JiangSu HuiTong Group HTMD005A NXP5169 Module User Manual
JiangSu HuiTong Group Co.,Ltd NXP5169 Module
User Manual
Jiang Su HuiTong Group Co., Ltd
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Specifications Datasheet
Module supports:
Module Part Number:
Module#ModuleName HTPartNumber remark
#1ZigbeeNXP5169ModuleHTMD‐005
Role Name: Appointment: Signature:
Author Li Dan Design Engineer
Checked by Nick Qiao PM – R&D
Approved by Yin Zhi Lin CTO
Date: Classification Version: Status:
<31 July 2018> Confidential <V0.1> <Draft>
NXP5169 Module
Jiang Su HuiTong Group Co., Ltd
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Revision History:
Version Date
(dd/mm/yyyy) Author Status Modifications
V0.1 31/07/2018 Li Dan Draft Doc creation
© Jiang Su HuiTong Group Co., Ltd
All rights are reserved. The information presented in this document does not form part of any quotation, is
believed to be accurate and reliable and may be changed without notice. No liability will be accepted by
the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
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1 Introduction
1.1 Scope
Module
#ModuleName HTP/NSOCStandard
Supported
Bluetooth
Standard
Supported
RFFrequency
Band
Interfaceto
Host
Module
Size
#2ZigbeeNXP5169
ModuleHTMD‐005Zigbee3.0 2.4G(2.4~
2.5GHz) UART
25mm(L)x
16mm(W)
x
3mm(H)
1.2 Product Features
The JN5169 module provides designers with a ready-made component that provides a fully
integrated solution for applications, using the IEEE802.15.4 standard in the 2.4 GHz - 2.5 GHz ISM
frequency band, including ZigBee 3.0 and ZigBee PRO stack with Home Automation, Light Link and
Smart Energy profiles.
The modules integrate all of the RF components required, removing the need to perform
expensive RF design and test. Products can be designed by simply connecting sensors
and switches to the module IO pins. The modules use NXP’s single chip IEEE802.15.4
wireless microcontroller, allowing designers to make use of the extensive chip
development support material. Hence, this range of modules allows designers to bring
wireless applications to market in the minimum time with significantly reduced
development effort and cost.
The JN5169 module is a range of ultra-low power, high performance surface
mount modules targeted at IEEE 802.15.4, ZigBee 3.0 and ZigBee Home Automation,
Light Link and Smart Energy networking applications, enabling users to realize products
with minimum time to market and at the lowest cost. They remove the need for expensive
and lengthy development of custom RF board designs and test suites. The modules use
NXP’s JN5169 wireless microcontroller to provide a comprehensive solution with large
memory, high CPU and radio performance and all RF components included. All that is
required to develop and manufacture wireless control or sensing products is to connect a
power supply and peripherals such as switches, actuators and sensors, considerably
simplifying product development.
JN5169
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2.4 GHz IEEE 802.15.4, ZigBee 3.0 and ZigBee PRO stack with Home Automation,
Light Link and Smart Energy compatible
Integrated printed antenna
TX power 14.92dBm
Receiver sensitivity –98 dBm
TX current 27.2 mA at 10 dBm
TX current 23.6 mA at 8.5 dBm
RX current 17.8 mA at maximum input level 10 dBm
RX current 16.2 mA at maximum input level 0 dBm
Features: microcontroller
32-bit RISC CPU; 1 MHz to 32 MHz clock speed
Variable instruction width for high coding efficiency
Multi-stage instruction pipeline
512 kB Flash
32 kB RAM
4 kB EEPROM
Data EEPROM with guaranteed 100 k write operations
2-wire I2C-bus compatible serial interface; can operate as either master or slave
5 PWM (4 timers, 1 timer/counter)
2 low-power sleep counters
2 UARTs
SPI-bus Master and Slave port, 3 selects
Supply voltage monitor with 8 programmable thresholds
6-input 10-bit ADC, comparator
Battery and temperature sensors
Watchdog and Supply Voltage Monitor (SVM)
Up to 20 Digital IO (DIO) pins
Ambient Conditions:
Operation Temperature: -10℃ ~ +120℃
Storage Temperature: -40℃ ~ +85℃
Operation Humidity: 10 ~ 90% RH
Storage Humidity: 5 ~ 95% RH
Environmental compliance:
RoHS compliant
REACH compliant
Approbation:
EU/ Russia:
LATAM:
Features: modules
U-NII Unlicensed National Information Infrastructure
l (2.412GHz~2.484GHz,)
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1.3 Acronyms and abbreviations
BR Basic Rate
EDR Enhanced Data
Rate
EVM Error Vector Magnitude
CCK complementary code keying (CCK),
CE Conformité Européenne (European Conformity)
DSSS Direct Sequence Spread Spectrum
EMC Electromagnetic Compatibility
EMF Electromagnetic Fields, the acronym used for the issue of exposure of
humans to EM-fields and the associated possible adverse health effects
EIRP Effective Isotropically Radiated Power
ERP Effective Radiated Power
ETSI European Telecommunications Standards Institute
HCI Host Controller Interface
HT Huitong
HT20 High Throughput 20 MHz bandwidth (802.11n/ac)
HT40 High Throughput 40 MHz bandwidth (802.11n/ac)
IEC International Electrotechnical Commission
IEEE Institute of Electrical and Electronics Engineers
IP Internet Protocol (IP)
Iperf
Iperf is a commonly used network testing tool that can create Transmission Control
Protocol (TCP) and User Datagram Protocol (UDP) data streams and measure the
throughput of a network that is carrying them, that was developed by the
Distributed Applications Support Team (DAST) at the National Laboratory for
Applied Network Research (NLANR)
ISM Industrial, Scientific, and Medical
VHT80 Very High High Throughput 80 MHz bandwidth (802.11ac)
VHT160 Very High Throughput 160 MHz bandwidth (802.11ac)
LE Low Energy
MAC Media Access Control
MCS Modulation and Coding Scheme
PID Product ID
VID Vendor ID
TX Transmission
RX Receiver
RSSI Received Signal Strength Indicator
TSSI Transmit Signal Strength Indicator
MIMO Multiple-Input Multiple-Output
WoWLAN Wake on WLAN
WoBLE Wake up on BLE
QoS Quality-of-Service (QoS)
EIRP Equivalent Isotropically Radiated Power
TCP Transmission Control Protocol (TCP)
TCP/IP Internet Protocol Suite: TCP and Internet Protocol (IP)
TPC Transmit Power Control
ISM Industrial, Scientific and Medica
UDP User Datagram Protocol (UDP) is the set of network protocols used for the
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Internet.
VSWR Voltage Standing Wave Ratio
WiFi Wireless Fidelity
1.4 REFERENCES
1. NXP5169_Data_sheetV1.01.pdf
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2 Technical Specifications
2.1 Absolute Maximum Ratings:
Stresses beyond these conditions listed below may cause permanent damage to the module.
Parameters Maximum Rating
Power Supply Voltage at +3V3 (-0.3 ~3.63)V
Input voltage to IO pins (-0.3 ~3.63)V
Storage Temperature Conditions –40 ℃ ~ +85℃.
Storage Humidity conditions 5% to 95% (RH)
ESD (HBM) 1000V
2.2 Recommended Operation Conditions
Parameters Operation Conditions
Operating Temperature
Conditions
(–10 ℃ ~ +120℃)
- No performance reduction up 80°C ambient Temperature
- No component failure up to 120°C ambient
Temperature.
Operating Humidity conditions 10% to 90% (RH)
CTQ parameters are marked with *.
4)
Operation Temperature = room temp
Front End Insertion loss ( including
3)
TX power is at typical level, measured at antenna feed point.
2)
1)
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2.3 Electrical Specifications
Pre-test conditions:
1 Operation Temperature = room temperature 25°C, unless otherwise noted.
2 CTQ parameters are marked with *.
Item
No. Parameters Test Conditions Specifications/Requirement
Min Typ Max Units
3.3.1 Input power Test board 2.8V 3.3V 3.6V V
3.3.2 Power
consumption
standby mA
3.3.3 Active mA
3.3.4 ESD
EN61000-3-2/3-3: ESD
- IEC61000/4/2 : 8kV air
- ANATEL 442 : 8kV air discharge
Module is mounted into Final
product casing at the designed
location.
No functional failures and
no parts should suffer
damage
2.4 RF Performance
Pre-test conditions:
Balun, impedance mis-match+diplexer):
erature 25°C, unless otherwise noted.
2.4.1 Zigbee RF Specifications
Item
No. Parameters Test Conditions Specifications/Requirement
Min Typ Max Units
2.4.2.1
receiver sensitivity
2405 nominal for 1 % PER, as per
802.15.4 -96 dBm
2.4.2.2 2440 nominal for 1 % PER, as per
802.15.4 -96 dBm
2.4.2.3 2480 nominal for 1 % PER, as per
802.15.4 -96 dBm
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2.4.2.4
Power
2405
14.76 dBm
2.4.2.5 2440 14.92 dBm
2.4.2.6 2480
-2.31 dBm
2.5 Quality, Environmental and Reliability
S/N Electrical Test
Requirement TEST CONDITION Requirement
2.5.1 Dry heat Test Temp. : +70℃
Test time : 96 hrs 4 days
2.5.2 Low Temperature
storage
Temp. : -25℃
Test time : 96 hrs 4 days
2.5.3 Temperature
Shock
Temp. : -20℃ ~ +85℃, Duration : 30 min
Ramp-up & Ramp-down for 5 min, Cycle : 1,000cycle. 35 days
2.5.4 Humidity
Load Test
Leave samples in 40℃±5℃, 90 ~ 95% RH for
21days,
and in standard test condition for 30 minutes
21 days
2.5.5 Vibration test 10-55-10Hz / amplitude 0.35mm / sweep rate 1
octave per min. 1 day
2.5.6 Cold Test Operational/start up after min 4hrs at -10℃ 1 day
2.5.7 Damp heat cyclic
Humidity 93%RH, 6h:temp from 25 ℃ to 40 ℃, 6hrs
temp 40 ℃ to 25 ℃, 6hrs at 25 ℃, operational last
hour only for 21 days.
21 days
2.5.8 Temperature step
stress test Operational up to a temperature of 60 ℃ for 16 days 16 days
2.5.9 Operation
Life(MTBF) Temp. : 60℃, 90% RH, MTBF 50,000 hrs 10 days
3.6 EMC Compliance and Certifications
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Region Regulation Standards Requirement
EU/RU
Fulfill CE with official test report at
module level to meet the latest
EMC requirement
LATAM:
Fulfill approbation requirements,
with official test report at Module
level
2.7 Environment Compliance
RoHS compliant
REACH compliant
3 Mechanical Drawing
3.1 Pin define
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3.2 Mechanical Outline and dimensions
Dimension (TOP View)
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Dimension (Side View)
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Dimension (Bottom View)
3.3 Actual Module image
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4 Software
2405 MHz-2480 MHz
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4.1 MAC Address and Product ID:
Before module is shipped out of Huitong, the following addresses must be flashed into EEPROM
and with clear marking on the product:
: No define for current version
5 Key Components
5.1 SOC Chipset
P/N 151727-20
FREQUENCY BAND：
MECHANICAL CONFIGURATION：(see next page)
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6 Marking Information
The sticker on the module contents the following info:
- Type and Version number (on Bottom side, tbc)
- Serial number (on Bottom side, tbc)
- Manufacturing date (on Bottom side, tbc)
- WiFi MAC address (on Bottom side, tbc)
- BT MAC address (on Bottom side, tbc)
FCC Statement:
Any Changes or modifications not expressly approved by the party responsible for compliance
could void the user’s authority to operate the equipment.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two
conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause
undesired operation.
FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment .This
equipment should be installed and operated with minimum distance 20cm between the
radiator& your body.
FCC Label Instructions:
The outside of final products that contains this module device must display a label referring to
the enclosed
module. This exterior label can use wording such as: "Contains Transmitter Module
FCC ID: PUW-HTMD005A or Contains FCC ID: PUW-HTMD005A " , Any similar wording that
expresses the same meaning may be used.