Jorjin Technologies WG6611 WLAN module User Manual 1

Jorjin Technologies Inc. WLAN module 1

Users Manual

            Doc No: WG6611-00-DTS-D08                                                                                               Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 1 Index  1. HISTORY CHANGE ....................................................................................................................... 2 2. GENERAL DESCRIPTION ........................................................................................................... 3 3. FUNCTIONAL FEATURES ........................................................................................................... 4 3.1. MODULE BLOCK DIAGRAM .......................................................................................................... 4 3.2. PIN ASSIGNMENT (TOP VIEW) ....................................................................................................... 5 3.3. PIN DESCRIPTION ......................................................................................................................... 6 4. FUNCTIONAL SPECIFICATION ................................................................................................ 7 4.1. TEMPERATURE LIMIT RATINGS ................................................................................................... 10 4.2. DC POWER SUPPLY ............................................................................................................... 10 4.3. CURRENT CONSUMPTION ............................................................................................................ 11 4.4. WLAN 2.4-GHZ RF PERFORMANCE .......................................................................................... 12 4.5. PIN FUNCTION TABLE ................................................................................................................. 13 5. REFFERENCE SCHEMATIC ...................................................................................................... 14 5.1. APPLICATION REFERENCE CIRCUIT ............................................................................................ 14 6. PACKAGE INFORMATION ......................................................................................................... 15 6.1. MODULE MECHANICAL OUTLINE ................................................................................................ 15 6.2. PACKAGE MARKING ................................................................................................................... 17 7. SMT AND BAKING RECOMMENDATION ............................................................................. 18 7.1. BAKING RECOMMENDATION ...................................................................................................... 18 7.2. SMT RECOMMENDATION ........................................................................................................... 18
            Doc No: WG6611-00-DTS-D08                                                                                               Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 2 1.    HISTORY CHANGE Revision Date Description D0.1 2016-01-13 Initial Document creation. D0.2 2016-02-26 Verify Current Consumption D0.3 2016-03-08 Verify Application Reference Circuit D0.4 2016-03-17 Modify Functional Specification remove Certification     D0.5 2016-06-21 1. Modify Functional Specification increased IPEX Connector   2. Cover modify Series Specifications 3. Modify Module Block Diagram D0.6 2016-09-20 1. Modify Application Reference Circuit   2. Modify pin Description 3. Modify Module Block Diagram D0.7 2016-10-13 1. Remove SDIO Interface 2. Add package marking  D0.8 2017-06-29 1. Remove NFC function 2. Modify schematic pin define
            Doc No: WG6611-00-DTS-D08                                                                                               Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 3 2.  GENERAL DESCRIPTION    WG6611-00 is a single chip wireless Internet-of-Things module. The advance Realtek RTL8711AM is a highly integrated single-chip low power 802.11n Wireless LAN (WLAN) network controller. It combines an ARM-Cortex M3 MCU, WLAN MAC, a 1T1R capable   WLAN baseband, and RF in a single chip. It also provides a bunch of configurable GPIOs   which are configured as digital peripherals for different applications and control usage.      RTL8711AM integrates internal memories for complete WIFI protocol functions. The embedded memory configuration also provides simple application developments.  FEATURES INTRODUCTION  Dimension, L x W x H = 22.25 mm x 19mm x2.3mm (Deviation +/-0.1mm)  Support IEEE 802.11 b/g/n Standard    One Transmit and one Receive path (1T1R)  Frequency range: 2.412GHz – 2.484GHz    ARM® Cortex®-M3 Core  CPU Clock: 166MHz  Memory capacity: 512kB of ROM  1MB of Flash      448kB of SRAM  Operating Voltage: DC 3.3V  Other interface: UART, JTAG, I2S, I2C, SPI, ETE(External Timer Trigger Event),PCM,PWM  RoHS Compliant  Module is for Client mode & Address point & Router  Default is for RF IPEX Connector  Antenna Type(1T1R) Gain(dBi): 3.58  Crystal: 40MHz
            Doc No: WG6611-00-DTS-D08                                                                                               Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 4 3.  FUNCTIONAL FEATURES 3.1.  Module Block Diagram
            Doc No: WG6611-00-DTS-D08                                                                                               Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 5 3.2.  Pin Assignment (Top view)
            Doc No: WG6611-00-DTS-D08                                                                                               Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 6 3.3.  Pin Description Pin# Name Description Type 1 GND Ground G 2 GND Ground G 3 NC Not Connected is not used N 4 NC Not Connected is not used N 5 NC Not Connected is not used N 6 NC Not Connected is not used N 7 VDDIO(1.8~3.3V) GPIOE, GPIOC, GPIOA, GPIOB group IO power P 8 NC Not Connected is not used N 9 SWCLK/GPIOE_4 Clock into the core I/O 10 SWDIO/GPIOE_3 SWD data in/out I/O 11 GPIOE_2/PWM2 GPIO Pin, PWM(multiplexing) I/O 12 GPIOE_1/I2C2_SDA/PWM1 GPIO Pin, PWM, I2C(multiplexing) I/O 13 GPIOE_0/I2C2_SCL GPIO Pin, I2C(multiplexing) I/O 14 NC Not Connected is not used N   15 ADC_CH2 ADC_CH2,AD converter input I 16 NC Not Connected is not used N 17 GND Ground G 18 CHIP_EN 1: Enable Chip 0: Disable chip in shutdown mode I 19 NC Not Connected is not used N 20 NC Not Connected is not used N 21 NC Not Connected is not used N 22 GPIOA_3/UART0_RTS GPIO Pin, UART(multiplexing) I/O 23 NC Not Connected is not used N 24 GPIOA_5/UART0_CTS GPIO Pin, UART(multiplexing) I/O 25 GPIOA_7/UART0_TXD GPIO Pin, UART(multiplexing) I/O 26 GPIOA_6/UART0_RXD GPIO Pin, UART(multiplexing) I/O 27 GND Ground G 28 NC Not Connected is not used N 29 NC Not Connected is not used N 30 GND Ground G 31 NC Not Connected is not used N 32 NC Not Connected is not used N
            Doc No: WG6611-00-DTS-D08                                                                                               Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 7 33 GND Ground G 34 VD33 3.3V Power Supply P 35 GND Ground G 36 GPIOC_3/SPI0_MISO/I2S1_MCK GPIO Pin, SPI, I2S(multiplexing) I/O 37 GPIOC_2/SPI0_MOSI/ I2S1_SD_TX GPIO Pin, SPI, I2S(multiplexing) I/O 38 GPIOC_1/SPI0_CLK/I2S1_CLK GPIO Pin, SPI, I2S(multiplexing) I/O 39 GPIOC_0/PWM0/I2S1_WS GPIO Pin, PWM, I2S(multiplexing) I/O 40 GPIOC_4/SPI0_CS1/I2S1_SD_RX GPIO Pin, SPI, I2S(multiplexing) I/O 41 GPIOC_5 GPIO Pin I/O 42 GPIOB_3/I2C3_SDA GPIO Pin, I2C(multiplexing) I/O 43 GPIOB_2/I2C3_SCL/NORMAL_MODE_SEL GPIO Pin, /I2C(multiplexing), Shared with GPIOB_2 1:Normal operation 0:Enter into test/debug mode I/O 44 UART_RXD/GPIOB_1 UART_LOG_IN(Debug) I/O 45 UART_TXD/GPIOB_0/BOOT_SCENARIO UART_LOG_OUT(Debug), Shared with GPIOB_0 0:booting from flash 1:booting from internal memory I/O 46 NC Not Connected is not used N 47 NC Not Connected is not used N 48 GND Ground G 49 NC Not Connected is not used N 50 NC Not Connected is not used N 51 GND Ground G 52 GND Ground G 53 NC Not Connected is not used N  4.  FUNCTIONAL SPECIFICATION  Main Chipset Realtek RTL8711AM Wireless standard IEEE 802.11 b/g /n Frequency   2.4~2.483GHz    ISM Band Transmit Speed 802.11b: 11,5.5,2,1 Mbps 802.11g: 54,48,36,24,18,12,9,6 Mbps 802.11n: up to 150Mbps
            Doc No: WG6611-00-DTS-D08                                                                                               Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 8 Wireless Security WPAK2-AES(802.11i(WPA,WP2)) OPEN,shared key,and pair-wise key authentication services Channel Channel 1~14 Modulation 802.11b(DSSS): CCK(11, 5.5Mbps), DQPSK(2Mbps), DBPSK(1Mbps); 802.11g(OFDM): BPSK(9,6Mbps), QPSK(18,12Mbps), 16QAM(36,24Mbps), 64QAM(54,48Mbps); 802.11n(OFDM): BPSK, QPSK, 16QAM, 64QAM(150Mbps) Sensitivity 150Mbps: Typical - 64dBm @ 10% PER 54Mbps: Typical - 65dBm @ 10% PER 11Mbps: Typical - 76dBm @ 8% PER TX Power 11Mbps: 802.11b 17±2dBm   54Mbps:802.11g 14±2dBm 150Mbps:802.11n 13±2dBm EVM 11Mbps: 802.11b EVM≦8% 54Mbps:802.11g EVM≦-28dB 150Mbps:802.11n EVM≦-30dB Antenna RF path selection feature -00 : IPEX Connector   -01 : Internal Antenna Network Architecture AP Mode (Default) Client Mode I/O Voltage Level Please refer to Table 1 and Table 2 below  UART x2   (Maximum 2 high speed UART interface with baud rate up to 4Mbps)  I2C x3 (Three speeds: Standard mode(0 to 100 Kb/s) Fast mode(<400Kb/s) High-speed mode(<3.4Mb/s)(with appropriate bus loading) I/O Interface I2S x1   (Support 8/16/24/32/48/96KHz,44.1/88.2KHz) SPI x2   (Support Master/Slave mode(SPI0 only),and Slave only(SPI1 and SPI2);
            Doc No: WG6611-00-DTS-D08                                                                                               Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 9 Support DMA to offload CPU bandwidth. 1 very high speed SPI with baud rate up to 41 MHz. 1 high speed SPI with baud rate up to 10MHz). PWM x4   (PWM with configurable duration and duty cycle from 0 ~ 100%) GPIO x19 PCM x2 (Master clock output:64,128,256,or 512kHz) ETE x1 Dimensions 22.25 x 19 x2.3mm  Table1-Typeical Digital IO DC Parameters(3.3V Case)    Symbol Parameter Min Typ. Max Units VIH Input-High-Voltage 2.0         V VIL Input-Low-Voltage      0.8   V VOH Output-High-Voltage 2.4     V VOL Output-Low-Voltage     0.4   V  Table2-Typeical Digital IO DC Parameters(1.8V Case)    Symbol Parameter Min Typ. Max Units VIH Input-High-Voltage 0.65xVcc   V VIL Input-Low-Voltage      0.35xVcc   V VOH Output-High-Voltage Vcc-0.45    V VOL Output-Low-Voltage    0.45   V
            Doc No: WG6611-00-DTS-D08                                                                                               Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 10 4.1.   Temperature Limit Ratings Parameter Min. Max. Units Storage Temperature -40 +80 ℃ Operating Temperature 0 +70 ℃  4.2.  DC POWER SUPPLY Symbol Parameter Min Typ. Max Units VDD 3.3V Supply Voltage 3.0 3.3 3.6 V VDIO Digital IO Supply Voltage 1.62 1.8~3.3 3.6 V
            Doc No: WG6611-00-DTS-D08                                                                                               Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 11 4.3.  Current Consumption    State Current(3.3V) Description Deep Sleep 5.5uA Low Power Timer and GPIO Evnet Wakeup Deep Standby 25uA Low Power Timer and GPIO Evnet Wakeup Sleep 0.5mA Associated with AP but no traffic Associated Idle (DTIM=1) 3.3mA Associated with AP and no traffic Associated Idle (DTIM=2) 2.41mA Associated with AP and no traffic Associated Idle (DTIM=3) 1.985mA Associated with AP and no traffic Run in Active clock 25mA CPU clock 166MHz, UART/SPI/I2C available WiFi is disable 11n RX Mode 62mA CPU clock 166MHz, UART/SPI/I2C available WiFi is in 11n Rx 11n TX Throughput @ 13dBm 162mA CPU clock 166MHz, UART/SPI/I2C available WiFi is in 11n Tx transmitting data(throughput) WiFi is in 11n Rx  Mode Condition Typical Current at 3.3V Active:            TX at 11 Mbps 343mA TX at 54 Mbps 282mA TX at HT20-MCS7 267mA TX at HT40-MCS7 262mA RX at 11Mbps 68mA RX at 54Mbps 74mA RX at HT20-MCS7 74mA RX at HT40-MCS7 74mA
            Doc No: WG6611-00-DTS-D08                                                                                               Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 12 4.4.  WLAN 2.4-GHz RF Performance  2.4G WLAN Transmitter Characteristics Condition Min Typ. Max Unit 11b Output Power 11M CCK  17  dBm 1M DSSS  17  11g Output Power 54M OFDM  14  6M OFDM  16  11n Output Power MCS7    13  MCS0  15   2.4G WLAN Receiver Characteristics Condition Min Tyd Max Unit 11b Rx Sensitivity 11M CCK  -76  dBm 1M DSSS  -83  11g Rx Sensitivity 54M OFDM  -65  6M OFDM    -82  11n Rx Sensitivity MCS7    -64  MCS0  -82  Note: IPEX Connector Test RF Performance Measurement
            Doc No: WG6611-00-DTS-D08                                                                                               Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 13 4.5.  Pin Function Table
            Doc No: WG6611-00-DTS-D08                                                                                               Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 14 5.  REFFERENCE SCHEMATIC 5.1.  Application Reference Circuit
            Doc No: WG6611-00-DTS-D08                                                                                               Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 15 6.  PACKAGE INFORMATION 6.1.  Module mechanical outline
            Doc No: WG6611-00-DTS-D08                                                                                               Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 16    Module TOP VIEW
            Doc No: WG6611-00-DTS-D08                                                                                               Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 17 6.2.  Package Marking    Data Code: YYWWSSFA YY   = Digit of the year, ex: 2012=12 WW  = Week (01~52) SS   = Serial number from 01~98 match to MFG’s lot number or 99 to repair control code F    = Reverse for internal use A    = Module version from A to Z
            Doc No: WG6611-00-DTS-D08                                                                                               Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 18 7.  SMT AND BAKING RECOMMENDATION 7.1.  Baking Recommendation  Baking condition: - Follow MSL Level 4 to do baking process.   - After  bag  is  opened,  devices  that  will  be  subjected  to  reflow  solder  or  other  high temperature process must be a) Mounted within 72 hours of factory conditions <30°C/60% RH, or   b) Stored at <10% RH. - Devices require bake, before mounting, if Humidity Indicator Card reads >10%   If baking is required, Devices may be baked for 8 hrs at 125 °C.  7.2.  SMT Recommendation  Recommended Reflow profile:     No. Item Temperature (°C) Time (sec) 1 Pre-heat   D1: 140 ~ D2: 200   T1: 80 ~ 120 2 Soldering   D2: = 220   T2: 60 ± 10 3 Peak-Temp. D3: 250 °C max H
            Doc No: WG6611-00-DTS-D08                                                                                               Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 19  Note: (1) Reflow soldering is recommended two times maximum. (1) Add Nitrogen while Reflow process:  SMT solder ability will be better.   Stencil thickness:  0.1~ 0.15 mm (Recommended)  Soldering paste (without Pb):  Recommended SENJU N705-GRN3360-K2-V can get better soldering effects.
            Doc No: WG6611-00-DTS-D08                                                                                               Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 20  FCC Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:   —Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver.   —Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.   —Consult the dealer or an experienced radio/TV technician for help.    FCC Radiation Exposure Statement This device complies with FCC radiation exposure limits set forth for an uncontrolled environment and it also complies with Part 15 of the FCC RF Rules. This equipment must be installed and operated in accordance with provided instructions and the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. End-users and installers must be provided with antenna installation instructions and consider removing the no-collocation statement.  This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:     (1) this device may not cause harmful interference, and   (2) this device must accept any interference received, including interference that may cause undesired operation.  Caution!     Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
            Doc No: WG6611-00-DTS-D08                                                                                               Copyright © JORJIN TECHNOLOGIES INC. 2017 http://WWW.JORJIN.COM.TW CONFIDENTIAL Page 21  This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna, 3) For  all  products  market in  US,  OEM  has  to  limit  the  operation  channels  in  CH1  to  CH11  for 2.4Gband by supplied firmware programming tool. OEM shall not supply any tool or info to the end-user regarding to Regulatory Domain change. As long as 3 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.  IMPORTANT NOTE:   In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.     End Product Labelling    The final end product must be labelled in a visible area with the following:       “Contains FCC ID:WS2-WG6611.       Manual Information to the End User    The OEM integrator has to be aware not to provide information to the end user regarding how   to install or remove this RF module in the user’s manual of the end product which integrates this module.

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