Microchip Technology BM23SPKXYC2A Bluetooth Modulel User Manual Manual
Microchip Technology Inc. Bluetooth Modulel Manual
Manual
BM23SPKA1NB9
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park, Hsinchu city 30077, Taiwan, R.O.C Version:0.94
Phone: 886-3-577-8385 10/27/2014
Fax: 886-3-577-8501
BM23SPKA1NB9
Bluetooth 4.1 Digital Audio Interface Module
BM23SPKA1NB9
Version: 0.94 - 2 - 22/9/2014
Product Description
The ISSC BM23SPKA1NB9 is a highly integrated Bluetooth 4.1 digital audio
output module, designed for high data rate, short-range wireless
communication in the 2.4 GHz ISM band. With the build-in ISSC Bluetooth
stack, profile and digital audio interface, the ISSC BM23SPKA1NB9 can
combine the external DSP and codec to provide high performance Bluetooth
audio.
Features
Main Chip: ISSC IS2023S(ROM version)
Bluetooth 4.1 EDR compliant
Max. +4dBm Class 2 output power
Receiver Sensitivity: GFSK typical -90dBm, π/4 PSK typical -91dBm,
8DPSK typical -84dBm
Piconet and Scatter net support
CVSD, A-law, -law, mSBC CODEC algorithms for voice applications
SBC/AAC decode for Bluetooth audio streaming
Microphone input and audio line-in support
Built-in four language voice prompt (Chinese/English/Spanish/French)
Support PCM and I2S digital audio interface
Built-in 350mAH Li-ion battery charger
HSP, HFP, A2DP, AVRCP,SPP profiles supported
3.3V operating voltage
Built-in program ROM and 64Kb EEPROM
43 pins for SMT module Size: 15mmx29mm2
Built-in PCB Antenna
RoHS compliant
FCC certification
BM23SPKA1NB9
Version: 0.94 - 3 - 22/9/2014
Module Pin Out Diagram
BM23SPKA1NB9
BM23SPKA1NB9
Version: 0.94 - 4 - 22/9/2014
BM23SPKA1NB9
Version: 0.94 - 5 - 22/9/2014
Pin Definition for ROM module
Pin No.
I/O
Name
Description
1
I/O
P00
GPIO, default pull-low input.
UART_TX_IND: BT Module use to inform MCU
2
I/O
RFS0
Receive frame synchronization
3
I/O
TFS0
Transmit frame synchronization
4
I/O
SLK0
Serial clock
5
I
DR0
Serial data receive
6
O
DT0
Serial data transmit
7
I/O
P04
GPIO, default pull-high input
8
I
EAN
Embedded ROM/External Flash enable
High: ROM mode;
Low: External Flash mode
9
AI
MIC1_P
Mic 1 mono differential analog positive input
10
AI
MIC1_N
Mic 1 mono differential analog negative input
11
AP
MIC_BIAS
Power output, microphone biasing voltage
12
AP
VDDA
Power output, reserve for external cap to fine tune
audio frequency response, no need to add power
to this pin
13
AI
AIR
Stereo analog line in, R-channel
14
AI
AIL
Stereo analog line in, L-channel
15
P
GND
Ground
16
I/O
RST_N
System Reset Pin,
Low: reset
17
--
NC
--
18
--
NC
--
19
P
VDDIO
Power output, VDDIO pin, no need to add power to
this pin
20
I/O
P15
GPIO, default pull-high input
21
I/O
P01
GPIO, default pull-high input
22
P
ADAP_IN
Power adaptor input
23
P
BAT_IN
Battery input
24
P
AMB_DET
ADC analog input 1
BM23SPKA1NB9
Version: 0.94 - 6 - 22/9/2014
25
P
SYS_PWR
System Power Output
BAT mode: 3.3~4.2V
Adapter mode: 4.0V
26
P
BK_OUT
Power output, 1v8 pin, no need to add power to this
pin
27
P
MFB
1. Power key when in off mode
2. UART_RX_IND: MCU use to wakeup BT
28
P
LED1
LED Driver 1, 4mA max
29
P
LED2
LED Driver 2, 4mA max
30
I/O
P24
GPIO, default input with internal pull high
System Configuration: (with the combination of P20
and EAN)
Low: boot Mode when P20=low, EAN=high
31
I/O
P02
GPIO, default pull-high input
32
I/O
P03
GPIO, default pull-high input
33
O
HCI_TXD
HCI TX data, output pin, BT to send data
34
I
HXI_RXD
HCI RX data, input pin, BT to receive data
35
I/O
P05
GPIO, default pull-high input
36
I/O
P27
GPIO, default pull-high input
37
I/O
P20
GPIO, default pull-high input
38
I/O
P30
GPIO, default pull-high input
39
I/O
P20
GPIO, default pull-high input
System Configuration, H: Application L:
Baseband(IBDK Mode)
40
P
GND
Ground.
41
A
ANT1
Antenna enhancement .
42
A
ANT2
Antenna enhancement .
43
A
ANT3
Antenna enhancement .
BM23SPKA1NB9
Version: 0.94 - 7 - 22/9/2014
Digital Audio Interface
Support I2S and PCM interface
Sampling Rate : 8K, 44.1K, 48K
Word Length: 16 bits, 24 bits
4 application modes
BM23SPKA1NB9
Version: 0.94 - 8 - 22/9/2014
Mode 1: I2S Master
BCLK
ADCLRC
DACLRC
ADCDAT
DACDAT
Slave
SCLKn
RFSn
TFSn
DRn
DTn
Master
External CODEC/DSP BM23
DAC
ADC
ADC
Bn-1
RFSn/TFSn
SCLKn
DRn/DTn Bn-2 B1B0Bn-1 Bn-2 B1B0
Left Channel Right Channel
1/fs
Word Length
Or
Solutions with mic and line-in analog input with I2S audio output
Mic for Bluetooth SCO link
Line-in for external audio playback(for high SNR requirement)
BCLK
ADCLRC
DACLRC
ADCDAT
DACDAT
Slave
SCLKn
RFSn
TFSn
DRn
DTn
Master
External CODEC/DSP BM23
Application 1
DAC
LineIn
BM23SPKA1NB9
Version: 0.94 - 9 - 22/9/2014
Mode 2: I2S Slave
BCLK
ADCLRC
DACLRC
ADCDAT
DACDAT
Master
SCLKn
RFSn
TFSn
DRn
DTn
Slave
External CODEC/DSP BM23
DAC
ADC
ADC
Bn-1
RFSn/TFSn
SCLKn
DRn/DTn Bn-2 B1B0Bn-1 Bn-2 B1B0
Left Channel Right Channel
1/fs
Word Length
Or
Solutions with mic and line-in analog input with I2S audio output
Mic for Bluetooth SCO link
Line-in for external audio playback(for high SNR requirement)
BCLK
ADCLRC
DACLRC
ADCDAT
DACDAT
Master
SCLKn
RFSn
TFSn
DRn
DTn
Slave
External CODEC/DSP BM23
Application 1
DAC
LineIn
BM23SPKA1NB9
Version: 0.94 - 10 - 22/9/2014
Mode 3: PCM master
BCLK
ADCLRC
DACLRC
ADCDAT
DACDAT
Slave
SCLKn
RFSn
TFSn
DRn
DTn
Master
External CODEC/DSP BM23
DAC
ADC
ADC
Bn-1
RFS0/TFS0
SCLK0
DR0/DT0 Bn-2 B1B0Bn-1 Bn-2 B1B0
Left Channel
1/fs
Word Length
Right Channel
BM23SPKA1NB9
Version: 0.94 - 11 - 22/9/2014
Mode 4: PCM slave
BCLK
ADCLRC
DACLRC
ADCDAT
DACDAT
Master
SCLKn
RFSn
TFSn
DRn
DTn
Slave
External CODEC/DSP BM23
DAC
ADC
ADC
Bn-1
RFS0/TFS0
SCLK0
DR0/DT0 Bn-2 B1B0Bn-1 Bn-2 B1B0
Left Channel
1/fs
Word Length
Right Channel
BM23SPKA1NB9
Version: 0.94 - 12 - 22/9/2014
Outline Dimension (Module Foot print)
BM23SPKA1NB9
Version: 0.94 - 13 - 22/9/2014
Electrical Characteristics
Table 1: Absolute Maximum Voltages
Rating
Min
Max
Storage Temperature
-40ºC
+85ºC
ESD: Human Body Mode
±2KV
ESD: Machine Mode
±200V
ESD: Charge Device Mode
±400V
Core supply voltage
VDD_CORE,
AVDD_PLL
1.14V
1.26V
RF supply voltage
VCC_RF
1.28V
SAR supply voltage
AVDD_SAR
1.62V
1.98V
Codec supply voltage
VDD_AUDIO
2.7V
3.0V
I/O voltage
VDD_IO
3.6V
Supply voltage
BK_VDD
4.3V
3V1_VIN
4.3V
BAT_IN
3.0
4.3V
ADAP_IN
4.5
7.0V
LED
5.1V
Power switch
7.0V
Table 2: Recommended operate condition
Rating
Min
Typ
Max
Storage Temperature
-10ºC
+25ºC
+60ºC
Core supply voltage
VDD_CORE,
AVDD_PLL
1.14V
1.2V
1.26V
RF supply voltage
VCC_RF
1.28V
SAR supply voltage
AVDD_SAR
1.62V
1.8V
1.98V
Codec supply voltage
VDD_AUDIO
2.7V
3.0V
I/O voltage
VDD_IO
2.7V
3.0V
3.3V
Supply voltage
BK_VDD
3V
4.3V
3V1_VIN
3V
4.3V
BAT_IN
3V
4.3V
BM23SPKA1NB9
Version: 0.94 - 14 - 22/9/2014
ADAP_IN
4.5V
7.0V
LED
4.3V
Power switch
1.8V
7.0V
Table 3: BUCK switching regulator
Normal Operation
Min
Typ
Max
Unit
Operation Temperature
-40
85
℃
Input Voltage (VIN)
3.0
3.8
4.5
V
Output Voltage (VOUT)
(ILOAD=70mA, VIN=4V)
1.7
1.80
2.05
V
Output Voltage Accuracy
±5
%
Output Voltage Adjustable Step
50
mV/Step
Output Adjustment Range
-0.1
+0.25
V
Output Ripple
10
15
mV RMS
Average Load Current (ILOAD)
120
mA
Settling Time
(start-up time)
EN or VIN to VOUT
1.2
2
ms
Conversion
efficiency
@BAT=3.8V
ILOAD = 50mA
88
%
ILOAD ≥ 10mA (PWM)
70
ILOAD ≥ 10mA (PFM)
80
ILOAD ≥ 250μA
(PFM)
65
70
Switching Frequency
800
KHz
PWM/PFM Switching Point
by F/W
mA
Start-up Current Limit
0
50
210
mA
Start-up Inrush
Current
ILOAD = 10mA
400
mA
Quiescent Current
PWM
1000
μA
PFM
30
40
Output Current (Peak)
200
mA
Load Regulation (ILOAD = 10 ~ 100mA)
1
mV/mA
Line Regulation (3.2V < VIN < 4.2V)
0.03
%/V
BM23SPKA1NB9
Version: 0.94 - 15 - 22/9/2014
(30)
(mV/V)
EN threshold
Logic Low Voltage
(VIL)
0.4
V
Logic High Voltage
(VIH)
1.62
V
EN current
10
nA
Shutdown Current *1
<1
μA
Table 4: Low Drop Regulation
Normal Operation
Min
Typ
Max
Unit
Operation Temperature
-40
85
℃
Input Voltage (VIN)
3.0
4.5
V
Output Voltage (VOUT)
(1) VOUT_CODEC
(2) VOUT_IO
VOUT = 2.9V
(2.4~3.4V)
2.9
V
VOUT = 1.8V
(1.3~2.3V)
1.8
Accuracy (VIN=3.7V, ILOAD=100mA, 27’C)
±5
%
Output Voltage Adjustable Step
67
100
mV/Step
Output Adjustment Range
±0.5
V
Start-up Inrush
Current
ILOAD=10mA
200
400
mA
Settling Time
(start-up time)
EN or VIN to VOUT
250
500
μs
Output Current
(Average)
VOUT
100
mA
Output Current
(Peak)
VOUT
150
mA
Drop-Out Voltage (ILOAD = maximum output
current)
300
mV
Quiescent Current (excluding load, ILOAD <
1mA)
45
μA
Quiescent Current (excluding load, ILOAD <
100μA)
N/A
μA
Load Regulation (Iload = 0mA to 100mA), Δ
VOUT
40
(0.4)
mV
(mV/mA)
BM23SPKA1NB9
Version: 0.94 - 16 - 22/9/2014
Note: 0.4(mV/mA) * (100mA-0mA)=40mV
Line Regulation (VOUT+0.3V<VIN<4.5V
7
10
mV/V
EN threshold
Logic Low Voltage
(VIL)
0.4
V
Logic High Voltage
(VIH)
1.62
V
EN current
10
nA
Shutdown Current (*1)
<1
μA
Table 5: Battery Charger
Charging Mode (BAT_IN rising to 4.2V)
Min
Typ
Max
Unit
Operation Temperature
-40
85
℃
Input Voltage (VIN)
Note: It needs more time to get battery fully charged when
VIN=4.5V
4.5
5.0
7.0
V
Supply current to charger only
3
4.5
mA
Battery trickle charge current
(BAT_IN < trickle charge voltage threshold)
0.1C
mA
Maximum Battery
Fast Charge Current
Note: ENX2=0
Headroom > 0.7V
(ADAP_IN=5V)
170
200
240
mA
Headroom = 0.3V
(ADAP_IN=4.5V)
160
180
240
mA
Maximum Battery
Fast Charge Current
Note: ENX2=1
Headroom > 0.7V
(ADAP_IN=5V)
330
370
420
mA
Headroom = 0.3V
(ADAP_IN=4.5V)
180
220
270
mA
Minimum Step
1
mA
Trickle Charge Voltage Threshold
3
V
Float Voltage
4.158
4.2
4.242
V
Battery Charge Termination Current,
% of Fast Charge Current
10
%
Standby Mode (BAT_IN falling from 4.2V)
Supply current to charger only
2
4
mA
BM23SPKA1NB9
Version: 0.94 - 17 - 22/9/2014
Battery Current
-1
μA
Battery Recharge Current
Note: C Battery Capacity (*1)
0.25C
mA
BM23SPKA1NB9
Version: 0.94 - 18 - 22/9/2014
Table 6: Audio codec ADC
Conditions
Min
Typ
Max
Unit
Temperature
-40
25
85
℃
Resolution
16
Bits
Input sample rate, Fsample
8KHz for MIC
44.1KHz for Line-in
8
44.1
KHz
Signal to Noise Ratio
(SNR @MIC or Line-in
mode)
fin=1KHz
B/W=20~20KHz
A-weighted
THD+N < 1%
150mVpp input
8KHz
90
dB
44.1KHz
90
Digital Gain
-54
4.85
dB
Digital Gain Resolution
2~6
dB
MIC Boost Gain
20
Analog Gain
60
dB
Analog Gain Resolution
2.0
dB
Input full-scale at maximum
gain (differential)
4
mV rms
Input full-scale at minimum
gain (differential)
800
mV rms
3dB bandwidth
20
KHz
Microphone mode
input impedance
Input impedance
6
10
KΩ
Input capacitance
20
pF
THD+N (microphone input)
@30mVrms input
0.02
%
THD+N (line input)
0.04
%
ADC channels
2
Analog supply voltage
2.6
2.8
3.0
V
Digital supply voltage
1.08
1.2
1.32
V
BM23SPKA1NB9
Version: 0.94 - 19 - 22/9/2014
Table 7: Transmitter section for BDR (25℃)
Min
Typ
Max
Bluetooth
specification
Unit
Maximum RF transmit power
4.0
5.0
-6 to 4
dBm
RF power variation over temperature
range with compensation enabled
±1.0
dB
RF power variation over temperature
range with compensation disabled
±2.0
dB
RF power control range
18
≥16
dB
RF power range control resolution
±0.5
dB
20dB bandwidth for modulated
carrier
925
≤1000
KHz
ACP
Note:
F0=2441MHz
F = F0±2MHz
-42
-40
≤-20
dBm
F = F0±3MHz
-49
-48
≤-40
dBm
F = F0±>3MHz
-57
-53
≤-40
dBm
∆f1avg maximum modulation
145
175
140<∆f1avg<175
KHz
∆f2max maximum modulation
120
135
140
≥115
KHz
∆f2avg/∆f1avg
0.9
0.95
≥0.80
ICFT
4.5
8
10.5
±75
KHz
Drift rate
3.3
5
7.0
≤20
KHz/50
us
Drift (single slot packet)
12
≤40
KHz
2nd harmonic content
-42
≤-30
dBm
3rd harmonic content
-45
≤-30
dBm
BM23SPKA1NB9
Version: 0.94 - 20 - 22/9/2014
Table 8 Transmitter section for EDR (25℃)
Min
Typ
Max
Bluetooth
specification
Unit
Relative transmit power
-1.2
-4 to 1
dB
π/4 DQPSK max
carrier frequency
stability
|ωo|
freq. error
2.5
5
≤10 for all
blocks
KHz
|ωi|
initial freq.
error
2.5
5
≤75 for all
blocks
KHz
|ωo+ωi|
block freq.
error
5
10
≤75 for all
blocks
KHz
8DPSK max carrier
frequency stability
|ωo|
freq. error
2.5
5
≤10 for all
blocks
KHz
|ωi|
initial freq.
error
2.5
5
≤75 for all
blocks
KHz
|ωo+ωi|
block freq.
error
5
10
≤75 for all
blocks
KHz
π/4 DQPSK
modulation accuracy
RMS DEVM
7
12.2
≤20
%
99% DEVM
PASS
≤30
%
Peak DEVM
25
≤35
%
8DQPSK
modulation accuracy
RMS DEVM
7
≤13
%
99% DEVM
PASS
≤20
%
Peak DEVM
20
≤25
%
In-band spurious
emissions
Note: F0=2441MHz
F > F0+3MHz
<-52
≤-40
dBm
F < F0-3MHz
<-53
≤-40
dBm
F = F0-3MHz
-46
≤-40
dBm
F = F0-2MHz
-34
≤-20
dBm
F = F0-1MHz
-34
≤-26
dBm
F = F0+1MHz
-37
≤-26
dBm
F = F0+2MHz
-34
≤-20
dBm
BM23SPKA1NB9
Version: 0.94 - 21 - 22/9/2014
F = F0+3MHz
-46
≤-40
dBm
EDR differential phase encoding
100
≥99
%
Table 9 Receiver section for BDR (25℃)
Frequency
(GHz)
Min
Typ
Max
Bluetooth
specification
Unit
Sensitivity at 0.1%
BER for all basic rate
packet types
2.402
-90
≤-70
dBm
2.441
-90
2.480
-90
Maximum received signal at 0.1%
BER
0
≥-20
dBm
Continuous power
required to block
Bluetooth reception
(for input power of
-67dBm with 0.1%
BER) measured at the
unbalanced port of the
balun
0.030–2.000
-7
-10
dBm
2.000-2.400
-10
-27
2.500-3.000
-11
-27
3.000-12.75
-7
-10
C/I co-channel
6
≤11
dB
Adjacent channel
selectivity C/I
Note: F0=2441MHz
F =
F0+1MHz
-6
≤0
dB
F =
F0-1MHz
-6.5
≤0
dB
F =
F0+2MHz
-36
≤-30
dB
F =
F0-2MHz
-28
≤-9
dB
F =
F0-3MHz
-31
≤-20
dB
F =
F0+5MHz
-48
≤-40
dB
F = Fimage
-28
≤-9
dB
Maximum level of intermodulation
-37
≥-39
dBm
BM23SPKA1NB9
Version: 0.94 - 22 - 22/9/2014
interferers
Spurious output level
N/A
dBm/Hz
BM23SPKA1NB9
Version: 0.94 - 23 - 22/9/2014
Table 10: Receiver section for EDR (25℃)
Frequency
(GHz)
Modulation
Min
Typ
Max
Bluetooth
specification
Unit
Sensitivity at
0.01% BER
2.402
π/4
DQPSK
-91
≤-70
dBm
2.441
π/4
DQPSK
-91
2.480
π/4
DQPSK
-91
2.402
8DPSK
-85
≤-70
dBm
2.441
8DPSK
-84
2.480
8DPSK
-85
Maximum received signal at
0.1% BER
π/4
DQPSK
-10
≥-20
dBm
8DPSK
-10
≥-20
C/I co-channel at 0.1% BER
π/4
DQPSK
10
≤13
dB
8DPSK
16
≤21
dB
Adjacent
channel
selectivity C/I
Note:
F0=2441MHz
F = F0+1MHz
π/4
DQPSK
-11
≤0
dB
8DPSK
-5
≤5
dB
F = F0-1MHz
π/4
DQPSK
-8
≤0
dB
8DPSK
-4
≤5
dB
F = F0+2MHz
π/4
DQPSK
-38.5
≤-30
dB
8DPSK
-33.5
≤-25
dB
F = F0-2MHz
π/4
DQPSK
-29
≤-7
dB
8DPSK
-25
≤0
dB
F = F0-3MHz
π/4
DQPSK
-32.5
≤-20
dB
8DPSK
-27
≤-13
dB
F = F0+5MHz
π/4
-49.5
≤-40
dB
BM23SPKA1NB9
Version: 0.94 - 24 - 22/9/2014
DQPSK
8DPSK
-43.5
≤-33
dB
F = Fimage
π/4
DQPSK
-29
≤-7
dB
8DPSK
-25
≤0
dB
BM23SPKA1NB9
Version: 0.94 - 25 - 22/9/2014
FCC Label Instructions
The outside of final products that contains this module device must display a label referring to
the enclosed module. This exterior label can use wording such as the following: “Contains
Transmitter Module FCC ID: A8TBM23SPKXYC2A” or “Contains FCC ID:
A8TBM23SPKXYC2A.” Any similar wording that expresses the same meaning may be used.
If the final product is to be sold in Canada, then this exterior label should use wording such as
the following: “Contains Transmitter Module IC: 12246A-BM23SPKXYC2”
BM23SPKA1NB9
Version: 0.94 - 26 - 22/9/2014
Reflow profile
BM23SPKA1NB9
Version: 0.94 - 27 - 22/9/2014
QR code label information
Label Size:15±1.5 *6±1.5 mm
Device Name: BM23SPKA1NB9
MAC ID: xxxxxxxxxx
Customer ID Name: Cxxxxx
Date Code: 13xx
Module Weight
(Test condition: module with QR label)
TBD
BM23SPKA1NB9
Version: 0.94 - 28 - 22/9/2014
Storage standard
1. Calculated shelf life in sealed bag: 12 months at < 40 ℃ and <90% relative humidity (RH)
2. After bag is opened, devices that will be subjected to reflow solder or other high temperature process
must be Mounted within 168 hours of factory conditions <30℃/60% RH
BM23SPKA1NB9
Version: 0.94 - 29 - 22/9/2014
Ordering Information
Device
Module
Order Number
Size
Shipment
Method
BM23SPKA1NB9
Bluetooth 4.1
digital audio Module
29*15 mm2
Tray
Note:
Minimum Order Quantity is 630pcs Tray.
BM23SPKA1NB9
Version: 0.94 - 30 - 22/9/2014
Packing Information
Tray Dimensions
BM23SPKA1NB9
Version: 0.94 - 31 - 22/9/2014
Packing Method
Inner box: Q’ty (630 Pcs)
Dimensions: 36*16*9.5 cm
Bar Code Label
P/N: Device name
C/N: Customer name
Lot No: Lot ID
Q’ty: Box or Carton Module’s Q’ty
Carton: Q’ty (3780 Pcs)
Dimensions: 38*35*30 cm