Laird Connectivity FREESTAR3 FreeStar Tranceiver Module User Manual

LS Research, LLC FreeStar Tranceiver Module

User Manual

Download: Laird Connectivity FREESTAR3 FreeStar Tranceiver Module User Manual
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Date Submitted2012-12-10 00:00:00
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PRELIMINARY DATA SHEET
FreeStar Transceiver Module
ZFSM-101-3
Integrated Transceiver Module for ZigBee®/IEEE 802.15.4
DESCRIPTION
California Eastern Laboratories (CEL)'s FreeStar Module is a
small, fully-integrated, drop-in RF transmission solution that is
ideal for ZigBee and other low cost, low power IEEE 802.15.4
RF transmission applications. FreeStar incorporates the
MC13202 transceiver IC and MC9S08GT60 microprocessor
from Freescale with a power amplifier and an Inverted-F PCB
antenna. It delivers up to 4,000 feet of range and features a
streamlined communications protocol that results in the lowest
power consumption in transmit mode of any Module on the
market. The FreeStar is also FCC and CE Certified, which
eliminates the need for a costly and time-consuming approval
process when incorporated into your design.
FreeStar
ZFSM-101-3
• Transmit Power: 100 mW
• Receive Sensitivity: -91 dBm
• RF Data Rate: 250 kbps
• Based on the Freescale MC13202
transceiver IC
• 8-bit HCS08-based MCU
APPLICATIONS
FEATURES
• Communication Modes:
Point-to-Point, Point-to Multipoint, Mesh Networking
• 4,000+ feet Line of Sight Performance
• Small Form Factor:
1.4” x 1.0”
• Integrated PCB Trace Antenna
• FCC, IC and CE Certified
• RoHS Compliance
• Direct Sequence Spread Spectrum
• CSMA-CA
Residential and
Commercial Automation
Health Care
• Patient Monitoring
• Fitness Monitoring
• Wireless Boot Loader
• Flash-Based/Upgradable
Industrial Controls
• Asset Tracking and Monitoring
• Lighting Control
• Homeland Security
• Security
• Process Management
• Access Control
• Environmental Monitoring
• Heating, Ventilation,
and Control
Air-Conditioning (HVAC)
• Heating, Ventilation,
• Automated Meter Reading (AMR) Air-Conditioning (HVAC)
• Automated Meter Reading (AMR)
• 10 Bit A/D (2 inputs)
• General Purpose I/O (8 ports)
• Microsoft® Windows® -Based Configuration and Test Tool
• Simple Serial UART Interface
• Over 65,000 Network Addresses
Consumer
• Human Interface Devices
(keyboard, mice, etc.)
• Remote Control
• Wireless Toys
ORDERING INFORMATION
Part Number
Order Number
FreeStar
ZFSM-101-3
ZFSM-101-3
Description
FreeStar 100mW transceiver module PCB Trace Antenna
with / Freescale MC13202
The information in this document is subject to change without notice, please confirm data is current
Document No: 0001-00-07-01-000
Date Published: October 26, 2012
Mins/Mults
Status
200 pcs / 200 pcs
Not Recommended
For New Designs
FreeStar ZFSM-101-3
TABLE OF CONTENTS
Introduction and Overview
Description..............................................................................................................................................................................................
Features..................................................................................................................................................................................................
Applications............................................................................................................................................................................................
Ordering Information.............................................................................................................................................................................
Module Block Diagram...........................................................................................................................................................................
Development Kit.....................................................................................................................................................................................
System Level Function
Transceiver IC.........................................................................................................................................................................................
Electrical Specification
Antenna...................................................................................................................................................................................................
Absolute Maximum Ratings...................................................................................................................................................................
Recommended Operating Conditions...................................................................................................................................................
Electrical Characteristics.......................................................................................................................................................................
Typical Transmit Power vs. Power Setting..........................................................................................................................................
Pin Signal & Interfaces
Pin Definitions........................................................................................................................................................................................
Connector Legend..................................................................................................................................................................................
Connector Configuration.......................................................................................................................................................................
Radiation Patterns..................................................................................................................................................................................
Example Interface Diagrams..................................................................................................................................................................
Module Dimensions................................................................................................................................................................................
10
Module Keepouts....................................................................................................................................................................................
11
Processing.........................................................................................................................................................................................
12
Shipment, Storage and Handling.............................................................................................................................................
13
Quality..................................................................................................................................................................................................
13
Agency Certifications...................................................................................................................................................................
14
References and Revision History............................................................................................................................................
16
Page 2
FreeStar ZFSM-101-3
MODULE BLOCK DIAGRAM
FreeStar Module
16MHz
XTAL
PA Enable
Balun
MCU
PA
ANT
LPF
Radio
Balun
BUS
DEVELOPMENT KIT
No Longer Available.
TRANSCEIVER IC
The Freestar ZFSM-101-3 Module replaces the ZFSM-101-2 Module. The difference between the two modules is the
replacement of the power amplifier. The design was optimized to provide similar output power between the two designs so
that there are no perceived changes by existing customers or designs. The ZFSM-101-3 can use the firmware for the ZFSM101-2.
The power shaping restrictions for FCC/IC and ETSI compliance are listed in the table below for reference. The power setting
restrictions must be adhered to.
Certification
FCC/IC
ETSI
RF Channel
11 thru 23
24
25
26
11-26
Valid TX Power
Steps
0-30
0-18
0-14
0-6
Typical Output
Power
20 dBm
16.8 dBm
10.8 dBm
2.7 dBm
2.7 dBm
Page 3
FreeStar ZFSM-101-3
ANTENNA
FreeStar Modules include an integrated PCB trace antenna. The PCB antenna employs an F-Antenna topology that is compact and supports an omni-directional radiation pattern. To maximize antenna efficiency, an adequate ground plane must be
provided on the host PCB.
The following will significantly contribute to antenna performance:
• The position of the module on the host board
• The position of the ground plane on the host board under the module
• Overall design of product enclosure
Poor design affects radiation patterns and can result in reflection, diffraction and/or scattering of the transmitted signal.
The following are a few design guidelines to help ensure antenna performance:
•
•
•
•
•
Never place the ground plane or route copper traces directly underneath the antenna portion of the module
Never place the antenna close to metallic objects
In the overall design, ensure that wiring and other components are not placed near the antenna
Do not place the antenna in a metallic or metallized plastic enclosure
Keep plastic enclosures 1cm or more from the antenna in any direction
ABSOLUTE MAXIMUM RATINGS
Rating
Power Supply Voltage
RF Input Power
Storage Temperature Range
Value
Unit
3.6
Vdc
+10
dBm
-55 to 125
ºC
RECOMMENDED OPERATING CONDITIONS
Characteristic
Power Supply Voltage (Vdd)
Input Frequency
Ambient Temperature Range
Min
Typ
2.1
3.3
2405
-40
25
Max
Unit
3.6
Vdc
2480
MHz
85
ºC
Logic Input Low Voltage
30% Vdd
Logic Input High Voltage
70% Vdd
Vdd
Page 4
FreeStar ZFSM-101-3
ELECTRICAL CHARACTERISTICS
Parameter
Min
RF Frequency Range
Output Power (software controlled)
Receiver Sensitivity @ 1% PER
RF Data Rate
Host Data Rate
Voltage Operating Range
General Purpose Digital I/O (8 Pins)
RF Channels (Channels 24, 25, and 26 are set at reduced power levels)
2400
General Characteristics
2.1
DC Electrical Characteristics
Transmit Mode 100mW
Receive Mode
Standby Mode
Output High Voltage (all digital outputs)
Output Low Voltage (all digital outputs)
-91
250
19.2
170
50
Power Supply Current
(Vdd) = 3.3V, @ 25°C
AC Electrical Characteristics
Typ
80% Vdd
Sensitivity for 1% packet error rate (-40 to +85ºC)
–
-91
Sensitivity for 1% packet error rate (25ºC)
–
-91
Max
Unit
2483.5
100
3.6
16
MHz
mW
dBm
kbps
kbps
Pins
Channels
55
15
Vdd
20% Vdd
mA
mA
uA
dBm
-89
dBm
Saturation (maximum input level)
10
dBm
Nominal Output Power
20
dBm
Output Power Control Range (+20 to 0 dBm)
20
Error Vector Magnitude (RMS EVM)
Over the Air Data Rate
dB
35
250
kbps
On-board Antenna Gain (peak)
0.8
dBi
On-board Antenna Gain (average)
-3.1
dBi
Typical Transmit Power vs. Power Setting
Power Setting
Output Power
>= 30
19.8 dBm
28
19.8 dBm
26
19.8 dBm
24
19.2 dBm
22
17.6 dBm
20
17.2 dBm
18
16.8 dBm
16
16.3 dBm
14
10.8 dBm
12
10.4 dBm
10
9.8 dBm
9.2 dBm
2.7 dBm
2.3 dBm
1.9 dBm
1.5 dBm
Page 5
FreeStar ZFSM-101-3
PIN DEFINITIONS
Signal
Name
PIN
TYPE
ANT2
AO/AI
ANT2
AO/AI
TPRF1
GND
GND
GROUND
GND
GND
GROUND
GND
GND
GROUND
GND
GND
GROUND
DI/DO
PTD3
GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE, PORT D , BIT 3
DI/DO
PTD4
GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE, PORT D , BIT 4
AI
PTB0
ANALOG TO DIGITAL CONVERTER INPUT, PORT B , INPUT 0
AI
PTB1
ANALOG TO DIGITAL CONVERTER INPUT, PORT B , INPUT 1
PI
VCC
PRIMARY POWER INPUT: VCC = 2.4 TO 3.6 VDC
10
GND
GND
GROUND
DI
MODE0
FCC / PRODUCTION TEST MODE INPUT WORD, BIT 0
DI
MODE1
FCC / PRODUCTION TEST MODE INPUT WORD, BIT 1
DI
MODE2
FCC / PRODUCTION TEST MODE INPUT WORD, BIT 2
14
DI/DO
PTA4
GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE PORT A, BIT 4,
KBI1P4 (KEYBOARD INTERRUPT)
15
DI/DO
PTA5
GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE PORT A, BIT 5,
KBI1P5 (KEYBOARD INTERRUPT)
16
DI/DO
PTA6
GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE PORT A, BIT 6,
KBI1P6 (KEYBOARD INTERRUPT)
17
DI
PTA7
DIGITAL INPUT CONFIGURED TO INTERRUPT ON RISING EDGE OF SIGNAL TO WAKE
UP MODULE FROM SLEEP MODE. PORT A, BIT 7, KBI1P7 (KEYBOARD INTERRUPT)
18
DI/DO
PTGO
19
PORT G, BIT 0, BKGD/MS (BACKGROUND/MODE SELECT, FOR PROGRAMMING
AND FIRMWARE DEBUG)
DI/DO
/RESET1
20
DI/DO
PTC0
GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE PORT C, BIT 0,
SCI2 TXD2 (SERIAL COMMUNICATION INTERFACE 2, TRANSMIT DATA)
21
DI/DO
PTC1
22
GENERAL PURPOSE DIGITAL I/O FIRMWARE CONFIGURABLE PORT C, BIT 1,
SCI2 RXD2 (SERIAL COMMUNICATION INTERFACE 2, RECEIVE DATA)
DI/DO
PTC5
RESERVED
TPRF1
11
12
13
23
24
25
26
27
28
29
30
Note:
Electrical Description
INTEGRATED PBC F-ANTENNA
COAXIAL RF TEST POINT – 50 OHMS
MASTER RESET, ACTIVE LOW
DO
TXD
APPLICATION TRANSMIT DATA OUTPUT (SCI1, TXD1)
DI
RXD
APPLICATION RECEIVE DATA INPUT (SCI1, RXD1)
GND
GND
GROUND
GND
GND
GROUND
GND
GND
GROUND
GND
GND
GROUND
GND
GND
GROUND
GND
GND
GROUND
Use an Open Collector Output to Drive the Reset pin or put a 1k Ohm resistor in series with the driving source.
Normally the reset pin is an output; however, under brown out and other reset conditions the Freescale 		
microcontroller will drive the pin low.
Page 6
FreeStar ZFSM-101-3
CONNECTOR LEGEND
TYPE
DEFINITION
DI
DIGITAL INPUT
DO
DIGITAL OUTPUT
AI
ANALOG INPUT
AO
ANALOG OUTPUT
PI
POWER INPUT
GND
GROUND
LOGIC INPUT HIGH
0.7 (VCC) < VIH < (VCC)
LOGIC INPUT LOW
0 < VIL < 0.3 (VCC)
LOGIC OUTPUT HIGH
(VCC – 0.8) < VOH < VCC
LOGIC OUTPUT LOW
0 < VOL < 0.2 (VCC)
CONNECTOR CONFIGURATION
SHD1
GND
GND
GND
GND
GND
GND
GND
GND
PDT3
GND
PDT4
GND
PDB0
RXD
PDB1
TXD
Note:
/RESET
PTG0
PTA7
PTC0
PTA6
MODE0
PTA5
PTC1
PTA4
GND
MODE2
PTC5
MODE1
VCC
The PIN Numbering begins at top left-hand side with pin number 1 and follows counter-clockwise
about the perimeter of the module.
Page 7
FreeStar ZFSM-101-3
RADIATION PATTERNS
FreeStar Rev B 2440 MHz
Device Orientation
Polarization
(V)
Vertical
Gain (dB)
Max
Avg
0.60
-1.72
(V)
Horizontal
-7.27
-12.37
(H)
Vertical
-4.00
-10.91
(H)
Horizontal
0.02
-5.90
(F)
Vertical
-6.62
-13.52
(F)
Horizontal
0.85
-4.67
Total Average Gain (dB)
-3.15
Vertical
Horizontal
Flat
Page 8
FreeStar ZFSM-101-3
EXAMPLE INTERFACE DIAGRAMS
Sample Connection Diagram when Using Serial Interface
Sample Connection Diagram when Using Host Processor Interface
Page 9
FreeStar ZFSM-101-3
Module dimensions
Note: Unless otherwise specified, dimensions are in inches.
PCB FOOTPRINT
Note: Unless otherwise specified, dimensions are in inches.
TOP VIEW
PCB COPPER PATTERN
FOR REFERENCE ONLY
0.047”
0.047”
Recommended Host PCB Board Edge
30
1.115”
0.098”
(2.5mm) Pitch Throughout
0.060” TYP 30 Places
0.090” TYP 30 Places
0.098” (2.5mm)
Pitch Throughout
0.068”
0.068”
0.885”
Page 10
FreeStar ZFSM-101-3
Module KEEPOUTS
Note: Unless otherwise specified, dimensions are in inches.
Module - Dimensions and Keepouts
TOP VIEW
0.975”
COPPER AND COMPONENT KEEPOUT
COPPER AND COMPONENT KEEPOUT
0.265”
COPPER KEEPOUT
1.425”
30
29
28
27
26
25
MODULE
TOP VIEW
24
23
22
10
21
11
RECOMMENDED MODULE
EXTENSION OVER EDGE
OF HOST PCB
HOST PCB EDGE
12
13
14
15 16
17
18
19
20
0.100” PRIMETER AROUND MODULE
COMPONENT KEEPOUT
COPPER AND COMPONENT KEEPOUT AREA
• NO COPPER/TRACES ALLOWED ON ANY LAYER
OF HOST PCB IN THIS AREA
• NO COMPONENTS ON EITHER TOP OR BOTTOM SIDES
OF HOST PCB ALLOWED WITHIN 0.100” OF MODULE
COMPONENT KEEPOUT - NO HOST BOARD PERIPHERAL COMPONENTS
ALLOWED WITHIN 0.100” OF MODULE
IF OVER HANG METHOD OF MOUNTING IS NOT USED
• NO COMPONENTS ON EITHER TOP OR BOTTOM SIDES
OF HOST PCB ALLOWED IN THIS AREA
• NO COPPER/TRACES ALLOWED ON ANY LAYER
OF HOST PCB IN THIS AREA
Page 11
FreeStar ZFSM-101-3
PROCESSING
Recommended Reflow Profile
Parameters Values
Ramp Up Rate (from Tsoakmax to Tpeak)
3º/sec max
Minimum Soak Temperature
150ºC
Maximum Soak Temperature
200ºC
Soak Time
60-120 sec
TLiquidus
217ºC
Time above TL
60-150 sec
Tpeak
250ºC
Time within 5º of Tpeak
20-30 sec
Time from 25º to Tpeak
8 min max
Ramp Down Rate
6ºC/sec max
Pb-Free Solder Paste
Use of “No Clean” solder paste is strongly recommended, as it does not require cleaning after the soldering process.
Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC
Specification. See the latest IPC-A-610 Acceptability of Electronic Assemblies, Castellated Terminations section.
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed
with any cleaning process.
•
•
•
Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and
the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between
neighboring pads. Water could also damage any stickers or labels.
Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which
is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “No Clean” solder paste and eliminate the post-soldering cleaning step.
Optical Inspection
After soldering the module to the host board, consider optical inspection to check the following:
• Proper alignment and centering of the module over the pads.
• Proper solder joints on all pads.
• Excessive solder or contacts to neighboring pads or vias.
Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
Wave Soldering
If a wave soldering process is required on the host boards due to the presence of thru hole components, only a single wave
soldering process is encouraged.
Page 12
FreeStar ZFSM-101-3
PROCESSING (Continued)
Hand Soldering
Hand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC-7711).
Rework
The module can be unsoldered from the host board. Use of a hot air rework tool should be programmable and the solder
joint and module should not exceed the maximum peak reflow temperature of 250 ºC.
Caution
If temperature ramps exceed the reflow temperature profile, module and component damage may occur due to thermal
shock. Avoid overheating.
Warning
Never attempt a rework on the module itself, (e.g., replacing individual components). Such actions will terminate
warranty coverage.
Additional Grounding
Attempts to improve module or system grounding by soldering braids, wires or cables onto the module RF shield cover is
done at the customer's own risk. The numerous ground pins at the module perimeter should be sufficient for optimum
immunity to external RF interference.
SHIPMENT, HANDLING AND STORAGE
Shipment
The modules are delivered in trays of 50.
Handling
The modules are designed and packaged to be processed in an automated assembly line.
Warning
The modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage
the module permanently.
Warning
The modules are moisture-sensitive devices. Appropriate handling instructions and precautions are summarized in J-STD-033.
Read carefully to prevent permanent damage due to moisture intake.
Moisture Sensitivity Level (MSL)
MSL 3, per J-STD-033.
Storage
Storage/shelf life in sealed bags is 12 months at <40°C and <90% relative humidity.
QUALITY
CEL modules offer the highest quality at competitive prices. Our modules are manufactured in compliance with the IPC-A-610
specification, Class II. Our modules go through JESD22 qualification processes which includes high temperature operating life
tests, mechanical shock, temperature cycling, humidity and reflow testing. CEL modules are 100% factory tested for RF and
DC performance. In addition, every production lot is sample tested for compliance with CEL’s high quality and performance
standards.
CEL builds quality into our products giving our customers the confidence when integrating our products into their systems.
Page 13
FreeStar ZFSM-101-3
AGENCY CERTIFICATIONS
FCC Compliance Statement (Part 15.19) Section 7.15 of RSS-GEN
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference
2. This device must accept any interference received, including interference that may cause undesired operation
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible
d'en compromettre le fonctionnement
Warning (Part 15.21)
Changes or modifications not expressly approved by CEL could void the user's authority to operate the equipment.
20 cm Separation Distance
To comply with FCC/IC RF exposure limits for general population/uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or
operating in conjunction with any other antenna or transmitter.
OEM Responsibility to the FCC Rules and Regulations
The FreeStar Module has been certified per FCC Part 15 rules for integration into products without further testing or certification. To fulfill the FCC certification requirements, the OEM of the FreeStar Module must ensure that the
information provided on the FreeStar Label is placed on the outside of the final product. The FreeStar Module is labeled
with its own FCC ID Number. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior
label can use wording such as the following: “Contains Transmitter Module FCC ID: TFB-FREESTAR3” or “Contains FCC ID:
TFB-FREESTAR3”
The OEM of the FreeStar Module must only use the approved antenna, that has been certified with this module. The OEM
of the FreeStar Module must test their final product configuration to comply with Unintentional Radiator Limits before declaring
FCC compliance per Part 15 of the FCC rules.
IC Certification — Industry Canada Statement
The term "IC" before the Certification/Registration number only signifies that the Industry Canada technical specifications
were met.
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference
that may cause undesired operation of the device.
Certification IC - Déclaration d'Industrie Canada
Le terme "IC" devant le numéro de certification/d'enregistrement signifie seulement que les spécifications techniques
Industrie Canada ont été respectées.Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur
de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le
fonctionnement
Page 14
FreeStar ZFSM-101-3
AGENCY CERTIFICATIONS (Continued)
Section 14 of RSS-210
The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF field in
excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's
website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php
L'article 14 du CNR-210
Le programme d'installation de cet équipement radio doit s'assurer que l'antenne est située ou orientée de telle sorte qu'il
ne pas émettre de champ RF au-delà des limites de Santé Canada pour la population générale. Consulter le Code de
sécurité 6, disponible sur le site Web de Santé Canada: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/
index-eng.php
EMC Certification
FCC Part 15.247 Module Certified (Portable)
EN 300 328 1 Certified / CE Approved
The FreeStar Module has been tested and certified for the European Union.
OEM Responsibility to the European Union Compliance Rules
If the FreeStar Module is to be incorporated into a product, the OEM must verify compliance of the final product to the European Harmonized EMC and Low-Voltage/Safety Standards. A Declaration of Conformity must be issued for each of these
standards and kept on file as described in Annex II of the R&TTE Directive.
The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining
European Union Compliance. If any of the specifications are exceeded in the final product, the OEM is required to
make a submission to the notified body for compliance testing.
OEM Labeling Requirements
The `CE' mark must be placed on the OEM product in a visible location. The CE mark shall consist of the initials “CE” with
the following form:
• If the CE marking is reduced or enlarged, the proportions given in the above graduated
		 drawing must be adhered to
• The CE mark must be a minimum of 5mm in height
• If the use of the module is subject to restrictions in the end application, the CE marking on the
		 OEM product should also include the alert sign as shown in the picture to the right
Australia Certification
Number: AS/NZS 4268
Page 15
FreeStar ZFSM-101-3
REFERENCES & REVISION HISTORY
Previous Versions
0001-00-07-01-000
(Issue ES) October 10, 2011
0001-00-07-01-000
(Issue ES) October 26, 2011
0001-00-07-01-000
October 18, 2012
0001-00-07-01-000
October 26, 2012
Changes to Current Version
Initial preliminary datasheet.
Updated electrical characteristics, software revisions.
Rolled part number to -3, updated power amplifier section
Updated FCC information
Page(s)
N/A
1, 4, 6
1, 2, 3, 5
Disclaimer
• The information in this document is current as of the published date. The information is subject to change without
notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most
up-to-date specifications of CEL products. Not all products and/or types are available in every country. Please 		
check with an CEL sales representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior written 		
consent of CEL. CEL assumes no responsibility for any errors that may appear in this document.
• CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of CEL products listed in this document or any other liability arising from the
use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of CEL or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative 		
purposes in semiconductor product operation and application examples. The incorporation of these circuits, 		
software and information in the design of a customer’s equipment shall be done under the full responsibility of the
customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use
of these circuits, software and information.
• While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and 		
acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to
property or injury (including death) to persons arising from defects in CEL products, customers must incorporate
sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features.
Page 16

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