MXCHIP Information Technology EMW3161 Embedded WiFi module User Manual DS0005E EMW3161 v1 0

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Document ID	2149449
Application ID	ShU32bXziB5w+JTJDfw+qA==
Document Description	User Manual
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Document Type	User Manual
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Filesize	95.86kB (1198189 bits)
Date Submitted	2013-12-22 00:00:00
Date Available	2013-12-22 00:00:00
Creation Date	2013-07-17 23:54:07
Producing Software	Microsoft® Word 2013
Document Lastmod	2013-12-18 10:02:29
Document Title	DS0005E_EMW3161_v1.0
Document Creator	Microsoft® Word 2013
Document Author:	William Xu

Warning statement
FCC STATEMENT
1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) This device may not cause harmful interference.
(2) This device must accept any interference received, including interference that may
cause undesired operation.
2. Changes or modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate the equipment.
NOTE: This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation.
This equipment generates uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one or more of the following
measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
FCC Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance
20cm between the radiator & your body.
The EMW3161 module is designed to comply with the FCC statement. FCC ID is
P53-EMW3161. The host system using EMW3161, should have label indicated FCC ID
P53-EMW3161.
EMW3161 embedded Wi-Fi module
EMW3161
Data Sheet
Embedded Wi-Fi module
2.0
Date：2013-07-17
Data Sheet
Overview
EMW3161 is an ultra-compact, low-power
embedded Wi-Fi module based on MX1081, a fully
integrated System-on-Chip that is fully compatible
with Broadcom WICED platform. MX1081
integrates a wireless LAN MAC/baseband /radio,
and a Cortex-M3 microcontroller STM32F205 that
runs a unique "self-hosted" Wi-Fi networking
library and software application stack. EMW3161
has 1M bytes flash, 128k RAM and rich peripherals
Product list
Module
EMW3161
On-board chip antenna
IPEX connector
for your embedded Wi-Fi applications.
Antenna
EMW3161 is also an mxchipWNetTM
compatible platform, users can build their own
Firmware/Library
Function
embedded Wi-Fi applications based on
mxchipWNetTM -
Predefined firmware:
DTU
UART/Wi-Fi conversion
mxchipWNetTM
Software library used to
Library
develop custom firmware
mxchipWNetTM library which manage all of the
Wi-Fi MAC and TCP/IP stack processing.
provide several
mxchipWNetTM
We also
firmware to meet
typical applications: wireless UART, wireless audio,
wireless sensor etc.
When using mxchipWNetTM -DTU firmware,
you can establish Wi-Fi networking for any device
WICEDTM Firmware
development kit
WICEDTM source codes
with TCP/IP, Wi-Fi MAC
RTOS and GCC tool chain
Hardware block
with a micro-controller and a UART interface.
Quick development cycles enables fast time to
market.
Applications

Building Automation / Access Control

Smart home appliances

Medical/Health Care

Industrial Automation Systems

Point Of Sale system (POS)

Auto electronics
MXCHIP Co., Ltd
Contents
RF characteristics ................................. 15
INTRODUCTION .......................... 1
Features ................................................... 2
3.8.1
Basic RF characteristics ......................................... 15
3.8.2
IEEE802.11b mode .................................................. 16
3.8.3
IEEE802.11g mode .................................................. 16
3.8.4
IEEE802.11n 20MHz bandwidth mode ............ 17
INTERFACE ................................... 3
Mechanical Dimensions ...................... 19
3.9.1
Pinouts ..................................................... 3
EMW3161 Mechanical Dimensions .................. 19
Pin Arrangement .................................... 3
Pin Arrangement for peripherals ......... 8
Typical Pin Arrangement ....................... 9
ANTENNA INFORMATION....... 20
Minimizing radio interference ........... 20
U.F.L RF Connector ............................... 21
ELECTRICAL PARAMETERS ....... 10
Absolute maximum ratings: ............... 10
3.1.1
Voltage & Current .................................................. 10
Recommended Reflow Profile ............ 22
Operating conditions: .......................... 10
3.2.1
OTHERS ...................................... 22
MSL/Storage Condition ....................... 22
Voltage & Current .................................................. 10
Digital I/O port characteristics ........... 13
3.3.1
Output voltage levels ............................................ 13
3.3.2
Output voltage levels ............................................ 14
3.3.3
nRESET pin characteristics ................................... 14
Other MCU electrical parameters ....... 14
Temperature and Humidity ................. 14
ESD ......................................................... 15
Static latch-up ....................................... 15
SALES INFORMATION .............. 23
TECHNICAL SUPPORT .............. 23
1
Introduction
EMW3161 is an ultra-compact, low-power embedded Wi-Fi module based on
MX1080, a fully integrated System-on-Chip that is fully compatible with Broadcom
WICED platform. MX1081 integrates a Broadcom BCM43362 wireless LAN
MAC/baseband/radio, and an embedded processor core that runs a unique "self-hosted"
Wi-Fi networking library and software application stack. EMW3161 has 1M bytes flash,
128k RAM and rich peripherals for your embedded Wi-Fi applications.
EMW3161 is also an mxchipWNetTM compatible platform, users can build their own
embedded Wi-Fi applications based on mxchipWNetTM library which manage all of the
Wi-Fi MAC and TCP/IP stack processing. We also provide several mxchipWNetTM
firmware to meet typical applications: wireless UART, wireless audio, wireless sensor etc.
When using mxchipWNetTM-DTU firmware, you can establish Wi-Fi networking for
any device with a micro-controller and a serial interface. Quick development cycles
enables fast time to market.
1.1
Features

Single operation voltage：3.3V

Power consumption: <130mA under running mode, <1mA under standby mode.

STM32F2 MCU frequency: 120MHz，flash size: 1M bytes，RAM size128k bytes.

On-chip functionality Single-chip: MAC/BB/RF

Peripherals：


42 x GPIOs

3 x UARTs，UART2 include hardware flow control

2 x SPI, 1xIIS

8 x ADC input channels，2 DAC output channel

1 x USB device, 1 x CAN

2 x I2C

PWM/Timer input/output

DCMI

SWD debug interface
Wi-Fi connectivity

802.11b, 802.11g, 802.11n (single stream) on channel 1-14@2.4GHz

WEP, WPA/WPA2 PSK/Enterprise

Transmit power：18.5dBm@11b，15.5dBm@11g，14.5dBm@11n

MIN Receiver Sensitivity: -96 dBm

Max Data rate：11Mbps@11b，54Mbps@11g，72Mbps@11n HT20

Wi-Fi modes：Station, Soft AP and Wi-Fi direct

Advanced 1x1 802.11n features
Full/Half Guard Interval
Frame Aggregation
Space Time Block Coding (STBC)
Low Density Parity Check (LDPC) Encoding

Hardware Encryption: WEP, WPA/WPA2

WPS 2.0

Multiple power save modes

On-board chip antenna，IPEX connector for external antenna

CE，FCC compliant

Operating Temperature: -40℃ to 85℃

MSL level 3
2
Interface
2.1
Pinouts
EMW3161 has two groups of pins (1X15 +1X15). The lead pitch is 2mm.
EMW3161’s pinout is shown in the Figure 2.1. Table 2.2 lists the pin functions.
Figure2.1 EMW3161: appearance and pinout
2.2
Pin Arrangement
Figure 2.2 EMW3161 pin arrangement
Pins
Name
Type IO level
Main function
(after reset)
Alternate functions
Other
functions
SPI1_NSS / SPI3_NSS /
PA4(2)
I/O
TT
USART2_CK / DCMI_HSYNC ADC12_IN4
PA4
/ OTG_HS_SOF/ I2S3_WS/
/DAC1_OUT
EVENTOUT
SPI1_SCK/ OTG_HS_ULPI_CK
PA5(2)
I/O
TT
PA5
/ TIM2_CH1_ETR/
TIM8_CHIN/ EVENTOUT
ADC12_IN5
/DAC2_OUT
SPI1_MISO /
PA6(2)
I/O
FT
TIM8_BKIN/TIM13_CH1 /
PA6
DCMI_PIXCLK / TIM3_CH1 /
TIM1_BKIN/ EVENTOUT
ADC12_IN6
Pins
Name
Type IO level
Main function
(after reset)
Alternate functions
Other
functions
SPI1_MOSI/ TIM8_CH1N /
TIM14_CH1 TIM3_CH2/
PA7(2)
I/O
FT
PA7
ETH_MII_RX_DV /
TIM1_CH1N / RMII_CRS_DV
/ EVENTOUT
SPI2_MISO/ TIM1_CH2N /
PB14
I/O
FT
TIM12_CH1 / OTG_HS_DM
PB14
USART3_RTS/ TIM8_CH2N/
EVENTOUT
SPI2_MOSI / I2S2_SD /
PB15
I/O
TT
TIM1_CH3N / TIM8_CH3N /
PB15
TIM12_CH2 / OTG_HS_DP /
RTC_50Hz/ EVENTOUT
SPI2_SCK/ I2S2_SCK/
PB10
I/O
FT
JTDO/
TRACESWO
I2C2_SCL / USART3_TX /
OTG_HS_ULPI_D3 /
ETH_MII_RX_ER /
TIM2_CH3/ EVENTOUT
SPI2_NSS/I2S2_WS/
I2C2_SMBA/ USART3_CK/
TIM1_BKIN / CAN2_RX /
PB12
I/O
FT
PB12
OTG_HS_ULPI_D5/
ETH_RMII_TXD0 /
ETH_MII_TXD0/ OTG_HS_ID/
EVENTOUT
I2S2_MCK /
TIM8_CH1/SDIO_D6 /
PC6
I/O
FT
PC6
USART6_TX /
DCMI_D0/TIM3_CH1/
EVENTOUT
I2C3_SDA / DCMI_HSYNC/
10
PH8
I/O
FT
PH8
11
PH9
I/O
FT
PH9
12
PH10
I/O
FT
PH10
13
PH11
I/O
FT
PH11
EVENTOUT
I2C3_SMBA / TIM12_CH2/
DCMI_D0/ EVENTOUT
TIM5_CH1 / DCMI_D1/
EVENTOUT
TIM5_CH2 / DCMI_D2/
EVENTOUT
ADC12_IN7
Type IO level
Main function
Pins
Name
14
PH12
I/O
FT
PH12
15
PH14
I/O
FT
PH14
16
PI4
I/O
FT
PI4
17
PI5
I/O
FT
PI5
18
PI6
I/O
FT
PI6
19
PI7
I/O
FT
PI7
(after reset)
Alternate functions
Other
functions
TIM5_CH3 / DCMI_D3/
EVENTOUT
TIM8_CH2N / DCMI_D4/
EVENTOUT
TIM8_BKIN / DCMI_D5/
EVENTOUT
TIM8_CH1 / DCMI_VSYNC/
EVENTOUT
TIM8_CH2 / DCMI_D6/
EVENTOUT
TIM8_CH3 / DCMI_D7/
EVENTOUT
USART1_TX/ TIM1_CH2 /
20
PA9
I/O
FT
PA9
I2C3_SMBA / DCMI_D0/
EVENTOUT
USART1_RX/ TIM1_CH3/
21
PA10
I/O
FT
PA10
OTG_FS_ID/DCMI_D1/
EVENTOUT
TIM8_CH1N / CAN1_TX/
22
PH13
I/O
FT
PH13
23
PH15
I/O
FT
PH15
24
PD5
I/O
FT
PD5
25
PD6
I/O
FT
PD6
26
PA13
I/O
FT
JTMS- SWDIO
JTMS-SWDIO/ EVENTOUT
27
PA14
I/O
FT
JTCK- SWCLK
JTCK-SWCLK/ EVENTOUT
EVENTOUT
TIM8_CH3N / DCMI_D11/
EVENTOUT
FSMC_NWE/USART2_TX/
EVENTOUT
FSMC_NWAIT/ USART2_RX/
EVENTOUT
I2C1_SCL/ TIM4_CH1 /
28
PB6
I/O
FT
CAN2_TX /
PB6
DCMI_D5/USART1_TX/
EVENTOUT
2C1_SDA / FSMC_NL(8) /
DCMI_VSYNC /
29
PB7
I/O
FT
PB7
USART1_RX/ TIM4_CH2/
EVENTOUTDCMI_D5/USART
1_TX/ EVENTOUT
OTG_FS_ VBUS
Type IO level
Main function
Pins
Name
30
BOOT0
31
PI2
I/O
FT
PI2
32
PI1
I/O
FT
PI1
(after reset)
Alternate functions
Other
functions
BOOT0
TIM8_CH4 /SPI2_MISO /
DCMI_D9/ EVENTOUT
SPI2_SCK / I2S2_SCK /
DCMI_D8/ EVENTOUT
TIM5_CH4 / SPI2_NSS /
33
PI0
I/O
FT
PI0
I2S2_WS / DCMI_D13/
EVENTOUT
TIM8_ETR / SPI2_MOSI /
34
PI3
I/O
FT
PI3
I2S2_SD / DCMI_D10/
EVENTOUT
TRACED2 / FSMC_A21 /
35
PE5
I/O
FT
PE5
TIM9_CH1 / DCMI_D6/
EVENTOUT
TRACED3 / FSMC_A22 /
36
PE6
I/O
FT
PE6
TIM9_CH2 / DCMI_D7/
EVENTOUT
TIM14_CH1 / FSMC_CD/
37
PF9(2)
I/O
FT
PF9
38
PF0
I/O
FT
PF0
39
PF1
I/O
FT
PF1
40
NRST
I/O
NRST
41
GND
GND
42
VDD
VDD
43
VDD
VDD
44
GND
GND
EVENTOUT
ADC3_IN7
FSMC_A0 / I2C2_SDA/
EVENTOUT
FSMC_A1 / I2C2_SCL/
EVENTOUT
USART2_CTS/ UART4_TX/
45
PA0WKUP(2)
I/O
FT
PA0-WKUP
ETH_MII_CRS /
ADC123_IN0/
TIM2_CH1_ETR/ TIM5_CH1
WKUP
/ TIM8_ETR/ EVENTOUT
USART2_RTS / UART4_RX/
ETH_RMII_REF_CLK /
46
PA1(2)
I/O
FT
PA1
ETH_MII_RX_CLK /
ADC123_IN1
TIM5_CH2 / TIM2_CH2/
EVENTOUT
47
PA2(2)
I/O
FT
PA2
USART2_TX/TIM5_CH3 /
ADC123_IN2
Pins
Name
Type IO level
Main function
Alternate functions
(after reset)
Other
functions
TIM9_CH1 / TIM2_CH3 /
ETH_MDIO/EVENTOUT
USART2_RX/TIM5_CH4 /
48
PA3(2)
I/O
FT
TIM9_CH2 / TIM2_CH4 /
PA3
OTG_HS_ULPI_D0 /
ADC123_IN3
ETH_MII_COL/ EVENTOUT
49
GND
GND
1.
FT = 5 V tolerant; TT = 3.6 V tolerant.
2.
FT = 5 V tolerant except when in analog mode or oscillator mode (for PC14,
PC15, PH0 and PH1).
3.
I = input, O = output, S = supply.
4.
STM32 peripherals are not listed if they cannot be presented on current pins
2.3
Pin Arrangement for peripherals
Some of STM32 peripherals are not listed if their main function is not usable on
EMW3161.
USART1(AF7)
TX
USART2(AF7)
RX
TX
RX
CTS
20
PA9
21 PA10 47
PA2
48
PA3
28
PB6
29
PD5 25
PD6
PB7
24
I2C1(AF4)
SCL
28
45
RTS
PA0
46
29
SCL
PB7
SDA
SCK
PA4
PA4
TX
45
PA0
RX
46
PA1
39
PF1
38
PB10
SMBA
PF0
PB12
SPI1(AF5)
NSS
PA1
CK
I2C2(AF4)
SDA
PB6
USART4(AF8)
PA5
SPI2(AF5)
MISO
MOSI
PA6
NSS
PA7
SCK
MOSI
MISO
33
PI0
32
PI1
34
PI3
31
PI2
PB12
PB10
PB15
PB14
IIS2(AF5)
WS
SCK
SD
MCK
33
PI0
32
PI1
34
PI3
PB12
PB10
PB15
USB_HS(AF12)
DP
CAN2(AF9)
DM
PB15
PC6
TX
PB14
28
RX
PB6
PB12
DCMI(AF13)
HSYNC
PA4
10 PH8
PIXCK
VSYNC
D0
D1
D2
D3
D4
D5
D6
D7
PA6 29 PB7 11 PH9 12 PH10 13 PH11 14 PH12 15 PH14 16 PI4 18 PI6 19 PI7
17 PI5 20 PA9 21 PA10
PC6
28 PB6 35 PE5 36 PE6
ADC123(AF14)
IN0
IN1
IN2
ADC12(AF14)
IN3
IN4
IN5
IN6
ADC3(AF14)
IN7
45 PA0 46 PA1 47 PA2 48 PA3 1 PA4 2 PA5 3 PA6 4 PA7
DAC1(AF14)
DAC2(AF14)
OUT
OUT
2.4
PA4
PA5
Typical Pin Arrangement
IN7
37
PF9
3
Electrical Parameters
3.1
Absolute maximum ratings:
3.1.1
Voltage & Current
Stresses above the absolute maximum ratings may cause permanent damage to the
device. These are stress ratings only and functional operation of the device at these
conditions is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.
Symbol
Ratings
Min
Max
Unit
VDD–VSS
Voltage
–0.3
4.0
VIN
Input voltage on five volt tolerant pin
VSS −0.3
5.5
VIN
Input voltage on any other pin
VSS −0.3
VDD+0.3
Symbol
Ratings
Max
Unit
IVDD
Total current into VDD power lines (source)
320
mA
IVSS
Total current out of VSS ground lines (sink)
320
Output current sunk by any I/O and control pin
25
Output current source by any I/O and control pin
-25
IIO
3.2
Operating conditions
3.2.1
Voltage & Current
Symbol
Note
VDD
Voltage
Conditions
Specification
Min.
2.4
10
Typical Max. Unit
3.3
3.5
WLAN Subsystem
Symbol
Note
IRF
Conditions
Typical
Unit
OFF1
μA
IRF
SLEEP4
200
μA
IRF
Rx(Listen)2
52
mA
IRF
Rx(Active)3
59
mA
IRF
Power Save5 6
1.9
mA
IRF
Tx CCK7 10
11 Mbps at 18.5 dBm
320
mA
IRF
Tx
OFDM8 10
54 Mbps at 15.5 dBm
270
mA
IRF
Tx OFDM9 10
65 Mbps at 14.5 dBm
260
mA
Note 1: Power is off.
Note 2: Carrier Sense (CCA) when no carrier present
Note 3: Carrier Sense (CS) detect/Packet Rx
Note 4: Intra-beacon Sleep
Note 5: Beacon Interval = 102.4ms, DTIM = 1, Beacon duration = 1 ms @1 Mbps.
Integrated Sleep + wakeup + Beacon Rx current over 1 DTIM interval.
Note 6: In WLAN power-saving mode, the following blocks are powered down:
Crystal oscillator, Baseband PLL, AFE, RF PLL, Radio
Note 7: CCK power at chip port. Duty cycle is 100%. Includes PA contribution.
Note 8: OFDM power at chip port. Duty cycle is 100%. Includes PA contribution.
Note 9: OFDM power at chip port is 16 dBm, duty cycle is 100%, includes PA
contribution.
Note 10: Absolute junction temperature limits maintained through active thermal
monitoring and dynamic Tx duty cycle limiting.
11
Microcontroller Subsystem
Typical and maximum current consumption in Run mode, code with data processing
running from Flash memory (ART accelerator enabled) or RAM
Symbol
Conditions
Running Mode
Sleep Mode
TA=25°C
TA=25°C
120MHz
49
38
90MHz
38
30
60MHz
26
20
30MHz
14
11
25MHz
11
16MHz
8MHz
3.6
4MHz
2.4
2MHz
1.9
120MHz
21
90MHz
17
60MHz
12
30MHz
3.5
25MHz
2.5
16MHz
2.1
8MHz
2.5
1.7
4MHz
1.5
2MHz
1.6
1.4
fHCLK
External clock, all
peripherals enabled
IMCU
External clock, all
peripherals disabled
Unit
mA
Typical and maximum current consumptions in Stop mode
Symbol
Parameter
Conditions
Typ
Max
TA=25°C TA=25°C
Unit
Flash in Stop mode, low-speed and
Supply current in
Stop mode with
main regulator in
Run mode
high-speed internal RC oscillators and
high-speed oscillator OFF (no
0.55
1.2
0.5
1.2
independent watchdog).
Flash in Deep power down mode, lowspeed and high-speed internal RC
oscillators and high-speed oscillator OFF
(no independent watchdog).
IMCU
mA
Flash in Stop mode, low-speed and
Supply current in
Stop mode with
main regulator in
Low Power mode
high-speed internal RC oscillators and
high-speed oscillator OFF (no
0.35
1.1
0.3
1.1
independent watchdog).
Flash in Deep power down mode, lowspeed and high-speed internal RC
oscillators and high-speed oscillator OFF
(no independent watchdog).
12
Typical and maximum current consumptions in Standby mode
Symbol
Parameter
Supply current
IMCU
Typ
Conditions
in Standby
mode
TA=25°C
Backup SRAM ON, low-speed oscillator and RTC ON
4.0
Backup SRAM OFF, low-speed oscillator and RTC ON
3.3
Backup SRAM ON, RTC OFF
3.0
Backup SRAM OFF, RTC OFF
2.2
Unit
μA
Power consumption in typical operation modes3
Symbol Parameter
Min
Conditions
TA=25°C
Imodule
consumption
on EMW3161
module
Max
TA=25°C TA=25°C
Unit
2.8
7.2
73.5
mA
2.8
12
262
mA
Send data in UDP mode, 20k bps1
24
280
mA
RF off, MCU enter standby mode2
μA
52
74
320
mA
No Wi-Fi data is transmitting1
Total power
Average
Receive data in UDP mode, 20k bps
Connecting to AP
Note1: TA=25°C, MCU frequency=120MHz, with data processing running from Flash
memory (ART accelerator enabled). Firmware process TCP/IP stack and IEEE 802.11 MAC
every 250 milliseconds, enter stop mode when no task is pending.
RF subsystem is connected to an access point and run under power save mode in
IEEE 802.11n@14.5 dBm Tx power. AP Beacon Interval = 102.4ms, DTIM = 1.
Note2: Wi-Fi connection is disconnected.
Note3: These data may not be the same depend on different firmware functions.
3.3
Digital I/O port characteristics
3.3.1
Output voltage levels
Symbol
Note
VOL
VOH
VOL
VOH
UART& IO
Parameter
Conditions
Output low level voltage
IIO= +8 mA
Min.
Max. Unit
0.4
Output high level voltage 2.7 V < VDD < 3.6 V VDD-0.4
output voltage Output low level voltage
IIO= +20 mA
Output high level voltage 2.7 V < VDD < 3.6 V VDD-1.3
13
1.3
3.3.2
Output voltage levels
Symbol
Note
Parameter
Conditions
Max.
Unit
-0.5
0.8
VDD+0.5
5.5
-0.5
0.35VDD
0.65VDD
VDD+0.5
Input low level voltage
VIL
Input high level voltage
VIH
UART& IO
Input high level voltage
input voltage
(5V input tolerant)
VIL
Input low level voltage
VIH
Input high level voltage
3.3.3
Min.
TTL level
CMOS level
nRESET pin characteristics
The nRESET pin input driver uses CMOS technology. EMW3161 contains RC
(resistance-capacitance) reset circuit which ensures the module reset accurately when it
powers up. If you need to reset manually, just connect the external control signals to the
reset pins directly, but the control signal should be Open Drain Mode。
Symbol
Item
VIL(NRST)
nRESET input low level
–0.5
0.8
VIH(NRST)
nRESET input high level
VDD+0.5
RPU
Resistor for Pulling up
CPD
Capacitor for charging and Resetting
3.4
Conditions
VIN= VSS
Min.
Typical
7.5
Max.
8.3
kΩ
100
1000
pF
Other MCU electrical parameters
Temperature and Humidity
Symbol
Ratings
Max
Unit
TSTG
Storage temperature
–55 to +125
℃
TA
Working temperature
-40 to +85
℃
Humidity
Non condensing, relative humidity
Max. 95%
14
Please refer to STM32F215RGT6 data sheet.
3.5
Unit
3.6
ESD
Absolute maximum ratings: The Electromagnetic Environment Electrostatic discharge
Symbol
Ratings
Electrostatic discharge voltage
VESD(HBM)
(human body model)
Electrostatic discharge voltage
VESD(CDM)
3.7
Conditions
(charge device model)
Class Max Unit
TA= +25 °C
conforming to
2000
JESD22-A114
TA = +25 °C
conforming to
II
500
JESD22-C101
Static latch-up
These tests are compliant with EIA/JESD 78A IC latch-up standard.
Symbol
Parameter
Class
Class
LU
Static latch-up class
TA= +105 °C conforming to JESD78A
II level A
3.8
RF characteristics
3.8.1
Basic RF characteristics
Item
Specification
Operating Frequency
FCC:2412~2462MHz CE:2412-2472MHz
Wi-Fi Standard
802.11b/g/n(single stream n)
11b: DBPSK, DQPSK,CCK for DSSS
Modulation Type
11g: BPSK, QPSK, 16QAM, 64QAM for OFDM
11n: MCS0~7,OFDM＊
11b:1, 2, 5.5 and 11Mbps
Data Rates
11g:6, 9, 12, 18, 24, 36, 48 and 54 Mbps
11n: MCS0~7, up to 72Mbps
Antenna type
One U.F.L connector for external antenna
PCB printed ANT (Reserve)
15
3.8.2
IEEE802.11b mode
Item
Specification
Modulation Type
DSSS / CCK
Frequency range
FCC:2412MHz~2462MHz CE:2412MHz-2472MHz
Channel
CH1 to CH14
Data rate
1, 2, 5.5, 11Mbps
TX Characteristics
Min.
Typical
Max.
Unit
Transmitter Output Power
11bTarget Power
18.5
dBm
Spectrum Mask @ target power
fc +/-11MHz to +/-22MHz
-30
dBr
fc > +/-22MHz
-50
dBr
＋20
ppm
Frequency Error
-20
Constellation Error( peak EVM)@ target power
1~11Mbps
-17
-10
Typical
Max.
Unit
1Mbps (FER≦8%)
-97
-83
dBm
2Mbps (FER≦8%)
-93
-80
dBm
5.5Mbps (FER≦8%)
-91
-79
dBm
11Mbps (FER≦8%)
-89
-76
dBm
RX Characteristics
Min.
Minimum Input Level Sensitivity
-10
Maximum Input Level (FER≦8%)
3.8.3
dBm
IEEE802.11g mode
Item
Specification
Modulation Type
OFDM
Frequency range
2400MHz~2484MHz
Channel
CH1 to CH14
Data rate
6, 9, 12, 18, 24, 36, 48, 54Mbps
TX Characteristics
Min.
Transmitter Output Power
16
Typical
Max.
Unit
11gTarget Power
15.5
dBm
Spectrum Mask @ target power
fc +/-11MHz
-20
dBr
fc +/-20MHz
-28
dBr
fc > +/-30MHz
-40
dBr
＋20
ppm
6Mbps
-5
dB
9Mbps
-8
dB
12Mbps
-10
dB
18Mbps
-13
dB
24Mbps
-16
dB
36Mbps
-19
dB
48Mbps
-22
dB
-25
dB
@ 11MHz
-20
dBr
@ 20MHz
-28
dBr
@ 30MHz
-40
dBr
Typical
Max.
Unit
6Mbps (FER≦10%)
-90
-82
dBm
9Mbps (FER≦10%)
-88
-87
dBm
12Mbps (FER≦10%)
-86
-79
dBm
18Mbps (FER≦10%)
-85
-77
dBm
24Mbps (FER≦10%)
-82
-74
dBm
36Mbps (FER≦10%)
-79
-70
dBm
48Mbps (FER≦10%)
-75
-66
dBm
54Mbps (FER≦10%)
-72
-65
dBm
Frequency Error
-20
Constellation Error( peak EVM)@ target power
54Mbps
-30
Transmit spectrum mask
RX Characteristics
Min.
Minimum Input Level Sensitivity
Maximum Input Level (FER≦10%)
3.8.4
-20
dBm
IEEE802.11n 20MHz bandwidth mode
Item
Modulation Type
Specification
MIMO-OFDM
17
Channel
CH1 to CH14
Data rate
MCS0/1/2/3/4/5/6/7
TX Characteristics
Min.
Typical
Max.
Unit
Transmitter Output Power
11n HT20 Target Power
14.5
dBm
Spectrum Mask @ target power
fc +/-11MHz
-20
dBr
fc +/-20MHz
-28
dBr
fc > +/-30MHz
-45
dBr
＋25
ppm
MCS0
-5
dBm
MCS1
-10
dBm
MCS2
-13
dBm
MCS3
-16
dBm
MCS4
-19
dBm
MCS5
-22
dBm
MCS6
-25
dBm
-28
dBm
@ 11MHz
-20
dBr
@ 20MHz
-28
dBr
@ 30MHz
-40
dBr
Typical
Max.
Unit
MCS0 (FER≦10%)
-89
-82
dBm
MCS1 (FER≦10%)
-86
-79
dBm
MCS2 (FER≦10%)
-84
-77
dBm
MCS3 (FER≦10%)
-82
-74
dBm
MCS4 (FER≦10%)
-78
-70
dBm
MCS5 (FER≦10%)
-74
-66
dBm
MCS6 (FER≦10%)
-72
-65
dBm
MCS7 (FER≦10%)
-69
-64
dBm
Frequency Error
-25
-1.2
Constellation Error( peak EVM)@ target power
MCS7
-32
Transmit spectrum mask
RX Characteristics
Min.
Minimum Input Level Sensitivity
Maximum Input Level (FER≦10%)
-20
18
dBm
3.9
Mechanical Dimensions
3.9.1
EMW3161 Mechanical Dimensions
Figure 3.1 EMW3161 top view (Metric units)
19
4
Antenna information
There is co-layout design (C35&C32) for antenna connection. Please order your
module carefully. Users can also modify the capacitor position but MXCHIP would not
take any responsibility for this behavior.
EMW3161-E load the capacitor C35 (10pF/0201), it means can use U.F.L RF connector
for external antenna. If want to use on-board chip antenna, just need load the capacitor
from C35 to C32 (EMW3161-C).
In order to get the maximum performance, strongly suggest customer use external
antenna connected with U.F.L RF connector.
4.1
Minimizing radio interference
When integrating the Wi-Fi module with on board PCB printed antenna, make sure
the area around the antenna end the module protrudes at least 15mm from the mother
board PCB and any metal enclosure. If this is not possible use the on board U.FL
connector to route to an external antenna.
The area (6.5mmx17.3mm) under the antenna end of the module should be keep
clear of metallic components, connectors, vias, traces and other materials that can
interfere with the radio signal.
15mm
15mm
20
4.2
U.F.L RF Connector
This module use U.F.L type RF connector for external antenna connection.
21
5
Others
5.1
Recommended Reflow Profile
Reflow times<= 2times (Max.)
5.2
MSL/Storage Condition
22
6
Sales Information
If you need to buy this product, please call MXCHIP during the working hours.
(Monday ~ Friday A.M.9:00~12:00; P.M. 1:00~6:00)
Telephone: +86-21-52655026 / 52655025
Address: Room 811, Tongpu Building, No.1220 Tongpu Road, Shanghai
Post Code: 200333
Email: sales@mxchip.com
Technical Support
If you need to get the latest information on this product or our other product
information, you can visit: http://www.mxchip.com/
If you need to get technical support, please call us during the working hours:
ST ARM technical support
+86 (021)52655026-822 Email: support@mxchip.com
Wireless network technical support
+86 (021)58655026-812 Email: support@mxchip.com
Development tools technical support
+86 (021) 52655026-822 Email: support@mxchip.com
23

---

Source Exif Data:

File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.6
Linearized                      : No
Author                          : William Xu
Create Date                     : 2013:07:17 23:54:07+08:00
Keywords                        : DS0005;EMW3161
Modify Date                     : 2013:12:18 10:02:29+08:00
Language                        : en-US
Tagged PDF                      : Yes
XMP Toolkit                     : Adobe XMP Core 4.2.1-c041 52.342996, 2008/05/07-20:48:00
Format                          : application/pdf
Creator                         : William Xu
Title                           : DS0005E_EMW3161_v1.0
Creator Tool                    : Microsoft® Word 2013
Metadata Date                   : 2013:12:18 10:02:29+08:00
Producer                        : Microsoft® Word 2013
Document ID                     : uuid:70344b5a-247f-4db3-bf1f-7c0f10947801
Instance ID                     : uuid:8aa65fe3-9b2b-45ca-b000-991a1aa5c1f7
Page Count                      : 26

EXIF Metadata provided by EXIF.tools