Intel Mobile Communications 31307 Wireless Bluetooth module User Manual Product Overview Singlestone PA33
Intel Mobile Communications GmbH Wireless Bluetooth module Product Overview Singlestone PA33
Users Manual
Preliminary Product Overview T3130-7V10PO1-7600 PBA 313 07 Singlestone Secure Mobile Solutions Preliminary Data Sheet, 11/2001 CONFIDENTIAL s t o p t h i n k i n g . N e v e r Apr-2004 Singlestone PBA 313 07 For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the Infineon Technologies Companies and Representatives worldwide: see our webpage at http://www.infineon.com ABM®, AOP®, ARCOFI®, ARCOFI®-BA, ARCOFI®-SP, DigiTape®, EPIC®-1, EPIC®-S, ELIC®, FALC®54, FALC®56, FALC®-E1, FALC®-LH, IDEC®, IOM®, IOM®-1, IOM®-2,IPAT®-2, ISAC®-P, ISAC®-S, ISAC®-S TE, ISAC®-P TE, ITAC®, IWE®, MUSAC®-A, OCTAT®-P, QUAT®-S, SICAT®, SICOFI®, SICOFI®-2, SICOFI®-4, SICOFI®-4µC, SLICOFI®, are registered trademarks of Infineon Technologies AG. ACE™, ASM™, ASP™, POTSWIRE™, QuadFALC™, SCOUT™ are trademarks of Infineon Technologies AG. BLUETOOTHT M is a trademark owned by its proprietor and used by Infineon Technologies AG under license. Edition 4/2004 Published by Infineon Technologies WS Sweden AB, Isafjordsgatan 16 SE-164 81 Kista © Infineon Technologies AG All Rights Reserved. Attention please! The information presented in this document does not constitute a part of any quotation or contract. Infineon Technologies especially emphazises the following: As far as patents or other rights of third parties are concerned, liability is expressly excluded for applications, processes and circuits implemented within components or assemblies. The information describes the type of component and shall not be considered as assured characteristics or representation. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies AG is an approved CECC manufacturer. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 of the Infineon Technologies AG, may only be used in life-support devices or systems 2 with the express written approval of Infineon Technologies AG. A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life, such as, for example, in medical, air traffic, defense, or life-sustaining automotive applications. If they fail, it is reasonable to assume that the health of the user or another person may be endangered. Exclusion of Warranty and Liability The Software is provided "as is" and Infineon gives no warranty - expressly or implied - of any kind, including, but not limited to, warranties of merchantability or fitness for a particular purpose, nor does Infineon assume any liability whatsoever as to the performance of the Software. In addition, Infineon assumes no responsibility for the ability of the customer to use this Software for the purpose it was provided for, nor does Infineon assume responsibility for any claims, including, but not limited to, claims of infringement of intellectual property rights of third parties, arising from the customer's use of the Software. Preliminary Product Overview 4/2004 Singlestone PBA 313 07 Table of Contents Introduction ...................................................................................................................... 5 General Device Overview.............................................................................................. 6 2.1 General Features............................................................................................................. 7 2.2 Block diagram................................................................................................................. 8 2.3 Typical application ......................................................................................................... 8 2.4 Mechanical dimension and pad arrangement ................................................................. 9 2.5 Module pin-out.............................................................................................................. 10 2.6 Functional Block Diagram ............................................................................................ 11 2.7 System Integration and Applications............................................................................ 12 2.7.1 General description.................................................................................................. 12 Electrical Specifications .............................................................................................13 3.1 Absolute Maximum Ratings.......................................................................................... 13 3.2 Operating conditions.................................................................................................... 13 3.3 Latch-up immunity ........................................................................................................ 13 3.4 Quality .......................................................................................................................... 13 3.5 Capacitance .................................................................................................................. 14 3.6 Current consumption.................................................................................................... 14 3.7 DC Characteristics of Digital Part ................................................................................. 15 3.7.1 Pull Up characteristics on ResetQ ............................................................................. 16 3.8 Operational Range for RF part ...................................................................................... 16 3.9 AC/DC Characteristics of RF part.................................................................................. 16 3.9.1 Transmitter Characteristics....................................................................................... 17 3.9.2 RSSI ....................................................................................................................... 17 3.9.3 Receiver Characteristics........................................................................................... 18 3.10 Characteristics of externally supplied 32.768kHz clock signal............................... 18 Assembly and design guidelines .............................................................................19 4.1 General description of the module ............................................................................... 19 4.2 Printed Circuit Board design......................................................................................... 19 4.3 Solder paste printing .................................................................................................... 19 4.4 Assembly...................................................................................................................... 20 4.4.1 Component placement ............................................................................................. 20 4.4.2 Pin mark .................................................................................................................. 20 4.5 Soldering profile........................................................................................................... 21 4.6 Antenna ........................................................................................................................ 21 4.7 Shielding / EMC requirements....................................................................................... 21 4.8 Safety............................................................................................................................ 21 Type approvals and Qualification.............................................................................22 5.1 Bluetooth Qualification ................................................................................................. 22 Preliminary Product Overview 4/2004 Singlestone PBA 313 07 5.2 FCC Modular Approval.................................................................................................. 22 5.3 R&TTE Approval ........................................................................................................... 22 Module marking.............................................................................................................23 Package...........................................................................................................................24 References......................................................................................................................25 Preliminary Product Overview 4/2004 Singlestone PBA 313 07 1 Introduction The module is built around the BlueMoon Single Cellular chip (PMB 8761) which contains the radio, baseband, link manager and HCI functionality. For additional information regarding the PMB8761 such as firmware features, complete description of Infineon specific HCI commands and events, please refer to the latest version of the Data sheet for PMB8761, T8761-XV01Dx-7600. Preliminary Product Overview 4/2004 Singlestone PBA 313 07 2 General Device Overview Infineon’s Singlestone - PBA 313 07 is a ready-to-use Class2 Bluetooth module solution targeted for data and audio applications in the 10 meters personal area range. BLUETOOTH wireless technology is an open industry standard for short range wireless communication with both data and voice transmission capability (up to 723 kbit/s data asymmetrically or up to 3 voice channels simultaneously). Singlestone is a Bluetooth 1.1 pre-qualified component, so any further development and qualification efforts for the user are minimized. It is already hardware prepared for the upcoming Bluetooth 1.2 Standard, which will improve the quality of voice connections, support the co-existence with WLAN solutions using the same frequency band and accelerate the connection setup. Integrating the baseband, link manager and RF-transceiver, Singlestone closes the gap between the Bluetooth air interface (external antenna, 2.4 GHz ISM band) and the standardized host-controllerinterface (HCI), which is physically realized as a full-duplex UART port (HW-handshake optional). In parallel, the PCM interface is suitable for audio connections. Around Infineon’s BlueMoon Single Cellular – PMB 8761 Bluetooth chip, all essential components for a complete Bluetooth solution are integrated in the Singlestone module. A 26 MHz temperature compensated crystal oscillator (TCXO) provides the highly accurate Bluetooth clock, an E²PROM holds the application specific configuration data which is loaded after power-up reset, and an integrated balun-filter component ensures optimized RF matching between the chip and the external antenna. Only a 32.768 kHz real-time clock, which is available in most target applications, must be provided to the Singlestone module. Bluetooth stack software supporting the extended feature set of Infineon’s BlueMoon family and a comprehensive portfolio of Bluetooth profiles are available from our SW partners ported to a variety of host architectures. The device is designed for a broad range of wireless applications in the consumer, automotive and industrial segments, as well as for interconnection of cellular phones, desktop PCs, laptops, and PDAs. The device is available in a shielded LGA package (11.85 x 10.6 mm²) with 8x9 pads. Preliminary Product Overview 4/2004 Singlestone PBA 313 07 2.1 General Features General • Low power consumption, programmable Power down mode • Chip in advanced low power CMOS technology • External supply-voltage 3.0V..4.75 V, recommended 3.3 V +/- 5 % • Extended temperature range – 40°C .. +85°C Interfaces • UART for UART-HCI with HW-handshake (Baudrate up to 3 Mbaud) • PCM interface (slave- and master-mode; programmable PCM slot allocation) • JTAG • GPIO for control of external devices Digital-Section • Digital demodulation gives best performance in sensitivity, co- and adjacent channel performance • Digital offset compensation and symbol synchronization / frame synchronization • GFSK-modulator (over-sampling at typ. 9-bit-resolution) with amplitude adjustment and highperformance A/D-converter for RX-data • Digital part (Noise-shaper, Gaussian impulse filter) of Σ∆-Fractional-N-PLL • CVSD transcoder for voice conformant to BLUETOOTH wireless technology • A-law, u-Law and linear PCM also possible • Baseband and Linkmanager Firmware up to HCI in internal ROM • 4 kbit E PROM for storing Bluetooth device data RF and Analog Section • Analog part of Σ∆-Fractional-N-PLL for receive and transmit path (multi-modulus-divider, phase detector and charge pump) on chip • Fully integrated and balanced VCO with integrated varactors and inductors. • On chip 2.5 GHz RF driver amplifier up to + 5 dBm output power (Fine tuning in the range of -16 - + 5 dBm in 1.5 dB steps) • Integrated LNA • Fully integrated Balun, switch and antenna filter giving one single-ended RF interface, no additional external RF components • Chip-integrated supply voltage regulator for VCO • On module 26 MHz reference clock • On module voltage regulator for single supply voltage. • Typical sensitivity -83 dBm • Typical output power +2.5 dBm Software • Baseband, Link Manager and HCI functionality is incorporated by ProBlue Firmware in chipintegrated ROM. • Infineon specific HCI+ commands to support enhanced features • Configuration data (e.g. Bluetooth device address) are loaded from internal E PROM after reset. Optionally, configuration data may be provided by the host via HCI+ command. Package • LGA 9 x 8 pads Preliminary Product Overview 4/2004 Singlestone PBA 313 07 2.2 Block diagram Singlestone – PBA 313 07 EEPROM IC UART HCI PMB8761 Bluemoon Single Cellular PCM Vsupply Antenna Balun Antenna Filter Voltage Regulator Low Power Clock 32.768 kHz Clock 26 MHz Figure 2-1: Block diagram of the PBA 313 07 Singlestone module 2.3 Typical application Bluetooth Module PBA 313 07 Singlestone CLK32 VSupply PCM UART Host application Figure 2-2: Typical application diagram Preliminary Product Overview 4/2004 Singlestone PBA 313 07 2.4 Mechanical dimension and pad arrangement Below shows the module’s pad layout. All dimensions are in mm. Figure 2-3 Mechanical dimensions, pad arrangement. Dimension Length Width Height min. 11.65 10.40 1.6 typ. 11.85 10.6 1.8 max. 12.05 10.80 2.0 Unit mm mm mm Table 2-1 Mechanical dimensions with tolerances Preliminary Product Overview 4/2004 Singlestone PBA 313 07 2.5 Module pin-out Table 2-2 represents the functional description of Singlestone’s connecting pads. Functionally nonused pads (NC) are used as sacrifice pads or test pads, and must not be connected in an application. Pin Location Symbol Input/ Output During Reset After Reset Function UART-Input UART-Output (Pull-Up controlled by FW) UART-Request to Send (PullDown/-Up controlled by FW) UART-Clear to Send Wake-up signal for host ) (PullDown controlled by FW) PCM input PCM output (Pull-Down/-Up controlled by FW) PCM frame (8kHz)(Pull-Down/-Up controlled by FW) PCM clock (>64kHz) (Pull-Down/Up controlled by FW) General purpose Input/Output (PullDown/Up controlled by FW) D6 E6 UARTIN UARTOUT Tristate Pull-Up Tristate Pull-Up E5 UARTRTS Pull-Down Pull-Down B5 D5 UARTCTS WAKEUP_HOST Tristate Pull-Down Tristate Pull-Down C2 D3 PCMIN PCMOUT Tristate Pull-Down Tristate Pull-Down B0 PCMFR I/O Pull-Down Pull-Down C1 PCMCLK I/O Pull-Down Pull-Down C3 GPIO (=GPIO0) I/O Pull-Down Pull-Down G2 B4 C4 D4 B3 F2 F3 TRST TCK TMS TDI TDO RESETQ WAKEUP_BT Pull-Down Input Pull-Up Pull-Up Tristate Pull-Up Input Pull-Down Input Pull-Up Pull-Up Tristate Pull-Up Input E2 J5 F0 G7 CLK32 ANT VSUPPLY NC (VDD) Input Input A0, A1, A4, A5 C5, C6 D1 E0, E1 E3, E4 F4, F5 G1, G6 H0, H4, H5, H6 J0, J4, J6 A2, A3 , A6, A7 B1, B2, B6, B7 C0, C7 D0, D2, D7 E7 F1, F6, F7 G0, G3, G4, G5, G7 H1, H2, H3, H7 J1, J2, J3, J7 Comments Test Reset (JTAG) Test Clock (JTAG) Test Mode Set (JTAG) Test Data Input (JTAG) Test Data Output (JTAG) Reset line (0:reset, 1:active) Wake-up signal from low power mode 32.768 kHz clock input RF input /output 50 ohms. Power Supply Regulated supply voltage for test purposes. Important that is leaved NC. GND GND GND GND GND GND GND GND GND NC NC NC NC NC NC NC NC NC Table 2-2 Module pin-out Preliminary Product Overview 10 4/2004 Singlestone PBA 313 07 2.6 Functional Block Diagram PCM Interface Loop Filter PMB8761 BlueMoon Single Cellular PCMInterface BasebandControl A/µ-Law DataRAM/ ControlRAM CRC/FEC Control Information Ser a Par FrameSync (Buffers) CRC/FEC CVSD Encryption Clocks Interrupts Digital Link Control Section Timer Ports Watchdog RF Frequency Synthesizer (Analog part ofΣ∆Fractional-N-PLL) Timers/ RF-Interface Σ∆ Fract.-NPLL SymbolRecov. OffsetCanc. Digital Baseband Section Bluetooth Link-Control/ Link-Manager/ HCI-UART Impulse Shaping Par a Ser Transmitter Demodulator Antenna Switch Σ∆-Clocks-PLL LNA I²C Receiver Power management unit UART Analog Baseband Section Analog RF-Section I CInterface E2 PROM UART GPIO JTAG 26 MHz XO WAKEUP 32.768 kHz VSUPPLY (3.0V – 4.75V) Figure 2-4: Singlestone PBA 313 07 Block diagram Preliminary Product Overview 11 4/2004 Balun + filter Singlestone PBA 313 07 2.7 System Integration and Applications 2.7.1 General description On the RF-side, Singlestone provides a 50 Ohm single-ended input/output to be directly connected to an external antenna. The design of the antenna is open to a broad spectrum (e.g. PCB antenna, ceramic antenna, external antenna) and can be optimized to the target application requirements. The HCI-interface is implemented as a full-duplex UART port which can be configured to be used in 2line or 4-line mode (with or without hardware handshake). If hardware handshake is not used then the UARTCTS pin must be grounded. The PCM interface is able to serve one Bluetooth SCO channel for voice data. Optionally, SCO channels may be linked to the host via the HCI-UART interface. Both the UART- and PCM-interfaces are assigned to the regulated voltage (2.7V) powered by VSUPPLY. VSUPPLY must be in the range of 3.0 to 4.75 V. General purpose input/output lines (GPIOs) can be controlled via HCI+ commands. Configuration data (e.g. Bluetooth device address) are loaded from internal E PROM after reset. Optionally, configuration data may be provided by the host via HCI+ commands. Preliminary Product Overview 12 4/2004 Singlestone PBA 313 07 3 Electrical Specifications 3.1 Absolute Maximum Ratings The maximum ratings may not be exceeded under any circumstances, not even momentarily and individually, as permanent damage to the module will result. Parameter Limit values Unit VSUPPLY VI Supply voltage range Input Voltage Range min. -0.3 -0.3 VO Output Voltage Range 0.3 3.0 IIN Input Current - 10 10 mA kV TStorage ESD integrity according to MIL-STD883D Method 3015.7 Maximum storage temperature range 125 °C -40 max. 6.0 3.75 Table 3-1: Absolute maximum ratings Note: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Exposure to conditions beyond those indicated in the recommended operational conditions of this specification may affect device reliability. This is a stress rating only and functional operation of the device under these conditions or at any other condition beyond those indicated in the operational conditions of this specification is not implied. 3.2 Operating conditions Unless otherwise stated, the following characteristics apply operating conditions. Parameter Temperature VSUPPLY min. typ. max. -40°C 3.0V +25°C 3.3V +85°C 4.75V Remarks Table 3-2 Operating Conditions 3.3 Latch-up immunity Latch-up immunity is guaranteed in accordance with JEDEC-standard No. 17, EIA Jedec JC-40.2. 3.4 Quality For quality and reliability conditions se 105 63-PBA31301+ Uen. Preliminary Product Overview 13 4/2004 Singlestone PBA 313 07 3.5 Capacitance T = 25°C Symbol Parameter Limit Values min. max. Unit CIN input capacitance 10 pF COUT output capacitance 15 pF CIO I/O 20 pF Table 3-3: Capacitance 3.6 Current consumption Regulator input voltage: VSUPPLY = 3.0..4.75V Bluetooth mode Average Consumption min. typ. max. Unit Test Conditions HV3 32 40 mA WSE 0x02 2.2 3.5 mA WSE 0x03 3.0 mA Sniff mode mA ACL link in sniff mode with max. interval 1.28 s scan interval, 11.25 ms scan, no interlaced scan 1.28 s scan interval, 2*11.25 ms scan, no interlaced scan 2.00 s sniff interval, sniff attempt = 1, sniff timeout = 0 Table 3-4: Average current for some Bluetooth modes. WSE means after HCI_Write_Scan_Enable. Preliminary Product Overview 14 4/2004 Singlestone PBA 313 07 3.7 DC Characteristics of Digital Part VSUPPLY = 3.0V..4.75V. Maximum allowed input levels are from -0.3V to 3.0V. Higher voltages up to 3.6V can be applied at UARTIN, UARTCTS, PCMIN, PCMFR, PCMCLK, TRST, TCK, TMS, TDI, RESETQ, CLK32, WAKEUP_BT. Symbol Parameter Test Condition Pins: PCMCLK, PCMFR, PCMIN, UARTIN, UARTCTS, GPIO0 V IN LOW Input low voltage V IN HIGH Input high voltage Pins: PCMCLK, PCMFR, PCMOUT, UARTOUT, UARTRTS, GPIO0 V OUT LOW Output low voltage IOL =2.4mA V OUT LOW Output low voltage IOL =100µA V OUT HIGH Output high voltage IOH=-2.4mA V OUT HIGH Output high voltage IOH=-100µA Pins: WAKEUP_HOST V OUT LOW Output low voltage IOL =100µA V OUT HIGH Output high voltage IOH=-100µA Pins: TRST, TCK, TMS, TDI V IN LOW Input low voltage V IN HIGH Input high voltage Pin: TDO V OUT LOW Output low voltage IOL =2.4mA V OUT LOW Output low voltage IOL =100µA V OUT HIGH Output high voltage IOH=-2.4mA V OUT HIGH Output high voltage IOH=-100µA Pin: WAKEUP_BT, CLK32 V ILOSC Input low voltage V IHOSC Input high voltage Pin: RESETQ V IN LOW Input low voltage V IN HIGH Input high voltage Min Limit Values typ 0.81 1.89 0.68 0.27 0.27 2.43 0.81 1.89 0.35 0.15 2.2 2.6 0.4 2.0 0.35 2.5 2.02 2.43 Unit max Table 3-5: DC characteristics of digital part PCMOUT PCMCLK PCMFRM max. Load Capacitance (during test) 30 pF 30 pF 30 pF Rise/Fall Time (for measurement of DC characteristics) 30 ns 30 ns 30 ns Table 3-6: Pin characteristics Symbol Parameter ILI ILO ILI, H Input leakage current Output leakage current Input leakage current for 3.6V tolerant pins* Output leakage current for UART and PCM domain pins ILO, H min Limit Values typ Unit Test Condition max µA µA µA 0VProduct number with suffix and revision state according to purchase order. 3. Batch number 4. Type of module: Engineering Samples, XX=ES 5. Manufacturing year (yy), week (ww) and factory code (2) 6. FCC Identification number Bluetooth logotype. CE marking 8. Table 6-1 Figure 6-1 Marking example Preliminary Product Overview 23 4/2004 Singlestone PBA 313 07 7 Package Singlestone is packed in tape on reel according to Figure 7-1. The tape is also the module dry pack as referred to in chapter 4.5. Figure 7-1 Tape on reel for Singlestone Preliminary Product Overview 24 4/2004 Singlestone PBA 313 07 8 References 1. T8761-XV01D12 -7600 Preliminary Data Sheet PMB 8761 Preliminary Product Overview 25 4/2004
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