Microchip Technology BM57SPPSYC2A Bluetooth Module User Manual Manual

Microchip Technology Inc. Bluetooth Module Manual

Manual

Datasheet of Bluetooth
BM57SPPSyC2 Module
iSSC Technologies Corp.
Revision History
Date Revision Content Version
2012/03/08 Preliminary Draft Version 0.2
CONFIDENTIAL
© 2000~2011 iSSC Technologies Corp. 2
Content
1.Introduction ...................................................................................................................... 3
1.1.Major Components ....................................................................................................................................... 3
1.2.Features ........................................................................................................................................................ 3
1.3.Application .................................................................................................................................................... 4
1.4.Certifications ................................................................................................................................................. 4
2.Product Specification ...................................................................................................... 5
2.1.Chipset .......................................................................................................................................................... 5
2.2.Interfaces ...................................................................................................................................................... 5
2.3.Hardware Design Considerations ................................................................................................................. 5
3.Hardware Architecture ................................................................................................... 10
4.Compatibility Requirements .......................................................................................... 10
5.Environmental Requirements ....................................................................................... 11
5.1.Temperature ............................................................................................................................................... 11
5.2.Humidity ...................................................................................................................................................... 11
Appendix A: Dimension and Foot Print ................................................................................. 12
Appendix B: Product Image .................................................................................................... 13
Appendix C: PIN Assignment ................................................................................................. 14
Appendix D: Reflow Profile ..................................................................................................... 16
Appendix E: Schematic ........................................................................................................... 17
Appendix F: Reference Schematic ......................................................................................... 18
Appendix G: Test Board Layout Information ......................................................................... 19
Appendix H: Test Board Layout Information ......................................................................... 19
Appendix H: Label Information ............................................................................................... 19
Appendix I: Packaging Information ........................................................................................ 20
Appendix I: Reversion History ................................................................................................ 21
CONFIDENTIAL
© 2000~2011 iSSC Technologies Corp. 3
1. Introduction
Part Name: iSSC BM57SPPSyC2 Bluetooth module
Part Number: BM57SPPSyC2-xxxxxx
The iSSC BM57SPPSyC2 Bluetooth module is design for MFi (The Made for iPod, Made for iPhone and Made for
iPad logos) electronic accessory via Bluetooth connectivity. It is available in the 2.4GHz ISM band Class 2 Radio,
compatible with Bluetooth Core Specification Version 3.0 + EDR.
iSSC IS1657NM single chip solution combines transceiver and baseband function to decrease the external
components. It narrows down the module size and minimizes its cost. The optimized power designs minimize power
consumption to keep low battery.
The module is integrated with shielding case and 2.4GHz RF Chip antenna. It has passed the Bluetooth SIG and
FCC Part 15 certification.
*Notice:
1. Changes or modifications made to this equipment not expressly approved by the Grantee of the FCC
ID may void the FCC authorization to operate this equipment.
2. LABEL OF THE END PRODUCT: The final end product must be labeled in a visible area with the following
" Contains FCC ID: A8TBM57SPPSYC2A”.
1.1. Major Components
- iSSC IS1657NM (48 pin QFN, single-chip Bluetooth transceiver and baseband processor)
- Serial EEPROM 8K (1024*8) TSSOP 8P
1.2. Features
- Bluetooth 3.0 EDR compliant
- Low power 1.8V RF operation
- RF transmitter output power Class 2
- RF receiver GFSK typical -90dBm, π/4 PSK typical -90dBm, 8DPSK typical -83dBm
- Internal ROM and 4Mibts of flash
- HCI over UART
- I2C for external EEPROM and authentication chip (to enable functionality between your electronic accessory and
the iPod, iPhone and iPad)
- 1 LED driver
- 2.4GHz ceramic chip antenna
CONFIDENTIAL
© 2000~2011 iSSC Technologies Corp. 4
1.3. Application
- GPS
- Printers
- Electric Scale
- Blood Pressure Monitors
- Bar code Scanner
- Industrial Applications (CNC, PLC, RFID)
- Embedded systems
1.4. Certifications
- Bluetooth SIG: QDID B017511
http://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=17511
- FCC ID: A8TBM57SPPSYC2A
CONFIDENTIAL
© 2000~2011 iSSC Technologies Corp. 5
2. Product Specification
2.1. Chipset
7x7 mm2 48 pin QFN IS1657NM
2.2. Interfaces
- Multi function GPIO interface
- Bluetooth RF interface
- HCI over URAT up to 921600 bps
- I2C for external EEPROM and authentication chip
- 2/4 wires SPI interface (master/slave) for external peripherals control. (Optional)
2.3. Hardware Design Considerations
- Power
The module requires either a 3.3V or 5V supply voltage. (3.3V was suggested)
- Power ramp-up timing restriction
1) BAT_IN : ramp-up (0 to 1.6V) < 200ms
2) PMULDO_O : PMU-logic ramp-up (0 to 1.6V) <60ms
3) VCC_RF (1.8V power domain) : RF BPOR ramp-up (0 to 1.6V) < 20ms
- Power on sequence
1) BAT_IN/ BAT_IN_5V: must be first!
2) 3.3V power domain: VDD_IO/ VDD_FIO must power-up early than 1.8V power.
3) 1.8V power domain: 1V8/ VCC_RF/ VDD_XO/ 1V8_U_P
4) RST_N: digital reset released from 0 to 1.6V must be the last one.
- Recommended operating conditions
Rating Min Typ Max
VDD_IO_x, 3.2V 3.63V
SW_BTN 3.2V 4.3V
BAT_IN 3.2V 4.3V
- Clock Sources
A high accuracy crystal with ±10ppm tolerance is connected to the BM57SPPSyC2 clock input pins.
- Serial Flash and Firmware Version
Firmware code is stored on chip internal flash.
- Radio Characteristics
Bluetooth V3.0 + EDR
Frequency Band: 2402-2480 GHz
Number of Channels: 79 1MHz channels
CONFIDENTIAL
© 2000~2011 iSSC Technologies Corp. 6
- Current Consumption
Operation Mode Peak
current
AVG
current Unit Note
Peak current at TX mode 50.357 mA
Peak current at RX mode 49.413 mA
Standby mode (Discoverable &
connectable mode 2.382 mA
Deep power down mode 0.276 mA
Connected + Sniff, Master (No data) 2.723 mA No data was transmitted
Sniff (40 20 4 0)
Connected + Sniff, Master (No data) 0.673 mA No data was transmitted
Sniff (500 20 4 0)
Connected + Sniff, Slave (No data) 0.745 mA No data was transmitted
Sniff (500 20 3 3) iPhone parameters
Data, Master 17.641 mA Data transmitted at 115200bps
Data, Slave 18.025 mA Data transmitted at 115200bps
- Terminal characteristics
Condition :
VDD_IO=3.3V Min Typ Max Unit
I/O voltage levels
VIL input logic levels low -0.3 0.8 V
VIH input logic levels high 2.0 3.6 V
VOL output logic levels low 0.4 V
VOH output logic levels
high
2.4 V
Reset terminal
VTH,res threshold voltage 1.6 V
Input and tri-state current with
Pull-up Resistor 65 Kohm
Leakage current -10 +10 μA
Vdd supply current
TX mode 70 mA
RX mode 70 mA
CONFIDENTIAL
© 2000~2011 iSSC Technologies Corp. 7
- Baud Rate
Desired baud rate Clock P Div Actual Baud rate Error Rate %
921600 48000000 13 3.50641026 923077 0.16
460800 48000000 13 7.51282051 461538 0.16
230400 48000000 13 15.525641 230769 0.16
115200 16000000 13 10.1837607 111888 -2.87
57600 16000000 13 20.8675214 58608 1.75
38400 16000000 13 31.5512821 38462 0.16
28800 16000000 13 42.2350427 28623 -0.62
19200 16000000 13 63.6025641 19231 0.16
14400 16000000 13 84.9700855 14480 0.55
9600 16000000 13 127.705128 9615 0.16
4800 16000000 13 255.910256 4808 0.16
2400 16000000 13 512.320513 2399 -0.03
- Testing Criterion
NO. Testing Item Name Spec.
1 Device Initialization
2 System Verify System Power>1.6V
3 PMU LDO trim 1.8~2.1
4 Calibration LDO18 1.81~1.93V
5 Calibration LDO33 3.1~3.4V
6 RF frequency calibration < 10k Hz
7 RF TX power verify > -5 dBm
8 8852 output power -2dbm~+4dbm
9 Initial carrier test +/- 30KHz
10 Single slot sensitivity > -70dbm
11 Multi slot sensitivity > -70dbm
12 Modulation index test
‘140KHz ≦ f1avg ≦ 175KHz
≧
f2max 115KHz
≧
f2/f1avg 0.8
CONFIDENTIAL
© 2000~2011 iSSC Technologies Corp. 8
- Timing Sequence
Timing Sequence for Mode selection Pin (P20, P24) under APP mode
Pin No. I/O Name Description
4 I BAT_IN 3.3V power input
7 P VDD_IO Main power supply
17 I P20 System configuration, refer to P2_4, MCU do NOT drive under APP Mode
18 I P24
Boot mode selection (MCU NOT drive under APP Mode)
P2_0/ P2_4: HH Æ Application
LL Æ Boot mode
LH Æ HCI UART mode for testing and system configuration.
P20
P24
VDDIO
Power
7.28ms 41.1ms
P20, P24 Mode Selection Timing Diagram
CONFIDENTIAL
© 2000~2011 iSSC Technologies Corp. 9
Timing Sequence for Rest Pin (RST_N) under different mode
22 I RST_N External reset input (Low Active), clock period 62.5n at least.
External Rest
Write Flash Mode
Test Mode
1 ms
APP Mode
RST_N Timing Diagram
60 ms
5 ms
400 ms
2
1
3
Ready
for MCU
Ready
for MCU
Ready
for MCU
CONFIDENTIAL
© 2000~2011 iSSC Technologies Corp. 10
3. Hardware Architecture
Block Diagram
IS1657NM
16M XTAL
EEPROM
RTX
(Class 2)
I2C
32 mm
12.6 mm
UART/ HCI Interface
GPIO Control
Antenna
Power Tree
BM57 Module
IS1657NM
EEPROM
VDD_IO
Either One
BAT_IN is
recommended
BAT_IN_5V
BAT_IN
5V
3V~4V2
BAT_IN_5V
BAT_IN
VDD_FIO
USB_VDD
LDO18_I
1V8
VDD_XO
VCC_RF
AVDD_SAR
1V8_U_P
LDO18_O
1V8
VDD_IO
LDO33_O
2V8 ~ 3V3
2V8 ~ 3V3
4. Compatibility Requirements
The BM57SPPSyC2 Bluetooth module shall pass the standard test plan, which includes hardware compatibility and
reliability, and software compatibility test.
CONFIDENTIAL
© 2000~2011 iSSC Technologies Corp. 11
5. Environmental Requirements
5.1. Temperature
Conditions Operating Temperature Non-Operating Temperature
Minimum -10 ℃ -40℃
Maximum +70 ℃ +80 ℃
5.2. Humidity
Conditions Operating Humidity Non-Operating Humidity
Minimum 10% 5%
Maximum 90% 95%
CONFIDENTIAL
© 2000~2011 iSSC Technologies Corp. 12
Appendix A: Dimension and Foot Print
1. Dimension
• 32mm* 12.6mm* 1.86mm (Length* Width* Height)
• board thickness: 0.8mm (4 layers PCB)
2. Module Foot Print
3. The mandatory layout under the module.
4. The solder stop mask
CONFIDENTIAL
© 2000~2011 iSSC Technologies Corp. 13
Appendix B: Product Image
CONFIDENTIAL
© 2000~2011 iSSC Technologies Corp. 14
Appendix C: PIN Assignment
Pin # I/O Name Description
1 P GND Ground
2 I SAR_BAT Reserved
3 I BAT_IN_5V 5V power input
4 I BAT_IN 3.3V power input
5 I SW_BTN Reserved
6 P LDO33_O 3V3 LDO output
7 P VDD_IO Main power supply
8 P LDO18_O LDO18 output
9 I WAKEUP Wakeup BM57 from Shutdown State. (Low Active)
It is only valid while BM57 into Shutdown State.
10 P PMULDO_O Output of PMULDO
11 O P04
UART_TX_IND:
H: BM57 indicate UART data will be transmitted out after a certain timing
(setting by EEPROM, default 5 ms)
L: Otherwise.
STATUS_IND_2: BM57 State indication , refer to P22
12 I/O P12/ SCL I2C_SCL, for Authentication Coprocessor 2.0B
13 I/O P13/ SDA I2C_SDA, for Authentication Coprocessor 2.0B
14 I/O P16 EEPROM WP
Chip Antenna
BM57_V2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
17
19
32
31
30
29
28
27
26
25
24
23
22
21
20
GND
SAR_BAT
BAT_IN_5V
BAT_IN
SW_BTN
LDO33_O
VDD_IO
LDO18_O
WAKEUP
PMULDO_O
P04
P12 / SCL
P13 / SDA
P16
USB_DM P20
P24
P21
BT_RF
GND
LED1
P07
P25
P23
P27
P26
HCI_TXD
HCI_RXD
RST_N
EAN
P22
USB_DP 1815
16
CONFIDENTIAL
© 2000~2011 iSSC Technologies Corp. 15
15 I/O USB_DP Reserved
16 I/O USB_DM Reserved
17 I P20 System configuration, refer to P2_4, No drive under APP Mode
18 I P24
Boot mode selection (No drive under APP Mode)
P2_0/ P2_4: HH Æ Application
LL Æ Boot mode
LH Æ HCI UART mode for testing and system configuration.
19 O
P21 CP_RST:
Reset Authentication Coprocessor 2.0B
20 O P22
STATUS_IND:
Bluetooth link status indication,
P22/P04: HH Æ Power default value and Shutdown State.
P22/P04: HL Æ Access State.
P22/P04: LL Æ Link State w/o UART_TXD.
P22/P04: LH Æ Link State with UART_TXD.
21 I EAN ROM/ Flash selection. (No drive under APP Mode)
H: ROM code; L: Flash code
22 I RST_N External reset input (Low Active), clock period 62.5n at least.
23 I HCI_RXD UART_RXD
24 O HCI_TXD UART_TXD
25 I P26 UART_CTS:
UART Flow Control- set HIGH to disable TX transmitter.
26 O P27
UART_RTS:
UART Flow Control- go HIGH to disable host transmitter.
Open data session indication- go LOW when APP session is ready.
27 I P23
LINK_DROP:
Host_MCU ask to drop SPP link under Link State;
One low pulse with 10 ms duration low signal to trigger SPP disconnection.
Otherwise it will be set as high always.
28 I P25 Pairing Key:
Device will enter Standby Mode after pull low over 240ms.
29 I P07
UART_RX_IND:
L: Inform BM57 that UART data will be transmitted out after 1 ms
H: Otherwise.
30 O LED1 LED1 driver
31 P GND Ground
32 RI/O BT_RF RF Port
CONFIDENTIAL
© 2000~2011 iSSC Technologies Corp. 16
Appendix D: Reflow Profile
1.) Follow: IPC/JEDEC J-STD-020 C
2.) Condition:
Average ramp-up rate (217℃ to peak): 1~2℃/sec max.
Preheat：150~200C、60~180 seconds
Temperature maintained above 217℃ : 60~150 seconds
Time within 5℃ of actual peak temperature: 20 ~ 40 sec.
Peak temperature：250+0/-5℃ or 260+0/-5℃
Ramp-down rate : 3℃/sec. max.
Time 25℃ to peak temperature : 8 minutes max.
Cycle interval：5 minus
Slope: 1~2℃/ sec max.
(217℃ to peak)
217℃
Peak: 250+0/-5℃
Or 260+0/-5℃
Ramp down rate:
Max. 3℃/sec.
20~40 sec.
60~150 sec.60~180 sec.
25℃
Preheat: 150~200℃
Time (sec)
CONFIDENTIAL
© 2000~2011 iSSC Technologies Corp. 17
Appendix E: Schematic
EAN
LDO18_O
C12
10u/6.3V
LDO33_O
RST_N
USB_DP
P20
C8
10u/6.3V
P27
SW_BTN
BT_RF
ANT1
CAN4311851042453K
21
P16
C4
1.8p/50V
5V_IN
C11
9p/50V
C19
1u/10V
LDO18_O
SAR_BAT
C13
9p/50V
C16
1u/10V
P25
C14
1u/10V
LDO18_O
P13
R3
4K7
12
C15
1u/10V
WAKEUP
LDO18_O
C9
1u/16V
P04
C6
1.2p/50V
LDO33_O
LDO18_O
QFN48-SPP Bridge
IS1657NM
8
48
6
1
3
7
27
9
25
5
2
11
20
21
12
13
29
35
26
22
32
34
33
28
19
18
23 38
41
40
49
45
4
47
43
46
44
39
42
10
14
15
16
17
24 37
36
31
30
P1_6/WP
1V8_GND
P1_4/TX_CLS1
LDO18_O
PMULDO_O
P1_5/RX_CLS1
VDD_IO
P1_2/SCL
HCI_TXD
P0_4
WAKEUP
GND
P2_1
P2_2
1V8
VDD_IO
P2_7/MISO
XO _ P
1V8
EAN
P0_7
VDD_XO
VDD_FIO
P2_6/NCS
P2_4
P2_0
RST_N VCC_RF
AVDD_SAR
RTX
EP
SW_BTN
NC
LDO18_IN
BAT_IN_5V
LDO33_O
BAT_IN
RX
SAR_BAT
P1_3/SDA
USB_DP
USB_DM
USB_VDD
1V8_U_P
HCI_RXD LED1
XO_N
P2_5/SCLK
P2_3/MOSI
USB_DM
P24
P21
L2
4.7nH
1 2
LDO33_O
PMULDO_O
P26
C3
10u/6.3V
LDO33_O
P23
HCI_RXD
P12
L1
2.7nH
1 2
LDO33_O
LED1
P07
LDO18_O
LDO18_O
C5
10u/6.3V
P22
HCI_TXD
C17
1u/10V
LDO18_O
VBAT_IN
X1
X4P-16MHZ-HLT
4
1
3
2
C7
NP-0402
12
SW_BTN
P21
HCI_RXD
P27
P24
P23
LDO33_O
P16
BM57_V2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
16 17
18
19
32
31
30
29
28
27
26
25
24
23
22
21
20
15
GND
SAR_BAT
BAT_IN_5V
BAT_IN
SW_BTN
LDO33_O
VDD_IO
LDO18_O
WAKEUP
PMULDO_O
P04
P12 / SCL
P13 / SDA
P16
USB_DM P20
P24
P21
BT_RF
GND
LED1
P07
P25
P23
P27
P26
HCI_TXD
HCI_RXD
RST_N
EAN
P22
USB_DP
P12
LED1
P20
P22
USB_DM
USB_DP
P07
HCI_TXD
LDO18_O
P13
EAN
P26
VBAT_IN
5V_IN
SAR_BAT
PMULDO_O
P25
RST_NP04
WAKEUP
CONFIDENTIAL
© 2000~2011 iSSC Technologies Corp. 18
U4
IS24C08A
1
2
3
4 5
6
7
8
A0
A1
A2
GND SDA
SCL
WP
VCC
P13/SDA
VDD_IO
VDD_IO
P16
R6
10K
12
P12/SCL
Appendix F: Reference Schematic
WAKEUP (option)
ROM/ Flash selection (reserv e test point)
CP_SCL (option)
Pairing Key (option)
HCI_TXD
TP2
CP_SDA (option)
Sy stem conf iguration (reserv e test point)
3V3
Boot mode selection (reserv e test point)
LED1
UART_RX_IND (option)
CP_RST (option)
LINK_DROP (option)
TP3
HCI_RXD
UART_RTS (option)
UART_TX_IND (option)
UART_CTS (option)
TP1
STATUS_IND (recommend)
LED1
LED-B
12
BM57_V2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
16 17
18
19
32
31
30
29
28
27
26
25
24
23
22
21
20
15
GND
SAR_BAT
BAT_IN_5V
BAT_IN
SW_BTN
LDO33_O
VDD_IO
LDO18_O
WAKEUP
PMULDO_O
P04
P12 / SCL
P13 / SDA
P16
USB_DM P20
P24
P21
BT_RF
GND
LED1
P07
P25
P23
P27
P26
HCI_TXD
HCI_RXD
RST_N
EAN
P22
USB_DP
4V2~3V2
RST_N (option)
Test Point: TP1, TP2, TP3 are recommended for future firmware, EEPROM table update if the module are welded
on load board.
CONFIDENTIAL
© 2000~2011 iSSC Technologies Corp. 19
Appendix G: Test Board Layout Information
1. The CN1 is reserved for SMA Connector, It’s will be used only if user would like to check
module RF performance.
2. The C4 components must be removed under general condition. The RF trace will output from
the chip antenna on the module.
Appendix H: Test Board Layout Information
Top Bottom
Appendix H: Label Information
TBA
CONFIDENTIAL
© 2000~2011 iSSC Technologies Corp. 20
Appendix I: Packaging Information
TBA
CONFIDENTIAL
© 2000~2011 iSSC Technologies Corp. 21
Appendix I: Reversion History
Version Date History
0.1 2011/12/11 Preliminary Draft Version

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