Jorjin Technologies WG6031 WLAN module User Manual 1
Jorjin Technologies Inc. WLAN module 1
Users Manual
a module solution provider WG6031-00 WLAN Module Realtek RTL8189EM IEEE 802.11b/g/n 1T/1R Solution with SDIO/SPI Interface Datasheet Draft 0.2 Prepared By Reviewed By Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Approved By Doc No: WG6031-00-DTS-D02 Index 1. HISTORY CHANGE .............................................................................................................................. 2 2. GENERAL DESCRIPTION ..................................................................................................................... 3 2.1. FEATURES........................................................................................................................................ 3 3. MODULE BLOCK DIAGRAM ............................................................................................................... 4 4. MODULE OUTLINE ............................................................................................................................. 5 4.1. SIGNAL LAYOUT (TOP VIEW) ............................................................................................................... 5 4.2. PIN DESCRIPTION ............................................................................................................................. 6 5. MODULE SPECIFICATION ................................................................................................................... 7 5.1. GENERAL MODULE REQUIREMENTS AND OPERATION .............................................................................. 7 5.1.1. Temperature Limit Ratings ................................................................................................... 7 5.1.2. DC Power Supply Characteristics .......................................................................................... 7 5.1.3. Digital IO DC Characteristics ................................................................................................ 7 5.2. WLAN RF PERFORMANCE ................................................................................................................. 8 5.2.1. WLAN 2.4-GHz Receiver Characteristics .............................................................................. 8 5.2.2. WLAN 2.4-GHz Transmitter Power ....................................................................................... 8 6. REFERENCE SCHEMATICS................................................................................................................... 9 7. PACKAGE INFORMATION ................................................................................................................. 10 7.1. MODULE MECHANICAL OUTLINE ........................................................................................................ 10 7.2. ORDERING INFORMATION ............................................................................................................11 7.3. MODULE MARKING .....................................................................................................................11 7.4. CERTIFICATION INFORMATION ............................................................................................................11 8. SMT AND BAKING RECOMMENDATION ......................................................................................... 12 8.1. BAKING RECOMMENDATION ............................................................................................................. 12 8.2. SMT RECOMMENDATION ................................................................................................................ 12 9. REGULATORY INFORMATION .......................................................................................................... 14 9.1. UNITED STATES .............................................................................................................................. 14 Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 1 Doc No: WG6031-00-DTS-D02 1. HISTORY CHANGE Revision Date Description Draft 0.1 2017-06-05 Initial Document creation. Draft 0.2 2017-10-06 1. 2. 3. 4. Updated SDIO information. Corrected RF Performance. Updated Module Size tolerance. Added Module Package Marking and Regulatory Information. Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 2 Doc No: WG6031-00-DTS-D02 2. GENERAL DESCRIPTION The WG6031-00 is a 802.11b/g/n 1T1R Wireless LAN SiP (system in package) module with SDIO/SPI interface. The WG6031-00 provides a complete solution for a high throughput performance integrated wireless LAN device. 2.1. Features Dimension 13mm(L) x 13mm(W) x 2.35mm(H). LGA-20 pin package. CMOS MAC, Baseband PHY, and RF in a single chip for 802.11b/g/n compatible WLAN. Complete 802.11n solution for 2.4GHz band. 72.2Mbps receive PHY rate and 72.2Mbps transmit PHY rate using 20MHz bandwidth. 150Mbps receive PHY rate and 150Mbps transmit PHY rate using 40MHz bandwidth. Compatible with 802.11n specification. Backward compatible with 802.11b/g device while operating in 802.11n mode. Operating temperature: 0°C to 70°C Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 3 Doc No: WG6031-00-DTS-D02 3. MODULE BLOCK DIAGRAM Xtal 40MHz External RF Design (Default) Internal RF Connector RTL8189EM VDD33 TX/RX Matching Circuit SDIO/SPI Interface Figure 3-1. WG6031-00 Block Diagram Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 4 Doc No: WG6031-00-DTS-D02 4. MODULE OUTLINE 4.1. Signal Layout (Top View) Figure 4-1 Device pins (Top View) Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 5 Doc No: WG6031-00-DTS-D02 4.2. Pin Description Pin Signal Name Type GND Power Ground GND Power Ground GND Power Ground (1) NC Description I/O SPI not Connection / SDIO D3 SPI_IRQ SPI Interrupt Output / SDIO D2 SPI_SS SPI Slave Select / SDIO D1 SPI_MISO SPI Master in Slave out / SDIO D0 SPI_MOSI SPI Master out Slave in / SDIO Command Input SPI_CLK SPI Clock Input / SDIO Clock Input 10 RESET Hardware Reset 11 WAKE I/O 12 GND Power Ground 13 VDD Power Power supply input. Typical 3.3V. 14 VDD Power Power supply input. Typical 3.3V. 15 GND Power Ground. 16 GND Power Ground. 17 GND Power Ground. 18 RF_OUT RF 19 GND Power Ground. 20 PGND Power Ground. Module Thermal PAD. General Purpose Input / Output Pin WLAN 2.4GHz External RF port. (1) SPI interface: this pin is no used. / SDIO interface: this pin is defined SDIO_D3. Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 6 Doc No: WG6031-00-DTS-D02 5. MODULE SPECIFICATION 5.1. General Module Requirements and Operation 5.1.1. Temperature Limit Ratings Parameter Min Max Units Storage Temperature -40 +125 ℃ Ambient Operating +70 ℃ 5.1.2. DC Power Supply Characteristics Parameter Condition Min Typical Max Units VDD DC supply Voltage 3.0 3.3 3.6 5.1.3. Digital IO DC Characteristics Parameter Condition Min Normal Max Units VIH Input high voltage 2.0 3.3 3.6 VIL Input low voltage 0.9 VOH Output high voltage 2.97 3.3 VOL Output low voltage 0.33 Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 7 Doc No: WG6031-00-DTS-D02 5.2. WLAN RF Performance 5.2.1. WLAN 2.4-GHz Receiver Characteristics Parameter Condition Min Operation frequency range 2412 At < 8% PER limit Sensitivity Typ At < 10% PER At < 10% PER limit 1 Mbps DSSS -95 11 Mbps CCK -86 6 Mbps OFDM -91 54 Mbps OFDM -74 MCS0 MM -90 MCS7 MM -71 MCS0 MM 40MHz -87 MCS7 MM 40MHz -68 Max Units 2484 MHz dBm 5.2.2. WLAN 2.4-GHz Transmitter Power Parameter Output Power Frequency Accuracy Condition Min Typ Max 11 Mbps CCK 17 – 54 Mbps OFDM 15 – MCS7 MM 14 – MCS7 MM 40MHz 14 – -20 Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL dBm +20 ppm Page 8 Doc No: WG6031-00-DTS-D02 6. REFERENCE SCHEMATICS C8 10pF CAP1005 ANT1 RF_OUT L1 NL IND1005 L2 NL IND1005 PIN-4 defined as SDIO_D3 if SDIO interface. TP1 C3 C4 C5 C6 NU 0402 NU 0402 NU 0402 NU 0402 SPI_IRQ R1 SPI_SS R2 SPI_MISO R3 SPI_MOSI R5 0R 0402 0R 0402 0R 0402 0R 0402 17 GND 19 18 RF OUT GND PGND GND 20 Pi-Circuit for Antenna matching. GND GND U1 GND GND WG6031-00 Module 3.3V NC/SD_D3 E-13X13-N20-1.2-TOP 3.3V SPI_IRQ/SD_D2 SPI_SS/SD_D1 SPI_MISO/SD_D0 SPI_MOSI/SD_CMD GND WAKE RESET SPI_CLK/SD_CLK Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL 16 VDD33 15 14 13 C1 0.1uF 0402 12 11 10 R4 R6 TP2 0R 0402 0R 0402 RESET SPI_CLK C7 Page 9 NU 0402 C2 10uF 0603 Doc No: WG6031-00-DTS-D02 7. PACKAGE INFORMATION 7.1. Module mechanical outline Figure 6-1 Module Pad Dimensions Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 10 Doc No: WG6031-00-DTS-D02 Marking L (Body size) W (Body size) T (Thickness) a1 a2 a3 Min 12.85 12.85 2.15 0.55 1.05 1.15 3.55 Nom 13.00 13.00 2.35 0.60 1.10 1.20 3.60 Max 13.15 13.15 2.55 0.65 1.15 1.25 3.65 Marking b1 b2 b3 c1 c2 Min 0.75 0.10 4.65 5.85 2.95 7.55 4.45 Nom 0.80 0.15 4.70 5.90 3.00 7.60 4.50 Max 0.85 0.20 4.75 5.95 3.05 7.65 4.55 Table 7-1. Dimensions for Module Mechanical Outline 7.2. Ordering Information Part number: WG6031-00A 7.3. Module Marking LTC : Date Code , YYWWSSFA YY = Digit of the year, ex: 2017=17 WW = Week (01~52) SS = Serial number from 01 ~99 match to manufacture’s lot number. = Reserve for internal use. A = Module version. 7.4. Certification Information FCC : WS2-WG6031, FCC grant ID TELEC : R 201-170841, TELEC grant ID and compliance mark CE : CE compliance mark Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 11 Doc No: WG6031-00-DTS-D02 8. SMT AND BAKING RECOMMENDATION 8.1. Baking Recommendation Baking condition: Follow MSL Level 4 to do baking process. After bag is opened, devices that will be subjected to reflow solder or other high temperature process must be a) Mounted within 72 hours of factory conditions <30°C/60% RH, or b) Stored at <10% RH. - Devices require bake, before mounting, if Humidity Indicator Card reads >10% If baking is required, Devices may be baked for 8 hrs at 125 °C. 8.2. SMT Recommendation Recommended Reflow profile: Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 12 Doc No: WG6031-00-DTS-D02 No. Item Temperature (°C) Time (sec) Pre-heat D1: 140 ~ D2: 200 T1: 80 ~ 120 Soldering D2: = 220 T2: 60 ± 10 Peak-Temp. D3: 250 °C max Note: (1) Reflow soldering is recommended two times maximum. (1) Add Nitrogen while Reflow process: SMT solder ability will be better. Stencil thickness: 0.1~ 0.15 mm (Recommended) Soldering paste (without Pb): Recommended SENJU N705-GRN3360-K2-V can get better soldering effects. Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 13 Doc No: WG6031-00-DTS-D02 9. REGULATORY INFORMATION This section outlines the regulatory information for the following countries: United States Europe Japan 9.1. United States Federal Communications Commission Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 14 Doc No: WG6031-00-DTS-D02 FCC RF Radiation Exposure Statement: This device complies with FCC radiation exposure limits set forth for an uncontrolled environment and it also complies with Part 15 of the FCC RF Rules. This device is intended only for OEM integrators under the following conditions: (1) The antenna must be installed such that 20cm is maintained between the antenna and users, and (2) The transmitter module may not be co-located with any other transmitter or antenna, (3) For all products market in US, OEM has to limit the operation channels in CH1 to CH11 for 2.4Gband by supplied firmware programming tool. OEM shall not supply any tool or info to the end-user regarding to Regulatory Domain change. As long as 3 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Important Note: In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling: The final end product must be labelled in a visible area with the following: “Contains FCC ID: WS2-WG6031”. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 15
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