Jorjin Technologies WG6031 WLAN module User Manual 1

Jorjin Technologies Inc. WLAN module 1

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Document ID3598588
Application IDTN/jbdcSfi3MITpc1HNBjQ==
Document DescriptionUsers Manual
Short Term ConfidentialNo
Permanent ConfidentialNo
SupercedeNo
Document TypeUser Manual
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Filesize79.25kB (990609 bits)
Date Submitted2017-10-11 00:00:00
Date Available2017-10-12 00:00:00
Creation Date2017-10-06 11:19:04
Producing SoftwareMicrosoft® Word 2010
Document Lastmod2017-10-06 11:19:04
Document Title1
Document CreatorMicrosoft® Word 2010
Document Author: Hsinwei

a module solution provider
WG6031-00 WLAN Module
Realtek RTL8189EM IEEE 802.11b/g/n
1T/1R Solution with SDIO/SPI Interface
Datasheet
Draft 0.2
Prepared By
Reviewed By
Copyright © JORJIN TECHNOLOGIES INC. 2017
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Approved By
Doc No: WG6031-00-DTS-D02
Index
1. HISTORY CHANGE .............................................................................................................................. 2
2. GENERAL DESCRIPTION ..................................................................................................................... 3
2.1. FEATURES........................................................................................................................................ 3
3. MODULE BLOCK DIAGRAM ............................................................................................................... 4
4. MODULE OUTLINE ............................................................................................................................. 5
4.1. SIGNAL LAYOUT (TOP VIEW) ............................................................................................................... 5
4.2. PIN DESCRIPTION ............................................................................................................................. 6
5. MODULE SPECIFICATION ................................................................................................................... 7
5.1. GENERAL MODULE REQUIREMENTS AND OPERATION .............................................................................. 7
5.1.1. Temperature Limit Ratings ................................................................................................... 7
5.1.2. DC Power Supply Characteristics .......................................................................................... 7
5.1.3. Digital IO DC Characteristics ................................................................................................ 7
5.2. WLAN RF PERFORMANCE ................................................................................................................. 8
5.2.1. WLAN 2.4-GHz Receiver Characteristics .............................................................................. 8
5.2.2. WLAN 2.4-GHz Transmitter Power ....................................................................................... 8
6. REFERENCE SCHEMATICS................................................................................................................... 9
7. PACKAGE INFORMATION ................................................................................................................. 10
7.1. MODULE MECHANICAL OUTLINE ........................................................................................................ 10
7.2. ORDERING INFORMATION ............................................................................................................11
7.3. MODULE MARKING .....................................................................................................................11
7.4. CERTIFICATION INFORMATION ............................................................................................................11
8. SMT AND BAKING RECOMMENDATION ......................................................................................... 12
8.1. BAKING RECOMMENDATION ............................................................................................................. 12
8.2. SMT RECOMMENDATION ................................................................................................................ 12
9. REGULATORY INFORMATION .......................................................................................................... 14
9.1. UNITED STATES .............................................................................................................................. 14
Copyright © JORJIN TECHNOLOGIES INC. 2017
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Doc No: WG6031-00-DTS-D02
1. HISTORY CHANGE
Revision
Date
Description
Draft 0.1
2017-06-05
Initial Document creation.
Draft 0.2
2017-10-06
1.
2.
3.
4.
Updated SDIO information.
Corrected RF Performance.
Updated Module Size tolerance.
Added Module Package Marking and Regulatory
Information.
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Doc No: WG6031-00-DTS-D02
2. GENERAL DESCRIPTION
The WG6031-00 is a 802.11b/g/n 1T1R Wireless LAN SiP (system in package) module with
SDIO/SPI interface. The WG6031-00 provides a complete solution for a high throughput
performance integrated wireless LAN device.
2.1. Features
 Dimension 13mm(L) x 13mm(W) x 2.35mm(H).
 LGA-20 pin package.
 CMOS MAC, Baseband PHY, and RF in a single chip for 802.11b/g/n compatible WLAN.
 Complete 802.11n solution for 2.4GHz band.
 72.2Mbps receive PHY rate and 72.2Mbps transmit PHY rate using 20MHz bandwidth.




150Mbps receive PHY rate and 150Mbps transmit PHY rate using 40MHz bandwidth.
Compatible with 802.11n specification.
Backward compatible with 802.11b/g device while operating in 802.11n mode.
Operating temperature: 0°C to 70°C
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Doc No: WG6031-00-DTS-D02
3. MODULE BLOCK DIAGRAM
Xtal
40MHz
External
RF Design
(Default)
Internal
RF Connector
RTL8189EM
VDD33
TX/RX
Matching
Circuit
SDIO/SPI
Interface
Figure 3-1. WG6031-00 Block Diagram
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Doc No: WG6031-00-DTS-D02
4. MODULE OUTLINE
4.1. Signal Layout (Top View)
Figure 4-1 Device pins (Top View)
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Doc No: WG6031-00-DTS-D02
4.2. Pin Description
Pin
Signal Name
Type
GND
Power
Ground
GND
Power
Ground
GND
Power
Ground
(1)
NC
Description
I/O
SPI not Connection / SDIO D3
SPI_IRQ
SPI Interrupt Output / SDIO D2
SPI_SS
SPI Slave Select / SDIO D1
SPI_MISO
SPI Master in Slave out / SDIO D0
SPI_MOSI
SPI Master out Slave in / SDIO Command Input
SPI_CLK
SPI Clock Input / SDIO Clock Input
10
RESET
Hardware Reset
11
WAKE
I/O
12
GND
Power
Ground
13
VDD
Power
Power supply input. Typical 3.3V.
14
VDD
Power
Power supply input. Typical 3.3V.
15
GND
Power
Ground.
16
GND
Power
Ground.
17
GND
Power
Ground.
18
RF_OUT
RF
19
GND
Power
Ground.
20
PGND
Power
Ground. Module Thermal PAD.
General Purpose Input / Output Pin
WLAN 2.4GHz External RF port.
(1) SPI interface: this pin is no used. / SDIO interface: this pin is defined SDIO_D3.
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Doc No: WG6031-00-DTS-D02
5. MODULE SPECIFICATION
5.1. General Module Requirements and Operation
5.1.1. Temperature Limit Ratings
Parameter
Min
Max
Units
Storage Temperature
-40
+125
℃
Ambient Operating
+70
℃
5.1.2. DC Power Supply Characteristics
Parameter
Condition
Min
Typical
Max
Units
VDD
DC supply Voltage
3.0
3.3
3.6
5.1.3. Digital IO DC Characteristics
Parameter
Condition
Min
Normal
Max
Units
VIH
Input high voltage
2.0
3.3
3.6
VIL
Input low voltage
0.9
VOH
Output high voltage
2.97
3.3
VOL
Output low voltage
0.33
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Doc No: WG6031-00-DTS-D02
5.2. WLAN RF Performance
5.2.1. WLAN 2.4-GHz Receiver Characteristics
Parameter
Condition
Min
Operation frequency range
2412
At < 8% PER limit
Sensitivity
Typ
At < 10% PER At
< 10% PER limit
1 Mbps DSSS
-95
11 Mbps CCK
-86
6 Mbps OFDM
-91
54 Mbps OFDM
-74
MCS0 MM
-90
MCS7 MM
-71
MCS0 MM 40MHz
-87
MCS7 MM 40MHz
-68
Max
Units
2484
MHz
dBm
5.2.2. WLAN 2.4-GHz Transmitter Power
Parameter
Output Power
Frequency Accuracy
Condition
Min
Typ
Max
11 Mbps CCK
17
–
54 Mbps OFDM
15
–
MCS7 MM
14
–
MCS7 MM 40MHz
14
–
-20
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dBm
+20
ppm
Page 8
Doc No: WG6031-00-DTS-D02
6. REFERENCE SCHEMATICS
C8
10pF
CAP1005
ANT1
RF_OUT
L1
NL
IND1005
L2
NL
IND1005
PIN-4 defined as SDIO_D3
if SDIO interface.
TP1
C3
C4
C5
C6
NU
0402
NU
0402
NU
0402
NU
0402
SPI_IRQ
R1
SPI_SS
R2
SPI_MISO
R3
SPI_MOSI
R5
0R
0402
0R
0402
0R
0402
0R
0402
17
GND
19
18
RF OUT
GND
PGND
GND
20
Pi-Circuit for Antenna matching.
GND
GND
U1
GND
GND
WG6031-00 Module
3.3V
NC/SD_D3
E-13X13-N20-1.2-TOP
3.3V
SPI_IRQ/SD_D2
SPI_SS/SD_D1
SPI_MISO/SD_D0
SPI_MOSI/SD_CMD
GND
WAKE
RESET
SPI_CLK/SD_CLK
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16
VDD33
15
14
13
C1
0.1uF
0402
12
11
10 R4
R6
TP2
0R
0402
0R
0402
RESET
SPI_CLK
C7
Page 9
NU
0402
C2
10uF
0603
Doc No: WG6031-00-DTS-D02
7. PACKAGE INFORMATION
7.1. Module mechanical outline
Figure 6-1 Module Pad Dimensions
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Doc No: WG6031-00-DTS-D02
Marking
L (Body size)
W (Body size)
T (Thickness)
a1
a2
a3
Min
12.85
12.85
2.15
0.55
1.05
1.15
3.55
Nom
13.00
13.00
2.35
0.60
1.10
1.20
3.60
Max
13.15
13.15
2.55
0.65
1.15
1.25
3.65
Marking
b1
b2
b3
c1
c2
Min
0.75
0.10
4.65
5.85
2.95
7.55
4.45
Nom
0.80
0.15
4.70
5.90
3.00
7.60
4.50
Max
0.85
0.20
4.75
5.95
3.05
7.65
4.55
Table 7-1. Dimensions for Module Mechanical Outline
7.2. Ordering Information
Part number:
WG6031-00A
7.3. Module Marking
LTC : Date Code , YYWWSSFA
YY = Digit of the year, ex: 2017=17
WW = Week (01~52)
SS = Serial number from 01 ~99 match to
manufacture’s lot number.
= Reserve for internal use.
A = Module version.
7.4. Certification Information



FCC : WS2-WG6031, FCC grant ID
TELEC : R 201-170841, TELEC grant ID and compliance mark
CE : CE compliance mark
Copyright © JORJIN TECHNOLOGIES INC. 2017
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Doc No: WG6031-00-DTS-D02
8. SMT AND BAKING RECOMMENDATION
8.1. Baking Recommendation

Baking condition:
Follow MSL Level 4 to do baking process.
After bag is opened, devices that will be subjected to reflow solder or other high
temperature process must be
a) Mounted within 72 hours of factory conditions <30°C/60% RH, or
b) Stored at <10% RH.
- Devices require bake, before mounting, if Humidity Indicator Card reads >10%
If baking is required, Devices may be baked for 8 hrs at 125 °C.
8.2. SMT Recommendation

Recommended Reflow profile:
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Doc No: WG6031-00-DTS-D02
No.
Item
Temperature (°C)
Time (sec)
Pre-heat
D1: 140 ~ D2: 200
T1: 80 ~ 120
Soldering
D2: = 220
T2: 60 ± 10
Peak-Temp.
D3: 250 °C max
Note: (1) Reflow soldering is recommended two times maximum.
(1) Add Nitrogen while Reflow process: SMT solder ability will be better.


Stencil thickness: 0.1~ 0.15 mm (Recommended)
Soldering paste (without Pb): Recommended SENJU N705-GRN3360-K2-V can get better
soldering effects.
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Doc No: WG6031-00-DTS-D02
9. REGULATORY INFORMATION
This section outlines the regulatory information for the following countries:
 United States
 Europe
 Japan
9.1. United States
Federal Communications Commission Statement
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates, uses and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
- Consult the dealer or an experienced radio/TV technician for help.
FCC Caution:
Any changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause
undesired operation.
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Doc No: WG6031-00-DTS-D02
FCC RF Radiation Exposure Statement:
This device complies with FCC radiation exposure limits set forth for an uncontrolled
environment and it also complies with Part 15 of the FCC RF Rules.
This device is intended only for OEM integrators under the following conditions:
(1) The antenna must be installed such that 20cm is maintained between the antenna and users,
and
(2) The transmitter module may not be co-located with any other transmitter or antenna,
(3) For all products market in US, OEM has to limit the operation channels in CH1 to CH11 for
2.4Gband by supplied firmware programming tool. OEM shall not supply any tool or info to the
end-user regarding to Regulatory Domain change.
As long as 3 conditions above are met, further transmitter test will not be required. However,
the OEM integrator is still responsible for testing their end-product for any additional compliance
requirements required with this module installed.
Important Note:
In the event that these conditions cannot be met (for example certain laptop configurations or
co-location with another transmitter), then the FCC authorization is no longer considered valid and
the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be
responsible for re-evaluating the end product (including the transmitter) and obtaining a separate
FCC authorization.
End Product Labeling:
The final end product must be labelled in a visible area with the following:
“Contains FCC ID: WS2-WG6031”.
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how
to install or remove this RF module in the user’s manual of the end product which integrates this
module.
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Source Exif Data:
File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.5
Linearized                      : No
Page Count                      : 16
Language                        : zh-TW
Tagged PDF                      : Yes
Title                           : 1
Author                          : Hsinwei
Creator                         : Microsoft® Word 2010
Create Date                     : 2017:10:06 11:19:04+08:00
Modify Date                     : 2017:10:06 11:19:04+08:00
Producer                        : Microsoft® Word 2010
EXIF Metadata provided by EXIF.tools
FCC ID Filing: WS2-WG6031

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