Lattice Semiconductor MOD65412 60GHz Module set for Gigabit-Class Wireless Infrastructure Application User Manual MOD65412 Wireless Link Module Set
Lattice Semiconductor Corporation 60GHz Module set for Gigabit-Class Wireless Infrastructure Application MOD65412 Wireless Link Module Set
Manual and Installation Guide
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| Document ID | 3764819 |
| Application ID | nFOL9me9cubdKM/6spldmQ== |
| Document Description | Manual and Installation Guide |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 60.14kB (751802 bits) |
| Date Submitted | 2018-02-28 00:00:00 |
| Date Available | 2018-08-01 00:00:00 |
| Creation Date | 2018-02-21 15:14:09 |
| Producing Software | Microsoft® Word 2010 |
| Document Lastmod | 2018-02-21 15:14:09 |
| Document Title | MOD65412 Wireless Link Module Set |
| Document Creator | Microsoft® Word 2010 |
| Document Author: | Lattice Semiconductor |
MOD65412 Wireless Link Module Set Preliminary Data Brief SB-DB-02006-0.80 February 2018 MOD65412 Wireless Link Module Set Preliminary Data Brief Copyright Notice Copyright © 2018 Lattice Semiconductor Corporation. All rights reserved. The contents of these materials contain proprietary and confidential information (including trade secrets, copyright, and other Intellectual Property interests) of Lattice Semiconductor Corporation and/or its affiliates. All rights are reserved. You are permitted to use this document and any information contained therein expressly and only for bona fide non-commercial evaluation of products and/or services from Lattice Semiconductor Corporation or its affiliates; and only in connection with your bona fide consideration of purchase or license of products or services from Lattice Semiconductor Corporation or its affiliates, and only in accordance with the terms and conditions stipulated. 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Further Information To request other materials, documentation, and information, contact your local Lattice Semiconductor sales office or visit the Lattice Semiconductor web site at www.latticesemi.com. Disclaimers These materials are provided on an “AS IS” basis. Lattice Semiconductor Corporation and its affiliates disclaim all representations and warranties (express, implied, statutory or otherwise), including but not limited to: (i) all implied warranties of merchantability, fitness for a particular purpose, and/or non-infringement of third party rights; (ii) all warranties arising out of course-of-dealing, usage, and/or trade; and (iii) all warranties that the information or results provided in, or that may be obtained from use of, the materials are accurate, reliable, complete, up-to-date, or produce specific outcomes. 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EXCEPT FOR SUCH LIMITED WARRANTY, LATTICE SEMICONDUCTOR CORPORATION AND ITS AFFILIATES DISCLAIM ALL REPRESENTATIONS AND WARRANTIES (EXPRESS, IMPLIED, STATUTORY OR OTHERWISE), REGARDING THE INFORMATION, SERVICES, DESIGNS, KNOW-HOW AND PRODUCTS PROVIDED BY LATTICE SEMICONDUCTOR CORPORATION AND/OR ITS AFFILIATES, INCLUDING BUT NOT LIMITED TO, ALL IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND/OR NON-INFRINGEMENT OF THIRD PARTY RIGHTS. YOU ACKNOWLEDGE AND AGREE THAT SUCH INFORMATION, SERVICES, DESIGNS, KNOW-HOW AND PRODUCTS HAVE NOT BEEN DESIGNED, TESTED, OR MANUFACTURED FOR USE OR RESALE IN SYSTEMS WHERE THE FAILURE, MALFUNCTION, OR ANY INACCURACY OF THESE ITEMS CARRIES A RISK OF DEATH OR SERIOUS BODILY INJURY, INCLUDING, BUT NOT LIMITED TO, USE IN NUCLEAR FACILITIES, AIRCRAFT NAVIGATION OR COMMUNICATION, EMERGENCY SYSTEMS, OR OTHER SYSTEMS WITH A SIMILAR DEGREE OF POTENTIAL HAZARD. NO PERSON IS AUTHORIZED TO MAKE ANY OTHER WARRANTY OR REPRESENTATION CONCERNING THE PERFORMANCE OF THE INFORMATION, PRODUCTS, KNOW-HOW, DESIGNS OR SERVICES OTHER THAN AS PROVIDED IN THESE TERMS AND CONDITIONS. © 2018 Lattice Semiconductor All rights reserved. CONFIDENTIAL SB-DB-02006-0.80 MOD65412 Wireless Link Module Set Preliminary Data Brief 1. General Description 1.2. Features The Lattice MOD65412 Wireless Link Module Set is a two-board wireless link evaluation platform that includes a MOD65410 baseband board that conforms to the PCI Express (PCIe) Half-Mini Card specification and a MOD63422 RF board that includes a printed circuit board (PCB) antenna. The baseband board contains the SB6541 device, a single-chip IEEE 802.11ad-based baseband processor for industrial, and communication applications. The RF board contains the SiI6342 device, a 60 GHz RF transceiver for medium-range access, backhaul, and bridging applications. The baseband and RF boards are connected by a Flexible Printed Circuit (FPC) cable. The module set can be integrated with a host network processor via PCIe to provide wireless station (STA) or access point (AP) functions in a gigabit network link. 1.1. Applications Fixed wireless broadband backhaul and access Indoor/outdoor Wi-Fi wireless backhaul Indoor/outdoor 4G LTE small-cell wireless backhaul Municipal and Enterprise backhaul IP Data Network Processor PCIe MOD65410 Baseband Board MOD63422 RF Board IEEE 802.11ad single-carrier PHY MCS modes 1-8, with PHY data rate up to 2.3 Gb/s IEEE 802.11ad control PHY MCS mode 0 IEEE 802.11ad channels 2 and 3 (59.4 – 63.7 GHz) PCI Express 1.1 x1 interface to host system 1.7 Gb/s effective maximum bidirectional TCP/IP throughput Transmitter EIRP (typical) 37 dBm @ MCS4 Rx sensitivity (typical) –86 dBm @ MCS4 Dual firmware image support with 2 MB flash Adaptive beamforming with ±45° steering angle (-3dB point) Integrated EMI shield, heat sink and antenna on RF board simplify system integration Operating temperature range: –25 C to +90 C case temperature; start-up at –40 C Board dimensions: Half-Mini card (30 mm × 26.8 mm × 1 mm) RF board (64 mm × 52 mm × 8.2 mm) Linux driver supporting kernel version 3.10 to 4.0 Regulatory certification: FCC MOD63422 RF Board Network Node MOD65410 Baseband Board PCIe Network Processor IP Data Network Node Figure 1.1. Typical Application SB-DB-02006-0.80 © 2018 Lattice Semiconductor All rights reserved. CONFIDENTIAL MOD65412 Wireless Link Module Set Preliminary Data Brief 2. System Description 2.1. Block Diagram 3.3Vaux GND Power Supply 1.0V Antennas on PCB TX0-TX11 RX0-RX11 PCLK RF I/Q SiI6342 HSBUS HSBUS 50-pin Connector SB6541 LED_WWAN# W_DISABLE1# 50-pin Connector PET0p/n PER0p/n REFCLK+/- P.S. GND 50-pin Connector 1.1V GND 50-pin Connector 1.8V 3.3V PCLK RF I/Q PCIe Mini-Card Edge Connector The MOD65412 Wireless Link Module Set block diagram is presented below (Figure 2.1). SPI RST# PERST# 54MHz FPC Cable Flash RF Board Baseband Board Figure 2.1. Wireless Link Module Set Block Diagram 2.2. Baseband Board Dimensions The MOD65410 baseband board is a PCI Express Half-Mini Card. Refer to the PCI Express® Mini Card Electromechanical Specification, Revision 2.0, for the bare PCB dimensions. The PCI Express system connectoris card edge is 0.8 mm pitch, 52 pins. The baseband board is 30 mm × 26.8 mm × 4.6 mm, with an EMI enclosure on the top side and without the FPC cable attached. The board is 30 mm × 26.8 mm × 5.1 mm with a standard height FPC connector attached. The two mounting screws are M2: ISO 7045:2011 M2×0.4 Pan head screws with type H or Z crosscut drive or M2.5: ISO 7045:2011 M2.5×0.45 Pan head screws with type H or Z crosscut drive. 8.25 2x 24.20 1.20 MAX 2.40 MAX 3.85 2. 60 +0 30.00 -0.30 Pin 1 +0 26.80 -0.30 23.90 23.90 15.60 CN1 0.8 xR AX 0M 28.60 1.50` 0.10 2x 3.20 MIN 10.45 1.00` 0.10 4.00` 0.10 4.50 2x 2.15 REF Figure 2.2. Baseband Board Mechanical Dimensions © 2018 Lattice Semiconductor All rights reserved. CONFIDENTIAL SB-DB-02006-0.80 MOD65412 Wireless Link Module Set Preliminary Data Brief 2.3. RF Board Dimensions The MOD63422 RF board is 62.6 mm × 51.6 mm × 7.4 mm. The PCB bottom side is covered by a combination EMI shield/heat sink block. There are two M2×0.4 threaded screw holes in the heat sink for attaching a cable retention plate, if needed to prevent the FPC cable from working loose due to shock and vibration. There are four holes in the PCB and heat sink that can be used to mount the module to the system assembly. These holes are 2.4 mm in diameter. M2 wafer head screws are recommended for mounting the module to the system. The four mounting screws are M2: ISO 7045:2011 M2×0.4 Wafer head screws with type H or Z crosscut drive. 2.50 5.00 36.00 19.00 4x M2x0.4-5 Wafer Head Cross-drive Screws 5.00 31.30 31.30 Pin 1 1.60 12.10 12.10 46.80 2 x M2x0.4 x THRU 25.80 TX Antenna Elements RX Antenna Elements 46.40 51.60 0.62 47.80 8.30 J1 2.60 0.80 2.60 57.40 4 x n 2.40 x THRU 44.00 2.40 Center of SiI6342IZU IC 9.30 62.60 Figure 2.3. RF Board Mechanical Dimensions 2.4. Baseband and RF Board Interconnect The baseband and RF boards each have connectors for FPC cable. On the baseband board Connector type: Hirose DDF40C series Part number: DF40C-50DS-0.4V(51) Description: Dual row board-to-board socket, 0.4 mm pitch, 50 pins, 1.5 mm stacking height On the RF board Connector type: Hirose DF40C series Part number: DF40C-50DP-0.4V(51) Description: Dual row board-to-board plug, 0.4 mm pitch, 50 pins, 1.5 mm stack height The FPC cable has mating connectors on each end. Connector types: Hirose DF40C series Part numbers:DF40C-50DP-0.4V(51) on the baseband board end DF40C-50DS-0.4V(51) on the RF board end For technical details of the connectors, refer to the information provided by the manufacturer at https://www.hirose.com/product/en/products/DF40/ SB-DB-02006-0.80 © 2018 Lattice Semiconductor All rights reserved. CONFIDENTIAL MOD65412 Wireless Link Module Set Preliminary Data Brief 2.5. Board Interconnect Cable MOD65412 Wireless Link Module Set uses an FPC cable to connect high speed signals between the baseband board and the RF board. This implementation of the FPC interconnect is 150 mm long, with board-to-board connectors at either end. The cable is folded to connect the baseband board inside the host system to the RF board mounted on an exterior surface of the host system. The FPC has two layers, with all signals routed on one layer and a ground plane on the second layer. The construction of the FPC cable is shown in Table 2.1 below. The geometry used with this implementation is 165 µm traces for single-ended 50 Ω signals and 100/100/100 µm trace/space/trace for 100 Ω differential signal pairs. In designing a system specific FPC cable, care must be taken to match the trace lengths of the two signals in a differential pair as closely as possible. In addition to matching pair trace lengths, the lengths of the TXI/TXQ pairs must be matched, the lengths of the RXI/RXQ pairs must be matched, and the lengths of the HSD[0-3]/HSCS/HSCLK pairs must be matched. The cable included with the Starter Kit matches differential pair trace lengths and group trace lengths to <5 µm. Table 2.1. FPC Interconnect Cable Cross Section Circuit Layer — Thickness 12.5 Unit µm Material Polyamide — Top 15 34 µm µm Adhesive Copper — — — 20 50 20 µm µm µm Adhesive Polyamide Adhesive Bottom — — 34 15 12.5 µm µm µm Copper Adhesive Polyamide Total thickness 213 µm — © 2018 Lattice Semiconductor All rights reserved. CONFIDENTIAL FPC Construction Top Coverlay Double-sided FPC Bottom Coverlay — SB-DB-02006-0.80 MOD65412 Wireless Link Module Set Preliminary Data Brief Baseband Module End of Cable RF Module End of Cable J1 DF40C-50DP-0.4V HIROSE_DF40C-50DP HSD0_P HSD0_N HSCLK_P HSCLK_N TXI_N TXI_P TXQ_N TXQ_P RXI_P RXI_N RXQ_P RXQ_N 54 53 50 48 46 44 42 40 38 36 34 32 30 28 26 24 22 20 18 16 14 12 10 49 47 45 43 41 39 37 35 33 31 29 27 25 23 21 19 17 15 13 11 52 51 J2 DF40C-50DS-0.4V HIROSE_DF40C-50DS RST_N STBY HSDOUT 49 47 45 43 41 39 37 35 33 31 29 27 25 23 21 19 17 15 13 11 HSD2_P HSD2_N HSD1_N HSD1_P HSD3_N HSD3_P HSCS_P HSCS_N PCLK_N PCLK_P 3V3 50 48 46 44 42 40 38 36 34 32 30 28 26 24 22 20 18 16 14 12 10 HSD0_P HSD0_N HSCLK_P HSCLK_N TXI_N TXI_P TXQ_N TXQ_P RXI_P RXI_N RXQ_P RXQ_N Figure 2.4. FPC Interconnect Cable Schematic 15 3.4 Pin 1 3.4 Pin 1 J2 RF Board End 7.5 7.5 J1 Baseband Board End 0.2 150 0.3 Detail A Scale 2:1 15 15 Figure 2.5. FPC Interconnect Cable Mechanical Dimensions SB-DB-02006-0.80 © 2018 Lattice Semiconductor All rights reserved. CONFIDENTIAL MOD65412 Wireless Link Module Set Preliminary Data Brief 3. Electrical Interface This section describes the Electrical Interface between the module set and the host system. The system connector is a 52-pin card edge connector that is compliant with the PCIe Mini Card specification. Refer to the PCI Express® Mini Card Electromechanical Specification, Revision 2.0, for complete details on the card form factor and interface signals. 3.1. Pin Out Table 3.1. System Interface Pin Out Name † PETn0 Pin Number 31 Signal Type — Direction PETp0 † PERn0 † PERp0 33 23 25 — — — REFCLKREFCLK+ 11 13 — — CLKREQ# PERST# 22 W_DISABLE1# 20 LED_WLAN# 44 † 3.3Vaux GND RSVD/NC 2, 24, 39, 41, 52 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43, 50 1, 3, 5, 6, 8, 10, 12, 14, 16, 17, 19, 28, 30, 32, 36, 38, 42, 44, 45, 46, 47, 48, 49, 51 Description Function Group PCI Express differential transmit pair System data/control PCI Express differential receive pair System data/control PCI Express differential reference clock (100 MHz) System data/control LVCMOS LVCMOS Open-Drain 3.3V tolerant Open-Drain 3.3V tolerant Reference clock request Functional reset to the module System control System control Radio operation disable signal System control LED control signal to indicate radio enabled for transmitting System control 3.3 V ± 5%, 1 A — 3.3 V source Module power Electrical Ground — Ground Module power N/C — Card edge pins not used by module Reserved pins † The PET and PER differential pairs are named from the system board point of view. The PETp0 and PETn0 pins are connected to the PCI Express transmitter differential pair on the system board and to the PCI Express receiver differential pair on the SB6541 device on the baseband board. The PERp0 and PERn0 pins are connected to the PCI Express receiver differential pair on the system board and to the PCI Express transmitter differential pair on the SB6541 device on the baseband board. © 2018 Lattice Semiconductor All rights reserved. CONFIDENTIAL SB-DB-02006-0.80 MOD65412 Wireless Link Module Set Preliminary Data Brief 3.2. Description 3.2.1. 3.3 V The PCI Express Mini Card edge connector supplies 3.3 V power to the module set. Due to the nature of the wireless power optimization implemented in this module set, the average power consumed by the module is much lower than the peak power, which is transient. Parameter Value Power Input VIN 3.3 V DC, 1.1 A Max Input Voltage Ripple ±9% Max Power Baseband: 1.0W, RF: 2.7W Typical Power (at MCS6) Baseband: 0.7W, RF: 1.5W Idle Power Baseband: 0.6W, RF: 0.9W 3.2.2. GND These pins provide the common power and signal ground returns for the module. 3.2.3. PCI Express x1 Lane The PETp0/PETn0 and PERp0/PERn0 differential pairs make up a ×1 PCI Express Lane that are the primary means of communicating with and controlling the module setMOD65412 Wireless Link Module Set. The signals are named with respect to the host platform. The PETp0/PETn0 signals are the input pair and are connected to the receiver pins on the SB6541 device on the baseband board. The PERp0/PERn0 signals are the output pair and are connected to the transmitter pins on the SB6541 device through DC-blocking capacitors. 3.2.4. Reference Clock The REFCLK+/REFCLK- differential pair is an input to the baseband board. The reference clock is a 100 MHz clock used to assist the synchronization of the SB6541 device PCI Express interface timing circuits. The reference clock is required by the SB6541 device for proper operation. 3.2.5. CLKREQ# The CLKREQ# signal is an active low output from the baseband board. It is used by the baseband board to request that the host platform supply a PCI Express reference clock. The baseband board ties this signal low through a 1 KΩ pull-down. 3.2.6. PERST# The PERST# signal is an input to the baseband board. It is used by the host platform to indicate the system power source state and to force a hardware reset on the module. The host platform de-asserts (drives high) the signal when the system power sources are stable and within tolerance specifications. The host platform asserts (drives low) the signal when the system power is turned off or goes out of spec. 3.2.7. W_DISABLE1# The W_DISABLE1# signal is an active low input to the baseband board. The host platform can use this signal to indicate to the baseband processor that the radio should be disabled. 3.2.8. LED_WWAN# The LED_WWAN# signal is an active low output from the baseband board intended to drive an LED indicator on the host platform. It is used to indicate when the module has enabled the radio for transmission. SB-DB-02006-0.80 © 2018 Lattice Semiconductor All rights reserved. CONFIDENTIAL MOD65412 Wireless Link Module Set Preliminary Data Brief 4. Grants and Labeling The MOD65412 Module Set is subject to modular approval in regulatory regions. The United States of America (FCC) is the first region that the module is certified. In order to comply with radiation exposure limit set by the FCC, the system where the module is installed must operate at a distance of 30 cm away from any person. It is under such condition that the system integrator can use the MOD65412 modular grant. The MOD65412 modular grant covers three components of the module: the baseband board, the RF board, and the FPC cable. The grant allows the system integrator to use different lengths of the FPC cable between 75 mm and 250 mm to meet specific system design requirements. The FPC cable reference design can be obtained through Lattice Semiconductor sales representatives. The following grants have been issued for the MOD65412 module set: Model: MOD65412: FCC (USA): UK2-MOD65412 4.1. Module Label Examples The labels attached to the model set provide identification and traceability in addition to displaying regulatory grants. Example labels are shown below. The exact layout may differ, but all important information should be displayed clearly. Label Color: White Text Color: Black Material: adhesive and Time Resistant (Polyester) 38 mm Lattice Semiconductor Corporation OPN: MOD63422 15 mm PN: MOD63422 BAR CODE AREA 2115 O’Nel Drive San Jose, CA 95131, USA Made in Country ODM or OEM marks: for example Lot number, Product ID LABEL Figure 4.1. Example Label on MOD63422 10 © 2018 Lattice Semiconductor All rights reserved. CONFIDENTIAL SB-DB-02006-0.80 MOD65412 Wireless Link Module Set Preliminary Data Brief Label Color: White Text Color: Black Material: adhesive and Time Resistant (Polyester) 28 mm 14 mm Lattice Semiconductor Corporation OPN: MOD65412 (MOD63422 + MOD65410) PN: MOD65410 BAR CODE and MAC address Area FCC ID: UK2-MOD65412 2115 O’Nel Drive San Jose, CA 95131, USA Made in Country ODM or OEM marks: for example Lot number, Product ID LABEL Figure 4.2. Example Label on MOD65410 SB-DB-02006-0.80 © 2018 Lattice Semiconductor All rights reserved. CONFIDENTIAL 11 MOD65412 Wireless Link Module Set Preliminary Data Brief Ordering Information Device Lattice GigaRay Module Set 12 Ordering Part Number MOD65412 © 2018 Lattice Semiconductor All rights reserved. CONFIDENTIAL SB-DB-02006-0.80 MOD65412 Wireless Link Module Set Preliminary Data Brief Appendix A. OEM Installation A.1. Interference Statement USA - Federal Communications Commission (FCC) This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy. If not installed and used in accordance with the instructions, it may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. 1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. 2. This product does not contain any user serviceable components. Any unauthorized product changes or modifications will invalidate warranty and all applicable regulatory certifications and approvals. 3. Caution: Exposure to Radio Frequency Radiation: The installer of this radio equipment must place the module inside the enclosure of a stationary system intended to operate 30 cm away from the end user body in typical operation. This implies that this module shall not be integrated in battery operated devices, handheld devices, wearable accessories for example. 4. The antenna(s) used for this transceiver must not be collocated or operating in conjunction with any other antenna or transmitter within a host device, except in accordance with FCC multi-transmitter product procedures. Other antennas shall be installed with a minimum 30 cm separation from the 60 GHz device antenna present in this module. 5. Caution: User is cautioned that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. 6. FCC rule 15.255(a) prohibits the use of this device on aircrafts or satellites. 7. This module is intended for the OEM integrator. Additional note to System Integrator/OEM: The regulatory label on the final system must include the exact statement: “Contains FCC ID: UK2-MOD65412” on the enclosure SB-DB-02006-0.80 © 2018 Lattice Semiconductor All rights reserved. CONFIDENTIAL 13 MOD65412 Wireless Link Module Set Preliminary Data Brief Revision History Revision 0.80, February 2018 First preliminary release. 14 © 2018 Lattice Semiconductor All rights reserved. CONFIDENTIAL SB-DB-02006-0.80 th th 7 Floor, 111 SW 5 Avenue Portland, OR 97204, USA T 503 268 8000 www.latticesemi.com
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