MXCHIP Information Technology EMW3161 Embedded WiFi module User Manual DS0005E EMW3161 v1 0

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EMW3161 User Manual

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1Warning statementFCC STATEMENT1. This device complies with Part 15 of the FCC Rules. Operation is subject to the followingtwo conditions:(1) This device may not cause harmful interference.(2) This device must accept any interference received, including interference that maycause undesired operation.2. Changes or modifications not expressly approved by the party responsible forcompliance could void the user's authority to operate the equipment.NOTE: This equipment has been tested and found to comply with the limits for a Class Bdigital device, pursuant to Part 15 of the FCC Rules. These limits are designed to providereasonable protection against harmful interference in a residential installation.This equipment generates uses and can radiate radio frequency energy and, if not installedand used in accordance with the instructions, may cause harmful interference to radiocommunications. However, there is no guarantee that interference will not occur in aparticular installation. If this equipment does cause harmful interference to radio ortelevision reception, which can be determined by turning the equipment off and on, theuser is encouraged to try to correct the interference by one or more of the followingmeasures:Reorient or relocate the receiving antenna.Increase the separation between the equipment and receiver.Connect the equipment into an outlet on a circuit different from that to which thereceiver is connected.Consult the dealer or an experienced radio/TV technician for help.FCC Radiation Exposure StatementThis equipment complies with FCC radiation exposure limits set forth for an uncontrolledenvironment. This equipment should be installed and operated with minimum distance20cm between the radiator & your body.The EMW3161 module is designed to comply with the FCC statement. FCC ID isP53-EMW3161. The host system using EMW3161, should have label indicated FCC IDP53-EMW3161.

EMW3161 embedded Wi-Fi module Overview EMW3161 is an ultra-compact, low-power embedded Wi-Fi module based on MX1081, a fully integrated System-on-Chip that is fully compatible with Broadcom WICED platform. MX1081 integrates a wireless LAN MAC/baseband /radio, and a Cortex-M3 microcontroller STM32F205 that runs a unique "self-hosted" Wi-Fi networking library and software application stack. EMW3161 has 1M bytes flash, 128k RAM and rich peripherals for your embedded Wi-Fi applications. EMW3161 is also an mxchipWNetTM compatible platform, users can build their own embedded Wi-Fi applications based on mxchipWNetTM library which manage all of the Wi-Fi MAC and TCP/IP stack processing. We also provide several mxchipWNetTM firmware to meet typical applications: wireless UART, wireless audio, wireless sensor etc. When using mxchipWNetTM -DTU firmware, you can establish Wi-Fi networking for any device with a micro-controller and a UART interface. Quick development cycles enables fast time to market. Applications  Building Automation / Access Control  Smart home appliances  Medical/Health Care  Industrial Automation Systems  Point Of Sale system (POS)  Auto electronics Product list Module - Antenna EMW3161 - C On-board chip antenna - E IPEX connector Firmware/Library Function mxchipWNetTM -DTU Predefined firmware: UART/Wi-Fi conversion mxchipWNetTM Library Software library used to develop custom firmware WICEDTM Firmware development kit WICEDTM source codes with TCP/IP, Wi-Fi MAC RTOS and GCC tool chain Hardware block MXCHIP Co., Ltd Data Sheet EMW3161 Embedded Wi-Fi module 2.0 Date：2013-07-17 Data Sheet

1 1 Introduction EMW3161 is an ultra-compact, low-power embedded Wi-Fi module based on MX1080, a fully integrated System-on-Chip that is fully compatible with Broadcom WICED platform. MX1081 integrates a Broadcom BCM43362 wireless LAN MAC/baseband/radio, and an embedded processor core that runs a unique "self-hosted" Wi-Fi networking library and software application stack. EMW3161 has 1M bytes flash, 128k RAM and rich peripherals for your embedded Wi-Fi applications. EMW3161 is also an mxchipWNetTM compatible platform, users can build their own embedded Wi-Fi applications based on mxchipWNetTM library which manage all of the Wi-Fi MAC and TCP/IP stack processing. We also provide several mxchipWNetTM firmware to meet typical applications: wireless UART, wireless audio, wireless sensor etc. When using mxchipWNetTM-DTU firmware, you can establish Wi-Fi networking for any device with a micro-controller and a serial interface. Quick development cycles enables fast time to market.

2 1.1 Features  Single operation voltage：3.3V  Power consumption: <130mA under running mode, <1mA under standby mode.  STM32F2 MCU frequency: 120MHz，flash size: 1M bytes，RAM size128k bytes.  On-chip functionality Single-chip: MAC/BB/RF  Peripherals：  42 x GPIOs  3 x UARTs，UART2 include hardware flow control  2 x SPI, 1xIIS  8 x ADC input channels，2 DAC output channel  1 x USB device, 1 x CAN  2 x I2C  PWM/Timer input/output  DCMI  SWD debug interface  Wi-Fi connectivity  802.11b, 802.11g, 802.11n (single stream) on channel 1-14@2.4GHz  WEP, WPA/WPA2 PSK/Enterprise  Transmit power：18.5dBm@11b，15.5dBm@11g，14.5dBm@11n  MIN Receiver Sensitivity: -96 dBm  Max Data rate：11Mbps@11b，54Mbps@11g，72Mbps@11n HT20  Wi-Fi modes：Station, Soft AP and Wi-Fi direct  Advanced 1x1 802.11n features Full/Half Guard Interval Frame Aggregation Space Time Block Coding (STBC) Low Density Parity Check (LDPC) Encoding  Hardware Encryption: WEP, WPA/WPA2  WPS 2.0  Multiple power save modes  On-board chip antenna，IPEX connector for external antenna  CE，FCC compliant  Operating Temperature: -40℃ to 85℃  MSL level 3

3 2 Interface 2.1 Pinouts EMW3161 has two groups of pins (1X15 +1X15). The lead pitch is 2mm. EMW3161’s pinout is shown in the Figure 2.1. Table 2.2 lists the pin functions. Figure2.1 EMW3161: appearance and pinout 2.2 Pin Arrangement Figure 2.2 EMW3161 pin arrangement Pins Name Type IO level Main function (after reset) Alternate functions Other functions 1 PA4(2) I/O TT PA4 SPI1_NSS / SPI3_NSS / USART2_CK / DCMI_HSYNC / OTG_HS_SOF/ I2S3_WS/ EVENTOUT ADC12_IN4 /DAC1_OUT 2 PA5(2) I/O TT PA5 SPI1_SCK/ OTG_HS_ULPI_CK / TIM2_CH1_ETR/ TIM8_CHIN/ EVENTOUT ADC12_IN5 /DAC2_OUT 3 PA6(2) I/O FT PA6 SPI1_MISO / TIM8_BKIN/TIM13_CH1 / DCMI_PIXCLK / TIM3_CH1 / TIM1_BKIN/ EVENTOUT ADC12_IN6

4 Pins Name Type IO level Main function (after reset) Alternate functions Other functions 4 PA7(2) I/O FT PA7 SPI1_MOSI/ TIM8_CH1N / TIM14_CH1 TIM3_CH2/ ETH_MII_RX_DV / TIM1_CH1N / RMII_CRS_DV / EVENTOUT ADC12_IN7 5 PB14 I/O FT PB14 SPI2_MISO/ TIM1_CH2N / TIM12_CH1 / OTG_HS_DM USART3_RTS/ TIM8_CH2N/ EVENTOUT 6 PB15 I/O TT PB15 SPI2_MOSI / I2S2_SD / TIM1_CH3N / TIM8_CH3N / TIM12_CH2 / OTG_HS_DP / RTC_50Hz/ EVENTOUT 7 PB10 I/O FT JTDO/ TRACESWO SPI2_SCK/ I2S2_SCK/ I2C2_SCL / USART3_TX / OTG_HS_ULPI_D3 / ETH_MII_RX_ER / TIM2_CH3/ EVENTOUT 8 PB12 I/O FT PB12 SPI2_NSS/I2S2_WS/ I2C2_SMBA/ USART3_CK/ TIM1_BKIN / CAN2_RX / OTG_HS_ULPI_D5/ ETH_RMII_TXD0 / ETH_MII_TXD0/ OTG_HS_ID/ EVENTOUT 9 PC6 I/O FT PC6 I2S2_MCK / TIM8_CH1/SDIO_D6 / USART6_TX / DCMI_D0/TIM3_CH1/ EVENTOUT 10 PH8 I/O FT PH8 I2C3_SDA / DCMI_HSYNC/ EVENTOUT 11 PH9 I/O FT PH9 I2C3_SMBA / TIM12_CH2/ DCMI_D0/ EVENTOUT 12 PH10 I/O FT PH10 TIM5_CH1 / DCMI_D1/ EVENTOUT 13 PH11 I/O FT PH11 TIM5_CH2 / DCMI_D2/ EVENTOUT

5 Pins Name Type IO level Main function (after reset) Alternate functions Other functions 14 PH12 I/O FT PH12 TIM5_CH3 / DCMI_D3/ EVENTOUT 15 PH14 I/O FT PH14 TIM8_CH2N / DCMI_D4/ EVENTOUT 16 PI4 I/O FT PI4 TIM8_BKIN / DCMI_D5/ EVENTOUT 17 PI5 I/O FT PI5 TIM8_CH1 / DCMI_VSYNC/ EVENTOUT 18 PI6 I/O FT PI6 TIM8_CH2 / DCMI_D6/ EVENTOUT 19 PI7 I/O FT PI7 TIM8_CH3 / DCMI_D7/ EVENTOUT 20 PA9 I/O FT PA9 USART1_TX/ TIM1_CH2 / I2C3_SMBA / DCMI_D0/ EVENTOUT OTG_FS_ VBUS 21 PA10 I/O FT PA10 USART1_RX/ TIM1_CH3/ OTG_FS_ID/DCMI_D1/ EVENTOUT 22 PH13 I/O FT PH13 TIM8_CH1N / CAN1_TX/ EVENTOUT 23 PH15 I/O FT PH15 TIM8_CH3N / DCMI_D11/ EVENTOUT 24 PD5 I/O FT PD5 FSMC_NWE/USART2_TX/ EVENTOUT 25 PD6 I/O FT PD6 FSMC_NWAIT/ USART2_RX/ EVENTOUT 26 PA13 I/O FT JTMS- SWDIO JTMS-SWDIO/ EVENTOUT 27 PA14 I/O FT JTCK- SWCLK JTCK-SWCLK/ EVENTOUT 28 PB6 I/O FT PB6 I2C1_SCL/ TIM4_CH1 / CAN2_TX / DCMI_D5/USART1_TX/ EVENTOUT 29 PB7 I/O FT PB7 2C1_SDA / FSMC_NL(8) / DCMI_VSYNC / USART1_RX/ TIM4_CH2/ EVENTOUTDCMI_D5/USART1_TX/ EVENTOUT

6 Pins Name Type IO level Main function (after reset) Alternate functions Other functions 30 BOOT0 I BOOT0 31 PI2 I/O FT PI2 TIM8_CH4 /SPI2_MISO / DCMI_D9/ EVENTOUT 32 PI1 I/O FT PI1 SPI2_SCK / I2S2_SCK / DCMI_D8/ EVENTOUT 33 PI0 I/O FT PI0 TIM5_CH4 / SPI2_NSS / I2S2_WS / DCMI_D13/ EVENTOUT 34 PI3 I/O FT PI3 TIM8_ETR / SPI2_MOSI / I2S2_SD / DCMI_D10/ EVENTOUT 35 PE5 I/O FT PE5 TRACED2 / FSMC_A21 / TIM9_CH1 / DCMI_D6/ EVENTOUT 36 PE6 I/O FT PE6 TRACED3 / FSMC_A22 / TIM9_CH2 / DCMI_D7/ EVENTOUT 37 PF9(2) I/O FT PF9 TIM14_CH1 / FSMC_CD/ EVENTOUT ADC3_IN7 38 PF0 I/O FT PF0 FSMC_A0 / I2C2_SDA/ EVENTOUT 39 PF1 I/O FT PF1 FSMC_A1 / I2C2_SCL/ EVENTOUT 40 NRST I/O NRST 41 GND S GND 42 VDD S VDD 43 VDD S VDD 44 GND S GND 45 PA0-WKUP(2) I/O FT PA0-WKUP USART2_CTS/ UART4_TX/ ETH_MII_CRS / TIM2_CH1_ETR/ TIM5_CH1 / TIM8_ETR/ EVENTOUT ADC123_IN0/ WKUP 46 PA1(2) I/O FT PA1 USART2_RTS / UART4_RX/ ETH_RMII_REF_CLK / ETH_MII_RX_CLK / TIM5_CH2 / TIM2_CH2/ EVENTOUT ADC123_IN1 47 PA2(2) I/O FT PA2 USART2_TX/TIM5_CH3 / ADC123_IN2

7 Pins Name Type IO level Main function (after reset) Alternate functions Other functions TIM9_CH1 / TIM2_CH3 / ETH_MDIO/EVENTOUT 48 PA3(2) I/O FT PA3 USART2_RX/TIM5_CH4 / TIM9_CH2 / TIM2_CH4 / OTG_HS_ULPI_D0 / ETH_MII_COL/ EVENTOUT ADC123_IN3 49 GND S GND 1. FT = 5 V tolerant; TT = 3.6 V tolerant. 2. FT = 5 V tolerant except when in analog mode or oscillator mode (for PC14, PC15, PH0 and PH1). 3. I = input, O = output, S = supply. 4. STM32 peripherals are not listed if they cannot be presented on current pins

8 2.3 Pin Arrangement for peripherals Some of STM32 peripherals are not listed if their main function is not usable on EMW3161. USART1(AF7) USART2(AF7) USART4(AF8) TX RX TX RX CTS RTS CK TX RX 20 PA9 21 PA10 47 PA2 48 PA3 45 PA0 46 PA1 1 PA4 45 PA0 46 PA1 28 PB6 29 PB7 24 PD5 25 PD6 I2C1(AF4) I2C2(AF4) SCL SDA SCL SDA SMBA 28 PB6 29 PB7 39 PF1 38 PF0 8 PB12 7 PB10 SPI1(AF5) SPI2(AF5) NSS SCK MISO MOSI NSS SCK MOSI MISO 1 PA4 2 PA5 3 PA6 4 PA7 33 PI0 32 PI1 34 PI3 31 PI2 8 PB12 7 PB10 6 PB15 5 PB14 IIS2(AF5) WS SCK SD MCK 33 PI0 32 PI1 34 PI3 9 PC6 8 PB12 7 PB10 6 PB15 USB_HS(AF12) DP DM 6 PB15 5 PB14 DCMI(AF13) HSYNC PIXCK VSYNC D0 D1 D2 D3 D4 D5 D6 D7 1 PA4 3 PA6 29 PB7 11 PH9 12 PH10 13 PH11 14 PH12 15 PH14 16 PI4 18 PI6 19 PI7 10 PH8 17 PI5 20 PA9 21 PA10 28 PB6 35 PE5 36 PE6 9 PC6 CAN2(AF9) TX RX 28 PB6 8 PB12

9 ADC123(AF14) ADC12(AF14) ADC3(AF14) IN0 IN1 IN2 IN3 IN4 IN5 IN6 IN7 IN7 45 PA0 46 PA1 47 PA2 48 PA3 1 PA4 2 PA5 3 PA6 4 PA7 37 PF9 DAC1(AF14) DAC2(AF14) OUT OUT 1 PA4 2 PA5 2.4 Typical Pin Arrangement

10 3 Electrical Parameters 3.1 Absolute maximum ratings: 3.1.1 Voltage & Current Stresses above the absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Symbol Ratings Min Max Unit VDD–VSS Voltage –0.3 4.0 V VIN Input voltage on five volt tolerant pin VSS −0.3 5.5 V VIN Input voltage on any other pin VSS −0.3 VDD+0.3 V Symbol Ratings Max Unit IVDD Total current into VDD power lines (source) 320 mA IVSS Total current out of VSS ground lines (sink) 320 IIO Output current sunk by any I/O and control pin 25 Output current source by any I/O and control pin -25 3.2 Operating conditions 3.2.1 Voltage & Current Symbol Note Conditions Specification Min. Typical Max. Unit VDD Voltage 2.4 3.3 3.5 V

11 WLAN Subsystem Symbol Note Conditions Typical Unit IRF OFF1 2 μA IRF SLEEP4 200 μA IRF Rx(Listen)2 52 mA IRF Rx(Active)3 59 mA IRF Power Save5 6 1.9 mA IRF Tx CCK7 10 11 Mbps at 18.5 dBm 320 mA IRF Tx OFDM8 10 54 Mbps at 15.5 dBm 270 mA IRF Tx OFDM9 10 65 Mbps at 14.5 dBm 260 mA Note 1: Power is off. Note 2: Carrier Sense (CCA) when no carrier present Note 3: Carrier Sense (CS) detect/Packet Rx Note 4: Intra-beacon Sleep Note 5: Beacon Interval = 102.4ms, DTIM = 1, Beacon duration = 1 ms @1 Mbps. Integrated Sleep + wakeup + Beacon Rx current over 1 DTIM interval. Note 6: In WLAN power-saving mode, the following blocks are powered down: Crystal oscillator, Baseband PLL, AFE, RF PLL, Radio Note 7: CCK power at chip port. Duty cycle is 100%. Includes PA contribution. Note 8: OFDM power at chip port. Duty cycle is 100%. Includes PA contribution. Note 9: OFDM power at chip port is 16 dBm, duty cycle is 100%, includes PA contribution. Note 10: Absolute junction temperature limits maintained through active thermal monitoring and dynamic Tx duty cycle limiting.

12 Microcontroller Subsystem Typical and maximum current consumption in Run mode, code with data processing running from Flash memory (ART accelerator enabled) or RAM Symbol Conditions fHCLK Running Mode Sleep Mode Unit TA=25°C TA=25°C IMCU External clock, all peripherals enabled 120MHz 49 38 mA 90MHz 38 30 60MHz 26 20 30MHz 14 11 25MHz 11 8 16MHz 8 6 8MHz 5 3.6 4MHz 3 2.4 2MHz 2 1.9 External clock, all peripherals disabled 120MHz 21 8 90MHz 17 7 60MHz 12 5 30MHz 7 3.5 25MHz 5 2.5 16MHz 4 2.1 8MHz 2.5 1.7 4MHz 2 1.5 2MHz 1.6 1.4 Typical and maximum current consumptions in Stop mode Symbol Parameter Conditions Typ Max Unit TA=25°C TA=25°C IMCU Supply current in Stop mode with main regulator in Run mode Flash in Stop mode, low-speed and high-speed internal RC oscillators and high-speed oscillator OFF (no independent watchdog). 0.55 1.2 mA Flash in Deep power down mode, low-speed and high-speed internal RC oscillators and high-speed oscillator OFF (no independent watchdog). 0.5 1.2 Supply current in Stop mode with main regulator in Low Power mode Flash in Stop mode, low-speed and high-speed internal RC oscillators and high-speed oscillator OFF (no independent watchdog). 0.35 1.1 Flash in Deep power down mode, low-speed and high-speed internal RC oscillators and high-speed oscillator OFF (no independent watchdog). 0.3 1.1

13 Typical and maximum current consumptions in Standby mode Symbol Parameter Conditions Typ Unit TA=25°C IMCU Supply current in Standby mode Backup SRAM ON, low-speed oscillator and RTC ON 4.0 μA Backup SRAM OFF, low-speed oscillator and RTC ON 3.3 Backup SRAM ON, RTC OFF 3.0 Backup SRAM OFF, RTC OFF 2.2 Power consumption in typical operation modes3 Symbol Parameter Conditions Min Average Max Unit TA=25°C TA=25°C TA=25°C Imodule Total power consumption on EMW3161 module No Wi-Fi data is transmitting1 2.8 7.2 73.5 mA Receive data in UDP mode, 20k bps1 2.8 12 262 mA Send data in UDP mode, 20k bps1 3 24 280 mA RF off, MCU enter standby mode2 4 6 8 μA Connecting to AP 52 74 320 mA Note1: TA=25°C, MCU frequency=120MHz, with data processing running from Flash memory (ART accelerator enabled). Firmware process TCP/IP stack and IEEE 802.11 MAC every 250 milliseconds, enter stop mode when no task is pending. RF subsystem is connected to an access point and run under power save mode in IEEE 802.11n@14.5 dBm Tx power. AP Beacon Interval = 102.4ms, DTIM = 1. Note2: Wi-Fi connection is disconnected. Note3: These data may not be the same depend on different firmware functions. 3.3 Digital I/O port characteristics 3.3.1 Output voltage levels Symbol Note Parameter Conditions Min. Max. Unit VOL UART& IO output voltage Output low level voltage IIO= +8 mA 2.7 V < VDD < 3.6 V 0.4 V VOH Output high level voltage VDD-0.4 V VOL Output low level voltage IIO= +20 mA 2.7 V < VDD < 3.6 V 1.3 V VOH Output high level voltage VDD-1.3 V

14 3.3.2 Output voltage levels Symbol Note Parameter Conditions Min. Max. Unit VIL UART& IO input voltage Input low level voltage TTL level -0.5 0.8 V VIH Input high level voltage 2 VDD+0.5 V Input high level voltage (5V input tolerant) 2 5.5 V VIL Input low level voltage CMOS level -0.5 0.35VDD V VIH Input high level voltage 0.65VDD VDD+0.5 V 3.3.3 nRESET pin characteristics The nRESET pin input driver uses CMOS technology. EMW3161 contains RC (resistance-capacitance) reset circuit which ensures the module reset accurately when it powers up. If you need to reset manually, just connect the external control signals to the reset pins directly, but the control signal should be Open Drain Mode。 Symbol Item Conditions Min. Typical Max. Unit VIL(NRST) nRESET input low level –0.5 0.8 V VIH(NRST) nRESET input high level 2 VDD+0.5 RPU Resistor for Pulling up VIN= VSS 7.5 8 8.3 kΩ CPD Capacitor for charging and Resetting 100 1000 pF 3.4 Other MCU electrical parameters Please refer to STM32F215RGT6 data sheet. 3.5 Temperature and Humidity Symbol Ratings Max Unit TSTG Storage temperature –55 to +125 ℃ TA Working temperature -40 to +85 ℃ Humidity Non condensing, relative humidity Max. 95%

15 3.6 ESD Absolute maximum ratings: The Electromagnetic Environment Electrostatic discharge Symbol Ratings Conditions Class Max Unit VESD(HBM) Electrostatic discharge voltage (human body model) TA= +25 °C conforming to JESD22-A114 2 2000 V VESD(CDM) Electrostatic discharge voltage (charge device model) TA = +25 °C conforming to JESD22-C101 II 500 3.7 Static latch-up These tests are compliant with EIA/JESD 78A IC latch-up standard. Symbol Parameter Class Class LU Static latch-up class TA= +105 °C conforming to JESD78A II level A 3.8 RF characteristics 3.8.1 Basic RF characteristics Item Specification Operating Frequency FCC:2412~2462MHz CE:2412-2472MHz Wi-Fi Standard 802.11b/g/n(single stream n) Modulation Type 11b: DBPSK, DQPSK,CCK for DSSS 11g: BPSK, QPSK, 16QAM, 64QAM for OFDM 11n: MCS0~7,OFDM＊ Data Rates 11b:1, 2, 5.5 and 11Mbps 11g:6, 9, 12, 18, 24, 36, 48 and 54 Mbps 11n: MCS0~7, up to 72Mbps Antenna type One U.F.L connector for external antenna PCB printed ANT (Reserve)

16 3.8.2 IEEE802.11b mode Item Specification Modulation Type DSSS / CCK Frequency range FCC:2412MHz~2462MHz CE:2412MHz-2472MHz Channel CH1 to CH14 Data rate 1, 2, 5.5, 11Mbps TX Characteristics Min. Typical Max. Unit Transmitter Output Power 11bTarget Power 18.5 dBm Spectrum Mask @ target power fc +/-11MHz to +/-22MHz -30 dBr fc > +/-22MHz -50 dBr Frequency Error -20 ＋20 ppm Constellation Error( peak EVM)@ target power 1~11Mbps -17 -10 RX Characteristics Min. Typical Max. Unit Minimum Input Level Sensitivity 1Mbps (FER≦8%) -97 -83 dBm 2Mbps (FER≦8%) -93 -80 dBm 5.5Mbps (FER≦8%) -91 -79 dBm 11Mbps (FER≦8%) -89 -76 dBm Maximum Input Level (FER≦8%) -10 dBm 3.8.3 IEEE802.11g mode Item Specification Modulation Type OFDM Frequency range 2400MHz~2484MHz Channel CH1 to CH14 Data rate 6, 9, 12, 18, 24, 36, 48, 54Mbps TX Characteristics Min. Typical Max. Unit Transmitter Output Power

17 11gTarget Power 15.5 dBm Spectrum Mask @ target power fc +/-11MHz -20 dBr fc +/-20MHz -28 dBr fc > +/-30MHz -40 dBr Frequency Error -20 ＋20 ppm Constellation Error( peak EVM)@ target power 6Mbps -5 dB 9Mbps -8 dB 12Mbps -10 dB 18Mbps -13 dB 24Mbps -16 dB 36Mbps -19 dB 48Mbps -22 dB 54Mbps -30 -25 dB Transmit spectrum mask @ 11MHz -20 dBr @ 20MHz -28 dBr @ 30MHz -40 dBr RX Characteristics Min. Typical Max. Unit Minimum Input Level Sensitivity 6Mbps (FER≦10%) -90 -82 dBm 9Mbps (FER≦10%) -88 -87 dBm 12Mbps (FER≦10%) -86 -79 dBm 18Mbps (FER≦10%) -85 -77 dBm 24Mbps (FER≦10%) -82 -74 dBm 36Mbps (FER≦10%) -79 -70 dBm 48Mbps (FER≦10%) -75 -66 dBm 54Mbps (FER≦10%) -72 -65 dBm Maximum Input Level (FER≦10%) -20 dBm 3.8.4 IEEE802.11n 20MHz bandwidth mode Item Specification Modulation Type MIMO-OFDM

18 Channel CH1 to CH14 Data rate MCS0/1/2/3/4/5/6/7 TX Characteristics Min. Typical Max. Unit Transmitter Output Power 11n HT20 Target Power 14.5 dBm Spectrum Mask @ target power fc +/-11MHz -20 dBr fc +/-20MHz -28 dBr fc > +/-30MHz -45 dBr Frequency Error -25 -1.2 ＋25 ppm Constellation Error( peak EVM)@ target power MCS0 -5 dBm MCS1 -10 dBm MCS2 -13 dBm MCS3 -16 dBm MCS4 -19 dBm MCS5 -22 dBm MCS6 -25 dBm MCS7 -32 -28 dBm Transmit spectrum mask @ 11MHz -20 dBr @ 20MHz -28 dBr @ 30MHz -40 dBr RX Characteristics Min. Typical Max. Unit Minimum Input Level Sensitivity MCS0 (FER≦10%) -89 -82 dBm MCS1 (FER≦10%) -86 -79 dBm MCS2 (FER≦10%) -84 -77 dBm MCS3 (FER≦10%) -82 -74 dBm MCS4 (FER≦10%) -78 -70 dBm MCS5 (FER≦10%) -74 -66 dBm MCS6 (FER≦10%) -72 -65 dBm MCS7 (FER≦10%) -69 -64 dBm Maximum Input Level (FER≦10%) -20 dBm

19 3.9 Mechanical Dimensions 3.9.1 EMW3161 Mechanical Dimensions Figure 3.1 EMW3161 top view (Metric units)

20 4 Antenna information There is co-layout design (C35&C32) for antenna connection. Please order your module carefully. Users can also modify the capacitor position but MXCHIP would not take any responsibility for this behavior. EMW3161-E load the capacitor C35 (10pF/0201), it means can use U.F.L RF connector for external antenna. If want to use on-board chip antenna, just need load the capacitor from C35 to C32 (EMW3161-C). In order to get the maximum performance, strongly suggest customer use external antenna connected with U.F.L RF connector. 4.1 Minimizing radio interference When integrating the Wi-Fi module with on board PCB printed antenna, make sure the area around the antenna end the module protrudes at least 15mm from the mother board PCB and any metal enclosure. If this is not possible use the on board U.FL connector to route to an external antenna. The area (6.5mmx17.3mm) under the antenna end of the module should be keep clear of metallic components, connectors, vias, traces and other materials that can interfere with the radio signal. 15mm 15mm

21 4.2 U.F.L RF Connector This module use U.F.L type RF connector for external antenna connection.

23 6 Sales Information If you need to buy this product, please call MXCHIP during the working hours. (Monday ~ Friday A.M.9:00~12:00; P.M. 1:00~6:00) Telephone: +86-21-52655026 / 52655025 Address: Room 811, Tongpu Building, No.1220 Tongpu Road, Shanghai Post Code: 200333 Email: sales@mxchip.com 7 Technical Support If you need to get the latest information on this product or our other product information, you can visit: http://www.mxchip.com/ If you need to get technical support, please call us during the working hours: ST ARM technical support +86 (021)52655026-822 Email: support@mxchip.com Wireless network technical support +86 (021)58655026-812 Email: support@mxchip.com Development tools technical support +86 (021) 52655026-822 Email: support@mxchip.com