Inventek Systems 362 802.11 TYPE WIFI MODULE User Manual Table of Contents
Inventek Systems 802.11 TYPE WIFI MODULE Table of Contents
User Manual
Inventek Systems ISM43362-M3x-L44 Embedded Serial-to-Wi-Fi Module eS-WiFi 802.11 b/g/n Preliminary Data Sheet TM _____________________________________________________________________________________________ Inventek Systems - www.Inventeksys.com 2 Republic Road • Billerica, MA 01862 • Phone 978-667-1962 Product Specification ISM43362-M3X Product Specification Table of Contents GENERAL DESCRIPTION ................................................................................................... 4 PART NUMBER DETAIL DESCRIPTION .......................................................................... 5 2.1 Ordering Information ...................................................................................................... 5 GENERAL FEATURES ......................................................................................................... 5 3.1 Limitations ...................................................................................................................... 6 3.2 Regulatory Compliance .................................................................................................. 6 3.3 FCC User’s Manual Statements ( In Process ): .............................................................. 7 3.4 Industry Canada User’s Manual Statements: .................................................................. 9 COMPLEMENTARY DOCUMENTATION ...................................................................... 10 4.1 Inventek Systems .......................................................................................................... 10 SPECIFICATIONS ............................................................................................................... 10 5.1 Module Architecture ..................................................................................................... 10 5.2 External Antenna Connections ..................................................................................... 11 5.3 Mechanical Specifications ............................................................................................ 11 5.4 Environmental Specifications ....................................................................................... 12 HARDWARE ELECTRICAL SPECIFICATIONS ............................................................. 12 6.1.1 Absolute Maximum Ratings ..................................................................................... 12 6.1.2 Recommended Operating Ratings ............................................................................ 12 6.2 Power Consumption ...................................................................................................... 13 6.2.1 Estimated Power Consumption ................................................................................. 13 6.2.2 Stop Mode ................................................................................................................. 13 Pin out ................................................................................................................................... 14 7.1.1 Detailed Pin Description ........................................................................................... 15 7.1.2 Configuration Pins: ................................................................................................... 16 *Requires a 10K ohm pull down .............................................................................................. 16 AC CHARACTERISTICS ................................................................................................... 16 8.1 UART ............................................................................................................................ 16 8.1.1 Data Mode ................................................................................................................. 16 8.1.2 2.1.2 Flow Control .................................................................................................... 16 8.1.3 2.1.3 Supported Baud Rates ...................................................................................... 17 8.1.4 Default Serial Configuration ..................................................................................... 17 8.2 SPI (Serial Peripheral Interface Bus) ............................................................................ 17 8.2.1 SPI Communication Overview: ................................................................................ 18 8.2.2 SPI Command Phase: ................................................................................................ 18 8.2.3 SPI Data Phase: ......................................................................................................... 19 8.2.4 SPI Asynchronous Messages: ................................................................................... 19 8.2.5 SPI AC Characteristics: ............................................................................................ 20 8.3 USB ............................................................................................................................... 20 8.4 GPIO ............................................................................................................................. 20 8.5 ADC’s ........................................................................................................................... 20 Wi-Fi RF Specification ......................................................................................................... 21 9.1.1 RF Specification........................................................................................................ 21 _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 ISM43362-M3X Product Specification 10 Antenna Patterns ................................................................................................................... 22 10.1 External Antenna .......................................................................................................... 22 10.2 PCB Etch antenna gain on the evaluation board ........................................................... 23 10.3 Farfield Directivity........................................................................................................ 24 11 On Board Processor .............................................................................................................. 25 12 ISM43362-M3x-L44 FOOTPRINT ...................................................................................... 26 12.1 Module’s package dimensions (mm) ............................................................................ 26 13 Typical Application Circuit .................................................................................................. 27 13.1 Reference Schematic (EVB) ......................................................................................... 28 13.2 USB to UART ............................................................................................................... 29 13.3 Connecting Microcontroller to eS-WiFi UART ........................................................... 30 13.4 EXTERNAL FLASH FOR OVER THE AIR UPGRADE........................................... 31 13.5 JTAG and Reset Connections ....................................................................................... 31 13.6 eS-WiFi Programming Options .................................................................................... 32 13.7 eS-WiFi USB Direct Connection Option ...................................................................... 32 14 Product Compliance Considerations ..................................................................................... 33 15 Reflow Profile ....................................................................................................................... 33 16 Packaging Information .......................................................................................................... 34 16.1 MSL Level / Storage Condition .................................................................................... 34 16.2 Device baking requirements prior to assembly............................................................. 35 Module’s Assembly Instructions .............................................................................................. 35 17 REVISION CONTROL ........................................................................................................ 36 18 CONTACT INFORMATION ............................................................................................... 36 _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 ISM43362-M3X Product Specification 1 GENERAL DESCRIPTION The Inventek ISM43362-M3X-L44 is an embedded (eS-WiFiTM) wireless Internet Connectivity device. The Wi-Fi module hardware consists of an STM M3 Cortex host processor, integrated antenna (or optional ext. antenna) and Broadcom Wi-Fi device all interconnected. The module provides UART, USB and SPI interfaces enabling connection to an embedded design. The Wi-Fi module requires no operating system and has a completely integrated TCP/IP Stack that only requires AT commands to establish connectivity for your wireless product, minimizing development time, testing routines and certification. The low cost, small foot print (14.5 mm x 30 mm) and ease of design-in make it ideal for a range of embedded applications. The module hardware can be used with Inventek’s AT Command set or the Broadcom’s WICEDTM SDK. Summary of Key Features: 802.11 b/g/ n compliant based on Broadcom MAC/Baseband/Radio device. Fully contained TCP/IP stack minimizing host CPU requirements. Configurable using AT commands. Host interface: UART, SPI, or USB. Network features ICMP (Ping), ARP, DHCP,TCP, UDP. Low power operation (3.3V supply) with built-in low power modes. Secure Wi-Fi authentication WEP-128, WPA-PSK (TKIP), WPA2-PSK. Proven Interoperability … Connects with other vendor’s b/g/n Access Points in the Wireless LAN. Supported by Broadcom WICEDTM SDK Typical Applications: PDA, Pocket PC, computing devices. Building automation and smart energy control. Industrial sensing and remote equipment monitoring. Warehousing, logistics and freight management. PC and gaming peripherals. Printers, scanners, alarm and video systems. Medical applications including patient monitoring and remote diagnostics. _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 ISM43362-M3X Product Specification 2 PART NUMBER DETAIL DESCRIPTION 2.1 Ordering Information Device ISM43362-M3G-L44 ISM43362-M3G-L44 ISM43362-M3G-EVB-E Description 802.11 Module, STM32F205 (1 Meg), Commercial Temp (UART,SPI, Internal Etched Antenna) 802.11 Module, STM32F205 (1 Meg), Commercial Temp (UART,SPI, External U.FL Connector)) Evaluation Board, USB cable, with ISM43362-M3G-L44-E, Quick Start Guide Ordering Number ISM43362-M3G-L44-E ISM43362-M3G-L44-U ISM43362-M3G-EVB-E 3 GENERAL FEATURES Based on the Broadcom BCM43362 MAC/Baseband/Radio device. Supports Broadcom WICED SDK CPU ARM Cortex™-M3 32-bit RISC core from ST Microelectronics. Host UART, SPI, or USB HID interface. IEEE 802.11n D7.0 -OFDM-72.2 Mbps -single stream w/20 Mhz, Short GI IEEE 802.11g (OFDM 54 Mbps) IEEE 802.11b (DSSS 11Mbps) IEEE 802.11i (Security) WPA (Wi-Fi Protected Access) –PSK/TKIP WPA2 (Wi-Fi Protected Access 2)- AES/CCMP/802.1x Authentication Inputs +3.3 V tolerant 5 GPIO, 5 ADC (Note: SPI interface utilizes ADC pins.) The devices operate from a 3.0 to 3.6 V power supply. -40 to +85 °C temperature range Power-saving mode allows the design of low-power applications. Lead Free Design which is compliant with ROHS requirements. EMI/EMC Metal Shield for best RF performance in noisy environments and to accommodate for lower RF emissions/signature for easier FCC compliance. FCC/CE Compliance Certification (In process). _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 ISM43362-M3X Product Specification 3.1 Limitations Inventek Systems products are not authorized for use in safety-critical applications (such as life support) where a failure of the Inventek Systems product would reasonably be expected to cause severe personal injury or death. 3.2 Regulatory Compliance CE Regulator FCC CE RoHS Status 07P-362 10147A-362 Compliant _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 ISM43362-M3X Product Specification 3.3 FCC and IC User’s Manual Statements ( Pending ): OEM INSTRUCTIONS: This module is limited to OEM installation only. OEM integrators must ensure that the end-user has no manual instructions to remove or install the module.. OEM’s must comply with FCC marking regulation part 15 declaration of conformity (Section 2.925(e)). This module is to be installed only in mobile or fixed applications (Please refer to FCC CFR 47 Part 2.1091(b) for a definition of mobile and fixed devices). Separate approval is required for all other operating configurations, including portable configurations with respect to FCC CFR 47 Part 2.1093, and different antenna configurations. The antennas used with this module must be installed to provide a separation distance of at least 20cm from all persons, and must not be co-located or transmit simultaneously with any other antenna or transmitter, except in accordance with FCC multi transmitter product procedures. The ISM43362 Module has been designed to operate with the following antennas and gains. Use with other antenna types or with these antenna types at higher gains is strictly prohibited. Manufacturer Inventek Inventek Type of Antenna U.Fl port Antenna Trace Antenna Model Gain dB W24P-U 2.15 NA Type of Connector Unique Connector Permanent integral _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 ISM43362-M3X Product Specification Warning: changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. A clearly visible label is required on the outside of the user’s (OEM) enclosure stat the following text: Contains FCC ID: O7P-362 Contains IC: 10147A-362 This transmitter module has been certified for FCC Part 15 operation; when installed in a host device, the host manufacturer is responsible for making sure that the host device with the transmitter installed continues to be compliant with Part 15B unintentional radiator requirements _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 ISM43362-M3X Product Specification Industry Canada User’s Manual Statements: IC RSS-210/RSS-Gen NoticesOperation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of this device. L’opѐration est soumise aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer d’interfѐrences et (2) cet apparial doit accepter toute interfѐrence, y compris les interfѐrences qui peuvent causer un mauvis fonctionment de l’appareil. Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. Sous la rѐglementation d’Industrie Canada, ce transmetteur radio ne peut fonctionner en utilisant une antenne d’un type et un maximum (ou moins) gain approuvѐes pour l’ѐmetteur par Industrie Canada. Pour rѐduire le risqué d’interference aux autres utilisateures, le type d’antenne et son gain doivent être choisis de maniѐre que la puissance isotrpe rayonnѐe ѐquivalente (PIRE) ne dѐpasse pas ce qui est nѐcessaire pour une communication rѐussie. The radio transmitter has been approved by Industry Canada to operate with the antenna types listed above with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Cet ѐmetteur de radio a ѐtѐ approuvѐ par Industrie Canada pour fonctionner avec les types d’antennes ѐnumѐrѐes ci-dessus avec le gain maximal admissible et impѐdance d’antenna requise pour chaque type d’antenne indiquѐ. Types d’antennes ne figurant pas dans cette liste, ayant un gain supѐrieur au gain maximum indiquѐ pour ce type, sont strictement interdites pour l’utilisation avec cet appareil. _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 ISM43362-M3X Product Specification 4 COMPLEMENTARY DOCUMENTATION 4.1 Inventek Systems Evaluation Board o ISM43362-M3G-EVB Evaluation Board Specification o EVB Users Guide o Quick Start Guide o eS-WiFi Demo software (includes EVB Drivers and Firmware) AT Command Set o AT Command Set User’s Manual o AT Command Set Quick Reference Guide Firmware OrCAD Schematic Symbol PADS Land Pattern FCC Test Report ( In Process) 5 SPECIFICATIONS 5.1 Module Architecture Figure 1 Inventek’s ISM43362-M3 General Block Diagram Note: 1. ADC1-ADC4 can also be used as SPI port 2. Antenna Options: Integrated microstrip antenna or U.fl connector for an external antenna. _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 10 ISM43362-M3X Product Specification 5.2 External Antenna Connections ISM43362-M3X-L44-U module is designed for use with an external antenna via a connection using the U.FL connector. Item Description Connector U.FL series Manufacturer I-PEX Co., Ltd. Part No. 20279-001E-01 Height 1.25 mm Width 2 mm DC 3.0 – 5.0 V Table 1 On-Board Antenna Connector 5.3 Mechanical Specifications The Physical dimensions of this eS-WiFi Module are as follow: * Keep out Area Figure 2: ANTENNA IS IN ETCH * External Antenna does not require keep out area *Keep out area should ideally have the antenna handing off the side of the PCB for best performance. *The ISM43362-M3X-L44 U and E have the same footprint. _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 11 ISM43362-M3X Product Specification Items Description ISM43362-M3X-L44-E /U Length Width Height Package 30 mm (-/+0.5 mm) 14.5 mm (-/+0.5 mm) 2.5 ± 0.2 mm 44 pin LGA 5.4 Environmental Specifications Item Operating temperature range Storage temperature range Humidity Description -40 deg. C to +85 deg. C -40 deg. C to +85 deg. C 95% max non-condensing Note 1: The ISM43362-M3X supports a functional operating range of -40°C to +85°C. However the optimal RF performance specified in this data sheet is only guaranteed for temperatures from -10°C to +65°C 6 HARDWARE ELECTRICAL SPECIFICATIONS 6.1.1 Absolute Maximum Ratings Symbol Description Min Max Unit VDD Input supply Voltage -0.4 3.7 VBAT Battery Backup -0.4 3.6 6.1.2 Recommended Operating Ratings Symbol Min. Typ. Max. Unit. VDD 3.0 3.3 3.6 VBAT 3.0 3.3 3.6 _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 12 ISM43362-M3X Product Specification 6.2 Power Consumption 6.2.1 Estimated Power Consumption Mode/Description 802.x (1) Voltage Typ. (RMS) 110 55 30 10 Running Full Power /n 3.3V Running in Power Save Mode /n 3.3V Wi-Fi Radio Off b/g/n (2) Stop Mode Note: (1) During transmit the max can reach 340 mA burst of not more than 5ms. (2) Available in Firmware release1.3 or later only. Max. (1) 110 Unit mA mA mA mA The eS-WiFi modules support multiple power saving modes. Please see the power savings application note for more detailed information 6.2.2 Stop Mode Stop Mode is initiated by software and exited by the Wakeup pin. (Wakeup pin is 3.3 volt tolerant). The wakeup pin is an external interrupt pin that on the rising edge will cause the module to exit stop mode. It is an edge trigged input. It is critical to have no glitch on this line. _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 13 ISM43362-M3X Product Specification 7 Pin out _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 14 ISM43362-M3X Product Specification 7.1.1 Detailed Pin Description Pin No. 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 Type Pin Definition G GND I VDD G GND I/O RES I/O RES I/O RES I/O RES I/O RES I ADC 4 / SPI_MOSI I ADC 3 / SPI_MISO I ADC 2 / SPI_SCK I ADC 1 / SPI_SSN I ADC 0/ DATARDY I VDD I VBAT I Wakeup G GND I DP I/O DM G GND I/O RX I/O TX I/O GPIO 0 I/O GPIO 1 I/O GPIO 2 I/O GPIO 3 I/O GPIO 4 I CFGO I CFG1 O RES I RES I RES I BOOT 0 I RSTN G GND G GND Descriptions Ground 3.3V Ground Reserved Reserved Reserved Reserved Reserved ADC Input Pins or SPI (Refer to SPI Section 8.2) 3.3V 3.3V (Refer to Section 6.2.2) Ground USB Data Plus (Refer to Table 7.1.2) USB Data Minus (Refer to Table 7.1.2 ) Ground UART Receive (Refer to section 8.1 ) UART Transmit (Refer to section 8.1 ) General Purpose Interface Pins Configuration Pin 0 (Refer to Table 7.1.2 ) Configuration Pin 1 (Refer to Table 7.1.2 ) Reserved Reserved Reserved Reserved Reset (See STM32F205 NRST specification ) Ground Ground _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 15 ISM43362-M3X Product Specification Pin No. Type Pin Definition 37 G GND 38 G GND 39 G GND 40 G GND 41 G GND 42 G GND 43 G GND 44 G GND Descriptions Ground Ground Ground Ground Ground Ground Ground Ground 7.1.2 Configuration Pins: CFGO CFG1 Internally Pulled High UART ( NC) 0* SPI 0* USB VCP 0* 0* USB HID *Requires a 10K ohm pull down 8 AC CHARACTERISTICS Serial interfaces supported 8.1 UART 8.1.1 Data Mode When the eS-WiFi module is interfaced serially, the serial interface needs to be configured for 8 bit data, no parity, and one stop bit -- (8-n-1). 8.1.2 2.1.2 Flow Control The eS-WiFi module doesn’t require or support Flow Control, so Flow Control should be ‘None’ _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 16 ISM43362-M3X Product Specification 8.1.3 2.1.3 Supported Baud Rates The eS-WiFi module supports the following serial baud rates: 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400, 460800, 921600, 1152000, 1382400, 1612800, 1834200, 2073600 8.1.4 Default Serial Configuration The eS-WiFi module is shipped with the default serial configuration of 115200 baud, 8 data bits, no party, and 1 stop bits. 8.2 SPI (Serial Peripheral Interface Bus) The eS-WiFi module supports SPI (Contact Inventek for firmware) SCLK MOSI MISO SSN CMD/DATA READY Command Phase Data Phase SPI Slave Interface: Clock rate: 20MHz max. Width: 16-bit Note: That all commands to the eS-WiFi module must be post-padded with 0x0A (Line Feed) to an even number of bytes. That all data from eS-WiFi module will post-padded with 0x15(NAK) to an even number of bytes. _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 17 ISM43362-M3X Product Specification 8.2.1 SPI Communication Overview: With the exception of initial cursor, all communication with the module happens synchronously. In other words, the SPI Master must always poll for every asynchronous event. A typical command flow is provided flow. This is an example using the Direct Connect Soft AP with a TCP communication server. SPI Master SPI Slave Description “\r\n> “ Prompt “AS=0,ABC\r\x15” "\r\n\r\nOK\r\n> " Set Access Point SSID “AD\r\x15” "\r\n\r\nOK\r\n> " Start AP - Direct Mode "P1=0\r\x15" "\r\n\r\nOK\r\n> " Set TCP Protocol "P4=2000\r" "\r\n\r\nOK\r\n> " Set TCP Port "P5=1\r\x15" "\r\n\r\nOK\r\n> " Start TCP COMM Server "MR\r\x15" "\r\n[SOMA]...[EOMA]\r\nOK\r\n> Read Messages Note: [SOMA] - Start Of Message Asynchronous, [EOMA] - End Of Message Asynchronous The SPI communication is always 16-bit and can be sustained up to 20MHz. The eS-WiFi module after power up or reset will raise CMD/DATA READY pin to signal that the first Data Phase has started. In this mode, the SPI Host must fetch the cursor. As provided by the example above, this is the only time host needs fetch data from slave without issuing a command. The Host will initiate a SPI cycle (lower SSN) and clock out 0x0A (Line Feed) until the CMD/DATA READY pin lowers signaling the end of the Data Phase. The data received will be 0x0d (CR) 0x0A (LF) 0x3E (>) 0x20 (SP). The next rising edge of the CMD/DATA READY pin signals the Command Phase. 8.2.2 SPI Command Phase: The Command Phase indicates the eS-WiFi module is ready to accept a AT Command. The command must include all delimiters and data for the command. Ex. S3=0010\r0123456789 The command must also be sent as one continuous SPI cycle, that is SSN must stay low for the complete command, delimiters, and data. The Host will initiate a SPI cycle (lower SSN) and clock out the command, delimiters and associated data and raise the NSS signal to indicated that the all data has be sent. As result of the NNS raising the eS-WiFi module will lower the CMD/DATA READY pin to signal the end Command Phase. The data that will be clocked back to the Host will be 0x15 (NAK). _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 18 ISM43362-M3X Product Specification 8.2.3 SPI Data Phase: The Data Phase indicates the eS-WiFi module has data ready for the Host to read. The eS-WiFi module will raise CMD/DATA READY and the Host will initiate a SPI cycle (lower SSN) and clock out 0x0A (Line Feed) until the CMD/DATA READY pin lowers signaling the end of the Data Phase. 8.2.4 SPI Asynchronous Messages: There are certain situations in which the eS-WiFi will issue asynchronous messages: Soft AP (AO/AD Commands), when a device connects to the Soft AP a DHCP assigned message will issued. Ex. [DHCP ] Assigned 00:00:00:00:00:00 has 192.168.10.100 TCP/UDP Communication Servers (P5=1), when a client connects to the server a connected message will be issued. Ex. [TCP SVR] Waiting on connection... [TCP SVR] Accepted 192.168.10.100:2000 [UDP SVR] Accepted 192.168.10.100:2000 With the SPI host interface being synchronous the Host must poll for these messages. This can be done by using the MR (Message Read) command or when a Communication connection the issuing of a R0 command will read all asynchronous message and the result of the R0 command. The asynchronous messages are delineated by the Start Of Message Asynchronous ([SOMA]) and End Of Message Asynchronous ([EOMA]) markers. _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 19 ISM43362-M3X Product Specification 8.2.5 SPI AC Characteristics: Symbol Tf(sck) Tc(sck) Tsu(sck) Tc(byte) Tsu(ssn) Th(ssn) Min. Typ. Max. 20 MHz 50 ns 15 us 8 * Tc(sck) 4 us 3 us 8.3 USB The eS-WiFi module supports a USB HID interface. (Contact Inventek for firmware.) 8.4 GPIO Each of the GPIO pins can be configured by the AT command set as Button, LED, Digital input or Digital output. The outputs are 3.3V CMOS and reference the AT Command Set User manual to configure. 8.5 ADC’s One 12-bit analog-to-digital converters is available and reference the AT Command Set User manual to configure. _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 20 ISM43362-M3X Product Specification 9 Wi-Fi RF Specification 9.1.1 RF Specification Conditions: VDD=3.3V; VDDIO=3.3V; TEMP: 25°C Feature WLAN Standard Frequency Range Number of Channels Modulation Output Power Receive Sensitivity (11n,20MHz) @10% PER Receive Sensitivity (11g) @10% PER Receive Sensitivity (11b) @10% PER Data Rates Data Rate (20MHz ,Long GI,800ns) Description IEEE 802.11b/g/n, Wi-Fi compliant 2.400 GHz ~ 2.497 GHz (2.4 GHz ISM Band) Ch1 ~ Ch14 802.11 g/n : OFDM /64-QAM,16-QAM, QPSK, BPSK 802.11b : CCK, DQPSK, DBPSK 802.11b /11Mbps : 20 dBm ± 1.5 dB 802.11g /54Mbps: 20 dBm ± 1.5 dB 802.11n /72Mbps: 20 dBm ± 1.5 dB - MCS=0 PER @ -86 dBm, typical - MCS=1 PER @ -85 dBm, typical - MCS=2 PER @ -85 dBm, typical - MCS=3 PER @ -84 dBm, typical - MCS=4 PER @ -80 dBm, typical - MCS=5 PER @ -78 dBm, typical - MCS=6 PER @ -72 dBm, typical - MCS=7 PER @ -69 dBm, typical - 6Mbps PER @ -89 dBm, typical - 9Mbps PER @ -88 dBm, typical - 12Mbps PER @ -88 dBm, typical - 18Mbps PER @ -87 dBm, typical - 24Mbps PER @ -83 dBm, typical - 36Mbps PER @ -80 dBm, typical - 48Mbps PER @ -75 dBm, typical - 54Mbps PER @ -72 dBm, typical - 1Mbps PER @ -93 dBm, typical - 2Mbps PER @ -91 dBm, typical - 5.5Mbps PER @ -89 dBm, typical - 11Mbps PER @ -87 dBm, typical 802.11b : 1, 2, 5.5, 11Mbps 802.11g : 6, 9, 12, 18, 24, 36, 48, 54Mbps 802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 21 ISM43362-M3X Product Specification Data Rate (20MHz ,short GI,400ns) 802.11n : 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65,72.2Mbps Maximum Input Level 802.11b : -10 dBm 802.11g : -10 dBm 10 Antenna Patterns 10.1 External Antenna The U.FLPCB antenna has passed FCC and CE. The part number is W24P-U. It is a 2.4 GHz PCB antenna with an u.FL connector. The es-Wifi family of Wi-Fi products comes with two different antenna offerings: ISM43362-M3G-L44-E ISM43362-M3G-L44-U PCB Etch Antenna U.FL connector for external antenna The PCB U.FL antenna that will be used for FCC and CE certified can be found on the Inventek Website. _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 22 ISM43362-M3X Product Specification 10.2 PCB Etch antenna gain on the evaluation board The es-WiFi PCB etch antenna performance is shown below. This etch antenna will be FCC and CE certified and the radiation patterns shown below are based on simulation using our evaluation boards that has a ground plane 71 x 48mm. _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 23 ISM43362-M3X Product Specification 10.3 Farfield Directivity _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 24 ISM43362-M3X Product Specification 11 On Board Processor The eS-WiFi module is available with ST Microcontroller, F205 family of processors. ISM43362-M3G-L44 -E STM32F205 (1 Meg), Flash ISM43362-M3G-L44-U Microcontroller STM32F103 (1Meg), Flash Microcontroller) See theSTM32F205 specification from ST Microelectronics for UART, SPI (Slave Mode) and USB Device. http://www.st.com/internet/mcu/product/164485.jsp#DATASHEET _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 25 ISM43362-M3X Product Specification 12 ISM43362-M3x-L44 FOOTPRINT 12.1 Module’s package dimensions (mm) _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 26 ISM43362-M3X Product Specification 13 Typical Application Circuit This is the minimum number of wires required to be connected to your microcontroller for operation in UART mode. You may also want to bring out the JTAG lines for firmware upgrades. ISM43362-M3G _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 27 ISM43362-M3X Product Specification 13.1 Reference Schematic (EVB) ISM43362-M3G Note: Second USB port J10 is not installed on the evaluation boards. Please contact Inventek if you want to use USB or SPI mode. Typical application circuits please refer to schematic below. For a *.pdf version please visit the Wi-Fi evaluation board website, www.Inventeksys.com. _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 28 ISM43362-M3X Product Specification 13.2 USB to UART _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 29 ISM43362-M3X Product Specification 13.3 Connecting Microcontroller to eS-WiFi UART ISM43362-M3G ISM43362-M3G _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 30 ISM43362-M3X Product Specification 13.4 EXTERNAL FLASH FOR OVER THE AIR UPGRADE (In development, contact Inventek) 13.5 JTAG and Reset Connections _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 31 ISM43362-M3X Product Specification 13.6 eS-WiFi Programming Options 13.7 eS-WiFi USB Direct Connection Option _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 32 ISM43362-M3X Product Specification 14 Product Compliance Considerations RoHS: Restriction of Hazardous Substances (RoHS) directive has come into force since 1st July 2006 all electronic products sold in the EU must be free of hazardous materials, such as lead. Inventek is fully committed to being one of the first to introduce lead-free GPS products while maintaining backwards compatibility and focusing on a continuously high level of product and manufacturing quality. EMI/EMC: The Inventek module design embeds EMI/EMC suppression features and accommodations to allow for higher operational reliability in noisier (RF) environments and easier integration compliance in host (OEM) applications. FCC/CE: The module will be in compliance test for FCC/CE 15 Reflow Profile Reference the IPC/JEDEC standard. Peak Temperature: <250°C Number of Times: ≤2 times _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 33 ISM43362-M3X Product Specification 16 Packaging Information 16.1 MSL Level / Storage Condition _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 34 ISM43362-M3X Product Specification 16.2 Device baking requirements prior to assembly Boards must be baked prior to rework or assembly to avoid damaging moisture sensitive components during localized reflow. The default bake cycles is 24 hours at 125C. Maintaining proper control of moisture uptake in components is critical. Before opening the shipping bag and attempting solder reflow, you should maintain a minimal out-of-bag time and ensure the highest possible package reliability for the final product. Module’s Assembly Instructions Board Placement: The ISM43362-M3G-L44 has an optional on board Wi-Fi antenna. The board is designed to be a stuffing option. If you elect to use the on board antenna, then board placement is critical in your system. Several key things to consider when placing the module are: Ensure that the antenna portion of the design is placed so that the antenna has no ground plane under, above or near the antenna. Ideally, the antenna requires clear sky for optimal performance. If you have shields or other material around the antenna, please test for interference and loss of signal strength. _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 35 ISM43362-M3X Product Specification 17 REVISION CONTROL Document : ISM43362-M3X-L44 External Release Wi-Fi module DOC-DS-20023 Date 8/15/2012 2/11/2013 Author FMT FMT Revision 1.0 1.1 5/5/2013 7/24/13 FMT FMT 2.0 2.1 Comment Preliminary Updated Ref. Schematic Updated SPI Added FCC, updated Temp range 18 CONTACT INFORMATION Inventek Systems 2 Republic Road Billerica Ma, 01862 Tel: 978-667-1962 Sales@inventeksys.com www.inventeksys.com Inventek Systems reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. The information contained within is believed to be accurate and reliable. However Inventek Systems does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others. _____________________________________________________________________________________________ Inventek Systems DOC-DS-20023-2.1 36
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