MXCHIP Information Technology EMW3080 Embedded WiFi module User Manual DS0069EN EMW3080 AB V1 1

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Datasheet [Page 1]

EMW3080

Vision Illustration

Date Vision Details

2017-01-16 1.0 Initial document

2017-02-13 1.1

Update label, package, RF reference, encryption. Add

BOOT/EASYLINK description

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Datasheet [Page 2]

EMW3080

Content

Abstract ................................................................................................................................................................................. 1

Vision Illustration ................................................................................................................................................................. 1

1. Product Introduction ..................................................................................................................................................... 4

1.1 EMW3080 LABEL INFORMATION ..................................................................................................................... 5

1.2 PIN ARRANGEMENT .......................................................................................................................................... 6

1.3 PIN DEFINITION ................................................................................................................................................ 8

1.3.1 EMW3080 Package Definition ............................................................................................................ 8

1.3.2 EMW3080 Pin Definition.................................................................................................................... 8

2. Electrical Parameters .................................................................................................................................................. 10

2.1 OPERATING CONDITIONS ................................................................................................................................ 10

2.2 POWER PARAMETERS ...................................................................................................................................... 10

2.3 WORKING ENVIRONMENT ............................................................................................................................... 11

2.4 ELECTROSTATIC DISCHARGE .......................................................................................................................... 11

3. RF parameters ............................................................................................................................................................. 12

3.1 BASIC RF PARAMETERS .................................................................................................................................. 12

3.2 TX PERFORMANCE ......................................................................................................... 错误！未定义书签。

3.2.1 Transmit performance of IEEE802.11b mode ................................................... 错误！未定义书签。

3.2.2 Transmit performance of IEEE802.11g mode ................................................... 错误！未定义书签。

3.2.3 Transmit performance of IEEE802.11n-HT20 mode......................................... 错误！未定义书签。

3.3 RX RECEIVE SENSITIVITY .............................................................................................................................. 12

3.3.1 IEEE802.11b Mode ........................................................................................................................... 12

3.3.2 IEEE802.11g Mode ........................................................................................................................... 13

3.3.3 IEEE802.11n-HT Mode ..................................................................................................................... 13

4. Antenna Information ................................................................................................................................................... 15

4.1 ANTENNA TYPE .............................................................................................................................................. 15

4.2 PCB ANTENNA CLEARANCE ZONE ................................................................................................................. 15

4.3 EXTERNAL ANTENNA CONNECTOR ................................................................................................................. 17

5. Assembly Information and Production Guidance ....................................................................................................... 18

5.1 ASSEMBLY SIZE .............................................................................................................................................. 18

5.2 PRODUCTION GUIDANCE（IMPORTANT） ...................................................................................................... 19

5.3 CONSIDERATIONS ............................................................................................................................................ 20

5.4 STORAGE CONDITION ..................................................................................................................................... 21

5.5 TEMPERATURE CURVE OF SECONDARY REFLOW ............................................................................................. 22

6. Reference Circuit ........................................................................................................................................................ 23

7. Module MOQ and Package Information ..................................................................................................................... 25

8. Sales Information and Technical Support ................................................................................................................... 26

Figure Content

Figure 1 EMW3080 Label Information ............................................................................................................... 6

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Datasheet [Page 3]

EMW3080

Figure 2 DIP Package Size ............................................................................................................................... 7

Figure 3 LGA Package Size .............................................................................................................................. 7

Figure 4EMW3080 Package Definition .............................................................................................................. 8

Figure 5Minimum Clearance Zone of PCB Antenna (Unit: mm) ..................................................................... 16

Figure 6 Size of External Antenna Connector ................................................................................................... 17

Figure 7 EMW3080Side View (Unit: mm) ........................................................................................................ 18

Figure 8 Humidity Card ..................................................................................................................................... 19

Figure 9 Storage Condition ................................................................................................................................ 21

Figure 10 Temperature Curve of Secondary Reflow ......................................................................................... 22

Figure 11 Power Source Circuit ......................................................................................................................... 23

Figure 12USB to UART .................................................................................................................................... 23

Figure 13External Interface Circuit of EMW3080 ............................................................................................ 24

Figure 14 3.3V UART- 5V UART Convert Circuit ........................................................................................... 24

Table Content

Table 1 EMW3080 Pin Definition ....................................................................................................................... 8

Table 2 Range of input voltage .......................................................................................................................... 10

Table 3Absolute maximum voltage rating ......................................................................................................... 10

Table 4EMW3080 2.2Power Parameters ..................................................................................................... 10

Table 5Temperature and humidity condition ...................................................................................................... 11

Table 6 Electrostatic Discharge Parameters ........................................................................................................ 11

Table 7Radio-frequency standards ..................................................................................................................... 12

Table 8CCK_11 transmit performance parameters of IEEE802.11b mode ....................... 错误！未定义书签。

Table 9OFDM_54 transmit performance parameters of IEEE802.11g mode .................... 错误！未定义书签。

Table 10MCS7 transmit performance parameters of IEEE802.11n-HT20 mode .............. 错误！未定义书签。

Table 11 MCS7 Transmit Performance of IEEE802.11n-HT 40MHz mode ..................... 错误！未定义书签。

Table 12Receive Sensitivity of IEEE802.11b Mode with Bandwidth 20MHz(dBm) ........................................ 12

Table 13 Receive Sensitivity of IEEE802.11g Mode with Bandwidth 20MHz(dBm) ....................................... 13

Table 14 Receive Sensitivity of IEEE802.11n-HT20 Mode with Bandwidth 20MHz(dBm) ............................ 13

Table 15 Receive Sensitivity of IEEE802.11n-HT40 Mode (dBm) ................................................................... 14

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Datasheet [Page 4]

EMW3080

1. Product Introduction

EMW3080 is a cost-effective embedded Wi-Fi module released by MXCHIP with high integrating ARM

CM4F, WLAN MAC/Baseband/RF. Maximum frequency 133MHz with 256KB SRAM and 2M FLASH. Power

supply is DC 3.3V. Installation modes are LGA SMT and Pin Connection. Peripheral: 2xUART / 1x SPI /2x I2C /

6x PWM / Up to 13 GPIOs.

EMW3080 operates MiCO 3.0 IoT operating system, supporting Micoder 1.0 development system. Provide

fast, stable and secure end-to-end cloud links to users with integrate TCP/IP protocol stack, various security

encryption algorithm, intelligent cloud such as MXCHIP easylink/Alink 1.1/Joinlink 3.0/Hilink/One

Net/Gome/Suning, oversea cloud such as AWS/Ayla/Azure/IBM Watson/Google/Apple Homekit.

EMW3080 (A): Provide securityencryption chip to the integrity and legality and cloud communication safety

of client firmware.

EMW3080 (B): Abundant peripherals and memory to supply most application and multi-cloud requirement.

Hardware diagram is shown below with four main parts:

 CM4F main core

 WLAN MAC/BB/RF/ANT

 Hardware encryption

 Power management

With:

1. ARM CM4FCPU with 133MHz maximum frequency and 256KB SRAM and 2M FLASH. Support high

speed UART, I2C, SPI, PWM and multi-GPIO.

2. 2MB SPI Flash is used for custom firmware development

3. Support PCB antenna and IPEX

4. Input voltage:DC 3.3V

EMW3080(A) Wi-Fi Module Block Diagram

SOC

2.4GHz Radio

U.F.L connector

On-board

PCB Ant

3.3V

Input

40MHz

OSC

256KB SRAM

UART x 2

I2Cx 2

GPIO x 11

Power Management

802.11b/g/n

MAC

133MHz Cortex-M4F MCU

512KB ROM

SWD

2MB Flash SPI

PWM x 5 Encryption

Chip

VBAT_MEAS

EMW3080 Hardware block

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Datasheet [Page 5]

EMW3080

1.1 EMW3080 Label Information

EMW3080(A) EMW3080(B)

Encryption security chip Inside External support

CPU ARM CM4F

CPU Maximum Speed 133MHz 133MHz

SRAM 256KB 256KB

Flash（QSPI

100MHz） 2MB（Support XIP CACHE running and decrypting）

UART (Maximum

6Mbps) 2 2

I2C (400KHz) 2 2

SPI (31.25MHz) None 1

PWM (Maximum 4MHz) 5 6

SWD debug port 1 1

Debug port 1 1

GPIO(Output current

4mA) 11 13

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Datasheet [Page 6]

EMW3080

Figure1EMW3080 Label Information

Label Information:

CMIIT ID:XXXXXXXX : SRRC approval number

FCC ID:XXX-XXXXXXX :FCC certification information

CE: CE authenticationlog

EMW3080: Module type

047863100000：MAC address(Each module has a unique MAC address)

F3080AP /F3080AE: Sub model type of module A, PCB antenna or IPEX

F3080BP /F3080BE: Sub model type of module B, PCB antenna or IPEX

X1701：production batch

XXXX.XXXX.XXXX : SN series number

1.2 Pin Arrangement

EMW3080 has LGA package and DIP package, DIP package (as shown in figure 2) could effectively reduce

the quality risk of second patch；LGA package (as shown in figure 3) is easy to debug, provide multi-choice for

customers.

Solder mask openness has the same size with land. The width of steel mesh is suggested to be 0.12mm to

0.14mm in SMT.

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像

，然后重新将其插入。

Fig

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Datasheet

EMW3080

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[Page 7]

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Datasheet [Page 8]

EMW3080

1.3 Pin Definition

1.3.1 EMW3080Package Definition

Figure4EMW3080 Package Definition

1.3.2 EMW3080 Pin Definition

Table1EMW3080 Pin Definition

numb

er

FUNCTION1 FUNCTION2 FUNCTION3 FUNCTION4 FUNCTION5 FUNCTION6

1, 3 MICO_GPIO_1 MICO_PWM1 SWCLK

2, 4 MICO_GPIO_2 MICO_PWM2 SWDIO

5 NC

6 VBAT MEAS

7 MICO_GPIO_7 MICO_I2C0_SCL MICO_UART0_RTS MICO_PWM6 MICO_SPI1_MISO

8 MICO_GPIO_8 MICO_I2C0_SDA MICO_UART0_CTS MICO_SPI1_CS

9 MICO_GPIO_9 MICO_I2C1_SDA MICO_UART0_TXD MICO_PWM1 MICO_SPI1_MOSI

10 MICO_GPIO_10 MICO_I2C1_CLK MICO_UART0_RXD MICO_SPI1_CLK

11 CHIP_EN

12 MICO_GPIO_12 MICO_PWM3

13 MICO_GPIO_13 MICO_PWM4

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Datasheet [Page 9]

EMW3080

14 MICO_GPIO_14 MICO_PWM5

15 NC

16 VDD

17 GND

18 NC

19 MICO_GPIO_19

20 NC

21, 24 MICO_GPIO_21 MICO_I2C0_SDA MICO_UART1_TXD MICO_PWM4

22, 25 MICO_GPIO_22 MICO_I2C0_SCL MICO_UART1_RXD MICO_PWM5

23 MICO_GPIO_23

Illustration：words in black color is the common pins in both A and B, words in blue color is unique pins of

B module. Compare to A module, EMW3080(B) has four pins: PIN 7,8,9,10 with function: traffic control of

UART, SPI function,PWM output and GPIO.

PIN 19 is used as BOOT，PIN23 is used as EASYLINK, please do not use pin 19 and 23 in hardware 硬件

design. Please contact engineer of MXCHIP if it is necessary to use the two pins.

PIN21/24should be in high voltage or NC when power on,please aware it when designing circuit.

CHIP_EN could not be set NC, the other pins should not be set NC.

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Datasheet [Page 10]

EMW3080

2. Electrical Parameters

2.1 Operating Conditions

EMW3080would be unstable when input voltage is less than the lowest rated voltage.

Table2Range of input voltage

Symbol Illustration Condition

Details

Minimum Typ Maximum Unit

VDD Power Supply 3.0 3.3 3.6 V

There would be permanent damage in hardware if the device operates at the voltage over rated value.

Meanwhile, reliability could be influenced when the device has a long-term operating at maximum voltage.

Table3Absolute maximum voltage rating

Symbol Description Minimum Typ Unit

VDD Module input voltage –0.3 3.6 V

VIN GPIO input voltage −0.3 3.6 V

2.2 Power Parameters

Table4EMW3080 2.2 Power Parameters

Status Current（3V3） Description

WIFIInitialization 26.91mA

Enable WIFI, low power consumption

Connect WIFI 47.71mA Enable WIFI,low power consumption

UDPtransmission 168.37mA Disable WIF, low power consumption

SoftAP 121.48mA

SoftAPconnect to internet

Easylink 122.84mA

Process of module network distribution

Standby 10.45uA Ultra low standby power mode

Actual working current is variable at different operating mode. Maximum operating current 300 mA 。

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Datasheet [Page 11]

EMW3080

2.3 Working Environment

Table5Temperature and humidity condition

Symbol Name Maximum Unit

TSTG Storage Temperature -55 to +125

℃

TA Operation Temperature -20 to +85

℃

Humidity Non-condensing, Relative humidity 95 %

2.4 Electrostatic Discharge

Table6Electrostatic Discharge Parameters

Symbol Name Details Level Maximum Unit

VESD(HBM)

Electrostatic discharge

voltage

(Human module)

TA= +25 °C , JESD22-A114 2 2000

V

VESD(CDM)

Electrostatic discharge

voltage

(Discharge device

module)

TA = +25 °C , JESD22-C101 II 500

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Datasheet [Page 12]

EMW3080

3. RF parameters

3.1 Basic RF parameters

Table7Radio-frequency standards

Name Illustration

Working frequency 2.412~2.484GHz

Wi-Fi wireless standard IEEE802.11b/g/n20/n40

Maximum output power 18dBm

Data

transmission rate

20MHz

11b：1,2,5.5,11Mbps

11g:6,9,12,18,24,36,48,54Mbps

11n: MCS0~7,72.2Mbps

40MHz 11n：MCS0~7,150Mbps

Antenna type PCB(Default)

IPX (Optional)

3.2 RX Receive Sensitivity

3.2.1 IEEE802.11b Mode

Table8Receive Sensitivity of IEEE802.11b Mode with Bandwidth 20MHz(dBm)

Rate

Channel 11M 1M

IEEE spec -76dBm -83dBm

1 -90dBm -100dBm

2 -90dBm -100dBm

3 -90dBm -100dBm

4 -90dBm -100dBm

5 -90dBm -100dBm

6 -90dBm -100dBm

7 -90dBm -100dBm

8 -90dBm -100dBm

9 -90dBm -100dBm

10 -90dBm -100dBm

11 -90dBm -100dBm

12 -90dBm -100dBm

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Datasheet [Page 13]

EMW3080

Rate

Channel 11M 1M

13 -90dBm -100dBm

3.2.2 IEEE802.11g Mode

Table9Receive Sensitivity of IEEE802.11g Mode with Bandwidth 20MHz(dBm)

Rate

Channel

54M 6M

IEEE spec -65dBm -82dBm

1 -76dBm -92dBm

2 -76dBm -92dBm

3 -76dBm -92dBm

4 -76dBm -92dBm

5 -76dBm -92dBm

6 -76dBm -92dBm

7 -76dBm -92dBm

8 -76dBm -92dBm

9 -76dBm -92dBm

10 -76dBm -92dBm

11 -76dBm -92dBm

12 -76dBm -92dBm

13 -76dBm -92dBm

3.2.3 IEEE802.11n-HT Mode

Table10Receive Sensitivity of IEEE802.11n-HT20 Mode with Bandwidth 20MHz(dBm)

Channel Rate MCS7 MCS0

IEEE spec -64dBm -82dBm

1 -73dBm -92dBm

2 -73dBm -92dBm

3 -73dBm -92dBm

4 -73dBm -92dBm

5 -73dBm -92dBm

6 -73dBm -92dBm

7 -73dBm -92dBm

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Datasheet [Page 14]

EMW3080

Channel Rate MCS7 MCS0

8 -73dBm -92dBm

9 -73dBm -92dBm

10 -73dBm -92dBm

11 -73dBm -92dBm

12 -73dBm -92dBm

13 -73dBm -92dBm

Table11Receive Sensitivity of IEEE802.11n-HT40 Mode(dBm)

Rate

Channel

MCS7 MCS0

IEEE spec -64dBm -82dBm

3 -69dBm -89dBm

4 -69dBm -89dBm

5 -69dBm -89dBm

6 -69dBm -89dBm

7 -69dBm -89dBm

8 -69dBm -89dBm

9 -69dBm -89dBm

10 -69dBm -89dBm

11 -69dBm -89dBm

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Datasheet [Page 15]

EMW3080

4. Antenna Information

4.1 Antenna Type

EMW3080has two type of antenna: EMW3080(AP/BP) and EMW3080(AE/BE)

EWM3080（AP） EMW3080(BP)

EMW3080(AE) EMW3080(BE)

4.2 PCB Antenna Clearance Zone

Main PCB should have a distance over 16mm with other metal elements when using PCB antenna in Wi-Fi

device. Shadow parts in the figure below should keep away from metal elements, sensor, interference source and

other material that could cause signal interference.

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Datasheet [Page 16]

EMW3080

Figure5Minimum Clearance Zone of PCB Antenna (Unit: mm)

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Datasheet [Page 17]

EMW3080

4.3 External Antenna Connector

Figure6Size of External Antenna Connector

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Datasheet [Page 18]

EMW3080

5. Assembly Information and Production Guidance

5.1 Assembly Size

Top View

Left Side View

Side View

Figure7EMW3080Side View (Unit: mm)

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Datasheet [Page 19]

EMW3080

5.2 Production Guidance（Important）

 The stamp hole package module produced by Mxchip must completely being patched by SMT machine

in 24 hours after open firmware package. Otherwise the module should be re-package by vacuum pumping

and drying before patch.

 Devices for SMT patch:

（1）Reflow soldering machine

（2）AOI detector

（3）Suction nozzle with 6-8mm caliber

 Device for drying:

（1）Cabinet type oven

（2）Anti-static and high thermotolerant tray

（3）Anti-static and high thermotolerant gloves

 Conditions of product storage (Storage environment is shown in figure 8):

 Moisture bag must be stored in temperature below 30 and humidity less than 85%RH.

 Dry packaging products, the guarantee period should be from 6 months date of packing seal.

 Humidity indicator card is in the hermetic package.

Figure8Humidity Card

 Humidity indicator card and drying situation:

 2 hours drying for module if the color ring at 30%, 40%, 50% in humidity indicator card is blue

after unpacking;

 4 hours drying for module if the color ring at 30% in humidity indicator card is pink after

unpacking;

 6 hours drying for module if the color ring at 30%, 40% in humidity indicator card is pink after

unpacking;

 12 hours drying for module if the color ring at 30%, 40%, 50% in humidity indicator card is pink

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Datasheet [Page 20]

EMW3080

after unpacking.

 Drying parameters:

 Drying temperature: 125℃±5℃；

 Alarm temperature:130℃；

 SMT patch when the device cool down below 36℃ in natural condition;

 Dry times: 1;

 Please dry again if the module is unsoldering in 12 hours after last drying.

 SMT is unsuitable if the module packed over 3 months. There would be serious oxidation of the pad

because of immersion gold and cause false welding and lack of weld. Mxchip does not assume the

corresponding responsibility;

 ESD protection is required before SMT;

 SMT patch should on the basis of reflow profile diagram, maximum temperature 245℃, reflow profile

diagram is shown in figure 10;

 In order to guarantee the reflow soldering qualification rate, vision and AOI detection should be done in

10% products for the first patch to make sure the rationality of temperature control, device adsorption mode

and position. Detect 5 to 10 sample every hour in the following batch production.

5.3 Considerations

 Operator should wear anti-static gloves during producing;

 No more than drying time;

 Any explosive, flammable and corrosivematerial is not allowed to add in drying;

 Module should be put into oven with high thermotolerant tray. Ventilation should exist between each

module and no direct contact with oven;

 Make sure oven is closed when drying to prevent temperature leaking;

 Reduce opening time or keep closing the door of the oven during drying;

 Use anti-static glove to take out module when its temperature below 36℃by natural cool down after

drying;

 Make sure no water and dirt in the bottom of the module;

 Temperature and humidity control is level 3 for initial modules. Storage and drying conditions are based

on IPC/JEDEC J-STD-020.

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Datasheet [Page 21]

EMW3080

5.4 Storage Condition

Figure9Storage Condition

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[Page 22

than 2 times

]

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Datasheet [Page 23]

EMW3080

6. Reference Circuit

Power source circuit is shown in figure 11, USB to UART is shown in figure 12, external interface circuit is

shown in figure 13.

Figure11Power Source Circuit

Figure12USB to UART

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Datasheet [Page 24]

EMW3080

Figure13External Interface Circuit of EMW3080

Voltage of EMW3239 UART is 3.3V. 5V UART should convert to 3.3V UART for the users that have 5V

chips. Convert circuit is shown in figure 14.

Figure143.3V UART- 5V UARTConvert Circuit

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Datasheet [Page 25]

EMW3080

7. ModuleMOQ and Package Information

Table 16 ModuleMOQ and Package Information

Type MOQ(pcs)

Shipping

packing method

（Tray/Tape）

Module storage

quantity for

each tray (pcs)

Tray number

for each box

Module quantity

for each box (pcs)

EMW3080(AP)

EMW3080(AE)

EMW3080(BP)

EMW3080(BE)

1050（2 boxes） Tray 35 15+1 525

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Datasheet [Page 26]

EMW3080

8. FCC Caution

§ 15.19 Labeling requirements.

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)

This device may not cause harmful interference, and (2) this device must accept any interference received,

including interference that may cause undesired operation.

§ 15.21 Information to user.

Any Changes or modifications not expressly approved by the party responsible for compliance could void the

user's authority to operate the equipment.

§ 15.105 Information to the user.

Note: This equipment has been tested and found to comply with the limits for a Class B digital device,

pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful

interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and,

if not installed and used in accordance with the instructions, may cause harmful interference to radio

communications. However, there is no guarantee that interference will not occur in a particular installation. If this

equipment does cause harmful interference to radio or television reception, which can be determined by turning

the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following

measures:

-Reorient or relocate the receiving antenna.

-Increase the separation between the equipment and receiver.

-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

-Consult the dealer or an experienced radio/TV technician for help.

This equipment complies with FCC radiation exposure limits set forth for an

uncontrolled environment. This equipment should be installed and operated withminimum distance 20cm between

the radiator & your body.

This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC compliance

requirement of the end product which integrates this module.

The final end product must be labeled in a visible area with the following

" Contains TX FCC ID: P53-EMW3080".

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Datasheet [Page 27]

EMW3080

9. CE Caution

Complies with the essential protection requirements of Directives on Radio Equipment Directive

2014/53/EU.

This declaration applies to all specimens manufactured identical to the samples submitted for

testing/evaluation.

The assessments were based on the following regulations and standards:

Requirement Standard Report No. Assessment Body

Health and

safety

EN 60950-1:2006+A11:2009+A1:2010+A12:2011+A2:2013

EN 62311:2008;

SET2017-04238

SET2017-04738 Telefication B.V

EMC

Draft EN 301 489-1 V2.2.0

Draft EN 301 489-17 V3.2.0

SET2017-03082 Telefication B.V

Radio

Spectrum

EN 300 328 V2.1.1

SET2017-03256 Telefication B.V

This declaration is the responsibility of the manufacturer:

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Datasheet [Page 28]

EMW3080

10. Sales Information and Technical Support

Company: Shanghai MXCHIP Information Technology Co., Ltd

For consultation or purchase the product, please contact Mxchip during working hours:

From Monday to Friday, morning 9:00~12:00, afternoon 13:00~18:00

Telephone: +86-21-52655026

Contact address: 9thFloor, No.5, Lane2145 JinshaJiang Road Putuo District, ShangHai.

Postcode：200333

Email: sales@mxchip.com

MXCHIP Information Technology EMW3080 Embedded WiFi module User Manual DS0069EN EMW3080 AB V1 1

Shanghai MXCHIP Information Technology Co.,Ltd. Embedded WiFi module DS0069EN EMW3080 AB V1 1

Users Manual

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