Microchip Technology BM57SPPSYC2A Bluetooth Module User Manual Manual
Microchip Technology Inc. Bluetooth Module Manual
Manual
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| Document ID | 1662274 |
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| Document Description | Manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
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| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 101.06kB (1263224 bits) |
| Date Submitted | 2012-03-25 00:00:00 |
| Date Available | 2012-04-16 00:00:00 |
| Creation Date | 2012-03-13 17:01:53 |
| Producing Software | Acrobat Distiller 7.0 (Windows) |
| Document Lastmod | 2012-03-13 17:01:53 |
| Document Title | Microsoft Word - Datasheet_BM57SPPSy_120308_FCC.doc |
| Document Creator | PScript5.dll Version 5.2 |
| Document Author: | Anthony |
Datasheet of Bluetooth BM57SPPSyC2 Module iSSC Technologies Corp. Revision History Date 2012/03/08 Revision Content Preliminary Draft Version Version 0.2 Content 1. Introduction ...................................................................................................................... 3 1.1. Major Components ....................................................................................................................................... 3 1.2. Features........................................................................................................................................................ 3 1.3. Application .................................................................................................................................................... 4 1.4. Certifications ................................................................................................................................................. 4 2. Product Specification ...................................................................................................... 5 2.1. Chipset.......................................................................................................................................................... 5 2.2. Interfaces ...................................................................................................................................................... 5 2.3. Hardware Design Considerations ................................................................................................................. 5 3. Hardware Architecture ................................................................................................... 10 4. Compatibility Requirements.......................................................................................... 10 5. Environmental Requirements ....................................................................................... 11 5.1. Temperature ............................................................................................................................................... 11 5.2. Humidity ...................................................................................................................................................... 11 Appendix A: Dimension and Foot Print ................................................................................. 12 Appendix B: Product Image .................................................................................................... 13 Appendix C: PIN Assignment ................................................................................................. 14 Appendix D: Reflow Profile ..................................................................................................... 16 Appendix E: Schematic ........................................................................................................... 17 Appendix F: Reference Schematic ......................................................................................... 18 Appendix G: Test Board Layout Information ......................................................................... 19 Appendix H: Test Board Layout Information ......................................................................... 19 Appendix H: Label Information ............................................................................................... 19 Appendix I: Packaging Information ........................................................................................ 20 Appendix I: Reversion History ................................................................................................ 21 CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 1. Introduction Part Name: iSSC BM57SPPSyC2 Bluetooth module Part Number: BM57SPPSyC2-xxxxxx The iSSC BM57SPPSyC2 Bluetooth module is design for MFi (The Made for iPod, Made for iPhone and Made for iPad logos) electronic accessory via Bluetooth connectivity. It is available in the 2.4GHz ISM band Class 2 Radio, compatible with Bluetooth Core Specification Version 3.0 + EDR. iSSC IS1657NM single chip solution combines transceiver and baseband function to decrease the external components. It narrows down the module size and minimizes its cost. The optimized power designs minimize power consumption to keep low battery. The module is integrated with shielding case and 2.4GHz RF Chip antenna. It has passed the Bluetooth SIG and FCC Part 15 certification. *Notice: 1. Changes or modifications made to this equipment not expressly approved by the Grantee of the FCC ID may void the FCC authorization to operate this equipment. 2. LABEL OF THE END PRODUCT: The final end product must be labeled in a visible area with the following " Contains FCC ID: A8TBM57SPPSYC2A”. 1.1. Major Components - iSSC IS1657NM (48 pin QFN, single-chip Bluetooth transceiver and baseband processor) - Serial EEPROM 8K (1024*8) TSSOP 8P 1.2. Features - Bluetooth 3.0 EDR compliant - Low power 1.8V RF operation - RF transmitter output power Class 2 - RF receiver GFSK typical -90dBm, π/4 PSK typical -90dBm, 8DPSK typical -83dBm - Internal ROM and 4Mibts of flash - HCI over UART - I2C for external EEPROM and authentication chip (to enable functionality between your electronic accessory and the iPod, iPhone and iPad) - 1 LED driver - 2.4GHz ceramic chip antenna CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 1.3. Application - GPS - Printers - Electric Scale - Blood Pressure Monitors - Bar code Scanner - Industrial Applications (CNC, PLC, RFID) - Embedded systems 1.4. Certifications - Bluetooth SIG: QDID B017511 http://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=17511 - FCC ID: A8TBM57SPPSYC2A CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 2. Product Specification 2.1. Chipset 7x7 mm2 48 pin QFN IS1657NM 2.2. Interfaces - Multi function GPIO interface - Bluetooth RF interface - HCI over URAT up to 921600 bps - I2C for external EEPROM and authentication chip - 2/4 wires SPI interface (master/slave) for external peripherals control. (Optional) 2.3. Hardware Design Considerations - Power The module requires either a 3.3V or 5V supply voltage. (3.3V was suggested) - Power ramp-up timing restriction 1) BAT_IN : ramp-up (0 to 1.6V) < 200ms 2) PMULDO_O : PMU-logic ramp-up (0 to 1.6V) <60ms 3) VCC_RF (1.8V power domain) : RF BPOR ramp-up (0 to 1.6V) < 20ms - Power on sequence 1) BAT_IN/ BAT_IN_5V: must be first! 2) 3.3V power domain: VDD_IO/ VDD_FIO must power-up early than 1.8V power. 3) 1.8V power domain: 1V8/ VCC_RF/ VDD_XO/ 1V8_U_P 4) RST_N: digital reset released from 0 to 1.6V must be the last one. - Recommended operating conditions Rating Min Typ Max VDD_IO_x, 3.2V 3.63V SW_BTN 3.2V 4.3V BAT_IN 3.2V 4.3V - Clock Sources A high accuracy crystal with ±10ppm tolerance is connected to the BM57SPPSyC2 clock input pins. - Serial Flash and Firmware Version Firmware code is stored on chip internal flash. - Radio Characteristics Bluetooth V3.0 + EDR Frequency Band: 2402-2480 GHz Number of Channels: 79 1MHz channels CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. - Current Consumption Operation Mode Peak AVG current current Unit Peak current at TX mode 50.357 mA Peak current at RX mode 49.413 mA Standby mode (Discoverable & Note 2.382 mA Deep power down mode 0.276 mA Connected + Sniff, Master (No data) 2.723 mA Connected + Sniff, Master (No data) 0.673 mA Connected + Sniff, Slave (No data) 0.745 mA Data, Master 17.641 mA Data transmitted at 115200bps Data, Slave 18.025 mA Data transmitted at 115200bps connectable mode No data was transmitted Sniff (40 20 4 0) No data was transmitted Sniff (500 20 4 0) No data was transmitted Sniff (500 20 3 3) iPhone parameters - Terminal characteristics Condition : VDD_IO=3.3V Min Typ Max Unit I/O voltage levels VIL input logic levels low -0.3 0.8 VIH input logic levels high 2.0 3.6 0.4 VOL output logic levels low VOH output logic levels 2.4 high Reset terminal VTH,res threshold voltage 1.6 65 Kohm Input and tri-state current with Pull-up Resistor Leakage current -10 +10 μA TX mode 70 mA RX mode 70 mA Vdd supply current CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. - Baud Rate Desired baud rate Clock Div Actual Baud rate Error Rate % 921600 48000000 13 3.50641026 923077 0.16 460800 48000000 13 7.51282051 461538 0.16 230400 48000000 13 15.525641 230769 0.16 115200 16000000 13 10.1837607 111888 -2.87 57600 16000000 13 20.8675214 58608 1.75 38400 16000000 13 31.5512821 38462 0.16 28800 16000000 13 42.2350427 28623 -0.62 19200 16000000 13 63.6025641 19231 0.16 14400 16000000 13 84.9700855 14480 0.55 9600 16000000 13 127.705128 9615 0.16 4800 16000000 13 255.910256 4808 0.16 2400 16000000 13 512.320513 2399 -0.03 - Testing Criterion NO. Testing Item Name Spec. Device Initialization System Verify System Power>1.6V PMU LDO trim 1.8~2.1 Calibration LDO18 1.81~1.93V Calibration LDO33 3.1~3.4V RF frequency calibration < 10k Hz RF TX power verify > -5 dBm 8852 output power -2dbm~+4dbm Initial carrier test +/- 30KHz 10 Single slot sensitivity > -70dbm 11 Multi slot sensitivity > -70dbm ‘140KHz ≦ f1avg ≦ 175KHz 12 Modulation index test f2max ≧ 115KHz f2/f1avg ≧ 0.8 CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. - Timing Sequence Timing Sequence for Mode selection Pin (P20, P24) under APP mode Pin No. I/O Name Description BAT_IN 3.3V power input VDD_IO Main power supply 17 P20 System configuration, refer to P2_4, MCU do NOT drive under APP Mode Boot mode selection (MCU NOT drive under APP Mode) 18 P2_0/ P2_4: HH Æ Application P24 LL Æ Boot mode LH Æ HCI UART mode for testing and system configuration. 7.28ms 41.1ms P20 P24 VDDIO Power P20, P24 Mode Selection Timing Diagram CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. Timing Sequence for Rest Pin (RST_N) under different mode 22 RST_N External reset input (Low Active), clock period 62.5n at least. 60 ms External Rest 400 ms 1 ms Write Flash Mode Ready for MCU Test Mode Ready for MCU APP Mode Ready for MCU 5 ms RST_N Timing Diagram CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 3. Hardware Architecture Block Diagram 32 mm IS1657NM I2C Antenna RTX (Class 2) UART/ HCI Interface GPIO Control EEPROM 16M XTAL 12.6 mm Power Tree BM57 Module IS1657NM 2V8 ~ 3V3 LDO33_O VDD_FIO USB_VDD LDO18_I BAT_IN_5V BAT_IN 5V 3V~4V2 Either One BAT_IN is recommended BAT_IN_5V VDD_IO 2V8 ~ 3V3 VDD_IO LDO18_O BAT_IN 1V8 VDD_XO VCC_RF AVDD_SAR 1V8_U_P 1V8 EEPROM 4. Compatibility Requirements The BM57SPPSyC2 Bluetooth module shall pass the standard test plan, which includes hardware compatibility and reliability, and software compatibility test. CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 10 5. Environmental Requirements 5.1. Temperature Conditions Operating Temperature Non-Operating Temperature Minimum -10 ℃ -40℃ Maximum +70 ℃ +80 ℃ Conditions Operating Humidity Non-Operating Humidity Minimum 10% 5% Maximum 90% 95% 5.2. Humidity CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 11 Appendix A: Dimension and Foot Print 1. Dimension • 32mm* 12.6mm* 1.86mm (Length* Width* Height) • board thickness: 0.8mm (4 layers PCB) 2. Module Foot Print 3. The mandatory layout under the module. 4. The solder stop mask CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 12 Appendix B: Product Image CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 13 Appendix C: PIN Assignment Chip Antenna 10 11 12 13 14 15 16 GND SAR_BAT BAT_IN_5V BAT_IN SW_BTN LDO33_O VDD_IO LDO18_O WAKEUP PMULDO_O P04 P12 / SCL P13 / SDA P16 USB_DP USB_DM 32 BT_RF 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 GND LED1 P07 P25 P23 P27 P26 HCI_TXD HCI_RXD RST_N EAN P22 P21 P24 P20 BM57_V2 Pin # I/O Name Description GND Ground SAR_BAT Reserved BAT_IN_5V 5V power input BAT_IN 3.3V power input SW_BTN Reserved LDO33_O 3V3 LDO output VDD_IO Main power supply LDO18_O LDO18 output WAKEUP 10 PMULDO_O Wakeup BM57 from Shutdown State. (Low Active) It is only valid while BM57 into Shutdown State. Output of PMULDO UART_TX_IND: H: BM57 indicate UART data will be transmitted out after a certain timing 11 P04 (setting by EEPROM, default 5 ms) L: Otherwise. STATUS_IND_2: BM57 State indication , refer to P22 12 I/O P12/ SCL I2C_SCL, for Authentication Coprocessor 2.0B 13 I/O P13/ SDA I2C_SDA, for Authentication Coprocessor 2.0B 14 I/O P16 EEPROM WP CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 14 15 I/O USB_DP Reserved 16 I/O USB_DM Reserved 17 P20 System configuration, refer to P2_4, No drive under APP Mode Boot mode selection (No drive under APP Mode) 18 P24 P2_0/ P2_4: HH Æ Application LL Æ Boot mode LH Æ HCI UART mode for testing and system configuration. 19 P21 CP_RST: Reset Authentication Coprocessor 2.0B STATUS_IND: Bluetooth link status indication, 20 P22 P22/P04: HH Æ Power default value and Shutdown State. P22/P04: HL Æ Access State. P22/P04: LL Æ Link State w/o UART_TXD. P22/P04: LH Æ Link State with UART_TXD. ROM/ Flash selection. (No drive under APP Mode) 21 EAN 22 RST_N External reset input (Low Active), clock period 62.5n at least. 23 HCI_RXD UART_RXD 24 HCI_TXD UART_TXD 25 P26 H: ROM code; L: Flash code UART_CTS: UART Flow Control- set HIGH to disable TX transmitter. UART_RTS: 26 P27 UART Flow Control- go HIGH to disable host transmitter. Open data session indication- go LOW when APP session is ready. LINK_DROP: 27 P23 Host_MCU ask to drop SPP link under Link State; One low pulse with 10 ms duration low signal to trigger SPP disconnection. Otherwise it will be set as high always. 28 P25 Pairing Key: Device will enter Standby Mode after pull low over 240ms. UART_RX_IND: 29 P07 L: Inform BM57 that UART data will be transmitted out after 1 ms H: Otherwise. 30 LED1 LED1 driver 31 GND Ground 32 RI/O BT_RF RF Port CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 15 Appendix D: Reflow Profile 1.) Follow: IPC/JEDEC J-STD-020 C 2.) Condition: Average ramp-up rate (217℃ to peak): 1~2℃/sec max. Preheat：150~200C、60~180 seconds Temperature maintained above 217℃ : 60~150 seconds Time within 5℃ of actual peak temperature: 20 ~ 40 sec. Peak temperature：250+0/-5℃ or 260+0/-5℃ Ramp-down rate : 3℃/sec. max. Time 25℃ to peak temperature : 8 minutes max. Cycle interval：5 minus Slope: 1~2℃/ sec max. (217℃ to peak) Peak: 250+0/-5℃ Or 260+0/-5℃ Ramp down rate: Max. 3℃/sec. 217℃ Preheat: 150~200℃ 20~40 sec. 60~180 sec. 60~150 sec. 25℃ Time (sec) CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 16 Appendix E: Schematic 5V_IN C3 10u/6.3V L1 C4 1.8p/50V LDO33_O 4.7nH BT_RF1 C6 1.2p/50V LDO18_O LDO18_O C5 10u/6.3V 2.7nH C7 CAN4311851042453K NP-0402 VBAT_IN ANT1 L2 SAR_BAT C8 10u/6.3V C9 SW_BTN 1u/16V C11 9p/50V C14 1u/10V 48 47 46 45 44 43 42 41 40 39 38 37 EP LDO18_O 1 WAKEUP PMULDO_O 3 P04 P16 P12 P13 10 11 12 LDO18_O XO_N WAKEUP XO_P VDD_XO PMULDO_O VDD_FIO NC P0_4 P0_7 P1_4/TX_CLS1 P2_5/SCLK P1_5/RX_CLS1 P2_3/MOSI P2_7/MISO P1_6/WP P1_2/SCL P2_6/NCS P1_3/SDA QFN48-SPP Bridge VDD_IO GND 1V8 HCI_TXD 1V8 IS1657NM 9p/50V 36 35 34 33 32 31 30 29 28 27 26 25 P07 P25 P23 P27 P26 LDO33_O 1u/10V C16 LDO33_O LDO18_O 1u/10V C15 LDO18_O 13 14 15 16 17 18 19 20 21 22 23 24 HCI_TXD LDO18_O C13 X1 VDD_IO USB_DP USB_DM USB_VDD 1V8_U_P P2_0 P2_4 P2_1 P2_2 EAN RST_N HCI_RXD LDO18_O C12 10u/6.3V X4P-16MHZ-HLT 1V8_GND LDO18_IN LDO33_O SW_BTN BAT_IN BAT_IN_5V SAR_BAT AVDD_SAR RTX RX VCC_RF LED1 49 LED1 HCI_RXD P20 P24 P21 P22 EAN LDO33_O USB_DP USB_DM RST_N R3 4K7 LDO33_O LDO18_O 1u/10V C17 1u/10V C19 5V_IN GND BT_RF 32 VBAT_IN LDO33_O LDO18_O SAR_BAT 2 SW_BTN 5 WAKEUP 9 PMULDO_O 10 P04 11 P12 12 P13 13 P16 14 USB_DP 15 USB_DM 16 SAR_BAT BAT_IN_5V BAT_IN SW_BTN LDO33_O VDD_IO LDO18_O WAKEUP PMULDO_O P04 P12 / SCL P13 / SDA P16 USB_DP USB_DM GND LED1 P07 P25 P23 P27 P26 HCI_TXD HCI_RXD RST_N EAN P22 P21 P24 P20 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 LED1 P07 P25 P23 P27 P26 HCI_TXD HCI_RXD RST_N EAN P22 P21 P24 P20 BM57_V2 CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 17 VDD_IO A0 A1 A2 GND VCC WP SCL SDA P16 P12/SCL P13/SDA U4 IS24C08A VDD_IO R6 10K Appendix F: Reference Schematic GND BT_RF 32 3V3 LED1 4V2~3V2 WAKEUP (option) 10 UART_TX_IND (option) 11 CP_SCL (option) 12 CP_SDA (option) 13 14 15 16 SAR_BAT BAT_IN_5V BAT_IN SW_BTN LDO33_O VDD_IO LDO18_O WAKEUP PMULDO_O P04 P12 / SCL P13 / SDA P16 USB_DP USB_DM GND LED1 P07 P25 P23 P27 P26 HCI_TXD HCI_RXD RST_N EAN P22 P21 P24 P20 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 LED1 UART_RX_IND (option) Pairing Key (option) LINK_DROP (option) LED-B UART_RTS (option) UART_CTS (option) HCI_TXD HCI_RXD RST_N (option) ROM/ Flash selection (reserv e test point) STATUS_IND (recommend) TP1 CP_RST (option) Boot mode selection (reserv e test point) Sy stem conf iguration (reserv e test point) TP2 TP3 BM57_V2 Test Point: TP1, TP2, TP3 are recommended for future firmware, EEPROM table update if the module are welded on load board. CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 18 Appendix G: Test Board Layout Information 1. The CN1 is reserved for SMA Connector, It’s will be used only if user would like to check module RF performance. 2. The C4 components must be removed under general condition. The RF trace will output from the chip antenna on the module. Appendix H: Test Board Layout Information Top Bottom Appendix H: Label Information TBA CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 19 Appendix I: Packaging Information TBA CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 20 Appendix I: Reversion History Version 0.1 Date History 2011/12/11 Preliminary Draft Version CONFIDENTIAL © 2000~2011 iSSC Technologies Corp. 21
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