LG Innotek BK1000 Telematics Modem User Manual 1

LG Innotek Co., Ltd. Telematics Modem 1

User Manual

Copyright ⓒ. 2017. All Rights Reserved. User Guide for the LTD-BK1000 1. Overview 2. Major features 3. Interface 4. Electrical specifications 5. RF specifications 6. Mechanical specifications 7. General specifications 8. Connectors 9.  RFx information 10. Approbation FCC Table of Contents Product: LTE_WCDMA Wireless Modem  Model name: LTD-BK1000
Copyright ⓒ. 2017. All Rights Reserved.   The LTD-BK1000 is a personal mobile communication device that incorporates the latest compact radio  technology, including smaller and lighter components and  support  for  WCDMA(850/1900MHz)  bands  and  LTE(700/850/1700/1900 MHz).  This  device  acts  as  the  vehicle’s  telematics  system  and  connects  to WCDMA  (HSPA+)  and  LTE  wireless  networks  and  wireless  modules  to  allow voice  and  data communication.  Furthermore,  this device can  operate on land and water as well as other similar areas.   In  LTE  mode,  the  device  provides  uplink  speeds  of up to 50  Mbps  and downlink  speeds  of up to 150  Mbps  for  seamless  transfer  of  data  such  as movies and video calls. The device also supports the transfer of large amounts of data.   The device communicates with the host system via a standard RS-232 or USB port, and AT commands and control commands can be used to send data. Voice calls are also possible. 1.  Overview
Copyright ⓒ. 2017. All Rights Reserved. Mechanical Dimensions 34 x 40 x 3.5 mm (L x W x T) (Tolerance – width, length : TBD) Weight   TBD g (max) Interface   USB, general purpose I/O pins Temperature*   Operation: -20 ℃ - +70 ℃   Storage: -40 ℃ - +85 ℃ Technology  Main chipset   MDM9628 Memory   4Gb(NAND) / 1Gb(SDRAM) Standard   WCDMA (HSPA+) - DL Speed : 14.4 Mbps - UL Speed : 5.76 Mbps    LTE - DL Speed : 150 Mbps - UL Speed : 50 Mbps  Band  WCDMA B2, B5  LTE B2, B4, B5, B17 Power   WCDMA : Typ. 24dBm (Power Class 3)    LTE : Typ. 23dBm (Power Class 3)  ETC DC power   4 V Functions   Voice, data, SMS 2.  Major features
Copyright ⓒ. 2017. All Rights Reserved. 3.  Interface 3.1 LGA Pad Layout (Top View) Figure 1. LGA Pin map GND12 GND10 GND6 GND5GND GND GND GNDGND GNDGND11 GND421 A21 C21 E21 G21 I21 K21 M21 O21 Q21 S21 U21 W21 Y21 AA21 AC21 AE21GND MAIN_ANT GND GND GND GND GND GND GND GND GND GND GND GND ANT_DIV GND20 B20 D20 F20 H20 J20 L20 N20 P20 R20 T20 V20 X20 Z20 AB20 AD20GND GND MAIN_ANT_DTC_EN GND GND GND GND GND GND GND GND GND DIV_ANT_DTC_EN GND GND19 A19 C19 E19 G19 I19 K19 M19 O19 Q19 S19 U19 W19 Y19 AA19 AC19 AE19GND GND ADC1 GND GND GND GND GND GND GND GND GND GND ADC2 GND GND18 B18 D18 F18 H18 J18 L18 N18 P18 R18 T18 V18 X18 Z18 AB18 AD18GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND17 A17 C17 E17 G17 I17 K17 M17 O17 Q17 S17 U17 W17 Y17 AA17 AC17 AE17VPH_PWR GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND16 B16 D16 F16 H16 J16 L16 N16 P16 R16 T16 V16 X16 Z16 AB16 AD16VPH_PWR GND GND GND GND GND GND GND GND GND GND GND GND GND GND15 A15 C15 E15 G15 I15 W15 Y15 AA15 AC15 AE15VPH_PWR GND GND GND GND GND GND GND GND GND14 B14 D14 F14 H14 N14 P14 R14 X14 Z14 AB14 AD14VPH_PWR GND GND GND GND GND GND GND GND GND GND13 A13 C13 E13 G13 I13 M13 O13 Q13 S13 W13 Y13 AA13 AC13 AE13GND GND GND GND GND GND GND GND GND GND GND GND GND GND12 B12 D12 F12 H12 N12 P12 R12 X12 Z12 AB12 AD12NC GND GND GND GND GND GND GND GND GND GND11 A11 C11 E11 G11 I11 M11 O11 Q11 S11 W11 Y11 AA11 AC11 AE11GND GND GND GND GND GND GND GND GND SGMII_RX_M SGMII_TX_P EPHY_RST_N SGMII_CLK EPHY_INT_N10 B10 D10 F10 H10 N10 P10 R10 X10 Z10 AB10 AD10GND GND GND GND GND GND GND SGMII_RX_P SGMII_TX_M SGMII_DATA GND9A9 C9 E9 G9 I9 M9 O9 Q9 S9 W9 Y9 AA9 AC9 AE9VPH_PWR VREG_L11_1P8 GND NC NC GND GND GND GND GND GND GND GND MDM_JTAG_SRST_N8B8 D8 F8 H8 N8 P8 R8 X8 Z8 AB8 AD8VPH_PWR VREG_L11_1P8 GND GND GND GND GND MDM2AP_INT_N AP2MDM_INT_N MDM_JTAG_TCK MDM_JTAG_PS_HOLD7A7 C7 E7 G7 I7 W7 Y7 AA7 AC7 AE7VPH_PWR VPH_PWR GND NC SPI_LEVEL_SHIFT_EN GND COEX_UART_RX GND MDM_JTAG_TMS MDM_JTAG_TRST_N6B6 D6 F6 H6 J6 L6 N6 P6 R6 T6 V6 X6 Z6 AB6 AD6GND GND GPIO ACC_PWR_ON GND GPIO GPIO GND SPI_CS_N SPI_CLK GND DSRC_SLP_CLK COEX_UART_TX MDM_JTAG_TDO MDM_JTAG_TDI5A5 C5 E5 G5 I5 K5 M5 O5 Q5 S5 U5 W5 Y5 AA5 AC5 AE5GND NC GPIO GND BOOT_OK UART1_TX UART2_TX UART3_TX SPI_INTERRUPT SPI_MOSI SPI_MISO GNDWLAN_3V_EN_DSRC GND GND GND4B4 D4 F4 H4 J4 L4 N4 P4 R4 T4 V4 X4 Z4 AB4 AD4MDM_RESOUT_N NC GND MGS GND UART1_RX UART2_RX UART3_RX GND GND GND RFCLK2_QCA DSRC_PPS GND Ehernet_DC-DC_EN3A3 C3 E3 G3 I3 K3 M3 O3 Q3 S3 U3 W3 Y3 AA3 AC3 AE3PHONE_ON_N LGA_RESIN_N GND 96H_END UIM1_PRESENT GND GND GND SDC_DATA3 SDC_DATA2 GND PCM_EN PCM_DIN WLAN_EN_DSRC GND VREG_L5_UIM22B2 D2 F2 H2 J2 L2 N2 P2 R2 T2 V2 X2 Z2 AB2 AD2GND GND VREG_L6_UIM1 UIM1_CLK GND USB_ID USB_HS_DM GND SDC_DATA1 SDC_DATA0 GND PCM_CLK GND HSIC_DATA NC1A1 C1 E1 G1 I1 K1 M1 O1 Q1 S1 U1 W1 Y1 AA1 AC1 AE1GND GND UIM1_RESET UIM1_DATA GND USB_VBUS USB_HS_DP GND SDC_CMD SDC_CLK GND PCM_SYNC PCM_DOUT GND HSIC_STB NCGND9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z AA AB AC AD AE GND2GND GNDGND GND GND GNDGND8 GND7 GND3 GND1
Copyright ⓒ. 2017. All Rights Reserved. 3.  Interface 3.2 Pin description Table 1. Pin descriptions PAD. NAME DIRECTION DESCRIPTION Antenna Interface Pads C21 MAIN_ANT  Input/Output RF Main Antenna  AC21 DIV_ANT  Input/Output RF Diversity Antenna User Interface Pads H6 ACC_PWR_ON  Input ACC_PWR_ON I5 BOOT_OK  Output BOOT_OK H4 MSG  Output MSG G3 96H_END  Output 96H_END F20 MAIN_ANT_DTC_EN  Output Main ANT Detect Enable Z20 DIV_ANT_DTC_EN  Output Diversity ANT Detect Enable I7 SPI_LEVEL_SHIFT_EN  Output SPI LEVEL SHIFT Enable AD4 ETHERNET_DCDC_ENABLE Output Ethernet power enable F6 GPIO1 Input/Output (Do not use with External PU) General purpose I/O E5 GPIO2 General purpose I/O L6 GPIO3 Input/Output (Not support INTERRUPT) General purpose I/O N6 GPIO4 General purpose I/O ADC Interface Pads E19 ADC1  Input ADC Convertor input for main antenna detect AA19 ADC2  Input ADC Convertor input for diversity antenna detect PCM Interface Pads W3 PCM_EN  Output PCM 3.3 Level Shifter Enable X2 PCM_CLK  Input PCM Clock W1 PCM_SYNC  Input PCM Frame Sync Y3 PCM_DIN  Input PCM Data In Y1 PCM_DOUT  Output PCM Data Out JTAG Pin Description AC7 MDM_JTAG_TMS  Input/Output JTAG mode select input AD8 MDM_JTAG_PS_HOLD  input JTAG PS HOLD detect AD6 MDM_JTAG_TDI  Input JTAG data input AE7 MDM_JTAG_TRST_N  Input JTAG reset for debug AB6 MDM_JTAG_TDO  Output JTAG debugging AB8 MDM_JTAG_TCK  Input JTAG clock input AE9 MDM_JTAG_SRST_N  Input JTAG reset USB Interface Pads N2 USB_HS_DM  Input/Output USB high speed data (minus) M1 USB_HS_DP  Input/Output USB high speed data (plus) K1 USB_VBUS  Input USB power L2 USB_ID  Input USB ID SDIO Interface Pads S1 SDC_CLK  Output Secure digital controller clock Q1 SDC_CMD  Output Secure digital controller command T2 SDC_DATA0  Input/Output Secure digital controller data bit 0 R2 SDC_DATA1  Input/Output Secure digital controller data bit 1 S3 SDC_DATA2  Input/Output Secure digital controller data bit 2
Copyright ⓒ. 2017. All Rights Reserved. 3.  Interface Table 1. Pin descriptions Q3 SDC_DATA3  Input/Output Secure digital controller data  bit 3 SGMMI Interface  Pads AA11 EPHY_RST_N or UIM2_RESET  Output Ethernet PHY reset AE11 EPHY_INT_N or UIM2_DETECT Input Ethernet PHY interrupt AB10 SGMII_DATA or UIM2_CLK  Input/Output SGMII input Output data AD10 GND   Ground X10 SGMII_RX_P  Input SGMII receive - plus W11 SGMII_RX_M  Input SGMII receive -minus Z10 SGMII_TX_M  Output SGMII transmit - plus Y11 SGMII_TX_P  Output SGMII transmit -minus AC11 SGMII_CLK or UIM2_DATA  Output SGMII clock SPI Interface   Pads S5 SPI_MOSI  Output SPI Serial Output T6 SPI_CLK  Output SPI Serial Clock R6 SPI_CS_N  Output SPI Chip Select U5 SPI_MISO  Input SPI Serial input Q5 SPI_INTERRUPT  Input MICOM → LGA SPI interrupt UART Interface Pads M5 UART2_TX  Output UART2 Transmit data N4 UART2_RX  Input UART2 Receive  data K5 UART1_TX  Output Debug UART5 Transmit Data L4 UART1_RX  Input Debug UART5 Receive Data O5 UART3_TX  Output UART6 Transmit data P4 UART3_RX  Input UART6 Receive  data USIM Interface  Pads I3 UIM1_PRESENT  Input Detection of an external UIM card H2 UIM1_CLK  Output Clock Output to an external UIM card E1 UIM1_RESET  Output Reset Output to an external UIM card G1 UIM1_DATA  Input/Output Data connection with an external UIM card F2 VREG_L6_UIM1  Output Supply Output for an external UIM card E3 GND   Ground D2 GND   Ground A1 GND   Ground C1 GND   Ground B2 GND   Ground HSIC Pin Description AB2 HSIC_DATA  Input/Output HSIC data AC1 HSIC_STB  Input/Output HSIC Strobe signal AD2 NC   No Connect AE1 NC   No Connect DSRC Pin Description Y7 COEX_UART_RX  Input LTE receiver sync for coexistence with UART Z6 COEX_UART_TX  Output LTE transmitter  sync for coexistence with UART X4 RFCLK2_QCA  Output Low noise RF clock Output AA3 WLAN_EN_DSRC  Output WLAN Enable
Copyright ⓒ. 2017. All Rights Reserved. 3.  Interface Table 1. Pin descriptions X6 DSRC_SLP_CLK  Output DSRC sleep clock Y5 WLAN_3V_EN_DSRC  Output Used for WLAN enable Z4 DSRC_PPS  Input/Output Pulse Per Second X8 MDM2AP_INT_N  Output MDM to AP interrupt, PCM_LDO_EN Z8 AP2MDM_INT_N  Input AP to MDM interrupt Control Pads A3 LGA_PHONE_ON  Input ON/OFF Control B4 MDM_RESOUT_N  Output Reset Output C3 LGA_RESIN_N  Input External Reset Input Power Supply Pads A17 VPH_PWR for PAM  Input power supply (4.0V) B16 VPH_PWR for PAM  Input power supply (4.0V) A15 VPH_PWR for PAM  Input power supply (4.0V) B14 VPH_PWR for PAM  Input power supply (4.0V) A9 VPH_PWR for PMIC  Input power supply (4.0V) B8 VPH_PWR for PMIC  Input power supply (4.0V) A7 VPH_PWR for PMIC  Input power supply (4.0V) C7 VPH_PWR for PMIC  Input power supply (4.0V) Voltage Reference Pad C9 VREG_L11_1P8  Output LDO out for 1.8V pull up  D8 VREG_L11_1P8  Output LDO out for 1.8V pull up  AE3 Voltage Reference for SGMII (VREG_L5_UIM2) – Ethernet IO전압 level  Output Ethernet I/O voltage NC Pads G9 NC   No Connect B12 NC   No Connect I9 NC   No Connect G7 NC   No Connect C5 NC   No Connect D4 NC   No Connect          A21 GND   Ground E21 GND   Ground G21 GND   Ground I21 GND   Ground K21 GND   Ground M21 GND   Ground O21 GND   Ground Q21 GND   Ground S21 GND   Ground U21 GND   Ground W21 GND   Ground Y21 GND   Ground AA21 GND   Ground AE21 GND   Ground B20 GND   Ground D20 GND   Ground H20 GND   Ground J20 GND   Ground
Copyright ⓒ. 2017. All Rights Reserved. 3.  Interface Table 1. Pin descriptions L20 GND   Ground N20 GND   Ground P20 GND   Ground R20 GND   Ground T20 GND   Ground V20 GND   Ground X20 GND   Ground AB20 GND   Ground AD20 GND   Ground A19 GND   Ground C19 GND   Ground G19 GND   Ground I19 GND   Ground K19 GND   Ground M19 GND   Ground O19 GND   Ground Q19 GND   Ground S19 GND   Ground U19 GND   Ground W19 GND   Ground Y19 GND   Ground AC19 GND   Ground AE19 GND   Ground B18 GND   Ground D18 GND   Ground F18 GND   Ground H18 GND   Ground J18 GND   Ground L18 GND   Ground N18 GND   Ground P18 GND   Ground R18 GND   Ground T18 GND   Ground V18 GND   Ground X18 GND   Ground Z18 GND   Ground AB18 GND   Ground AD18 GND   Ground C17 GND   Ground E17 GND   Ground G17 GND   Ground I17 GND   Ground K17 GND   Ground M17 GND   Ground O17 GND   Ground Q17 GND   Ground S17 GND   Ground U17 GND   Ground W17 GND   Ground Y17 GND   Ground
Copyright ⓒ. 2017. All Rights Reserved. 3.  Interface Table 1. Pin descriptions AA17 GND   Ground AC17 GND   Ground AE17 GND   Ground D16 GND   Ground F16 GND   Ground H16 GND   Ground J16 GND   Ground L16 GND   Ground N16 GND   Ground P16 GND   Ground R16 GND   Ground T16 GND   Ground V16 GND   Ground X16 GND   Ground Z16 GND   Ground AB16 GND   Ground AD16 GND   Ground C15 GND   Ground E15 GND   Ground G15 GND   Ground I15 GND   Ground W15 GND   Ground Y15 GND   Ground AA15 GND   Ground AC15 GND   Ground AE15 GND   Ground D14 GND   Ground F14 GND   Ground H14 GND   Ground X14 GND   Ground Z14 GND   Ground AB14 GND   Ground AD14 GND   Ground A13 GND   Ground C13 GND   Ground E13 GND   Ground G13 GND   Ground I13 GND   Ground W13 GND   Ground Y13 GND   Ground AA13 GND   Ground AC13 GND   Ground AE13 GND   Ground D12 GND   Ground F12 GND   Ground H12 GND   Ground X12 GND   Ground Z12 GND   Ground AB12 GND   Ground AD12 GND   Ground
Copyright ⓒ. 2017. All Rights Reserved. 3.  Interface Table 1. Pin descriptions A11 GND   Ground C11 GND   Ground E11 GND   Ground G11 GND   Ground I11 GND   Ground B10 GND   Ground D10 GND   Ground F10 GND   Ground H10 GND   Ground E9 GND   Ground W9 GND   Ground Y9 GND   Ground AA9 GND   Ground AC9 GND   Ground F8 GND   Ground H8 GND   Ground E7 GND   Ground W7 GND   Ground AA7 GND   Ground B6 GND   Ground D6 GND   Ground J6 GND   Ground P6 GND   Ground V6 GND   Ground A5 GND   Ground W5 GND   Ground AA5 GND   Ground AC5 GND   Ground AE5 GND   Ground F4 GND   Ground J4 GND   Ground R4 GND   Ground T4 GND   Ground V4 GND   Ground AB4 GND   Ground K3 GND   Ground M3 GND   Ground O3 GND   Ground U3 GND   Ground AC3 GND   Ground J2 GND   Ground P2 GND   Ground V2 GND   Ground Z2 GND   Ground I1 GND   Ground O1 GND   Ground U1 GND   Ground AA1 GND   Ground GND1 GND   Ground GND2 GND   Ground
Copyright ⓒ. 2017. All Rights Reserved. 3.  Interface Table 1. Pin descriptions GND3 GND   Ground GND4 GND   Ground GND5 GND   Ground GND6 GND   Ground GND7 GND   Ground GND8 GND   Ground GND9 GND   Ground GND10 GND   Ground GND11 GND   Ground GND12 GND   Ground N14 GND   Ground P14 GND   Ground R14 GND   Ground M13 GND   Ground O13 GND   Ground Q13 GND   Ground S13 GND   Ground N12 GND   Ground P12 GND   Ground R12 GND   Ground M11 GND   Ground O11 GND   Ground Q11 GND   Ground S11 GND   Ground N10 GND   Ground P10 GND   Ground R10 GND   Ground M9 GND   Ground O9 GND   Ground Q9 GND   Ground S9 GND   Ground N8 GND   Ground P8 GND   Ground R8 GND   Ground G5 GND   Ground
Copyright ⓒ. 2017. All Rights Reserved. 3.  Interface 3.3 USB  This device supports universal serial bus (USB) connections for high-speed data communication. The relevant hardware satisfies the USB 2.0 specifications and supports maximum communications speeds of 480 Mbps Table 2. USB Pin descriptions Pin NO.  Signal Name  Pin I/O (Modem host)  Function Description M1 USB_D+  IO USB Differential data line (+) N2 USB_D-  IO USB Differential data line (-) K1 USB_VBUS  I  USB Power Supply
Copyright ⓒ. 2017. All Rights Reserved. 3.  Interface 3.4 Audio   This module includes a PCM interface. The pull-up and pull-down resistors attached to these pin must provide more than 50 Kohm of resistance. Table 3. PCM Pin descriptions 3.5 User interface Pin No. Signal Name  Direction Function I5 BOOT_OK   O  Indicates that the Modem boot is complete.  C3  RESET_IN  I  Control line to unconditionally restart the module. H4  MSG   O  Indicates that the Modem receive Urgent message. G3  96H_END   O  Indicates that the 96hr sleep mode is end.  H6  ACC_ON_SLEEP I  Control line to power on or 96hr sleep mode. A3  Phone_ON  I  Control line to power on / off Table 4. User interface Pin descriptions Pin NO. Signal Name  Pin I/O (Modem host)  Function Description W1  PCM_SYNC   I  PCM Interface sync  X2  PCM_CLK   I  PCM Interface clock  Y1  PCM_TXD   O  PCM Interface digital audio data out Y3 PCM_RXD I  PCM Interface digital audio data in
Copyright ⓒ. 2017. All Rights Reserved. 4.  Electrical specifications 4.1 Power supply specifications   The host system provides the power supply (V_BATT)DC 4 V, 2.5 A to the device. The internal power supply module manages the power supplied to the integral circuits and  maintains  constant  voltages. This  module  also  controls each power block to minimize power consumption.  In particular, the PAM (power amplifier module) consumes a lot of power, so it receives  a  direct  power  supply  of  4  V  from  the  V_BATT.  Therefore  the V_BATT  signal  inputs  only  the  supply  power  of  the  PAM,  even  when  the absolute rating is higher. In addition, the entire power input module blocks and protects against high surges and ESD in the NAD module. Pin No.  Signal Name Direction MIN  TYP  MAX A7,C7,B8,A9, B14,A15,B16, A17 V_BATT  I  3.9 V  4 V  4.1 V Table 5. Power supply specifications
Copyright ⓒ. 2017. All Rights Reserved. 4.  Electrical specifications 4.2 Logic level specifications  4.2.1 Digital logic level specifications Table 6.  Digital logic level specifications Signal Name  Type  Low  High  Unit Min  Max  Min  Max BOOT_OK  O  0  0.45  1.35  1.8 V RESET_IN  I  -0.3  0.63  1.17  1.8 MSG  O  0  0.45  1.35  1.8 96H_END  O  0  0.45  1.35  1.8 ACC_ON_SLEEP I  0  0.63  1.17  1.8
Copyright ⓒ. 2017. All Rights Reserved. 5. RF specifications 5.1 WCDMA  5.1.1 Receiver .- Bandwidth : 5MHz .- Frequency : 869MHz – 894MHz (B5), 1930MHz – 1990MHz (B2) .- RF to Baseband Direct conversion (Zero IF) .- Modulation method : QPSK, 16QAM .- Sensitivity : ≤-104dBm (BER = Under 0.1%) 5.1.2 Transmitter .- Frequency: 824MHz – 849MHz (B5), 1850MHz – 1910MHz (B2) .- Maximum RF Output : Power class3 , 20.3dBm ~ 25.7dBm                                    .- Modulation method :  QPSK .- Baseband to RF Direct conversion (Zero IF) 5.2 LTE  5.2.1 Receiver .- Bandwidth :  B2/B4(5 MHz, 10 MHz, 15 MHz, 20 MHz), B5/B17(5 MHz, 10 MHz) .- Frequency :  B2 (1930 MHz – 1990 MHz), B4 (2110 MHz – 2155 MHz), B5 (869 MHz – 894 MHz), B17 (734 MHz – 746 MHz) .- RF to Baseband Direct conversion (Zero IF) .- Modulation method : QPSK, 16QAM and 64QAM .- Sensitivity :  B2 (≤-94.3dBm @QPSK, BW:10 MHz), B4 (≤-96.3dBm @QPSK, BW:10 MHz), B5 (≤-94.3dBm @QPSK, BW:10 MHz), B17 (≤-93.3dBm @QPSK, BW:10 MHz)
Copyright ⓒ. 2017. All Rights Reserved. 5. RF specifications 5.2.2 Transmitter .- Frequency: B2 (1850 MHz – 1910 MHz), B4 (1710 MHz – 1755 MHz),B5 (824 MHz – 849 MHz), B17 (704 MHz – 716MHz) .- Maximum RF Output : Power class3 , 20.3dBm ~ 25.7dBm                                    .- Modulation method :  QPSK and 16QAM .- Baseband to RF Direct conversion (Zero IF)
Copyright ⓒ. 2017. All Rights Reserved. 6. Mechanical specifications 6.1 Environment specifications .- Storage temp.: -40 ℃ - +85 ℃ .- Operating temp.: -20 ℃ - +70 ℃     (-20 ℃ - +70 ℃ : 3GPP specifications are satisfied     -30 ℃ - -20 ℃, +70 ℃ - +80 ℃ : May cause performance degradation) .- Operating humidity: 80% (60℃) relative humidity
Copyright ⓒ. 2017. All Rights Reserved. 6. Mechanical specifications 6.1 Mechanical dimensions Dimensions  34 x 40.0 x 3.5 mm (L x W x T) (Tolerance – width, length : TBD) Weight  TBD grams(max.) Modem interface connector  12709HS-H40  (Manufacture vendor : YUNHO) Modem antenna Connector (Plug)  KR15005-DD , KR15005-DG  (Manufacture vendor : KET) Table 7.  Mechanical specification Figure 2. Mechanical dimension
Copyright ⓒ. 2017. All Rights Reserved. 7. General specifications 7.1 WCDMA B5 electrical specifications Table 8. WCDMA  B5 RF specification   TEST ITEM Spec. Test Temperature Test Frequency CHANNEL 4357 4400 4458 1  Maximum Output Power   20.3~25.7dBm  Normal, Temp L, Temp H  Low, Mid, High  PASS PASS PASS 2  Frequency Error  -195 ~ +195Hz  Normal, Temp L, Temp H  Low, Mid, High  PASS PASS PASS 3  Inner Loop Power Control in the Uplink  PASS  Normal  Mid  -  PASS - 4  Minimum Output Power  -49dBm ↓ Normal, Temp L, Temp H  Low, Mid, High  PASS PASS PASS 5  Occupied Bandwidth (OBW) 5MHz ↓  Normal  Low, Mid, High  PASS PASS PASS 6  Spectrum emission mask SEM Band1 Offset2.5-3.5MHz (at Freq+3.5MHz)  -48.5dBc ↓ Normal  Low, Mid, High PASS PASS PASS SEM Band1 Offset3.5-7.5MHz (at Freq+7.5MHz)  -37.5dBc ↓  PASS PASS PASS SEM Band1 Offset7.5-8.5MHz (at Freq+8.5MHz)  -47.5dBc ↓  PASS PASS PASS SEM Band1 Offset8.5-12.5MHz  -47.5dBc ↓  PASS PASS PASS 7 Adjacent Channel Leakage Power Ratio (ACLR) ACLR Offset +5/-5MHz Rel  -32.2dBc ↓ Normal, Temp L, Temp H  Low, Mid, High  PASS PASS PASS ACLR Offset +10/-10MHz Rel  -42.2dBc ↓ Normal, Temp L, Temp H  Low, Mid, High  PASS PASS PASS 8  Error Vector Magnitude(EVM) EVM at Tx output power 24dBm /-18dBm  17.5% ↓  Normal  Low, Mid, High  PASS PASS PASS 9  Peak code domain error PCDE at Tx output power 24dBm/-18dBm -14dB ↓  Normal  Low, Mid, High  PASS PASS PASS 10 Phase Discontinuity Phase Discontinuity max EVM  17.5% ↓ Normal  Mid -  PASS - Phase Discontinuity max Frequency Error -195~195Hz  -  PASS - Phase Discontinuity max 1500Hz  36 degrees ↓  -  PASS - 11 Reference Sensitivity Level  Ref Sense Go/No Go I^or=-104dBm/3.84MHz BER 0.1% ↓ Normal, Temp L, Temp H  Low, Mid, High  PASS PASS PASS 12 Maximum Input Level  Max Input Go/No Go I^or=-25.7dBm/3.84MHz BER 0.1% ↓  Normal  Mid  -  PASS -
Copyright ⓒ. 2017. All Rights Reserved. 7. General specifications 7.2 WCDMA B2 electrical specifications Table 9. WCDMA B2 RF specification   TEST ITEM Spec. Test Temperature Test Frequency CHANNEL 9662 9800 9938 1  Maximum Output Power   20.3~25.7dBm  Normal, Temp L, Temp H  Low, Mid, High  PASS PASS PASS 2  Frequency Error  -195 ~ +195Hz  Normal, Temp L, Temp H  Low, Mid, High  PASS PASS PASS 3  Inner Loop Power Control in the Uplink  PASS  Normal  Mid  -  PASS - 4  Minimum Output Power  -49dBm ↓ Normal, Temp L, Temp H  Low, Mid, High  PASS PASS PASS 5  Occupied Bandwidth (OBW) 5MHz ↓  Normal  Low, Mid, High  PASS PASS PASS 6  Spectrum emission mask SEM Band1 Offset2.5-3.5MHz (at Freq+3.5MHz)  -48.5dBc ↓ Normal  Low, Mid, High PASS PASS PASS SEM Band1 Offset3.5-7.5MHz (at Freq+7.5MHz)  -37.5dBc ↓  PASS PASS PASS SEM Band1 Offset7.5-8.5MHz (at Freq+8.5MHz)  -47.5dBc ↓  PASS PASS PASS SEM Band1 Offset8.5-12.5MHz  -47.5dBc ↓  PASS PASS PASS 7 Adjacent Channel Leakage Power Ratio (ACLR) ACLR Offset +5/-5MHz Rel  -32.2dBc ↓ Normal, Temp L, Temp H  Low, Mid, High  PASS PASS PASS ACLR Offset +10/-10MHz Rel  -42.2dBc ↓ Normal, Temp L, Temp H  Low, Mid, High  PASS PASS PASS 8  Error Vector Magnitude(EVM) EVM at Tx output power 24dBm /-18dBm  17.5% ↓  Normal  Low, Mid, High  PASS PASS PASS 9  Peak code domain error PCDE at Tx output power 24dBm/-18dBm -14dB ↓  Normal  Low, Mid, High  PASS PASS PASS 10 Phase Discontinuity Phase Discontinuity max EVM  17.5% ↓ Normal  Mid -  PASS - Phase Discontinuity max Frequency Error -195~195Hz  -  PASS - Phase Discontinuity max 1500Hz  36 degrees ↓  -  PASS - 11 Reference Sensitivity Level  Ref Sense Go/No Go I^or=-104dBm/3.84MHz BER 0.1% ↓ Normal, Temp L, Temp H  Low, Mid, High  PASS PASS PASS 12 Maximum Input Level  Max Input Go/No Go I^or=-25.7dBm/3.84MHz BER 0.1% ↓  Normal  Mid  -  PASS -
Copyright ⓒ. 2017. All Rights Reserved. 7. General specifications 7.3 LTE B2 electrical specifications   시험 항목 Spec. Test Temperature Frequency TX Channel 18650 18900 19150 1 Maximum Output Power(class 3)  20.3~25.7dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 2 Minimum Output Power -39dBm ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 3 Frequency Error ±0.1ppm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 4 Error Vector Magnitude(EVM) 12.5%↓(16QAM, 50RB) Normal Low, Mid, High PASS PASS PASS 5 Relative Carrier Leakage Power Carrier Leakage (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 6 In-band emission In-band emission (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 7 EVM equalizer spectrum flatness EVM equalizer spectrum flatness Range1 5.4 dB ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 8 Spectrum emission mask Spectrum Emission Mask upper/lower Area 1 -16.5 dBm ↓ Normal Low, Mid, High PASS PASS PASS Spectrum Emission Mask upper/lower Area 2 -8.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 3 -11.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 4 -23.5 dBm ↓ PASS PASS PASS 9 Adjacent Channel Leakage Power Ratio ACLR E-UTRA ± -29.2dB ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS ACLR UTRA Offset 1 ± -32.2dB ↓ PASS PASS PASS ACLR UTRA Offset 2 ± -35.2dB ↓ PASS PASS PASS 10 Reference Sensitivity Level @ 10MHz  Ref Sense throughput shall be ≥ 95% -94.3 dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Table 10. LTE B2 RF specification
Copyright ⓒ. 2017. All Rights Reserved. 7. General specifications 7.4 LTE B4 electrical specifications   시험 항목 Spec. Test Temperature Frequency TX Channel 20000 20175 20350 1 Maximum Output Power(class 3)  20.3~25.7dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 2 Minimum Output Power -39dBm ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 3 Frequency Error ±0.1ppm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 4 Error Vector Magnitude(EVM) 12.5%↓(16QAM, 50RB) Normal Low, Mid, High PASS PASS PASS 5 Relative Carrier Leakage Power Carrier Leakage (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 6 In-band emission In-band emission (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 7 EVM equalizer spectrum flatness EVM equalizer spectrum flatness Range1 5.4 dB ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 8 Spectrum emission mask Spectrum Emission Mask upper/lower Area 1 -16.5 dBm ↓ Normal Low, Mid, High PASS PASS PASS Spectrum Emission Mask upper/lower Area 2 -8.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 3 -11.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 4 -23.5 dBm ↓ PASS PASS PASS 9 Adjacent Channel Leakage Power Ratio ACLR E-UTRA ± -29.2dB ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS ACLR UTRA Offset 1 ± -32.2dB ↓ PASS PASS PASS ACLR UTRA Offset 2 ± -35.2dB ↓ PASS PASS PASS 10 Reference Sensitivity Level @ 10MHz  Ref Sense throughput shall be ≥ 95% -96.3 dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Table 11. LTE B4 RF specification
Copyright ⓒ. 2017. All Rights Reserved. 7. General specifications 7.5 LTE B5 electrical specifications   시험 항목 Spec. Test Temperature Frequency TX Channel 20450 20525 20600 1 Maximum Output Power(class 3)  20.3~25.7dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 2 Minimum Output Power -39dBm ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 3 Frequency Error ±0.1ppm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 4 Error Vector Magnitude(EVM) 12.5%↓(16QAM, 50RB) Normal Low, Mid, High PASS PASS PASS 5 Relative Carrier Leakage Power Carrier Leakage (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 6 In-band emission In-band emission (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 7 EVM equalizer spectrum flatness EVM equalizer spectrum flatness Range1 5.4 dB ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 8 Spectrum emission mask Spectrum Emission Mask upper/lower Area 1 -16.5 dBm ↓ Normal Low, Mid, High PASS PASS PASS Spectrum Emission Mask upper/lower Area 2 -8.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 3 -11.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 4 -23.5 dBm ↓ PASS PASS PASS 9 Adjacent Channel Leakage Power Ratio ACLR E-UTRA ± -29.2dB ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS ACLR UTRA Offset 1 ± -32.2dB ↓ PASS PASS PASS ACLR UTRA Offset 2 ± -35.2dB ↓ PASS PASS PASS 10 Reference Sensitivity Level @ 10MHz  Ref Sense throughput shall be ≥ 95% -94.3 dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Table 12. LTE B5 RF specification
Copyright ⓒ. 2017. All Rights Reserved. 7. General specifications 7.17 LTE B17 electrical specifications Table 13. LTE B17 RF specification   시험 항목 Spec. Test Temperature Frequency TX Channel 23780 23790 23800 1 Maximum Output Power(class 3)  20.3~25.7dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 2 Minimum Output Power -39dBm ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 3 Frequency Error ±0.1ppm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 4 Error Vector Magnitude(EVM) 12.5%↓(16QAM, 50RB) Normal Low, Mid, High PASS PASS PASS 5 Relative Carrier Leakage Power Carrier Leakage (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 6 In-band emission In-band emission (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 7 EVM equalizer spectrum flatness EVM equalizer spectrum flatness Range1 5.4 dB ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 8 Spectrum emission mask Spectrum Emission Mask upper/lower Area 1 -16.5 dBm ↓ Normal Low, Mid, High PASS PASS PASS Spectrum Emission Mask upper/lower Area 2 -8.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 3 -11.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 4 -23.5 dBm ↓ PASS PASS PASS 9 Adjacent Channel Leakage Power Ratio ACLR E-UTRA ± -29.2dB ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS ACLR UTRA Offset 1 ± -32.2dB ↓ PASS PASS PASS ACLR UTRA Offset 2 ± -35.2dB ↓ PASS PASS PASS 10 Reference Sensitivity Level @ 10MHz  Ref Sense throughput shall be ≥ 95% -93.3 dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS
Copyright ⓒ. 2017. All Rights Reserved. 8. RFx information   The  strength  of  the  RF  field  produced  by  the  wireless  module  or  modules embedded in the TCU is well within all international RF exposure limits known at this time. Because the wireless modules embedded in the TCU emit less than the maximum amount of  energy permitted in  radio frequency safety standards and  recommendations,  the  manufacturer  believes  these  modules  are  safe  for use.         Regardless  of  the  power  levels,  care  should  be  taken  to  minimize  human contact during normal  operation. This module should be  remain more than  20 cm (8 inches) from the body when wireless devices are on and transmitting.   This  transmitter  must  not  be  collocated  or  operated  in  conjunction  with  any other antenna or transmitter. Operation is subject to the following two conditions: (1)  this  module  does  not  cause  interference  ,  (2)  this  module  accepts  any interference that may cause undesired operation.  8.1 Information for the integrator   The integrator must not provide information to the end user regarding how to install or remove this RF module in the user manual of the end product. The user manual that is provided by the integrator for end users must include the following information  in  a  prominent  location.  To  comply  with  FCC  RF  exposure requirements, the antenna used for this transmitter must be installed to provide a separation  distance  of at  least  20 cm  from  all  persons  and  must  not be collocated or operated in conjunction with any other antenna or transmitter. The label for the end product must include FCC ID: YZP-BK1000 or A RF transmitter inside, IC ID: 7414C-BK1000
Copyright ⓒ. 2017. All Rights Reserved. 9. Approbation FCCThis module complies with FCC/IC rules. FCC : Part 22, Part 24, Part 27IC     : RSS-130, RSS-132, RSS-133, RSS-139Furthermore, this device complies with FCC/IC radiation exposure limits set forth for uncontrolled environments.  This module must be installed and operated with minimum distance of 20 cm between the radiating element and the user.  This module must not be co-located with any other transmitters or antennasCet module est conforme à l'exposition de FCC et IC rayonnements  limites é-tablies pour un environnement non contrôlé. Cet module doit être installé et utilisé avec une distance minimale de 20 cm entre le radiateur et votre corps. Ce module ne doit pas être même endroit avec d'autres émetteur ou antennes.To comply with FCC/IC regulations limiting both the maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile-only exposure condition must not exceed the values listed in the following table. To satisfy the FCC’s exterior labeling requirements, the following text must appear on the exterior of the end product.  Contains transmitter module FCC ID: YZP-BK1000 Contains transmitter module IC ID:  7414C-BK1000 Changes or modifications to this equipment may cause harmful interference unless the modifications are expressly approved in the instruction manual. Users may lose the authority to operate this equipment if an unauthorized change or codification is made. Note: If this module is intended for use in a portable device, additional testing will be required to satisfy the RF exposure and SAR requirements of FCC Part 2.1093 and RSS-102. Band  Frequency Range [MHz]  Maximum Antenna Gain[dBi] WCDMA(B5)  826.40~846.6  4.5 WCDMA(B2)  1852.4~1907.6  2.0 LTE(B2)  1850~1910  2.0 LTE(B4)  1710~1755  2.0 LTE(B5)  824~849  4.5 LTE(B17)  704~716  4.5

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