Microchip Technology BM78ABCDEFGH Bluetooth Module User Manual BM78 RN4678 datasheet 20150922 f
Microchip Technology Inc. Bluetooth Module BM78 RN4678 datasheet 20150922 f
Manual
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| Document Description | Manual |
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| Date Submitted | 2015-09-23 00:00:00 |
| Date Available | 2015-09-24 00:00:00 |
| Creation Date | 2015-09-24 10:58:13 |
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| Document Lastmod | 2015-09-24 10:58:13 |
| Document Title | BM78-RN4678_datasheet_20150922-f |
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| Document Author: | chartonr |
BM78SPPS5MC2,RN4678
Bluetooth® 4.0 Dual mode Module
•
Features:
Bluetooth Classic (BR/EDR) and Low
Energy (LE)
Complete , Fully Certified, Embedded 2.4
GHz Bluetooth® Version 4.0 IC
Bluetooth SIG Certified
Transparent UART mode for seamless
serial data over UART interface
Easy to configure with Windows GUI or
direct by MCU
Firmware can be field upgradable via UART
Compact surface mount module: 22 x 12 x
2.4 mm
Castellated surface mount pads for easy
and reliable host PCB mounting
Perfect for Portable Battery Operated
Devices
Internal Battery Regulator Circuitry
Worldwide regulatory certifications
1 LED and it has 16 steps Brightness.
•
Operational:
Single operating voltage: 3.2V to 4.3V
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
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Data Throughput:
11k bps (BR/EDR)@ UART baud Rate is 115200
bps
8 Kbps (LE) UART baud Rate is 115200 bps
MAC/Baseband/Higher Layer:
Secure AES128 encryption
BTv3.0: GAP, SPP, SDP, RFCOMM and L2CAP
BTv4.0: GAP, GATT, ATT, SMP and L2CAP.
FIGURE 1: BM78 TOP VIEW
Temperature range: -20℃ to 70℃
Industrial
Simple, UART interface
Integrated crystal, internal voltage
regulator, and matching circuitry
Multiple I/O pins for control and status
RF/Analog:
Frequency: 2.402 to 2.480 GHz
Receive Sensitivity: -90 dBm (BR/EDR); -92
dBm (LE)
Power Output: +2 dBm (typ.)
2015 Microchip Technology Inc.
General Description:
The BM78 is a fully-certified Bluetooth®
Version 4.0 (BR/EDR/LE) IC for designers who
want to easily add dual mode Bluetooth®
wireless capability to their products.
Advance Information
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Delivering local connectivity for the
Internet of Things (IoT), the IC bridges your
product to Smart Phones and Tablets for
convenient data transfer, control and
access to cloud applications.
It supports GAP, SDP, SPP, and GATT
profiles. Data is transferred over the
Bluetooth link by sending/receiving data
via transparent UART mode, making it easy
to integrate with any processor or
Microcontroller with a UART interface.
Configuration is made easy using a
Windows® based GUI or directly via UART
2015 Microchip Technology Inc.
by a MCU
Applications:
•
Mobile Point of Sales (mPOS)
•
LED lighting (16 step)
•
Wearables
•
Digital Sports
•
Fitness Devices
•
Health Care/ Medical
•
Automotive Accessories
•
Home Automation
•
Remote Control Toys
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BM78SPPS5MC2 , RN4678
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at docerrors@microchip.com. We welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The
last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
Microchip’s Worldwide Web site; http://www.microchip.com
Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
using.
Customer Notification System
Register on our web site at www.microchip.com to receive the most current information on all of our products.
2015 Microchip Technology Inc.
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BM78SPPS5MC2 , RN4678
1.0 DEVICE OVERVIEW
The BM78 is a complete, fully certified, embedded 2.4 GHz Bluetooth® version 4.0
(BR/EDR/LE) wireless IC. It incorporates an on-board Bluetooth stack, cryptographic accelerator,
power management subsystem, 2.4 GHz transceiver, and RF power amplifier (see Figure 1). With
the BM78, designers can embed Bluetooth functionality rapidly into virtually any device.
•
•
•
•
•
The BM78 provides cost and time-to-market savings as a self-contained Bluetooth solution.
The IC has been designed to provide integrators with a simple Bluetooth solution that features:
Ease of integration and programming
Vastly reduced development time
Minimum system cost
Interoperability with Bluetooth hosts
Maximum value in a range of applications
The BM78 can independently maintain a low-power wireless connection. Low-power usage
and flexible power management maximize the IC’s lifetime in battery-operated devices. A wide
operating temperature range allows use in indoor and outdoor environments (industrial
temperature range).
The BM78 module comes in two varieties. The BM78SPPS3MC2 is a complete, fully
regulatory certified module with integral ceramic chip antenna and shield. The BM78SPP03MC2 is
a lower cost alternative with external antenna and no shield. The integrator is responsible for the
antenna, antenna matching, and regulatory certifications.
The BM78 is a small, compact, surface mount module with castellated pads for easy and
reliable host PCB mounting. The module is compatible with standard pick-and-place equipment.
TABLE 1‐1: BM78 MODULE FAMILY TYPES
Device
Antenna
Shield
BM78SPPS5NC2
Integral ceramic chip Yes
BM78SPP05NC2
External
No
Regulatory Certifications
FCC, IC, CE, KCC, NCC, Japan
NO
FIGURE 1: Block Diagram
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BM78SPPS5MC2 , RN4678
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BM78SPPS5MC2 , RN4678
FIGURE 1‐2: BM78SPPS5NC2 PIN DIAGRAM
FIGURE 1‐3: BM78SPP05NC2 PIN DIAGRAM
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BM78SPPS5MC2 , RN4678
TABLE 1‐1: PIN DESCRIPTION
S5
03
Symbol
pin
pin
-GND
-GND
GND
BAT_IN
Type
Description
Power
Power
Power
Power
Ground reference
Ground reference
Ground reference
Battery Input. Main positive supply input.
Connect to 10uF (X5R/X7R) capacitor.
Software Button H: Power On / L: Power Off
Internal 3.3V LDO regulator output.
Connect to 10uF (X5R/X7R) capacitor.
I/O positive supply input.
Ensure VDD_IO and MCU I/O voltages are compatible.
Internal 1.8V LDO regulator output.
Connect to 10uF (X5R/X7R) capacitor.
Wakeup from shutdown mode (active low)
(internal pull-up)
Power management unit output.
Connect to 1uF (X5R/X7R) capacitor.
UART_TX_IND:
H: BM78 indicate UART data will be transmitted out
after certain timing.
(Setting by UI@ “MCU setting”, default wait 5ms)*1
L: Otherwise.
STATUS_IND_2:
BM78 State indication , refer to P1_5
STATUS_IND:
Bluetooth link status indication
I2C SCL (Do Not Connect)
I2C SDA (Do Not Connect)
Configurable Control or Indication pin or
UART CTS (input)
Configurable Control or Indication pin
Configurable Control or Indication pin or
UART RTS (output)
System configuration (internal pull-up)
System configuration (internal pull-up)
System configuration (internal pull-down)
Module reset (active low) (internal pull-up)
Apply a pulse of at least 63 ns.
UART data input
UART data output
Configurable Control or Indication pin
(when configured as input: internal pull-up)
Configurable Control or Indication pin
(when configured as input: internal pull-up)
SW_BTN
LDO33_O
DI
Power
VDD_IO
Power
LDO18_O
Power
WAKEUP
DI
10
PMULDO_O
Power
11
P0_4
DO
12
10
P1_5
DO
13
14
15
11
12
13
P1_2/SCL
P1_3/SDA
P1_7/CTS
DO
DIO
DIO
16
17
14
15
P0_5
P0_0/RTS
DIO
DIO
18
19
20
21
16
17
18
19
P2_0
P2_4
EAN
RST_N
DI
DI
DI
DI
22
23
24
20
21
22
RXD
TXD
P3_1
DI
DO
DIO
25
23
P3_2
DIO
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BM78SPPS5MC2 , RN4678
26
24
P3_3
DIO
Configurable Control or Indication pin
(when configured as input: internal pull-up)
27
25
P3_4
DIO
Configurable Control or Indication pin
(when configured as input: internal pull-up)
28
26
P3_6
DIO
(Do Not Connect)
29
27
P3_7
DIO
Configurable Control or Indication pin
(when configured as input: internal pull-up)
30
28
LED1
DO
Status LED
31
29
GND
Power
Ground reference
-30
BT_RF
AIO
External antenna connection (50 ohm)
32
-GND
Power
Ground reference
33
-GND
Power
Ground reference
Note 1: Pin type abbreviation: A = Analog, D = Digital, I = Input, O = Output.
UI setting:
2015 Microchip Technology Inc.
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BM78SPPS5MC2 , RN4678
1.1 Power Tree
Figures 2-1 : Power Tree
1.2
UART Interface
Figures 2-2 : Power and MCU interface examples.
Figure 2‐2 shows an example power scheme using a 3.3 volt to MCU VDD. Battery power is
applied to BAT_IN pin. From the LDO33_O pin, voltage can be routed the VDD_IO pin and external
circuitry including the MCU. This power scheme ensures that BM78 and MCU I/O voltages are
compatible.
CAUTION: The internal 3.3volt LDO current source: 50mA maximum!!
2015 Microchip Technology Inc.
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BM78SPPS5MC2 , RN4678
2.0 Bluetooth behavior auto/manual pattern configuration
Power ON
Auto Pattern Setting
Enabled
Disabled
Configure Mode
Manual Pattern
Auto Pattern
2.1 auto pattern
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BM78SPPS5MC2 , RN4678
Configure mode
Access State
Standby mode
Link back mode
Pairing Procedure
Link state
Connected mode
Shutdown state
Shutdown mode
2.2 Manual pattern
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BM78SPPS5MC2 , RN4678
2.3 UI setting
NOTE: Please reference “Application Note_IS1678S_Draft.docx” and “IS1678S Command Set v0
97 20140924.docx.”
2015 Microchip Technology Inc.
Advance Information
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BM78SPPS5MC2 , RN4678
3.0 Control and Indication I/O Pins
I/O pins P0_0, P0_5, P1_7, P3_1, P3_2, P3_3, P3_4 and P3_7 are configurable control and
indication I/O. Control signals are input to the BM78. Indication signals are output from the BM78.
Table 4‐1 shows configurable I/O pin assignment to control and indication signals.
Note: that RTS can only be assigned to P0_0 and CTS is assigned to P1_7.
Configuring the BM78 can reference the “Application Note_IS1678S_Draft.docx” and
“IS1678S Command Set v0 97 20140924.docx.”
P0_0
P0_5
P1_7
P3_1
P3_2
P3_3
P3_4
P3_7
PROFILE_IND
INQUIRY CONTROL
PAIRING_KEY
UART_RX_IND
LINK_DROP_CONTROL
(DISCONNECT)
GET WIFI INFO KEY
RSSI_IND
LOW_BATTERY_IND
UART_CTS
UART_RTS
N/C
TABLE 3‐1: CONFIGURATION AND INDICATION I/O ASSIGNMENTS
■
■
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■
■
■
■
■
■
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BM78SPPS5MC2 , RN4678
3.1 UI setting
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BM78SPPS5MC2 , RN4678
4.0 Status Indication I/O Pins
I/O pins P1_5 and P0_4 are Status Indicator 1 and 2 signals respectively. Together they
provide status indication to the MCU as shown in Table 4‐1.
TABLE 4‐1: STATUS INDICATION
P1_5
P0_4
/STATUS_IND_1
/STATUS_IND_2
Indication
Power-on to setting default and Shutdown State.
HH status should be stable for at least 500ms
Access state
Link state
(UART data between being and stop transmitted)
Link state (UART data stop transmitted)
4.1 System Configuration
I/O pins P2_0, P2_4, and EAN place the BM78 into operation modes as shown in Table 4‐2.
P2_0 , P2_4and EAN each have internal pull-ups.
TABLE 4‐2: SYSTEM CONFIGURATION SETTINGS
IC
P2_0
P2_4
EAN
IS1678S
Operational Mode
Low
High
High
Write EEPROM and test mode
High
High
High
Normal operation / APP Mode
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BM78SPPS5MC2 , RN4678
5.0 Software Button (SW_BTN)
The Software Button (SW_BTN) input pin powers the BM78 on (high) or off (low) in to S4 mode.
Figures 5‐1 : SW_BTN Time (high) @APP mode
Note:
A. P0_4/P1_5 state: Refer to table5-1
B. Reset is floating.
Figures 5‐2 : SW_BTN Time (low) at access states.
Note:
A. SW_BTN pull low can’t active on Shutdown State.
B. Reset is floating.
Figures 5‐3 : SW_BTN Time (low) at link states.
2015 Microchip Technology Inc.
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BM78SPPS5MC2 , RN4678
Note:
C. *1: this time by iPhone LE mode disconnect time.
D. SW_BTN pull low can’t active on Shutdown State.
E. Reset is floating.
6.0 WAKE UP
The Wake Up input pin wakes the BM78 from shutdown mode (active low).
Figures 6‐1 : WAKE_UP Time at Shutdown State.
7.0 EXTERNAL RESET
A watchdog timer capable of reset the chip. It has an integrated Power-On Reset (POR)
circuit that resets all circuits to a known power-on state. This action can also be driven by an
external reset signal that can be used to externally control the device, forcing it into a power-on
reset state. The RST signal input is active low and no connection is required in most applications.
Figures 7 ‐1 : Reset Time at Shutdown State.
2015 Microchip Technology Inc.
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BM78SPPS5MC2 , RN4678
Note:
a. Auto pattern can use external reset.
b. Manual pattern can use external reset and reset command.
8.0 LED DRIVER
There are one dedicate LED drivers to control the LEDs. The LED can be connected directly
with BM78. The LED max current is 4 mA and it has 16 steps to trim Brightness.
LDO33_O
LED1
BM78
The status LED (LED1) indicates:
Standby
Link Back
Low Battery
Inquiry
Link
Page
Each indication is a configurable flashing sequence. LED brightness can also be configured.
9.0 MEMORY
A synchronous single port RAM interface is used. There are sufficient ROM and RAM to
fulfill the requirement of processor. A register bank, a dedicated single port memory and a flash
memory are connected to the processor bus. The processor coordinates all the link control
procedures and data movement using a set of pointers registers.
2015 Microchip Technology Inc.
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BM78SPPS5MC2 , RN4678
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BM78SPPS5MC2 , RN4678
10.0 Throughput
The BM78 UART pins TXD and RXD connect to the UART pins of the host MCU. It is highly
recommended to use hardware flow control pins RTS and CTS. The BM78 hardware flow control is
disabled by default and must be configured to enable. The UART Baud is configurable. The
available signal rates are listed in Table 10‐1.
TABLE 10‐1: UART BAUD
Baud
Crystal Frequency (MHz)
Actual Baud
Error Rate (%)
921600
460800
16
16
941176
457143
2.12
-0.79
307200
16
307692
0.16
230400
16
231884
0.64
115200
57600
38400
16
16
16
117647
57145
38462
2.1
-0.97
0.16
28800
19200
16
16
28623
19231
-0.62
0.16
14400
9600
16
16
14480
9615
0.55
0.16
4800
2400
16
16
4808
2399
0.16
-0.03
TABLE 10‐2: APP mode Throughput report
BR/EDR mode
iPad mini (Wi‐Fi disable){iOS 7.0.4 (11B554a)}
921600 bps
echo Tx
Burst Throughput(byte/s) 14384.46
Normal
8437.462
Throughput(byte/s)
BR/EDR mode
echo Rx
Tx
Rx
9845.31
14521.5 14333.3
8375.28
6674.11 14399.4
iPad mini (Wi‐Fi disable){iOS 7.0.4 (11B554a)}
115200 bps
echo Tx
Burst Throughput(byte/s) 11080.55
Normal
6248.758
Throughput(byte/s)
BR/EDR mode
921600 bps
Normal
Throughput(byte/s)
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echo Rx
9284.37
6211.69
Tx
Rx
11640.3 11134.8
11513
11158.4
Android Samsung Note3/Android 4.3
echo Tx
echo Rx
9727.704
9041.34
Tx
Rx
17030.1 10233.6
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BM78SPPS5MC2 , RN4678
BR/EDR mode
115200 bps
Normal
Throughput(byte/s)
LE mode
115200 bps
Normal
Throughput(byte/s)
LE mode
921600 bps
Normal
Throughput(byte/s)
2015 Microchip Technology Inc.
Android Samsung Note3/Android 4.3
echo Tx
echo Rx
Tx
Rx
11312.2
10548.5
9842.5
11436.4
iPad mini (Wi‐Fi disable){iOS 7.0.4 (11B554a)}
RX
Rx
TX
(response)
(Reliable Burst Transmit)
7935.2
3337.3
7082.1
iPad mini (Wi‐Fi disable){iOS 7.0.4 (11B554a)}
RX
Rx
TX
(response)
(Reliable Burst Transmit)
8063.2
3384.5
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BM78SPPS5MC2 , RN4678
11.0 Mounting Details
The BM78 SPPS5NC2 physical dimensions are shown in Figure 11-1, recommended host PCB footprint
in Figure 11-2, and mounting suggestion in Figure 11-3. There should not be top copper layer near the
test pin area shown in Figure 11-2. When laying out the host PCB, the areas under the antenna should
not contain any top, inner layer, or bottom copper as shown in Figure 11-3. A low-impedance ground
plane will ensure best radio performance (best range, lowest noise). Figure 11-3 shows a minimum
ground plane area to the left and right of the module for best antenna performance. The ground plane
can be extended beyond the minimum recommended as need for host PCB EMC noise reduction. For
best range performance, keep all external metal away from the ceramic chip antenna at least 31 mm.
The BM78SPP03MC2 physical dimensions are shown in Figure 11-4, recommended host PCB footprint in
Figure 11-5, and mounting suggestion in Figure 11-6. It is highly recommended to layout the host PCB as
suggested in Figure 11-6. A low-impedance ground plane will ensure best radio performance (best
range, lowest noise). Pin 30 (BT_RF) is a 50 ohm connection to an external antenna connector, PCB
trace antenna, or component (ceramic chip) antenna through a host PCB 50 ohm micro-strip trace. This
trace can be extended to include passive parts for antenna attenuation padding, impedance matching,
or to provide test posts. It is recommended that the micro-strip trace be as short as possible for
minimum loss and best impedance matching. If the micro-strip trace is longer, it should be a 50 ohm
impedance. Figure 11-6 shows an example connection to U.FL connector.
Soldering Recommendations
The BM78 wireless module was assembled using standard lead-free reflow profile IPC/JEDEC J-STD-020.
The module can be soldered to the host PCB using standard leaded and lead-free solder reflow profiles.
To avoid damaging the module, the following recommendations are given:
•
•
•
•
•
•
Microchip Technology Application Note AN233 Solder Reflow Recommendation (DS00233)
provides solder reflow recommendations
Do not exceed peak temperature (TP) of 250 deg C
Refer to the solder paste data sheet for specific reflow profile recommendations
Use no-clean flux solder paste
Do not wash as moisture can be trapped under the shield
Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.
2015 Microchip Technology Inc.
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BM78SPPS5MC2 , RN4678
FIGURE 11‐1: BM78SPPS5NCS MODULE DIMENSIONS
FIGURE 11‐2: BM78SPPS5NC2 RECOMMEDED PCB FOOTPRINT
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BM78SPPS5MC2 , RN4678
FIGURE 11‐3: BM78SPPS5NCS HOST PCB MOUNTING SUGGESTION
>4.7mm
Top and Bottom Copper
layer keep out area
>6.4mm
Edge of
host PCB
Top Copper Layer
Bottom Copper Layer
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BM78SPPS5MC2 , RN4678
FIGURE 11‐4: BM78SPP05NCS MODULE DIMENSIONS
FIGURE 11‐5: BM78SPP05NC2 RECOMMEDED PCB FOOTPRINT
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BM78SPPS5MC2 , RN4678
FIGURE 11‐6: BM78SPP05NCS HOST PCB MOUNTING SUGGESTION
Top Copper Layer
Bottom Copper Layer
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BM78SPPS5MC2 , RN4678
12.0
ANTENNA PLACEMENT RULE
For Bluetooth product, antenna placement will affect whole system performance.
Antenna need free space to transmit RF signal, it can’t be surround by GND plane.
Here are some examples of good and poor placement on a Main Application board with GND plane.
FIGURE 12-1: KEEP OUT AREA SUGGESTION FOR ANTENNA
For more detail free space of antenna placement design, you can reference the design rule of
antenna produce vendor.
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BM78SPPS5MC2 , RN4678
12-2
BM78SPPS5NC2 Ceramic Chip Antenna
The BM78SPPS5NC2 module contains an integral ceramic chip antenna. The antenna performance on
the module is shown in Figure 12-2.
FIGURE 12‐2: BM78SPPS5NC2 ANTENNA RADIATION PATTERN
Gain (dBi)
5.0
0.0
Y-ax
is
x is
X-a
-5.0
Z-axis
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
Frequency
Max Gain
Efficiency
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2450 MHz
1.63 dBi
71.55%
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13.0
Electrical Characteristics
Recommended Operating Conditions
Rating
Min
Typ
Max
Storage temperature range
-65ºC
+25ºC
+150ºC
Ambient Operating temperature range
-20ºC
+25ºC
+70ºC
Relative Humidity (Operating)
10%
90%
Relative Humidity (Storage)
10%
90%
HBM
±2KV
MM
200V
ESD
HTOL (*1)
1000 hrs
Supply voltage : BAT_IN
3.2V
4.3V
SW_BTN
1.7V
4.3V
LED1
3.6V
Reset VTH,res threshold voltage
1.6V
IOH
12mA
IOL
12mA
VIL input logic levels low
-0.3V
0.8V
VIH input logic levels high
2.0V
3.6V
VOL output logic levels low
VOH output logic levels high
0.4V
2.4V
RF TX mode
43 mA
RF RX mode
37 mA
1) HTOL life test condition : +125ºC , BAT_IN=4.2V, LDO33_O= 3.3V, LDO18_O=1.9V
1.8V LDO
(*1)(*2)
Min
Operation Temperature
-20
(*3)
Input Voltage (Vin)
2.0
Output Current (VIN=3.0v/load regulation with
80mV drop)
Quiescent Current (Vin <3.0V)
Typ
Max
70
3.6
Unit
℃
100
mA
13
uA
1) With 1uF capacitors at LDO18_O as the condition of IP verification.
2) Output voltage can calibration by MP tool
3.3V LDO
(*1)(*2)
Min
Operation Temperature
-20
Input Voltage (Vin)
3.2
Output Current (VIN=3.6v / load regulation with
100mV drop)
Quiescent Current(VIN=3.6v)
Typ
Max
70
4.3
Unit
℃
100
mA
150
uA
1) With 10uF capacitor at LDO33_O as the condition of IP verification
2) Output voltage can calibration by MP tool
PMU LDO
(*1)(*2)
Min
Operation Temperature
-20
Input Voltage (Vin)
3.2
Output Current (VIN=3.6v / load regulation
with 0.3mV drop)
Quiescent Current(VIN=3.6v)
Typ
Max
70
4.3
Unit
℃
100
uA
120
uA
1) With 1uF capacitor at PMULDO_O as the condition of IP verification.
2) Output voltage can calibration by MP tool
SAR‐ADC and Battery Voltage Detector
Operation Temperature
AVDD_SAR power supply
SAR_BAT(BAT_IN)
Resolution
Min
-20
Typ
Max
70
Unit
℃
4.5
bit
1.8
1.1
10
Operating Current (including bandgap)
Shutdown Current
mA
uA
1) SAR_BAT is shorted to BAT_IN internally for battery voltage detection.
Intensity controllable LED driver
Operation Temperature
Open-drain Voltage
Current Step
Programmable Current Range
Intensity control
Power down open-drain current
Shutdown Current
Min
-20
Typ
Max
70
3.6
0.3
16
Unit
℃
mA
mA
step
uA
uA
14.0
Radio Characteristics:
Transmitter Performance (25℃
℃)
Min
BDR power
EDR power
LE power
Typ
Max
Bluetooth
specification
-6 ~ +4
-6 ~ +4
-20 ~ +10
Unit
dBm
NOTE:
1) The RF Transmit power calibrated during production using MP Tool software and MT8852
Bluetooth Test equipment.
2) Test condition: VCC_RF= 1.80V, temperature=25 ºC.
Receiver Performance (25℃
℃)
Basic Data Rate
BDR Sensitivity
EDR 2M Sensitivity
EDR 3M Sensitivity
LE Sensitivity
Min
Typ
Max
-90
-90
-82
-92
NOTE:
1)
Test condition: VCC_RF= 1.80V, temperature=25 ºC.
Bluetooth
specification
Unit
≤-70
dBm
15.0
System Current Consumption
SUPPLY CONSUMPTION – CLASSIC (1)
Parameter
Standby mode
Current (avg.)
Units : mA
Current2.543
shutdown mode
0.187
Connected + Sniff, Master (no data)
0.541
Connected + Sniff, Slave (no data)
0.551
Data, Master
10.67
Data, Slave
14.87
Notes
No data was transmitted
Sniff interval = 500ms
No data was transmitted
Sniff interval = 500ms
(Data transmitted at 115200 bps;
block size=500)
(Data transmitted at 115200 bps;
block size=500)
Note 1: Classic BR/EDR, RX_IND Function Enabled
2. The DATA from IS1678S-151
SUPPLY CONSUMPTION –LOW ENERGY (1)
Current (avg.)
Parameter
Units : mA
Notes
Shutdown mode
0.13
LE fast advertising
1.21
LE fast advertising interval =100 ms
0.88
LE fast advertising interval = 160 ms
0.48
LE fast advertising interval = 500 ms
1.72
0.39
LE fast advertising interval = 100 ms +
Beacon 100 ms
LE fast advertising interval = 500 ms +
Beacon 500 ms
LE Reduced Power advertising
interval = 961 ms
LE Reduced Power advertising
interval = 961 ms+ Beacon 100 ms
LE Reduced Power advertising
interval = 961 ms + Beacon 500 ms
Connection interval = 1500 ms
0.43
Connection interval = 600 ms
0.45
Connection interval = 500 ms
0.60
Connection interval = 200 ms
6.6
Connection interval = 500 ms
7.0
Connection interval = 200 ms
0.62
Reduced Power advertising
0.39
1.00
0.51
Connected (No data)
Connected (iPhone6IC)
Connected (ICiPhone6)
Note 1. Only Low Energy, RX_IND Function Enabled
2. The DATA from IS1678S-151
3
33
32
GND
BAT_IN
SW_BTN
LDO33_0
VDD_IO
BAT_IN
C1
10u/16V
LDO33_O
WAKEUP
BAT_IN
SW_BTN
LDO33_O
VDD_IO
LDO18_O
WAKEUP
PMULDO_O
P0_4
P1_5
P12 / SCL
P13 / SDA
GND
LED1
P3_7
P3_6
P3_4
P3_3
P3_2
P3_1
HCI_TXD
HCI_RXD
31
30
29
28
27
26
25
24
23
22
P3_7
P3_6
P3_4
P3_3
P3_2
P3_1
UART_TXD
UART_RXD
Reset for I2C IC
LDO33_O
LED1
LED-B
P0_4
P1_5
Status_IND
MCU
P0_0
P1_7
UART CTS / RTS
15
16
17
18
19
20
21
P1_7
P0_5
P0_0
P2_0
P2_4
EAN
RST_N
P0_4
P1_5
P1_2
P1_3
Functional GPIO
P3_6
10
11
12
13
14
P1_7
P0_5
P0_0
P2_0
P2_4
EAN
RST_N
UART_RXD
UART_TXD
WAKEUP
TP2 TP-2
TP3 TP-2
P2_0
Test PIN
TP6 TP-2
TP4 TP-2
BAT_IN
TP7 TP-2
P2_4
UART TXD / RXD
WAKEUP
SW_BTN
RST_N
SW_BTN
RST_N
TP5 TP-2
SW_BTN
PMULDO_O
TP8 TP-2
UART_RXD
TP9 TP-2
RST_N
LDO18_O
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park,
TP10TP-2
TP11TP-2
EAN
TP12TP-2
UART_TXD
TP13TP-2
Hsinchu City 30078, Taiwan
TEL. 886-3-5778385
LDO33_O
P/ N
Bo a r d
Na m
0222
BM78S REFERANCE CIRCUIT
T ti e
Re v
Sz
i e
Custom
1.0
MAIN CIRCUIT
Da t e :
Sh e e t
Friday , April 24, 2015
o f
REFERENCE CIRCUIT
BM78 Reference Circuit
16.0
P3_7
P3_4
P3_3
P3_2
P3_1
P0_5
FP1
FP-BM78SPPA
1.0
REGULATORY APPROVAL
This section outlines the regulatory information for the BM78SSPS5MC2 module for the following
countries:
• United States
• Canada
• Europe
• Australia
• Japan
• Korea
• Taiwan
• China
1.2
United States
The BM78SSPS5MC2 module has received Federal Communications Commission (FCC) CFR47
Telecommunications, Part 15 Subpart C “Intentional Radiators” modular approval in accordance with Part
15.212 Modular Transmitter approval. Modular approval allows the end user to integrate the BM78
module into a finished product without obtaining subsequent and separate FCC approvals for intentional
radiation, provided no changes or modifications are made to the module circuitry. Changes or
modifications could void the user’s authority to operate the equipment. The end user must comply with all
of the instructions provided by the Grantee, which indicate installation and/or operating conditions
necessary for compliance.
PENDING
The finished product is required to comply with all applicable FCC equipment authorizations regulations,
requirements and equipment functions not associated with the transmitter module portion. For example,
compliance must be demonstrated to regulations for other transmitter components within the host
product; to requirements for unintentional radiators (Part 15 Subpart B “Unintentional Radiators”), such
as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements
for the non-transmitter functions on the transmitter module (i.e., Verification, or Declaration of
Conformity) (e.g., transmitter modules may also contain digital logic functions) as appropriate.
1.2.1
LABELING AND USER INFORMATION REQUIREMENTS
The BM78 module has been labeled with its own FCC ID number, and if the FCC ID is not visible when the
module is installed inside another device, then the outside of the finished product into which the module
is installed must also display a label referring to the enclosed module. This exterior label can use wording
as follows:
Contains Transmitter Module FCC ID: A8TBM78ABCDEFGH
or
Contains FCC ID: A8TBM78ABCDEFGH
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) this device may not cause harmful interference,
and (2) this device must accept any interference received, including
interference that may cause undesired operation
A user’s manual for the finished product should include the following statement:
This equipment has been tested and found to comply with the limits for a
Class B digital device, pursuant to part 15 of the FCC Rules. These limits are
designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses and can radiate radio
frequency energy, and if not installed and used in accordance with the
instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one or
more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that
to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
Additional information on labeling and user information requirements for Part 15 devices can be found in
KDB Publication 784748 available at the FCC Office of Engineering and Technology (OET) Laboratory
Division Knowledge Database (KDB) http://apps.fcc.gov/oetcf/kdb/index.cfm.
1.2.2
RF EXPOSURE
All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF
Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities,
operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by
the Federal Communications Commission (FCC).
From the FCC Grant: Output power listed is conducted. This grant is valid only when the module is sold to
OEM integrators and must be installed by the OEM or OEM integrators. This transmitter is restricted for
use with the specific antenna(s) tested in this application for Certification and must not be co-located or
operating in conjunction with any other antenna or transmitters within a host device, except in accordance
with FCC multi-transmitter product procedures.
1.2.3
HELPFUL WEB SITES
Federal Communications Commission (FCC): http://www.fcc.gov
FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB):
http://apps.fcc.gov/oetcf/kdb/index.cfm
1.3
Canada
The BM78SPPS5MC2 module has been certified for use in Canada under Industry Canada (IC) Radio
Standards Specification (RSS) RSS-210 and RSS-Gen. Modular approval permits the installation of a module
in a host device without the need to recertify the device.
1.3.1
LABELING AND USER INFORMATION REQUIREMENTS
Labeling Requirements for the Host Device (from Section 3.2.1, RSS-Gen, Issue 3, December 2010): The
host device shall be properly labeled to identify the module within the host device.
The Industry Canada certification label of a module shall be clearly visible at all times when installed in the
host device, otherwise the host device must be labeled to display the Industry Canada certification
number of the module, preceded by the words “Contains transmitter module”, or the word “Contains”, or
similar wording expressing the same meaning, as follows:
PENDING
Contains transmitter module IC: 12246A-BM78SPPS5M2
User Manual Notice for License-Exempt Radio Apparatus (from Section 7.1.3 RSS-Gen, Issue 3, December
2010): User manuals for license-exempt radio apparatus shall contain the following or equivalent notice in
a conspicuous location in the user manual or alternatively on the device or both:
This device complies with Industry Canada license-exempt RSS standard(s).
Operation is subject to the following two conditions: (1) this device may not
cause interference, and (2) this device must accept any interference, including
interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux
appareils radio exempts de licence. L'exploitation est autorisée aux deux
conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2)
l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi,
même si le brouillage est susceptible d'en compromettre le fonctionnement.
1.3.2
RF EXPOSURE
All transmitters regulated by IC must comply with RF exposure requirements listed in RSS-102 - Radio
Frequency (RF) Exposure Compliance of Radiocommunication Apparatus (All Frequency Bands).
(Get direct quote from Certificate and place here)
1.3.3
HELPFUL WEB SITES
Industry Canada: http://www.ic.gc.ca/
1.4
Europe
The BM78SPPS5MC2 module is an R&TTE Directive assessed radio module that is CE marked and has been
manufactured and tested with the intention of being integrated into a final product.
The BM78 module has been tested to R&TTE Directive 1999/5/EC Essential Requirements for Health and
Safety (Article (3.1(a)), Electromagnetic Compatibility (EMC) (Article 3.1(b)), and Radio (Article 3.2) and are
summarized in Table 3‐1: European Compliance Testing. A Notified Body Opinion has also been issued. All
test reports are available on the BM78 product web page at http://www.microchip.com/bm78.
The R&TTE Compliance Association provides guidance on modular devices in document Technical
Guidance Note 01 available at http://www.rtteca.com/html/download_area.htm.
Note: To maintain conformance to the testing listed in Table 3‐1: European Compliance Testing, the
module shall be installed in accordance with the installation instructions in this data sheet and shall
not be modified.
When integrating a radio module into a completed product the integrator becomes the manufacturer
of the final product and is therefore responsible for demonstrating compliance of the final product
with the essential requirements of the R&TTE Directive.
PENDING
1.4.1
LABELING AND USER INFORMATION REQUIREMENTS
The label on the final product which contains the BM77 module must follow CE marking requirements. The
R&TTE Compliance Association Technical Guidance Note 01 provides guidance on final product CE
marking.
1.4.2
ANTENNA REQUIREMENTS
From R&TTE Compliance Association document Technical Guidance Note 01:
Provided the integrator installing an assessed radio module with an integral or specific antenna
and installed in conformance with the radio module manufacturer’s installation instructions
requires no further evaluation under Article 3.2 of the R&TTE Directive and does not require
further involvement of an R&TTE Directive Notified Body for the final product. [Section 2.2.4]
The European Compliance Testing listed in Table 3‐1 was performed using the integral ceramic chip
antenna.
TABLE 3‐1: EUROPEAN COMPLIANCE TESTING
Certification
Safety
Health
Standards
EN 60950-1:2006+A11:2009+A1:2010
EN 50371:2002-03
Article
(3.1(a))
Laboratory
Report Number
Date
EMC
Radio
Notified Body
Opinion
EN 301 489-1 V1.8.1 (2008-04)
EN 301 489-17 V2.1.1 (2009-05)
EN 300 328 V1.7.1 (2006-10)
1.4.3
(3.1(b))
(3.2)
HELPFUL WEB SITES
A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in
Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be
downloaded from the European Radio Communications Office (ERO) at: http://www.ero.dk/.
Additional helpful web sites are:
• Radio and Telecommunications Terminal Equipment (R&TTE):
http://ec.europa.eu/enterprise/rtte/index_en.htm
•
European Conference of Postal and Telecommunications Administrations (CEPT):
http://www.cept.org
•
European Telecommunications Standards Institute (ETSI):
http://www.etsi.org
•
European Radio Communications Office (ERO):
http://www.ero.dk
•
The Radio and Telecommunications Terminal Equipment Compliance Association (R&TTE CA):
http://www.rtteca.com/
1.5
Australia
The Australia radio regulations do not provide a modular approval policy similar to the United States (FCC)
and Canada (IC). However, BM77 module RF transmitter test reports can be used in part to demonstrate
compliance in accordance with ACMA Radio communications “Short Range Devices” Standard 2004 (The
Short Range Devices standard calls up the AS/NZS 4268:2008 industry standard). The BM77 module test
reports can be used as part of the product certification and compliance folder. For more information on
the RF transmitter test reports, contact Microchip Technology Australia sales office.
PENDING
To meet overall Australian final product compliance, the developer must construct a compliance folder
containing all relevant compliance test reports e.g. RF, EMC, electrical safety and DoC (Declaration of
Conformity) etc. It is the responsibility of the integrator to know what is required in the compliance folder
for ACMA compliance. All test reports are available on the BM78 product web page at
http://www.microchip.com. For more information on Australia compliance, refer to the Australian
Communications and Media Authority web site http://www.acma.gov.au/.
1.5.1
HELPFUL WEB SITES
The Australian Communications and Media Authority: www.acma.gov.au/.
1.6
Japan
The BM78SPPS5MC2 module has received type certification and is labeled with its own technical
conformity mark and certification number as required to conform to the technical standards regulated by
the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan.
Integration of this module into a final product does not require additional radio certification provided
installation instructions are followed and no modifications of the module are allowed. Additional testing
may be required:
•
If the host product is subject to electrical appliance safety (for example, powered from an AC
mains), the host product may require Product Safety Electrical Appliance and Material (PSE)
PENDING
•
testing. The integrator should contact their conformance laboratory to determine if this testing is
required.
There is an voluntary Electromagnetic Compatibility (EMC) test for the host product administered
by VCCI: http://www.vcci.jp/vcci_e/index.html
1.6.1
LABELING AND USER INFORMATION REQUIREMENTS
The label on the final product which contains the BM78 module must follow Japan marking requirements.
The integrator of the module should refer to the labeling requirements for Japan available at the Ministry
of Internal Affairs and Communications (MIC) website.
The BM78module is labeled with its own technical conformity mark and certification number. The final
product in which this module is being used must have a label referring to the type certified module inside:
Contains transmitter module with certificate number:
202-XXXXXX
1.6.2
HELPFUL WEB SITES
Ministry of Internal Affairs and Communications (MIC): http://www.tele.soumu.go.jp/e/index.htm
Association of Radio Industries and Businesses (ARIB): http://www.arib.or.jp/english/
1.7
Korea
The BM78SPPS5MC2 module has received certification of conformity in accordance with the Radio Waves
Act. Integration of this module into a final product does not require additional radio certification provided
installation instructions are followed and no modifications of the module are allowed.
1.7.1
PENDING
LABELING AND USER INFORMATION REQUIREMENTS
The label on the final product which contains the BM77 module must follow KC marking requirements. The
integrator of the module should refer to the labeling requirements for Korea available on the Korea
Communications Commission (KCC) website.
The BM78 module is labeled with its own KC mark. The final product requires the KC mark and certificate
number of the module:
(Number)
1.7.2
HELPFUL WEB SITES
Korea Communications Commission (KCC): http://www.kcc.go.kr
National Radio Research Agency (RRA): http://rra.go.kr
1.8
Taiwan
The BM78SPPS5MC2 module has received compliance approval in accordance with the
Telecommunications Act. Customers seeking to use the compliance approval in their product should
contact Microchip Technology sales or distribution partners to obtain a Letter of Authority.
PENDING
Integration of this module into a final product does not require additional radio certification provided
installation instructions are followed and no modifications of the module are allowed.
1.8.1
LABELING AND USER INFORMATION REQUIREMENTS
The BM77 module is labeled with its own NCC mark and certificate number as below:
(Number)
The user’s manual should contain below warning (for RF device) in traditional Chinese:
注意 !
依據 低功率電波輻射性電機管理辦法
第十二條 經型式認證合格之低功率射頻電機，非經許可，
公司、商號或使用者均不得擅自變更頻率、加大功率或變更原設計
之特性及功能。
第十四條 低功率射頻電機之使用不得影響飛航安全及干擾合法通信；
經發現有干擾現象時，應立即停用，並改善至無干擾時方得繼續使用。
前項合法通信，指依電信規定作業之無線電信。
低功率射頻電機須忍受合法通信或工業、科學及醫療用電波輻射性
電機設備之干擾。
1.8.2
HELPFUL WEB SITES
National Communications Commission (NCC): http://www.ncc.gov.tw
1.9
Other Regulatory Jurisdictions
Should other regulatory jurisdiction certification be required by the customer, or the customer need to
recertify the module for other reasons, a certification utility is available. For further regulatory
Certification Utility and documentation, contact ISSC Technologies Corp.
FIGURE 20-1: Reflow Profile
Standard : IPC/JEDEC J-STD-020
Condition :
Preheat：150~200℃、60~120 seconds
Average ramp-up rate (217℃ to peak): 3℃/sec max.
Temperature maintained above 217℃ : 60~150 seconds
Time within 5℃ of peak temperature: 30 ~ 40 seconds.
Peak temperature：260 +5/-0 ℃
Ramp-down rate (peak to 217℃) : 6℃/sec. max.
Time 25℃ to peak temperature : 8 minutes max.
Cycle interval：5 minutes
Soldering Recommendations
Stereo module was assembled using standard lead-free reflow profile IPC/JEDEC J-STD-020. The
module can be soldered to the main PCB using standard leaded and lead-free solder reflow profiles. To
avoid damaging of the module, the recommendations are listed as follows:
•
•
•
•
•
•
Refer to Microchip Technology Application Note AN233 Solder Reflow Recommendation (DS00233)
for the soldering reflow recommendations
Do not exceed peak temperature (TP) of 250 degree C
Refer to the solder paste data sheet for specific reflow profile recommendations
Use no-clean flux solder paste
Do not wash as moisture can be trapped under the shield
Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.
ORDERING INFORMATION
TABLE 4‐1: ORDERING INFORMATION
Part Number
Description
BM78SPPS5NC2-000--Bluetooth® 4.0 Dual Mode, Class 2, Surface Mount module with integral
antenna, with shield
BM78SPP05NC2-000--Bluetooth® 4.0 Dual Mode, Class 2, Surface Mount module, external
antenna, no shield
A.3.3 HELPFUL WEB SITES
A document that can be used as a starting point in understanding the use of Short Range
Devices (SRD) in Europe is the European Radio Communications Committee (ERC)
Recommendation 70‐03 E, which can be downloaded from the European Radio
Communications Office (ERO) at: http://www.ero.dk/.
Additional helpful web sites are:
• Radio and Telecommunications Terminal Equipment (R&TTE):
http://ec.europa.eu/enterprise/rtte/index_en.htm
•
European Conference of Postal and Telecommunications Administrations (CEPT):
http://www.cept.org
•
European Telecommunications Standards Institute (ETSI):
http://www.etsi.org
•
European Radio Communications Office (ERO):
http://www.ero.dk
•
The Radio and Telecommunications Terminal Equipment Compliance Association
(R&TTE CA):
http://www.rtteca.com/
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
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Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
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Fax: 43-7242-2244-393
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Fax: 972-818-2924
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China - Chengdu
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Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Dusseldorf
Tel: 49-2129-3766400
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Pforzheim
Tel: 49-7231-424750
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Poland - Warsaw
Tel: 48-22-3325737
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
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