MMB Research BSB03PA1X EFR32 802.15.4 Module User Manual

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Date Submitted	2018-02-14 00:00:00
Date Available	2018-08-14 00:00:00
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MMB Networks EFR32 Zigbee / Thread Module
BSB03PA10 / PA11 / PA12
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The MMB Networks BSB03PA1x family is the latest generation
Zigbee and Thread capable module. Based on the EFR32 multiprotocol IC from Silicon Labs, the BSB03PA1x are drop-in Zigbee 3.0
solutions. Preloaded with MMB Networks’ RapidSE Zigbee Smart
Energy application or RapidHA Home Automation application,
it offers hardware vendors an easy way to integrate a fullyimplemented, automated Zigbee Smart Energy or Zigbee Home
Automation platform into their existing devices.
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Document Rev 0.7
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MMB Networks offers a variety of hardware and software
development tools to facilitate integration. For more information,
please visit
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http://www.mmbnetworks.com
Benefits
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Features
Ensures compatibility with latest Zigbee and Thread
specifications
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Pre-loaded with RapidConnect firmware
Industry leading 802.15.4 MCU ensures best-in-class
performance
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Built on Silicon Labs EFR32 Wireless Gecko Family
Certified application layer, onboard stack, antenna and
regulatory approvals
Provides rapid time-to-market and short
implementation time
Up to 118 dB link budget
Delivers unmatched range for difficult installations
SMD Chip Antenna or U.FL RF connector options
Allows for external antennas where required
15.88mm x 12.6mm x 2.0mm module size
Tiny module size will fit in the most miniature
applications
+19.5, +16.5, and +8 dBm transmit power options
Power and price optimized to meet end product
transmit power requirements
15 GPIO (General Purpose Input/Output) connections
Flexibility to drive simple to complex devices
Rev 0.7 © MMB Networks 2018
Page 1
BSB03PA1x Module Data Sheet
Contents
1 | General Information....................................................................................................................................3
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2 | Memory.........................................................................................................................................................3
3 | Module Pinout..............................................................................................................................................3
3.1 | Debug and Programming Interface...........................................................................................................................................4
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4 | Electrical Specifications..............................................................................................................................4
4.1 | Absolute Maximum Ratings............................................................................................................................................................4
4.2 | Recommended Operating Conditions.....................................................................................................................................4
4.3 | DC Electrical Characteristics............................................................................................................................................................5
In
5 | RF Specifications..........................................................................................................................................5
5.1 | Receive Specifications.........................................................................................................................................................................5
5.2 | Transmit Specifications.......................................................................................................................................................................5
5.2.1 | Typical Transmit Performance Curves(Tx Current vs. Tx Power)...........................................................................6
5.2.2 | Typical Transmit Performance Curves(Output Power vs. Tx Power)...................................................................7
6 | Functional Specifications...........................................................................................................................7
6.1 | Serial Ports..................................................................................................................................................................................................7
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7 | Mechanical Specifications..........................................................................................................................8
7.1 | Physical Dimensions.............................................................................................................................................................................8
7.2 | Recommended Land Pattern (Surface Mount)...................................................................................................................9
7.3 | RF Connector Dimensions.............................................................................................................................................................10
7.4 | Label Drawings.....................................................................................................................................................................................10
8 | Soldering Temperature Time Profile for reflow soldering (Lead-free solder)............................... 11
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9 | Regulatory Approvals.............................................................................................................................. 11
9.1 | Federal Communications Commission (FCC - US)..........................................................................................11
9.2 | Industry Canada (IC) .........................................................................................................................................................................12
9.3 | EU..................................................................................................................................................................................................................13
9.4 | RoHS Compliance...............................................................................................................................................................13
10 | Revision History...................................................................................................................................... 13
11 | Ordering Information............................................................................................................................ 14
Rev 0.7 © MMB Networks 2018
Page 2
BSB03PA1x Module Data Sheet
1 | General Information
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Note that some of the specifications refer to either the “EFR32” chip or the “Module”. Specifications cited as EFR32 are taken
from the EFR32 datasheet (this should also be noted where referred to). Module means measurements taken with our
production module.
2 | Memory
On-Chip Flash (kB)
32
256
RAM (kB)
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3 | Module Pinout
Function
EFR32 Pin Name (number)
2.4GHz antenna line out
2G4RF_IOP (12)
Module Ground
EFR32 GPIO, Port D #13
EFR32 GPIO, Port D #14
EFR32 GPIO, Port D #15
EFR32 GPIO, Port A #1
PA1 (18)
Yes
EFR32 GPIO, Port A #0
PA0 (17)
Yes
Digital I/O Power Supply
IOVDD (30)
EFR32 GPIO, Port B #11
PB11 (19)
Yes
10
EFR32 GPIO, Port B #12
PB12 (20)
Yes
Yes
PD14 (15)
Yes
PD15 (16)
Yes
PD13 (14)
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ADC Capable
Module Ground
Module Ground
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12
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11
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Module Pad
13
Module Ground
14
EFR32 GPIO, Port B #13
PB13 (21)
Yes
15
EFR32 GPIO, Port B #14
PB14 (23)
Yes
16
EFR32 GPIO, Port B #15
PB15 (24)
Yes
17
Module Ground
18
Module Main Power
19
Module Ground
20
EFR32 GPIO, Port C #10
PC10 (31)
Yes
21
EFR32 GPIO, Port C #11
PC11 (32)
Yes
22
Module Ground
23
Reset input, active low
RESETn (8)
24
EFR32 GPIO, Port F #0
PF0 (1)
Yes
25
EFR32 GPIO, Port F #1
PF1 (2)
Yes
26
EFR32 GPIO, Port F #2
PF2 (3)
Yes
27
Module Ground
Rev 0.7 © MMB Networks 2018
Page 3
BSB03PA1x Module Data Sheet
3.1 | Debug and Programming Interface
In order to access the EFR32 for programming and debug purposes, it is recommended that the designer incorporate
Silcon Labs 10-pin Mini Simplicity connector.
17 (Module Ground)
23 (Reset input, active low)
6 (EFR32 GPIO, Port A #1)
7 (EFR32 GPIO, Port A #0)
26 (EFR32 GPIO, Port F #2)
25 (EFR32 GPIO, Port F #1)
24 (EFR32 GPIO, Port F #0)
14 (EFR32 GPIO, Port B #13)
10
10 (EFR32 GPIO, Port B #12)
10
18 (Module Main Power)
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VAEM
RST
VCOM_TX
SWDIO
PTI_FRAME
GND
VCOM_RX
SWO
SWCLK
PTI_DATA
In
Module Pad
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Silicon Labs
Simplicity
Studio Port Pin
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The following table shows a pin mapping between Silicon Labs 10-pin Mini Simplicity connector and the module, and the
graphic to the right displays the layout of the Mini Simplicity connector.
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4 | Electrical Specifications
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4.1 | Absolute Maximum Ratings
Parameter
Minimum
Maximum
Units
Supply Voltage (VCC)
3.6
Voltage on any GPIO
-0.3
VCC + 0.3
Voltage on any GPIO pin when used as an input to the general purpose ADC
with the low voltage range selected
-0.3
Ambient Operating Temperature (standard version)
-40
85
°C
Storage Temperature
-50
150
°C
4.2 | Recommended Operating Conditions
Parameter
Minimum
Typical
Maximum
Units
Supply Voltage (VCC)
2.0
3.3
3.6
Temperature Range
-40
85
°C
Rev 0.7 © MMB Networks 2018
Page 4
BSB03PA1x Module Data Sheet
4.3 | DC Electrical Characteristics
Test Condition
Minimum
Maximum
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At 25 °C, VCC = 3.3v, normal
mode, 19.5 dBm
Typical
Parameter
At 25 °C, VCC = 3.3v, normal
mode, 16.5 dBm
At 25 °C, VCC = 3.3v, normal
mode, 8 dBm
RX Current
At 25 °C, VCC = 3.3v, normal
mode, 2.4 GHz
Deep Sleep Current
At 25 °C, VCC = 3.3v, shutdown
mode. Full RAM retention and
RTCC running from LFXO
140
mA
95
mA
30
mA
8.7
mA
μA
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Operating Current
Units
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5.1 | Receive Specifications
5 | RF Specifications
Sensitivity
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Frequency range
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Note: The Typical number indicates one standard deviation above the mean, measured at room temperature (25°C). The
Min and Max numbers were measured over process corners at room temperature.
2400
1% PER, 20 byte packet defined by
IEEE 802.15.4-2003
2483.5
-98
MHz
dBm
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5.2 | Transmit Specifications
Output Power at highest power
setting
Rev 0.7 © MMB Networks 2018
BSB03PA10 module
19.5
dBm
BSB03PA11 module
16.5
dBm
BSB03PA12 module
8.5
dBm
Page 5
BSB03PA1x Module Data Sheet
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5.2.1 | Typical Transmit Performance Curves (Tx Current vs. Tx Power)
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Note: The graph above is for the PA10 variant. For PA11 and PA12 modules, the maximum output power is limited by the
chosen SKU (16.5dBm or 8dBm respectively)
Rev 0.7 © MMB Networks 2018
Page 6
BSB03PA1x Module Data Sheet
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5.2.2 | Typical Transmit Performance Curves (Output Power vs. Tx Power)
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Note: The graph above is for the PA10 variant. For PA11 and PA12 modules, the maximum output power is limited by
the chosen SKU (16.5dBm or 8dBm respectively)
6 | Functional Specifications
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6.1 | Serial Ports
Refer to the EFR32 data sheet for functionality and associated GPIO pinouts.
Note: The module pinout table in section 3 of this document provides a cross reference between the MMB module pins
and the EFR32 GPIO.
Note 2: The RapidConnect firmware supports UART communication with a baud rate of 115.2kbps. However, MMB can
modify this configuration as necessary through a Non-Recurring Engineering engagement.
Rev 0.7 © MMB Networks 2018
Page 7
BSB03PA1x Module Data Sheet
7 | Mechanical Specifications
Antenna
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7.1 | Physical Dimensions
Description
Length of the module
15.88 mm
Width of the module
12.60 mm
Distance
Height of the module
2.88 mm
Length of keep-out zone
5.50 mm
Width of keep-out zone
8.50 mm
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in
Symbol
Keep-out zone from corner of PCB
5.0 mm
Keep-out zone from corner of PCB
5.0 mm
Note: The above table and recommendation apply to BSB03PA1x-CHP products only.
The BSB03PA1x family of devices use a System on Module (SOM) package process technology.
Rev 0.7 © MMB Networks 2018
Page 8
BSB03PA1x Module Data Sheet
7.2 | Recommended Land Pattern (Surface Mount)
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The diagram below shows the recommended dimensions and arrangement of the pads for the module. The daughtercard
upon which the module will be mounted should not include any traces or vias directly under the module, because they
may come in contact with the module’s traces and cause unexpected behavior. If it is absolutely necessary to include traces
and/or vias under the module due to space constraints, then a customer can elect to do so at their own risk. MMB can
provide a Hardware Designer Package to show the module’s footprint and drill locations, which must not line up with the
daughtercard’s drill locations.
22
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27
F7
F1
In
21
F3
in
F5
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0.64 mm
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1.14 mm
Top and Bottom
Pad Dimensions
1.14 mm
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F6
F5
13
F4
0.64 mm
Right Side
Pad Dimensions
Symbol
Description
Distance
F1
Distance pad centre to pad centre
2.68 mm
F2
Distance pad centre to pad centre
1.40 mm
F3
Distance pad centre to pad centre
3.52 mm
F4
Distance pad centre to pad centre
1.48 mm
F5
Pitch
1.02 mm
F6
Module silkscreen outline
12.60 mm
F7
Module silkscreen outline
15.88 mm
Rev 0.7 © MMB Networks 2018
F2
Page 9
BSB03PA1x Module Data Sheet
7.3 | RF Connector Dimensions
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The diagram below shows the dimensions for the RF connector. This connector appears on the -RFC variants only.
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7.4 | Label Drawings
Rev 0.7 © MMB Networks 2018
Page 10
BSB03PA1x Module Data Sheet
Temp
[ ˚C ]
8 | Soldering Temperature Time Profile for reflow soldering (Lead-free solder)
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230˚C - 240˚C max
220˚C
30 +20/-10s
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150˚C - 190˚C
90 ±30s
Maximum reflow cycles: 2
Time [ s ]
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Opposite-side reflow is prohibited due to the module weight. You must not place the module on the bottom / underside
of your PCB and re-flow.
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9 | Regulatory Approvals
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9.1 | Federal Communications Commission (FCC - US)
Note: this section applies to BSB03PA1x-CHP and BSB03PA1x-RFC devices only.
9.1.1 | Approved Antennae
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For the BSB03PA1x-CHP modules using the onboard chip antenna, the approved power level settings are -2 dBm for
channels 11-25 and -20 dBm for channel 26. The onboard chip antenna is Inpaq ACA-2012-A1-CC-S.
For the BSB03PA1x-RFC modules using the approved external antenna, the approved power level settings are -11 dBm for
channels 11-25 and -26 dBm for channel 26. The BSB03PA1x-RFC devices have been approved with the following external
FCC approved antennas: Mag Layers EDA-1713-2G4C1-A2, and Bondale G-RA0K13200284-SZ478.
9.1.2 | FCC Notice
The BSB03PA1x-CHP and BSB03PA1x-RFC devices comply with Part 15 of the FCC rules. Operation is subject to the following
two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause undesired operation.
To comply with FCC RF Exposure requirements, users of this device must ensure that the module be installed and/or
configured to operate with a separation distance of 20cm or more from all persons.
Usage of Channel 26 at full power will result in non-compliance to FCC standards. MMB recommends avoiding use of
channel 26 and if necessary only use with a reduced power setting. For further details please contact MMB.
Rev 0.7 © MMB Networks 2018
Page 11
BSB03PA1x Module Data Sheet
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This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try
to correct the interference by one of the following measures:
Reorient or relocate the receiving antenna.
•
Increase the separation between the equipment and receiver.
•
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
•
Consult the dealer or an experienced radio/TV technician for help.
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•
9.1.3 | Modular Approval
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The BSB03PA1x-CHP and BSB03PA1x-RFC devices meet the requirements for modular transmitter approval as detailed in the
FCC public notice DA 00-1407.
It should be noted that:
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“While the applicant for a device into which an authorized module is installed is not required to obtain a new authorization
for the module, this does not preclude the possibility that some other form of authorization or testing may be required for
the device (e.g., a WLAN into which an authorized module is installed must still be authorized as a PC peripheral, subject to
the appropriate equipment authorization).”
-- FCC Public Notice DA 00-1407
NOTE:
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Caution:
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority
to operate the equipment.
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This module is intended for an OEM integrator. The OEM integrator is responsible for the compliance to all the rules that
apply to the product into which this certified RF module is integrated. Additional testing and certification may be necessary
when multiple modules are used.
A 20cm minimum distance has to be able to be maintained between the antenna and the users for the host this module
is integrated into. Under such configuration, the FCC radiation exposure limits set forth for a population/uncontrolled
environment can be satisfied.
Further RF exposure shall be re-evaluated to the scenario of portable, and collocated use.
USER MANUAL OF THE END PRODUCT:
In the user manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna
while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency exposure
guidelines for an uncontrolled environment can be satisfied.
The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could
void the user’s authority to operate this equipment.
Rev 0.7 © MMB Networks 2018
Page 12
BSB03PA1x Module Data Sheet
9.1.4 | Labeling Requirements
The user of this device is responsible for meeting the FCC labeling requirements. A clearly visible label on the exterior
enclosure of an incorporating device must list the MMB Research Inc. FCC ID “XFF-BSB03PA1X” and the FCC Notice above
(section 9.1.1).
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The exterior label should use the wording “Contains” or “Contains Transmitter Module”. For example:
Any similar wording that expresses the same meaning may be used.
Contains FCC ID: XFF-BSB03PA1X
or
Contains Transmitter Module FCC ID: XFF-BSB03PA1X
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If the labelling area is smaller than the palm of the hand, then additional FCC part 15.19 statement is required to be
available in the users manual: This device complies with Part 15 of FCC rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received,
including interference that may cause undesired operation.
In
LABEL OF THE END PRODUCT:
The final end product must be labeled in a visible area with the following “Contains TX FCC ID: XFF-BSB03PA1X”.
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If the labelling area is larger than the palm of the hand, then the following FCC part 15.19 statement has to also be
available on the label: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference and (2) this device must accept any interference received, including
in
interference that may cause undesired operation.
9.2 | Industry Canada (IC)
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Note: this section applies to BSB03PA1x-CHP and BSB03PA1x-RFC devices only.
9.2.1 | Approved Antennae
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For the BSB03PA1x-CHP modules using the onboard chip antenna, the approved power level settings are -2 dBm for
channels 11-25 and -20 dBm for channel 26.
For the BSB03PA1x-RFC modules using the approved external antenna, the approved power level settings are -11 dBm for
channels 11-25 and -26 dBm for channel 26.
9.2.2 | IC Notice
This device complies with Industry Canada licence-exempt RSS standard(s).
Operation is subject to the following two conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence.
L’exploitation est autorisée aux deux conditions suivantes :
(1) l’appareil ne doit pas produire de brouillage, et
(2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en
compromettre le fonctionnement.
Rev 0.7 © MMB Networks 2018
Page 13
BSB03PA1x Module Data Sheet
9.2.3 | Labeling Requirements
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The host device shall be properly labelled to identify the modules within the host device. The Industry Canada certification
label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be
labelled to display the Industry Canada certification number of the module, preceded by the words “Contains transmitter
module”, or the word “Contains”, or similar wording expressing the same meaning, as follows:
Contains transmitter module IC: 8365A-BSB03PA1X
Contient le émetteur radio IC: 8365A-BSB03PA1X
9.3 | EU
Note: this section applies to BSB03PA1x-CHP and BSB03PA1x-RFC devices only.
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BSB03PA1x-CHP and BSB03PA1x-RFC devices are compliant with the following EU standards: ETSI EN 300 328 (v1.9.1), ETSI
EN 301 489 1 (v1.9.2) and ETSI EN 301 489 17 (v2.2.1), provided that the transmit power level is set to -2 dBm (if on-board
antenna is used) or -11 dBm (if whip antenna is used).
These devices are also compliant with 2014/53/EU.
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9.4 | RoHS Compliance
10 | Revision History
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The BSB03PA1X devices do not contain any substances in excess of the maximum concentration allowed by Directive
2002/95/EC. The module is RoHS compliant.
Date
0.7
2018/02/13
Comments
Added Debug and Programming
Section, Updated FCC/IC section
2017/11/21
Updated dimensions, package type,
and ordering information
2017/10/04
Regulatory Information added
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0.6
in
Revision
0.4
2017/09/15
New SKU names, minor updates
0.3
2017/08/24
Added PA11 and PA12 variants
0.2
2017/07/10
Minor updates
0.1
2017/05/29
Initial draft
Rev 0.7 © MMB Networks 2018
Page 14
BSB03PA1x Module Data Sheet
Max Output
Power (dBm)
RF Output
Option
Status
BSB03PA10-CHP
19.5
Chip Antenna
Engineering Samples
BSB03PA10-RFC
19.5
RF Connector
Engineering Samples
BSB03PA10-PIN
19.5
Module Pad 1
Engineering Samples
BSB03PA11-CHP
16.5
Chip Antenna
Engineering Samples
BSB03PA11-RFC
16.5
RF Connector
Engineering Samples
BSB03PA11-PIN
16.5
Module Pad 1
Engineering Samples
BSB03PA12-CHP
Chip Antenna
Engineering Samples
BSB03PA12-RFC
RF Connector
BSB03PA12-PIN
Module Pad 1
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HW SKU
11 | Ordering Information
Engineering Samples
Engineering Samples
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Note: The above table provides the HW SKU which forms the first part of the complete part number. The complete part
number takes the format: BSB03PA1x-yyy-r-zzz.
Where r is the regulatory region (E=Europe, N=North America), and zzz represents a three digit programming code.
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Contact your local MMB sales representative to determine the correct programming code for your application.
Copyright © 2018 MMB Research Inc. All rights reserved.
The information in this document is subject to change without notice. This document
is believed to be accurate and reliable, but the statements contained herein are
presented without expressed or implied warranty.
500 -243 College Street
416.636.3145
Toronto, Ontario, Canada
info@mmbnetworks.com
M5T 1R5
www.mmbnetworks.com
MMB Networks is a division of MMB Research Inc
RapidSE, RapidHA, and RapidConnect are trademarks of MMB Research Inc.
All other trademarks are the property of their respective holders.
February 2018
Rev 0.7 © MMB Networks 2018
Page 15
BSB03PA10x Module Data Sheet

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