JL MARINE SYSTEMS EA041 MICRO SHALLOW WATER ANCHOR User Manual Bluetooth technology class 2 module

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Document ID	2140937
Application ID	NFTjBjM5La+/QWCSR4Jnag==
Document Description	Bluetooth Module
Short Term Confidential	No
Permanent Confidential	No
Supercede	No
Document Type	User Manual
Display Format	Adobe Acrobat PDF - pdf
Filesize	44.51kB (556352 bits)
Date Submitted	2013-12-12 00:00:00
Date Available	2013-12-12 00:00:00
Creation Date	2011-10-21 14:49:11
Producing Software	Acrobat Distiller 9.0.0 (Windows)
Document Lastmod	2012-08-07 19:21:09
Document Title	Bluetooth® technology class-2 module
Document Creator	C2 v2.0.0 build 003
Document Author:	STMICROELECTRONICS

SPBT2632C2A
BluetoothÂŽ technology class-2 module
Datasheet − production data
Features
■
BluetoothÂŽ radio
– Fully embedded Bluetooth® v3.0 with
profiles
– Class 2 module
– Complete RF ready module
– 128-bit encryption security
– Integrated antenna
– Multipoint capability
■
ST micro Cortex-M3 microprocessor up to
72 MHz
■
Memory
– 256 kb Flash memory
– 48 kb RAM memory
■
Data rate
– 1.5 Mbps maximum data rate
■
Serial interface
– UART up to 2.0 Mbps
– SPI interface
■
General I/O
– 7 general purpose I/Os
– 1 LPO input
■
User interface
– AT2 command set (abSerial)
– Firmware upgrade over UART
■
FCC and BluetoothÂŽ qualified
■
EPL (end product listing) fulfilled
■
Single voltage supply: 2.5 V typical
■
Micro-sized form factor: 11.6 x 13.5 x 2.9 mm
■
Operating temperature range: -40 °C to 85 °C.
August 2012
This is information on a product in full production.
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www.st.com
27
Contents
SPBT2632C2A
Contents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
RoHS compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Software architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1
Lower layer stack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.2
Upper layer stack: Amp'ed UP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.3
AT command set: abSerial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.4
Bluetooth firmware implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Hardware specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.1
Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.2
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.3
High speed CPU mode current consumption . . . . . . . . . . . . . . . . . . . . . . 11
5.4
Standard CPU mode current consumption . . . . . . . . . . . . . . . . . . . . . . . . 11
5.5
I/O operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.6
Selected RF characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.7
Pin assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.8
Pin placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.9
Layout drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Hardware block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Hardware design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2/27
7.1
Module reflow installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.2
GPIO interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.3
UART interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.4
PCB layout guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.5
Reset circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7.5.1
External reset circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7.5.2
Internal reset circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
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SPBT2632C2A
Contents
7.6
External LPO input circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
7.7
Apple iOS CP reference design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Regulatory compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
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List of tables
SPBT2632C2A
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
4/27
Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
High speed CPU mode current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Standard CPU mode current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
I/O operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Selected RF characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Pin assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Soldering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
System configuration variables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
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SPBT2632C2A
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
FW architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Pin placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Layout drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
SPBT2632C2A.AT2 module block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Soldering profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Connection to host device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Typical RS232 circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
PCB layout guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
External reset circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Internal reset circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
External LPO circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
BT module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Co-processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Power switch. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
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Description
SPBT2632C2A
Description
The SPBT2632C2A.AT2 is an easy to use Bluetooth module, compliant with Bluetooth v3.0.
The module is the smallest form factor available which provides a complete RF platform.
The SPBT2632C2A.AT2 enables electronic devices with wireless connectivity, not requiring
any RF experience or expertise for integration into the final product. The
SPBT2632C2A.AT2 module, being a certified solution, optimizes the time to market of the
final applications.
The module is designed for maximum performance in a minimal space including fast speed
UART and 7 general purpose I/O lines, several serial interface options, and up to 1.5 Mbps
data throughput.
Optimized design allows the integration of a complete working Bluetooth modem, including
antenna, in the minimum possible size; only an additional external LPO (low power
oscillator) is required to enable low power mode capability.
The SPBT2632C2A.AT2 is a surface mount PCB module that provides fully embedded,
ready to use Bluetooth wireless technology. The reprogrammable Flash memory contains
embedded firmware for serial cable replacement using the Bluetooth SPP profile.
Embedded Bluetooth AT2 command firmware is a friendly interface, which realizes a simple
control for cable replacement, enabling communication with most Bluetooth enabled
devices, provided that the devices support the SPP profile. The SPBT2632C2A.AT2 ,
supporting iAP profile, provides communication with Android, smartphone, and AppleÂŽ iOS
Bluetooth enabled devices.
An Apple authentication IC is required to exchange data with an Apple device or access an
Apple device application. The AT2 FW includes the Bluetooth SPP profile capable of
recognizing the Apple authentication chip.
Customers using the Apple authentication IC must register as developers to become an
Apple certified MFI member. License fees may apply, for additional information visit:
http://developer.apple.com/programs/which-program/index.html.
Certified MFI developers developing electronic accessories that connect to the iPodÂŽ,
iPhoneÂŽ, and iPadÂŽ gain access to technical documentation, hardware components,
technical support and certification logos.
Customized firmware for peripheral device interaction, power optimization, security, and
other proprietary features may be supported and can be ordered pre-loaded and configured.
6/27
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SPBT2632C2A
RoHS compliance
RoHS compliance
ST modules are RoHS compliant and comply with ECOPACKÂŽ norms.
Applications
●
Serial cable replacement
●
M2M industrial control
●
Service diagnostic
●
Data acquisition equipment
●
Machine control
●
Sensor monitoring
●
Security system
●
Mobile health.
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Software architecture
SPBT2632C2A
Software architecture
4.1
Lower layer stack
4.2
4.3
●
Bluetooth v3.0
●
Device power modes: active, sleep and deep sleep
●
Wake on Bluetooth feature optimized power consumption of host CPU
●
Authentication and encryption
●
Encryption key length from 8 bits to 128 bits
●
Persistent Flash memory for BD address and user parameter storage
●
All ACL (asynchronous connection less) packet types
●
Multipoint capability
●
Sniff mode: fully supported to maximum allowed intervals
●
Master slave switch supported during connection and post connection
●
Dedicated inquiry access code for improved inquiry scan performance
●
Dynamic packet selection channel quality driven data rate to optimize link performance
●
Dynamic power control
●
802.11b co-existence AFH.
Upper layer stack: Amp'ed UP
●
SPP, IAP, SDAP and GAP protocols
●
RFComm, SDP, and L2CAP supported
●
Multipoint with simultaneous slaves.
AT command set: abSerial
Please see command list reported in the SPBT2532C2.AT datasheet, Appendix D, for
details.
The complete command list including the iAP commands will be reported in the user
manual UM1547.
8/27
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SPBT2632C2A
4.4
Software architecture
Bluetooth firmware implementation
Figure 1.
FW architecture
I!0
!-V
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Hardware specifications
SPBT2632C2A
Hardware specifications
General conditions (VIN = 2.5 V and 25 °C).
5.1
Recommended operating conditions
Table 1.
5.2
Rating
Min.
Typical
Max.
Unit
Operating temperature range
-40
85
°C
Supply voltage VIN
2.1
2.5
3.6
Signal pin voltage
2.1
RF frequency
2400
2483.5
MHz
Absolute maximum ratings
Table 2.
10/27
Recommended operating conditions
Absolute maximum ratings
Rating
Min.
Typical
Max.
Unit
Storage temperature range
-55
+105
°C
Supply voltage, VIN
-0.3
+ 5.0
I/O pin voltage, VIO
-0.3
+ 5.5
RF input power
-5
dBm
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SPBT2632C2A
5.3
Hardware specifications
High speed CPU mode current consumption
●
High speed CPU mode
–
CPU 32 MHz
–
UART supports up to 921 Kbps
–
Data throughput up to 1.5 Mbps
–
Shallow sleep enabled.
Table 3.
High speed CPU mode current consumption
Modes (typical power consumption)
5.4
Avg.
Unit
ACL data 115 K baud UART at max. throughput (master)
23
mA
ACL data 115 K baud UART at max. throughput (slave)
27.5
mA
Connection, no data traffic, master
9.1
mA
Connection, no data traffic, slave
11.2
mA
Connection 375 ms sniff (external LPO required)
490
ÂľA
Standby, without deep sleep
8.6
mA
Standby, with deep sleep, no external LPO
1.7
mA
Standby, with deep sleep, with external LPO
70
ÂľA
Page/inquiry scan, with deep sleep, no external LPO
2.7
mA
Page/inquiry scan, with deep sleep, with external LPO
520
ÂľA
Bluetooth power down / CPU standby, no external LPO
25
ÂľA
Standard CPU mode current consumption
●
Standard CPU mode
–
CPU 8 MHz
–
UART supports up to 115 Kbps
–
Data throughput up to 200 Kbps
–
Shallow sleep enabled.
Table 4.
Standard CPU mode current consumption
Modes (typical power consumption)
Avg.
Unit
ACL data 115 K baud UART at max. throughput (master)
16.7
mA
ACL data 115 K baud UART at max. throughput (slave)
18
mA
Connection, no data traffic, master
4.9
mA
Connection, no data traffic, slave
7.0
mA
Connection 375 ms sniff (external LPO required)
490
ÂľA
Standby, without deep sleep
4.2
mA
Standby, with deep sleep, no external LPO
1.7
mA
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Hardware specifications
Table 4.
SPBT2632C2A
Standard CPU mode current consumption (continued)
Modes (typical power consumption)
5.5
Unit
Standby, with deep sleep, with external LPO
70
ÂľA
Page/inquiry scan, with deep sleep, no external LPO
2.6
mA
Page/inquiry scan, with deep sleep, with external LPO
520
ÂľA
Bluetooth power-down / CPU standby, no external LPO
25
ÂľA
I/O operating characteristics
Table 5.
5.6
Avg.
I/O operating characteristics
Symbol
Parameter
Min.
Max.
Unit
Conditions
VIL
Low-level input voltage
0.6
VIN, 2.1 V
VIH
High-level input voltage
1.4
VIN, 2.1 V
VOL
Low-level output voltage
0.4
VIN, 2.1 V
VOH
High-level output voltage
1.8
VIN, 2.1 V
IOL
Low -level output current
4.0
mA
VOL = 0.4 V
IOH
High-level output current
4.0
mA
VOH = 1.8 V
RPU
Pull-up resistor
80
120
kΊ
Resistor turned on
RPD
Pull-down resistor
80
120
kΊ
Resistor turned on
Selected RF characteristics
Table 6.
Selected RF characteristics
Parameters
Conditions
Antenna load
Typical(1)
Unit
50
ohm
Radio receiver
Sensitivity level
BER < .001 with DH5
-86
dBm
Maximum usable level
BER < .001 with DH1
dBm
Input VSWR
2.5:1
Radio transmitter
Maximum output power
50 Ί load
dBm
Initial carrier frequency tolerance
kHz
20 dB bandwidth for modulated carrier
935
kHz
1. RF characteristics can be influenced by physical characteristics of final application.
12/27
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SPBT2632C2A
5.7
Hardware specifications
Pin assignment
Table 7.
Name
Pin assignment
Type
Pin#
Description
ALT function(1)
5V
tolerant
ADC 3
ADC 2
UART interface
RXD
13
Receive data
TXD
14
Transmit data
RTS
12
Request to send (active low)
ADC 0 I C clock/aux UART
Rx
CTS
11
Clear to send (active low)
ADC 1 I2C data/aux UART
Tx
Boot loader
Boot 0
Boot 0
Power and ground
Vin
Vin
GND
GND
Reset
RESETN
10
2.5 V
max.
Reset input (active low for 5 ms)
LPO
LPO
15
LPO input
GPIO - general purpose input/output
GPIO [1]
I/O
General purpose input/output
SPI MISO
GPIO [2]
I/O
General purpose input/output
SPI MOSI/I2S_SD
GPIO [3]
I/O
General purpose input/output
SPI SCLK/I2S_CK
GPIO [4]
I/O
General purpose input/output
SPI SS/I2S_WS
GPIO [5]
I/O
General purpose input/output
GPIO [6]
I/O
General purpose input/output
DAC
GPIO [7]
I/O
16
General purpose input/output
ADC 4
1. Please note that the usage of ALT function is dependant upon the firmware that is loaded into the module,
and is beyond the scope of this document. The AT command interface uses the main UART by default.
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Hardware specifications
5.8
SPBT2632C2A
Pin placement
Figure 2.
Pin placement
!-V
5.9
Layout drawing
Figure 3.
Layout drawing
3IZE  MM X  MM X  MM HEIGHT TOLERANCE   MM
MILLIMETERS
!-V
14/27
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SPBT2632C2A
Hardware block diagram
Hardware block diagram
Figure 4.
SPBT2632C2A.AT2 module block diagram
%DWWHU\RU6XSSO\
$50&RUWH[0&8
670
5HJXODWRU
$QWHQQD
.)ODVK
%3
)LOWHU
+RVW&RQWUROOHU
,QWHUIDFH
67/&
8$57
*3,2
.5$0
8$57
,6
3&0
&ORFN
/32
!-V
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Hardware design
SPBT2632C2A
Hardware design
The SPBT2632C2A module without AT2 command embedded FW supports UART, SPI, I2C
and GPIO hardware interfaces. Note that the usage of these interfaces is dependent upon
the firmware that is loaded into the module, and is beyond the scope of this document. The
AT2 command interface uses the main UART by default.
Note:
7.1
All unused pins should be left floating; do not ground.
All GND pins must be well grounded.
The area around the module should be free of any ground planes, power planes, trace
routings, or metal for 6 mm from the antenna in all directions.
Traces should not be routed underneath the module.
Module reflow installation
The SPB2632C2A is a surface mount Bluetooth module supplied on a 16-pin, 6-layer PCB.
The final assembly recommended reflow profiles are indicated here below.
The soldering phase must be executed with care: In order to avoid undesired melting
phenomenon, particular attention must be paid to the setup of the peak temperature.
The following are some suggestions for the temperature profile based on IPC/JEDEC JSTD-020C, July 2004 recommendations.
Table 8.
Soldering
Profile feature
Average ramp-up rate (TSMAX to TP)
3 °C/sec max
Preheat:
– Temperature min. (TS min.)
– Temperature max. (TS max.)
– Time (ts min. to ts max.)(ts)
150 °C
200 °C
60-100 sec
Time maintained above:
– Temperature TL
– Temperature TL
217 °C
60-70 sec
Peak temperature (TP)
240 + 0 °C
Time within 5 °C of actual peak temperature (TP)
10-20 sec
Ramp-down rate
6 °C/sec
Time from 25 °C to peak temperature
16/27
PB-free assembly
Doc ID 022833 Rev 4
8 minutes max.
SPBT2632C2A
Hardware design
Figure 5.
Soldering profile
!-V
7.2
GPIO interface
All GPIOs are capable of sinking and sourcing 4 mA of I/O current. GPIO [1] to GPIO [7] are
internally pulled down with 100 kΊ (nominal) resistors.
7.3
UART interface
The UART is compatible with the 16550 industry standard. Four signals are provided with
the UART interface. The TXD and RXD pins are used for data while the CTS and RTS pins
are used for flow control.
Figure 6.
Connection to host device
"LUETOOTH
-ODULE
(OST
!-V
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Hardware design
Figure 7.
SPBT2632C2A
Typical RS232 circuit
!-V
7.4
PCB layout guidelines
Figure 8.
PCB layout guidelines
SURROUNDING
!-V
18/27
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SPBT2632C2A
7.5
Hardware design
Reset circuit
Two types of system reset circuits are detailed below.
7.5.1
External reset circuit
Figure 9.
External reset circuit
2%3%4
!-V
Note:
RPU ranges from 30 kΊ to 50 kΊ internally.
7.5.2
Internal reset circuit
Figure 10. Internal reset circuit
2%3%4
!-V
Note:
RPU ranges from 30 kΊ to 50 kΊ internally.
RRST should be from 1 kΊ to 10 kΊ.
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Hardware design
7.6
SPBT2632C2A
External LPO input circuit
An optional low power oscillator input may be added to allow Deep sleep and Sniff modes.
●
●
LPO parameters:
–
Frequency: 32.768 kHz
–
Tolerance: 150 ppm
–
Voltage levels
–
Low: 0.5 V
–
High: 1.8 V
–
Input capacitance: 2.5 pF maximum
Configurations:
–
Table 9.
Use two configuration variables: UseExtLPO and AllowSniff.
System configuration variables
Variable
Name
Default
Description
Var37
UseExtLPO
True
True when a 32.768 kHz low power oscillator is present, and false
if not present
Var43
AllowSniff
True
Enables Sniff mode.
Figure 11. External LPO circuit
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20/27
Doc ID 022833 Rev 4
SPBT2632C2A
7.7
Hardware design
Apple iOS CP reference design
The figures below give an indicative overview of what the hardware concept looks like. A
specific MFI co-processor layout is available for licensed MFI developers from the MFI
program.
Figure 12. BT module
!-V
Figure 13. Co-processor
!-V
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Hardware design
SPBT2632C2A
Figure 14. Power switch
!-V
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SPBT2632C2A
Regulatory compliance
Regulatory compliance
●
FCC and IC
–
This module has been tested and found to comply with the FCC part 15 and IC
RSS-210 rules. These limits are designed to provide reasonable protection
against harmful interference in approved installations. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio
communications.
However, there is no guarantee that interference may not occur in a particular
installation.
This device complies with part 15 of the FCC rules. Operation is subject to the
following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
Modifications or changes to this equipment not expressly approved by the part
responsible for compliance may render void the user's authority to operate this
equipment.
–
Modular approval, FCC and IC
FCC ID: X3ZBTMOD4
IC: 8828A-MOD4
In accordance with FCC part 15, the SPBT2632C2A.AT2 is listed above as a
modular transmitter device.
–
Label instructions
When integrating the SPBT2632C2A.AT2 into the final product, it must be ensured
that the FCC labelling requirements, as specified below, are satisfied. Based on
the Public Notice from FCC, the product into which the ST transmitter module is
installed must display a label referring to the enclosed module. The label should
use wording such as the following:
Contains Transmitter Module
FCC ID: X3ZBTMOD4
IC: 8828A-MOD4
Any similar wording that expresses the same meaning may be used.
●
BQB
–
BQB qualified design, QD ID: B019224
–
Product type: End Product
–
TGP version: Core 3.0
–
Core spec version: 3.0
–
Product descriptions: Bluetooth module, spec V3.0
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Regulatory compliance
●
SPBT2632C2A
CE
–
CE Expert opinion: 0448-ARAM00003
–
Measurements have been performed in accordance with (report available on
request):
–
EN 300 328 V 1.7.1 (2006-10) (a)
–
EN 301 489-17 V 2.1.1 (2009) (b)
–
EN60950-1:2006 +A11:2009+A1:2010
(c)
CE certified:
a. EN 300 328 V 1.7.1 (2006-10): “electromagnetic compatibility and radio spectrum Matters (ERM); Wideband
transmission systems; data transmission equipment operating in the 2.4 GHZ ISM band and using wideband
modulation techniques; harmonized EN covering essential requirements under article 3.2 of the R&TTE
directive”.
b. EN 301 489-17 V 2.1.1 (2009): “electromagnetic compatibility and radio spectrum Matters (ERM);
electromagnetic compatibility (EMC) standard for radio equipment and services; part 17: specific condition for
2.4 GHz wideband transmission systems and 5 GHz high performance RLAN equipment”.
c. EN60950-1:2006 +A11:2009+A1:2010: “Information technology equipment - safety”.
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SPBT2632C2A
Ordering information
Ordering information
Table 10.
Ordering information
Order code
Description
SPBT2632C2A.AT2
Class 2 OEM Bluetooth antenna module
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Revision history
10
SPBT2632C2A
Revision history
Table 11.
26/27
Document revision history
Date
Revision
Changes
03-Apr-2012
First release.
16-Apr-2012
Modified: Section 8
12-Jun-2012
– Document status promoted from preliminary data to
production data
– Modified: Figure 1
07-Aug-2012
– Added: notes in Table 6 and 7
– Modified: Section 7
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SPBT2632C2A
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Keywords                        : Technical Literature, 022833, Product Development, Specification, Datasheet, SPBT2632C2A
Create Date                     : 2011:10:21 14:49:11Z
Title                           : Bluetooth® technology class-2 module
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Modify Date                     : 2012:08:07 19:21:09Z

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