Inventek Systems 362 802.11 TYPE WIFI MODULE User Manual Table of Contents

Inventek Systems 802.11 TYPE WIFI MODULE Table of Contents

User Manual

_____________________________________________________________________________________________ Inventek Systems - www.Inventeksys.com   2 Republic Road  • Billerica, MA 01862  •  Phone 978-667-1962                                      Product Specification     1                          Inventek Systems  ISM43362-M3x-L44 Embedded Serial-to-Wi-Fi Module eS-WiFiTM 802.11 b/g/n Preliminary Data Sheet
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 2   Table of Contents  1 GENERAL DESCRIPTION ................................................................................................... 4 2 PART NUMBER DETAIL DESCRIPTION .......................................................................... 5 2.1 Ordering Information ...................................................................................................... 5 3 GENERAL FEATURES ......................................................................................................... 5 3.1 Limitations ...................................................................................................................... 6 3.2 Regulatory Compliance .................................................................................................. 6 3.3 FCC User’s Manual Statements ( In Process ): .............................................................. 7 3.4 Industry Canada User’s Manual Statements: .................................................................. 9 4 COMPLEMENTARY DOCUMENTATION ...................................................................... 10 4.1 Inventek Systems .......................................................................................................... 10 5 SPECIFICATIONS ............................................................................................................... 10 5.1 Module Architecture ..................................................................................................... 10 5.2 External Antenna Connections ..................................................................................... 11 5.3 Mechanical Specifications ............................................................................................ 11 5.4 Environmental Specifications ....................................................................................... 12 6 HARDWARE ELECTRICAL SPECIFICATIONS ............................................................. 12 6.1.1 Absolute Maximum Ratings ..................................................................................... 12 6.1.2 Recommended Operating Ratings ............................................................................ 12 6.2 Power Consumption ...................................................................................................... 13 6.2.1 Estimated Power Consumption ................................................................................. 13 6.2.2 Stop Mode ................................................................................................................. 13 7 Pin out ................................................................................................................................... 14 7.1.1 Detailed Pin Description ........................................................................................... 15 7.1.2 Configuration Pins: ................................................................................................... 16 *Requires a 10K ohm pull down .............................................................................................. 16 8 AC CHARACTERISTICS ................................................................................................... 16 8.1 UART ............................................................................................................................ 16 8.1.1 Data Mode ................................................................................................................. 16 8.1.2 2.1.2 Flow Control .................................................................................................... 16 8.1.3 2.1.3 Supported Baud Rates ...................................................................................... 17 8.1.4 Default Serial Configuration ..................................................................................... 17 8.2 SPI (Serial Peripheral Interface Bus) ............................................................................ 17 8.2.1 SPI Communication Overview: ................................................................................ 18 8.2.2 SPI Command Phase: ................................................................................................ 18 8.2.3 SPI Data Phase: ......................................................................................................... 19 8.2.4 SPI Asynchronous Messages: ................................................................................... 19 8.2.5 SPI AC Characteristics: ............................................................................................ 20 8.3 USB ............................................................................................................................... 20 8.4 GPIO ............................................................................................................................. 20 8.5 ADC’s ........................................................................................................................... 20 9 Wi-Fi RF Specification ......................................................................................................... 21 9.1.1 RF Specification........................................................................................................ 21
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 3  10 Antenna Patterns ................................................................................................................... 22 10.1 External Antenna .......................................................................................................... 22 10.2 PCB Etch antenna gain on the evaluation board ........................................................... 23 10.3 Farfield Directivity........................................................................................................ 24 11 On Board Processor .............................................................................................................. 25 12 ISM43362-M3x-L44 FOOTPRINT ...................................................................................... 26 12.1 Module’s package dimensions (mm) ............................................................................ 26 13 Typical Application Circuit .................................................................................................. 27 13.1 Reference Schematic (EVB) ......................................................................................... 28 13.2 USB to UART ............................................................................................................... 29 13.3 Connecting Microcontroller to eS-WiFi UART ........................................................... 30 13.4 EXTERNAL FLASH FOR OVER THE AIR UPGRADE........................................... 31 13.5 JTAG and Reset Connections ....................................................................................... 31 13.6 eS-WiFi Programming Options .................................................................................... 32 13.7 eS-WiFi USB Direct Connection Option ...................................................................... 32 14 Product Compliance Considerations ..................................................................................... 33 15 Reflow Profile ....................................................................................................................... 33 16 Packaging Information .......................................................................................................... 34 16.1 MSL Level / Storage Condition .................................................................................... 34 16.2 Device baking requirements prior to assembly ............................................................. 35 Module’s Assembly Instructions .............................................................................................. 35 17 REVISION CONTROL ........................................................................................................ 36 18 CONTACT INFORMATION ............................................................................................... 36
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 4   1  GENERAL DESCRIPTION   The  Inventek  ISM43362-M3X-L44  is  an  embedded  (eS-WiFiTM)  wireless  Internet Connectivity device.  The Wi-Fi module hardware consists of an STM M3 Cortex host processor, integrated antenna (or optional ext. antenna) and Broadcom Wi-Fi device all interconnected.    The  module  provides  UART,  USB  and  SPI  interfaces  enabling connection  to  an embedded  design.  The Wi-Fi  module  requires  no  operating system and  has  a  completely  integrated  TCP/IP  Stack  that  only  requires  AT  commands  to establish  connectivity  for  your wireless  product,  minimizing development  time,  testing routines and certification. The low cost, small foot print (14.5 mm x 30 mm) and ease of design-in make it ideal for a range of embedded applications. The module hardware can be used with Inventek’s AT Command set or the Broadcom’s WICEDTM SDK.  Summary of Key Features:  802.11 b/g/ n compliant based on Broadcom MAC/Baseband/Radio device.   Fully contained TCP/IP stack minimizing host CPU requirements.   Configurable using AT commands.   Host interface: UART, SPI, or USB.    Network features    ICMP (Ping), ARP, DHCP,TCP, UDP.     Low power operation (3.3V supply) with built-in low power modes.   Secure Wi-Fi authentication WEP-128, WPA-PSK (TKIP), WPA2-PSK.   Proven Interoperability … Connects with other vendor’s b/g/n Access Points in the Wireless LAN.  Supported by Broadcom WICEDTM SDK  Typical Applications:  PDA, Pocket PC, computing devices.   Building automation and smart energy control.   Industrial sensing and remote equipment monitoring.   Warehousing, logistics and freight management.   PC and gaming peripherals.   Printers, scanners, alarm and video systems.   Medical applications including patient monitoring and remote diagnostics.
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 5     2  PART NUMBER DETAIL DESCRIPTION 2.1  Ordering Information  Device Description Ordering Number ISM43362-M3G-L44 802.11 Module, STM32F205 (1 Meg), Commercial Temp (UART,SPI, Internal Etched Antenna) ISM43362-M3G-L44-E ISM43362-M3G-L44 802.11 Module, STM32F205 (1 Meg), Commercial Temp (UART,SPI, External U.FL Connector)) ISM43362-M3G-L44-U ISM43362-M3G-EVB-E Evaluation Board, USB cable, with ISM43362-M3G-L44-E, Quick Start Guide  ISM43362-M3G-EVB-E 3  GENERAL FEATURES    Based on the Broadcom BCM43362 MAC/Baseband/Radio device.   Supports Broadcom WICED SDK   CPU ARM Cortex™-M3 32-bit RISC core from ST Microelectronics.   Host UART, SPI, or USB HID interface.   IEEE 802.11n D7.0 -OFDM-72.2 Mbps -single stream w/20 Mhz, Short GI   IEEE 802.11g (OFDM 54 Mbps)    IEEE 802.11b (DSSS 11Mbps)   IEEE 802.11i (Security) o  WPA (Wi-Fi Protected Access) –PSK/TKIP o  WPA2 (Wi-Fi Protected Access 2)- AES/CCMP/802.1x Authentication   Inputs +3.3 V tolerant   5 GPIO, 5 ADC (Note: SPI interface utilizes ADC pins.)   The devices operate from a 3.0 to 3.6 V power supply.    -40 to +85 °C temperature range    Power-saving mode allows the design of low-power applications.    Lead Free Design which is compliant with ROHS requirements.    EMI/EMC Metal Shield for best RF performance in noisy environments and to accommodate for lower RF emissions/signature for easier FCC compliance.   FCC/CE Compliance Certification (In process).
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 6   3.1  Limitations  Inventek Systems products are not authorized for use in safety-critical applications (such as life support) where a failure of the Inventek Systems product would reasonably be expected to cause severe personal injury or death.   3.2  Regulatory Compliance     CE  Regulator Status FCC 07P-362 CE 10147A-362 RoHS Compliant
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 7   3.3  FCC and IC User’s Manual Statements ( Pending ):  OEM INSTRUCTIONS:  This module is limited to OEM installation only.  OEM integrators must ensure that the end-user has no manual instructions to remove or install the module.. OEM’s must comply with FCC marking regulation part 15 declaration of conformity (Section 2.925(e)).  This module is to be installed only in mobile or fixed applications (Please refer to FCC CFR 47 Part 2.1091(b) for a definition of mobile and fixed devices).  Separate approval is required for all other operating configurations, including portable configurations with respect to FCC CFR 47 Part 2.1093, and different antenna configurations.   The antennas  used with this module must be installed to provide a separation distance of at least 20cm from all persons, and must not be co-located or transmit simultaneously with any other antenna or transmitter, except in accordance with FCC multi transmitter product procedures.   The ISM43362 Module has been designed to operate with the following antennas and gains.  Use with other antenna types or with these antenna types at higher gains is strictly prohibited.   Manufacturer Type of Antenna Model Gain dB Type of Connector Inventek U.Fl port Antenna W24P-U 2.15 Unique Connector Inventek Trace Antenna NA 0 Permanent integral
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 8   Warning: changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.  A clearly visible label is required on the outside of the user’s (OEM) enclosure stat the following text:  Contains FCC ID: O7P-362 Contains IC: 10147A-362  This transmitter module has been certified for FCC Part 15 operation; when installed in a host device, the host manufacturer is responsible for making sure that the host device with the transmitter installed continues to be compliant with Part 15B unintentional radiator requirements
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 9  Industry Canada User’s Manual Statements:  IC RSS-210/RSS-Gen Notices-  Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of this device.  L’opѐration est soumise aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer d’interfѐrences et (2) cet apparial doit accepter toute interfѐrence, y compris les interfѐrences qui peuvent causer un mauvis fonctionment de l’appareil.  Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada.  To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.  Sous la rѐglementation d’Industrie Canada, ce transmetteur radio ne peut fonctionner en utilisant une antenne d’un type et un maximum (ou moins) gain approuvѐes pour l’ѐmetteur par Industrie Canada. Pour rѐduire le risqué d’interference aux autres utilisateures, le type d’antenne et son gain doivent être choisis de maniѐre que la puissance isotrpe rayonnѐe ѐquivalente (PIRE) ne dѐpasse pas ce qui est nѐcessaire pour une communication rѐussie.  The radio transmitter has been approved by Industry Canada to operate with the antenna types listed above with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.  Cet ѐmetteur de radio a ѐtѐ approuvѐ par Industrie Canada pour fonctionner avec les types d’antennes ѐnumѐrѐes ci-dessus avec le gain maximal admissible et impѐdance d’antenna requise pour chaque type d’antenne indiquѐ. Types d’antennes ne figurant pas dans cette liste, ayant un gain supѐrieur au gain maximum indiquѐ pour ce type, sont strictement interdites pour l’utilisation avec cet appareil.
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 10   4  COMPLEMENTARY DOCUMENTATION 4.1  Inventek Systems   Evaluation Board o ISM43362-M3G-EVB Evaluation Board Specification o EVB Users Guide o Quick Start Guide o eS-WiFi Demo software (includes EVB Drivers and Firmware)  AT Command Set o AT Command Set User’s Manual o AT Command Set Quick Reference Guide  Firmware  OrCAD Schematic Symbol  PADS Land Pattern  FCC Test Report ( In  Process)  5  SPECIFICATIONS 5.1  Module Architecture   Figure 1 Inventek’s ISM43362-M3 General Block Diagram  Note:   1. ADC1-ADC4 can also be used as SPI port      2. Antenna Options:  Integrated microstrip antenna or U.fl connector for an external antenna.
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 11  5.2  External Antenna Connections  ISM43362-M3X-L44-U  module  is  designed  for  use  with  an  external  antenna  via  a connection using the U.FL connector. Item Description Connector U.FL series Manufacturer I-PEX Co., Ltd. Part No. 20279-001E-01 Height 1.25 mm Width 2 mm DC 3.0 – 5.0 V Table 1 On-Board Antenna Connector 5.3  Mechanical Specifications  The Physical dimensions of this eS-WiFi Module are as follow:   Figure 2:  ANTENNA IS IN ETCH * External Antenna does not require keep out area *Keep out area should ideally have the antenna handing off the side of the PCB for best performance.  *The ISM43362-M3X-L44 U and E have the same footprint. * Keep out Area
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 12   Items Description ISM43362-M3X-L44-E /U  Length 30 mm  (-/+0.5 mm) Width 14.5 mm (-/+0.5 mm)  Height 2.5 ± 0.2 mm  Package 44 pin LGA 5.4  Environmental Specifications  Item Description Operating temperature range -40 deg. C to +85 deg. C Storage temperature range -40 deg. C to +85 deg. C Humidity 95% max non-condensing  Note 1: The ISM43362-M3X supports a functional operating range of -40°C to +85°C. However the optimal RF performance specified in this data sheet is only guaranteed for temperatures from -10°C to +65°C  6  HARDWARE ELECTRICAL SPECIFICATIONS  6.1.1  Absolute Maximum Ratings   6.1.2  Recommended Operating Ratings  Symbol Min. Typ. Max. Unit. VDD 3.0 3.3 3.6 V VBAT 3.0 3.3 3.6 V      Symbol Description Min Max Unit VDD Input supply Voltage -0.4 3.7 V VBAT Battery Backup -0.4 3.6 V
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 13   6.2  Power Consumption  6.2.1  Estimated Power Consumption  Mode/Description 802.x Voltage Typ. (RMS) Max. Unit Running Full Power(1) /n 3.3V 110  mA Running in Power Save Mode /n 3.3V 55 110(1) mA Wi-Fi Radio Off  b/g/n  30  mA Stop Mode(2)    10  mA Note: (1)During transmit the max can reach 340 mA burst of not more than 5ms. (2)Available in Firmware release1.3 or later only.  The eS-WiFi modules support multiple power saving modes. Please see the power savings application note for more detailed information 6.2.2  Stop Mode  Stop Mode is initiated by software and exited by the Wakeup pin. (Wakeup pin is 3.3 volt tolerant). The wakeup pin is an external interrupt pin that on the rising edge will cause the module to exit stop mode. It is an edge trigged input.  It is critical to have no glitch on this line.
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 14  7  Pin out
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 15  7.1.1 Detailed Pin Description  Pin No. Type Pin Definition Descriptions 1 G GND Ground 2 I VDD 3.3V 3 G GND Ground 4 I/O RES    Reserved 5 I/O RES Reserved 6 I/O RES Reserved 7 I/O RES   Reserved 8 I/O RES Reserved 9 I ADC 4 / SPI_MOSI  ADC Input Pins or SPI (Refer to SPI Section 8.2)  10 I ADC 3 / SPI_MISO 11 I ADC 2 / SPI_SCK 12 I ADC 1 / SPI_SSN 13  I ADC 0/ DATARDY 14 I VDD 3.3V 15 I VBAT 3.3V  16 I Wakeup  (Refer to Section 6.2.2) 17 G GND Ground 18 I DP USB Data Plus (Refer to Table 7.1.2) 19 I/O DM USB Data Minus (Refer to Table 7.1.2 ) 20 G GND Ground 21 I/O RX UART Receive (Refer to section 8.1 ) 22 I/O TX UART Transmit (Refer to section 8.1 ) 23 I/O GPIO 0   General Purpose Interface Pins 24 I/O GPIO 1 25 I/O GPIO 2 26 I/O GPIO 3 27 I/O GPIO 4 28 I CFGO Configuration Pin 0 (Refer to Table 7.1.2 ) 29 I CFG1 Configuration Pin 1 (Refer to Table 7.1.2 ) 30 O RES Reserved 31 I RES Reserved 32 I RES Reserved 33 I BOOT 0 Reserved 34 I RSTN Reset  (See STM32F205 NRST specification ) 35 G GND Ground 36 G GND Ground
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 16  Pin No. Type Pin Definition Descriptions 37 G GND Ground 38 G GND Ground 39 G GND Ground 40 G GND Ground 41 G GND Ground 42 G GND Ground 43 G GND Ground 44 G GND Ground   7.1.2 Configuration Pins:  CFGO CFG1 Internally Pulled High 1 1 UART ( NC) 1 0* SPI 0* 1 USB VCP 0* 0* USB HID *Requires a 10K ohm pull down   8  AC CHARACTERISTICS Serial interfaces supported 8.1  UART 8.1.1  Data Mode  When the eS-WiFi module is interfaced serially, the serial interface needs to be configured for 8 bit data, no parity, and one stop bit -- (8-n-1).  8.1.2 2.1.2 Flow Control  The eS-WiFi module doesn’t require or support Flow Control, so Flow Control should be ‘None’
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 17  8.1.3 2.1.3 Supported Baud Rates  The eS-WiFi module supports the following serial baud rates: 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400, 460800, 921600, 1152000, 1382400, 1612800, 1834200, 2073600  8.1.4 Default Serial Configuration  The eS-WiFi module is shipped with the default serial configuration of 115200 baud, 8 data bits, no party, and 1 stop bits.   8.2  SPI (Serial Peripheral Interface Bus)  The eS-WiFi module supports SPI (Contact Inventek for firmware)                    SPI Slave Interface: Clock rate:  20MHz max. Width:   16-bit  Note: That all commands to the eS-WiFi module must be post-padded with 0x0A (Line Feed) to an even number of bytes. That all data from eS-WiFi module will post-padded with 0x15(NAK) to an even number of bytes.  Command Phase Data Phase SCLK MOSI MISO SSN CMD/DATA READY
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 18  8.2.1 SPI Communication Overview:  With the exception of initial cursor, all communication with the module happens synchronously. In other words, the SPI Master must always poll for every asynchronous event.   A typical command flow is provided flow. This is an example using the Direct Connect Soft AP with a TCP communication server. SPI Master SPI Slave Description  “\r\n> “ Prompt “AS=0,ABC\r\x15” "\r\n\r\nOK\r\n> " Set Access Point SSID “AD\r\x15” "\r\n\r\nOK\r\n> " Start AP - Direct Mode "P1=0\r\x15" "\r\n\r\nOK\r\n> " Set TCP Protocol "P4=2000\r" "\r\n\r\nOK\r\n> " Set TCP Port "P5=1\r\x15" "\r\n\r\nOK\r\n> " Start TCP COMM Server "MR\r\x15" "\r\n[SOMA]...[EOMA]\r\nOK\r\n> " Read Messages Note: [SOMA] - Start Of Message Asynchronous, [EOMA] - End Of Message Asynchronous  The SPI communication is always 16-bit and can be sustained up to 20MHz. The eS-WiFi module after power up or reset will raise CMD/DATA  READY pin to signal that the first Data Phase has started. In this mode, the SPI Host must fetch the cursor. As provided by the example above, this is the only time host needs fetch data from slave without issuing a command.   The Host will initiate a SPI cycle (lower SSN) and clock out 0x0A (Line Feed) until the CMD/DATA READY pin lowers signaling the end of the Data Phase. The data received will be 0x0d (CR) 0x0A (LF) 0x3E (>) 0x20 (SP).   The next rising edge of the CMD/DATA READY pin signals the Command Phase. 8.2.2 SPI Command Phase:  The Command Phase indicates the eS-WiFi module is ready to accept a AT Command. The command must include all delimiters and data for the command.  Ex.  S3=0010\r0123456789 The command must also be sent as one continuous SPI cycle,  that is SSN must stay low for the complete command, delimiters, and data.  The Host will initiate a SPI cycle (lower SSN) and clock out the command, delimiters and associated data  and raise the NSS signal to indicated that the all data has be sent. As result of the NNS raising the eS-WiFi module will lower the CMD/DATA READY pin to signal the end Command Phase.  The data that will be clocked back to the Host will be 0x15 (NAK).
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 19  8.2.3 SPI Data Phase:  The Data Phase indicates the eS-WiFi module has data ready for the Host to read. The eS-WiFi module will raise CMD/DATA READY  and the Host will initiate a SPI cycle (lower SSN) and clock out 0x0A (Line Feed) until the CMD/DATA READY pin lowers signaling the end of the Data Phase.  8.2.4 SPI Asynchronous Messages:   There are certain situations in which the eS-WiFi will issue asynchronous messages:  Soft AP (AO/AD Commands), when a device connects to the Soft AP a DHCP assigned message will issued. Ex.  [DHCP      ] Assigned 00:00:00:00:00:00 has 192.168.10.100  TCP/UDP Communication Servers (P5=1), when a client connects to the server a connected message will be issued. Ex.  [TCP SVR]  Waiting on connection...   [TCP SVR] Accepted 192.168.10.100:2000   [UDP SVR] Accepted 192.168.10.100:2000 With the SPI host interface being synchronous the Host must poll for these messages. This can be done by using the MR (Message Read) command or when a Communication   connection the issuing of a R0 command will read all asynchronous message and the result of the R0 command.  The asynchronous messages are delineated by the Start Of Message Asynchronous ([SOMA]) and End Of Message Asynchronous ([EOMA]) markers.
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 20  8.2.5 SPI AC Characteristics:   Symbol Min. Typ. Max. Tf(sck)   20 MHz Tc(sck) 50 ns   Tsu(sck)  15 us  Tc(byte)  8 * Tc(sck)  Tsu(ssn)  4 us  Th(ssn)  3 us     8.3  USB The eS-WiFi module supports a USB HID interface.  (Contact Inventek for firmware.)  8.4  GPIO  Each of the GPIO pins can be configured by the AT command set as Button, LED, Digital input or Digital output. The outputs are 3.3V CMOS and reference the AT Command Set User manual to configure.  8.5  ADC’s  One 12-bit analog-to-digital converters is available and reference the AT Command Set User manual to configure.
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 21  9  Wi-Fi RF Specification 9.1.1  RF Specification Conditions: VDD=3.3V; VDDIO=3.3V; TEMP: 25°C Feature Description WLAN Standard IEEE 802.11b/g/n, Wi-Fi compliant Frequency Range 2.400 GHz ~ 2.497 GHz (2.4 GHz ISM Band) Number of Channels Ch1 ~ Ch14 Modulation 802.11 g/n : OFDM /64-QAM,16-QAM, QPSK, BPSK 802.11b : CCK, DQPSK, DBPSK   Output Power 802.11b /11Mbps : 20 dBm ± 1.5 dB 802.11g /54Mbps:  20 dBm ± 1.5 dB 802.11n /72Mbps: 20 dBm ± 1.5 dB      Receive Sensitivity (11n,20MHz) @10% PER -  MCS=0  PER @ -86 dBm, typical -  MCS=1  PER @ -85 dBm, typical -  MCS=2  PER @ -85 dBm, typical -  MCS=3  PER @ -84 dBm, typical -  MCS=4  PER @ -80 dBm, typical -  MCS=5  PER @ -78 dBm, typical -  MCS=6  PER @ -72 dBm, typical -  MCS=7  PER @ -69 dBm, typical       Receive Sensitivity (11g) @10% PER -  6Mbps  PER @ -89 dBm, typical -  9Mbps  PER @ -88 dBm, typical -  12Mbps  PER @ -88 dBm, typical -  18Mbps  PER @ -87 dBm, typical -  24Mbps  PER @ -83 dBm, typical -  36Mbps  PER @ -80 dBm, typical -  48Mbps  PER @ -75 dBm, typical -  54Mbps  PER @ -72 dBm, typical   Receive Sensitivity (11b) @10% PER -  1Mbps  PER @ -93 dBm, typical -  2Mbps  PER @ -91 dBm, typical -  5.5Mbps  PER @ -89 dBm, typical -  11Mbps  PER @ -87 dBm, typical Data Rates 802.11b : 1, 2, 5.5, 11Mbps 802.11g : 6, 9, 12, 18, 24, 36, 48, 54Mbps Data Rate (20MHz ,Long GI,800ns)   802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 22  Data Rate (20MHz ,short GI,400ns) 802.11n : 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65,72.2Mbps   Maximum Input Level 802.11b : -10 dBm 802.11g : -10 dBm   10 Antenna Patterns  10.1 External Antenna  The U.FLPCB  antenna has  passed FCC and CE. The part number is W24P-U. It is a 2.4 GHz PCB antenna with an u.FL connector.    The es-Wifi family of Wi-Fi products comes with two different antenna offerings:  ISM43362-M3G-L44-E PCB Etch Antenna ISM43362-M3G-L44-U U.FL connector for external antenna   The PCB U.FL antenna that will be used for FCC and CE certified can be found on the Inventek Website.
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 23  10.2 PCB Etch antenna gain on the evaluation board   The es-WiFi PCB etch antenna performance is shown below. This etch antenna will be FCC and CE certified and the radiation patterns shown below are based on simulation using our evaluation boards that has a ground plane 71 x 48mm.
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 24  10.3 Farfield Directivity
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 25                             11 On Board Processor  The eS-WiFi module is available with ST Microcontroller, F205 family of processors.  ISM43362-M3G-L44 -E STM32F205 (1 Meg), Flash Microcontroller ISM43362-M3G-L44-U STM32F103 (1Meg), Flash Microcontroller) See theSTM32F205 specification from ST Microelectronics for UART, SPI (Slave Mode) and USB Device.     http://www.st.com/internet/mcu/product/164485.jsp#DATASHEET
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 26  12 ISM43362-M3x-L44 FOOTPRINT 12.1  Module’s package dimensions (mm)
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 27   13 Typical Application Circuit  This is the minimum number of wires required to be connected to your microcontroller for operation in UART mode. You may also want to bring out the JTAG lines for firmware upgrades.                    ISM43362-M3G
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 28  13.1  Reference Schematic (EVB)     Note: Second USB port J10 is not installed on the evaluation boards. Please contact Inventek if you want to use USB or SPI mode.  Typical application circuits please refer to schematic below. For a *.pdf version please visit the Wi-Fi evaluation board website, www.Inventeksys.com.            ISM43362-M3G
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 29  13.2  USB to UART
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 30  13.3  Connecting Microcontroller to eS-WiFi UART            ISM43362-M3G ISM43362-M3G
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 31  13.4  EXTERNAL FLASH FOR OVER THE AIR UPGRADE (In development, contact Inventek)   13.5 JTAG and Reset Connections
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 32   13.6  eS-WiFi Programming Options     13.7  eS-WiFi USB Direct Connection Option
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 33   14 Product Compliance Considerations  RoHS: Restriction of Hazardous Substances (RoHS) directive has come into force since 1st July 2006 all electronic products sold in the EU must be free of hazardous materials, such as lead. Inventek is fully committed to being one of the first to introduce lead-free GPS  products  while  maintaining  backwards  compatibility  and  focusing  on  a continuously high level of product and manufacturing quality.  EMI/EMC:  The  Inventek  module  design  embeds  EMI/EMC  suppression  features  and accommodations to allow for higher operational reliability in noisier (RF) environments and easier integration compliance in host (OEM) applications.  FCC/CE:  The module will be in compliance test for FCC/CE   15 Reflow Profile   Reference the IPC/JEDEC standard.  Peak Temperature:   <250°C  Number of Times:   ≤2 times
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 34    16 Packaging Information  16.1 MSL Level / Storage Condition
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 35  16.2 Device baking requirements prior to assembly  Boards must be baked prior to rework or assembly to avoid damaging moisture sensitive components during localized reflow.  The default bake cycles is 24 hours at 125C.  Maintaining proper control of moisture uptake in components is critical. Before opening the shipping bag and attempting solder reflow, you should maintain a minimal out-of-bag time and ensure the highest possible package reliability for the final product.  Module’s Assembly Instructions  Board Placement: The ISM43362-M3G-L44 has an optional on board Wi-Fi antenna. The board is designed to be a stuffing option. If you elect to use the on board antenna, then board placement is critical in your system.  Several key things to consider when placing the module are:   Ensure that the antenna portion of the design is placed so that the antenna has no ground plane under, above or near the antenna. Ideally, the antenna requires clear sky for optimal performance. If you have shields or other material around the antenna, please test for interference and loss of signal strength.
                              ISM43362-M3X Product Specification _____________________________________________________________________________________________   Inventek Systems  DOC-DS-20023-2.1 36    17 REVISION CONTROL  Document : ISM43362-M3X-L44 Wi-Fi module External Release DOC-DS-20023   Date Author Revision Comment 8/15/2012 FMT 1.0 Preliminary 2/11/2013 FMT 1.1 Updated Ref. Schematic 5/5/2013 FMT 2.0 Updated SPI 7/24/13 FMT 2.1 Added FCC, updated Temp range   18 CONTACT INFORMATION  Inventek Systems 2 Republic Road Billerica Ma, 01862 Tel: 978-667-1962 Sales@inventeksys.com   www.inventeksys.com   Inventek Systems reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. The information contained within is believed to be accurate and reliable.  However Inventek Systems does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others.

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