Intel Mobile Communications 31307 Wireless Bluetooth module User Manual Product Overview Singlestone PA33

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Preliminary Product Overview
T3130-7V10PO1-7600
PBA 313 07
Singlestone
Secure Mobile Solutions
Preliminary Data Sheet, 11/2001
CONFIDENTIAL
s t o p
t h i n k i n g .
N e v e r
Apr-2004
Singlestone
PBA 313 07
For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the Infineon
Technologies Companies and Representatives worldwide: see our webpage at http://www.infineon.com
ABM®, AOP®, ARCOFI®, ARCOFI®-BA, ARCOFI®-SP, DigiTape®, EPIC®-1, EPIC®-S, ELIC®, FALC®54, FALC®56, FALC®-E1,
FALC®-LH, IDEC®, IOM®, IOM®-1, IOM®-2,IPAT®-2, ISAC®-P, ISAC®-S, ISAC®-S TE, ISAC®-P TE, ITAC®, IWE®, MUSAC®-A,
OCTAT®-P, QUAT®-S, SICAT®, SICOFI®, SICOFI®-2, SICOFI®-4, SICOFI®-4µC, SLICOFI®, are registered trademarks of
Infineon Technologies AG.
ACE™, ASM™, ASP™, POTSWIRE™, QuadFALC™, SCOUT™ are trademarks of Infineon Technologies AG.
BLUETOOTHT M is a trademark owned by its proprietor and used by Infineon Technologies AG under license.
Edition 4/2004
Published by Infineon Technologies WS Sweden AB,
Isafjordsgatan 16
SE-164 81 Kista
© Infineon Technologies AG
All Rights Reserved.
Attention please!
The information presented in this document does not constitute a part of any quotation or contract. Infineon Technologies
especially emphazises the following:
As far as patents or other rights of third parties are concerned, liability is expressly excluded for applications, processes and
circuits implemented within components or assemblies.
The information describes the type of component and shall not be considered as assured characteristics or representation.
Terms of delivery and rights to change design reserved.
Due to technical requirements components may contain dangerous substances. For information on the types in question please
contact your nearest Infineon Technologies Office.
Infineon Technologies AG is an approved CECC manufacturer.
Packing
Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By
agreement we will take packing material back, if it is sorted. You must bear the costs of transport.
For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any
costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components 1 of the Infineon Technologies AG, may only be used in life-support devices or systems 2 with the express
written approval of Infineon Technologies AG.
A critical component is a component used in a life-support device or system whose failure can reasonably be expected to
cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and
sustain human life, such as, for example, in medical, air traffic, defense, or life-sustaining automotive applications. If they fail, it
is reasonable to assume that the health of the user or another person may be endangered.
Exclusion of Warranty and Liability
The Software is provided "as is" and Infineon gives no warranty - expressly or implied - of any kind, including, but not limited to,
warranties of merchantability or fitness for a particular purpose, nor does Infineon assume any liability whatsoever as to the
performance of the Software.
In addition, Infineon assumes no responsibility for the ability of the customer to use this Software for the purpose it was provided
for, nor does Infineon assume responsibility for any claims, including, but not limited to, claims of infringement of intellectual
property rights of third parties, arising from the customer's use of the Software.
Preliminary Product Overview
4/2004
Singlestone
PBA 313 07
Table of Contents
Introduction ...................................................................................................................... 5
General Device Overview.............................................................................................. 6
2.1
General Features............................................................................................................. 7
2.2
Block diagram................................................................................................................. 8
2.3
Typical application ......................................................................................................... 8
2.4
Mechanical dimension and pad arrangement ................................................................. 9
2.5
Module pin-out.............................................................................................................. 10
2.6
Functional Block Diagram ............................................................................................ 11
2.7
System Integration and Applications............................................................................ 12
2.7.1
General description.................................................................................................. 12
Electrical Specifications .............................................................................................13
3.1
Absolute Maximum Ratings.......................................................................................... 13
3.2
Operating conditions.................................................................................................... 13
3.3
Latch-up immunity ........................................................................................................ 13
3.4
Quality .......................................................................................................................... 13
3.5
Capacitance .................................................................................................................. 14
3.6
Current consumption.................................................................................................... 14
3.7
DC Characteristics of Digital Part ................................................................................. 15
3.7.1
Pull Up characteristics on ResetQ ............................................................................. 16
3.8
Operational Range for RF part ...................................................................................... 16
3.9
AC/DC Characteristics of RF part.................................................................................. 16
3.9.1
Transmitter Characteristics....................................................................................... 17
3.9.2
RSSI ....................................................................................................................... 17
3.9.3
Receiver Characteristics........................................................................................... 18
3.10
Characteristics of externally supplied 32.768kHz clock signal............................... 18
Assembly and design guidelines .............................................................................19
4.1
General description of the module ............................................................................... 19
4.2
Printed Circuit Board design......................................................................................... 19
4.3
Solder paste printing .................................................................................................... 19
4.4
Assembly...................................................................................................................... 20
4.4.1
Component placement ............................................................................................. 20
4.4.2
Pin mark .................................................................................................................. 20
4.5
Soldering profile........................................................................................................... 21
4.6
Antenna ........................................................................................................................ 21
4.7
Shielding / EMC requirements....................................................................................... 21
4.8
Safety............................................................................................................................ 21
Type approvals and Qualification.............................................................................22
5.1
Bluetooth Qualification ................................................................................................. 22
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Singlestone
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5.2
FCC Modular Approval.................................................................................................. 22
5.3
R&TTE Approval ........................................................................................................... 22
Module marking.............................................................................................................23
Package...........................................................................................................................24
References......................................................................................................................25
Preliminary Product Overview
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Singlestone
PBA 313 07
1 Introduction
The module is built around the BlueMoon Single Cellular chip (PMB 8761) which contains the radio,
baseband, link manager and HCI functionality. For additional information regarding the PMB8761 such
as firmware features, complete description of Infineon specific HCI commands and events, please
refer to the latest version of the Data sheet for PMB8761, T8761-XV01Dx-7600.
Preliminary Product Overview
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Singlestone
PBA 313 07
2 General Device Overview
Infineon’s Singlestone - PBA 313 07 is a ready-to-use Class2 Bluetooth module solution targeted for
data and audio applications in the 10 meters personal area range.
BLUETOOTH wireless technology is an open industry standard for short range wireless
communication with both data and voice transmission capability (up to 723 kbit/s data asymmetrically
or up to 3 voice channels simultaneously). Singlestone is a Bluetooth 1.1 pre-qualified component, so
any further development and qualification efforts for the user are minimized. It is already hardware
prepared for the upcoming Bluetooth 1.2 Standard, which will improve the quality of voice connections,
support the co-existence with WLAN solutions using the same frequency band and accelerate the
connection setup.
Integrating the baseband, link manager and RF-transceiver, Singlestone closes the gap between the
Bluetooth air interface (external antenna, 2.4 GHz ISM band) and the standardized host-controllerinterface (HCI), which is physically realized as a full-duplex UART port (HW-handshake optional). In
parallel, the PCM interface is suitable for audio connections.
Around Infineon’s BlueMoon Single Cellular – PMB 8761 Bluetooth chip, all essential components for
a complete Bluetooth solution are integrated in the Singlestone module. A 26 MHz temperature
compensated crystal oscillator (TCXO) provides the highly accurate Bluetooth clock, an E²PROM
holds the application specific configuration data which is loaded after power-up reset, and an
integrated balun-filter component ensures optimized RF matching between the chip and the external
antenna. Only a 32.768 kHz real-time clock, which is available in most target applications, must be
provided to the Singlestone module.
Bluetooth stack software supporting the extended feature set of Infineon’s BlueMoon family and a
comprehensive portfolio of Bluetooth profiles are available from our SW partners ported to a variety of
host architectures.
The device is designed for a broad range of wireless applications in the consumer, automotive and
industrial segments, as well as for interconnection of cellular phones, desktop PCs, laptops, and
PDAs.
The device is available in a shielded LGA package (11.85 x 10.6 mm²) with 8x9 pads.
Preliminary Product Overview
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Singlestone
PBA 313 07
2.1 General Features
General
• Low power consumption, programmable Power down mode
• Chip in advanced low power CMOS technology
• External supply-voltage 3.0V..4.75 V, recommended 3.3 V +/- 5 %
• Extended temperature range – 40°C .. +85°C
Interfaces
• UART for UART-HCI with HW-handshake (Baudrate up to 3 Mbaud)
• PCM interface (slave- and master-mode; programmable PCM slot allocation)
• JTAG
• GPIO for control of external devices
Digital-Section
• Digital demodulation gives best performance in sensitivity, co- and adjacent channel performance
• Digital offset compensation and symbol synchronization / frame synchronization
• GFSK-modulator (over-sampling at typ. 9-bit-resolution) with amplitude adjustment and highperformance A/D-converter for RX-data
• Digital part (Noise-shaper, Gaussian impulse filter) of Σ∆-Fractional-N-PLL
• CVSD transcoder for voice conformant to BLUETOOTH wireless technology
• A-law, u-Law and linear PCM also possible
• Baseband and Linkmanager Firmware up to HCI in internal ROM
• 4 kbit E PROM for storing Bluetooth device data
RF and Analog Section
• Analog part of Σ∆-Fractional-N-PLL for receive and transmit path (multi-modulus-divider, phase
detector and charge pump) on chip
• Fully integrated and balanced VCO with integrated varactors and inductors.
• On chip 2.5 GHz RF driver amplifier up to + 5 dBm output power (Fine tuning in the range of -16 - +
5 dBm in 1.5 dB steps)
• Integrated LNA
• Fully integrated Balun, switch and antenna filter giving one single-ended RF interface, no additional
external RF components
• Chip-integrated supply voltage regulator for VCO
• On module 26 MHz reference clock
• On module voltage regulator for single supply voltage.
• Typical sensitivity -83 dBm
• Typical output power +2.5 dBm
Software
• Baseband, Link Manager and HCI functionality is incorporated by ProBlue Firmware in chipintegrated ROM.
• Infineon specific HCI+ commands to support enhanced features
• Configuration data (e.g. Bluetooth device address) are loaded from internal E PROM after reset.
Optionally, configuration data may be provided by the host via HCI+ command.
Package
• LGA 9 x 8 pads
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Singlestone
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2.2 Block diagram
Singlestone – PBA 313 07
EEPROM
IC
UART HCI
PMB8761
Bluemoon
Single Cellular
PCM
Vsupply
Antenna
Balun
Antenna
Filter
Voltage
Regulator
Low Power Clock
32.768 kHz
Clock
26 MHz
Figure 2-1: Block diagram of the PBA 313 07 Singlestone module
2.3 Typical application
Bluetooth Module
PBA 313 07
Singlestone
CLK32
VSupply
PCM
UART
Host application
Figure 2-2: Typical application diagram
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Singlestone
PBA 313 07
2.4 Mechanical dimension and pad arrangement
Below shows the module’s pad layout. All dimensions are in mm.
Figure 2-3 Mechanical dimensions, pad arrangement.
Dimension
Length
Width
Height
min.
11.65
10.40
1.6
typ.
11.85
10.6
1.8
max.
12.05
10.80
2.0
Unit
mm
mm
mm
Table 2-1 Mechanical dimensions with tolerances
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Singlestone
PBA 313 07
2.5 Module pin-out
Table 2-2 represents the functional description of Singlestone’s connecting pads. Functionally nonused pads (NC) are used as sacrifice pads or test pads, and must not be connected in an application.
Pin Location
Symbol
Input/
Output
During
Reset
After
Reset
Function
UART-Input
UART-Output (Pull-Up controlled by
FW)
UART-Request to Send (PullDown/-Up controlled by FW)
UART-Clear to Send
Wake-up signal for host ) (PullDown controlled by FW)
PCM input
PCM output (Pull-Down/-Up
controlled by FW)
PCM frame (8kHz)(Pull-Down/-Up
controlled by FW)
PCM clock (>64kHz) (Pull-Down/Up controlled by FW)
General purpose Input/Output (PullDown/Up controlled by FW)
D6
E6
UARTIN
UARTOUT
Tristate
Pull-Up
Tristate
Pull-Up
E5
UARTRTS
Pull-Down
Pull-Down
B5
D5
UARTCTS
WAKEUP_HOST
Tristate
Pull-Down
Tristate
Pull-Down
C2
D3
PCMIN
PCMOUT
Tristate
Pull-Down
Tristate
Pull-Down
B0
PCMFR
I/O
Pull-Down
Pull-Down
C1
PCMCLK
I/O
Pull-Down
Pull-Down
C3
GPIO
(=GPIO0)
I/O
Pull-Down
Pull-Down
G2
B4
C4
D4
B3
F2
F3
TRST
TCK
TMS
TDI
TDO
RESETQ
WAKEUP_BT
Pull-Down
Input
Pull-Up
Pull-Up
Tristate
Pull-Up
Input
Pull-Down
Input
Pull-Up
Pull-Up
Tristate
Pull-Up
Input
E2
J5
F0
G7
CLK32
ANT
VSUPPLY
NC (VDD)
Input
Input
A0, A1, A4, A5
C5, C6
D1
E0, E1
E3, E4
F4, F5
G1, G6
H0, H4, H5, H6
J0, J4, J6
A2, A3 , A6, A7
B1, B2, B6, B7
C0, C7
D0, D2, D7
E7
F1, F6, F7
G0, G3, G4, G5,
G7
H1, H2, H3, H7
J1, J2, J3, J7
Comments
Test Reset (JTAG)
Test Clock (JTAG)
Test Mode Set (JTAG)
Test Data Input (JTAG)
Test Data Output (JTAG)
Reset line (0:reset, 1:active)
Wake-up signal from low power
mode
32.768 kHz clock input
RF input /output 50 ohms.
Power Supply
Regulated supply voltage for test
purposes. Important that is leaved
NC.
GND
GND
GND
GND
GND
GND
GND
GND
GND
NC
NC
NC
NC
NC
NC
NC
NC
NC
Table 2-2 Module pin-out
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Singlestone
PBA 313 07
2.6 Functional Block Diagram
PCM Interface
Loop Filter
PMB8761 BlueMoon Single Cellular
PCMInterface
BasebandControl
A/µ-Law
DataRAM/
ControlRAM
CRC/FEC
Control
Information
Ser a Par
FrameSync
(Buffers)
CRC/FEC
CVSD
Encryption
Clocks
Interrupts
Digital Link Control
Section
Timer
Ports
Watchdog
RF Frequency
Synthesizer
(Analog part ofΣ∆Fractional-N-PLL)
Timers/
RF-Interface
Σ∆
Fract.-NPLL
SymbolRecov.
OffsetCanc.
Digital Baseband
Section
Bluetooth
Link-Control/
Link-Manager/
HCI-UART
Impulse
Shaping
Par a Ser
Transmitter
Demodulator
Antenna
Switch
Σ∆-Clocks-PLL
LNA
I²C
Receiver
Power management unit
UART
Analog Baseband Section
Analog RF-Section
I CInterface
E2 PROM
UART
GPIO
JTAG
26 MHz XO
WAKEUP
32.768 kHz
VSUPPLY (3.0V – 4.75V)
Figure 2-4: Singlestone PBA 313 07 Block diagram
Preliminary Product Overview
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Balun +
filter
Singlestone
PBA 313 07
2.7 System Integration and Applications
2.7.1 General description
On the RF-side, Singlestone provides a 50 Ohm single-ended input/output to be directly connected to
an external antenna. The design of the antenna is open to a broad spectrum (e.g. PCB antenna,
ceramic antenna, external antenna) and can be optimized to the target application requirements.
The HCI-interface is implemented as a full-duplex UART port which can be configured to be used in 2line or 4-line mode (with or without hardware handshake). If hardware handshake is not used then the
UARTCTS pin must be grounded.
The PCM interface is able to serve one Bluetooth SCO channel for voice data. Optionally, SCO
channels may be linked to the host via the HCI-UART interface.
Both the UART- and PCM-interfaces are assigned to the regulated voltage (2.7V) powered by
VSUPPLY. VSUPPLY must be in the range of 3.0 to 4.75 V.
General purpose input/output lines (GPIOs) can be controlled via HCI+ commands.
Configuration data (e.g. Bluetooth device address) are loaded from internal E PROM after reset.
Optionally, configuration data may be provided by the host via HCI+ commands.
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Singlestone
PBA 313 07
3 Electrical Specifications
3.1 Absolute Maximum Ratings
The maximum ratings may not be exceeded under any circumstances, not even momentarily and
individually, as permanent damage to the module will result.
Parameter
Limit values
Unit
VSUPPLY
VI
Supply voltage range
Input Voltage Range
min.
-0.3
-0.3
VO
Output Voltage Range
0.3
3.0
IIN
Input Current
- 10
10
mA
kV
TStorage
ESD integrity according to MIL-STD883D
Method 3015.7
Maximum storage temperature range
125
°C
-40
max.
6.0
3.75
Table 3-1: Absolute maximum ratings
Note: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage
to the device. Exposure to conditions beyond those indicated in the recommended operational
conditions of this specification may affect device reliability. This is a stress rating only and
functional operation of the device under these conditions or at any other condition beyond those
indicated in the operational conditions of this specification is not implied.
3.2 Operating conditions
Unless otherwise stated, the following characteristics apply operating conditions.
Parameter
Temperature
VSUPPLY
min.
typ.
max.
-40°C
3.0V
+25°C
3.3V
+85°C
4.75V
Remarks
Table 3-2 Operating Conditions
3.3 Latch-up immunity
Latch-up immunity is guaranteed in accordance with JEDEC-standard No. 17, EIA Jedec JC-40.2.
3.4 Quality
For quality and reliability conditions se 105 63-PBA31301+ Uen.
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Singlestone
PBA 313 07
3.5 Capacitance
T = 25°C
Symbol
Parameter
Limit Values
min.
max.
Unit
CIN
input capacitance
10
pF
COUT
output capacitance
15
pF
CIO
I/O
20
pF
Table 3-3: Capacitance
3.6 Current consumption
Regulator input voltage: VSUPPLY = 3.0..4.75V
Bluetooth mode
Average Consumption
min.
typ.
max.
Unit Test Conditions
HV3
32
40
mA
WSE 0x02
2.2
3.5
mA
WSE 0x03
3.0
mA
Sniff mode
mA
ACL link in sniff mode with max.
interval
1.28 s scan interval, 11.25 ms
scan, no interlaced scan
1.28 s scan interval, 2*11.25 ms
scan, no interlaced scan
2.00 s sniff interval, sniff attempt =
1, sniff timeout = 0
Table 3-4: Average current for some Bluetooth modes. WSE means after
HCI_Write_Scan_Enable.
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Singlestone
PBA 313 07
3.7 DC Characteristics of Digital Part
VSUPPLY = 3.0V..4.75V.
Maximum allowed input levels are from -0.3V to 3.0V.
Higher voltages up to 3.6V can be applied at UARTIN, UARTCTS, PCMIN, PCMFR, PCMCLK, TRST,
TCK, TMS, TDI, RESETQ, CLK32, WAKEUP_BT.
Symbol
Parameter
Test Condition
Pins: PCMCLK, PCMFR, PCMIN, UARTIN, UARTCTS, GPIO0
V IN LOW
Input low voltage
V IN HIGH
Input high voltage
Pins: PCMCLK, PCMFR, PCMOUT, UARTOUT, UARTRTS, GPIO0
V OUT LOW
Output low voltage
IOL =2.4mA
V OUT LOW
Output low voltage
IOL =100µA
V OUT HIGH
Output high voltage
IOH=-2.4mA
V OUT HIGH
Output high voltage
IOH=-100µA
Pins: WAKEUP_HOST
V OUT LOW
Output low voltage
IOL =100µA
V OUT HIGH
Output high voltage
IOH=-100µA
Pins: TRST, TCK, TMS, TDI
V IN LOW
Input low voltage
V IN HIGH
Input high voltage
Pin: TDO
V OUT LOW
Output low voltage
IOL =2.4mA
V OUT LOW
Output low voltage
IOL =100µA
V OUT HIGH
Output high voltage
IOH=-2.4mA
V OUT HIGH
Output high voltage
IOH=-100µA
Pin: WAKEUP_BT, CLK32
V ILOSC
Input low voltage
V IHOSC
Input high voltage
Pin: RESETQ
V IN LOW
Input low voltage
V IN HIGH
Input high voltage
Min
Limit Values
typ
0.81
1.89
0.68
0.27
0.27
2.43
0.81
1.89
0.35
0.15
2.2
2.6
0.4
2.0
0.35
2.5
2.02
2.43
Unit
max
Table 3-5: DC characteristics of digital part
PCMOUT
PCMCLK
PCMFRM
max. Load Capacitance
(during test)
30 pF
30 pF
30 pF
Rise/Fall Time (for measurement of
DC characteristics)
30 ns
30 ns
30 ns
Table 3-6: Pin characteristics
Symbol
Parameter
ILI
ILO
ILI, H
Input leakage current
Output leakage current
Input leakage current for 3.6V
tolerant pins*
Output leakage current for UART
and PCM domain pins
ILO, H
min
Limit
Values
typ
Unit
Test Condition
max
µA
µA
µA
0V
Product number with suffix and revision state according to
purchase order.
3. 
Batch number
4. 
Type of module:
Engineering Samples, XX=ES
5. 
Manufacturing year (yy), week (ww) and factory code (2)
6. 
FCC Identification number
Bluetooth logotype.
CE marking
8.
Table 6-1
Figure 6-1 Marking example
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Singlestone
PBA 313 07
7 Package
Singlestone is packed in tape on reel according to Figure 7-1. The tape is also the module dry pack as
referred to in chapter 4.5.
Figure 7-1 Tape on reel for Singlestone
Preliminary Product Overview
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Singlestone
PBA 313 07
8 References
1.
T8761-XV01D12 -7600 Preliminary Data Sheet PMB 8761
Preliminary Product Overview
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