MXCHIP Information Technology EMW3080 Embedded WiFi module User Manual DS0069EN EMW3080 AB V1 1

Shanghai MXCHIP Information Technology Co.,Ltd. Embedded WiFi module DS0069EN EMW3080 AB V1 1

Users Manual

F Features  SupARM-CM 256 Wor MaxMbps wi MaxMbps wi  EMEMW30the securfirmwareaccordan EMFeatures crac ensubein savethe devnon data Wi- Dataspport 802.11bM4F,WLAN 6KB RAM/ 2Mrking Voltageximum transmith 20 MHz bximum transmith 40 MHz bMW3080B is s080A has hardrity level of Ce protection. nce with CC EMW3080(A)H Encrypt firmcking Digital signure integrityng tamperingAutomaticae the certificcloud can ivice to pren-secure accesPrevent haa and code -Fi Features Support 802heet Vb/g/n, integrMAC/BasebMB FLASH e: DC 3.0-3.6mission rate ubandwidth. mission rate ubandwidth. standard moddware encrypCloud connecSecurity leveEAL5+ AVA_Hardware Encrmware of clinature is usedy and legalig or replaced ially generate cate issued fridentify the event illegassing. ackers to ob2.11b/g/n，HEMEmbeddVision：1.1 rate and/RF 6V up to 72.2 up to 150 dule；tion. Improvection and el in _VAN5 ryption ients to preved in firmware ity, preventiin OTA. private keyfrom the cloulegality of tal, counterfebtain sensitiHT-40 MW3080(ded encryptioAbstre ent to ing to ud, the eit, ive AM(A)/EMWon security WDate：2017act AP Antenna:  Perip OperApplication Intel Intel Smar indu Intel Module TypeTypeEMW308EMW308EMW308EMW308W3080(BWi-Fi modul7-02-13 Support StatSupport EasyPCBor IPX (pherals： 2xUART 2x I2C 1x SPI 1x SWD 6x PWM Up to 13GPIrating Tempelligent lightinlligent Transprt Home Appstrial automalligent Securie 80(AP) Har80(AE) Hard80(BP) No PCB80(BE) No IPEXB) e Numbtion, Soft APyLink，Alin(Optional) IOs rature：-20℃ng portation plication ation ty Illustrationrdware Encryptdware EncryptioHardware E Hardware EX ber: DS0069P, Station+Sok，Joinlink℃ to +85℃n ion, PCB on, IPEX ncryption, ncryption, 9CN ft
H Hardware BlEMWUART x 2I2Cx 2GPIO x 11SWD2MB FlashPWM x 5VBAT_MEASCopyrigMxmeans, wlock W3080(A) Wi-Fi MSO3In256KB SRAM Power Ma133MHz Cor512KB ROMSPIEMWght Notice xchip copyrigwithout the prModule Block DiOC2.4GHz Radio3.3V nputanagement802.11b/g/n MACrtex-M4F MCU3080(A) ghts this specrior written coagramU.F.L connectorOn-boardPCB Ant40MHzOSCEncryption Chipcification. Noonsent of Mxo part of thixchip. s specificatioEWM3080(on may be re(B)eproduced inn any form oor
MXCHIP All Rights Reserved无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色“x”，则可能需要删除该图像，然后重新将其插入。Datasheet [Page 1] EMW3080 Vision Illustration Date Vision Details 2017-01-16 1.0 Initial document 2017-02-13 1.1 Update label, package, RF reference, encryption. Add BOOT/EASYLINK description
MXCHIP All Rights Reserved无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色“x”，则可能需要删除该图像，然后重新将其插入。Datasheet [Page 2] EMW3080 Content Abstract ................................................................................................................................................................................. 1 Vision Illustration ................................................................................................................................................................. 1 1. Product Introduction ..................................................................................................................................................... 4 1.1 EMW3080 LABEL INFORMATION ..................................................................................................................... 5 1.2 PIN ARRANGEMENT .......................................................................................................................................... 6 1.3 PIN DEFINITION ................................................................................................................................................ 8 1.3.1 EMW3080 Package Definition ............................................................................................................ 8 1.3.2 EMW3080 Pin Definition.................................................................................................................... 8 2. Electrical Parameters .................................................................................................................................................. 10 2.1 OPERATING CONDITIONS ................................................................................................................................ 10 2.2 POWER PARAMETERS ...................................................................................................................................... 10 2.3 WORKING ENVIRONMENT ............................................................................................................................... 11 2.4 ELECTROSTATIC DISCHARGE .......................................................................................................................... 11 3. RF parameters ............................................................................................................................................................. 12 3.1 BASIC RF PARAMETERS .................................................................................................................................. 12 3.2 TX PERFORMANCE ......................................................................................................... 错误！未定义书签。 3.2.1 Transmit performance of IEEE802.11b mode ................................................... 错误！未定义书签。 3.2.2 Transmit performance of IEEE802.11g mode ................................................... 错误！未定义书签。 3.2.3 Transmit performance of IEEE802.11n-HT20 mode......................................... 错误！未定义书签。 3.3 RX RECEIVE SENSITIVITY .............................................................................................................................. 12 3.3.1 IEEE802.11b Mode ........................................................................................................................... 12 3.3.2 IEEE802.11g Mode ........................................................................................................................... 13 3.3.3 IEEE802.11n-HT Mode ..................................................................................................................... 13 4. Antenna Information ................................................................................................................................................... 15 4.1 ANTENNA TYPE .............................................................................................................................................. 15 4.2 PCB ANTENNA CLEARANCE ZONE ................................................................................................................. 15 4.3 EXTERNAL ANTENNA CONNECTOR ................................................................................................................. 17 5. Assembly Information and Production Guidance ....................................................................................................... 18 5.1 ASSEMBLY SIZE .............................................................................................................................................. 18 5.2 PRODUCTION GUIDANCE（IMPORTANT） ...................................................................................................... 19 5.3 CONSIDERATIONS ............................................................................................................................................ 20 5.4 STORAGE CONDITION ..................................................................................................................................... 21 5.5 TEMPERATURE CURVE OF SECONDARY REFLOW ............................................................................................. 22 6. Reference Circuit ........................................................................................................................................................ 23 7. Module MOQ and Package Information ..................................................................................................................... 25 8. Sales Information and Technical Support ................................................................................................................... 26 Figure Content Figure 1 EMW3080 Label Information ............................................................................................................... 6
MXCHIP All Rights Reserved无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色“x”，则可能需要删除该图像，然后重新将其插入。Datasheet [Page 3] EMW3080 Figure 2 DIP Package Size ............................................................................................................................... 7Figure 3 LGA Package Size .............................................................................................................................. 7Figure 4EMW3080 Package Definition .............................................................................................................. 8Figure 5Minimum Clearance Zone of PCB Antenna (Unit: mm) ..................................................................... 16Figure 6 Size of External Antenna Connector ................................................................................................... 17Figure 7 EMW3080Side View (Unit: mm) ........................................................................................................ 18Figure 8 Humidity Card ..................................................................................................................................... 19Figure 9 Storage Condition ................................................................................................................................ 21Figure 10 Temperature Curve of Secondary Reflow ......................................................................................... 22Figure 11 Power Source Circuit ......................................................................................................................... 23Figure 12USB to UART .................................................................................................................................... 23Figure 13External Interface Circuit of EMW3080 ............................................................................................ 24Figure 14 3.3V UART- 5V UART Convert Circuit ........................................................................................... 24Table Content Table 1 EMW3080 Pin Definition ....................................................................................................................... 8Table 2 Range of input voltage .......................................................................................................................... 10Table 3Absolute maximum voltage rating ......................................................................................................... 10Table 4EMW3080 2.2Power Parameters ..................................................................................................... 10Table 5Temperature and humidity condition ...................................................................................................... 11Table 6 Electrostatic Discharge Parameters ........................................................................................................ 11Table 7Radio-frequency standards ..................................................................................................................... 12Table 8CCK_11 transmit performance parameters of IEEE802.11b mode ....................... 错误！未定义书签。Table 9OFDM_54 transmit performance parameters of IEEE802.11g mode .................... 错误！未定义书签。Table 10MCS7 transmit performance parameters of IEEE802.11n-HT20 mode .............. 错误！未定义书签。Table 11 MCS7 Transmit Performance of IEEE802.11n-HT 40MHz mode ..................... 错误！未定义书签。Table 12Receive Sensitivity of IEEE802.11b Mode with Bandwidth 20MHz(dBm) ........................................ 12Table 13 Receive Sensitivity of IEEE802.11g Mode with Bandwidth 20MHz(dBm) ....................................... 13Table 14 Receive Sensitivity of IEEE802.11n-HT20 Mode with Bandwidth 20MHz(dBm) ............................ 13Table 15 Receive Sensitivity of IEEE802.11n-HT40 Mode (dBm) ................................................................... 14
MXCHIP All Rights Reserved无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色“x”，则可能需要删除该图像，然后重新将其插入。Datasheet [Page 4] EMW3080 1. Product Introduction EMW3080 is a cost-effective embedded Wi-Fi module released by MXCHIP with high integrating ARM CM4F, WLAN MAC/Baseband/RF. Maximum frequency 133MHz with 256KB SRAM and 2M FLASH. Power supply is DC 3.3V. Installation modes are LGA SMT and Pin Connection. Peripheral: 2xUART / 1x SPI /2x I2C / 6x PWM / Up to 13 GPIOs. EMW3080 operates MiCO 3.0 IoT operating system, supporting Micoder 1.0 development system. Provide fast, stable and secure end-to-end cloud links to users with integrate TCP/IP protocol stack, various security encryption algorithm, intelligent cloud such as MXCHIP easylink/Alink 1.1/Joinlink 3.0/Hilink/One Net/Gome/Suning, oversea cloud such as AWS/Ayla/Azure/IBM Watson/Google/Apple Homekit. EMW3080 (A): Provide securityencryption chip to the integrity and legality and cloud communication safety of client firmware. EMW3080 (B): Abundant peripherals and memory to supply most application and multi-cloud requirement. Hardware diagram is shown below with four main parts:  CM4F main core  WLAN MAC/BB/RF/ANT  Hardware encryption  Power management With: 1. ARM CM4FCPU with 133MHz maximum frequency and 256KB SRAM and 2M FLASH. Support high speed UART, I2C, SPI, PWM and multi-GPIO. 2. 2MB SPI Flash is used for custom firmware development 3. Support PCB antenna and IPEX 4. Input voltage:DC 3.3V EMW3080(A) Wi-Fi Module Block DiagramSOC2.4GHz RadioU.F.L connectorOn-boardPCB Ant3.3V Input40MHzOSC256KB SRAM UART x 2I2Cx 2GPIO x 11Power Management802.11b/g/n MAC133MHz Cortex-M4F MCU512KB ROMSWD2MB Flash SPIPWM x 5 Encryption ChipVBAT_MEAS EMW3080 Hardware block
MXCHIP All Rights Reserved无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色“x”，则可能需要删除该图像，然后重新将其插入。Datasheet [Page 5] EMW3080 1.1 EMW3080 Label Information EMW3080(A) EMW3080(B) Encryption security chip Inside External support CPU ARM CM4F CPU Maximum Speed 133MHz 133MHz SRAM 256KB 256KB Flash（QSPI 100MHz） 2MB（Support XIP CACHE running and decrypting） UART (Maximum 6Mbps) 2 2 I2C (400KHz) 2 2 SPI (31.25MHz) None 1 PWM (Maximum 4MHz) 5 6 SWD debug port 1 1 Debug port 1 1 GPIO(Output current 4mA) 11 13
MXCHIP All Rights Reserved无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色“x”，则可能需要删除该图像，然后重新将其插入。Datasheet [Page 6] EMW3080 Figure1EMW3080 Label Information Label Information: CMIIT ID:XXXXXXXX : SRRC approval number FCC ID:XXX-XXXXXXX :FCC certification information CE: CE authenticationlog EMW3080: Module type 047863100000：MAC address(Each module has a unique MAC address) F3080AP /F3080AE: Sub model type of module A, PCB antenna or IPEX F3080BP /F3080BE: Sub model type of module B, PCB antenna or IPEX X1701：production batch XXXX.XXXX.XXXX : SN series number 1.2 Pin Arrangement EMW3080 has LGA package and DIP package, DIP package (as shown in figure 2) could effectively reduce the quality risk of second patch；LGA package (as shown in figure 3) is easy to debug, provide multi-choice for customers. Solder mask openness has the same size with land. The width of steel mesh is suggested to be 0.12mm to 0.14mm in SMT.
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MXCHIP All Rights Reserved无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色“x”，则可能需要删除该图像，然后重新将其插入。Datasheet [Page 8] EMW3080 1.3 Pin Definition 1.3.1 EMW3080Package Definition Figure4EMW3080 Package Definition 1.3.2 EMW3080 Pin Definition Table1EMW3080 Pin Definition Pin number FUNCTION1 FUNCTION2 FUNCTION3 FUNCTION4 FUNCTION5 FUNCTION61, 3 MICO_GPIO_1 MICO_PWM1 SWCLK 2, 4 MICO_GPIO_2 MICO_PWM2 SWDIO 5 NC 6 VBAT MEAS 7 MICO_GPIO_7 MICO_I2C0_SCL MICO_UART0_RTS MICO_PWM6 MICO_SPI1_MISO8 MICO_GPIO_8 MICO_I2C0_SDA MICO_UART0_CTS MICO_SPI1_CS 9 MICO_GPIO_9 MICO_I2C1_SDA MICO_UART0_TXD MICO_PWM1 MICO_SPI1_MOSI10 MICO_GPIO_10 MICO_I2C1_CLK MICO_UART0_RXD MICO_SPI1_CLK 11 CHIP_EN 12 MICO_GPIO_12 MICO_PWM313 MICO_GPIO_13 MICO_PWM4
MXCHIP All Rights Reserved无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色“x”，则可能需要删除该图像，然后重新将其插入。Datasheet [Page 9] EMW3080 14 MICO_GPIO_14 MICO_PWM515 NC 16 VDD 17 GND 18 NC 19 MICO_GPIO_19 20 NC 21, 24 MICO_GPIO_21 MICO_I2C0_SDA MICO_UART1_TXD MICO_PWM422, 25 MICO_GPIO_22 MICO_I2C0_SCL MICO_UART1_RXD MICO_PWM523 MICO_GPIO_23 Illustration：words in black color is the common pins in both A and B, words in blue color is unique pins of B module. Compare to A module, EMW3080(B) has four pins: PIN 7,8,9,10 with function: traffic control of UART, SPI function,PWM output and GPIO. PIN 19 is used as BOOT，PIN23 is used as EASYLINK, please do not use pin 19 and 23 in hardware 硬件design. Please contact engineer of MXCHIP if it is necessary to use the two pins. PIN21/24should be in high voltage or NC when power on,please aware it when designing circuit. CHIP_EN could not be set NC, the other pins should not be set NC.
MXCHIP All Rights Reserved无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色“x”，则可能需要删除该图像，然后重新将其插入。Datasheet [Page 10] EMW3080 2. Electrical Parameters 2.1 Operating Conditions EMW3080would be unstable when input voltage is less than the lowest rated voltage. Table2Range of input voltage Symbol Illustration Condition Details Minimum Typ Maximum Unit VDD Power Supply 3.0 3.3 3.6 V There would be permanent damage in hardware if the device operates at the voltage over rated value. Meanwhile, reliability could be influenced when the device has a long-term operating at maximum voltage. Table3Absolute maximum voltage rating Symbol Description Minimum Typ Unit VDD Module input voltage –0.3 3.6 V VIN GPIO input voltage −0.3 3.6 V 2.2 Power Parameters Table4EMW3080 2.2 Power Parameters Status Current（3V3） Description WIFIInitialization 26.91mA Enable WIFI, low power consumption Connect WIFI 47.71mA Enable WIFI,low power consumption UDPtransmission 168.37mA Disable WIF, low power consumption SoftAP 121.48mA SoftAPconnect to internet Easylink 122.84mA Process of module network distribution Standby 10.45uA Ultra low standby power mode Actual working current is variable at different operating mode. Maximum operating current 300 mA 。
MXCHIP All Rights Reserved无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色“x”，则可能需要删除该图像，然后重新将其插入。Datasheet [Page 11] EMW3080 2.3 Working Environment Table5Temperature and humidity condition Symbol Name Maximum Unit TSTG Storage Temperature -55 to +125 ℃ TA Operation Temperature -20 to +85 ℃ Humidity Non-condensing, Relative humidity 95 % 2.4 Electrostatic Discharge Table6Electrostatic Discharge Parameters Symbol Name Details Level Maximum Unit VESD(HBM) Electrostatic discharge voltage (Human module) TA= +25 °C , JESD22-A114 2 2000 V VESD(CDM) Electrostatic discharge voltage (Discharge device module) TA = +25 °C , JESD22-C101 II 500
MXCHIP All Rights Reserved无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色“x”，则可能需要删除该图像，然后重新将其插入。Datasheet [Page 12] EMW3080 3. RF parameters 3.1 Basic RF parameters Table7Radio-frequency standards Name Illustration Working frequency 2.412~2.484GHz Wi-Fi wireless standard IEEE802.11b/g/n20/n40 Maximum output power 18dBm Data transmission rate 20MHz 11b：1,2,5.5,11Mbps 11g:6,9,12,18,24,36,48,54Mbps 11n: MCS0~7,72.2Mbps 40MHz 11n：MCS0~7,150Mbps Antenna type PCB(Default) IPX (Optional) 3.2 RX Receive Sensitivity 3.2.1 IEEE802.11b Mode Table8Receive Sensitivity of IEEE802.11b Mode with Bandwidth 20MHz(dBm) Rate Channel 11M 1M IEEE spec -76dBm -83dBm 1 -90dBm -100dBm 2 -90dBm -100dBm 3 -90dBm -100dBm 4 -90dBm -100dBm 5 -90dBm -100dBm 6 -90dBm -100dBm 7 -90dBm -100dBm 8 -90dBm -100dBm 9 -90dBm -100dBm 10 -90dBm -100dBm 11 -90dBm -100dBm 12 -90dBm -100dBm
MXCHIP All Rights Reserved无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色“x”，则可能需要删除该图像，然后重新将其插入。Datasheet [Page 13] EMW3080 Rate Channel 11M 1M 13 -90dBm -100dBm 3.2.2 IEEE802.11g Mode Table9Receive Sensitivity of IEEE802.11g Mode with Bandwidth 20MHz(dBm) Rate Channel 54M 6M IEEE spec -65dBm -82dBm 1 -76dBm -92dBm 2 -76dBm -92dBm 3 -76dBm -92dBm 4 -76dBm -92dBm 5 -76dBm -92dBm 6 -76dBm -92dBm 7 -76dBm -92dBm 8 -76dBm -92dBm 9 -76dBm -92dBm 10 -76dBm -92dBm 11 -76dBm -92dBm 12 -76dBm -92dBm 13 -76dBm -92dBm 3.2.3 IEEE802.11n-HT Mode Table10Receive Sensitivity of IEEE802.11n-HT20 Mode with Bandwidth 20MHz(dBm) Channel Rate MCS7 MCS0 IEEE spec -64dBm -82dBm 1 -73dBm -92dBm 2 -73dBm -92dBm 3 -73dBm -92dBm 4 -73dBm -92dBm 5 -73dBm -92dBm 6 -73dBm -92dBm 7 -73dBm -92dBm
MXCHIP All Rights Reserved无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色“x”，则可能需要删除该图像，然后重新将其插入。Datasheet [Page 14] EMW3080 Channel Rate MCS7 MCS0 8 -73dBm -92dBm 9 -73dBm -92dBm 10 -73dBm -92dBm 11 -73dBm -92dBm 12 -73dBm -92dBm 13 -73dBm -92dBm Table11Receive Sensitivity of IEEE802.11n-HT40 Mode(dBm) Rate Channel MCS7 MCS0 IEEE spec -64dBm -82dBm 3 -69dBm -89dBm 4 -69dBm -89dBm 5 -69dBm -89dBm 6 -69dBm -89dBm 7 -69dBm -89dBm 8 -69dBm -89dBm 9 -69dBm -89dBm 10 -69dBm -89dBm 11 -69dBm -89dBm
MXCHIP All Rights Reserved无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色“x”，则可能需要删除该图像，然后重新将其插入。Datasheet [Page 15] EMW3080 4. Antenna Information 4.1 Antenna Type EMW3080has two type of antenna: EMW3080(AP/BP) and EMW3080(AE/BE) EWM3080（AP） EMW3080(BP) EMW3080(AE) EMW3080(BE) 4.2 PCB Antenna Clearance Zone Main PCB should have a distance over 16mm with other metal elements when using PCB antenna in Wi-Fi device. Shadow parts in the figure below should keep away from metal elements, sensor, interference source and other material that could cause signal interference.
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MXCHIP All Rights Reserved无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色“x”，则可能需要删除该图像，然后重新将其插入。Datasheet [Page 18] EMW3080 5. Assembly Information and Production Guidance 5.1 Assembly Size Top View Left Side View Side View Figure7EMW3080Side View (Unit: mm)
MXCHIP All Rights Reserved无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色“x”，则可能需要删除该图像，然后重新将其插入。Datasheet [Page 19] EMW3080 5.2 Production Guidance（Important）  The stamp hole package module produced by Mxchip must completely being patched by SMT machine in 24 hours after open firmware package. Otherwise the module should be re-package by vacuum pumping and drying before patch.  Devices for SMT patch: （1）Reflow soldering machine （2）AOI detector （3）Suction nozzle with 6-8mm caliber  Device for drying: （1）Cabinet type oven （2）Anti-static and high thermotolerant tray （3）Anti-static and high thermotolerant gloves  Conditions of product storage (Storage environment is shown in figure 8):  Moisture bag must be stored in temperature below 30 and humidity less than 85%RH.  Dry packaging products, the guarantee period should be from 6 months date of packing seal.  Humidity indicator card is in the hermetic package. Figure8Humidity Card  Humidity indicator card and drying situation:  2 hours drying for module if the color ring at 30%, 40%, 50% in humidity indicator card is blue after unpacking;  4 hours drying for module if the color ring at 30% in humidity indicator card is pink after unpacking;  6 hours drying for module if the color ring at 30%, 40% in humidity indicator card is pink after unpacking;  12 hours drying for module if the color ring at 30%, 40%, 50% in humidity indicator card is pink
MXCHIP All Rights Reserved无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色“x”，则可能需要删除该图像，然后重新将其插入。Datasheet [Page 20] EMW3080 after unpacking.  Drying parameters:  Drying temperature: 125℃±5℃；  Alarm temperature:130℃；  SMT patch when the device cool down below 36℃ in natural condition;  Dry times: 1;  Please dry again if the module is unsoldering in 12 hours after last drying.  SMT is unsuitable if the module packed over 3 months. There would be serious oxidation of the pad because of immersion gold and cause false welding and lack of weld. Mxchip does not assume the corresponding responsibility;  ESD protection is required before SMT;  SMT patch should on the basis of reflow profile diagram, maximum temperature 245℃, reflow profile diagram is shown in figure 10;  In order to guarantee the reflow soldering qualification rate, vision and AOI detection should be done in 10% products for the first patch to make sure the rationality of temperature control, device adsorption mode and position. Detect 5 to 10 sample every hour in the following batch production. 5.3 Considerations  Operator should wear anti-static gloves during producing;  No more than drying time;  Any explosive, flammable and corrosivematerial is not allowed to add in drying;  Module should be put into oven with high thermotolerant tray. Ventilation should exist between each module and no direct contact with oven;  Make sure oven is closed when drying to prevent temperature leaking;  Reduce opening time or keep closing the door of the oven during drying;  Use anti-static glove to take out module when its temperature below 36℃by natural cool down after drying;  Make sure no water and dirt in the bottom of the module;  Temperature and humidity control is level 3 for initial modules. Storage and drying conditions are based on IPC/JEDEC J-STD-020.
MXCHIP All Rights Reserved无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色“x”，则可能需要删除该图像，然后重新将其插入。Datasheet [Page 21] EMW3080 5.4 Storage Condition Figure9Storage Condition
无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色“x”，则可能需要删除该图 5.5 TemSuggestreflow. 像，然后重新将其插入。mperature ted solder pasCurve ofste type: SACFiguDf SecondaC305, unleadure10TemperMXCHIP All Rights ReservedDatasheetEMW3080ary Reflowded, solder parature Curve w aste thicknessof Secondary s from 0.12 ty Reflow to 0.15, less [Page 22than 2 times ]
MXCHIP All Rights Reserved无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色“x”，则可能需要删除该图像，然后重新将其插入。Datasheet [Page 23] EMW3080 6. Reference Circuit Power source circuit is shown in figure 11, USB to UART is shown in figure 12, external interface circuit is shown in figure 13. Figure11Power Source Circuit Figure12USB to UART
MXCHIP All Rights Reserved无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色“x”，则可能需要删除该图像，然后重新将其插入。Datasheet [Page 24] EMW3080 Figure13External Interface Circuit of EMW3080 Voltage of EMW3239 UART is 3.3V. 5V UART should convert to 3.3V UART for the users that have 5V chips. Convert circuit is shown in figure 14. Figure143.3V UART- 5V UARTConvert Circuit
MXCHIP All Rights Reserved无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色“x”，则可能需要删除该图像，然后重新将其插入。Datasheet [Page 25] EMW3080 7. ModuleMOQ and Package Information Table 16 ModuleMOQ and Package Information Type MOQ(pcs) Shipping packing method（Tray/Tape） Module storage quantity for each tray (pcs)Tray number for each box Module quantity for each box (pcs)EMW3080(AP) EMW3080(AE) EMW3080(BP) EMW3080(BE) 1050（2 boxes） Tray 35 15+1 525
MXCHIP All Rights Reserved无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色“x”，则可能需要删除该图像，然后重新将其插入。Datasheet [Page 26] EMW3080 8. FCC Caution § 15.19 Labeling requirements. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. § 15.21 Information to user. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. § 15.105 Information to the user. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna. -Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated withminimum distance 20cm between the radiator & your body. This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC compliance requirement of the end product which integrates this module. The final end product must be labeled in a visible area with the following " Contains TX FCC ID: P53-EMW3080".
MXCHIP All Rights Reserved无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色“x”，则可能需要删除该图像，然后重新将其插入。Datasheet [Page 27] EMW3080 9. CE Caution Complies with the essential protection requirements of Directives on Radio Equipment Directive 2014/53/EU. This declaration applies to all specimens manufactured identical to the samples submitted for testing/evaluation. The assessments were based on the following regulations and standards: Requirement Standard Report No. Assessment Body Health and safety EN 60950-1:2006+A11:2009+A1:2010+A12:2011+A2:2013 EN 62311:2008; SET2017-04238 SET2017-04738 Telefication B.V EMC Draft EN 301 489-1 V2.2.0 Draft EN 301 489-17 V3.2.0 SET2017-03082 Telefication B.V Radio Spectrum EN 300 328 V2.1.1 SET2017-03256 Telefication B.V This declaration is the responsibility of the manufacturer:
MXCHIP All Rights Reserved无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色“x”，则可能需要删除该图像，然后重新将其插入。Datasheet [Page 28] EMW3080 10. Sales Information and Technical Support Company: Shanghai MXCHIP Information Technology Co., Ltd For consultation or purchase the product, please contact Mxchip during working hours: From Monday to Friday, morning 9:00~12:00, afternoon 13:00~18:00 Telephone: +86-21-52655026 Contact address: 9thFloor, No.5, Lane2145 JinshaJiang Road Putuo District, ShangHai. Postcode：200333 Email: sales@mxchip.com

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