MXCHIP Information Technology EMW3090 Embedded WIFI module User Manual
Shanghai MXCHIP Information Technology Co.,Ltd. Embedded WIFI module Users Manual
User Manual
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| Document ID | 3628110 |
| Application ID | b2ybve+kHvAeB0eFvCnCGg== |
| Document Description | User Manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 174.12kB (2176506 bits) |
| Date Submitted | 2017-11-03 00:00:00 |
| Date Available | 2018-05-05 00:00:00 |
| Creation Date | 2017-10-30 11:38:38 |
| Document Lastmod | 2017-11-03 11:09:44 |
| Document Title | Users Manual |
| Document Creator | WPS Office |
| Document Author: | mxchip |
EMW3090 Datasheet Embedded Wi-Fi module Vision：1.0 Date：2017-06-12 Number: DS0084EN Abstract Features Support 802.11b/g/n, integrate ARM-CM4F, WLAN MAC/Baseband/RF 256KB RAM/ 2MB FLASH Intelligent lighting Working Voltage: DC 3.0-3.6V Intelligent Transportation Maximum transmission rate up to 72.2 Mbps with 20 MHz bandwidth. Smart Home Application Maximum transmission rate up to 150 Mbps with 40 MHz bandwidth. industrial automation Intelligent Security Wi-Fi Features Support 802.11b/g/n，HT-40 Support Station, Soft AP, Station+Soft AP Application Type Peripherals： 2x UART 2x I2C 1x SPI 1x SWD 6x PWM Up to 13GPIOs Operating Temperature：-20℃ to +85℃ Illustration EMW3090-P PCB antenna EMW3090-E IPEX connector Support EasyLink，Alink，Joinlink Antenna: PCB or IPX (Optional) Module Type Hardware Block Datasheet [Page 1] Version Illustration Date Vision 2017-06-12 1.0 Details Initial document EMW3090 Datasheet [Page 2] Content Abstract..................................................................................................................................................................................1 Version Illustration............................................................................................................................................................... 1 1.1 EMW3090 LABEL INFORMATION............................................................................................................................. 5 1.2 PIN ARRANGEMENT................................................................................................................................................... 5 1.3 PIN DEFINITION......................................................................................................................................................... 6 1.3.1 EMW3090 Package Definition..................................................................................................................6 1.3.2 EMW3090 Pin Definition..........................................................................................................................7 2. Electrical Parameters....................................................................................................................................................... 8 2.1 OPERATING CONDITIONS...........................................................................................................................................8 2.2 POWER CONSUMPTION...............................................................................................................................................8 2.3 WORKING ENVIRONMENT..........................................................................................................................................9 2.4 ELECTROSTATIC DISCHARGE..................................................................................................................................... 9 3. RF parameters.................................................................................................................................................................10 3.1 BASIC RF PARAMETERS...........................................................................................................................................10 4. Antenna Information...................................................................................................................................................... 11 4.1 ANTENNA TYPE........................................................................................................................................................ 11 4.2 PCB ANTENNA CLEARANCE ZONE&PCB ANT PARAMETER.................................................................................. 11 4.3 EXTERNAL ANTENNA CONNECTOR&EXTERNAL ANTENNA PARAMETERS................................................................ 12 5. Production Guidance（Important）............................................................................................................................ 14 5.1 CONSIDERATIONS.................................................................................................................................................... 15 5.2 STORAGE CONDITION.............................................................................................................................................. 16 5.3 TEMPERATURE CURVE OF SECONDARY REFLOW.....................................................................................................17 6. Reference Circuit............................................................................................................................................................ 18 7. Sales Information and Technical Support.................................................................................................................... 20 EMW3090 Datasheet [Page 3] Figure Content Figure 1 EMW3090 Label Information...............................................................................................................5 Figure 2 Half-hole SMT Package Size.............................................................................................................. 6 Figure 3 EMW3090 Package Definition............................................................................................................. 6 Figure 4 Minimum Clearance Zone of PCB Antenna (Unit: mm)................................................................... 12 Figure 5 Size of External Antenna Connector...................................................................................................13 Figure 6 Humidity Card.....................................................................................................................................14 Figure 7 Storage Condition................................................................................................................................16 Figure 8 Temperature Curve of Secondary Reflow...........................................................................................17 Figure 9 Power Source Circuit.......................................................................................................................... 18 Figure 10 USB to UART................................................................................................................................... 18 Figure 11 External Interface Circuit of EMW3090...........................................................................................18 Figure 12 3.3V UART- 5V UART Convert Circuit...........................................................................................19 EMW3090 Datasheet [Page 4] Product Introduction EMW3090 is a cost-effective embedded Wi-Fi module released by MXCHIP with high integrating ARM CM4F, WLAN MAC/Baseband/RF. Maximum frequency 133MHz with 256KB SRAM and 2M FLASH. Power supply is DC 3.3V. Mounting mode is SMT or DIP(Dual In-line Package). Peripherals: 2xUART / 1x SPI /2x I2C / 6x PWM / Up to 13 GPIOs. EMW3090 runs MiCO 3.0 IoT operating system, supporting Micoder IDE. Provide fast, stable and secure end-to-end cloud links to users with integrate TCP/IP protocol stack, various security encryption algorithm, intelligent cloud such as MXCHIP easylink/Alink 1.1/Joinlink 3.0/Hilink/One Net/Gome/Suning, oversea cloud such as AWS/Ayla/Azure/IBM Watson/Google/Apple Homekit. Hardware diagram is shown below with four main parts: CM4F main core WLAN MAC/BB/RF/ANT Hardware encryption Power management With: 1. ARM CM4F CPU with 133MHz maximum frequency and 256KB SRAM and 2M FLASH. Support high speed UART, I2C, SPI, PWM and multi-GPIO. 2. 2MB SPI Flash is used for custom firmware development 3. Support PCB antenna and IPEX 4. Input voltage: DC 3.3V EMW3090 Hardware block EMW3090 Datasheet [Page 5] 1.1 EMW3090 Label Information Figure 1 EMW3090 Label Information Label Information: CMIIT ID:XXXXXXXX : SRRC approval number EMW3090: Module type 047863100000：MAC address (Each module has a unique MAC address) X1701：production batch XXXX.XXXX.XXXX : SN series number 1.2 Pin Arrangement EMW3090 has half-hole SMT package. Solder mask openness has the same size with land. The width of steel mesh is suggested to be 0.12mm to 0.14mm in SMT. EMW3090 Datasheet Figure 2 Half-hole SMT Package Size 1.3 Pin Definition 1.3.1 EMW3090 Package Definition Figure 3 EMW3090 Package Definition EMW3090 [Page 6] Datasheet 1.3.2 [Page 7] EMW3090 Pin Definition Table 1 EMW3090 Pin Definition Pin NO. FUNCTION1 FUNCTION2 FUNCTION3 FUNCTION4 VDD CHIP_EN MICO_GPIO_12 MICO_PWM3 MICO_GPIO_13 MICO_PWM4 MICO_GPIO_8 MICO_I2C0_SDA MICO_UART0_CTS MICO_GPIO_7 MICO_I2C0_SCL MICO_UART0_RTS MICO_PWM6 MICO_GPIO_21 MICO_I2C0_SDA MICO_UART1_TXD MICO_PWM4 MICO_GPIO_22 MICO_I2C0_SCL MICO_UART1_RXD MICO_PWM5 GND 10 MICO_GPIO_14 11 MICO_GPIO_10 MICO_I2C1_CLK MICO_UART0_RXD 12 MICO_GPIO_9 MICO_I2C1_SDA MICO_UART0_TXD 13 GND 14 MICO_GPIO_23 15 VBAT_MEAS 16 NC 17 MICO_GPIO_19 18 GND FUNCTION5 MICO_SPI1_CS MICO_SPI1_MISO MICO_PWM5 MICO_SPI1_CLK MICO_PWM1 MICO_SPI1_MOSI Notes： (1) PIN 17 is used as BOOT，PIN14 is used as EASYLINK, please do not use pin 7 and 8 in hardware design. Please contact engineer of MXCHIP if it is necessary to use the two pins. (2) PIN7/8 should be in high voltage or NC when power on, please aware it when designing circuit. (3) If not used, please set the pin as NC, especially for CHIP_EN. EMW3090 Datasheet [Page 8] 2. Electrical Parameters 2.1 Operating Conditions EMW3090 would be unstable when input voltage is less than the lowest rated voltage. Table 2 Range of input voltage Details Symbol Illustration Condition Minimum Typ Maximum Unit 3.0 3.3 3.6 Power Supply VDD There would be permanent damage in hardware if the device operates at the voltage over rated value. Meanwhile, reliability could be influenced when the device has a long-term operating at maximum voltage. Table 3 Absolute maximum voltage rating Symbol Description Minimum Typ Unit VDD Module input voltage –0.3 3.6 VIN GPIO input voltage −0.3 3.6 2.2 Power Consumption Table 4 EMW3090 Power Consumption Status Average current（3V3） Max current（3V3） Description WIFI Initialization 26.91mA 33.1mA WIFI Connected 47.71mA 119.5mA UDP transmission 168.37mA 298.7mA WIFI low power mode disabled SoftAP 121.48mA 260.4mA SoftAP connect to internet Easylink 122.84mA 136.7mA Process of module network distribution Standby 10.45uA 12.07uA Ultra low standby power mode WIFI low power mode enabled Keep connected with the router WIFI low power mode enabled Actual working current is variable at different operating mode. Maximum operating current 300 mA 。 EMW3090 Datasheet [Page 9] 2.3 Working Environment Table 5 Temperature and humidity condition Symbol Name Maximum Unit TSTG Storage Temperature -20 to +85 ℃ TA Operation Temperature -20 to +85 ℃ Humidity Non-condensing, Relative humidity 95 2.4 Electrostatic Discharge Table 6 Electrostatic Discharge Parameters Symbol Name Details Level Maximum TA= +25 °C , JESD22-A114 2000 Unit Electrostatic discharge VESD(HBM) voltage (Human Body Model) Electrostatic discharge VESD(CDM) voltage (Charged Device TA = +25 °C , JESD22-C101 Model) EMW3090 II 500 Datasheet [Page 10] 3. RF parameters 3.1 Basic RF parameters Table 7 Radio-frequency standards Name Illustration Working frequency 2.412~2.472GHz Wi-Fi wireless standard IEEE802.11b/g/n 11b：1,2,5.5 和 11Mbps 20MHz Data 11g : 6,9,12,18,24,36,48,54Mbps 11n : MCS0~7,72.2Mbps transmission rate 40MHz Antenna type 11n：MCS0~7,150Mbps PCB (Default) IPX (Optional) EMW3090 Datasheet [Page 11] 4. Antenna Information 4.1 Antenna Type EMW3090 has two type of antenna: EMW3090-P and EMW3090-E EWM3090-P EMW3090-E 4.2 PCB Antenna Clearance Zone&PCB ANT parameter Main PCB should have a distance over 16mm with other metal elements when using PCB antenna in Wi-Fi device. Shadow parts in the figure below should keep away from metal elements, sensor, interference source and other material that could cause signal interference. EMW3090 Datasheet Figure 4 Minimum Clearance Zone of PCB Antenna (Unit: mm) 4.3 External Antenna Connector&External antenna parameters 1、External Antenna Parameter: Model name：IPEX1.3-2.4G-L131 2、External Antenna Connector EMW3090 [Page 12] Datasheet [Page 13] Figure 5 Size of External Antenna Connector 3、antenna trace design The characteristic impedance depends on the dielectric of PCB, the track width and the Ground plane spacing. Microstrip type is required. The detail simulation as below. The RE trace of the test board which was used in the FCC test is defined as below. EMW3090 Datasheet [Page 14] 5. Production Guidance（Important） The stamp hole package module produced by Mxchip must completely being patched by SMT machine in 24 hours after open firmware package. Otherwise the module should be re-package by vacuum pumping and drying before patch. Devices for SMT patch: （1）Reflow soldering machine （2）AOI detector （3）Suction nozzle with 6-8mm caliber Device for drying: （1）Cabinet type oven （2）Anti-static and high thermos tolerant tray （3）Anti-static and high thermos tolerant gloves Conditions of product storage (Storage environment is shown in figure 8): Moisture bag must be stored in temperature below 30 and humidity less than 85%RH. Dry packaging products, the guarantee period should be from 6 months date of packing seal. Humidity indicator card is in the hermetic package. Figure 6 Humidity Card Humidity indicator card and drying situation: 2 hours drying for module if the color ring at 30%, 40%, 50% in humidity indicator card is blue after unpacking; 4 hours drying for module if the color ring at 30% in humidity indicator card is pink after unpacking; 6 hours drying for module if the color ring at 30%, 40% in humidity indicator card is pink after EMW3090 Datasheet [Page 15] unpacking; 12 hours drying for module if the color ring at 30%, 40%, 50% in humidity indicator card is pink after unpacking. Drying parameters: Drying temperature: 125℃±5℃； Alarm temperature: 130℃； SMT patch when the device cool down below 36℃ in natural condition; Dry times: 1; Please dry again if the module is unsoldering in 12 hours after last drying. SMT is unsuitable if the module packed over 3 months. There would be serious oxidation of the pad because of immersion gold and cause false welding and lack of weld. Mxchip does not assume the corresponding responsibility; ESD protection is required before SMT; SMT patch should on the basis of reflow profile diagram, maximum temperature 245℃, reflow profile diagram is shown in figure 10; In order to guarantee the reflow soldering qualification rate, vision and AOI detection should be done in 10% products for the first patch to make sure the rationality of temperature control, device adsorption mode and position. Detect 5 to 10 sample every hour in the following batch production. 5.1 Considerations Operator should wear anti-static gloves during producing; No more than drying time; Any explosive, flammable and corrosive material is not allowed to add in drying; Module should be put into oven with high thermotolerant tray. Ventilation should exist between each module and no direct contact with oven; Make sure oven is closed when drying to prevent temperature leaking; Reduce opening time or keep closing the door of the oven during drying; Use anti-static glove to take out module when its temperature below 36℃ by natural cool down after drying; Make sure no water and dirt in the bottom of the module; Temperature and humidity control is level 3 for initial modules. Storage and drying conditions are based on IPC/JEDEC J-STD-020. EMW3090 Datasheet 5.2 Storage Condition Figure 7 Storage Condition EMW3090 [Page 16] Datasheet [Page 17] 5.3 Temperature Curve of Secondary Reflow Suggested solder paste type: SAC305, unleaded, solder paste thickness from 0.12 to 0.15, less than 2 times reflow. Figure 8 Temperature Curve of Secondary Reflow EMW3090 Datasheet [Page 18] 6. Reference Circuit Power source circuit is shown in figure 9, USB to UART is shown in figure 10, external interface circuit is shown in figure 11. Figure 9 Power Source Circuit Figure 10 USB to UART Figure 11 External Interface Circuit of EMW3090 EMW3090 Datasheet [Page 19] Voltage of EMW3090 UART is 3.3V. 5V UART should convert to 3.3V UART for the users that have 5V chips. Convert circuit is shown in figure 14. Figure 12 3.3V UART- 5V UART Convert Circuit EMW3090 Datasheet 7. Sales Information and Technical Support For consultation or purchase the product, please contact Mxchip during working hours: From Monday to Friday, morning 9:00~12:00, afternoon 13:00~18:00 Telephone: +86-21-52655026 Contact address: 9thFloor, No.5, Lane2145 JinshaJiang Road Putuo District, ShangHai. Postcode：200333 Email: sales@mxchip.com EMW3090 [Page 20] Datasheet [Page 1] FCC Regulations: This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. This device has been tested and found to comply with the limits for a Class B digital device , pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiated radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna. -Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. Caution: Changes or modifications not expressly approved by the party responsible for compliance could void the user‘s authority to operate the equipment. RF Exposure Information This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In order to avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna shall not be less than 20cm (8 inches) during normal operation. IMPORTANT NOTE: This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC compliance requirement of the end product, which integrates this module. 20cm minimum distance has to be able to be maintained between the antenna and the users for the host this module is integrated into. Under such configuration, the FCC radiation exposure limits set forth for an population/uncontrolled environment can be satisfied. Any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. EMW3090 Datasheet [Page 2] USERS MANUAL OF THE END PRODUCT: In the users manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. If the size of the end product is smaller than 8x10cm, then additional FCC part 15.19 statement is required to be available in the users manual: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. LABEL OF THE END PRODUCT: The final end product must be labeled in a visible area with the following " Contains Transmitter Module FCC ID: P53-EMW3090 ". If the size of the end product is larger than 8x10cm, then the following FCC part 15.19 statement has to also be available on the label: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. EMW3090
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