MitraStar Technology M4G-641 M4G-641 LTE FDD MODULE User Manual User Guide

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Document ID	2137117
Application ID	tM6dM3pJawVFLPaGq7uKEw==
Document Description	User Guide
Short Term Confidential	No
Permanent Confidential	No
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Document Type	User Manual
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Filesize	15.4kB (192558 bits)
Date Submitted	2013-12-09 00:00:00
Date Available	2014-06-07 00:00:00
Creation Date	2017-10-24 18:56:45
Producing Software	GPL Ghostscript 9.18
Document Lastmod	2017-10-24 18:56:45
Document Title	User Guide

Wireless Broadband LTE Solutions
MitraStar M4G-641 LTE FDD Module
Band 13 & Band 4 supported
Field Proved LTE Technology
M4G-641 is based on Altair Semiconductor’s high performance LTE chipsets of
3GPPTS 36.521 Compliant
FourGee3100 baseband and FourGee6202 RFIC chip. It supports 3GPP R8 and R9
(LTE FDD)
upgradable without hardware change. It supports LTE connection using single
R8. Software upgradable to
software and implements a high performance MIMO receiver. Altair FourGee
R9
3100/6202 LTE chipset is Verizon Wireless pre-certified to run over Verizon’s 4G
FDD Dual Band
LTE network.
Band 13
Band 4
Standard mPCIe minicard
Fast Hook Up Standard Minicard Interface
Form Factor
M4G-641 adapts the standard mini-PCIe minicard with 52 pin connector. The
23dBm Transmission Power
dimension is 51(L) x 30(W) x 5(H)mm. Both sides have components. Two antenna
connectors are provided. The operation temperature ranged from -30°C to 60°C.
Easy Enable with Hostless Driver Support
M4G-641 supports hostless driver architecture on Linux and Windows. The
advantage of this kind of driver requires a lower-end process to establish LTE
connection and run traffic through LTE network. This will let most lower-end
machine-to-machine applications to use 4G wireless broadband LTE high speed
network in the first moment.
© 2012 MitraStar Technology Corp. All Rights Reserved.
Ver. 1.2
Specifications
LTE Air Interface
Hardware Specifications
OS Support
3GPPTS 36.521 Compliant
mini-PCIe minicard 52 connector
Linux
R8 compliance
(work in USB mode)
Microsoft Windows
Software upgradeable to R9.
LED : Power/ LTE connection
Duplex mode: FDD
status through minicard interface Certification
Band 13
SIM card though mini-card
FCC
Uplink 777-787MHz
interface
RoHS
Downlink 746-756MHz
Band 4
Power Specification
Uplink 1710-1755 MHz
Input Voltage: 3.3V ± 9%
Downlink 2110-2155 MHz
Power consumption :
Channel Bandwidth:
Average power consumption 3 W
1.4MHz, 3MHz, 5MHz, 10MHz,
15MHz and 20MHz.
Physical Specifications
Modulation:
Dimension:
Uplink QPSK, 16QAM
51(L) x 30(W) x 5(H)mm
Downlink QPSK, 16QAM, 64QAM
Weight: 12g
Transmsit Power : 23±1 dBm
Receive Sensitivity:
Environmental Specifications
-97dBm @ QPSK 1/2. 10MHz
Operation Temperature: -30 oC ~
channel bandwidth
60oC
Antenna:
Operation Humidity : 10% ~ 90%
Two antenna connectors
Storage Temperature: -30oC ~
Main RF for transmit & receive
70oC
Auxiliary RF for receive diversity
Storage Humidity: 10% ~ 95%
© 2012 MitraStar Technology Corp. All Rights Reserved.
Ver. 1.2
Pin Assignment
Pin Number
Minicard
I/O
MitraStar
Standard
LTE module
Pin Define
Pin Definition
WAKE_N
NC
I/O
Description
No Connect
3V3_Vaux
3V3_Vaux
Main Board for Module +3V3 System
COEX1/NC
I/O
BUZZER_CTL
USB Mode: no used
OP Mode: RSSI Signal Monitor by Voice
GND
GND
Ground
COEX2/NC
I/O
RSSI_LED_0
USB Mode: no used
OP Mode: RSSI Signal Monitor by LED
1.5V
NC
No Connect
CLKREQ_N
LAN_RESET
OP Mode: Rest PHY IC
USB Mode: no used
UIM_PWR
UIM_PWR
For SIM Slot (Card) Power +1.8V/+3.0V
GND
GND
Ground
10
UIM_DATA
I/O
UIM_DATA
I/O
11
REF_CLK-
NC
12
UIM_CLK
UIM_CLK
SIM Clock Signal
13
REF_CLK+
NC
No Connect
14
UIM_RST
UIM_RST
SIM Reset Signal
15
GND
GND
Ground
16
UIM_VPP
NC
No Connect
17
UIM_C8
NA
NC
No Connect
18
GND
GND
Ground
19
UIM_C4
NA
NC
No Connect
20
W_DISABLE_N
W_DISABLE_N
USB Mode: Active Low Signal. System Can Be Use This Signal
SIM Data Signal
No Connect
to Disable Radio Operation. Pull-up Resistor on The Card.
(Feature Support)
Low: Idle/Sleep Mode
High: Operation Mode
OP Mode: no used
21
GND
GND
Ground
22
PERST_N
PERST_N
USB Mode: Reset Module
OP Mode: no used
23
PERn0
I/O
RMII_RXCTL
OP Mode: RMII Interface
USB Mode: no used
24
3V3_Vaux
3V3_Vaux
Main Board for Module +3V3 System
25
PERp0
I/O
RMII_TXCTL
OP Mode: RMII Interface
USB Mode: no used
26
GND
GND
© 2012 MitraStar Technology Corp. All Rights Reserved.
Ground
Ver. 1.2
Pin Number
Minicard
I/O
MitraStar
Standard
LTE module
Pin Define
Pin Definition
I/O
Description
27
GND
GND
Ground
28
1.5V
NC
No Connect
29
GND
GND
Ground
30
SMB_CLK
RMII_MDIO
I/O
OP Mode: RMII Interface
USB Mode: no used
31
PETn0
I/O
RMII_RXD0
OP Mode: RMII Interface
USB Mode: no used
32
SMB_DATA
I/O
RMII_MDC
OP Mode: RMII Interface
USB Mode: no used
33
PETp0
I/O
RMII_RXD1
OP Mode: RMII Interface
34
GND
GND
Ground
35
GND
GND
Ground
36
USB_D-
I/O
USB_D-
I/O
USB Mode: no used
OP Mode: no used
USB Mode: Data Interface
37
GND
GND
38
USB_D+
I/O
USB_D+
I/O
Ground
OP Mode: no used
USB Mode: Data Interface
39
3V3_Vaux
3V3_Vaux-PA
Main Board for PA Power +3V3 (+23dBm) or +4V2 (+26dBm)
40
GND
GND
Ground
41
3V3_Vaux
3V3_Vaux-PA
Main Board for PA Power +3V3 (+23dBm) or +4V2 (+26dBm)
42
LED_WWAN_N
RSSI_LED_1
USB Mode: no used
OP Mode: RSSI Signal Monitor by LED
43
GND
GND
Ground
44
LED_WLAN_N
RSSI_LED_2
USB Mode: no used
OP Mode: RSSI Signal Monitor by LED
45
NC
RMII_CLK
OP Mode: RMII Interface
46
LED_WPAN_N
NC
No Connect
47
NC
RMII_TXD0
OP Mode: RMII Interface
USB Mode: no used
USB Mode: no used
48
1.5V
NC
No Connect
49
NC
RMII_TXD1
OP Mode: RMII Interface
USB Mode: no used
50
GND
GND
Ground
51
NC
NC
No Connect
52
3V3_Vaux
3V3_Vaux-PA
Main Board for PA Power +3V3 (+23dBm) or +4V2 (+26dBm)
© 2012 MitraStar Technology Corp. All Rights Reserved.
Ver. 1.2
Connector
Figure 1 Module Connectors
Physical Dimension
Figure 2 Mechanical Drawing (unit: mm)
© 2012 MitraStar Technology Corp. All Rights Reserved.
Ver. 1.2
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF
module in the user’s manual of the end product which integrates this module. The end user manual shall include all
required regulatory information/warning as show in this manual.
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device
may not cause harmful interference, and (2) this device must accept any interference received, including interference that
may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the
FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference
to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to
try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the party responsible for compliance could void the user's
authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other
antenna or transmitter.
Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment
should be installed and operated with minimum distance 20 cm between the radiator & your body.
End Product Labeling
When the module is installed in the host device, the FCC ID label must be visible through a window on the final device or
it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the
outside of the final device that contains the following text: “Contains FCC ID: ZMYM4G-641”
The grantee's FCC ID can be used only when all FCC compliance requirements are met.
© 2012 MitraStar Technology Corp. All Rights Reserved.
Ver. 1.2
This device is intended only for OEM integrators under the following conditions:
(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,
(2) The transmitter module may not be co-located with any other transmitter or antenna.
(3) To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, the
maximum antenna gain including cable loss in a mobile exposure condition must not exceed:
5.5dBi in LTE Band 4
10dBi in LTE Band 13
In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another
transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product.
In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the
transmitter) and obtaining a separate FCC authorization.
© 2012 MitraStar Technology Corp. All Rights Reserved.
Ver. 1.2

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