Jorjin Technologies WG1300B0 WIFI MODULE User Manual 1

Jorjin Technologies Inc. WIFI MODULE 1

User Manual

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Date Submitted2014-05-22 00:00:00
Date Available2014-11-18 00:00:00
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Document Author: donny

a module solution provider
WG1300-B0
Evaluation Module User Guide
Revision 0.2
Copyright © JORJIN TECHNOLOGIES INC. 2013
http://WWW.JORJIN.COM.TW
CONFIDENTIAL
Doc No: WG1300BE00 EM Board-UG-R02
Index
0. REGULATION INFORMATION .......................................................................... 2
1. INTRODUCTION.................................................................................................... 7
2. WG1300-B0 EM BOARD ........................................................................................ 7
2.1. TOP SIDE ............................................................................................................. 7
2.2. BOTTOM SIDE .................................................................................................. 10
2.3. HARDWARE SETUP ............................................................................................. 12
2.4. SCHEMATICS ....................................................................................................... 13
2.5. BILL OF MATERIAL (BOM) ................................................................................ 14
3. ANTENNA CHARACTERISTICS ...................................................................... 15
3.1. RETURN LOSS & VSWR .................................................................................... 15
3.2. PLANE DEFINITION ............................................................................................. 15
3.3. 3D RADIO PATTERN ............................................................................................ 16
3.4. 2D RADIO PATTERN ............................................................................................ 17
4. LAYOUT GUIDELINES ....................................................................................... 18
4.1. BOARD LAYOUT ................................................................................................. 18
5. APPLICATION DEVELOPMENT ...................................................................... 22
6. HISTORY CHANGE ............................................................................................. 23
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0. REGULATION INFORMATION
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions: (1) This device may not cause harmful interference, and (2) this device
must accept any interference received, including interference that may cause undesired
operation.
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
FCC Caution: Any changes or modifications not expressly approved by the party
responsible for compliance could void the user's authority to operate this equipment. This
transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance
20cm between the radiator & your body.
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This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20 cm is maintained between the antenna and
users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
3) The monopole chip antenna with 2.5 dBi gain was verified in the conformity testing.
Radiated transmit power must be equal to or lower than that specified in the Equipment
Authorization. A separate approval is required for all other antenna type, or higher gain
antenna.
As long as 3 conditions above are met, further transmitter test will not be required.
However, the OEM integrator is still responsible for testing their end-product for any
additional compliance requirements required with this module installed
IMPORTANT NOTE: In the event that these conditions can not be met (for example
certain laptop configurations or co-location with another transmitter), then the FCC
authorization is no longer considered valid and the FCC ID can not be used on the final
product. In these circumstances, the OEM integrator will be responsible for re-evaluating
the end product (including the transmitter) and obtaining a separate FCC authorization.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be
installed such that 20 cm may be maintained between the antenna and users. The final end
product must be labeled in a visible area with the following: “Contains FCC ID:
WS2-WG1300B0”. The grantee's FCC ID can be used only when all FCC compliance
requirements are met.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding
how to install or remove this RF module in the user’s manual of the end product which
integrates this module.
The end user manual shall include all required regulatory information/warning as show in
this manual.
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Industry Canada statement:
This device complies with RSS-210 of the Industry Canada Rules. Operation is subject to
the following two conditions: (1) This device may not cause harmful interference, and (2)
this device must accept any interference received, including interference that may cause
undesired operation.
Ce dispositif est conforme à la norme CNR-210 d'Industrie Canada applicable aux
appareils radio exempts de licence. Son fonctionnement est sujet aux deux conditions
suivantes: (1) le dispositif ne doit pas produire de brouillage préjudiciable, et (2) ce
dispositif doit accepter tout brouillage reçu, y compris un brouillage susceptible de
provoquer un fonctionnement indésirable.
Radiation Exposure Statement:
This equipment complies with IC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance
20cm between the radiator & your body.
Déclaration d'exposition aux radiations: Cet équipement est conforme aux limites
d'exposition aux rayonnements IC établies pour un environnement non contrôlé. Cet
équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre la
source de rayonnement et votre corps.
This device is intended only for OEM integrators under the following conditions: (For
module device use)
1) The antenna must be installed such that 20 cm is maintained between the antenna and
users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required.
However, the OEM integrator is still responsible for testing their end-product for any
additional compliance requirements required with this module installed.
3) The monopole chip antenna with 2.5 dBi gain was verified in the conformity testing.
Radiated transmit power must be equal to or lower than that specified in the Equipment
Authorization. A separate approval is required for all other antenna type, or higher gain
antenna.
Copyright © JORJIN TECHNOLOGIES INC. 2014
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Doc No: WG1300BE00 EM Board-UG-R02
IMPORTANT NOTE:
In the event that these conditions can not be met (for example certain laptop
configurations or co-location with another transmitter), then the Canada authorization is
no longer considered valid and the IC ID can not be used on the final product. In these
circumstances, the OEM integrator will be responsible for re-evaluating the end product
(including the transmitter) and obtaining a separate Canada authorization.
NOTE IMPORTANTE:
Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines
configurations d'ordinateur portable ou de certaines co-localisation avec un autre
émetteur), l'autorisation du Canada n'est plus considéré comme valide et l'ID IC ne peut
pas être utilisé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera chargé
de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une autorisation
distincte au Canada.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be
installed such that 20 cm may be maintained between the antenna and users. The final end
product must be labeled in a visible area with the following: “Contains IC:
10462A-WG1300B0”.
Plaque signalétique du produit final
Ce module émetteur est autorisé uniquement pour une utilisation dans un dispositif où
l'antenne peut être installée de telle sorte qu'une distance de 20cm peut être maintenue
entre l'antenne et les utilisateurs. Le produit final doit être étiqueté dans un endroit visible
avec l'inscription suivante: "Contient des IC: 10462A-WG1300B0".
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding
how to install or remove this RF module in the user’s manual of the end product which
integrates this module.
The end user manual shall include all required regulatory information/warning as show in
this manual.
Manuel d'information à l'utilisateur final
Copyright © JORJIN TECHNOLOGIES INC. 2014
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Doc No: WG1300BE00 EM Board-UG-R02
L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur
final quant à la façon d'installer ou de supprimer ce module RF dans le manuel de
l'utilisateur du produit final qui intègre ce module. Le manuel de l'utilisateur final doit
inclure toutes les informations réglementaires requises et avertissements comme indiqué
dans ce manuel.
Under Industry Canada regulations, this radio transmitter may only operate using an
antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry
Canada. To reduce potential radio interference to other users, the antenna type and its
gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not
more than that necessary for successful communication.
Copyright © JORJIN TECHNOLOGIES INC. 2014
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1. INTRODUCTION
The purpose of this user guide is to help user understanding how to use
WG1300-B0 EM (Evaluation Module) board to complete hardware
setup for test to evaluate the performances of CC3000 - WG1300-B0 SiP
Module.
2. WG1300-B0 EM BOARD
In the following sub-sections, it’ll divide into TOP and BOTTOM Side to
explain details on the key parts and its features.
2.1. TOP Side
Figure 1 is TOP-Side picture of WG1300BE00 EM Board.
Antenna
J1
J14
J12
J16
J13
J10
CC3000-WG1300-B0
Module
J11
Figure 1. TOP Side of WG1300BE00 EM Board
The picture above marks some key parts and jumpers and Table 1
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below shows the explanations to them in the details.
Items
Key Parts
CC3000-WG1300-B0
The core module for performance evaluation. It’s
Module
related feature can be referred to its datasheet.
Antenna
It can used for radiated test by reworking cpacitor
Descriptions
to correct pads.
J1
It’s a U.FL RF connector via which you can proceed
conducted power test.
J14
It is a jumper via which we can swap testing modes,
test mode and operation mode. When pin 2 and
pin 3 are shorted, it runs in operation mode and it
operate in test mode when pin 1 and pin 2 are
shorted.
J10
It is a jumper for testing power consumption. It is for
the power for all circuit in this board. In operation
mode, pins of the jumper is shorted. For power
testing, the jumper is removed and ammeter crosses
the pins to do the testing.
J12
It is a jumper for testing VBAT_IN power consumption
of WG1300-B0. In operation mode, pins of the
jumper is shorted. For power testing, the jumper is
removed and ammeter crosses the pins to do the
testing.
J11
It is a jumper for testing VIO_SOC power
consumption of WG1300-B0. In operation mode,
pins of the jumper is shorted. For power testing, the
jumper is removed and ammeter crosses the pins to
do the testing.
J13
Refer to Table 2. For more details on these
through-hole test points
J16
Refer to Table 3. For more details on these
through-hole test points
Table 1. TOP-Side Key parts of WG1300BE00 EM Board
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Table 2 below shows the signal descriptions of J13
Pin
Number
Pin Name
WL_RS232_RX
Pin Type
Descriptions
Test RS232 receive output; Leave floating
for normal operation
WL_RS232_TX
Test RS232 transmit output; Leave floating
for normal operation
WL_UART_DBG
I/O
UART Debug Line
NS_UARTD
I/O
Networking subsystem UART Debug line.
DC2DC_OUT
Internal DC2DC output power.
GND
Ground
Table 2. TOP-Side J13 of WG1300BE00 EM Board
Table 3 below shows the signal descriptions of J16
Pin
Number
Pin Name
Pin Type
GND
Descriptions
Ground
I2C Data signal from EEPROM inside
SDA_EEPROM
I/O
CC3000-WG1300-B0 SiP Module. This pin is
connected to SDA_CC3000 via a 0-Ohm
resister and is not used by end users.
I2C Clock signal input from EEPROM inside
SCL_EEPROM
CC3000-WG1300-B0 SiP Module. This pin is
connected to SCL_CC3000 via a 0-Ohm
resister and is not used by end users.
Table 3. TOP-Side J16 of WG1300BE00 EM Board
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2.2. BOTTOM Side
Figure 2 is BOTTOM-Side picture of WG1300BE00 EM Board.
J7
J6
Figure 2. Bottom Side of WG1300BE00 EM Board
There are two EM Board mating connectors which are used for
connecting to Host platform and mounted on the bottom side as the
picture above. Table 4 and Table 5 show the descriptions on the signals
brought out from these two EM mating connectors.
J6 Pin
Pin Name
Module Pin Type
Description
Number
GND
Ground
External Slow Clock input from Host
EXT_32KHz
device. It can be used for the SiP
Module inside which hasn’t slow clock
source.
10
VBAT_SW_EN
Active-high enable signal from Host
device.
12
WL_SPI_IRQ
Host Interface SPI Interrupt Request
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14
WL_SPI_CS
Host interface SPI Chip Select
16
WL_SPI_CLK
Host interface SPI Clock input
18
WL_SPI_DIN
Host Interface SPI Data Input
19
GND
20
WL_SPI_DOUT
Ground
Host interface SPI Data Ouput
Table 4. BOTTOM-Side J6 of WG1300BE00 EM Board
J7 Pin
Pin Name
Module Pin Type
Description
Number
GND
Ground
VBAT_IN
PI
Battery voltage input to Module
VBAT_IN
PI
Battery voltage input to Module
15
EXT_32KHz
External Slow Clock input from Host
device.
Table 5. BOTTOM-Side J7 of WG1300BE00 EM Board
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2.3. Hardware Setup
Before conducting performance test, EM Board should be connected
to Host platform with mating connectors, J6 and J7. For the case of
using EM mating connector for hardware connection, the mating EM
connector should be lined up and spaced 1.2” apart as Figure 3 below
Figure 3. Host PCB Mating Connector Arrangement
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2.4. Schematics
Figure 4 is the schematics of WG1300E00 EM Board
J16
NL_Male 1x3
SLOW CLK 32.768KHz
R2
OSC1
SG-3030LC/32.768kHz
CY -N12_3.6X2.8_0.5
VIO_SYS: Voltage of Host Level
WL_SPI_CS_HOST
VCCA
A1
A2
VCCB
-->
GND
B1
B2
DIR
17
R7
15
R8
0R RES1005
WL_SPI_CS_1V8
14
R10
0R RES1005
WL_SPI_CLK_1V8
13
R11
0R RES1005
WL_SPI_IRQ_1V8
12
R12
0R RES1005
WL_SPI_DOUT_1V8
11
R13
0R RES1005
WL_SPI_DIN_1V8
GND
GND
GND
GND
GND
GND
GND
VIO_CLK:
VIO
VCC
VIO_CLK
3.3V
R16
NL_100K
RES1005
VIO_SOC
U7
NL_TPS79733
MO-203_2.1x2
PG
OUT
CAP1608
C7
NL_1uF
VBAT_IN
NC
IN
VBAT_SY S
R14
NL_0R
RES1005
GND
J11
Male 1x2
VIO LDO
VIO_SOC
VIO_SOC: 1.62V~1.92V => 1.8V TYP
WL_SPI_DIN_HOST
WL_SPI_CLK_HOST
VBAT_SY S
WL_SPI_IRQ_HOST
WL_SPI_DOUT_HOST
Connect to Host SPI Interface.
(Host I/O level: VIO_SYS)
U4
SN74AVC2T45
XBGA-N8_1X2_0.5-A
VCCA
A1
A2
VCCB
-->
GND
B1
B2
DIR
U5
SN74AVC2T45
XBGA-N8_1X2_0.5-A
VCCA
A1
A2
-->
VBAT_SY S
GND
VCCB
B1
B2
DIR
VIO_SOC
WL_SPI_DIN_1V8
WL_SPI_CLK_1V8
VBAT_SY S
J13
VIO_SOC
R15
100K
RES1005
Debug mode => 1-2 short to GND
Functional mode => 2-3 short
WL_SPI_IRQ_1V8
WL_SPI_DOUT_1V8
NL_0R
RES1005
11
13
15
17
19
PG
OUT
CAP1608
C4
1uF
VBAT_IN
GND
NC
IN
VBAT_SYS FET SWITCH
VBAT_SYS: 2.7V~4.8V => 3.6V TYP
DIR High : A data to B bus
DIR Low : B data to A bus
VBAT_SY S
10
12
14
16
18
20
J6
SFM-110-02-L-D-A
pitch 1.27-2x10
J10
VBAT_SY S
VBAT_SW_EN
WL_SPI_IRQ_HOST
WL_SPI_CS_HOST
WL_SPI_CLK_HOST
WL_SPI_DIN_HOST
WL_SPI_DOUT_HOST
U6
TPS22913B
XBGA-N4_0.9x0.9_0.5
VBAT_SY S
R19
NL_10K
RES1005
VBAT_SW_EN
R20
U3
TPS79718
MO-203_2.1x2
Male 1x6
EM Connector
32KHz_1V8_HOST
WL_EN1
DC2DC_OUT
NS_UART
WL_DBG
WL_TX
WL_RX
Male 1x2
32KHz_1V8_HOST
R21
NL_0R
RES1005
C22
10uF
CAP2012
11
13
15
17
19
10
12
14
16
18
20
R22
0R
RES1005
32KHz_1V8_HOST
Reserved VIO CLK LDO
Male 1x3
VBAT_SY S
VBAT_SY S
R6
NL_0R
RES1005
10
RTTT Debug
WL_EN1
WL_EN2
VIO_CLK
R4
NL_0R
RES1005
The 32.768kHz clock select.
Connect to OSC or Host source.
WL_SPI_CS_1V8
NL_0R
RES1005
16
37
38
39
40
41
42
43
VIO_SOC
GND
GND
WL_RS232_RX
GND
WL_RX
WL_RS232_TX
GND
SPI_DIN
18
J14
NC
NC
NC
NC
OUT
GND
GND
GND
GND
GND
GND
GND
GND
GND
XTALP
XTALM
VIO_SOC
11
10
44
45
46
47
48
49
50
51
19
20
21
22
23
24
SPI_DOUT
RF_ANT
VBAT_IN
R5
0R
RES1005
U2
SN74AVC2T45
XBGA-N8_1X2_0.5-A
GND
SPI_IRQ
GND
WL Debug Logger
VBAT_SY S
SCL_EEPROM
SPI_CLK
NS_UARTD
C3
NL_10pF
CAP1005
To VIO_SYS Host Level
SCL_CC3000
GND
SDA_CC3000
GND
SPI_CS
CLK_REQ_OUT
GND
36
EXT_32K
GND
WL_DBG
L2
2.2nH
IND1005
35
GND
DC2DC_OUT
J1
U.FL-R-SMT(10)
U.FL
L1
NL
IND1005
34
C2
10pF
CAP1005
GND
WL_TX
C1
2.2pF
CAP1005
33
NS_UART
Networking Subsystem Debug
ANT1
AT8010-E2R9HAA
8.0x1.0x1.0mm
32
WL_EN1
31
0R RES1005
WL_EN2
30
DC2DC_OUT
R9
WL_UART_DBG
Male 1x2
VIO_SOC
VBAT_IN
29
28
SDA_EEPROM
WG1300-B0
The Antenna matching circuit.
25
27
E_N51_14.5X14.5_1.3
26
U1
VBAT_IN
J12
VIO_SOC
R1
0R
RES1005
12
NC
NC
NC
NC
GND
0R
RES1005
R3
0R
RES1005
C5
R17
RES1005
Internal Power FET Switch Enable.
Connect to Host GPIO.
0.1uF
CAP1005
0R
A2
B2
VIN
VOUT
ON
GND
VBAT_IN
A1
B1
C6
1uF
CAP1608
R18
100K
RES1005
J7
SFM-110-02-L-D-A
pitch 1.27-2x10
Figure 4. Schematics of WG1300BE00 EM Board
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R23
NL_0R
RES1005
Doc No: WG1300BE00 EM Board-UG-R02
2.5. Bill Of Material (BOM)
Items
Reference Designator
Description
U1
TI CC3000 WiFi b/g Module (LC)
U2, U4, U5
IC BUS TRANSCEIVER, SN74AVC2T45YZPR
U3
IC Regulator, TPS79718DCK
U6
IC Power Switch, TPS22913BYZV
OSC1
OSC 3225 / 32.768KHz / 1.5~5.5V / 5ppm
ANT1
ANT / 2.4GHZ / Peak Gain 2.5DB
J10, J11, J12
CON Male 1x2 / Pitch 2.0 mm
J14
CON Male 1x3 / Pitch 2.0 mm
Female Header / Fool Proof H:4.3 / 2x10 /
J6,J7
Pitch 1.27mm / SMT
10
J1
Mini RF Header Receptacle
11
R1, R2, R3, R5, R8, R9,
R10, R11, R12, R13, R17,
RES 0402 / 0R / ±5%
R22
12
R15, R18
RES 0402 / 100K / ±5%
13
L2
IND 0402 / 2.2nH / ±0.3nH / 0.16ohm / 300mA
14
C1
CAP 0402 / 2.2pF / 50V / NPO / ±0.25pF
15
C2
CAP 0402 / 10pF / 50V / NPO / ±5%
16
C5
CAP 0402 / 0.1uF / 10V / X7R / ±10%
17
C4, C6
CAP 0603 / 1uF / 16V / X7R / ±10%
18
C22
CAP 0805 / 10uF / 10V / X5R / ±10%
Table 6. BOM of WG1300BE00 EM Board
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3. ANTENNA CHARACTERISTICS
3.1. Return Loss & VSWR
Figure 5. Antenna return loss & VSWR
3.2. Plane Definition
Figure 6. Plane Definition
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XY-Plane
Theta=90°
XZ-Plane
Phi=0°
YZ-Plane
Phi=90°
3.3. 3D Radio Pattern
Figure 7. 3D Radio Pattern
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3.4. 2D Radio Pattern
Figure 8. 2D Radio Pattern
XY-Plane
XZ-Plane
YZ-Plane
Peak
Avg.
Peak
Avg.
Peak
Avg.
0.3
-2.6
1.3
-4.2
0.9
-0.9
Efficiency
66.7%
Table 7. Gain Table
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4. LAYOUT GUIDELINES
4.1. Board Layout
Figure 9 shows the 2 layers evaluation board.
Figure 9. Board Layout
Table 8 and Figure 10 describe instances of good layout practices.
Reference
Guideline Descriptions
The proximity of ground vias must be close to the pad.
Signal traces must not be run underneath the module on the layer
where the module is mounted.
Increase the ground pour in the first layer.
Have a solid ground plane and ground vias under the module for
stable system and thermal dissipation.
Table 8. Module Layout Guidelines
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2, 3
Figure 10. Module Layout Guidelines
Figure 11 shows the RF trace design for the PCB. A 50-Ω impedance
match on the trace to the antenna should be used. Also, 50-Ω traces
are recommended for the PCB layout. Figure 11 also lists the distances.
Figure 12 shows layer 1 with the trace to the antenna over the layer 2.
Table 9 and Figure 13 describe instances of good layout practices for
the antenna and RF trace routing.
Figure 11. Trace Design for the PCB layout
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Doc No: WG1300BE00 EM Board-UG-R02
Figure 12. Layer 1 Combined with Layer 2
Reference
Guideline Descriptions
The RF trace antenna feed must be as short as possible beyond the
ground reference. At this point, the trace starts to radiate.
The RF trace bends must be gradual with an approximate maximum
bend of 45 degrees with trace mitered. RF traces must not have
sharp corners.
RF traces must have via stitching on the ground plane beside the RF
trace on both sides.
RF traces must have constant impedance (microstrip transmission
line).
For best results, the RF trace ground layer must be the ground layer
immediately below the RF trace. The ground layer must be solid.
There must be no traces or ground under the antenna section.
The PCB designer must understand the microstrip model used and
the scale line width according to the microstrip model.
RF traces must be as short as possible. The antenna, RF traces, and
modules must be on the edge of the PCB product. The proximity of
the antenna to the enclosure and the enclosure material must also
be considered.
Table 9. Antenna and RF Trace Routing Layout Guidelines
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Doc No: WG1300BE00 EM Board-UG-R02
Top Layer
Bottom Layer
Figure 13. Antenna and RF Trace Routing Layout Guidelines
The following show the supply routing guidelines:
 For power supply routing, the power trace for VBAT must be at least
40 mil wide.



The 1.8-V trace must be at least 18 mil wide.
Make VBAT traces as wide as possible to ensure reduced
inductance and trace resistance.
If possible, shield VBAT traces with ground above, below, and
beside the traces.
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Doc No: WG1300BE00 EM Board-UG-R02
5. APPLICATION DEVELOPMENT
Texas Instrument had developed a HOST platform, MSP-EXP430FR5730,
for evaluating CC3000-based SiP Module. Figure 4 shows the platform
and WG1300BE00 EM Board
Figure 4. MSP-EXP430FR5730 and WG1300BE00 EM Board
The MSP-EXP430FR5739 test platform can be ordered as the link below.
http://www.ti.com/tool/msp-exp430fr5739
Specific application examples can refer to the link below
http://processors.wiki.ti.com/index.php/CC3000 Wi-Fi for MCU
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6. HISTORY CHANGE
Revision Date
Description
R 0.1
2013/7/22
Release 0.1
R 0.2
2014/May/22
Add
3. Antenna Characteristics
4. Layout Guidelines
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