Laird Connectivity FREESTAR3 FreeStar Tranceiver Module User Manual

LS Research, LLC FreeStar Tranceiver Module

User Manual

FreeStar Transceiver ModuleCalifornia Eastern Laboratories (CEL)'s FreeStar Module is a small, fully-integrated, drop-in RF transmission solution that is ideal for ZigBee and other low cost, low power IEEE 802.15.4 RF transmission applications. FreeStar incorporates the MC13202 transceiver IC and MC9S08GT60 microprocessor from Freescale with a power amplier and an Inverted-F PCB antenna. It delivers up to 4,000 feet of range and features a streamlined communications protocol that results in the lowest power consumption in transmit mode of any Module on the market. The FreeStar is also FCC and CE Certied, which eliminates the need for a costly and time-consuming approval process when incorporated into your design.Integrated Transceiver Module for ZigBee®/IEEE 802.15.4 The information in this document is subject to change without notice, please conrm data is currentDocument No: 0001-00-07-01-000Date Published: October 26, 2012PRELIMINARY DATA SHEETDESCRIPTIONZFSM-101-3 • Communication Modes: Point-to-Point, Point-to Multipoint, Mesh Networking • 4,000+ feet Line of Sight Performance • Small Form Factor: 1.4” x 1.0” • Integrated PCB Trace Antenna • FCC, IC and CE Certified • RoHS Compliance • Direct Sequence Spread Spectrum • CSMA-CA • Wireless Boot Loader • Flash-Based/Upgradable• 10 Bit A/D (2 inputs)• General Purpose I/O (8 ports)• Microsoft® Windows® -Based Configuration and Test Tool• Simple Serial UART Interface• Over 65,000 Network AddressesFEATURESFreeStar ZFSM-101-3• Transmit Power: 100 mW • Receive Sensitivity: -91 dBm • RF Data Rate: 250 kbps• Based on the Freescale MC13202 transceiver IC • 8-bit HCS08-based MCU APPLICATIONSHealth Care• Patient Monitoring• Fitness MonitoringIndustrial Controls• Asset Tracking and Monitoring• Homeland Security• Process Management• Environmental Monitoring and Control• Heating, Ventilation, Air-Conditioning (HVAC)• Automated Meter Reading (AMR)Consumer• Human Interface Devices (keyboard, mice, etc.)• Remote Control• Wireless ToysResidential and Commercial Automation • Lighting Control• Security• Access Control• Heating, Ventilation, Air-Conditioning (HVAC)• Automated Meter Reading (AMR)Part Number Order Number Description Mins/Mults StatusFreeStarZFSM-101-3 ZFSM-101-3 FreeStar 100mW transceiver module PCB Trace Antenna with / Freescale MC13202 200 pcs / 200 pcs Not Recommended For New DesignsORDERING INFORMATION
FreeStar ZFSM-101-3Page 2Introduction and OverviewDescription..............................................................................................................................................................................................1Features.................................................................................................................................................................................................. 1Applications............................................................................................................................................................................................ 1Ordering Information.............................................................................................................................................................................1Module Block Diagram...........................................................................................................................................................................3Development Kit..................................................................................................................................................................................... 3System Level FunctionTransceiver IC......................................................................................................................................................................................... 3Electrical SpecicationAntenna...................................................................................................................................................................................................4Absolute Maximum Ratings...................................................................................................................................................................4Recommended Operating Conditions................................................................................................................................................... 4Electrical Characteristics.......................................................................................................................................................................5Typical Transmit Power vs. Power Setting.......................................................................................................................................... 5Pin Signal & InterfacesPin Denitions........................................................................................................................................................................................ 6Connector Legend.................................................................................................................................................................................. 7Connector Conguration....................................................................................................................................................................... 7Radiation Patterns.................................................................................................................................................................................. 8Example Interface Diagrams.................................................................................................................................................................. 9Module Dimensions................................................................................................................................................................................ 10Module Keepouts.................................................................................................................................................................................... 11Processing......................................................................................................................................................................................... 12Shipment, Storage and Handling............................................................................................................................................. 13Quality.................................................................................................................................................................................................. 13Agency Certications................................................................................................................................................................... 14References and Revision History............................................................................................................................................ 16TABLE OF CONTENTS
FreeStar ZFSM-101-3Page 3The Freestar ZFSM-101-3 Module replaces the ZFSM-101-2 Module. The difference between the two modules is the replacement of the power amplier. The design was optimized to provide similar output power between the two designs so that there are no perceived changes by existing customers or designs. The ZFSM-101-3 can use the rmware for the ZFSM-101-2.The power shaping restrictions for FCC/IC and ETSI compliance are listed in the table below for reference. The power setting restrictions must be adhered to.TRANSCEIVER ICCercaon RF Channel Valid TX Power StepsTypical Output PowerFCC/IC11 thru 23 0-30 20 dBm24 0-18 16.8 dBm25 0-14 10.8 dBm26 0-6 2.7 dBmETSI 11-26 6 2.7 dBmMODULE BLOCK DIAGRAMDEVELOPMENT KITNo Longer Available.ANTPA Enable16MHzXTALBUSFreeStar ModuleMCU RadioBalunBalunPA LPF
FreeStar ZFSM-101-3Page 4ABSOLUTE MAXIMUM RATINGS Rating Value UnitPower Supply Voltage 3.6 VdcRF Input Power +10 dBmStorage Temperature Range -55 to 125 ºCRECOMMENDED OPERATING CONDITIONS Characteristic Min Typ Max UnitPower Supply Voltage (Vdd) 2.1 3.3 3.6 VdcInput Frequency 2405 2480 MHzAmbient Temperature Range -40 25 85 ºCLogic Input Low Voltage 0 30% Vdd VLogic Input High Voltage 70% Vdd Vdd V FreeStar Modules include an integrated PCB trace antenna. The PCB antenna employs an F-Antenna topology that is com-pact and supports an omni-directional radiation pattern. To maximize antenna efciency, an adequate ground plane must be provided on the host PCB. The following will signicantly contribute to antenna performance: • The position of the module on the host board • The position of the ground plane on the host board under the module • Overall design of product enclosure Poor design affects radiation patterns and can result in reection, diffraction and/or scattering of the transmitted signal.The following are a few design guidelines to help ensure antenna performance: • Never place the ground plane or route copper traces directly underneath the antenna portion of the module • Never place the antenna close to metallic objects • In the overall design, ensure that wiring and other components are not placed near the antenna • Do not place the antenna in a metallic or metallized plastic enclosure • Keep plastic enclosures 1cm or more from the antenna in any directionANTENNA
FreeStar ZFSM-101-3Page 5Parameter Min Typ Max UnitGeneral CharacteristicsRF Frequency Range 2400 2483.5 MHzOutput Power (software controlled) 1 100 mWReceiver Sensitivity @ 1% PER -91 dBmRF Data Rate 250 kbpsHost Data Rate 19.2 kbpsVoltage Operating Range 2.1 3.6 VGeneral Purpose Digital I/O (8 Pins) 8PinsRF Channels (Channels 24, 25, and 26 are set at reduced power levels) 16 ChannelsDC Electrical CharacteristicsPower Supply Current (Vdd) = 3.3V, @ 25°CTransmit Mode 100mW 170 mAReceive Mode 50 55 mAStandby Mode 15 uAOutput High Voltage (all digital outputs) 80% Vdd Vdd VOutput Low Voltage (all digital outputs) 0 20% Vdd VAC Electrical CharacteristicsSensitivity for 1% packet error rate (-40 to +85ºC) – -91 dBmSensitivity for 1% packet error rate (25ºC) – -91 -89 dBmSaturation (maximum input level) 10 dBmNominal Output Power 20 dBmOutput Power Control Range (+20 to 0 dBm) 20 dBError Vector Magnitude (RMS EVM) 35 %Over the Air Data Rate 250 kbpsOn-board Antenna Gain (peak) 0.8 dBiOn-board Antenna Gain (average) -3.1 dBiTYPICAL TRANSMIT POWER VS. POWER SETTINGPower Setting Output Power>= 30 19.8 dBm28 19.8 dBm26 19.8 dBm24 19.2 dBm22 17.6 dBm20 17.2 dBm18 16.8 dBm16 16.3 dBm14 10.8 dBm12 10.4 dBm10 9.8 dBm8 9.2 dBm6 2.7 dBm4 2.3 dBm2 1.9 dBm0 1.5 dBmELECTRICAL CHARACTERISTICS
FreeStar ZFSM-101-3Page 6PIN DEFINITIONSPIN TYPE SIGNAL NAME ELECTRICAL DESCRIPTIONANT2 AO/AI ANT2 INTEGRATED PBC F-ANTENNATPRF1 AO/AI TPRF1 COAXIAL RF TEST POINT – 50 OHMS1GND GND GROUND2GND GND GROUND3GND GND GROUND4GND GND GROUND5DI/DO PTD3 GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE, PORT D , BIT 36DI/DO PTD4 GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE, PORT D , BIT 47AI PTB0 ANALOG TO DIGITAL CONVERTER INPUT, PORT B , INPUT 0 8AI PTB1 ANALOG TO DIGITAL CONVERTER INPUT, PORT B , INPUT 19PI VCC PRIMARY POWER INPUT: VCC = 2.4 TO 3.6 VDC10 GND GND GROUND11 DI MODE0 FCC / PRODUCTION TEST MODE INPUT WORD, BIT 012 DI MODE1 FCC / PRODUCTION TEST MODE INPUT WORD, BIT 113 DI MODE2 FCC / PRODUCTION TEST MODE INPUT WORD, BIT 214 DI/DO PTA4 GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE PORT A, BIT 4, KBI1P4 (KEYBOARD INTERRUPT) 15 DI/DO PTA5 GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE PORT A, BIT 5, KBI1P5 (KEYBOARD INTERRUPT) 16 DI/DO PTA6 GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE PORT A, BIT 6, KBI1P6 (KEYBOARD INTERRUPT) 17 DI PTA7 DIGITAL INPUT CONFIGURED TO INTERRUPT ON RISING EDGE OF SIGNAL TO WAKE UP MODULE FROM SLEEP MODE. PORT A, BIT 7, KBI1P7 (KEYBOARD INTERRUPT) 18 DI/DO PTGO PORT G, BIT 0, BKGD/MS (BACKGROUND/MODE SELECT, FOR PROGRAMMING AND FIRMWARE DEBUG)19 DI/DO /RESET1MASTER RESET, ACTIVE LOW20 DI/DO PTC0 GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE PORT C, BIT 0, SCI2 TXD2 (SERIAL COMMUNICATION INTERFACE 2, TRANSMIT DATA) 21 DI/DO PTC1 GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE PORT C, BIT 1, SCI2 RXD2 (SERIAL COMMUNICATION INTERFACE 2, RECEIVE DATA)22 DI/DO PTC5 RESERVED 23 DO TXD APPLICATION TRANSMIT DATA OUTPUT (SCI1, TXD1)24 DI RXD APPLICATION RECEIVE DATA INPUT (SCI1, RXD1)25 GND GND GROUND26 GND GND GROUND27 GND GND GROUND28 GND GND GROUND29 GND GND GROUND30 GND GND GROUNDNote: 1 Use an Open Collector Output to Drive the Reset pin or put a 1k Ohm resistor in series with the driving source. Normally the reset pin is an output; however, under brown out and other reset conditions the Freescale microcontroller will drive the pin low.
FreeStar ZFSM-101-3Page 7CONNECTOR LEGEND TYPE DEFINITIONDI DIGITAL INPUTDO DIGITAL OUTPUTAI ANALOG INPUTAO ANALOG OUTPUTPI POWER INPUTGND GROUNDLOGIC INPUT HIGH 0.7 (VCC) < VIH < (VCC)LOGIC INPUT LOW 0 < VIL < 0.3 (VCC)LOGIC OUTPUT HIGH (VCC – 0.8) < VOH < VCCLOGIC OUTPUT LOW 0 < VOL < 0.2 (VCC)CONNECTOR CONFIGURATIONGNDSHD1GNDGNDGNDGNDGNDRXDTXDPTC5PTC1PTC0GNDGNDGNDGNDPDT3PDT4PDB0PDB1VCCGNDMODE0MODE1MODE2PTA4PTA5PTA6PTA7PTG0/RESET Note: The PIN Numbering begins at top left-hand side with pin number 1 and follows counter-clockwise about the perimeter of the module.
FreeStar ZFSM-101-3Page 8FreeStar Rev B 2440 MHzDevice Orientation Polarization Gain (dB)Max Avg(V) Vertical 0.60 -1.72(V) Horizontal -7.27 -12.37(H) Vertical -4.00 -10.91(H) Horizontal 0.02 -5.90(F) Vertical -6.62 -13.52(F) Horizontal 0.85 -4.67Total Average Gain (dB) -3.15 Vertical HorizontalFlatRADIATION PATTERNS
FreeStar ZFSM-101-3Page 9EXAMPLE INTERFACE DIAGRAMSSample Connection Diagram when Using Serial Interface Sample Connection Diagram when Using Host Processor Interface
FreeStar ZFSM-101-3Page 10MODULE DIMENSIONSNote: Unless otherwise specied, dimensions are in inches.11.115”0.098”0.060”0.090”0.098”0.068”0.885”0.068”(2.5mm) Pitch ThroughoutRecommended Host PCB Board EdgePCB COPPER PATTERNFOR REFERENCE ONLYTOP VIEW(2.5mm) Pitch ThroughoutTYP 30 PlacesTYP 30 Places0.047”0.047”30PCB FOOTPRINTNote: Unless otherwise specied, dimensions are in inches.
FreeStar ZFSM-101-3Page 11MODULE KEEPOUTSNote: Unless otherwise specied, dimensions are in inches.COMPONENT KEEPOUTCOPPER AND COMPONENT KEEPOUT1.425”0.265”RECOMMENDED MODULEEXTENSION OVER EDGEOF HOST PCBCOMPONENT KEEPOUT - NO HOST BOARD PERIPHERAL COMPONENTSALLOWED WITHIN 0.100” OF MODULEIF OVER HANG METHOD OF MOUNTING IS NOT USED • NO COMPONENTS ON EITHER TOP OR BOTTOM SIDES OF HOST PCB ALLOWED IN THIS AREA • NO COPPER/TRACES ALLOWED ON ANY LAYER OF HOST PCB IN THIS AREAModule - Dimensions and KeepoutsTOP VIEW0.100” PRIMETER AROUND MODULE0.975”COPPER AND COMPONENT KEEPOUT AREA • NO COPPER/TRACES ALLOWED ON ANY LAYER OF HOST PCB IN THIS AREA • NO COMPONENTS ON EITHER TOP OR BOTTOM SIDES OF HOST PCB ALLOWED WITHIN 0.100” OF MODULECOPPER AND COMPONENT KEEPOUTMODULETOP VIEWHOST PCB EDGE1234567891011302928272625242322212012 13 14 15 16 17 18 19COPPER KEEPOUT
FreeStar ZFSM-101-3Page 12PROCESSINGRecommended Reow ProleParameters ValuesRamp Up Rate (from Tsoakmax to Tpeak) 3º/sec maxMinimum Soak Temperature 150ºC Maximum Soak Temperature 200ºCSoak Time 60-120 secTLiquidus 217ºC Time above TL 60-150 secTpeak 250ºCTime within 5º of Tpeak 20-30 secTime from 25º to Tpeak 8 min maxRamp Down Rate 6ºC/sec maxPb-Free Solder Paste Use of “No Clean” solder paste is strongly recommended, as it does not require cleaning after the soldering process. Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC Specication. See the latest IPC-A-610 Acceptability of Electronic Assemblies, Castellated Terminations section.Cleaning In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. • Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering ux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels. • Cleaning with alcohol or a similar organic solvent will likely ood soldering ux residuals into the two housings, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels. • Ultrasonic cleaning could damage the module permanently. The best approach is to consider using a “No Clean” solder paste and eliminate the post-soldering cleaning step.Optical Inspection After soldering the module to the host board, consider optical inspection to check the following: • Proper alignment and centering of the module over the pads. • Proper solder joints on all pads. • Excessive solder or contacts to neighboring pads or vias.Repeating Reow Soldering Only a single reow soldering process is encouraged for host boards.Wave Soldering If a wave soldering process is required on the host boards due to the presence of thru hole components, only a single wave soldering process is encouraged.
FreeStar ZFSM-101-3Page 13PROCESSING (Continued)Hand SolderingHand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC-7711).Rework The module can be unsoldered from the host board. Use of a hot air rework tool should be programmable and the solder joint and module should not exceed the maximum peak reow temperature of 250 ºC. Caution If temperature ramps exceed the reow temperature prole, module and component damage may occur due to thermal shock. Avoid overheating. Warning Never attempt a rework on the module itself, (e.g., replacing individual components). Such actions will terminate warranty coverage.Additional GroundingAttempts to improve module or system grounding by soldering braids, wires or cables onto the module RF shield cover is done at the customer's own risk. The numerous ground pins at the module perimeter should be sufcient for optimum immunity to external RF interference.QUALITYCEL modules offer the highest quality at competitive prices. Our modules are manufactured in compliance with the IPC-A-610 specication, Class II. Our modules go through JESD22 qualication processes which includes high temperature operating life tests, mechanical shock, temperature cycling, humidity and reow testing. CEL modules are 100% factory tested for RF and DC performance. In addition, every production lot is sample tested for compliance with CEL’s high quality and performance standards. CEL builds quality into our products giving our customers the condence when integrating our products into their systems.SHIPMENT, HANDLING AND STORAGEShipmentThe modules are delivered in trays of 50.HandlingThe modules are designed and packaged to be processed in an automated assembly line.Warning The modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. Warning The modules are moisture-sensitive devices. Appropriate handling instructions and precautions are summarized in J-STD-033. Read carefully to prevent permanent damage due to moisture intake. Moisture Sensitivity Level (MSL)MSL 3, per J-STD-033. Storage Storage/shelf life in sealed bags is 12 months at <40°C and <90% relative humidity.
FreeStar ZFSM-101-3Page 14AGENCY CERTIFICATIONSFCC Compliance Statement (Part 15.19) Section 7.15 of RSS-GENThis device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: 1. This device may not cause harmful interference 2. This device must accept any interference received, including interference that may cause undesired operationLe présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.L'exploitation est autorisée aux deux conditions suivantes: 1. l'appareil ne doit pas produire de brouillage, et 2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement Warning (Part 15.21)Changes or modications not expressly approved by CEL could void the user's authority to operate the equipment. 20 cm Separation DistanceTo comply with FCC/IC RF exposure limits for general population/uncontrolled exposure, the antenna(s) used for this trans-mitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter.OEM Responsibility to the FCC Rules and RegulationsThe FreeStar Module has been certied per FCC Part 15 rules for integration into products without further testing or certi-cation. To fulll the FCC certication requirements, the OEM of the FreeStar Module must ensure that the information provided on the FreeStar Label is placed on the outside of the nal product. The FreeStar Module is labeled with its own FCC ID Number. If the FCC ID is not visible when the module is installed inside another device, then the out-side of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: TFB-FREESTAR3” or “Contains FCC ID: TFB-FREESTAR3”The OEM of the FreeStar Module must only use the approved antenna, that has been certied with this module. The OEM of the FreeStar Module must test their nal product conguration to comply with Unintentional Radiator Limits before declaring FCC compliance per Part 15 of the FCC rules.IC Certication — Industry Canada Statement The term "IC" before the Certication/Registration number only signies that the Industry Canada technical specications were met.This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two con-ditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.Certication IC - Déclaration d'Industrie CanadaLe terme "IC" devant le numéro de certication/d'enregistrement signie seulement que les spécications techniquesIndustrie Canada ont été respectées.-Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement
FreeStar ZFSM-101-3Page 15AGENCY CERTIFICATIONS (Continued)Section 14 of RSS-210The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF eld in excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.phpL'article 14 du CNR-210Le programme d'installation de cet équipement radio doit s'assurer que l'antenne est située ou orientée de telle sorte qu'il ne pas émettre de champ RF au-delà des limites de Santé Canada pour la population générale. Consulter le Code de sécurité 6, disponible sur le site Web de Santé Canada: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.phpEMC CerticationFCC Part 15.247 Module Certied (Portable) EN 300 328 1 Certied / CE ApprovedThe FreeStar Module has been tested and certied for the European Union.OEM Responsibility to the European Union Compliance Rules If the FreeStar Module is to be incorporated into a product, the OEM must verify compliance of the nal product to the Eu-ropean Harmonized EMC and Low-Voltage/Safety Standards. A Declaration of Conformity must be issued for each of these standards and kept on le as described in Annex II of the R&TTE Directive.The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining European Union Compliance. If any of the specications are exceeded in the nal product, the OEM is required tomake a submission to the notied body for compliance testing.OEM Labeling RequirementsThe `CE' mark must be placed on the OEM product in a visible location. The CE mark shall consist of the initials “CE” with the following form: • If the CE marking is reduced or enlarged, the proportions given in the above graduated drawing must be adhered to • The CE mark must be a minimum of 5mm in height • If the use of the module is subject to restrictions in the end application, the CE marking on the OEM product should also include the alert sign as shown in the picture to the rightAustralia CerticationNumber: AS/NZS 4268
FreeStar ZFSM-101-3Page 16REFERENCES & REVISION HISTORYPrevious Versions Changes to Current Version Page(s)0001-00-07-01-000 (Issue ES) October 10, 2011 Initial preliminary datasheet. N/A0001-00-07-01-000(Issue ES) October 26, 2011 Updated electrical characteristics, software revisions. 1, 4, 60001-00-07-01-000October 18, 2012 Rolled part number to -3, updated power amplier section 1, 2, 3, 50001-00-07-01-000October 26, 2012 Updated FCC information 3Disclaimer • The information in this document is current as of the published date. The information is subject to change without notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most up-to-date specications of CEL products. Not all products and/or types are available in every country. Please check with an CEL sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of CEL. CEL assumes no responsibility for any errors that may appear in this document. • CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of CEL products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer’s equipment shall be done under the full responsibility of the customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in CEL products, customers must incorporate sufcient safety measures in their design, such as redundancy, re-containment and anti-failure features.

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