Microchip Technology BM23SPKXYC2A Bluetooth Modulel User Manual Manual

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Document Description	Manual
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Permanent Confidential	No
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Document Type	User Manual
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Date Submitted	2014-10-29 00:00:00
Date Available	2014-11-02 00:00:00
Creation Date	2014-10-27 17:37:34
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Document Lastmod	2014-10-27 17:37:34
Document Title	Manual
Document Creator	Microsoft® Word 2010
Document Author:	Rene_Lin.issc

BM23SPKA1NB9
BM23SPKA1NB9
Bluetooth 4.1 Digital Audio Interface Module
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park, Hsinchu city 30077, Taiwan, R.O.C
Phone: 886-3-577-8385
Fax: 886-3-577-8501
Version:0.94
10/27/2014
BM23SPKA1NB9
Product Description
The ISSC BM23SPKA1NB9 is a highly integrated Bluetooth 4.1 digital audio
output module, designed for high data rate, short-range wireless
communication in the 2.4 GHz ISM band. With the build-in ISSC Bluetooth
stack, profile and digital audio interface, the ISSC BM23SPKA1NB9 can
combine the external DSP and codec to provide high performance Bluetooth
audio.
Features
 Main Chip: ISSC IS2023S(ROM version)
 Bluetooth 4.1 EDR compliant
 Max. +4dBm Class 2 output power
 Receiver Sensitivity: GFSK typical -90dBm, π/4 PSK typical -91dBm,
8DPSK typical -84dBm
 Piconet and Scatter net support
 CVSD, A-law, -law, mSBC CODEC algorithms for voice applications
 SBC/AAC decode for Bluetooth audio streaming
 Microphone input and audio line-in support
 Built-in four language voice prompt (Chinese/English/Spanish/French)
 Support PCM and I2S digital audio interface
 Built-in 350mAH Li-ion battery charger
 HSP, HFP, A2DP, AVRCP,SPP profiles supported
 3.3V operating voltage
 Built-in program ROM and 64Kb EEPROM
 43 pins for SMT module Size: 15mmx29mm2
 Built-in PCB Antenna
 RoHS compliant
 FCC certification
Version: 0.94
-2-
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BM23SPKA1NB9
Module Pin Out Diagram
BM23SPKA1NB9
Version: 0.94
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BM23SPKA1NB9
Version: 0.94
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BM23SPKA1NB9
Pin Definition for ROM module
Pin No. I/O
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Name
Description
GPIO, default pull-low input.
UART_TX_IND: BT Module use to inform MCU
I/O
RFS0
Receive frame synchronization
I/O
TFS0
Transmit frame synchronization
I/O
SLK0
Serial clock
DR0
Serial data receive
DT0
Serial data transmit
I/O
P04
GPIO, default pull-high input
Embedded ROM/External Flash enable
EAN
High: ROM mode;
Low: External Flash mode
AI
MIC1_P Mic 1 mono differential analog positive input
AI
MIC1_N Mic 1 mono differential analog negative input
AP MIC_BIAS Power output, microphone biasing voltage
Power output, reserve for external cap to fine tune
AP
VDDA
audio frequency response, no need to add power
to this pin
AI
AIR
Stereo analog line in, R-channel
AI
AIL
Stereo analog line in, L-channel
GND
Ground
System Reset Pin,
I/O
RST_N
Low: reset
-NC
--NC
-Power output, VDDIO pin, no need to add power to
VDDIO
this pin
I/O
P15
GPIO, default pull-high input
I/O
P01
GPIO, default pull-high input
P ADAP_IN Power adaptor input
BAT_IN Battery input
P AMB_DET ADC analog input 1
I/O
Version: 0.94
P00
-5-
22/9/2014
BM23SPKA1NB9
25
SYS_PWR
26
BK_OUT
27
MFB
28
29
LED1
LED2
30
I/O
P24
31
32
33
34
35
36
37
38
I/O
I/O
I/O
I/O
I/O
I/O
P02
P03
HCI_TXD
HXI_RXD
P05
P27
P20
P30
39
I/O
P20
40
41
42
43
GND
ANT1
ANT2
ANT3
Version: 0.94
System Power Output
BAT mode: 3.3~4.2V
Adapter mode: 4.0V
Power output, 1v8 pin, no need to add power to this
pin
1. Power key when in off mode
2. UART_RX_IND: MCU use to wakeup BT
LED Driver 1, 4mA max
LED Driver 2, 4mA max
GPIO, default input with internal pull high
System Configuration: (with the combination of P20
and EAN)
Low: boot Mode when P20=low, EAN=high
GPIO, default pull-high input
GPIO, default pull-high input
HCI TX data, output pin, BT to send data
HCI RX data, input pin, BT to receive data
GPIO, default pull-high input
GPIO, default pull-high input
GPIO, default pull-high input
GPIO, default pull-high input
GPIO, default pull-high input
System Configuration, H: Application L:
Baseband(IBDK Mode)
Ground.
Antenna enhancement .
Antenna enhancement .
Antenna enhancement .
-6-
22/9/2014
BM23SPKA1NB9
Digital Audio Interface
 Support I2S and PCM interface
 Sampling Rate : 8K, 44.1K, 48K
 Word Length: 16 bits, 24 bits
 4 application modes
Version: 0.94
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22/9/2014
BM23SPKA1NB9
Mode 1: I2S Master
BM23
External CODEC/DSP
BCLK
ADCLRC
DACLRC
ADCDAT
ADC DACDAT
Slave
SCLKn
RFSn
TFSn
ADC
DRn
DTn
Master
DAC
1/fs
SCLKn
Left Channel
RFSn/TFSn
DRn/DTn
Bn-1 Bn-2
Right Channel
B1 B0
Bn-1 Bn-2
B1 B0
Word Length
Or

Solutions with mic and line-in analog input with I2S audio output

Mic for Bluetooth SCO link

Line-in for external audio playback(for high SNR requirement)
External CODEC/DSP
DAC
LineIn
Version: 0.94
BM23
BCLK
ADCLRC
DACLRC
ADCDAT
DACDAT
SCLKn
RFSn
TFSn
DRn
DTn
Slave
Application 1
Master
-8-
22/9/2014
BM23SPKA1NB9
Mode 2: I2S Slave
BM23
External CODEC/DSP
BCLK
ADCLRC
DACLRC
ADCDAT
ADC DACDAT
Master
SCLKn
RFSn
TFSn
ADC
DRn
DTn
Slave
DAC
1/fs
SCLKn
Left Channel
RFSn/TFSn
DRn/DTn
Bn-1 Bn-2
Right Channel
B1 B0
Bn-1 Bn-2
B1 B0
Word Length
Or

Solutions with mic and line-in analog input with I2S audio output

Mic for Bluetooth SCO link

Line-in for external audio playback(for high SNR requirement)
External CODEC/DSP
DAC
LineIn
Version: 0.94
BM23
BCLK
ADCLRC
DACLRC
ADCDAT
DACDAT
SCLKn
RFSn
TFSn
DRn
DTn
Master
Application 1
Slave
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22/9/2014
BM23SPKA1NB9
Mode 3: PCM master
BM23
External CODEC/DSP
BCLK
ADCLRC
DACLRC
ADCDAT
ADC DACDAT
Slave
SCLKn
RFSn
TFSn
ADC
DRn
DTn
Master
DAC
1/fs
SCLK0
RFS0/TFS0
Left Channel
DR0/DT0
Bn-1 Bn-2
Right Channel
B1 B0 Bn-1 Bn-2
B1 B0
Word Length
Version: 0.94
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22/9/2014
BM23SPKA1NB9
Mode 4: PCM slave
BM23
External CODEC/DSP
BCLK
ADCLRC
DACLRC
ADCDAT
ADC DACDAT
Master
SCLKn
RFSn
TFSn
ADC
DRn
DTn
Slave
DAC
1/fs
SCLK0
RFS0/TFS0
Left Channel
DR0/DT0
Bn-1 Bn-2
Right Channel
B1 B0 Bn-1 Bn-2
B1 B0
Word Length
Version: 0.94
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22/9/2014
BM23SPKA1NB9
Outline Dimension (Module Foot print)
Version: 0.94
- 12 -
22/9/2014
BM23SPKA1NB9
Electrical Characteristics
Table 1: Absolute Maximum Voltages
Rating
Min
Max
+85ºC
ESD: Human Body Mode
-40ºC
±2KV
ESD: Machine Mode
±200V
ESD: Charge Device Mode
±400V
Storage Temperature
Core supply voltage
VDD_CORE,
AVDD_PLL
1.14V
RF supply voltage
VCC_RF
1.28V
SAR supply voltage
AVDD_SAR
1.62V
1.98V
Codec supply voltage
VDD_AUDIO
2.7V
3.0V
I/O voltage
VDD_IO
3.6V
BK_VDD
4.3V
3V1_VIN
4.3V
Supply voltage
1.26V
BAT_IN
3.0
4.3V
ADAP_IN
4.5
7.0V
LED
5.1V
Power switch
7.0V
Table 2: Recommended operate condition
Rating
Storage Temperature
Min
Typ
Max
-10ºC
+25ºC
+60ºC
1.14V
1.2V
1.26V
Core supply voltage
VDD_CORE,
AVDD_PLL
RF supply voltage
VCC_RF
SAR supply voltage
AVDD_SAR
1.62V
Codec supply voltage
VDD_AUDIO
2.7V
I/O voltage
VDD_IO
2.7V
BK_VDD
3V
4.3V
3V1_VIN
3V
4.3V
BAT_IN
3V
4.3V
Supply voltage
Version: 0.94
1.28V
- 13 -
1.8V
1.98V
3.0V
3.0V
3.3V
22/9/2014
BM23SPKA1NB9
ADAP_IN
4.5V
LED
7.0V
4.3V
Power switch
1.8V
7.0V
Table 3: BUCK switching regulator
Normal Operation
Min
Operation Temperature
-40
Input Voltage (VIN)
3.0
Output Voltage (VOUT)
(ILOAD=70mA, VIN=4V)
1.7
Typ
Max
85
Unit
℃
3.8
4.5
1.80
2.05
Output Voltage Accuracy
±5
Output Voltage Adjustable Step
50
mV/Step
Output Adjustment Range
-0.1
Output Ripple
10
Average Load Current (ILOAD)
Settling Time
(start-up time)
Conversion
efficiency
@BAT=3.8V
1.2
ILOAD = 50mA
88
ILOAD ≥ 10mA (PWM)
70
ILOAD ≥ 10mA (PFM)
80
ILOAD ≥ 250μA
65
PWM/PFM Switching Point
Start-up Current Limit
mV RMS
ms
70
800
KHz
by F/W
mA
210
mA
ILOAD = 10mA
400
mA
PWM
1000
PFM
50
30
Output Current (Peak)
200
Load Regulation (ILOAD = 10 ~ 100mA)
Line Regulation (3.2V < VIN < 4.2V)
Version: 0.94
15
mA
EN or VIN to VOUT
Switching Frequency
Quiescent Current
120
(PFM)
Start-up Inrush
Current
+0.25
- 14 -
40
μA
mA
mV/mA
0.03
%/V
22/9/2014
BM23SPKA1NB9
(30)
EN threshold
Logic Low Voltage
(VIL)
Logic High Voltage
(VIH)
(mV/V)
0.4
1.62
EN current
10
Shutdown Current *1
<1
nA
μA
Table 4: Low Drop Regulation
Normal Operation
Min
Operation Temperature
-40
85
Unit
℃
Input Voltage (VIN)
3.0
4.5
VOUT = 2.9V
Output Voltage (VOUT)
(2.4~3.4V)
(1) VOUT_CODEC
VOUT = 1.8V
(2) VOUT_IO
(1.3~2.3V)
Typ
Max
2.9
1.8
Accuracy (VIN=3.7V, ILOAD=100mA, 27’C)
Output Voltage Adjustable Step
67
Output Adjustment Range
±5
100
±0.5
mV/Step
Start-up Inrush
Current
ILOAD=10mA
200
400
mA
Settling Time
(start-up time)
EN or VIN to VOUT
250
500
μs
Output Current
(Average)
VOUT
100
mA
Output Current
(Peak)
VOUT
150
mA
300
mV
Drop-Out Voltage (ILOAD = maximum output
current)
Quiescent Current (excluding load, ILOAD <
1mA)
Quiescent Current (excluding load, ILOAD <
100μA)
Load Regulation (Iload = 0mA to 100mA), Δ
VOUT
Version: 0.94
- 15 -
μA
45
N/A
μA
40
(0.4)
mV
(mV/mA)
22/9/2014
BM23SPKA1NB9
Note: 0.4(mV/mA) * (100mA-0mA)=40mV
Line Regulation (VOUT+0.3V 0.7V
(ADAP_IN=5V)
Headroom = 0.3V
(ADAP_IN=4.5V)
Maximum Battery
Fast Charge Current
Note: ENX2=1
Headroom > 0.7V
(ADAP_IN=5V)
Headroom = 0.3V
(ADAP_IN=4.5V)
0.1C
mA
170
200
240
mA
160
180
240
mA
330
370
420
mA
180
220
270
mA
Minimum Step
mA
Trickle Charge Voltage Threshold
Float Voltage
4.158
Battery Charge Termination Current,
% of Fast Charge Current
4.2
4.242
10
Standby Mode (BAT_IN falling from 4.2V)
Supply current to charger only
Version: 0.94
- 16 -
mA
22/9/2014
BM23SPKA1NB9
Battery Current
Battery Recharge Current
Note: C  Battery Capacity (*1)
Version: 0.94
- 17 -
-1
μA
0.25C
mA
22/9/2014
BM23SPKA1NB9
Table 6: Audio codec ADC
Conditions
Temperature
Min
Typ
Max
-40
25
85
Unit
℃
16
Bits
44.1
KHz
Resolution
Input sample rate, Fsample
8KHz for MIC
44.1KHz for Line-in
fin=1KHz
Signal to Noise Ratio
(SNR @MIC or Line-in
mode)
B/W=20~20KHz
90
8KHz
A-weighted
dB
THD+N < 1%
150mVpp input
90
44.1KHz
Digital Gain
-54
Digital Gain Resolution
4.85
2~6
MIC Boost Gain
dB
20
Analog Gain
60
Analog Gain Resolution
Input full-scale at maximum
gain (differential)
Input full-scale at minimum
gain (differential)
3dB bandwidth
Microphone mode
input impedance
dB
Input impedance
dB
2.0
dB
mV rms
800
mV rms
20
KHz
Input capacitance
10
KΩ
20
pF
THD+N (microphone input)
@30mVrms input
0.02
THD+N (line input)
0.04
ADC channels
Analog supply voltage
2.6
2.8
3.0
Digital supply voltage
1.08
1.2
1.32
Version: 0.94
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BM23SPKA1NB9
Table 7: Transmitter section for BDR (25℃)
Typ
Max
Bluetooth
specification
Unit
Maximum RF transmit power
4.0
5.0
-6 to 4
dBm
RF power variation over temperature
range with compensation enabled
±1.0
dB
RF power variation over temperature
range with compensation disabled
±2.0
dB
Min
RF power control range
RF power range control resolution
±0.5
20dB bandwidth for modulated
carrier
925
ACP
Note:
F0=2441MHz
≥16
18
dB
dB
≤1000
KHz
F = F0±2MHz
-42
-40
≤-20
dBm
F = F0±3MHz
-49
-48
≤-40
dBm
F = F0±>3MHz
-57
-53
≤-40
dBm
175
140<∆f1avg<175
KHz
140
≥115
KHz
∆f1avg maximum modulation
145
∆f2max maximum modulation
120
135
∆f2avg/∆f1avg
0.9
0.95
ICFT
4.5
10.5
±75
KHz
Drift rate
3.3
7.0
≤20
KHz/50
us
12
≤40
KHz
harmonic content
-42
≤-30
dBm
3rd harmonic content
-45
≤-30
dBm
Drift (single slot packet)
nd
Version: 0.94
- 19 -
≥0.80
22/9/2014
BM23SPKA1NB9
Table 8 Transmitter section for EDR (25℃)
Min
Relative transmit power
≤75 for all
blocks
KHz
2.5
≤10 for all
blocks
KHz
2.5
≤75 for all
blocks
KHz
block freq.
error
10
≤75 for all
blocks
KHz
RMS DEVM
12.2
≤20
99% DEVM
PASS
≤30
≤35
≤13
PASS
≤20
≤25
initial freq.
error
Peak DEVM
25
RMS DEVM
8DQPSK
99% DEVM
modulation accuracy
Peak DEVM
Version: 0.94
KHz
10
|ωo+ωi|
Note: F0=2441MHz
≤10 for all
blocks
|ωo+ωi|
|ωi|
In-band spurious
emissions
dB
initial freq.
error
freq. error
modulation accuracy
-4 to 1
2.5
|ωi|
|ωo|
π/4 DQPSK
Unit
block freq.
error
8DPSK max carrier
frequency stability
Bluetooth
specification
2.5
freq. error
carrier frequency
stability
Max
-1.2
|ωo|
π/4 DQPSK max
Typ
20
≤75 for all
blocks
KHz
F > F0+3MHz
<-52
≤-40
dBm
F < F0-3MHz
<-53
≤-40
dBm
F = F0-3MHz
-46
≤-40
dBm
F = F0-2MHz
-34
≤-20
dBm
F = F0-1MHz
-34
≤-26
dBm
F = F0+1MHz
-37
≤-26
dBm
F = F0+2MHz
-34
≤-20
dBm
- 20 -
22/9/2014
BM23SPKA1NB9
-46
≤-40
dBm
100
≥99
Bluetooth
specification
Unit
≤-70
dBm
≥-20
dBm
0.030–2.000
-7
-10
2.000-2.400
-10
-27
2.500-3.000
-11
-27
F = F0+3MHz
EDR differential phase encoding
Table 9 Receiver section for BDR (25℃)
Frequency
(GHz)
Min
Typ
Sensitivity at 0.1%
BER for all basic rate
2.402
-90
2.441
-90
packet types
2.480
-90
Maximum received signal at 0.1%
BER
Continuous power
required to block
Bluetooth reception
(for input power of
-67dBm with 0.1%
BER) measured at the
unbalanced port of the
balun
dBm
3.000-12.75
-7
-10
≤11
dB
F=
F0+1MHz
-6
≤0
dB
F=
F0-1MHz
-6.5
≤0
dB
F=
F0+2MHz
-36
≤-30
dB
F=
F0-2MHz
-28
≤-9
dB
-31
≤-20
dB
F=
F0+5MHz
-48
≤-40
dB
F = Fimage
-28
≤-9
dB
-37
≥-39
dBm
C/I co-channel
Adjacent channel
selectivity C/I
Note: F0=2441MHz
F=
F0-3MHz
Maximum level of intermodulation
Version: 0.94
Max
- 21 -
22/9/2014
BM23SPKA1NB9
interferers
Spurious output level
Version: 0.94
N/A
- 22 -
dBm/Hz
22/9/2014
BM23SPKA1NB9
Table 10: Receiver section for EDR (25℃)
Frequency
Modulation
(GHz)
2.402
2.441
Sensitivity at
0.01% BER
2.480
π/4
π/4
-91
DQPSK
π/4
-85
2.441
8DPSK
-84
2.480
8DPSK
-85
π/4
DQPSK
8DPSK
DQPSK
8DPSK
π/4
F = F0+1MHz DQPSK
8DPSK
π/4
F = F0-1MHz
DQPSK
8DPSK
π/4
F = F0+2MHz DQPSK
8DPSK
π/4
F = F0-2MHz
DQPSK
8DPSK
π/4
F = F0-3MHz
DQPSK
8DPSK
F = F0+5MHz π/4
Version: 0.94
Bluetooth
Unit
specification
≤-70
dBm
≤-70
dBm
-91
DQPSK
8DPSK
C/I co-channel at 0.1% BER
Max
-91
DQPSK
π/4
Note:
F0=2441MHz
Typ
2.402
Maximum received signal at
0.1% BER
Adjacent
channel
selectivity C/I
Min
- 23 -
-10
≥-20
-10
≥-20
10
≤13
dB
16
≤21
dB
-11
≤0
dB
-5
≤5
dB
-8
≤0
dB
-4
≤5
dB
-38.5
≤-30
dB
-33.5
≤-25
dB
-29
≤-7
dB
-25
≤0
dB
-32.5
≤-20
dB
-27
≤-13
dB
-49.5
≤-40
dB
dBm
22/9/2014
BM23SPKA1NB9
DQPSK
8DPSK
π/4
F = Fimage
DQPSK
8DPSK
Version: 0.94
- 24 -
-43.5
≤-33
dB
-29
≤-7
dB
-25
≤0
dB
22/9/2014
BM23SPKA1NB9
FCC Label Instructions
The outside of final products that contains this module device must display a label referring to
the enclosed module. This exterior label can use wording such as the following: “Contains
Transmitter Module FCC ID: A8TBM23SPKXYC2A” or “Contains FCC ID:
A8TBM23SPKXYC2A.” Any similar wording that expresses the same meaning may be used.
If the final product is to be sold in Canada, then this exterior label should use wording such as
the following: “Contains Transmitter Module IC: 12246A-BM23SPKXYC2”
Version: 0.94
- 25 -
22/9/2014
BM23SPKA1NB9
Reflow profile
Version: 0.94
- 26 -
22/9/2014
BM23SPKA1NB9
QR code label information
Label Size:15±1.5 *6±1.5 mm
Device Name: BM23SPKA1NB9
MAC ID: xxxxxxxxxx
Customer ID Name: Cxxxxx
Date Code: 13xx
Module Weight
(Test condition: module with QR label)
TBD
Version: 0.94
- 27 -
22/9/2014
BM23SPKA1NB9
Storage standard
1. Calculated shelf life in sealed bag: 12 months at < 40 ℃ and <90% relative humidity (RH)
2. After bag is opened, devices that will be subjected to reflow solder or other high temperature process
must be Mounted within 168 hours of factory conditions <30℃/60% RH
Version: 0.94
- 28 -
22/9/2014
BM23SPKA1NB9
Ordering Information
Module
Device
Size
Shipment
Method
29*15 mm2
Tray
Order Number
BM23SPKA1NB9
Bluetooth 4.1
digital audio Module
Note:
Minimum Order Quantity is 630pcs Tray.
Version: 0.94
- 29 -
22/9/2014
BM23SPKA1NB9
Packing Information
Tray Dimensions
Version: 0.94
- 30 -
22/9/2014
BM23SPKA1NB9
Packing Method
Inner box: Q’ty (630 Pcs)
Dimensions: 36*16*9.5 cm
Bar Code Label
P/N: Device name
C/N: Customer name
Lot No: Lot ID
Q’ty: Box or Carton Module’s Q’ty
Carton: Q’ty (3780 Pcs)
Dimensions: 38*35*30 cm
Version: 0.94
- 31 -
22/9/2014

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Source Exif Data:

File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.5
Linearized                      : No
Page Count                      : 31
Language                        : zh-TW
Tagged PDF                      : Yes
Author                          : Rene_Lin.issc
Creator                         : Microsoft® Word 2010
Create Date                     : 2014:10:27 17:37:34+08:00
Modify Date                     : 2014:10:27 17:37:34+08:00
Producer                        : Microsoft® Word 2010

EXIF Metadata provided by EXIF.tools