Landis Gyr ZIG527602 5276 Zigbee Transceiver Module User Manual RDD212 01

Landis + Gyr, Inc. 5276 Zigbee Transceiver Module RDD212 01

Manual

Product Manual
527602
Document Number: RDD212-01
Date : 18 June 2009
Document Number: RDD212-01
Author: C. Groves
Approved by: G.Lane
INT314-04
© Landis + Gyr
527602 Product Manual Date : 18 June 2009
Document Number: RDD212-01
Author: C. Groves
Page 2 of 15
Landis + Gyr reserves the right to amend specifications without notice © Landis +Gyr
Revision History
Index Date Name Comments
1 18.6.2009 C. Groves Initial Release
Subject to change without notice.
Landis + Gyr
1 Lysander Drive,
Northfields Industrial Estate,
Market Deeping,
Peterborough
PE6 8FB
527602 Product Manual Date : 18 June 2009
Document Number: RDD212-01
Author: C. Groves
Page 3 of 15
Landis + Gyr reserves the right to amend specifications without notice © Landis +Gyr
Table of Contents
1ABBREVIATIONS .......................................................................................................................................................... 4
2INTRODUCTION ............................................................................................................................................................ 5
2.1MODULE BLOCK DIAGRAM ............................................................................................................................................ 5
3PRODUCT APPROVALS .............................................................................................................................................. 6
3.1FCC APPROVALS ........................................................................................................................................................... 6
3.2EUROPEAN APPROVALS ................................................................................................................................................. 7
3.3MAXIMUM ALLOWABLE POWER LEVELS ....................................................................................................................... 7
4HARDWARE DESCRIPTION ....................................................................................................................................... 8
4.1EM260 ........................................................................................................................................................................... 8
4.2SKY65336 ..................................................................................................................................................................... 8
4.3CRYSTAL ........................................................................................................................................................................ 8
4.4RF SHIELD ..................................................................................................................................................................... 8
4.5ANTENNA ....................................................................................................................................................................... 8
4.6TEST POINTS .................................................................................................................................................................. 8
5MECHANICAL DRAWING .......................................................................................................................................... 9
6CONNECTIONS ............................................................................................................................................................ 10
6.1.1UART Connector (J2 and J4) ............................................................................................................................ 10
6.1.2M Bus Connector (J1) ........................................................................................................................................ 10
6.1.3Ember SIF Connector (J3) ................................................................................................................................. 11
6.2UART CONNECTOR DETAILED DESCRIPTION .............................................................................................................. 12
6.2.1Overview ............................................................................................................................................................ 12
6.2.2P2_TX and P2_RX ............................................................................................................................................. 12
6.2.3P2_CTS and P2_RTS ......................................................................................................................................... 12
6.2.4FORCE_BOOT .................................................................................................................................................. 13
6.2.5SYSRST .............................................................................................................................................................. 13
6.2.6P2_AUX1 ........................................................................................................................................................... 13
6.2.7OPTION_CARD_ID .......................................................................................................................................... 13
7ELECTRICAL SPECIFICATION ............................................................................................................................... 14
7.1ABSOLUTE MAXIMUM RATINGS .................................................................................................................................. 14
7.2RECOMMENDED OPERATING CONDITIONS ................................................................................................................... 14
7.3ELECTRICAL SPECIFICATION ........................................................................................................................................ 15
527602 Product Manual Date : 18 June 2009
Document Number: RDD212-01
Author: C. Groves
Page 4 of 15
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1 Abbreviations
BPF Band Pass Filter
CFR Code of Federal Regulations
FCC Federal Communications Commission
LNA Low Noise Amplifier
LPF Low Pass Filter
OTA Over the Air
PA Power Amplifier
RF Radio Frequency
RX Receive
SPDT Single Pole Double Throw
TBC To Be Confirmed
TX Transmit
UL Underwriters Laboratories
527602 Product Manual Date : 18 June 2009
Document Number: RDD212-01
Author: C. Groves
Page 5 of 15
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1.27mm
UART Connector
ZigBee
Antenna
All ICs are supplied with 3.3V unless otherwise specified
Ember SIF
Connector
2.54mm
UART Connector
24MHz
Crystal
Ember
EM260 Skyworks
SKY65336
BALUN – PA – FILTER
SPDT SWITCH
BALUN - LNA
TX
RX
2 Introduction
This document describes the 527602 ZigBee module, which has been design to be integrated into host
equipment to provide wireless mesh networking at 2.4GHz. The module is based on Ember’s EM260
ZigBee Co-Processer and uses the UART communication to be interfaced with the host micro-
controller.
2.1 Module Block Diagram
527602 Product Manual Date : 18 June 2009
Document Number: RDD212-01
Author: C. Groves
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3 Product Approvals
3.1 FCC Approvals
The 5276 ZigBee Module conforms to FCC CFR 47 part 15.
This device complies with Part 15 of the FCC rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.
FCC ID : ROV-ZIG527602
When the 5276 ZigBee Module is integrated inside another device then the outside of this device must
also display a label referring to the enclosed module. This exterior label can use wording such as
“Contains Transmitter Module FCC ID : ROV-ZIG527602” or “Contains FCC ID : ROV-ZIG527602”
This module complies with the USA SAR requirements and is not intended to be operated within 20cm
of the body. The following statement must be included as a CAUTION statement in manuals for OEM
product to alert users on FCC RF exposure compliance:
“WARNING: To satisfy FCC RF exposure requirement for mobile transmitting device, a
separation distance of 20cm or more should be maintain between the antenna of this device and
the persons during operation. To ensure compliance, operations at closer distances than this are
not recommended.”
Any modification or changes to this module may invalidate the certification and the user’s authority to
operate the equipment in the USA.
527602 Product Manual Date : 18 June 2009
Document Number: RDD212-01
Author: C. Groves
Page 7 of 15
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3.2 European Approvals
The module has been designed to meet the following European approvals:
Electromagnetic Compatibility Radio Spectrum
Matters; Short Range Devices; Radio Equipment to
be used in the 25 MHz to 1,000 MHz Frequency
Range with Power Levels Ranging up to 500mW;
Part 1: Technical Characteristics and Test Methods
EN 300 328 V1.7.1
Electromagnetic compatibility and Radio spectrum
Matters (ERM); Electromagnetic Compatibility
(EMC) standard for radio equipment and services;
Part 17: Specific conditions for 2,4 GHz wideband
transmission systems and 5GHz high performance
RLAN equipment.
EN 301 489-17 V1.2.1
Information technology equipment. Safety. General
requirements
IEC 60950-1:2001
(including amendment
11:2004)
3.3 Maximum Allowable Power Levels
The maximum allowable power levels are restricted by the relevant regulatory body for target country of
deployment. In order to comply with these appropriate approvals the EM260 and Skyworks devices
must be configured in software to transmit within these limits. The following table shows the
MAXIMUM allowable transmission levels allow according to the relevant approval body.
These levels must be set by the OEM equipment.
Approval
Body EM260
Channel 26
Power Level
EM260
Channel 25
Power Level
EM260
All Other
Channels Power
Level
Skyworks
Power Level
Mode
FCC -20 dBm -3 dBm +3 dBm HIGH
R&TTE 0 dBm 0 dBm 0 dBm LOW
Please check with the design team for the latest information.
527602 Product Manual Date : 18 June 2009
Document Number: RDD212-01
Author: C. Groves
Page 8 of 15
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4 Hardware Description
The 5276 ZigBee Module contains the EM260 from Ember, a 24MHz crystal reference and the
SKY65336 Front End Module (FEM) from Skyworks. It has an integrated printed inverted F antenna
matched to the FEM for optimum performance.
4.1 EM260
The Ember EM260 Co-Processor solution provides a wireless ZigBee mesh networking capabilities
with other ZigBee enabled devices. The EM260 is a 2.4GHz IEEE 802.15.4 compliant radio transceiver
with a 16-bit microprocessor. IEEE802.15.4 uses Offset Quadrature Phase Shift Keying (O-QPSK)
Modulation Scheme. The EM260 comes in a 6mm x 6mm, 40 pin QFN package. Further information
on the EM260 device, including how to correctly interface with the host device can be found at
www.ember.com.
4.2 SKY65336
The Skyworks front end module, SKY65336, will be used to provide a PA and LNA gain stage with
fully integrated impedance matching and filtering. This FEM comes in an 8mm x 8mm 28 pin MCM
package.
4.3 Crystal
There is a highly accurate 24MHz crystal fitted to the PCB. This is because the initial tolerance,
temperature stability and ageing directly correspond to life that a transceiver pair can communicate.
The crystal used in this design will have a maximum tolerance of ±40ppm, including initial, ageing (5
year prediction) and temperature tolerance. Calibration of the crystal would further improve the lifetime
of the communication system.
4.4 RF Shield
There is an RF shield fitted to the module.
4.5 Antenna
The antenna is an integrated printed ¼ wave inverted F antenna. This has a theoretical maximum peak
gain of 5.15dBi.
4.6 Test Points
Due to the compact nature of the design and to maintain optimal RF performance no test points have
been added to the main circuitry on the ZigBee module.
For programming debug and bootloading the J2 and J3 connectors should be used. For Production RF
testing, TP11 should e used to measure the conducted RF output.
For RF Development and antenna matching TP12 may be used. If TP12 is used R19 should be a zero
ohm link. In all other instances, including production, R19 must not be fitted.
527602 Product Manual Date : 18 June 2009
Document Number: RDD212-01
Author: C. Groves
Page 9 of 15
Landis + Gyr reserves the right to amend specifications without notice © Landis +Gyr
5 Mechanical Drawing
Top View
Notes:
J3 may be accessed from both sides of the PCB, however to avoid a crossover connector, i.e. direct
connection, to Ember development or production equipment it should be accessed from layer 4 (bottom
or no component side). Otherwise a crossover connector will be required.
527602 Product Manual Date : 18 June 2009
Document Number: RDD212-01
Author: C. Groves
Page 10 of 15
Landis + Gyr reserves the right to amend specifications without notice © Landis +Gyr
6 Connections
6.1.1 UART Connector (J2 and J4)
Note J2 and J4 are duplicate connectors
Connector 10 way connector
Format 2 x 5 way double row
Pitch 2.54mm or 1.27mm
Suggested Connector Samtec
TSW-105-25-L-D-RA or TSM-105-04-x-DV-M
Name Pin Description
+3V3 1 Supply for circuitry
P2_TX_SCL 2 UART Data TX
P2_RX_SDA 3 UART Data RX
P2_Aux1 4 Power Mode – high or Low Power
P2_CTS 5 UART Flow control CTS
SYSRST 6 Reset (Active Low)
P2_RTS 7 UART Flow control RTS
FORCE_BOOT 8 Force Bootloader (Hold Low during Reset)
OPTION_CARD_ID 9 Analogue voltage to identify card type
0V 10 Ground
6.1.2 M Bus Connector (J1)
Connector 4 way connector
Format 2 x 2 way double row
Pitch 2.54mm
Suggested Connector Not Required
Name Pin Description
NC 1,2,
3,4
No Connection
527602 Product Manual Date : 18 June 2009
Document Number: RDD212-01
Author: C. Groves
Page 11 of 15
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6.1.3 Ember SIF Connector (J3)
Connector 10 way connector
Format 5 x 2 way double row
Pitch 0.05 inch
Suggested Connector Samtec
FTSH-105-01-F-DV-K (connected to layer 4 of PCB)
Name
Pin Description
VBRD 1 Supply for circuitry (+3V3 recommended)
SIF_MISO 2 Serial Interface (Master Input, Slave Output)
SBDG 3 Debug Signal
SIF_MOSI 4 Serial Interface (Master Output, Slave Input)
GND 5 Ground
SIF_CLK 6 Serial Interface (Clock)
nSIF_LOAD 7 Serial Interface (Load Strobe)
nRESET 8 EM260 Reset (Active Low)
PTI_EN 9 Packet Trace Frame Signal
PTI_DATA 10 Packet Trace Data Signal (500kbps)
527602 Product Manual Date : 18 June 2009
Document Number: RDD212-01
Author: C. Groves
Page 12 of 15
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6.2 UART Connector Detailed Description
6.2.1 Overview
This section provides a detailed description of the connections between the ZigBee module and the host
MCU.
Name Host Micro Function EM260 Function EM260
Pin #
P2_TX UART Transmitted Data UART Received Data 26
P2_RX UART Received Data UART Transmitted Data 25
P2_CTS UART CTS UART RTS 16
P2_RTS UART RTS UART CTS 15
SYSRST EM260 RESET EM260 RESET 11
FORCE_BOOT Force EM260 Bootloader Force EM260 Bootloader 23
6.2.2 P2_TX and P2_RX
Transmitted and received serial data between the host micro and the ZigBee module. The signal lines are
connected directly to the EM260.
P2_TX Transmitted data on host MCU.
Received data on the EM260 (pin 26).
P2_RX Received data on host MCU.
Transmitted data on the EM260 (pin 25).
6.2.3 P2_CTS and P2_RTS
The UART hardware flow control lines between the host micro and the ZigBee module. The signal lines
have been connected directly to the EM260.
P2_CTS Clear To Send on the host MCU.
Ready To Send on the EM260 (pin 16).
P2_RTS Ready To Send on host MCU.
Clear To Send on EM260 (Pin 15).
527602 Product Manual Date : 18 June 2009
Document Number: RDD212-01
Author: C. Groves
Page 13 of 15
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6.2.4 FORCE_BOOT
This line can force the EM260 into bootloader mode should the software bootloader command fail. This
gives the host micro a fail safe recovery method for bootloading the EM260. Consideration should be
given to bootloading recovery method should the over the air system fail, for example if the EM260 is
corrupted. Bootloader can be activated by pulling FORCE_BOOT low during a RESET.
This line is connected to PTI_DATA on the EM260 (Pin 23) via a 330 Ohm limiting resistor. It has
been connected to PB12 (pin 51) on the host micro. Please refer to EM260 documetation for correct
implementation of hardware bootloader.
6.2.5 SYSRST
This line will force the EM260 into reset (active low). It is connected to nRESET line of the EM260
(pin 11) and PE10 (pin 41) on the host micro.
6.2.6 P2_AUX1
This line will control the power level of the Skyworks FEM. It is connected to pin 26 of the Skyworks
FEM. The following logic levels have been implemented.
P2_AUX1 Voltage Level Description
High High Power Mode (+20dBm)
Low Low Power Mode (+10dBm)
6.2.7 OPTION_CARD_ID
This signal is provided as a method for the host micro to identify the type of card that has been fitted to
the host equipment. This pin should be connected to an A2D on the host micro and used by the software
to determine the functionality of the card installed. For ZigBee with EM260 the following analogue
voltage level will be used on pin 9 of J2 and J4.
Min Typ Max Units Description
Type 2 0.73 0.83 0.93 V ZigBee with EM260
527602 Product Manual Date : 18 June 2009
Document Number: RDD212-01
Author: C. Groves
Page 14 of 15
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7 Electrical Specification
7.1 Absolute Maximum Ratings
Parameter Min Max Unit
Supply Voltage (Vcc) -0.3 3.6 V
Voltage on IO -0.3 Vcc+0.3
RF Input Power, Antenna Port +10 dBm
Storage Temperature -40 +125 °C
7.2 Recommended Operating Conditions
Parameter Min Typ Max Units
Voltage (Vcc) 2.7 3.3 3.6 V
Data Rate 256 kbps
Operating Temperature -40 +85 °C
527602 Product Manual Date : 18 June 2009
Document Number: RDD212-01
Author: C. Groves
Page 15 of 15
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7.3 Electrical Specification
Parameter Symbol Operating
Condition Min Typ Max Units
Operating Frequency Range F0 2405 2480 MHz
Transmitter Section
Saturated Output Power
(Conducted Measurement)
Low Power Mode
High Power Mode
PSAT_LP
PSAT_HP
VIN = 3.3V
+8.3
+19.7
+10
+20
dBm
dBm
Peak Transmit Current
Low Power Mode
High Power Mode
ITX_PK_LP
ITX_PK_LP
VIN = 3.3V
120
190
mA
mA
Receiver Section (Frequency = 2445MHz)
Receive Current
Low Power Mode
High Power Mode
IRX_AV_LP
IRX_AV_LP
VIN = 3.3V
45
45
mA
mA
Sensitivity
(1% PER, 20 byte packet
defined by IEEE 802.15.4)
V
IN = 3.3V
-107 -99 dBm
Notes:
This is the maximum power the module is capable of transmitting, local regulations may limit the output
power. Please check allowable transmission power for destination country of deployment in section 3.3
or with the design team.

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