MitraStar Technology M4G-641 M4G-641 LTE FDD MODULE User Manual User Guide

MitraStar Technology Corporation M4G-641 LTE FDD MODULE User Guide

User Guide

© 2012 MitraStar Technology Corp. All Rights Reserved. Ver. 1.2  3GPPTS 36.521 Compliant (LTE FDD)  R8. Software upgradable to R9  FDD Dual Band Band 13 Band 4  Standard mPCIe minicard Form Factor  23dBm Transmission Power Wireless Broadband LTE Solutions MitraStar M4G-641 LTE FDD Module Band 13 & Band 4 supported Field Proved LTE Technology M4G-641 is based on Altair Semiconductor’s high performance LTE chipsets of FourGee3100 baseband and FourGee6202 RFIC chip. It supports 3GPP R8 and R9 upgradable without hardware change. It supports LTE connection using single software and implements a high performance MIMO receiver. Altair FourGee 3100/6202 LTE chipset is Verizon Wireless pre-certified to run over Verizon’s 4G LTE network. Fast Hook Up Standard Minicard Interface M4G-641 adapts the standard mini-PCIe minicard with 52 pin connector. The dimension is 51(L) x 30(W) x 5(H)mm. Both sides have components. Two antenna connectors are provided. The operation temperature ranged from -30°C to 60°C. Easy Enable with Hostless Driver Support M4G-641 supports hostless driver architecture on Linux and Windows. The advantage of this kind of driver requires a lower-end process to establish LTE connection and run traffic through LTE network. This will let most lower-end machine-to-machine applications to use 4G wireless broadband LTE high speed network in the first moment.
© 2012 MitraStar Technology Corp. All Rights Reserved. Ver. 1.2 Specifications LTE Air Interface  3GPPTS 36.521 Compliant R8 compliance Software upgradeable to R9.  Duplex mode: FDD  Band 13 Uplink 777-787MHz Downlink 746-756MHz  Band 4 Uplink 1710-1755 MHz Downlink 2110-2155 MHz  Channel Bandwidth: 1.4MHz, 3MHz, 5MHz, 10MHz, 15MHz and 20MHz.  Modulation: Uplink QPSK, 16QAM Downlink QPSK, 16QAM, 64QAM  Transmsit Power : 23±1 dBm  Receive Sensitivity: -97dBm @ QPSK 1/2. 10MHz channel bandwidth  Antenna: Two antenna connectors Main RF for transmit & receive Auxiliary RF for receive diversity Hardware Specifications  mini-PCIe minicard 52 connector (work in USB mode)  LED : Power/ LTE connection status through minicard interface  SIM card though mini-card interface Power Specification  Input Voltage: 3.3V ± 9%  Power consumption : Average power consumption 3 W Physical Specifications  Dimension: 51(L) x 30(W) x 5(H)mm  Weight: 12g Environmental Specifications  Operation Temperature: -30 oC ~ 60oC  Operation Humidity : 10% ~ 90%  Storage Temperature: -30oC ~ 70oC  Storage Humidity: 10% ~ 95% OS Support  Linux  Microsoft Windows Certification  FCC  RoHS
© 2012 MitraStar Technology Corp. All Rights Reserved. Ver. 1.2 Pin Assignment Pin Number Minicard Standard Pin Define I/O MitraStar LTE module Pin Definition I/O Description 1 WAKE_N O NC - No Connect 2 3V3_Vaux I 3V3_Vaux I Main Board for Module +3V3 System 3 COEX1/NC I/O BUZZER_CTL O USB Mode: no used OP Mode: RSSI Signal Monitor by Voice 4 GND I GND I Ground 5 COEX2/NC I/O RSSI_LED_0 O USB Mode: no used OP Mode: RSSI Signal Monitor by LED 6 1.5V I NC - No Connect 7 CLKREQ_N O LAN_RESET O OP Mode: Rest PHY IC USB Mode: no used 8 UIM_PWR O UIM_PWR O For SIM Slot (Card) Power +1.8V/+3.0V 9 GND I GND I Ground 10 UIM_DATA I/O UIM_DATA I/O SIM Data Signal 11 REF_CLK- I NC - No Connect 12 UIM_CLK O UIM_CLK O SIM Clock Signal 13 REF_CLK+ I NC - No Connect 14 UIM_RST O UIM_RST O SIM Reset Signal 15 GND I GND I Ground 16 UIM_VPP O NC - No Connect 17 UIM_C8 NA NC - No Connect 18 GND I GND I Ground 19 UIM_C4 NA NC - No Connect 20 W_DISABLE_N I W_DISABLE_N I USB Mode: Active Low Signal. System Can Be Use This Signal to Disable Radio Operation. Pull-up Resistor on The Card. (Feature Support) Low: Idle/Sleep Mode High: Operation Mode OP Mode: no used 21 GND I GND I Ground 22 PERST_N I PERST_N I USB Mode: Reset Module OP Mode: no used 23 PERn0 I/O RMII_RXCTL I OP Mode: RMII Interface USB Mode: no used 24 3V3_Vaux I 3V3_Vaux I Main Board for Module +3V3 System 25 PERp0 I/O RMII_TXCTL O OP Mode: RMII Interface USB Mode: no used 26 GND I GND I Ground
© 2012 MitraStar Technology Corp. All Rights Reserved. Ver. 1.2 Pin Number Minicard Standard Pin Define I/O MitraStar LTE module Pin Definition I/O Description 27 GND I GND I Ground 28 1.5V I NC - No Connect 29 GND I GND I Ground 30 SMB_CLK I RMII_MDIO I/O OP Mode: RMII Interface USB Mode: no used 31 PETn0 I/O RMII_RXD0 I OP Mode: RMII Interface USB Mode: no used 32 SMB_DATA I/O RMII_MDC O OP Mode: RMII Interface USB Mode: no used 33 PETp0 I/O RMII_RXD1 I OP Mode: RMII Interface USB Mode: no used 34 GND I GND I Ground 35 GND I GND I Ground 36 USB_D- I/O USB_D- I/O OP Mode: no used USB Mode: Data Interface 37 GND I GND I Ground 38 USB_D+ I/O USB_D+ I/O OP Mode: no used USB Mode: Data Interface 39 3V3_Vaux I 3V3_Vaux-PA I Main Board for PA Power +3V3 (+23dBm) or +4V2 (+26dBm) 40 GND I GND I Ground 41 3V3_Vaux I 3V3_Vaux-PA I Main Board for PA Power +3V3 (+23dBm) or +4V2 (+26dBm) 42 LED_WWAN_N O RSSI_LED_1 X USB Mode: no used OP Mode: RSSI Signal Monitor by LED 43 GND I GND I Ground 44 LED_WLAN_N O RSSI_LED_2 O USB Mode: no used OP Mode: RSSI Signal Monitor by LED 45 NC X RMII_CLK O OP Mode: RMII Interface USB Mode: no used 46 LED_WPAN_N O NC - No Connect 47 NC X RMII_TXD0 O OP Mode: RMII Interface USB Mode: no used 48 1.5V I NC - No Connect 49 NC X RMII_TXD1 O OP Mode: RMII Interface USB Mode: no used 50 GND I GND I Ground 51 NC X NC - No Connect 52 3V3_Vaux I 3V3_Vaux-PA I Main Board for PA Power +3V3 (+23dBm) or +4V2 (+26dBm)
© 2012 MitraStar Technology Corp. All Rights Reserved. Ver. 1.2 Connector Figure 1 Module Connectors Physical Dimension Figure 2 Mechanical Drawing (unit: mm)
© 2012 MitraStar Technology Corp. All Rights Reserved. Ver. 1.2 Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body. End Product Labeling When the module is installed in the host device, the FCC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: “Contains FCC ID: ZMYM4G-641” The grantee's FCC ID can be used only when all FCC compliance requirements are met.
© 2012 MitraStar Technology Corp. All Rights Reserved. Ver. 1.2 This device is intended only for OEM integrators under the following conditions: (1) The antenna must be installed such that 20 cm is maintained between the antenna and users, (2) The transmitter module may not be co-located with any other transmitter or antenna. (3) To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile exposure condition must not exceed:  5.5dBi in LTE Band 4  10dBi in LTE Band 13 In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.

Navigation menu