MMB Research LKT00 802.15.4 Zigbee single module User Manual

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Document ID	3059680
Application ID	M2RvV/pAzcZ0ce6k+XFpuA==
Document Description	User Manual
Short Term Confidential	No
Permanent Confidential	No
Supercede	No
Document Type	User Manual
Display Format	Adobe Acrobat PDF - pdf
Filesize	24.57kB (307103 bits)
Date Submitted	2016-07-12 00:00:00
Date Available	2016-07-12 00:00:00
Creation Date	2016-04-27 03:49:46
Producing Software	Mac OS X 10.11.4 Quartz PDFContext
Document Lastmod	2016-04-27 03:49:46
Document Title	Microsoft Word - MMB Networks LKT00 Datasheet MB 4-26-16.docx
Document Creator	Word

MMB Networks LKT00 ZigBee Module based on the NCS36510
LKT00
The MMB Networks LKT00 ZigBee module is a drop-in
ZigBee/802.15.4 module for use in wireless mesh networking
applications. The module is based on ON Semiconductor’s
NCS36510 SoC. The NCS36510 is a low power, fully
integrated, System on Chip that integrates a 2.4 GHz IEEE
802.15.4−2006 compliant transceiver, ARM® Cortex®−M3
microprocessor, RAM and FLASH memory, a true random
number generator, and multiple peripherals to support
design of a complete and secure wireless network with
minimal external components.
Document Rev 0.2 DRAFT

The NCS36510 incorporates an industry leading 32 bit ARM
Cortex−M3 for high performance, low power and low cost processing. The NCS36510 includes 640 kB of
embedded FLASH memory for program storage along with 48 kB of RAM for data storage. NCS36510
uses a hardware accelerated MAC to minimize processor overhead while maximizing available processor
power for running application software.
Peripherals include DMA, UART(2), SPI(2), I2C(2), PWM, RTC, three programmable timers, WDT, 18
GPIO, 10 bit ADC with four external inputs and integrated temperature and voltage sensors.
Table of Contents
General Information ................................................................................................................. 1
Memory .................................................................................................................................... 1
Module Pinout.......................................................................................................................... 1
3.1
Debug and Programming Interface ................................................................................................ 1
Electrical Specifications ............................................................................................................ 2
4.1 Absolute Maximum Ratings ........................................................................................................... 2
4.2 Recommended Operating Conditions ............................................................................................ 2
4.3 DC Electrical Characteristics ........................................................................................................... 2
4.3.1 Core Power Consumption ....................................................................................................... 2
4.4 TX Power Setting ............................................................................................................................ 3
RF Specifications....................................................................................................................... 3
5.1
5.2
Receive Specifications .................................................................................................................... 3
Transmit Specifications .................................................................................................................. 3
Mechanical Specifications ........................................................................................................ 3
6.1
6.2
6.3
Physical Dimensions ....................................................................................................................... 3
Recommended Land Pattern (Surface Mount) .............................................................................. 4
Labeling .......................................................................................................................................... 4
Soldering Temperature Time Profile for Reflow Soldering (Lead-Free Solder) ........................ 4
Regulatory Approvals ............................................................................................................... 5
8.1 Approved Antennae ....................................................................................................................... 5
8.2 Federal Communications Commission (FCC - US) .......................................................................... 5
8.2.1 RF Output Power Settings ....................................................................................................... 5
8.2.2 FCC Notice ............................................................................................................................... 5
8.2.3 Modular Approval ................................................................................................................... 5
8.2.4 Labeling Requirements............................................................................................................ 5
8.3 Industry Canada (IC) ....................................................................................................................... 6
8.3.1 RF Output Power Settings ....................................................................................................... 6
8.3.2 IC Notice .................................................................................................................................. 6
8.3.3 Labeling Requirements............................................................................................................ 6
8.4 ETSI (EU) ......................................................................................................................................... 6
8.4.1 RF Output Power Settings ....................................................................................................... 6
8.4.2 ETSI Approval .......................................................................................................................... 6
Ordering Information ............................................................................................................... 7
1 General Information
Note that some of the specifications refer to either “NCS36510” or “Module”. Please note specifications cited as
NCS36510 are taken from the NCS36510 datasheet (this should also be noted where referred to). “Module” means
measurements taken with the MMB Networks production module.
2 Memory
RAM (kB)
48
On-Chip Flash (kB)
640
3 Module Pinout
Module Pad
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
NCS36510 GPIO (NCS36510 Pin Number)
Test (35)
DIO17 (40)
DIO10 (1)
DIO16 (4)
VDDIO (5)
GND
DIO8 (3)
DIO7 (7)
DIO6 (8)
DIO5 (9)
DIO4 (10)
DIO3 (11)
DIO2 (12)
DIO1 (13)
DIO0 (14)
nReset (36)
DIO9 (2)
VDD (22, 34)
GND
A0 (23)
DIO13 (37)
DIO12 (38)
DIO11 (39)
GND
A1 (24)
DIO15 (6)
DIO14 (15)
A2 (29)
A3 (30)
3.1 Debug and Programming Interface
DRAFT TBD
Rev 0.2 DRAFT
Page 1 of 7
LKT00 Module Datasheet DRAFT
4 Electrical Specifications
4.1 Absolute Maximum Ratings
Parameter
Supply Voltage (VDD, VDDIO)
Voltage on any GPIO (DIO0:DIO17, nReset, Test)
Analog pin voltage (A0:A3)
Storage Temperature Range
Minimum
-0.3
-0.3
-0.3
-40
Maximum
3.9
VDDIO+0.3, <=3.9
VDD+0.3, <=3.9
+125
Units
°C
4.2 Recommended Operating Conditions
Parameter
Supply Voltage (VDD) – 3V Mode
Supply Voltage (VDDIO)
Ambient Temperature Range
Minimum
TBD
TBD
-40
Typical
3.3
3.3
27
Maximum
3.6
3.6
85
Units
°C
4.3 DC Electrical Characteristics
For typical values TA = 27°C, for min/max values TA = −40°C to 85°C; unless otherwise noted. Power supplies VDD = 3.3
V, VDDIO = 3.3 V, unless otherwise noted.
Parameter
Coma Mode Sleep Current1
Test Condition
Minimum
3 V Mode, Switching Regulator
3 V Mode, Linear Regulator
FLASH Erase Cycles Before
Failure3
FLASH Read Current3
FLASH Erase Current3
FLASH Write Current3
Data Retention at 85°C
Typical
0.65
4.96
Maximum
Units
μA
μA
cycles
2.3
mA
mA
mA
years
Maximum
Units
mA
mA
mA
mA
mA
mA
mA
10k
10
4.3.1 Core Power Consumption
Parameter
3V Mode Transmit Current –
Switching Regulator4
3V Mode Transmit Current –
Linear Regulator4
Test Condition
+7.6 dBm (Max. Power Setting)
0 dBm
−16 dBm (Min. Power Setting)
+7.6 dBm (Max. Power Setting)
0 dBm
−16 dBm (Min. Power Setting)
3V Mode Receive Current –
Switching Regulator4
3V Mode Receive Current –
Linear Regulator4
Minimum
Typical
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
mA
Notes:
1. Coma mode = CPU running on internal 32 kHz osc and waiting for interrupt, both retention RAMS disabled, all other functions powered down
Rev 0.2 DRAFT
Page 2 of 7
LKT00 Module Datasheet DRAFT
2. VDD = 2.0V
3. Guaranteed by design
4. Peripherals disabled, CPU halted, 32 MHz crystal oscillator, CW Mode, 2.44GHz, ON Semiconductor evaluation board, conducted measurement,
50 ohm system
Please refer to the NCS36510 data sheet for DIO specifications including internal resistor values, switching voltages,
thresholds, etc.
4.4 TX Power Setting
The RF Output power of the Module can be adjusted via the SoC’s TX Power settings. The Transmit Current will also vary
according to the TX Power setting. The charts below show the relationship between the Transmit Current or Output
Power vs the TX Power setting.
CHART TBD
5 RF Specifications
5.1 Receive Specifications
Parameter
Frequency range
Sensitivity
RSSI range
Test Condition
Minimum
2400
Typical
-97
40
Maximum
2485
-92
60
Units
MHz
dBm
dB
5.2 Transmit Specifications
Parameter
Output Power
Error Vector Magnitude (EVM)
Spurious emissions, relative
Spurious emissions, absolute
Test Condition
Max Power
Setting
Max Power
Max power
Max power
Minimum
Typical
7.6
Maximum
10
Units
dBm
35
dBc
dBm
10
-20
-30
6 Mechanical Specifications
6.1 Physical Dimensions
Dimension Drawing TBD
Symbol
Description
Length of the module
Width of the module
Height of the module
A1
Pitch
A2
Distance center of pad to PCB edge
Rev 0.2 DRAFT
Page 3 of 7
Distance
LKT00 Module Datasheet DRAFT
Symbol
A3
Description
Distance center of pad to PCB edge
Length of keep-out zone
Width of keep-out zone
Keep-out zone from corner of PCB
Keep-out zone from corner of PCB
Distance
6.2 Recommended Land Pattern (Surface Mount)
Land Pattern TBD
Symbol
F1
F2
F3
F4
F5
F6
Description
Distance pad edge to pad edge
Distance pad edge to pad edge
Distance pad edge to pad center
Pitch
Module silkscreen outline
Module silkscreen outline
Distance
6.3 Labeling
7 Soldering Temperature Time Profile for Reflow Soldering (Lead-Free Solder)
Rev 0.2 DRAFT
Page 4 of 7
LKT00 Module Datasheet DRAFT
8 Regulatory Approvals
8.1 Approved Antennae
The LKT00 module has been certified with one onboard chip antenna. See the individual jurisdictions below for the
detailed output power settings.
8.2 Federal Communications Commission (FCC - US)
8.2.1 RF Output Power Settings
For the LKT00 module using the onboard chip antenna, the approved power level settings are 10 (max power) for
channels 11- 25 and X for channel 26.
8.2.2 FCC Notice
The LKT00 device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause undesired operation.
To comply with FCC RF Exposure requirements, users of this device must ensure that the module be installed and/or
configured to operate with a separation distance of 20cm or more from all persons. Usage of Channel 26 at full power
will result in non-compliance to FCC standards. MMB recommends avoiding use of channel 26 and if necessary only use
with a reduced power setting. For further details please contact MMB.
8.2.3 Modular Approval
The LKT00LKT00 device meets the requirements for modular transmitter approval as detailed in the FCC public notice DA
00-1407.
It should be noted that:
“While the applicant for a device into which an authorized module is installed is not required to obtain a new
authorization for the module, this does not preclude the possibility that some other form of authorization or testing may
be required for the device (e.g., a WLAN into which an authorized module is installed must still be authorized as a PC
peripheral, subject to the appropriate equipment authorization).”
-- FCC Public Notice DA 00-1407
Caution:
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority
to operate the equipment.
8.2.4 Labeling Requirements
The user of this device is responsible for meeting the FCC labeling requirements. A clearly visible label on the exterior
enclosure of an incorporating device must list the MMB Research Inc. FCC ID “XFF-LKT00” and the FCC Notice above
The exterior label should use the wording “Contains” or “Contains Transmitter Module”. For example:
Contains FCC ID: XFF-LKT00
Rev 0.2 DRAFT
Page 5 of 7
LKT00 Module Datasheet DRAFT
or
Contains Transmitter Module FCC ID: XFF-LKT00
Any similar wording that expresses the same meaning may be used.
8.3 Industry Canada (IC)
8.3.1 RF Output Power Settings
For the LKT00 module using the onboard chip antenna, the approved power level settings are 10 (max power) for
channels 11- 25 and X for channel 26.
8.3.2 IC Notice
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two
conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence.
L’exploitation est autorisée aux deux conditions suivantes :
(1) l’appareil ne doit pas produire de brouillage, et
(2) l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en
compromettre le fonctionnement.
8.3.3 Labeling Requirements
The host device shall be properly labeled to identify the modules within the host device. The Industry Canada
certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host
device must be labeled to display the Industry Canada certification number of the module, preceded by the words
“Contains transmitter module”, or the word “Contains”, or similar wording expressing the same meaning, as follows:
Contains transmitter module IC: 8365A-LKT00
8.4 ETSI (EU)
8.4.1 RF Output Power Settings
For the LKT00 module using the onboard chip antenna, the approved power level settings are 10 (max power for all
channels).
8.4.2 ETSI Approval
Provided that the above TX Power settings are used, the LKT00 module is compliant with the following EU standards:
ETSI EN 300 328 (v1.9.1), ETSI EN 301 489 1 (v1.9.2) and ETSI EN 301 489 17 (v2.2.1)
Rev 0.2 DRAFT
Page 6 of 7
LKT00 Module Datasheet DRAFT
9 Ordering Information
SKU
NCAT00LKT00082G4MNG
Rev 0.2 DRAFT
Description
Page 7 of 7
LKT00 Module Datasheet DRAFT

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PDF Version                     : 1.4
Title                           : Microsoft Word - MMB Networks LKT00 Datasheet MB 4-26-16.docx
Producer                        : Mac OS X 10.11.4 Quartz PDFContext
Creator                         : Word
Create Date                     : 2016:04:27 03:49:46Z
Modify Date                     : 2016:04:27 03:49:46Z

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