Jorjin Technologies WG1300B0 WIFI MODULE User Manual 1
Jorjin Technologies Inc. WIFI MODULE 1
User Manual
Copyright © JORJIN TECHNOLOGIES INC. 2013
http://WWW.JORJIN.COM.TW
CONFIDENTIAL
a module solution provider
WG1300-B0
Evaluation Module User Guide
Revision 0.2
Doc No: WG1300BE00 EM Board-UG-R02
Copyright © JORJIN TECHNOLOGIES INC. 2014
http://WWW.JORJIN.COM.TW
CONFIDENTIAL
Page 1
Index
0. REGULATION INFORMATION .......................................................................... 2
1. INTRODUCTION .................................................................................................... 7
2. WG1300-B0 EM BOARD ........................................................................................ 7
2.1. TOP SIDE ............................................................................................................. 7
2.2. BOTTOM SIDE .................................................................................................. 10
2.3. HARDWARE SETUP ............................................................................................. 12
2.4. SCHEMATICS ....................................................................................................... 13
2.5. BILL OF MATERIAL (BOM) ................................................................................ 14
3. ANTENNA CHARACTERISTICS ...................................................................... 15
3.1. RETURN LOSS & VSWR .................................................................................... 15
3.2. PLANE DEFINITION ............................................................................................. 15
3.3. 3D RADIO PATTERN ............................................................................................ 16
3.4. 2D RADIO PATTERN ............................................................................................ 17
4. LAYOUT GUIDELINES ....................................................................................... 18
4.1. BOARD LAYOUT ................................................................................................. 18
5. APPLICATION DEVELOPMENT ...................................................................... 22
6. HISTORY CHANGE ............................................................................................. 23
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0. REGULATION INFORMATION
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions: (1) This device may not cause harmful interference, and (2) this device
must accept any interference received, including interference that may cause undesired
operation.
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
FCC Caution: Any changes or modifications not expressly approved by the party
responsible for compliance could void the user's authority to operate this equipment. This
transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance
20cm between the radiator & your body.
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This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20 cm is maintained between the antenna and
users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
3) The monopole chip antenna with 2.5 dBi gain was verified in the conformity testing.
Radiated transmit power must be equal to or lower than that specified in the Equipment
Authorization. A separate approval is required for all other antenna type, or higher gain
antenna.
As long as 3 conditions above are met, further transmitter test will not be required.
However, the OEM integrator is still responsible for testing their end-product for any
additional compliance requirements required with this module installed
IMPORTANT NOTE: In the event that these conditions can not be met (for example
certain laptop configurations or co-location with another transmitter), then the FCC
authorization is no longer considered valid and the FCC ID can not be used on the final
product. In these circumstances, the OEM integrator will be responsible for re-evaluating
the end product (including the transmitter) and obtaining a separate FCC authorization.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be
installed such that 20 cm may be maintained between the antenna and users. The final end
product must be labeled in a visible area with the following: “Contains FCC ID:
WS2-WG1300B0”. The grantee's FCC ID can be used only when all FCC compliance
requirements are met.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding
how to install or remove this RF module in the user’s manual of the end product which
integrates this module.
The end user manual shall include all required regulatory information/warning as show in
this manual.
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Industry Canada statement:
This device complies with RSS-210 of the Industry Canada Rules. Operation is subject to
the following two conditions: (1) This device may not cause harmful interference, and (2)
this device must accept any interference received, including interference that may cause
undesired operation.
Ce dispositif est conforme à la norme CNR-210 d'Industrie Canada applicable aux
appareils radio exempts de licence. Son fonctionnement est sujet aux deux conditions
suivantes: (1) le dispositif ne doit pas produire de brouillage préjudiciable, et (2) ce
dispositif doit accepter tout brouillage reçu, y compris un brouillage susceptible de
provoquer un fonctionnement indésirable.
Radiation Exposure Statement:
This equipment complies with IC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance
20cm between the radiator & your body.
Déclaration d'exposition aux radiations: Cet équipement est conforme aux limites
d'exposition aux rayonnements IC établies pour un environnement non contrôlé. Cet
équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre la
source de rayonnement et votre corps.
This device is intended only for OEM integrators under the following conditions: (For
module device use)
1) The antenna must be installed such that 20 cm is maintained between the antenna and
users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required.
However, the OEM integrator is still responsible for testing their end-product for any
additional compliance requirements required with this module installed.
3) The monopole chip antenna with 2.5 dBi gain was verified in the conformity testing.
Radiated transmit power must be equal to or lower than that specified in the Equipment
Authorization. A separate approval is required for all other antenna type, or higher gain
antenna.
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IMPORTANT NOTE:
In the event that these conditions can not be met (for example certain laptop
configurations or co-location with another transmitter), then the Canada authorization is
no longer considered valid and the IC ID can not be used on the final product. In these
circumstances, the OEM integrator will be responsible for re-evaluating the end product
(including the transmitter) and obtaining a separate Canada authorization.
NOTE IMPORTANTE:
Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines
configurations d'ordinateur portable ou de certaines co-localisation avec un autre
émetteur), l'autorisation du Canada n'est plus considéré comme valide et l'ID IC ne peut
pas être utilisé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera chargé
de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une autorisation
distincte au Canada.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be
installed such that 20 cm may be maintained between the antenna and users. The final end
product must be labeled in a visible area with the following: “Contains IC:
10462A-WG1300B0”.
Plaque signalétique du produit final
Ce module émetteur est autorisé uniquement pour une utilisation dans un dispositif où
l'antenne peut être installée de telle sorte qu'une distance de 20cm peut être maintenue
entre l'antenne et les utilisateurs. Le produit final doit être étiqueté dans un endroit visible
avec l'inscription suivante: "Contient des IC: 10462A-WG1300B0".
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding
how to install or remove this RF module in the user’s manual of the end product which
integrates this module.
The end user manual shall include all required regulatory information/warning as show in
this manual.
Manuel d'information à l'utilisateur final
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L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur
final quant à la façon d'installer ou de supprimer ce module RF dans le manuel de
l'utilisateur du produit final qui intègre ce module. Le manuel de l'utilisateur final doit
inclure toutes les informations réglementaires requises et avertissements comme indiqué
dans ce manuel.
Under Industry Canada regulations, this radio transmitter may only operate using an
antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry
Canada. To reduce potential radio interference to other users, the antenna type and its
gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not
more than that necessary for successful communication.
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1. INTRODUCTION
The purpose of this user guide is to help user understanding how to use
WG1300-B0 EM (Evaluation Module) board to complete hardware
setup for test to evaluate the performances of CC3000 - WG1300-B0 SiP
Module.
2. WG1300-B0 EM BOARD
In the following sub-sections, it’ll divide into TOP and BOTTOM Side to
explain details on the key parts and its features.
2.1. TOP Side
Figure 1 is TOP-Side picture of WG1300BE00 EM Board.
Figure 1. TOP Side of WG1300BE00 EM Board
The picture above marks some key parts and jumpers and Table 1
J10
J14
J16
J13
J1
Antenna
CC3000-WG1300-B0
Module
J11
J12
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below shows the explanations to them in the details.
Items
Key Parts
Descriptions
1
CC3000-WG1300-B0
Module
The core module for performance evaluation. It’s
related feature can be referred to its datasheet.
2
Antenna
It can used for radiated test by reworking cpacitor
to correct pads.
3
J1
It’s a U.FL RF connector via which you can proceed
conducted power test.
4
J14
It is a jumper via which we can swap testing modes,
test mode and operation mode. When pin 2 and
pin 3 are shorted, it runs in operation mode and it
operate in test mode when pin 1 and pin 2 are
shorted.
5
J10
It is a jumper for testing power consumption. It is for
the power for all circuit in this board. In operation
mode, pins of the jumper is shorted. For power
testing, the jumper is removed and ammeter crosses
the pins to do the testing.
6
J12
It is a jumper for testing VBAT_IN power consumption
of WG1300-B0. In operation mode, pins of the
jumper is shorted. For power testing, the jumper is
removed and ammeter crosses the pins to do the
testing.
7
J11
It is a jumper for testing VIO_SOC power
consumption of WG1300-B0. In operation mode,
pins of the jumper is shorted. For power testing, the
jumper is removed and ammeter crosses the pins to
do the testing.
8
J13
Refer to Table 2. For more details on these
through-hole test points
9
J16
Refer to Table 3. For more details on these
through-hole test points
Table 1. TOP-Side Key parts of WG1300BE00 EM Board
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Table 2 below shows the signal descriptions of J13
Pin
Number
Pin Name
Pin Type
Descriptions
1
WL_RS232_RX
I
Test RS232 receive output; Leave floating
for normal operation
2
WL_RS232_TX
O
Test RS232 transmit output; Leave floating
for normal operation
3
WL_UART_DBG
I/O
UART Debug Line
4
NS_UARTD
I/O
Networking subsystem UART Debug line.
5
DC2DC_OUT
P
Internal DC2DC output power.
6
GND
Ground
Table 2. TOP-Side J13 of WG1300BE00 EM Board
Table 3 below shows the signal descriptions of J16
Pin
Number
Pin Name
Pin Type
Descriptions
1
GND
Ground
2
SDA_EEPROM
I/O
I2C Data signal from EEPROM inside
CC3000-WG1300-B0 SiP Module. This pin is
connected to SDA_CC3000 via a 0-Ohm
resister and is not used by end users.
3
SCL_EEPROM
I
I2C Clock signal input from EEPROM inside
CC3000-WG1300-B0 SiP Module. This pin is
connected to SCL_CC3000 via a 0-Ohm
resister and is not used by end users.
Table 3. TOP-Side J16 of WG1300BE00 EM Board
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2.2. BOTTOM Side
Figure 2 is BOTTOM-Side picture of WG1300BE00 EM Board.
Figure 2. Bottom Side of WG1300BE00 EM Board
There are two EM Board mating connectors which are used for
connecting to Host platform and mounted on the bottom side as the
picture above. Table 4 and Table 5 show the descriptions on the signals
brought out from these two EM mating connectors.
J6 Pin
Number
Pin Name
Module Pin Type
Description
1
GND
Ground
5
EXT_32KHz
I
External Slow Clock input from Host
device. It can be used for the SiP
Module inside which hasn’t slow clock
source.
10
VBAT_SW_EN
I
Active-high enable signal from Host
device.
12
WL_SPI_IRQ
O
Host Interface SPI Interrupt Request
J6
J7
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14
WL_SPI_CS
I
Host interface SPI Chip Select
16
WL_SPI_CLK
I
Host interface SPI Clock input
18
WL_SPI_DIN
I
Host Interface SPI Data Input
19
GND
Ground
20
WL_SPI_DOUT
O
Host interface SPI Data Ouput
Table 4. BOTTOM-Side J6 of WG1300BE00 EM Board
J7 Pin
Number
Pin Name
Module Pin Type
Description
2
GND
Ground
7
VBAT_IN
PI
Battery voltage input to Module
9
VBAT_IN
PI
Battery voltage input to Module
15
EXT_32KHz
I
External Slow Clock input from Host
device.
Table 5. BOTTOM-Side J7 of WG1300BE00 EM Board
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2.3. Hardware Setup
Before conducting performance test, EM Board should be connected
to Host platform with mating connectors, J6 and J7. For the case of
using EM mating connector for hardware connection, the mating EM
connector should be lined up and spaced 1.2” apart as Figure 3 below
Figure 3. Host PCB Mating Connector Arrangement
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2.4. Schematics
Figure 4 is the schematics of WG1300E00 EM Board
C7
NL_1uF
CAP1608
R16
NL_100K
RES1005
WL_TX
VBAT_SYS
R6
NL_0R
RES1005
To VIO_SYS Host Level
WL_DBG
VBAT_SYS
R19
NL_10K
RES1005
VBAT_SYS
U1
WG1300-B0
E_N51_14.5X14.5_1.3
WL_UAR T_DBG
2
NS_UAR TD
33
WL_EN1
4
WL_EN2
3
WL_RS232_T X
5
WL_RS232_R X
6
EXT_32K 17
GND
36
SCL_CC 3000 24
SCL_EEPROM 23
SDA_CC 3000 26
SDA_EEPROM 25
SPI_IR Q 13
SPI_DOU T 12
SPI_CS 15
SPI_CLK 14
SPI_DI N 11
RF_AN T
35
DC2D C_OUT
30
GND 27
GND
1
GND
9
GND
37
GND
38
GND
39
GND
40
GND 16
VBAT_IN
28
GND
31
GND
7
VIO_SOC
8
GND 19
GND
34
GND
41
GND
42
GND
43
GND 51
GND 50
GND 49
GND 48
GND 44
GND 45
GND 46
GND 47
XTALM 21
XTALP 20
GND 18
GND
29
GND 10
GND 22
CLK_REQ_OU T
32
R23
NL_0R
RES1005
VBAT_SYS: 2.7V~4.8V => 3.6V TYP
VBAT_SYS
VBAT_SW_EN
VIO_SOC: 1.62V~1.92V => 1.8V TYP
WL_RX
WL_DBG
WL_TX
C3
NL_10pF
CAP1005
J1
U.F L-R-SMT(10)
U.FL
1
2
3
L2
2.2nH
IND 1005
C1
2.2pF
CAP1005
L1
NL
IND 1005
C2
10pF
CAP1005
WL_EN1
ANT1
AT8010-E2R9HAA
8.0x1. 0x1.0mm
1
2
VIO_CLK
The Antenna matching circuit.
VBAT_IN
VBAT_IN
U2
SN74AVC2T45
XBGA-N8_1X2_0. 5-A
VCCA
1
A1
2
A2
3
GND
4
VCCB 8
B1 7
B2 6
DIR 5
VIO_SOC
VIO LDO
NS_UAR T
U4
SN74AVC2T45
XBGA-N8_1X2_0. 5-A
VCCA
1
A1
2
A2
3
GND
4
VCCB 8
B1 7
B2 6
DIR 5
R17 0R
RES1005
WL_SPI_I RQ_1V8
WL_SPI_D OUT_1V8
U5
SN74AVC2T45
XBGA-N8_1X2_0. 5-A
VCCA
1
A1
2
A2
3
GND
4
VCCB 8
B1 7
B2 6
DIR 5
WL_SPI_C S_1V8
U6
TPS22913B
XBGA-N4_0.9x0.9_0. 5
VIN
A2 VOUT A1
ON
B2 GND B1
VBAT_IN
U3
TPS79718
MO-203_2.1x2
GND
2
NC
3IN 4
OUT 5
PG
1
R9 0R RES1005
VIO_SYS: Voltage of Host Level
WL_SPI_I RQ_HOST
WL_SPI_D OUT_HOST
-->
C6
1uF
CAP1608
R18
100K
RES1005
-->
VIO_SOC
C4
1uF
CAP1608
-->
DIR High : A data to B bus
DIR Low : B data to A bus
VBAT_SYS
R15
100K
RES1005
VBAT_SYS
C5 0.1uF
CAP1005
WL_SPI_C LK_HOST
WL_SPI_D IN_HOST
WL_SPI_C S_HOST
VBAT_SYS FET SWITCH
WL_SPI_C LK_1V8
WL_SPI_D IN_1V8
WL_EN1
DC2D C_OUT
R3
0R
RES1005
J14
Male 1x3
1
2
3
RTTT Debug
VIO_SOC
Networking Subsystem Debug
NS_UAR T
DC2D C_OUT
WL Debug Logger
R4
NL_0R
RES1005
VBAT_IN
VIO_SOC
R1
0R
RES1005
32KHz_1V8_HOST
R7 NL_0R
RES1005
SLOW CLK 32.768KHz
OSC1
SG-3030LC/32. 768kHz
CY -N12_3.6X2.8_0.5
VIO 1
VCC
12
OUT
7GND 6
NC 2
NC 3
NC 4
NC 5
NC
8NC
9NC
10 NC
11
R2
0R
RES1005
J10
Male 1x2
1
2
Connect to Host SPI Interface.
(Host I/O level: VIO_SYS)
Internal Power FET Switch Enable.
Connect to Host GPIO.
VIO_SOC
The 32.768kHz clock select.
Connect to OSC or Host source.
J16
NL_Male 1x3
1
2
3
R14
NL_0R
RES1005
VIO_SOC
C22
10uF
CAP2012
J11
Male 1x2
1
2
Debug mode => 1-2 short to GND
Functional mode => 2-3 short
WL_EN2
VIO_SOC
EM Connector
J12
Male 1x2
1
2
WL_SPI_C S_1V8
R8 0R RES1005
R11 0R RES1005 W L_SPI_IRQ_1V8
R10 0R RES1005 W L_SPI_CLK_1V8
R13 0R RES1005 W L_SPI_DIN_1V8
R12 0R RES1005 W L_SPI_DOUT_1V8
VBAT_SYS
R21 NL_0R
RES1005
32KHz_1V8_HOST
32KHz_1V8_HOST R20 N L_0R
RES1005
WL_SPI_D IN_HOST
WL_SPI_C LK_HOST
VBAT_SW_EN
WL_SPI_C S_HOST
WL_SPI_D OUT_HOST
WL_SPI_I RQ_HOST
J6
SFM-110-02-L-D-A
pitch 1.27-2x10
1
3
5
7
9
11
13
15
17
19
2
4
6
8
10
12
14
16
18
20
R5
0R
RES1005
VBAT_SYS
J7
SFM-110-02-L-D-A
pitch 1.27-2x10
1
3
5
7
9
11
13
15
17
19
2
4
6
8
10
12
14
16
18
20
R22
0R
RES1005
J13
Male 1x6
1
2
3
4
5
6
VBAT_SYS
VBAT_SYS
VIO_CLK: 3.3V
VBAT_IN
Reserved VIO CLK LDO
VIO_CLK
WL_RX
U7
NL_TPS79733
MO-203_2.1x2
GND
2
NC
3IN 4
OUT 5
PG
1
Figure 4. Schematics of WG1300BE00 EM Board
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2.5. Bill Of Material (BOM)
Table 6. BOM of WG1300BE00 EM Board
Items
Reference Designator
Description
1
U1
TI CC3000 WiFi b/g Module (LC)
2
U2, U4, U5
IC BUS TRANSCEIVER, SN74AVC2T45YZPR
3
U3
IC Regulator, TPS79718DCK
4
U6
IC Power Switch, TPS22913BYZV
5
OSC1
OSC 3225 / 32.768KHz / 1.5~5.5V / 5ppm
6
ANT1
ANT / 2.4GHZ / Peak Gain 2.5DB
7
J10, J11, J12
CON Male 1x2 / Pitch 2.0 mm
8
J14
CON Male 1x3 / Pitch 2.0 mm
9
J6,J7
Female Header / Fool Proof H:4.3 / 2x10 /
Pitch 1.27mm / SMT
10
J1
Mini RF Header Receptacle
11
R1, R2, R3, R5, R8, R9,
R10, R11, R12, R13, R17,
R22
RES 0402 / 0R / ±5%
12
R15, R18
RES 0402 / 100K / ±5%
13
L2
IND 0402 / 2.2nH / ±0.3nH / 0.16ohm / 300mA
14
C1
CAP 0402 / 2.2pF / 50V / NPO / ±0.25pF
15
C2
CAP 0402 / 10pF / 50V / NPO / ±5%
16
C5
CAP 0402 / 0.1uF / 10V / X7R / ±10%
17
C4, C6
CAP 0603 / 1uF / 16V / X7R / ±10%
18
C22
CAP 0805 / 10uF / 10V / X5R / ±10%
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3. ANTENNA CHARACTERISTICS
3.1. Return Loss & VSWR
Figure 5. Antenna return loss & VSWR
3.2. Plane Definition
Figure 6. Plane Definition
Y
Z
X
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3.3. 3D Radio Pattern
Figure 7. 3D Radio Pattern
XY-Plane
Theta=90°
XZ-Plane
Phi=0°
YZ-Plane
Phi=90°
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3.4. 2D Radio Pattern
Figure 8. 2D Radio Pattern
Table 7. Gain Table
XY-Plane
XZ-Plane
YZ-Plane
Efficiency
Peak
Avg.
Peak
Avg.
Peak
Avg.
0.3
-2.6
1.3
-4.2
0.9
-0.9
66.7%
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4. LAYOUT GUIDELINES
4.1. Board Layout
Figure 9 shows the 2 layers evaluation board.
Figure 9. Board Layout
Table 8 and Figure 10 describe instances of good layout practices.
Reference
Guideline Descriptions
1
The proximity of ground vias must be close to the pad.
2
Signal traces must not be run underneath the module on the layer
where the module is mounted.
3
Increase the ground pour in the first layer.
4
Have a solid ground plane and ground vias under the module for
stable system and thermal dissipation.
Table 8. Module Layout Guidelines
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Figure 10. Module Layout Guidelines
Figure 11 shows the RF trace design for the PCB. A 50-Ω impedance
match on the trace to the antenna should be used. Also, 50-Ω traces
are recommended for the PCB layout. Figure 11 also lists the distances.
Figure 12 shows layer 1 with the trace to the antenna over the layer 2.
Table 9 and Figure 13 describe instances of good layout practices for
the antenna and RF trace routing.
Figure 11. Trace Design for the PCB layout
1
2, 3
4
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Figure 12. Layer 1 Combined with Layer 2
Reference
Guideline Descriptions
1
The RF trace antenna feed must be as short as possible beyond the
ground reference. At this point, the trace starts to radiate.
2
The RF trace bends must be gradual with an approximate maximum
bend of 45 degrees with trace mitered. RF traces must not have
sharp corners.
3
RF traces must have via stitching on the ground plane beside the RF
trace on both sides.
4
RF traces must have constant impedance (microstrip transmission
line).
5
For best results, the RF trace ground layer must be the ground layer
immediately below the RF trace. The ground layer must be solid.
6
There must be no traces or ground under the antenna section.
7
The PCB designer must understand the microstrip model used and
the scale line width according to the microstrip model.
8
RF traces must be as short as possible. The antenna, RF traces, and
modules must be on the edge of the PCB product. The proximity of
the antenna to the enclosure and the enclosure material must also
be considered.
Table 9. Antenna and RF Trace Routing Layout Guidelines
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Top Layer
Bottom Layer
Figure 13. Antenna and RF Trace Routing Layout Guidelines
The following show the supply routing guidelines:
For power supply routing, the power trace for VBAT must be at least
40 mil wide.
The 1.8-V trace must be at least 18 mil wide.
Make VBAT traces as wide as possible to ensure reduced
inductance and trace resistance.
If possible, shield VBAT traces with ground above, below, and
beside the traces.
1
2
3
4
5
5
6
8
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5. APPLICATION DEVELOPMENT
Texas Instrument had developed a HOST platform, MSP-EXP430FR5730,
for evaluating CC3000-based SiP Module. Figure 4 shows the platform
and WG1300BE00 EM Board
Figure 4. MSP-EXP430FR5730 and WG1300BE00 EM Board
The MSP-EXP430FR5739 test platform can be ordered as the link below.
http://www.ti.com/tool/msp-exp430fr5739
Specific application examples can refer to the link below
http://processors.wiki.ti.com/index.php/CC3000 Wi-Fi for MCU
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6. HISTORY CHANGE
Revision
Date
Description
R 0.1
2013/7/22
Release 0.1
R 0.2
2014/May/22
Add
3. Antenna Characteristics
4. Layout Guidelines