Jorjin Technologies WG1300B0 WIFI MODULE User Manual 1
Jorjin Technologies Inc. WIFI MODULE 1
User Manual
a module solution provider WG1300-B0 Evaluation Module User Guide Revision 0.2 Copyright © JORJIN TECHNOLOGIES INC. 2013 http://WWW.JORJIN.COM.TW CONFIDENTIAL Doc No: WG1300BE00 EM Board-UG-R02 Index 0. REGULATION INFORMATION .......................................................................... 2 1. INTRODUCTION.................................................................................................... 7 2. WG1300-B0 EM BOARD ........................................................................................ 7 2.1. TOP SIDE ............................................................................................................. 7 2.2. BOTTOM SIDE .................................................................................................. 10 2.3. HARDWARE SETUP ............................................................................................. 12 2.4. SCHEMATICS ....................................................................................................... 13 2.5. BILL OF MATERIAL (BOM) ................................................................................ 14 3. ANTENNA CHARACTERISTICS ...................................................................... 15 3.1. RETURN LOSS & VSWR .................................................................................... 15 3.2. PLANE DEFINITION ............................................................................................. 15 3.3. 3D RADIO PATTERN ............................................................................................ 16 3.4. 2D RADIO PATTERN ............................................................................................ 17 4. LAYOUT GUIDELINES ....................................................................................... 18 4.1. BOARD LAYOUT ................................................................................................. 18 5. APPLICATION DEVELOPMENT ...................................................................... 22 6. HISTORY CHANGE ............................................................................................. 23 Copyright © JORJIN TECHNOLOGIES INC. 2014 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 1 Doc No: WG1300BE00 EM Board-UG-R02 0. REGULATION INFORMATION Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Copyright © JORJIN TECHNOLOGIES INC. 2014 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 2 Doc No: WG1300BE00 EM Board-UG-R02 This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. 3) The monopole chip antenna with 2.5 dBi gain was verified in the conformity testing. Radiated transmit power must be equal to or lower than that specified in the Equipment Authorization. A separate approval is required for all other antenna type, or higher gain antenna. As long as 3 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains FCC ID: WS2-WG1300B0”. The grantee's FCC ID can be used only when all FCC compliance requirements are met. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Copyright © JORJIN TECHNOLOGIES INC. 2014 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 3 Doc No: WG1300BE00 EM Board-UG-R02 Industry Canada statement: This device complies with RSS-210 of the Industry Canada Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Ce dispositif est conforme à la norme CNR-210 d'Industrie Canada applicable aux appareils radio exempts de licence. Son fonctionnement est sujet aux deux conditions suivantes: (1) le dispositif ne doit pas produire de brouillage préjudiciable, et (2) ce dispositif doit accepter tout brouillage reçu, y compris un brouillage susceptible de provoquer un fonctionnement indésirable. Radiation Exposure Statement: This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Déclaration d'exposition aux radiations: Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps. This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. 3) The monopole chip antenna with 2.5 dBi gain was verified in the conformity testing. Radiated transmit power must be equal to or lower than that specified in the Equipment Authorization. A separate approval is required for all other antenna type, or higher gain antenna. Copyright © JORJIN TECHNOLOGIES INC. 2014 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 4 Doc No: WG1300BE00 EM Board-UG-R02 IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une autorisation distincte au Canada. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains IC: 10462A-WG1300B0”. Plaque signalétique du produit final Ce module émetteur est autorisé uniquement pour une utilisation dans un dispositif où l'antenne peut être installée de telle sorte qu'une distance de 20cm peut être maintenue entre l'antenne et les utilisateurs. Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: "Contient des IC: 10462A-WG1300B0". Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information à l'utilisateur final Copyright © JORJIN TECHNOLOGIES INC. 2014 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 5 Doc No: WG1300BE00 EM Board-UG-R02 L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements comme indiqué dans ce manuel. Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. Copyright © JORJIN TECHNOLOGIES INC. 2014 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 6 Doc No: WG1300BE00 EM Board-UG-R02 1. INTRODUCTION The purpose of this user guide is to help user understanding how to use WG1300-B0 EM (Evaluation Module) board to complete hardware setup for test to evaluate the performances of CC3000 - WG1300-B0 SiP Module. 2. WG1300-B0 EM BOARD In the following sub-sections, it’ll divide into TOP and BOTTOM Side to explain details on the key parts and its features. 2.1. TOP Side Figure 1 is TOP-Side picture of WG1300BE00 EM Board. Antenna J1 J14 J12 J16 J13 J10 CC3000-WG1300-B0 Module J11 Figure 1. TOP Side of WG1300BE00 EM Board The picture above marks some key parts and jumpers and Table 1 Copyright © JORJIN TECHNOLOGIES INC. 2014 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 7 Doc No: WG1300BE00 EM Board-UG-R02 below shows the explanations to them in the details. Items Key Parts CC3000-WG1300-B0 The core module for performance evaluation. It’s Module related feature can be referred to its datasheet. Antenna It can used for radiated test by reworking cpacitor Descriptions to correct pads. J1 It’s a U.FL RF connector via which you can proceed conducted power test. J14 It is a jumper via which we can swap testing modes, test mode and operation mode. When pin 2 and pin 3 are shorted, it runs in operation mode and it operate in test mode when pin 1 and pin 2 are shorted. J10 It is a jumper for testing power consumption. It is for the power for all circuit in this board. In operation mode, pins of the jumper is shorted. For power testing, the jumper is removed and ammeter crosses the pins to do the testing. J12 It is a jumper for testing VBAT_IN power consumption of WG1300-B0. In operation mode, pins of the jumper is shorted. For power testing, the jumper is removed and ammeter crosses the pins to do the testing. J11 It is a jumper for testing VIO_SOC power consumption of WG1300-B0. In operation mode, pins of the jumper is shorted. For power testing, the jumper is removed and ammeter crosses the pins to do the testing. J13 Refer to Table 2. For more details on these through-hole test points J16 Refer to Table 3. For more details on these through-hole test points Table 1. TOP-Side Key parts of WG1300BE00 EM Board Copyright © JORJIN TECHNOLOGIES INC. 2014 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 8 Doc No: WG1300BE00 EM Board-UG-R02 Table 2 below shows the signal descriptions of J13 Pin Number Pin Name WL_RS232_RX Pin Type Descriptions Test RS232 receive output; Leave floating for normal operation WL_RS232_TX Test RS232 transmit output; Leave floating for normal operation WL_UART_DBG I/O UART Debug Line NS_UARTD I/O Networking subsystem UART Debug line. DC2DC_OUT Internal DC2DC output power. GND Ground Table 2. TOP-Side J13 of WG1300BE00 EM Board Table 3 below shows the signal descriptions of J16 Pin Number Pin Name Pin Type GND Descriptions Ground I2C Data signal from EEPROM inside SDA_EEPROM I/O CC3000-WG1300-B0 SiP Module. This pin is connected to SDA_CC3000 via a 0-Ohm resister and is not used by end users. I2C Clock signal input from EEPROM inside SCL_EEPROM CC3000-WG1300-B0 SiP Module. This pin is connected to SCL_CC3000 via a 0-Ohm resister and is not used by end users. Table 3. TOP-Side J16 of WG1300BE00 EM Board Copyright © JORJIN TECHNOLOGIES INC. 2014 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 9 Doc No: WG1300BE00 EM Board-UG-R02 2.2. BOTTOM Side Figure 2 is BOTTOM-Side picture of WG1300BE00 EM Board. J7 J6 Figure 2. Bottom Side of WG1300BE00 EM Board There are two EM Board mating connectors which are used for connecting to Host platform and mounted on the bottom side as the picture above. Table 4 and Table 5 show the descriptions on the signals brought out from these two EM mating connectors. J6 Pin Pin Name Module Pin Type Description Number GND Ground External Slow Clock input from Host EXT_32KHz device. It can be used for the SiP Module inside which hasn’t slow clock source. 10 VBAT_SW_EN Active-high enable signal from Host device. 12 WL_SPI_IRQ Host Interface SPI Interrupt Request Copyright © JORJIN TECHNOLOGIES INC. 2014 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 10 Doc No: WG1300BE00 EM Board-UG-R02 14 WL_SPI_CS Host interface SPI Chip Select 16 WL_SPI_CLK Host interface SPI Clock input 18 WL_SPI_DIN Host Interface SPI Data Input 19 GND 20 WL_SPI_DOUT Ground Host interface SPI Data Ouput Table 4. BOTTOM-Side J6 of WG1300BE00 EM Board J7 Pin Pin Name Module Pin Type Description Number GND Ground VBAT_IN PI Battery voltage input to Module VBAT_IN PI Battery voltage input to Module 15 EXT_32KHz External Slow Clock input from Host device. Table 5. BOTTOM-Side J7 of WG1300BE00 EM Board Copyright © JORJIN TECHNOLOGIES INC. 2014 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 11 Doc No: WG1300BE00 EM Board-UG-R02 2.3. Hardware Setup Before conducting performance test, EM Board should be connected to Host platform with mating connectors, J6 and J7. For the case of using EM mating connector for hardware connection, the mating EM connector should be lined up and spaced 1.2” apart as Figure 3 below Figure 3. Host PCB Mating Connector Arrangement Copyright © JORJIN TECHNOLOGIES INC. 2014 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 12 Doc No: WG1300BE00 EM Board-UG-R02 2.4. Schematics Figure 4 is the schematics of WG1300E00 EM Board J16 NL_Male 1x3 SLOW CLK 32.768KHz R2 OSC1 SG-3030LC/32.768kHz CY -N12_3.6X2.8_0.5 VIO_SYS: Voltage of Host Level WL_SPI_CS_HOST VCCA A1 A2 VCCB --> GND B1 B2 DIR 17 R7 15 R8 0R RES1005 WL_SPI_CS_1V8 14 R10 0R RES1005 WL_SPI_CLK_1V8 13 R11 0R RES1005 WL_SPI_IRQ_1V8 12 R12 0R RES1005 WL_SPI_DOUT_1V8 11 R13 0R RES1005 WL_SPI_DIN_1V8 GND GND GND GND GND GND GND VIO_CLK: VIO VCC VIO_CLK 3.3V R16 NL_100K RES1005 VIO_SOC U7 NL_TPS79733 MO-203_2.1x2 PG OUT CAP1608 C7 NL_1uF VBAT_IN NC IN VBAT_SY S R14 NL_0R RES1005 GND J11 Male 1x2 VIO LDO VIO_SOC VIO_SOC: 1.62V~1.92V => 1.8V TYP WL_SPI_DIN_HOST WL_SPI_CLK_HOST VBAT_SY S WL_SPI_IRQ_HOST WL_SPI_DOUT_HOST Connect to Host SPI Interface. (Host I/O level: VIO_SYS) U4 SN74AVC2T45 XBGA-N8_1X2_0.5-A VCCA A1 A2 VCCB --> GND B1 B2 DIR U5 SN74AVC2T45 XBGA-N8_1X2_0.5-A VCCA A1 A2 --> VBAT_SY S GND VCCB B1 B2 DIR VIO_SOC WL_SPI_DIN_1V8 WL_SPI_CLK_1V8 VBAT_SY S J13 VIO_SOC R15 100K RES1005 Debug mode => 1-2 short to GND Functional mode => 2-3 short WL_SPI_IRQ_1V8 WL_SPI_DOUT_1V8 NL_0R RES1005 11 13 15 17 19 PG OUT CAP1608 C4 1uF VBAT_IN GND NC IN VBAT_SYS FET SWITCH VBAT_SYS: 2.7V~4.8V => 3.6V TYP DIR High : A data to B bus DIR Low : B data to A bus VBAT_SY S 10 12 14 16 18 20 J6 SFM-110-02-L-D-A pitch 1.27-2x10 J10 VBAT_SY S VBAT_SW_EN WL_SPI_IRQ_HOST WL_SPI_CS_HOST WL_SPI_CLK_HOST WL_SPI_DIN_HOST WL_SPI_DOUT_HOST U6 TPS22913B XBGA-N4_0.9x0.9_0.5 VBAT_SY S R19 NL_10K RES1005 VBAT_SW_EN R20 U3 TPS79718 MO-203_2.1x2 Male 1x6 EM Connector 32KHz_1V8_HOST WL_EN1 DC2DC_OUT NS_UART WL_DBG WL_TX WL_RX Male 1x2 32KHz_1V8_HOST R21 NL_0R RES1005 C22 10uF CAP2012 11 13 15 17 19 10 12 14 16 18 20 R22 0R RES1005 32KHz_1V8_HOST Reserved VIO CLK LDO Male 1x3 VBAT_SY S VBAT_SY S R6 NL_0R RES1005 10 RTTT Debug WL_EN1 WL_EN2 VIO_CLK R4 NL_0R RES1005 The 32.768kHz clock select. Connect to OSC or Host source. WL_SPI_CS_1V8 NL_0R RES1005 16 37 38 39 40 41 42 43 VIO_SOC GND GND WL_RS232_RX GND WL_RX WL_RS232_TX GND SPI_DIN 18 J14 NC NC NC NC OUT GND GND GND GND GND GND GND GND GND XTALP XTALM VIO_SOC 11 10 44 45 46 47 48 49 50 51 19 20 21 22 23 24 SPI_DOUT RF_ANT VBAT_IN R5 0R RES1005 U2 SN74AVC2T45 XBGA-N8_1X2_0.5-A GND SPI_IRQ GND WL Debug Logger VBAT_SY S SCL_EEPROM SPI_CLK NS_UARTD C3 NL_10pF CAP1005 To VIO_SYS Host Level SCL_CC3000 GND SDA_CC3000 GND SPI_CS CLK_REQ_OUT GND 36 EXT_32K GND WL_DBG L2 2.2nH IND1005 35 GND DC2DC_OUT J1 U.FL-R-SMT(10) U.FL L1 NL IND1005 34 C2 10pF CAP1005 GND WL_TX C1 2.2pF CAP1005 33 NS_UART Networking Subsystem Debug ANT1 AT8010-E2R9HAA 8.0x1.0x1.0mm 32 WL_EN1 31 0R RES1005 WL_EN2 30 DC2DC_OUT R9 WL_UART_DBG Male 1x2 VIO_SOC VBAT_IN 29 28 SDA_EEPROM WG1300-B0 The Antenna matching circuit. 25 27 E_N51_14.5X14.5_1.3 26 U1 VBAT_IN J12 VIO_SOC R1 0R RES1005 12 NC NC NC NC GND 0R RES1005 R3 0R RES1005 C5 R17 RES1005 Internal Power FET Switch Enable. Connect to Host GPIO. 0.1uF CAP1005 0R A2 B2 VIN VOUT ON GND VBAT_IN A1 B1 C6 1uF CAP1608 R18 100K RES1005 J7 SFM-110-02-L-D-A pitch 1.27-2x10 Figure 4. Schematics of WG1300BE00 EM Board Copyright © JORJIN TECHNOLOGIES INC. 2014 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 13 R23 NL_0R RES1005 Doc No: WG1300BE00 EM Board-UG-R02 2.5. Bill Of Material (BOM) Items Reference Designator Description U1 TI CC3000 WiFi b/g Module (LC) U2, U4, U5 IC BUS TRANSCEIVER, SN74AVC2T45YZPR U3 IC Regulator, TPS79718DCK U6 IC Power Switch, TPS22913BYZV OSC1 OSC 3225 / 32.768KHz / 1.5~5.5V / 5ppm ANT1 ANT / 2.4GHZ / Peak Gain 2.5DB J10, J11, J12 CON Male 1x2 / Pitch 2.0 mm J14 CON Male 1x3 / Pitch 2.0 mm Female Header / Fool Proof H:4.3 / 2x10 / J6,J7 Pitch 1.27mm / SMT 10 J1 Mini RF Header Receptacle 11 R1, R2, R3, R5, R8, R9, R10, R11, R12, R13, R17, RES 0402 / 0R / ±5% R22 12 R15, R18 RES 0402 / 100K / ±5% 13 L2 IND 0402 / 2.2nH / ±0.3nH / 0.16ohm / 300mA 14 C1 CAP 0402 / 2.2pF / 50V / NPO / ±0.25pF 15 C2 CAP 0402 / 10pF / 50V / NPO / ±5% 16 C5 CAP 0402 / 0.1uF / 10V / X7R / ±10% 17 C4, C6 CAP 0603 / 1uF / 16V / X7R / ±10% 18 C22 CAP 0805 / 10uF / 10V / X5R / ±10% Table 6. BOM of WG1300BE00 EM Board Copyright © JORJIN TECHNOLOGIES INC. 2014 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 14 Doc No: WG1300BE00 EM Board-UG-R02 3. ANTENNA CHARACTERISTICS 3.1. Return Loss & VSWR Figure 5. Antenna return loss & VSWR 3.2. Plane Definition Figure 6. Plane Definition Copyright © JORJIN TECHNOLOGIES INC. 2014 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 15 Doc No: WG1300BE00 EM Board-UG-R02 XY-Plane Theta=90° XZ-Plane Phi=0° YZ-Plane Phi=90° 3.3. 3D Radio Pattern Figure 7. 3D Radio Pattern Copyright © JORJIN TECHNOLOGIES INC. 2014 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 16 Doc No: WG1300BE00 EM Board-UG-R02 3.4. 2D Radio Pattern Figure 8. 2D Radio Pattern XY-Plane XZ-Plane YZ-Plane Peak Avg. Peak Avg. Peak Avg. 0.3 -2.6 1.3 -4.2 0.9 -0.9 Efficiency 66.7% Table 7. Gain Table Copyright © JORJIN TECHNOLOGIES INC. 2014 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 17 Doc No: WG1300BE00 EM Board-UG-R02 4. LAYOUT GUIDELINES 4.1. Board Layout Figure 9 shows the 2 layers evaluation board. Figure 9. Board Layout Table 8 and Figure 10 describe instances of good layout practices. Reference Guideline Descriptions The proximity of ground vias must be close to the pad. Signal traces must not be run underneath the module on the layer where the module is mounted. Increase the ground pour in the first layer. Have a solid ground plane and ground vias under the module for stable system and thermal dissipation. Table 8. Module Layout Guidelines Copyright © JORJIN TECHNOLOGIES INC. 2014 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 18 Doc No: WG1300BE00 EM Board-UG-R02 2, 3 Figure 10. Module Layout Guidelines Figure 11 shows the RF trace design for the PCB. A 50-Ω impedance match on the trace to the antenna should be used. Also, 50-Ω traces are recommended for the PCB layout. Figure 11 also lists the distances. Figure 12 shows layer 1 with the trace to the antenna over the layer 2. Table 9 and Figure 13 describe instances of good layout practices for the antenna and RF trace routing. Figure 11. Trace Design for the PCB layout Copyright © JORJIN TECHNOLOGIES INC. 2014 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 19 Doc No: WG1300BE00 EM Board-UG-R02 Figure 12. Layer 1 Combined with Layer 2 Reference Guideline Descriptions The RF trace antenna feed must be as short as possible beyond the ground reference. At this point, the trace starts to radiate. The RF trace bends must be gradual with an approximate maximum bend of 45 degrees with trace mitered. RF traces must not have sharp corners. RF traces must have via stitching on the ground plane beside the RF trace on both sides. RF traces must have constant impedance (microstrip transmission line). For best results, the RF trace ground layer must be the ground layer immediately below the RF trace. The ground layer must be solid. There must be no traces or ground under the antenna section. The PCB designer must understand the microstrip model used and the scale line width according to the microstrip model. RF traces must be as short as possible. The antenna, RF traces, and modules must be on the edge of the PCB product. The proximity of the antenna to the enclosure and the enclosure material must also be considered. Table 9. Antenna and RF Trace Routing Layout Guidelines Copyright © JORJIN TECHNOLOGIES INC. 2014 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 20 Doc No: WG1300BE00 EM Board-UG-R02 Top Layer Bottom Layer Figure 13. Antenna and RF Trace Routing Layout Guidelines The following show the supply routing guidelines: For power supply routing, the power trace for VBAT must be at least 40 mil wide. The 1.8-V trace must be at least 18 mil wide. Make VBAT traces as wide as possible to ensure reduced inductance and trace resistance. If possible, shield VBAT traces with ground above, below, and beside the traces. Copyright © JORJIN TECHNOLOGIES INC. 2014 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 21 Doc No: WG1300BE00 EM Board-UG-R02 5. APPLICATION DEVELOPMENT Texas Instrument had developed a HOST platform, MSP-EXP430FR5730, for evaluating CC3000-based SiP Module. Figure 4 shows the platform and WG1300BE00 EM Board Figure 4. MSP-EXP430FR5730 and WG1300BE00 EM Board The MSP-EXP430FR5739 test platform can be ordered as the link below. http://www.ti.com/tool/msp-exp430fr5739 Specific application examples can refer to the link below http://processors.wiki.ti.com/index.php/CC3000 Wi-Fi for MCU Copyright © JORJIN TECHNOLOGIES INC. 2014 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 22 Doc No: WG1300BE00 EM Board-UG-R02 6. HISTORY CHANGE Revision Date Description R 0.1 2013/7/22 Release 0.1 R 0.2 2014/May/22 Add 3. Antenna Characteristics 4. Layout Guidelines Copyright © JORJIN TECHNOLOGIES INC. 2014 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 23
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