LG Innotek BK1000 Telematics Modem User Manual 1
LG Innotek Co., Ltd. Telematics Modem 1
User Manual
| Download: |  |
| Mirror Download [FCC.gov] | |
| Document ID | 3364912 |
| Application ID | ad9/La0MXfOrw0R4BQvghg== |
| Document Description | User Manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 58.54kB (731803 bits) |
| Date Submitted | 2017-04-20 00:00:00 |
| Date Available | 2017-10-17 00:00:00 |
| Creation Date | 2017-02-22 17:25:52 |
| Producing Software | Microsoft® PowerPoint® 2010 |
| Document Lastmod | 2017-04-19 11:43:41 |
| Document Title | 슬ë¼ì´ë“œ 1 |
| Document Creator | Microsoft® PowerPoint® 2010 |
| Document Author: | Administrator |
User Guide for the LTD-BK1000 Product: LTE_WCDMA Wireless Modem Model name: LTD-BK1000 Table of Contents 1. Overview 2. Major features 3. Interface 4. Electrical specifications 5. RF specifications 6. Mechanical specifications 7. General specifications 8. Connectors 9. RFx information 10. Approbation FCC Copyright ⓒ. 2017. All Rights Reserved. 1. Overview The LTD-BK1000 is a personal mobile communication device that incorporates the latest compact radio technology, including smaller and lighter components and support for WCDMA(850/1900MHz) bands and LTE(700/850/1700/1900 MHz). This device acts as the vehicle’s telematics system and connects to WCDMA (HSPA+) and LTE wireless networks and wireless modules to allow voice and data communication. Furthermore, this device can operate on land and water as well as other similar areas. In LTE mode, the device provides uplink speeds of up to 50 Mbps and downlink speeds of up to 150 Mbps for seamless transfer of data such as movies and video calls. The device also supports the transfer of large amounts of data. The device communicates with the host system via a standard RS-232 or USB port, and AT commands and control commands can be used to send data. Voice calls are also possible. Copyright ⓒ. 2017. All Rights Reserved. 2. Major features Dimensions Weight Mechanical Interface 34 x 40 x 3.5 mm (L x W x T) (Tolerance – width, length : TBD) TBD g (max) USB, general purpose I/O pins Temperature* Operation: -20 ℃ - +70 ℃ Storage: -40 ℃ - +85 ℃ Main chipset MDM9628 Memory 4Gb(NAND) / 1Gb(SDRAM) Standard WCDMA (HSPA+) - DL Speed : 14.4 Mbps - UL Speed : 5.76 Mbps LTE - DL Speed : 150 Mbps - UL Speed : 50 Mbps Technology Band WCDMA B2, B5 LTE B2, B4, B5, B17 Power WCDMA : Typ. 24dBm (Power Class 3) LTE : Typ. 23dBm (Power Class 3) DC power 4V Functions Voice, data, SMS ETC Copyright ⓒ. 2017. All Rights Reserved. 3. Interface 3.1 LGA Pad Layout (Top View) GND12 GND10 GND6 GND5 GND GND GND GND GND GND GND11 GND4 21 A21 GND 20 C21 E21 G21 I21 K21 M21 O21 Q21 S21 U21 W21 Y21 AA21 AC21 AE21 MAIN_ANT GND GND GND GND GND GND GND GND GND GND GND GND ANT_DIV GND B20 D20 F20 GND GND MAIN_ANT_DTC_EN GND J20 L20 N20 P20 R20 T20 V20 X20 Z20 AB20 GND GND GND GND GND GND GND GND DIV_ANT_DTC_EN GND AD20 GND 19 A19 C19 E19 G19 I19 K19 M19 O19 Q19 S19 U19 W19 Y19 AA19 AC19 GND GND ADC1 GND GND GND GND GND GND GND GND GND GND ADC2 GND 18 B18 D18 GND 17 A17 VPH_PWR 16 GND 14 H18 GND J18 GND L18 GND N18 GND P18 GND R18 GND T18 GND V18 GND X18 GND Z18 GND AB18 GND GND I17 K17 M17 O17 Q17 S17 U17 W17 Y17 AA17 AC17 GND GND GND GND GND GND GND GND GND GND GND GND GND GND F16 GND H16 GND GND J16 L16 N16 P16 R16 T16 V16 GND GND GND GND GND GND GND X16 Z16 GND AB16 GND GND G15 I15 W15 Y15 AA15 AC15 GND GND GND GND GND GND GND GND VPH_PWR F14 GND H14 GND N14 GND P14 GND R14 GND X14 GND Z14 GND AB14 GND GND E13 G13 I13 M13 O13 Q13 S13 W13 Y13 AA13 AC13 GND GND GND GND GND GND GND GND GND GND GND GND GND D12 NC F12 GND H12 GND N12 GND P12 GND R12 GND X12 GND Z12 GND AB12 GND GND GND C13 B12 AE15 AD14 13 A13 12 GND GND E15 D14 AE17 AD16 C15 B14 GND GND G17 D16 AE19 AD18 E17 VPH_PWR VPH_PWR F18 C17 B16 15 A15 AE13 GND AD12 GND GND 11 A11 C11 E11 G11 I11 M11 O11 Q11 S11 W11 Y11 AA11 AC11 GND GND GND GND GND GND GND GND GND SGMII_RX_M SGMII_TX_P EPHY_RST_N SGMII_CLK 10 B10 D10 GND 9 A9 VPH_PWR GND SGMII_TX_M SGMII_DATA Y9 AA9 AC9 VREG_L11_1P8 GND NC NC GND GND GND GND GND GND GND GND D8 F8 VREG_L11_1P8 H8 GND GND N8 P8 R8 GND GND GND X8 Z8 MDM2AP_INT_N AB8 AP2MDM_INT_N AE11 EPHY_INT_N AD10 W9 GND AE9 MDM_JTAG_SRST_N AD8 MDM_JTAG_TCK MDM_JTAG_PS_HOLD C7 E7 G7 I7 W7 Y7 AA7 AC7 VPH_PWR GND NC SPI_LEVEL_SHIFT_EN GND COEX_UART_RX GND MDM_JTAG_TMS D6 F6 GND H6 GPIO J6 ACC_PWR_ON L6 GND N6 GPIO P6 GPIO R6 GND T6 SPI_CS_N V6 SPI_CLK X6 GND Z6 DSRC_SLP_CLK AB6 COEX_UART_TX MDM_JTAG_TDO E5 G5 I5 K5 M5 O5 Q5 S5 U5 W5 Y5 AA5 AC5 NC GPIO GND BOOT_OK UART1_TX UART2_TX UART3_TX SPI_INTERRUPT SPI_MOSI SPI_MISO GND WLAN_3V_EN_DSRC GND GND D4 F4 NC H4 GND J4 MGS L4 GND N4 UART1_RX P4 UART2_RX R4 UART3_RX T4 GND V4 GND X4 GND Z4 RFCLK2_QCA AB4 DSRC_PPS GND G3 I3 K3 M3 O3 Q3 S3 U3 W3 Y3 AA3 AC3 LGA_RESIN_N GND 96H_END UIM1_PRESENT GND GND GND SDC_DATA3 SDC_DATA2 GND PCM_EN PCM_DIN WLAN_EN_DSRC GND GND VREG_L6_UIM1 E1 GND H2 J2 UIM1_CLK G1 GND I1 UIM1_RESET UIM1_DATA GND L2 USB_ID K1 P2 USB_HS_DM M1 USB_VBUS N2 GND O1 USB_HS_DP GND R2 SDC_DATA1 Q1 Z2 PCM_CLK W1 GND X2 GND U1 SDC_CLK V2 SDC_DATA0 S1 SDC_CMD T2 AB2 GND Y1 PCM_SYNC PCM_DOUT GND AA AE5 GND AE3 VREG_L5_UIM2 AD2 HSIC_DATA AA1 MDM_JTAG_TDI Ehernet_DC-DC_EN E3 F2 NC AC1 AE1 HSIC_STB AB MDM_JTAG_TRST_N AD4 C3 D2 AE7 AD6 C5 C1 SGMII_RX_P AB10 S9 GND GND GND Z10 Q9 B2 1 A1 GND X10 O9 MDM_RESOUT_N PHONE_ON_N GND R10 M9 B4 3 A3 GND P10 I9 GND GND GND N10 G9 B6 5 A5 H10 E9 VPH_PWR VPH_PWR F10 C9 B8 7 A7 GND9 H20 AC NC AD AE GND2 GND GND GND GND GND GND GND8 GND7 GND3 GND1 Figure 1. LGA Pin map Copyright ⓒ. 2017. All Rights Reserved. 3. Interface 3.2 Pin description PAD. NAME Antenna Interface Pads C21 MAIN_ANT AC21 DIV_ANT User Interface Pads H6 ACC_PWR_ON I5 BOOT_OK H4 MSG G3 96H_END F20 MAIN_ANT_DTC_EN Z20 DIV_ANT_DTC_EN I7 SPI_LEVEL_SHIFT_EN AD4 ETHERNET_DCDC_ENABLE F6 GPIO1 E5 GPIO2 L6 GPIO3 DIRECTION Input/Output Input/Output RF Main Antenna RF Diversity Antenna Input Output Output Output Output Output Output Output Input/Output (Do not use with External PU) ACC_PWR_ON BOOT_OK MSG 96H_END Main ANT Detect Enable Diversity ANT Detect Enable SPI LEVEL SHIFT Enable Ethernet power enable General purpose I/O Input/Output (Not support INTERR UPT) N6 GPIO4 ADC Interface Pads E19 ADC1 Input AA19 ADC2 Input PCM Interface Pads W3 PCM_EN X2 PCM_CLK W1 PCM_SYNC Y3 PCM_DIN Y1 PCM_DOUT JTAG Pin Description AC7 MDM_JTAG_TMS AD8 MDM_JTAG_PS_HOLD AD6 MDM_JTAG_TDI AE7 MDM_JTAG_TRST_N AB6 MDM_JTAG_TDO AB8 MDM_JTAG_TCK AE9 MDM_JTAG_SRST_N USB Interface Pads N2 USB_HS_DM M1 USB_HS_DP K1 USB_VBUS L2 USB_ID SDIO Interface Pads S1 SDC_CLK Q1 SDC_CMD T2 SDC_DATA0 R2 SDC_DATA1 S3 SDC_DATA2 DESCRIPTION General purpose I/O General purpose I/O General purpose I/O ADC Convertor input for main antenna detect ADC Convertor input for diversity antenna detect Output Input Input Input Output PCM 3.3 Level Shifter Enable PCM Clock PCM Frame Sync PCM Data In PCM Data Out Input/Output input Input Input Output Input Input JTAG mode select input JTAG PS HOLD detect JTAG data input JTAG reset for debug JTAG debugging JTAG clock input JTAG reset Input/Output Input/Output Input Input USB high speed data (minus) USB high speed data (plus) USB power USB ID Output Output Input/Output Input/Output Input/Output Secure digital controller clock Secure digital controller command Secure digital controller data bit 0 Secure digital controller data bit 1 Secure digital controller data bit 2 Table 1. Pin descriptions Copyright ⓒ. 2017. All Rights Reserved. 3. Interface Q3 SDC_DATA3 SGMMI Interface Pads Input/Output Secure digital controller data bit 3 AA11 EPHY_RST_N or UIM2_RESET Output Ethernet PHY reset AE11 EPHY_INT_N or UIM2_DETECT Input Ethernet PHY interrupt Input/Output Input Input Output Output Output SGMII input Output data Ground SGMII receive - plus SGMII receive -minus SGMII transmit - plus SGMII transmit -minus SGMII clock Output Output Output Input Input SPI Serial Output SPI Serial Clock SPI Chip Select SPI Serial input MICOM → LGA SPI interrupt Output Input Output Input Output Input UART2 Transmit data UART2 Receive data Debug UART5 Transmit Data Debug UART5 Receive Data UART6 Transmit data UART6 Receive data Input Output Output Detection of an external UIM card Clock Output to an external UIM card Reset Output to an external UIM card Data connection with an external UIM card AB10 SGMII_DATA or UIM2_CLK AD10 GND X10 SGMII_RX_P W11 SGMII_RX_M Z10 SGMII_TX_M Y11 SGMII_TX_P AC11 SGMII_CLK or UIM2_DATA SPI Interface Pads S5 SPI_MOSI T6 SPI_CLK R6 SPI_CS_N U5 SPI_MISO Q5 SPI_INTERRUPT UART Interface Pads M5 UART2_TX N4 UART2_RX K5 UART1_TX L4 UART1_RX O5 UART3_TX P4 UART3_RX USIM Interface Pads I3 UIM1_PRESENT H2 UIM1_CLK E1 UIM1_RESET G1 UIM1_DATA Input/Output F2 VREG_L6_UIM1 Output E3 GND D2 GND A1 GND C1 GND B2 GND HSIC Pin Description AB2 HSIC_DATA AC1 HSIC_STB AD2 NC AE1 NC DSRC Pin Description Supply Output for an external UIM card Ground Ground Ground Ground Ground Input/Output Input/Output Y7 COEX_UART_RX Input Z6 COEX_UART_TX Output X4 AA3 RFCLK2_QCA WLAN_EN_DSRC Output Output HSIC data HSIC Strobe signal No Connect No Connect LTE receiver sync for coexistence with UART LTE transmitter sync for coexistence with UART Low noise RF clock Output WLAN Enable Table 1. Pin descriptions Copyright ⓒ. 2017. All Rights Reserved. 3. Interface X6 DSRC_SLP_CLK Y5 WLAN_3V_EN_DSRC Z4 DSRC_PPS X8 MDM2AP_INT_N Z8 AP2MDM_INT_N Control Pads A3 LGA_PHONE_ON B4 MDM_RESOUT_N C3 LGA_RESIN_N Power Supply Pads A17 VPH_PWR for PAM B16 VPH_PWR for PAM A15 VPH_PWR for PAM B14 VPH_PWR for PAM A9 VPH_PWR for PMIC B8 VPH_PWR for PMIC A7 VPH_PWR for PMIC C7 VPH_PWR for PMIC Voltage Reference Pad C9 VREG_L11_1P8 D8 VREG_L11_1P8 Voltage Reference for SGMII AE3 (VREG_L5_UIM2) – Ethernet IO전압 level NC Pads G9 NC B12 NC I9 NC G7 NC C5 NC D4 NC A21 E21 G21 I21 K21 M21 O21 Q21 S21 U21 W21 Y21 AA21 AE21 B20 D20 H20 J20 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Output Output Input/Output Output Input DSRC sleep clock Used for WLAN enable Pulse Per Second MDM to AP interrupt, PCM_LDO_EN AP to MDM interrupt Input Output Input ON/OFF Control Reset Output External Reset Input Input Input Input Input Input Input Input Input power supply (4.0V) power supply (4.0V) power supply (4.0V) power supply (4.0V) power supply (4.0V) power supply (4.0V) power supply (4.0V) power supply (4.0V) Output Output LDO out for 1.8V pull up LDO out for 1.8V pull up Output Ethernet I/O voltage No Connect No Connect No Connect No Connect No Connect No Connect Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Table 1. Pin descriptions Copyright ⓒ. 2017. All Rights Reserved. 3. Interface L20 N20 P20 R20 T20 V20 X20 AB20 AD20 A19 C19 G19 I19 K19 M19 O19 Q19 S19 U19 W19 Y19 AC19 AE19 B18 D18 F18 H18 J18 L18 N18 P18 R18 T18 V18 X18 Z18 AB18 AD18 C17 E17 G17 I17 K17 M17 O17 Q17 S17 U17 W17 Y17 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Table 1. Pin descriptions Copyright ⓒ. 2017. All Rights Reserved. 3. Interface AA17 AC17 AE17 D16 F16 H16 J16 L16 N16 P16 R16 T16 V16 X16 Z16 AB16 AD16 C15 E15 G15 I15 W15 Y15 AA15 AC15 AE15 D14 F14 H14 X14 Z14 AB14 AD14 A13 C13 E13 G13 I13 W13 Y13 AA13 AC13 AE13 D12 F12 H12 X12 Z12 AB12 AD12 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Table 1. Pin descriptions Copyright ⓒ. 2017. All Rights Reserved. 3. Interface A11 C11 E11 G11 I11 B10 D10 F10 H10 E9 W9 Y9 AA9 AC9 F8 H8 E7 W7 AA7 B6 D6 J6 P6 V6 A5 W5 AA5 AC5 AE5 F4 J4 R4 T4 V4 AB4 K3 M3 O3 U3 AC3 J2 P2 V2 Z2 I1 O1 U1 AA1 GND1 GND2 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Table 1. Pin descriptions Copyright ⓒ. 2017. All Rights Reserved. 3. Interface GND3 GND4 GND5 GND6 GND7 GND8 GND9 GND1 GND11 GND1 N14 P14 R14 M13 O13 Q13 S13 N12 P12 R12 M11 O11 Q11 S11 N10 P10 R10 M9 O9 Q9 S9 N8 P8 R8 G5 GND GND GND GND GND GND GND Ground Ground Ground Ground Ground Ground Ground GND Ground GND Ground GND Ground GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Table 1. Pin descriptions Copyright ⓒ. 2017. All Rights Reserved. 3. Interface 3.3 USB This device supports universal serial bus (USB) connections for high-speed data communication. The relevant hardware satisfies the USB 2.0 specifications and supports maximum communications speeds of 480 Mbps Pin NO. Signal Name Pin I/O (Modem host) Function Description M1 USB_D+ IO USB Differential data line (+) N2 USB_D- IO USB Differential data line (-) K1 USB_VBUS USB Power Supply Table 2. USB Pin descriptions Copyright ⓒ. 2017. All Rights Reserved. 3. Interface 3.4 Audio This module includes a PCM interface. The pull-up and pull-down resistors attached to these pin must provide more than 50 Kohm of resistance. Pin NO. Pin I/O (Modem host) Signal Name Function Description W1 PCM_SYNC PCM Interface sync X2 PCM_CLK PCM Interface clock Y1 PCM_TXD PCM Interface digital audio data out Y3 PCM_RXD PCM Interface digital audio data in Table 3. PCM Pin descriptions 3.5 User interface Pin No. Signal Name Direction Function I5 BOOT_OK Indicates that the Modem boot is complete. C3 RESET_IN Control line to unconditionally restart the module. H4 MSG Indicates that the Modem receive Urgent message. G3 96H_END Indicates that the 96hr sleep mode is end. H6 ACC_ON_SLEEP Control line to power on or 96hr sleep mode. A3 Phone_ON Control line to power on / off Table 4. User interface Pin descriptions Copyright ⓒ. 2017. All Rights Reserved. 4. Electrical specifications 4.1 Power supply specifications The host system provides the power supply (V_BATT)DC 4 V, 2.5 A to the device. The internal power supply module manages the power supplied to the integral circuits and maintains constant voltages. This module also controls each power block to minimize power consumption. In particular, the PAM (power amplifier module) consumes a lot of power, so it receives a direct power supply of 4 V from the V_BATT. Therefore the V_BATT signal inputs only the supply power of the PAM, even when the absolute rating is higher. In addition, the entire power input module blocks and protects against high surges and ESD in the NAD module. Pin No. Signal Name Direction MIN TYP MAX A7,C7,B8,A9, B14,A15,B16, A17 V_BATT 3.9 V 4V 4.1 V Table 5. Power supply specifications Copyright ⓒ. 2017. All Rights Reserved. 4. Electrical specifications 4.2 Logic level specifications 4.2.1 Digital logic level specifications Signal Name Type BOOT_OK RESET_IN MSG 96H_END ACC_ON_SLEEP Low Min -0.3 High Max 0.45 0.63 0.45 0.45 0.63 Min 1.35 1.17 1.35 1.35 1.17 Table 6. Digital logic level specifications Copyright ⓒ. 2017. All Rights Reserved. Max 1.8 1.8 1.8 1.8 1.8 Unit 5. RF specifications 5.1 WCDMA 5.1.1 Receiver .- Bandwidth : 5MHz .- Frequency : 869MHz – 894MHz (B5), 1930MHz – 1990MHz (B2) .- RF to Baseband Direct conversion (Zero IF) .- Modulation method : QPSK, 16QAM .- Sensitivity : ≤-104dBm (BER = Under 0.1%) 5.1.2 Transmitter .- Frequency: 824MHz – 849MHz (B5), 1850MHz – 1910MHz (B2) .- Maximum RF Output : Power class3 , 20.3dBm ~ 25.7dBm .- Modulation method : QPSK .- Baseband to RF Direct conversion (Zero IF) 5.2 LTE 5.2.1 Receiver .- Bandwidth : B2/B4(5 MHz, 10 MHz, 15 MHz, 20 MHz), B5/B17(5 MHz, 10 MHz) .- Frequency : B2 (1930 MHz – 1990 MHz), B4 (2110 MHz – 2155 MHz), B5 (869 MHz – 894 MHz), B17 (734 MHz – 746 MHz) .- RF to Baseband Direct conversion (Zero IF) .- Modulation method : QPSK, 16QAM and 64QAM .- Sensitivity : B2 (≤-94.3dBm @QPSK, BW:10 MHz), B4 (≤-96.3dBm @QPSK, BW:10 MHz), B5 (≤-94.3dBm @QPSK, BW:10 MHz), B17 (≤-93.3dBm @QPSK, BW:10 MHz) Copyright ⓒ. 2017. All Rights Reserved. 5. RF specifications 5.2.2 Transmitter .- Frequency: B2 (1850 MHz – 1910 MHz), B4 (1710 MHz – 1755 MHz),B5 (824 MHz – 849 MHz), B17 (704 MHz – 716MHz) .- Maximum RF Output : Power class3 , 20.3dBm ~ 25.7dBm .- Modulation method : QPSK and 16QAM .- Baseband to RF Direct conversion (Zero IF) Copyright ⓒ. 2017. All Rights Reserved. 6. Mechanical specifications 6.1 Environment specifications .- Storage temp.: -40 ℃ - +85 ℃ .- Operating temp.: -20 ℃ - +70 ℃ (-20 ℃ - +70 ℃ : 3GPP specifications are satisfied -30 ℃ - -20 ℃, +70 ℃ - +80 ℃ : May cause performance degradation) .- Operating humidity: 80% (60℃) relative humidity Copyright ⓒ. 2017. All Rights Reserved. 6. Mechanical specifications 6.1 Mechanical dimensions Dimensions 34 x 40.0 x 3.5 mm (L x W x T) (Tolerance – width, length : TBD) Weight TBD grams(max.) Modem interface connector 12709HS-H40 (Manufacture vendor : YUNHO) Modem antenna Connector (Plug) KR15005-DD , KR15005-DG (Manufacture vendor : KET) Table 7. Mechanical specification Figure 2. Mechanical dimension Copyright ⓒ. 2017. All Rights Reserved. 7. General specifications 7.1 WCDMA B5 electrical specifications TEST ITEM Spec. Test Temperature Test Freq uency Normal, Temp L, Te mp H Normal, Temp L, Te mp H Low, Mid, High Low, Mid, High CHANNEL 4357 4400 4458 PASS PASS PASS PASS PASS PASS Maximum Output Power 20.3~25.7dBm Frequency Error -195 ~ +195Hz Inner Loop Power Control in the Uplin PASS Normal Mid PASS Low, Mid, High PASS PASS PASS Low, Mid, High PASS PASS PASS PASS PASS PASS PASS PASS PASS Minimum Output Power -49dBm ↓ Normal, Temp L, Te mp H Occupied Bandwidth (OBW) 5MHz ↓ Normal Spectrum emis sion mask Adjacent Chan nel Leakage Po wer Ratio (ACL R) SEM Band1 Offset2. 5-3.5MHz (at Freq+3. 5MHz) -48.5dBc ↓ SEM Band1 Offset3. 5-7.5MHz (at Freq+7. 5MHz) -37.5dBc ↓ SEM Band1 Offset7. 5-8.5MHz (at Freq+8. 5MHz) -47.5dBc ↓ PASS PASS PASS SEM Band1 Offset8. 5-12.5MHz -47.5dBc ↓ PASS PASS PASS ACLR Offset +5/-5M Hz Rel -32.2dBc ↓ Normal, Temp L, Te mp H Low, Mid, High PASS PASS PASS ACLR Offset +10/-10 MHz Rel -42.2dBc ↓ Normal, Temp L, Te mp H Low, Mid, High PASS PASS PASS Normal Low, Mid, High Error Vector M agnitude(EVM) EVM at Tx output po wer 24dBm /-18dBm 17.5% ↓ Normal Low, Mid, High PASS PASS PASS Peak code do main error PCDE at Tx output p ower 24dBm/-18dBm -14dB ↓ Normal Low, Mid, High PASS PASS PASS Phase Discontinuity max EVM 17.5% ↓ PASS Phase Discontinuity max Frequency Error -195~195Hz PASS Phase Discontinuity max 1500Hz 36 degrees ↓ PASS 10 Phase Disconti nuity Normal Mid 11 Reference Sen sitivity Level Ref Sense Go/No Go I^or=-104dBm/3.84M Hz BER 0.1% ↓ Normal, Temp L, Te mp H Low, Mid, High PASS PASS PASS 12 Maximum Inpu t Level Max Input Go/No Go I^or=-25.7dBm/3.84M Hz BER 0.1% ↓ Normal Mid PASS Table 8. WCDMA B5 RF specification Copyright ⓒ. 2017. All Rights Reserved. 7. General specifications 7.2 WCDMA B2 electrical specifications Test Temperature Test Freq uency Normal, Temp L, Te mp H Normal, Temp L, Te mp H Low, Mid, High Low, Mid, High TEST ITEM Spec. Maximum Output Power 20.3~25.7dBm Frequency Error -195 ~ +195Hz Inner Loop Power Control in the Uplin PASS Normal Low, Mid, High Minimum Output Power -49dBm ↓ Normal, Temp L, Te mp H Occupied Bandwidth (OBW) 5MHz ↓ Normal Spectrum emis sion mask Adjacent Chan nel Leakage Po wer Ratio (ACL R) CHANNEL 9662 9800 9938 PASS PASS PASS PASS PASS PASS Mid PASS Low, Mid, High PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS PASS SEM Band1 Offset2. 5-3.5MHz (at Freq+3. 5MHz) -48.5dBc ↓ SEM Band1 Offset3. 5-7.5MHz (at Freq+7. 5MHz) -37.5dBc ↓ SEM Band1 Offset7. 5-8.5MHz (at Freq+8. 5MHz) -47.5dBc ↓ PASS PASS PASS SEM Band1 Offset8. 5-12.5MHz -47.5dBc ↓ PASS PASS PASS ACLR Offset +5/-5M Hz Rel -32.2dBc ↓ Normal, Temp L, Te mp H Low, Mid, High PASS PASS PASS ACLR Offset +10/-10 MHz Rel -42.2dBc ↓ Normal, Temp L, Te mp H Low, Mid, High PASS PASS PASS Normal Low, Mid, High Error Vector M agnitude(EVM) EVM at Tx output po wer 24dBm /-18dBm 17.5% ↓ Normal Low, Mid, High PASS PASS PASS Peak code do main error PCDE at Tx output p ower 24dBm/-18dBm -14dB ↓ Normal Low, Mid, High PASS PASS PASS Phase Discontinuity max EVM 17.5% ↓ PASS Phase Discontinuity max Frequency Error -195~195Hz PASS Phase Discontinuity max 1500Hz 36 degrees ↓ PASS 10 Phase Disconti nuity Normal Mid 11 Reference Sen sitivity Level Ref Sense Go/No Go I^or=-104dBm/3.84M Hz BER 0.1% ↓ Normal, Temp L, Te mp H Low, Mid, High PASS PASS PASS 12 Maximum Inpu t Level Max Input Go/No Go I^or=-25.7dBm/3.84M Hz BER 0.1% ↓ Normal Mid PASS Table 9. WCDMA B2 RF specification Copyright ⓒ. 2017. All Rights Reserved. 7. General specifications 7.3 LTE B2 electrical specifications TX Channel 시험 항목 Spec. Test Temperature Frequency Maximum Output Power(class 3) 20.3~25.7dBm Normal, Temp L, Temp H Minimum Output Power -39dBm ↓ Frequency Error Error Vector Magnitude(EVM) 18650 18900 19150 Low, Mid, High PASS PASS PASS Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS ±0.1ppm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 12.5%↓(16QAM, 50RB) Normal Low, Mid, High PASS PASS PASS Relative Carrier Leakage Power Carrier Leakage (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS In-band emission In-band emission (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS EVM equalizer spectrum flatness EVM equalizer spectrum flatness Range1 5.4 dB ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Spectrum Emission Mask upper/lower Area 1 -16.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 2 -8.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 3 -11.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 4 -23.5 dBm ↓ PASS PASS PASS ACLR E-UTRA ± -29.2dB ↓ PASS PASS PASS ACLR UTRA Offset 1 ± -32.2dB ↓ PASS PASS PASS ACLR UTRA Offset 2 ± -35.2dB ↓ PASS PASS PASS Ref Sense throughput shall be ≥ 95% -94.3 dBm PASS PASS PASS 10 Spectrum emission mask Adjacent Channel Leakage Power Ratio Reference Sensitivity Level @ 10MHz Normal Normal, Temp L, Temp H Normal, Temp L, Temp H Table 10. LTE B2 RF specification Copyright ⓒ. 2017. All Rights Reserved. Low, Mid, High Low, Mid, High Low, Mid, High 7. General specifications 7.4 LTE B4 electrical specifications TX Channel 시험 항목 Spec. Test Temperature Frequency Maximum Output Power(class 3) 20.3~25.7dBm Normal, Temp L, Temp H Minimum Output Power -39dBm ↓ Frequency Error Error Vector Magnitude(EVM) 20000 20175 20350 Low, Mid, High PASS PASS PASS Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS ±0.1ppm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 12.5%↓(16QAM, 50RB) Normal Low, Mid, High PASS PASS PASS Relative Carrier Leakage Power Carrier Leakage (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS In-band emission In-band emission (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS EVM equalizer spectrum flatness EVM equalizer spectrum flatness Range1 5.4 dB ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Spectrum Emission Mask upper/lower Area 1 -16.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 2 -8.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 3 -11.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 4 -23.5 dBm ↓ PASS PASS PASS ACLR E-UTRA ± -29.2dB ↓ PASS PASS PASS ACLR UTRA Offset 1 ± -32.2dB ↓ PASS PASS PASS ACLR UTRA Offset 2 ± -35.2dB ↓ PASS PASS PASS Ref Sense throughput shall be ≥ 95% -96.3 dBm PASS PASS PASS 10 Spectrum emission mask Adjacent Channel Leakage Power Ratio Reference Sensitivity Level @ 10MHz Normal Normal, Temp L, Temp H Normal, Temp L, Temp H Table 11. LTE B4 RF specification Copyright ⓒ. 2017. All Rights Reserved. Low, Mid, High Low, Mid, High Low, Mid, High 7. General specifications 7.5 LTE B5 electrical specifications TX Channel 시험 항목 Spec. Test Temperature Frequency Maximum Output Power(class 3) 20.3~25.7dBm Normal, Temp L, Temp H Minimum Output Power -39dBm ↓ Frequency Error Error Vector Magnitude(EVM) 20450 20525 20600 Low, Mid, High PASS PASS PASS Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS ±0.1ppm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 12.5%↓(16QAM, 50RB) Normal Low, Mid, High PASS PASS PASS Relative Carrier Leakage Power Carrier Leakage (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS In-band emission In-band emission (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS EVM equalizer spectrum flatness EVM equalizer spectrum flatness Range1 5.4 dB ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Spectrum Emission Mask upper/lower Area 1 -16.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 2 -8.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 3 -11.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 4 -23.5 dBm ↓ PASS PASS PASS ACLR E-UTRA ± -29.2dB ↓ PASS PASS PASS ACLR UTRA Offset 1 ± -32.2dB ↓ PASS PASS PASS ACLR UTRA Offset 2 ± -35.2dB ↓ PASS PASS PASS Ref Sense throughput shall be ≥ 95% -94.3 dBm PASS PASS PASS 10 Spectrum emission mask Adjacent Channel Leakage Power Ratio Reference Sensitivity Level @ 10MHz Normal Normal, Temp L, Temp H Normal, Temp L, Temp H Table 12. LTE B5 RF specification Copyright ⓒ. 2017. All Rights Reserved. Low, Mid, High Low, Mid, High Low, Mid, High 7. General specifications 7.17 LTE B17 electrical specifications TX Channel 시험 항목 Spec. Test Temperature Frequency Maximum Output Power(class 3) 20.3~25.7dBm Normal, Temp L, Temp H Minimum Output Power -39dBm ↓ Frequency Error Error Vector Magnitude(EVM) 23780 23790 23800 Low, Mid, High PASS PASS PASS Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS ±0.1ppm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS 12.5%↓(16QAM, 50RB) Normal Low, Mid, High PASS PASS PASS Relative Carrier Leakage Power Carrier Leakage (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS In-band emission In-band emission (3.2dBm ± 3.2dB) -24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS EVM equalizer spectrum flatness EVM equalizer spectrum flatness Range1 5.4 dB ↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS Spectrum Emission Mask upper/lower Area 1 -16.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 2 -8.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 3 -11.5 dBm ↓ PASS PASS PASS Spectrum Emission Mask upper/lower Area 4 -23.5 dBm ↓ PASS PASS PASS ACLR E-UTRA ± -29.2dB ↓ PASS PASS PASS ACLR UTRA Offset 1 ± -32.2dB ↓ PASS PASS PASS ACLR UTRA Offset 2 ± -35.2dB ↓ PASS PASS PASS Ref Sense throughput shall be ≥ 95% -93.3 dBm PASS PASS PASS 10 Spectrum emission mask Adjacent Channel Leakage Power Ratio Reference Sensitivity Level @ 10MHz Normal Normal, Temp L, Temp H Normal, Temp L, Temp H Table 13. LTE B17 RF specification Copyright ⓒ. 2017. All Rights Reserved. Low, Mid, High Low, Mid, High Low, Mid, High 8. RFx information The strength of the RF field produced by the wireless module or modules embedded in the TCU is well within all international RF exposure limits known at this time. Because the wireless modules embedded in the TCU emit less than the maximum amount of energy permitted in radio frequency safety standards and recommendations, the manufacturer believes these modules are safe for use. Regardless of the power levels, care should be taken to minimize human contact during normal operation. This module should be remain more than 20 cm (8 inches) from the body when wireless devices are on and transmitting. This transmitter must not be collocated or operated in conjunction with any other antenna or transmitter. Operation is subject to the following two conditions: (1) this module does not cause interference , (2) this module accepts any interference that may cause undesired operation. 8.1 Information for the integrator The integrator must not provide information to the end user regarding how to install or remove this RF module in the user manual of the end product. The user manual that is provided by the integrator for end users must include the following information in a prominent location. To comply with FCC RF exposure requirements, the antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operated in conjunction with any other antenna or transmitter. The label for the end product must include FCC ID: YZP-BK1000 or A RF transmitter inside, IC ID: 7414C-BK1000 Copyright ⓒ. 2017. All Rights Reserved. 9. Approbation FCC This module complies with FCC/IC rules. FCC : Part 22, Part 24, Part 27 IC : RSS-130, RSS-132, RSS-133, RSS-139 Furthermore, this device complies with FCC/IC radiation exposure limits set forth for uncontrolled environments. This module must be installed and operated with minimum distance of 20 cm between the radiating element and the user. This module must not be co-located with any other transmitters or antennas Cet module est conforme à l'exposition de FCC et IC rayonnements limites é-tablies pour un environnement non contrôlé. Cet module doit être installé et utilisé avec une distance minimale de 20 cm entre le radiateur et votre corps. Ce module ne doit pas être même endroit avec d'autres émetteur ou antennes. To comply with FCC/IC regulations limiting both the maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile-only exposure condition must not exceed the values listed in the following table. Band Frequency Range [MHz] Maximum Antenna Gain[dBi] WCDMA(B5) 826.40~846.6 4.5 WCDMA(B2) 1852.4~1907.6 2.0 LTE(B2) 1850~1910 2.0 LTE(B4) 1710~1755 2.0 LTE(B5) 824~849 4.5 LTE(B17) 704~716 4.5 To satisfy the FCC’s exterior labeling requirements, the following text must appear on the exterior of the end product. Contains transmitter module FCC ID: YZP-BK1000 Contains transmitter module IC ID: 7414C-BK1000 Changes or modifications to this equipment may cause harmful interference unless the modifications are expressly approved in the instruction manual. Users may lose the authority to operate this equipment if an unauthorized change or codification is made. Note: If this module is intended for use in a portable device, additional testing will be required to satisfy the RF exposure and SAR requirements of FCC Part 2.1093 and RSS-102. Copyright ⓒ. 2017. All Rights Reserved.
Source Exif Data:
File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.5 Linearized : No Language : ko-KR Tagged PDF : Yes XMP Toolkit : Adobe XMP Core 5.4-c005 78.147326, 2012/08/23-13:03:03 Format : application/pdf Creator : Administrator Title : 슬라이드 1 Create Date : 2017:02:22 17:25:52+09:00 Creator Tool : Microsoft® PowerPoint® 2010 Modify Date : 2017:04:19 11:43:41+09:00 Metadata Date : 2017:04:19 11:43:41+09:00 Producer : Microsoft® PowerPoint® 2010 Document ID : uuid:9c5ea767-877e-481b-a229-afb5c51f811e Instance ID : uuid:283c83b1-a69b-4457-8467-97c411034976 Page Count : 27 Author : AdministratorEXIF Metadata provided by EXIF.tools