM after reset.Optionally, configuration data may be provided by the host via HCI+ commands.
Singlestone PBA 313 07 Preliminary Product Overview 4/2004 13 3 Electrical Specifications3.1 Absolute Maximum Ratings The maximum ratings may not be exceeded under any circumstances, not even momentarily andindividually, as permanent damage to the module will result. Parameter Limit values Unit min. max. VSUPPLY Supply voltage range -0.3 6.0 V VI Input Voltage Range -0.3 3.75 V VO Output Voltage Range 0.3 3.0 V IIN Input Current - 10 10 mA ESD integrity according to MIL-STD883DMethod 3015.7 1 kV TStorage Maximum storage temperature range -40 125 °CTable 3-1: Absolute maximum ratingsNote: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damageto the device. Exposure to conditions beyond those indicated in the recommended operationalconditions of this specification may affect device reliability. This is a stress rating only andfunctional operation of the device under these conditions or at any other condition beyond thoseindicated in the operational conditions of this specification is not implied.3.2 Operating conditionsUnless otherwise stated, the following characteristics apply operating conditions.Parameter min. typ. max. RemarksTemperature -40°C +25°C +85°CVSUPPLY 3.0V 3.3V 4.75V Table 3-2 Operating Conditions3.3 Latch-up immunityLatch-up immunity is guaranteed in accordance with JEDEC-standard No. 17, EIA Jedec JC-40.2.3.4 QualityFor quality and reliability conditions se 105 63-PBA31301+ Uen.
Singlestone PBA 313 07 Preliminary Product Overview 4/2004 143.5 CapacitanceT = 25°CSymbol Parameter Limit Valuesmin. max. UnitCIN input capacitance -10 pFCOUT output capacitance -15 pFCIO I/O -20 pFTable 3-3: Capacitance3.6 Current consumptionRegulator input voltage: VSUPPLY = 3.0..4.75V Average Consumption #Bluetooth mode min. typ. max. Unit Test Conditions 1 HV3 32 40 mA ACL link in sniff mode with max.interval 2WSE 0x02 2.2 3.5 mA 1.28 s scan interval, 11.25 msscan, no interlaced scan 3WSE 0x03 3.0 4 mA 1.28 s scan interval, 2*11.25 msscan, no interlaced scan 4Sniff mode 2 3 mA 2.00 s sniff interval, sniff attempt =1, sniff timeout = 0 Table 3-4: Average current for some Bluetooth modes. WSE means afterHCI_Write_Scan_Enable.
Singlestone PBA 313 07 Preliminary Product Overview 4/2004 153.7 DC Characteristics of Digital PartVSUPPLY = 3.0V..4.75V.Maximum allowed input levels are from -0.3V to 3.0V.Higher voltages up to 3.6V can be applied at UARTIN, UARTCTS, PCMIN, PCMFR, PCMCLK, TRST,TCK, TMS, TDI, RESETQ, CLK32, WAKEUP_BT.Symbol Parameter Test Condition Limit Values UnitMin typ maxPins: PCMCLK, PCMFR, PCMIN, UARTIN, UARTCTS, GPIO0VIN LOW Input low voltage - - 0.81 VVIN HIGH Input high voltage -1.89 -VPins: PCMCLK, PCMFR, PCMOUT, UARTOUT, UARTRTS, GPIO0VOUT LOW Output low voltage IOL=2.4mA - - 0.68 VVOUT LOW Output low voltage IOL=100µA- - 0.27 VVOUT HIGH Output high voltage IOH=-2.4mA 2.02 - - VVOUT HIGH Output high voltage IOH=-100µA2.43 - - VPins: WAKEUP_HOSTVOUT LOW Output low voltage IOL=100µA- - 0.27 VVOUT HIGH Output high voltage IOH=-100µA2.43 - - VPins: TRST, TCK, TMS, TDIVIN LOW Input low voltage - - 0.81 VVIN HIGH Input high voltage -1.89 -VPin: TDOVOUT LOW Output low voltage IOL=2.4mA -0.35 VVOUT LOW Output low voltage IOL=100µA-0.15 VVOUT HIGH Output high voltage IOH=-2.4mA 2.2 -VVOUT HIGH Output high voltage IOH=-100µA2.6 -VPin: WAKEUP_BT, CLK32VILOSC Input low voltage - - 0.4 VVIHOSC Input high voltage -2.0 -VPin: RESETQVIN LOW Input low voltage - - 0.35 VVIN HIGH Input high voltage -2.5 -VTable 3-5: DC characteristics of digital partmax. Load Capacitance(during test)Rise/Fall Time (for measurement ofDC characteristics)PCMOUT 30 pF 30 nsPCMCLK 30 pF 30 nsPCMFRM 30 pF 30 nsTable 3-6: Pin characteristicsSymbol Parameter LimitValues Unit Test Conditionmin typ maxILI Input leakage current - - 1µA 0V<V IN<2.7VILO Output leakage current - - 1µA 0V<V OUT <2.7VILI, H Input leakage current for 3.6Vtolerant pins* - - 1µA 0V<V IN<3.6VILO, H Output leakage current for UARTand PCM domain pins - - 1µA 0V<V OUT <2.7VTable 3-7: Leakage currents* The following pins are 3.6 V tolerant: UARTIN, UARTCTS, PCMIN, PCMFR, PCMCLK, TRST, TCK,TMS, TDI, RESETQ, CLK32, WAKEUP_BT
Singlestone PBA 313 07 Preliminary Product Overview 4/2004 16Pull-Up and Pull-Down ValuesSymbol Pull-Up Pull-Down Unit Test Conditionmin typ max min typ maxUARTRTS 100 160 230 100 150 200 µAUARTOUT 100 160 230 100 150 200 µAWAKEUP_HOST 100 160 230 100 140 200 µAPCMOUT 100 160 230 100 140 200 µAPCMFR 100 160 230 100 140 200 µAPCMCLK 100 160 230 100 140 200 µAGPIO0 40 100 200 30 90 170 µA Table 3-8: Pull-Up / Pull-Down characteristics3.7.1 Pull Up characteristics on ResetQThe ResetQ signal is pulled up to Vdd. In order for the chip to start up properly at power up the pull upis delayed. Below is a table stating the delay from applying a stable Vsupply to the module until theResetQ goes high.Parameter LimitValues Unit Test Conditionmin typ maxDelay pull up of ResetQ 26 50 µsPull-up current ResetQ 270 500 µA3.8 Operational Range for RF part Within the operational range the module operates as described in the circuit description. The AC/DCcharacteristic limits are not guaranteed. Note: Power levels refer to 50Ω impedance Limit values #Parameter Symbol min. max. Unit Remarks 1 RF input level PRFIN 10 dBm 2 RF input frequency fRFIN 2500 MHz 3 Ambient temperature TA -40 +85 °C Table 3-9: Operational range for the RF part3.9 AC/DC Characteristics of RF part AC/DC characteristics involve the spread of values guaranteed within the specified supply voltage andambient temperature range. Typical values are the median of the production.
Singlestone PBA 313 07 Preliminary Product Overview 4/2004 173.9.1 Transmitter Characteristics Limit values #Parameter Symbol min. typ. max. Unit TestConditions 1 Output power -3.0 1.0 4.5 dBm 2 Output power -1.0 1.0 4 dBm T=25°C 3 Frequency deviation(00001111 sequence) fdev 140 158 175 kHz 4 Frequency deviation(0101 sequence) fdev 115 140 175 kHz 5 Relative frequencydeviation (0101sequence) fdev,0101/f dev,00001111 0.8 0.95 -20 dBc @ 500kHzoffset* -20 dBm @ 2MHzoffset* 6In-band spuriousemissions -40 dBm @ 3MHzoffset* -36 dBm 30MHz -1GHz -30 dBm 1 - 12.75 GHz -47 dBm 1.8 - 1.9 GHz 7 Out of band spuriousemission -47 dBm 5.15 -5.3 GHz*measurement method corresponding to Bluetooth test specification Table 3-10: Transmitter characteristics3.9.2 RSSI Limit values #Parameter Symbol min. typ. max. Unit TestConditions 1 Linear response lower limit -90 -80 dBm 2 Linear response upper limit -40 dBm Table 3-11: RSSI
Singlestone PBA 313 07 Preliminary Product Overview 4/2004 183.9.3 Receiver Characteristics Limit values #Parameter Range/Location min. typ. max. Unit Test Conditions 1 Sensitivity (BER=10-3) -85 -75 dBm According toBluetooth spec. 2 Sensitivity (BER=10-3) -85 -81 dBm T=25°C, nominaltransmitter Y=M -71 -68 dBm Y=M±1 -60 -58 dBm Y=M-2 -30 -23 dBm Y=M+2 (image) -51 -43 dBmfrequency deviation160kHz for wanted(M) and interferer (Y),level wanted –60dBm measured atantenna input Y=M-3 -27 -25 dBm Y=M+3 (adj. Image) -47 -36 dBm 3 Interferenceperformance(BER=10-3) Y= any otherBluetooth channel -27 -22 dBm frequency deviation160kHz for wanted(M) and interferer (Y),level wanted –67dBm measured atantenna input 30MHz≤f≤2GHz 5 8 dBm 2GHz≤f≤2.4GHz -27 dBm 2.5GHz≤f≤3GHz -27 dBm 3GHz≤f≤5GHz 5 8 dBm a) Out of bandblocking (BER=10-3) 5GHz≤f≤12.75GHz -10 dBm frequency deviation160kHz for wanted,unmodulatedinterferer, levelwanted –67dBm, not at VCOfrequency and mixingproducts of :3/2,measured at antennainput 1/3 fout 0 5 dBm 1/2 fout -10 0 dBm 1785MHz<f<1850MHz -10 0 dBm 4 c) Exceptions for LOspurious (based onmeasurements ongolden board) 2 fout -10 0 dBm 5 Intermodulationperformance(BER=10-3) -39 -34 dBm frequency deviation160kHz for wanted(N), level –64dBm;interferer (N+5)unmodulated,frequency deviation160kHz for interferer(N+10), measured atantenna input 30 MHz - 1 GHz -57 dBm 6 Spurious Emission 1 - 12.75 GHz -47 dBmTable 3-12: Receiver characteristics (including Digital Demodulator and PAM-Receiver) 3.10 Characteristics of externally supplied 32.768kHz clock signalThe 32.768kHz clock signal applied to CLK32 has to be a rectangular waveform with a duty cycle of10% up to 90%. The frequency accuracy has to be better than 250ppm. The rise time and fall time ofthe 32.768kHz signal must be below 10µs. The amplitude must satisfy the requirements in Table 3-5.
Singlestone PBA 313 07 Preliminary Product Overview 4/2004 194 Assembly and design guidelines4.1 General description of the moduleSinglestone is a Land Grid Array (LGA 8x9) module made for surface mounting. The pad diameter is0.8 mm and the pitch 1.27 mm.All solder joints on the module will reflow during soldering on the mother board. All components andshield will stay in place due to wetting force.Surface treatment on the module pads is Nickel /Gold.Figure 1 shows the pad layout on the module, Seen from component side. Figure 4-1 Pad layout on the module (top view)4.2 Printed Circuit Board designThe land pattern on the PCB shall be according to the land pattern on the module, which means thatthe diameter of the LGA pads on the PCB shall be 0.8 mm. It is recommended that each pad on thePCB shall be surrounded by a solder mask clearance of about 75 µm to avoid overlapping soldermask and pad.The solder pads must have wetability to eutectic solder. Electroless Ni/Au plating or OSP (OrganicSurface Protection) is a common surface finish and is suitable for assembly.4.3 Solder paste printingThe solder paste deposited on the PCB by stencil printing has to be of eutectic or near eutectic tinlead composition (e.g. 63Sn37Pb or 62Sn36Pb2Ag). A no-clean solder paste is preferred, becausecleaning of the solder joints which are under the module is difficult.Preferred thickness of the solder paste stencil is 100 - 127 µm (4 - 5 mils). The apertures on the solderpaste stencil shall be of the same size as the pads, 0.8 mm.
Singlestone PBA 313 07 Preliminary Product Overview 4/2004 204.4 Assembly4.4.1 Component placementIn order to assure a high yield soldering process good placement on the PCB is necessary. As a ruleof thumb the tolerable misplacement is 150 µm. This means that the Singlestone module can beassembled with a variety of placement systems.The recommendation is to pick and place the module with a nozzle in the centre of the shield. Thenozzle diameter shall not be bigger than 4 mm.4.4.2 Pin markPin 1 (A0) is marked on bottom footprint and on the top of the shield on the module according to fig2a-b. Diameter of pin 1 mark on the shield is 0.40 mm. Figure 2a: Top view Figure 2b: Bottom view Figure 4-2 Pin markPin 1 mark markPin 1 mark0,920,92
Singlestone PBA 313 07 Preliminary Product Overview 4/2004 214.5 Soldering profileGenerally all standard reflow soldering processes (vapour phase, convection, infra red) and typicaltemperature profiles used for surface mount devices are suitable for the Singlestone module. Wavesoldering is not possible.Figure 4-3 shows an example of a suitable solder reflow profile.Figure 4-3 : Eutectic Sn/Pb-Solder ProfileSinglestone shall be handled according to MSL3, which means a floor life of 168 h in 30°C/60% r.h.4.6 AntennaThe antenna output routing should be 50 W (VSWR ≤ 2:1) all the way to the antenna in order tomaintain the radio performance listed in this data sheet. For the routing underneath the module, themodules ground plane should be considered. The type approval for FCC and R&TTE have been donewith an antenna gain of 1.6dBi.4.7 Shielding / EMC requirementsThe module has its own RF shielding and is approved according to the standards by FCC and R&TTE.If the approval number is not visible on the outside when the module is utilised in the final product, anexterior label must state that there is a transmitter module inside the product (see Section 5.2).4.8 SafetyIn the R&TTE directives there are safety requirements for high voltage applications. For complyingwith the R&TTE security requirements regarding usage in high voltage equipment, using 230V supply,the device shall be mounted un-resolvable or it needs to be ensured that it cannot cause a shortcircuit.
Singlestone PBA 313 07 Preliminary Product Overview 4/2004 225 Type approvals and Qualification5.1 Bluetooth QualificationThe PBA 31307 is Bluetooth Qualified according to specification v1.1 with the ID: PBA31307. Thecovered functionality of this listing covers RF, Baseband and Link Manager.Since the PBA 31307 constitute a complete Bluetooth system, the pre-testing, listings andqualifications can be reused by reference by the end-customer.Please refer to the application note “PBA 31307 Bluetooth Qualification & Type Approval” for thedetails on the procedure to re-using the BT-qualification.5.2 FCC Modular ApprovalThis device complies with part 15 of the FCC Rules. Operation is subject to the following twoconditions: (1) This device may not cause harmful interference, and (2) this device must accept anyinterference received, including interference that may cause undesired operation.Changes or modifications not expressly approved by the party responsible for compliance could voidthe user’s authority to operate the equipment.The modular transmitter is labeled with its own FCC ID number, but, if the FCC ID is not visible whenthe module is installed inside another device, then the outside of the device into which the module isinstalled must also display a label referring to the enclosed module. The exterior label can use wordingsuch as the following: “Contains Transmitter Module FCC ID Q2331307” or “Contains FCC IDQ2331307”. Any similar wording that expresses the same meaning may be used.When reusing the Modular Approval, antenna related measurements might need to be redone. Theantenna used for modular approval was a max 1.6dBi half-wave antenna from gigAnt (PCB Swivel6076019). When using an other antenna a class II permissive change will be needed.For further details on the procedure for re-using the FCC type approval, please refer to the applicationnote “PBA 31307 Bluetooth Qualification & Type Approval”.5.3 R&TTE ApprovalThis device complies with the requirements in the European Union and EFTA according to thefollowing test specifications:EN 300 328EN 301 489 -1/17The R&TTE approval for the PBA31307 - device is valid in the following countries:Austria, Belgium, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland,Italy, Liechtenstein, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland andUnited Kingdom.The notification time for these countries to request additional testing and/or documentation are 4weeks.
Singlestone PBA 313 07 Preliminary Product Overview 4/2004 236 Module marking Marking Description 1, Infineon logotype 2. <PBA 313 07R1A> Product number with suffix and revision state according topurchase order. 3. <bbbbbb> Batch number 4. <XX> Type of module:Engineering Samples, XX=ES 5. <yyww2> Manufacturing year (yy), week (ww) and factory code (2) 6. <FCC ID Q2331307> FCC Identification number 7 Bluetooth logotype. 8. CE marking Table 6-1 Figure 6-1 Marking example
Singlestone PBA 313 07 Preliminary Product Overview 4/2004 247 Package Singlestone is packed in tape on reel according to Figure 7-1. The tape is also the module dry pack asreferred to in chapter 4.5. Figure 7-1 Tape on reel for Singlestone
Singlestone PBA 313 07 Preliminary Product Overview 4/2004 258 References1. T8761-XV01D12 -7600 Preliminary Data Sheet PMB 8761

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