MXCHIP Information Technology EMW3080 Embedded WiFi module User Manual DS0069EN EMW3080 AB V1 1
Shanghai MXCHIP Information Technology Co.,Ltd. Embedded WiFi module DS0069EN EMW3080 AB V1 1
Users Manual
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| Date Submitted | 2017-04-21 00:00:00 |
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EM MW3080((A)/EMW W3080(B B) Datasheet Embedd ded encryptioon security Wi-Fi module Vision：1.1 Date：2017 7-02-13 Numb ber: DS0069 9CN Abstract Support Stattion, Soft AP P, Station+Soft AP Features Suppport 802.11bb/g/n, integrrate ARM-CM M4F,WLAN MAC/Baseband/RF 2566KB RAM/ 2M MB FLASH Worrking Voltagee: DC 3.0-3.66V Antenna: PCBor IPX ((Optional) Maxximum transm mission rate up u to 72.2 Mbps wiith 20 MHz bandwidth. Maxximum transm mission rate up u to 150 Mbps wiith 40 MHz bandwidth. EM MW3080B is standard moddule； EMW30080A has harddware encryption. Improvee the securrity level of Cloud connecction and firmwaree protection. Security leveel in accordannce with CC EAL5+ AVA__VAN5 EM MW3080(A)H Hardware Encrryption Features Encrypt firm mware of cliients to preveent craccking Digital signnature is usedd in firmware to ensuure integrityy and legaliity, preventiing beinng tamperingg or replaced in i OTA. Automaticaally generate private key to fr the clouud, savee the certificcate issued from the cloud can identify the legality of the devvice to preevent illegaal, counterfeeit, nonn-secure accesssing. Support EasyyLink，Alink，Joinlink Perippherals： 2xUART 2x I2C 1x SPI 1x SWD 6x PWM Up to 13GPIIOs Operrating Temperature：-20℃ ℃ to +85℃ Application Intellligent lightinng Intellligent Transpportation Smarrt Home Appplication industrial automaation Intellligent Security Module Type Typee Illustration EMW30880(AP) Harrdware Encryption, PCB EMW30880(AE) Harddware Encryptio on, IPEX Prevent haackers to obbtain sensitiive dataa and code EMW30880(BP) No Hardware PCB Encryption, Wi--Fi Features EMW30880(BE) No Hardware IPEX Encryption, Support 8022.11b/g/n，H HT-40 Hardware Bllock EMW W3080(A) Wi-Fi Module Block Diagram SO OC UART x 2 133MHz Corrtex -M4F MCU I Cx2 PWM x 5 256KB SRAM 802.11b/g/n MAC 512KB ROM 2.4GHz Radio 40MHz OSC Encryption Chip VBAT_MEAS On-board PCB Ant SWD GPIO x 11 2MB Flash U.F.L connector SPI Power Ma anagement 3.3V In nput EMW3080(A) EWM3080((B) Copyrigght Notice Mxxchip copyrigghts this speccification. Noo part of this specificatioon may be reeproduced in n any form or means, without the prrior written coonsent of Mxxchip. Datasheet [Page 1] 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 Vision Illustration Date Vision 2017-01-16 1.0 2017-02-13 1.1 Details Initial document Update label, package, RF reference, encryption. Add BOOT/EASYLINK description MXCHIP All Rights Reserved EMW3080 Datasheet 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 [Page 2] Content Abstract ................................................................................................................................................................................. 1 Vision Illustration ................................................................................................................................................................. 1 1. Product Introduction ..................................................................................................................................................... 4 1.1 EMW3080 LABEL INFORMATION ..................................................................................................................... 5 1.2 PIN ARRANGEMENT .......................................................................................................................................... 6 1.3 PIN DEFINITION ................................................................................................................................................ 8 1.3.1 1.3.2 2. 3. Electrical Parameters .................................................................................................................................................. 10 2.1 OPERATING CONDITIONS ................................................................................................................................ 10 2.2 POWER PARAMETERS ...................................................................................................................................... 10 2.3 WORKING ENVIRONMENT............................................................................................................................... 11 2.4 ELECTROSTATIC DISCHARGE .......................................................................................................................... 11 RF parameters ............................................................................................................................................................. 12 3.1 BASIC RF PARAMETERS .................................................................................................................................. 12 3.2 TX PERFORMANCE ......................................................................................................... 错误！未定义书签。 3.3 3.2.1 Transmit performance of IEEE802.11b mode ................................................... 错误！未定义书签。 3.2.2 Transmit performance of IEEE802.11g mode ................................................... 错误！未定义书签。 3.2.3 Transmit performance of IEEE802.11n-HT20 mode......................................... 错误！未定义书签。 RX RECEIVE SENSITIVITY .............................................................................................................................. 12 MXCHIP All Rights Reserved 3.3.1 3.3.2 3.3.3 4. 5. EMW3080 Package Definition............................................................................................................ 8 EMW3080 Pin Definition.................................................................................................................... 8 IEEE802.11b Mode........................................................................................................................... 12 IEEE802.11g Mode ........................................................................................................................... 13 IEEE802.11n-HT Mode..................................................................................................................... 13 Antenna Information ................................................................................................................................................... 15 4.1 ANTENNA TYPE .............................................................................................................................................. 15 4.2 PCB ANTENNA CLEARANCE ZONE ................................................................................................................. 15 4.3 EXTERNAL ANTENNA CONNECTOR ................................................................................................................. 17 Assembly Information and Production Guidance ....................................................................................................... 18 5.1 ASSEMBLY SIZE .............................................................................................................................................. 18 5.2 PRODUCTION GUIDANCE（IMPORTANT） ...................................................................................................... 19 5.3 CONSIDERATIONS............................................................................................................................................ 20 5.4 STORAGE CONDITION ..................................................................................................................................... 21 5.5 TEMPERATURE CURVE OF SECONDARY REFLOW............................................................................................. 22 6. Reference Circuit ........................................................................................................................................................ 23 7. Module MOQ and Package Information ..................................................................................................................... 25 8. Sales Information and Technical Support ................................................................................................................... 26 Figure Content Figure 1 EMW3080 Label Information ............................................................................................................... 6 EMW3080 Datasheet [Page 3] Figure 2 DIP Package Size ............................................................................................................................... 7 Figure 3 LGA Package Size .............................................................................................................................. 7 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 Figure 4EMW3080 Package Definition .............................................................................................................. 8 Figure 5Minimum Clearance Zone of PCB Antenna (Unit: mm) ..................................................................... 16 Figure 6 Size of External Antenna Connector ................................................................................................... 17 Figure 7 EMW3080Side View (Unit: mm) ........................................................................................................ 18 Figure 8 Humidity Card ..................................................................................................................................... 19 Figure 9 Storage Condition ................................................................................................................................ 21 Figure 10 Temperature Curve of Secondary Reflow ......................................................................................... 22 Figure 11 Power Source Circuit ......................................................................................................................... 23 Figure 12USB to UART .................................................................................................................................... 23 Figure 13External Interface Circuit of EMW3080 ............................................................................................ 24 Figure 14 3.3V UART- 5V UART Convert Circuit ........................................................................................... 24 Table Content Table 1 EMW3080 Pin Definition ....................................................................................................................... 8 Table 2 Range of input voltage .......................................................................................................................... 10 Table 3Absolute maximum voltage rating ......................................................................................................... 10 MXCHIP All Rights Reserved Table 4EMW3080 2.2 Power Parameters ..................................................................................................... 10 Table 5Temperature and humidity condition ......................................................................................................11 Table 6 Electrostatic Discharge Parameters ........................................................................................................11 Table 7Radio-frequency standards..................................................................................................................... 12 Table 8CCK_11 transmit performance parameters of IEEE802.11b mode ....................... 错误！未定义书签。 Table 9OFDM_54 transmit performance parameters of IEEE802.11g mode .................... 错误！未定义书签。 Table 10MCS7 transmit performance parameters of IEEE802.11n-HT20 mode .............. 错误！未定义书签。 Table 11 MCS7 Transmit Performance of IEEE802.11n-HT 40MHz mode ..................... 错误！未定义书签。 Table 12Receive Sensitivity of IEEE802.11b Mode with Bandwidth 20MHz(dBm)........................................ 12 Table 13 Receive Sensitivity of IEEE802.11g Mode with Bandwidth 20MHz(dBm)....................................... 13 Table 14 Receive Sensitivity of IEEE802.11n-HT20 Mode with Bandwidth 20MHz(dBm) ............................ 13 Table 15 Receive Sensitivity of IEEE802.11n-HT40 Mode (dBm)................................................................... 14 EMW3080 Datasheet [Page 4] 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 1. Product Introduction EMW3080 is a cost-effective embedded Wi-Fi module released by MXCHIP with high integrating ARM CM4F, WLAN MAC/Baseband/RF. Maximum frequency 133MHz with 256KB SRAM and 2M FLASH. Power supply is DC 3.3V. Installation modes are LGA SMT and Pin Connection. Peripheral: 2xUART / 1x SPI /2x I2C / 6x PWM / Up to 13 GPIOs. EMW3080 operates MiCO 3.0 IoT operating system, supporting Micoder 1.0 development system. Provide fast, stable and secure end-to-end cloud links to users with integrate TCP/IP protocol stack, various security encryption algorithm, intelligent cloud such as MXCHIP easylink/Alink 1.1/Joinlink 3.0/Hilink/One Net/Gome/Suning, oversea cloud such as AWS/Ayla/Azure/IBM Watson/Google/Apple Homekit. EMW3080 (A): Provide securityencryption chip to the integrity and legality and cloud communication safety of client firmware. EMW3080 (B): Abundant peripherals and memory to supply most application and multi-cloud requirement. Hardware diagram is shown below with four main parts: CM4F main core WLAN MAC/BB/RF/ANT Hardware encryption Power management MXCHIP All Rights Reserved With: 1. ARM CM4FCPU with 133MHz maximum frequency and 256KB SRAM and 2M FLASH. Support high speed UART, I2C, SPI, PWM and multi-GPIO. 2. 2MB SPI Flash is used for custom firmware development 3. Support PCB antenna and IPEX 4. Input voltage:DC 3.3V EMW3080(A) Wi-Fi Module Block Diagram UART x 2 I2C x 2 SOC 133MHz Cortex-M4F MCU PWM x 5 256KB SRAM 802.11b/g/n MAC 512KB ROM 2.4GHz Radio 40MHz OSC Encryption Chip VBAT_MEAS SWD On-board PCB Ant GPIO x 11 2MB Flash SPI U.F.L connector Power Management 3.3V Input EMW3080 Hardware block EMW3080 Datasheet [Page 5] 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 Encryption security chip EMW3080(A) EMW3080(B) Inside External support ARM CM4F CPU CPU Maximum Speed 133MHz 133MHz SRAM 256KB 256KB Flash（QSPI 2MB（Support XIP CACHE running and decrypting） 100MHz） UART (Maximum 6Mbps) I2C (400KHz) SPI (31.25MHz) None SWD debug port Debug port GPIO(Output current 4mA) 11 13 PWM (Maximum 4MHz) MXCHIP All Rights Reserved 1.1 EMW3080 Label Information EMW3080 Datasheet [Page 6] 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 Figure1EMW3080 Label Information Label Information: CMIIT ID:XXXXXXXX : SRRC approval number FCC ID:XXX-XXXXXXX :FCC certification information CE: CE authenticationlog EMW3080: Module type 047863100000：MAC address(Each module has a unique MAC address) F3080AP /F3080AE: Sub model type of module A, PCB antenna or IPEX F3080BP /F3080BE: Sub model type of module B, PCB antenna or IPEX X1701：production batch XXXX.XXXX.XXXX : SN series number MXCHIP All Rights Reserved 1.2 Pin Arrangement EMW3080 has LGA package and DIP package, DIP package (as shown in figure 2) could effectively reduce the quality risk of second patch；LGA package (as shown in figure 3) is easy to debug, provide multi-choice for customers. Solder mask openness has the same size with land. The width of steel mesh is suggested to be 0.12mm to 0.14mm in SMT. EMW3080 Datasheet 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 Figuure2DIP Pack kage Size MXCHIP All Rights Reserved Figuree3 LGA Pacckage Size EMW3080 [Page 7] Datasheet [Page 8] 1.3 Pin Definition 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 1.3.1 EMW3080Package Definition Figure4EMW3080 Package Definition MXCHIP All Rights Reserved 1.3.2 EMW3080 Pin Definition Table1EMW3080 Pin Definition Pin numb er FUNCTION1 1, 3 MICO_GPIO_1 MICO_PWM1 SWCLK 2, 4 MICO_GPIO_2 MICO_PWM2 SWDIO NC VBAT MEAS MICO_GPIO_7 MICO_I2C0_SCL MICO_UART0_RTS MICO_GPIO_8 MICO_I2C0_SDA MICO_UART0_CTS MICO_GPIO_9 MICO_I2C1_SDA MICO_UART0_TXD 10 MICO_GPIO_10 MICO_I2C1_CLK MICO_UART0_RXD 11 CHIP_EN 12 MICO_GPIO_12 MICO_PWM3 13 MICO_GPIO_13 MICO_PWM4 FUNCTION2 FUNCTION3 EMW3080 FUNCTION4 MICO_PWM6 FUNCTION5 MICO_SPI1_MISO MICO_SPI1_CS MICO_PWM1 MICO_SPI1_MOSI MICO_SPI1_CLK FUNCTION6 Datasheet 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 [Page 9] 14 MICO_GPIO_14 MICO_PWM5 15 NC 16 VDD 17 GND 18 NC 19 MICO_GPIO_19 20 NC 21, 24 MICO_GPIO_21 MICO_I2C0_SDA MICO_UART1_TXD MICO_PWM4 22, 25 MICO_GPIO_22 MICO_I2C0_SCL MICO_UART1_RXD MICO_PWM5 23 MICO_GPIO_23 Illustration：words in black color is the common pins in both A and B, words in blue color is unique pins of B module. Compare to A module, EMW3080(B) has four pins: PIN 7,8,9,10 with function: traffic control of UART, SPI function,PWM output and GPIO. PIN 19 is used as BOOT，PIN23 is used as EASYLINK, please do not use pin 19 and 23 in hardware 硬件 design. Please contact engineer of MXCHIP if it is necessary to use the two pins. MXCHIP All Rights Reserved PIN21/24should be in high voltage or NC when power on,please aware it when designing circuit. CHIP_EN could not be set NC, the other pins should not be set NC. EMW3080 Datasheet [Page 10] 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 2. Electrical Parameters 2.1 Operating Conditions EMW3080would be unstable when input voltage is less than the lowest rated voltage. Table2Range of input voltage Details Symbol Illustration VDD Condition Minimum Typ Maximum Unit 3.0 3.3 3.6 Power Supply There would be permanent damage in hardware if the device operates at the voltage over rated value. Meanwhile, reliability could be influenced when the device has a long-term operating at maximum voltage. Table3Absolute maximum voltage rating Symbol Description Minimum Typ Unit VDD Module input voltage –0.3 3.6 VIN GPIO input voltage −0.3 3.6 MXCHIP All Rights Reserved 2.2 Power Parameters Table4EMW3080 2.2 Power Parameters Status Current（3V3） Description WIFIInitialization 26.91mA Enable WIFI, low power consumption Connect WIFI 47.71mA Enable WIFI,low power consumption UDPtransmission 168.37mA Disable WIF, low power consumption SoftAP 121.48mA SoftAPconnect to internet Easylink 122.84mA Process of module network distribution Standby 10.45uA Ultra low standby power mode Actual working current is variable at different operating mode. Maximum operating current 300 mA 。 EMW3080 Datasheet [Page 11] 2.3 Working Environment 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 Table5Temperature and humidity condition Symbol Name Maximum Unit TSTG Storage Temperature -55 to +125 ℃ TA Operation Temperature -20 to +85 ℃ Humidity Non-condensing, Relative humidity 95 2.4 Electrostatic Discharge Table6Electrostatic Discharge Parameters Symbol Name Details Level Maximum TA= +25 °C , JESD22-A114 2000 Unit Electrostatic discharge VESD(HBM) voltage (Human module) Electrostatic discharge voltage VESD(CDM) TA = +25 °C , JESD22-C101 (Discharge device module) MXCHIP All Rights Reserved EMW3080 II 500 Datasheet [Page 12] 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 3. RF parameters 3.1 Basic RF parameters Table7Radio-frequency standards Name Illustration Working frequency 2.412~2.484GHz Wi-Fi wireless standard IEEE802.11b/g/n20/n40 Maximum output power 18dBm 11b：1,2,5.5,11Mbps 20MHz Data 11g:6,9,12,18,24,36,48,54Mbps 11n: MCS0~7,72.2Mbps transmission rate 40MHz 11n：MCS0~7,150Mbps PCB(Default) Antenna type IPX (Optional) 3.2 RX Receive Sensitivity MXCHIP All Rights Reserved 3.2.1 IEEE802.11b Mode Table8Receive Sensitivity of IEEE802.11b Mode with Bandwidth 20MHz(dBm) Rate Channel 11M 1M IEEE spec -76dBm -83dBm -90dBm -100dBm -90dBm -100dBm -90dBm -100dBm -90dBm -100dBm -90dBm -100dBm -90dBm -100dBm -90dBm -100dBm -90dBm -100dBm -90dBm -100dBm 10 -90dBm -100dBm 11 -90dBm -100dBm 12 -90dBm -100dBm EMW3080 Datasheet Rate Channel 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 13 3.2.2 [Page 13] 11M 1M -90dBm -100dBm IEEE802.11g Mode Table9Receive Sensitivity of IEEE802.11g Mode with Bandwidth 20MHz(dBm) Rate 54M 6M Channel 3.2.3 IEEE spec -65dBm -82dBm -76dBm -92dBm -76dBm -92dBm -76dBm -92dBm -76dBm -92dBm -76dBm -92dBm -76dBm -92dBm -76dBm -92dBm -76dBm -92dBm -76dBm 10 -76dBm -92dBm 11 -76dBm -92dBm 12 -76dBm -92dBm 13 -76dBm -92dBm MXCHIP All Rights Reserved -92dBm IEEE802.11n-HT Mode Table10Receive Sensitivity of IEEE802.11n-HT20 Mode with Bandwidth 20MHz(dBm) Channel Rate MCS7 MCS0 IEEE spec -64dBm -82dBm -73dBm -92dBm -73dBm -92dBm -73dBm -92dBm -73dBm -92dBm -73dBm -92dBm -73dBm -92dBm -73dBm -92dBm EMW3080 Datasheet [Page 14] 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 Channel Rate MCS7 MCS0 -73dBm -92dBm -73dBm -92dBm 10 -73dBm -92dBm 11 -73dBm -92dBm 12 -73dBm -92dBm 13 -73dBm -92dBm Table11Receive Sensitivity of IEEE802.11n-HT40 Mode(dBm) Rate MCS7 MCS0 IEEE spec -64dBm -82dBm -69dBm -89dBm -69dBm -89dBm -69dBm -89dBm -69dBm -89dBm -69dBm -89dBm -69dBm -89dBm -69dBm -89dBm 10 -69dBm -89dBm 11 -69dBm -89dBm Channel MXCHIP All Rights Reserved EMW3080 Datasheet [Page 15] 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 4. Antenna Information 4.1 Antenna Type EMW3080has two type of antenna: EMW3080(AP/BP) and EMW3080(AE/BE) EWM3080（AP） EMW3080(BP) EMW3080(AE) EMW3080(BE) MXCHIP All Rights Reserved 4.2 PCB Antenna Clearance Zone Main PCB should have a distance over 16mm with other metal elements when using PCB antenna in Wi-Fi device. Shadow parts in the figure below should keep away from metal elements, sensor, interference source and other material that could cause signal interference. EMW3080 Datasheet 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 MXCHIP All Rights Reserved Figure5Minimum Clearance Zone of PCB Antenna (Unit: mm) EMW3080 [Page 16] Datasheet 4.3 External Antenna Connector 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 MXCHIP All Rights Reserved Figure6Size of External Antenna Connector EMW3080 [Page 17] Datasheet 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 5. Assembly Information and Production Guidance 5.1 Assembly Size Top View MXCHIP All Rights Reserved Left Side View Side View Figure7EMW3080Side View (Unit: mm) EMW3080 [Page 18] Datasheet [Page 19] 5.2 Production Guidance（Important） 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 The stamp hole package module produced by Mxchip must completely being patched by SMT machine in 24 hours after open firmware package. Otherwise the module should be re-package by vacuum pumping and drying before patch. Devices for SMT patch: （1）Reflow soldering machine （2）AOI detector （3）Suction nozzle with 6-8mm caliber Device for drying: （1）Cabinet type oven （2）Anti-static and high thermotolerant tray （3）Anti-static and high thermotolerant gloves Conditions of product storage (Storage environment is shown in figure 8): Moisture bag must be stored in temperature below 30 and humidity less than 85%RH. Dry packaging products, the guarantee period should be from 6 months date of packing seal. Humidity indicator card is in the hermetic package. MXCHIP All Rights Reserved Figure8Humidity Card Humidity indicator card and drying situation: 2 hours drying for module if the color ring at 30%, 40%, 50% in humidity indicator card is blue after unpacking; 4 hours drying for module if the color ring at 30% in humidity indicator card is pink after unpacking; 6 hours drying for module if the color ring at 30%, 40% in humidity indicator card is pink after unpacking; 12 hours drying for module if the color ring at 30%, 40%, 50% in humidity indicator card is pink EMW3080 Datasheet [Page 20] after unpacking. 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 Drying parameters: Drying temperature: 125℃±5℃； Alarm temperature:130℃； SMT patch when the device cool down below 36℃ in natural condition; Dry times: 1; Please dry again if the module is unsoldering in 12 hours after last drying. SMT is unsuitable if the module packed over 3 months. There would be serious oxidation of the pad because of immersion gold and cause false welding and lack of weld. Mxchip does not assume the corresponding responsibility; ESD protection is required before SMT; SMT patch should on the basis of reflow profile diagram, maximum temperature 245℃, reflow profile diagram is shown in figure 10; In order to guarantee the reflow soldering qualification rate, vision and AOI detection should be done in 10% products for the first patch to make sure the rationality of temperature control, device adsorption mode and position. Detect 5 to 10 sample every hour in the following batch production. 5.3 Considerations MXCHIP All Rights Reserved Operator should wear anti-static gloves during producing; No more than drying time; Any explosive, flammable and corrosivematerial is not allowed to add in drying; Module should be put into oven with high thermotolerant tray. Ventilation should exist between each module and no direct contact with oven; Make sure oven is closed when drying to prevent temperature leaking; Reduce opening time or keep closing the door of the oven during drying; Use anti-static glove to take out module when its temperature below 36℃by natural cool down after drying; Make sure no water and dirt in the bottom of the module; Temperature and humidity control is level 3 for initial modules. Storage and drying conditions are based on IPC/JEDEC J-STD-020. EMW3080 Datasheet 5.4 Storage Condition 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 MXCHIP All Rights Reserved Figure9Storage Condition EMW3080 [Page 21] D Datasheet [Page 22] 5.5 Tem mperature Curve off Secondaary Reflow 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 Suggestted solder passte type: SAC C305, unleadded, solder paaste thicknesss from 0.12 tto 0.15, less than 2 times reflow. MXCHIP All Rights Reserved Figuure10Temperrature Curve of Secondaryy Reflow EMW3080 Datasheet [Page 23] 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 6. Reference Circuit Power source circuit is shown in figure 11, USB to UART is shown in figure 12, external interface circuit is shown in figure 13. Figure11Power Source Circuit MXCHIP All Rights Reserved Figure12USB to UART EMW3080 Datasheet [Page 24] 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 Figure13External Interface Circuit of EMW3080 Voltage of EMW3239 UART is 3.3V. 5V UART should convert to 3.3V UART for the users that have 5V chips. Convert circuit is shown in figure 14. MXCHIP All Rights Reserved Figure143.3V UART- 5V UARTConvert Circuit EMW3080 Datasheet [Page 25] 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 7. ModuleMOQ and Package Information Table 16 Type ModuleMOQ and Package Information MOQ(pcs) Shipping packing method （Tray/Tape） Module storage quantity for each tray (pcs) Tray number for each box Module quantity for each box (pcs) 1050（2 boxes） Tray 35 15+1 525 EMW3080(AP) EMW3080(AE) EMW3080(BP) EMW3080(BE) MXCHIP All Rights Reserved EMW3080 Datasheet [Page 26] 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 8. FCC Caution § 15.19 Labeling requirements. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. § 15.21 Information to user. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. § 15.105 Information to the user. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna. -Increase the separation between the equipment and receiver. MXCHIP All Rights Reserved -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated withminimum distance 20cm between the radiator & your body. This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC compliance requirement of the end product which integrates this module. The final end product must be labeled in a visible area with the following " Contains TX FCC ID: P53-EMW3080". EMW3080 Datasheet [Page 27] 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 9. CE Caution Complies with the essential protection requirements of Directives on Radio Equipment Directive 2014/53/EU. This declaration applies to all specimens manufactured identical to the samples submitted for testing/evaluation. The assessments were based on the following regulations and standards: Requirement Health safety and Standard Report No. EN 60950-1:2006+A11:2009+A1:2010+A12:2011+A2:2013 SET2017-04238 EN 62311:2008; SET2017-04738 Assessment Body Telefication B.V Draft EN 301 489-1 V2.2.0 EMC SET2017-03082 Telefication B.V SET2017-03256 Telefication B.V Draft EN 301 489-17 V3.2.0 Radio Spectrum EN 300 328 V2.1.1 MXCHIP All Rights Reserved This declaration is the responsibility of the manufacturer: EMW3080 Datasheet 无法显示图像。计算机可能没有足够的内存以打开该图像，也可能是该图像已损坏。请重新启动计算机，然后重新打开该文件。如果仍然显示红色 “x”，则可能需要删除该图像，然后重新将其插入。 10. Sales Information and Technical Support Company: Shanghai MXCHIP Information Technology Co., Ltd For consultation or purchase the product, please contact Mxchip during working hours: From Monday to Friday, morning 9:00~12:00, afternoon 13:00~18:00 Telephone: +86-21-52655026 Contact address: 9thFloor, No.5, Lane2145 JinshaJiang Road Putuo District, ShangHai. Postcode：200333 Email: sales@mxchip.com MXCHIP All Rights Reserved EMW3080 [Page 28]
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