Jorjin Technologies WG6031 WLAN module User Manual 1

Jorjin Technologies Inc. WLAN module 1

Users Manual

Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL a module solution provider WG6031-00 WLAN Module Realtek RTL8189EM IEEE 802.11b/g/n 1T/1R Solution with SDIO/SPI Interface Datasheet Draft 0.2 Prepared By Reviewed By Approved By
Doc No: WG6031-00-DTS-D02 Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 1 Index 1. HISTORY CHANGE .............................................................................................................................. 2 2. GENERAL DESCRIPTION ..................................................................................................................... 3 2.1. FEATURES ........................................................................................................................................ 3 3. MODULE BLOCK DIAGRAM ............................................................................................................... 4 4. MODULE OUTLINE ............................................................................................................................. 5 4.1. SIGNAL LAYOUT (TOP VIEW) ............................................................................................................... 5 4.2. PIN DESCRIPTION ............................................................................................................................. 6 5. MODULE SPECIFICATION ................................................................................................................... 7 5.1. GENERAL MODULE REQUIREMENTS AND OPERATION .............................................................................. 7 5.1.1. Temperature Limit Ratings ................................................................................................... 7 5.1.2. DC Power Supply Characteristics .......................................................................................... 7 5.1.3. Digital IO DC Characteristics ................................................................................................ 7 5.2. WLAN RF PERFORMANCE ................................................................................................................. 8 5.2.1. WLAN 2.4-GHz Receiver Characteristics .............................................................................. 8 5.2.2. WLAN 2.4-GHz Transmitter Power ....................................................................................... 8 6. REFERENCE SCHEMATICS ................................................................................................................... 9 7. PACKAGE INFORMATION ................................................................................................................. 10 7.1. MODULE MECHANICAL OUTLINE ........................................................................................................ 10 7.2. ORDERING INFORMATION ............................................................................................................ 11 7.3. MODULE MARKING ..................................................................................................................... 11 7.4. CERTIFICATION INFORMATION ............................................................................................................ 11 8. SMT AND BAKING RECOMMENDATION ......................................................................................... 12 8.1. BAKING RECOMMENDATION ............................................................................................................. 12 8.2. SMT RECOMMENDATION ................................................................................................................ 12 9. REGULATORY INFORMATION .......................................................................................................... 14 9.1. UNITED STATES .............................................................................................................................. 14
Doc No: WG6031-00-DTS-D02 Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 2 1. HISTORY CHANGE Revision Date Description Draft 0.1 2017-06-05 Initial Document creation. Draft 0.2 2017-10-06 1. Updated SDIO information. 2. Corrected RF Performance. 3. Updated Module Size tolerance. 4. Added Module Package Marking and Regulatory Information.
Doc No: WG6031-00-DTS-D02 Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 3 2. GENERAL DESCRIPTION The WG6031-00 is a 802.11b/g/n 1T1R Wireless LAN SiP (system in package) module with SDIO/SPI interface. The WG6031-00 provides a complete solution for a high throughput performance integrated wireless LAN device. 2.1. Features  Dimension 13mm(L) x 13mm(W) x 2.35mm(H).  LGA-20 pin package.  CMOS MAC, Baseband PHY, and RF in a single chip for 802.11b/g/n compatible WLAN.  Complete 802.11n solution for 2.4GHz band.  72.2Mbps receive PHY rate and 72.2Mbps transmit PHY rate using 20MHz bandwidth.  150Mbps receive PHY rate and 150Mbps transmit PHY rate using 40MHz bandwidth.  Compatible with 802.11n specification.  Backward compatible with 802.11b/g device while operating in 802.11n mode.  Operating temperature: 0°C to 70°C
Doc No: WG6031-00-DTS-D02 Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 4 3. MODULE BLOCK DIAGRAM Figure 3-1. WG6031-00 Block Diagram RTL8189EM Xtal 40MHz TX/RX Matching Circuit Internal RF Connector External RF Design (Default) SDIO/SPI Interface VDD33
Doc No: WG6031-00-DTS-D02 Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 5 4. MODULE OUTLINE 4.1. Signal Layout (Top View) Figure 4-1 Device pins (Top View)
Doc No: WG6031-00-DTS-D02 Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 6 4.2. Pin Description Pin Signal Name Type Description 1 GND Power Ground 2 GND Power Ground 3 GND Power Ground 4 NC (1) I/O SPI not Connection / SDIO D3 5 SPI_IRQ O SPI Interrupt Output / SDIO D2 6 SPI_SS I SPI Slave Select / SDIO D1 7 SPI_MISO O SPI Master in Slave out / SDIO D0 8 SPI_MOSI I SPI Master out Slave in / SDIO Command Input 9 SPI_CLK I SPI Clock Input / SDIO Clock Input 10 RESET I Hardware Reset 11 WAKE I/O General Purpose Input / Output Pin 12 GND Power Ground 13 VDD Power Power supply input. Typical 3.3V. 14 VDD Power Power supply input. Typical 3.3V. 15 GND Power Ground. 16 GND Power Ground. 17 GND Power Ground. 18 RF_OUT RF WLAN 2.4GHz External RF port. 19 GND Power Ground. 20 PGND Power Ground. Module Thermal PAD. (1) SPI interface: this pin is no used. / SDIO interface: this pin is defined SDIO_D3.
Doc No: WG6031-00-DTS-D02 Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 7 5. MODULE SPECIFICATION 5.1. General Module Requirements and Operation 5.1.1. Temperature Limit Ratings Parameter Min Max Units Storage Temperature -40 +125 ℃ Ambient Operating 0 +70 ℃ 5.1.2. DC Power Supply Characteristics Parameter Condition Min Typical Max Units VDD DC supply Voltage 3.0 3.3 3.6 V 5.1.3. Digital IO DC Characteristics Parameter Condition Min Normal Max Units VIH Input high voltage 2.0 3.3 3.6 V VIL Input low voltage - 0 0.9 V VOH Output high voltage 2.97 - 3.3 V VOL Output low voltage 0 - 0.33 V
Doc No: WG6031-00-DTS-D02 Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 8 5.2. WLAN RF Performance 5.2.1. WLAN 2.4-GHz Receiver Characteristics Parameter Condition Min Typ Max Units Operation frequency range 2412 2484 MHz Sensitivity At < 8% PER limit 1 Mbps DSSS -95 dBm 11 Mbps CCK -86 At < 10% PER At < 10% PER limit 6 Mbps OFDM -91 54 Mbps OFDM -74 MCS0 MM -90 MCS7 MM -71 MCS0 MM 40MHz -87 MCS7 MM 40MHz -68 5.2.2. WLAN 2.4-GHz Transmitter Power Parameter Condition Min Typ Max Output Power 11 Mbps CCK 17 – dBm 54 Mbps OFDM 15 – MCS7 MM 14 – MCS7 MM 40MHz 14 – Frequency Accuracy -20 +20 ppm
Doc No: WG6031-00-DTS-D02 Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 9 6. REFERENCE SCHEMATICS TP21R4 0R0402 RESETVDD33C10.1uF0402C210uF0603R1 0R0402R2 0R0402R3 0R0402SPI_IRQC3 NU0402SPI_MISOSPI_SSC4 NU0402C5 NU0402TP1 1R6 0R0402 C7 NU0402SPI_CLKR5 0R0402SPI_MOSIC6 NU0402RF_OUTL1NLIND1005C810pFCAP1005L2NLIND1005ANT112 Pi-Circuit for Antenna matching.U1WG6031-00 ModuleE-13X13-N20-1.2-TOP3.3V 14GND 17RF OUT 18GND 19RESET 10WAKE 11SPI_IRQ/SD_D25NC/SD_D34SPI_MOSI/SD_CMD8SPI_CLK/SD_CLK 9SPI_MISO/SD_D07SPI_SS/SD_D16GND 123.3V 13PGND 20GND 15GND 16GND3GND1GND2 PIN-4 defined as SDIO_D3 if SDIO interface.
Doc No: WG6031-00-DTS-D02 Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 10 7. PACKAGE INFORMATION 7.1. Module mechanical outline Figure 6-1 Module Pad Dimensions
Doc No: WG6031-00-DTS-D02 Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 11 Marking Min Nom Max Marking Min Nom MaxL (Body size) 12.85 13.00 13.15 b 0.75 0.80 0.85W (Body size) 12.85 13.00 13.15 b1 0.10 0.15 0.20T (Thickness) 2.15 2.35 2.55 b2 4.65 4.70 4.75a 0.55 0.60 0.65 b3 5.85 5.90 5.95a1 1.05 1.10 1.15 c 2.95 3.00 3.05a2 1.15 1.20 1.25 c1 7.55 7.60 7.65a3 3.55 3.60 3.65 c2 4.45 4.50 4.55 Table 7-1. Dimensions for Module Mechanical Outline 7.2. Ordering Information Part number: WG6031-00A 7.3. Module Marking LTC : Date Code , YYWWSSFA YY = Digit of the year, ex: 2017=17 WW = Week (01~52) SS = Serial number from 01 ~99 match to manufacture’s lot number. F = Reserve for internal use. A = Module version. 7.4. Certification Information  FCC : WS2-WG6031, FCC grant ID  TELEC : R 201-170841, TELEC grant ID and compliance mark  CE : CE compliance mark
Doc No: WG6031-00-DTS-D02 Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 12 8. SMT AND BAKING RECOMMENDATION 8.1. Baking Recommendation  Baking condition： - Follow MSL Level 4 to do baking process. - After bag is opened, devices that will be subjected to reflow solder or other high temperature process must be a) Mounted within 72 hours of factory conditions <30°C/60% RH, or b) Stored at <10% RH. - Devices require bake, before mounting, if Humidity Indicator Card reads >10% If baking is required, Devices may be baked for 8 hrs at 125 °C. 8.2. SMT Recommendation  Recommended Reflow profile： H
Doc No: WG6031-00-DTS-D02 Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 13 No. Item Temperature (°C) Time (sec) 1 Pre-heat D1: 140 ~ D2: 200 T1: 80 ~ 120 2 Soldering D2: = 220 T2: 60 ± 10 3 Peak-Temp. D3: 250 °C max Note: (1) Reflow soldering is recommended two times maximum. (1) Add Nitrogen while Reflow process： SMT solder ability will be better.  Stencil thickness： 0.1~ 0.15 mm (Recommended)  Soldering paste (without Pb)： Recommended SENJU N705-GRN3360-K2-V can get better soldering effects.
Doc No: WG6031-00-DTS-D02 Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 14 9. REGULATORY INFORMATION This section outlines the regulatory information for the following countries:  United States  Europe  Japan 9.1. United States Federal Communications Commission Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation.
Doc No: WG6031-00-DTS-D02 Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 15 FCC RF Radiation Exposure Statement: This device complies with FCC radiation exposure limits set forth for an uncontrolled environment and it also complies with Part 15 of the FCC RF Rules. This device is intended only for OEM integrators under the following conditions: (1) The antenna must be installed such that 20cm is maintained between the antenna and users, and (2) The transmitter module may not be co-located with any other transmitter or antenna, (3) For all products market in US, OEM has to limit the operation channels in CH1 to CH11 for 2.4Gband by supplied firmware programming tool. OEM shall not supply any tool or info to the end-user regarding to Regulatory Domain change. As long as 3 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Important Note: In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling: The final end product must be labelled in a visible area with the following: “Contains FCC ID: WS2-WG6031”. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.

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