MobileTek Communication L506 LTE Module User Manual L506 hardware design

Shanghai MobileTek Communication Ltd. LTE Module L506 hardware design

User Manual

/$+DUGZDUH'HVLJQ&RS\ULJKW  6KDQJKDL 0RELOHWHN &RPPXQLFDWLRQ /WG       /+DUGZDUH'HVLJQLTE Module Series Version： V1.0 Date： 2016-09-13 Shanghai Mobiletek Communication Ltd
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdNotice Some features of the product and its accessories described herein rely on the software installed, capacities and settings of local network, and therefore may not be activated or may be limited by local network operators or network service providers. Thus, the descriptions herein may not exactly match the product or its accessories which you purchase. Shanghai Mobiletek Communication Ltd reserves the right to change or modify any information or specifications contained in this manual without prior notice and without any liability. Copyright This document contains proprietary technical information which is the property of Shanghai Mobiletek Communication Ltd. copying of this document and giving it to others and the using or communication of the contents thereof, are forbidden without express authority. Offenders are liable to the payment of damages. All rights reserved in the event of grant of patent or the registration of a utility model or design. All specification supplied herein are subject to change without notice at any time. DISCLAIMER ALL CONTENTS OF THIS MANUAL ARE PROVIDED “AS IS”. EXCEPT AS REQUIRED BY APPLICABLE LAWS, NO WARRANTIES OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE, ARE MADE IN RELATION TO THE ACCURACY, RELIABILITY OR CONTENTS OF THIS MANUAL. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, IN NO EVENT SHALL SHANGHAI MOBILETEK COMMUNICATION LTD BE LIABLE FOR ANY SPECIAL, INCIDENTAL, INDIRECT, OR CONSEQUENTIAL DAMAGES, OR LOSS OF PROFITS, BUSINESS, REVENUE, DATA, GOODWILL SAVINGS OR ANTICIPATED SAVINGS REGARDLESS OF WHETHER SUCH LOSSES ARE FORSEEABLE OR NOT.
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdVersion History Date Version Description of change Author 2016-09-13 V1.0 Initial
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd1 About this document 1.1Applicable scope This document describes the L506 series 4G LTE LCC Module (hereinafter referred to as L506), the basic specifications, product electrical characteristics, design guidance and hardware interface development guidance. Users need to follow this documentation requirements and guidance for design. This document applies only to L506 products in the application development. 1.2 Writing purpose This document provides the design and development basis for the product users. By reading this document, users can have a whole understanding of the product, the technical parameters of the product have a clear understanding, and can be used in this document to complete the development of Internet access functions. This hardware development document not only provides the product functional features and technical parameters, but also provides product reliability testing and related testing standards, business functions to achieve process, RF performance indicators and user circuit design guidance. 1.3 Support and reference documents list In addition to the hardware development documentation, we also provide a guide to the development board based on this product manual and software development instruction manual, 1-1 is supported as a list. Table 1-1 support document list No. Documents 1 《L506 AT Command User Guide》 2 《L506_SPEC.docx》 3 《L506 EVB User Manual》 4 《L506 Schematic checklist》 5 《L506 Layout checklist》 6 《L506_Reference Design_V3.pdf》 7 《L506_V1_DECAL.sch》
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd8 《L506_V3_DECAL.PCB》 1.4 Terms and Abbreviations Table 1-2 is the Document relative Terms and Abbreviations。 Table 1-2 Terms and Abbreviations Abbreviation Descriptions ESD Electro-Static discharge USB Universal Serial Bus UART Universal Asynchronous Receiver Transmitter SDCC Secure Digital Card Controller USIM Universal Subscriber Identification Module SPI Serial Peripheral Interface I2C Inter-Integrated Circuit PCM Pulse-coded Modulation I/O Input/output LED Light Emitting Diode GPIO General-purpose Input/Output WCDMA Wideband Code Division Multi Access UMTS Universal Mobile Telecommunication System HSDPA High Speed Downlink Packet Access HSUPA High Speed Uplink Packet Access AGPS Assisted Global Positioning System BER Bit Error Rate DL Downlink COEX WLAM/LTE-ISM coexistence SMPS Switched-mode power supplies LTE Long Term Evolution FDD Frequency Division Duplexing TDD Time Division Duplexing
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdDPCH Dedicated Physical Channel DPCH_Ec Average energy per PN chip for DPCH. DPCH
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd2 Product Overview L506 is a series module and design for global market, It include standard series and LD series. User can choose the module based on the wireless network configuration. In this document, the supported radio band is described in the following items. This product is a LCC interface of 4G wireless internet module, with the high speed, small size, light weight, high reliability can be widely used in various products and devices with wireless internet access: Table 2-1 L506 series module type correspond band Support band L506 WCDMA UMTS850 ● UMTS1900 ● LTE-FDD FDD_LTE B2 ● FDD_LTE B4 ● FDD_LTE B5 ● FDD_LTE B13 ● FDD_LTE B17 ● GNSS GPS L1 BAND ● GLONASS ● BEIDOU ● Table 2-2 Differences list between L506A standard series and L506 LD series Feature L506 Standard series L506 LD series Voice YES NO GNSS YES NO Diversity reception YES NO Data transmission specificationsLTE-FDD- Uplink up to 50Mbps, - Downlink up to 150Mbps
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdHSPA+- Uplink up to 5.76 Mbps, - Downlink up to 42 Mbps UMTS- Uplink/Downlink up to 384Kbps Interface SUB2.0UARTUSIM (3V/1.8V)GPIOADCSDIOPCMSPII2CNETLIGHTPOWER KEYRESETDimensions（L×W×H）:30mm×30mm×2.8mm TOP VIEW BOTTOM VIEW Figure 2-1 Product Physical Map 2.1 Package Dimensions The product module is 87-PIN LCC package module, in addition to signal pin, also contains many special heat welding disc to improve joint performance, mechanical strength and heat dissipation
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd performance, the heat release welding disc 12 and uniform distribution in the bottom of the PCB. Package size is 30 x 30 mm, the height is 2.8 mm. Pin 1 position from the bottom of the belt angle welding plate to identify, the missing corner where the direction of the corresponding module angle pad, figure 2-2 is the product dimension type map: (a)Top Dimensions (Unit mm) (b)Top Detail (Unit mm)A
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd (c)Bottom Dimensions (Unit mm) Note: antenna feed point in actual use of the customers don't need (PCB assembly, the stencil file). (d)Bottom Detail B (Unit mm)
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd (e)Bottom Detail C (Unit mm)
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd(e)Side view Dimensions(Unit mm) Figure 2-2 Module Dimensions 2.2 Product Function Outline 2.2.1 Hardware Diagram This product mainly includes the following signal group：USB Interface signal、USIM card Interface signal、I2C Interface signal、UART Interface signal、PCM Interface signal、UART Interface signal、SPI interface、Module startup、Module control signal、Power supply and ground.
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd2.2.2 Radio frequency function RF Function Overview： Five-Band FDD-LTE B2/B4/B5/B13/B17Dual-Band UMTS/HSDPA/HSPA+ B2/B5GPS/BEIDOU/GLONASSThe operating frequency range of the transmitter is shown in table 2-2. Table 2-3 RF frequency band Working band Upstream band（Uplink） Downlink frequency（Downlink） WCDMA B5 824 MHz~849 MHz 869 MHz~894 MHz WCDMA B2 1850 MHz — 1910 MHz 1930 MHz — 1990MHz FDD_LTE B2 1850 MHz — 1910 MHz 1930 MHz — 1990MHz FDD_LTE B4 1710 MHz~1755 MHz 2110 MHz~2155 MHz FDD_LTE B5 824 MHz~849 MHz 869 MHz~894 MHz FDD_LTE B13 777 MHz~787 MHz 746 MHz~756 MHz FDD_LTE B17 704 MHz~716 MHz 734 MHz~746 MHz GPS L1 BAND -- 1574.4 ～1576.44 MHz GLONASS -- 1598 ～1606 MHz BEIDOU B1 -- 1559.05 ～1563.14 MHz
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdTable 2-4 Conducted transmission power Working Band Max Power Min PowerWCDMA B5 22.5dBm +/-1dB <-50dBm WCDMA B2 23dBm +/-1dB <-50dBm FDD_LTE B2 22dBm +/-1dB <-40dBm FDD_LTE B4 22dBm +/-1dB <-40dBm FDD_LTE B5 22dBm +/-1dB <-40dBm FDD_LTE B13 21dBm +/-1dB <-40dBm FDD_LTE B17 21dBm +/-1dB <-40dBm Table 2-5 Conducted receive sensitivity Working Band Receive sensitivity(Typical) Receive sensitivity(MAX)WCDMA B2 < -108dBm 3GPP WCDMA B5< -109dBm 3GPP Table 2-6 Reference sensitivity (QPSK) Channel bandwidthE-UTRA Band 1.4 MHz 3 MHz 5 MHz 10 MHz 15 MHz 20 MHz Duplex Mode 2 -102.2 -99.7 -100 -97.2 -96.2 -95 FDD 4 -102.2 -99.7 -98 -95 -94.2 -93 FDD 5 -102.2 -99.7 -98 -95 -- -- FDD 13 -- -- -100.2 -97.2 -- -- FDD 17 -- -- -97 -94 -- -- FDD YNQCON IDENTIAL
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd3 Interface Description 3.1 PIN Definition 3.1.1 Pin I/O parameter definition The I/O parameter definition of the product is shown in table 3-1. Table 3-1 I/O parameter definitions Pin attribute symbol Description PI Power input PIN PO Power output PIN AI Analog input AIO Analog signal input/output PIN I/O Digital signal input/output PIN DI Digital signal input DO Digital signal output DOH Digital output with high level DOL Digital output with low level PD Pull down PU Pull up AO Analog output 3.1.2 Pin MapL506 haver different version, and the correspond pin definition show as special mark (* mark or #mark) in the pin map. In the different hardware version the corresponding pin have differential using, detail description show as below chart. All hardware interfaces which connect L506 to customers’ application platform are through 87 pins pads (Metal half hole). Figure 3-1 is L506 outline diagram.
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd12342167891011121314151651817198120GNDGNDPWRKEYRESETGNDSD_CMDSPI_CLKSPI_MISOSPI_MOSISPI_CSGNDUSB_VBUSUSB_DNUSB_DPGNDVDD_1V8USB_IDUSIM_DATAUSIM_RSTUSIM_CLKUSIM_VDDGND856059585655545352#5150#4948474645#57434442*8241BOOT_CFG0GNDAUX_ANTGNDGNDSDASCLFLIGHTMODEUSIM_DETGPIO_1/WAKEUP_OUTNETLIGHTGPIO_2/WAKEUP_INSTATUSSD1_DETADC1ADC2GPIO_0VDD_EXTGNDGNDMAIN_ANT84#COEX22223242526SD_DATA0SD_DATA1SD_DATA2SD_DATA3SD_CLK28#GPIO_327*SDC1_DATA229*30*31*32*33*SDC1_DATA1SDC1_DATA3SDC1_CMDSDC1_DATA035*P_CLK34*VREG_L2_1V836*37383940SDC1_CLKGNDVBATVBATGND83COEX161 GND876263646566VBATVBATGNDGNDRTS68 RXD67 CTS69#707172#73RIDCDTXDDTRPCM_OUT75 PCM_SYNC74 PCM_IN7677787980PCM_CLKGNDGNDGNSS_ANTGND86 COEX3BOOT_CFG1L506 LCCTOPFigure 3-1 Pin Map View (Top View) Note: 1. #flag pin in Figure 3-1 stand for multi-function pin. Detail description show as incorresponding function description. 3.1.3 PIN Definition and function description Table 3-2 Pin definition Pin No. Pin description Pin No. Pin description 1 GND 2 GND 3 PWRKEY 4 RESET
L506A Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd5 GND 6 SPI_CLK 7 SPI_MISO 8 SPI_MOSI 9 SPI_CS 10 GND 11 USB_VBUS 12 USB_DN 13 USB_DP 14 GND 15 VDD_1V8 16 USB_ID 17 USIM_DATA 18 USIM_RST 19 USIM_CLK 20 USIM_VDD 21 SD_CMD 22 SD_DATA0 23 SD_DATA1 24 SD_DATA2 25 SD_DATA3 26 SD_CLK 27* SDC1_DATA2 28# GPIO_3 29* SDC1_DATA1 30* 31* SDC1_DATA3 32* SDC1_CMD 33* SDC1_DATA0 34* VREG_L2_1V8 35* 32K_SLEEP_CLK 36* SDC1_CLK 37 GND 38 VBAT 39 VBAT 40 GND 41 GND 42* 43 GND 44 VDD_EXT 45# GPIO_0 46 ADC2 47 ADC1 48 SD1_DET 49 STATUS 50# GPIO_2/WAKEUP_IN 51 NETLIGHT 52# GPIO_1/WAKEUP_OUT 53 USIM_DET 54 FLIGHTMODE 55 SCL 56 SDA 57 GND 58 GND 59 AUX_ANT 60 GND 61 GND 62 VBAT 63 VBAT 64 GND 65 GND 66 RTS 67 CTS 68 RXD
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd69# RI 70 DCD 71 TXD 72# DTR 73 PCM_OUT 74 PCM_IN 75 PCM_SYNC 76 PCM_CLK 77 GND 78 GND 79 GNSS_ANT 80 GND 81 GND 82 MAIN_ANT 83 COEX1 84 COEX2# 85 BOOT_CFG0 86 COEX3 87 BOOT_CFG1 Table 3-3 Pin Function Description Power interface Pin Name Pin No. I/O Description Content VBAT 38,39,62,63 PI Power supply voltage, VBAT=3.4V~4.2V. The power supply for system Maximum load current must above 2A. VDD_1V8 15 PO Module LDO output power ,1.8V output, Max current 150mA, For I/O, MCP, SLIC, sensors. If not use keep it open. VDD_EXT 44 PO Module LDO output power, 2.85V output, Max current 300mA. Only use for external SD Card VDD. If not use keep it open. GND 1,2,5,10,14,37,40,41,43,57,58,60,61,64,65,77,78,80,81 Ground. System Control Pin Name Pin No. I/O Description Content PWRKEY 3 DI System power on/off input, active low. RESET 4 DI System reset input, active low.
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdFLIGHTMODE 54 DI, PU The input signal, used to control the system into flight mode, H: flight mode; L: normal mode Pull UP to VDD_1V8（PIN 15） with 10K resistor Module status(GPIO) Pin Name Pin No. I/O Description Content NETLIGHT 51 DO Identify the system network status. STATUS 40 DO Module status identify: High level power on, low level power off. SD interface Pin Name Pin No. I/O Description Content SD_CMD 21 DO SDIO command Advice add the ESD on you SD card Slot. If not use keep it open SD_DATA0 22 I/O SDIO data SD_DATA1 23 I/O SDIO data SD_DATA2 24 I/O SDIO data SD_DATA3 25 I/O SDIO data SD_CLK 26 DO SDIO clock SD_CARD_DET_N 48 DI，PU Input pin as SD card detecting. L506A have internal pull up,
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdH: SD card is removed L: SD card is inserted so SD card slot should choose insert detect PIN connect the ground. If not use keep it open SIM interface Pin Name Pin No. I/O Description Content USIM_DETECT 53 DI，PU Input pin as USIM card detect pin. H: USIM is removed L: USIM is inserted L506 have internal pull up. If not use keep it open. USIM_DATA 17 I/O USIM Card data I/O, which has been pulled up with a 10KR resistor to USIM_VDD in module. Do not pull up or pull down in users’ application circuit. All signals of USIM interface should be protected with ESD/EMC. USIM_RESET 18 DO USIM Reset USIM_CLK 19 DO USIM Clock USIM_VDD 20 PO USIM Card Power output, output Voltage depends on USIM mode automatically， and one is 3.0V±10%, another is 1.8V±10%. Current is less than 50mA. PCM interface Pin Name Pin No. I/O Description Content PCM_CLK 76 DO PCM data bit clock. If not use keep it open. PCM_SYNC 75 DO PCM data frame sync signal. PCM_IN 74 DI PCM data input. PCM_OUT 73 DO PCM data output. FULL UART/DEBUG PORT Pin Name Pin No. I/O Description Content
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdRTS 66 DI DET Request to send. If not use keep it open. CTS 67 DO Clear to Send. If not use keep it open. RX 68 DI Receive Data. If not use keep it open. RI 69# DO Ring Indicator. Multiplexed as MDM_DBG_UART_TX. If not use keep it open. Recommend reserved the test point for debug DCD 70 DO Carrier detects. If not use keep it open TXD 71 DO Transmit Data. If not use keep it open. DTR 72# DI DTE get ready. Multiplexed as MDM_DBG_UART_RX. If not use keep it open. Recommend reserved the test point for debug I2C interface Pin Name Pin No. I/O Description Content I2C_SCL 55 DO I2C clock output. L506 internal have pulled up to 1.8V I2C_SDA 56 I/O I2C data input/output. GPIO Pin Name Pin No. I/O Description Content GPIO_2/WAKEUP_IN 50 I/O Default: GPIO Optional: Input pin as wake/interrupt signal to module from host. If not use keep it open. GPIO_1/WAKEUP_OUT 52 DO Default: GPIO Optional: Output pin as wake/interrupt signal to host from module. GPIO_3 28 I/O GPIO GPIO_0 45 DO Default: GPIO
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdOptional: output control pin. RF port Pin Name Pin No. I/O Description Content MAIN _ANT 82 AIO Main Antenna AUX_ANT 59 AI diversity antenna GNSS_ANT 79 AI GPS antenna Others Pin Name Pin No. I/O Description Content ADC1 47 AI Analog conversion digital input interface1 If not use keep it open. ADC2 46 AI Analog conversion digital input interface2 COEX1 83 I/O RF synchronizing LTE. If not use keep it open. COEX3 86 I/O COEX2 84# I/O Default: RF synchronizing Optional: Pull up to 1.8V (L506A PIN 15 VDD_1V8) with 10K resistor force module in USB download mode Recommend placing test points for debug. BOOT_CFG0 85 DI, PD Pull up to 1.8V (L506A PIN 15 VDD_1V8) with 10K resistor force module in fastboot mode BOOT_CFG1 87 DI, PD Pull up to 1.8V (L506A PIN 15 VDD_1V8) with 10K resistor force module in fastboot mode
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd3.2 Operating conditionTable 3-4 module recommended operating condition Parameter Description Min. Typ. Max. Unit VBAT Main power supply for the module 3.4 3.8 4.2 V 3.3 Digital I/O characteristics Table 3-5 1.8V Digital I/O characteristics Parameter Description Min. Typ. Max. Unit VIH High level input voltage 0.7*VDD_PX VDD_PX VDD_PX+0.3 V VILLow level input voltage -0.3 0 0.2* VDD_PX V VOHHigh level output voltage VDD_PX-0.45 - VDD_PX V VOLLow level output voltage 0 0 0.45 V IOH High-level output current (no pull down resistor) - 2 - mA IOL Low-level output current (no pull up resistor) - -2 - mA IIH Input high leakage current (no pull down resistor) - - 1 uA IIL Input low leakage current (no pull up resistor) -1 - - uA *Note: 1. These parameters are for digital interface pins, such as SP, SDIO, GPIOs(NETLIGHT, FLIGHTMODE, STATUS, USIM_DET, SD1_DET), I2C, UART, PCM, COEXn, BOOT_CFGn. 2. L506A TF-card signal (SD_DATA0~SD_DATA3, SD_CLK, SD_CMD), USIM card signal(USIM_CLK, USIM_DATA, USIM_RST) support dual-voltage (1.8V and 3.0V) mode, and the DC character show in corresponding function block. 3.4 Power Interface 3.4.1 Power supply pin description
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdTable 3-6 DC Power Characteristics Pin No. Net Name Description DC Characteristic（V） Min. Typ. Max. 38,39,62,63 VBAT Power supply for the module 3.4 3.8 4.2 1,2,5,10,14,37,40,41,43,57,58,60,61,64,65,77,78,80,81 GND GND - - - 44 VCC_EXT Power supply for external SD card - 2.85 - 20 USIM_VDD Power supply for VDD SIM - 1.8/3.0 - 15 VDD_1V8 LDO 1.8V output - 1.8 - 88-99* GND Thermal and welding fixed plate - - - Note: Pin88~Pin99 (total12pin) is design for the thermal welding fixed plate. 3.4.2 Power supply requirements There are four VBAT PIN power for the module, VBAT directly power supply for the module baseband and PA, and operating rating is 3.4V~4.2V; In the weak network environment, the antenna will be maximum power emission. The peak current of the module under the 3G mode may reach the peak current of 1.8A. power supply to reach 2A, the average current to reach 0.9A above. maximum peak current can reach 2A, So the max power supply current must more than 2 A. Figure 3-2 sign for instantaneous pulse diagram. Figure 3-2 instantaneous pulse
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdTable 3-7 VBAT power supply interface characteristics Symbol Description Min Typ Max Unit VBAT Power supply voltage 3.4 3.8 4.2 V IVBAT(peak) Power supply p current - 2* - A IVBAT(average) Power supply average current 1 1.5 - A IVBAT(power-off) Power supply current in power off mode - - 20 uA IVBAT(power-save) Power supply current in power save mode(sleep mode) - - 3 mA 3.4.3 Power Supply Design Guide Make sure that the input voltage at the VBAT pin will never drop below 3.4V even during a transmit burst when the current consumption rises up to more than 2A. If the power voltage drops below 3.4V, the RF performance of module may be affected. Using large tantalum capacitors (above 300uF) will be the best way to reduce the voltage drops. If the power current cannot support up to 2A, users must introduce larger capacitor (typical 1000uF) to storage electric power. For the consideration of RF performance and system stability, some multi-layer ceramic chip (MLCC) capacitors (0.1/1uF) need to be used for EMC because of their low ESR in high frequencies. Note that capacitors should be put beside VBAT pins as close as possible. Also User should keep VBAT net wider than 2 mm to minimize PCB trace impedance on circuit board. The following figure is the recommended circuit.
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdFigure 3-3 VBAT input application circuit Note: The Cd, Ce, Cb, Cc and Cf are recommended being mounted for L506, but the Ca, Cb, Ce, Cc and Cf for tune. In addition, in order to get a stable power source, it is suggested to use a Zener diode of which reverse Zener voltage is 5.1V and dissipation power is more than 500mW. Table 3-8: Recommended Zener diode models NO. Manufacturer Part Number Power Package 1 On semi MMSZ5231BT1G 500mW SOD123 2 Prisemi PZ3D4V2H 500mW SOD123 3 Vishay MMSZ4689-V 500mW SOD123 4 Crownpo CDZ55C5V1SM 500mW 0805 3.4.4 Recommended Power supply circuit If the voltage difference is not big,We recommend DCDC or LDO is used for the power supply of the module, make sure that the peak current of power components can rise up to more than 2A. The following figure is the reference design of +5V input linear regulator power supply. The designed output for the power supply is 3.8V. Figure 3-4 Reference circuit of the LDO power supply
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdIf there is a big difference between the input voltage and the desired output (VBAT) or better efficiency is more important, a switching converter power supply will be preferable. The following figure is the reference circuit. Figure 3-5 Reference circuit of the DCDC power supply Note: DCDC may deprave RF performance because of ripple current intrinsically. 3.4.5 Power Supply Layout guide The layout of the power supply section and the related components is of vital importance in the power module design. If processes this part layout is not good, will lead to various effects, such as bad EMC, effective the emission spectrum and receiving sensitivity, etc. So the power supply part design is very important, when you design this part you should notes below contents: 1. DC DC switch power should place away from the antenna and other sensitivity circuit; 2. Consider the voltage drop and the module current requirement, the layout line should better above 100mil. If conditions allow should add a power shape plane. 3.5 USIM interface 3.5.1 Pin definition The L506 integrated a ISO 7816-2 standard USIM port, and the module can automatic identify the voltage demo according the USIM to allow the mobile equipment to attach to the network. Both 1.8V and 3.0V SIM Cards are supported. Table 3-9 USIM Electronic characteristic in 1.8V mode (USIM_VDD =1.8V) Symbol Parameter Min. Typ. Max. Unit USIM_VDD LDO power output 1.75 1.8 1.95 V VIH High-level input voltage 0.65·USIM_VDD - USIM_VDD +0.3 V VIL Low-level input voltage -0.3 0 0.35·USIM_VDD V
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdVOH High-level output voltage USIM_VDD -0.45 -- USIM_VDD V VOL Low-level output voltage 0 0 0.45 V Table 3-10: USIM Electronic characteristic 3.0V mode (USIM_VDD =3.0V) Symbol Parameter Min. Typ. Max. Unit USIM_VDD LDO power output 2.75 3.0 3.05 V VIH High-level input voltage 0.65*USIM_VDD - USIM_VDD +0.3 V VIL Low-level input voltage -0.3 0 0.25·USIM_VDD V VOH High-level output voltage USIM_VDD -0.45 - USIM_VDD V VOL Low-level output voltage 0 0 0.45 V 3.5.2 Design Guide USIM electronic characteristics as the table 3-8,3-9 show. In order to meet the 3 GPP TS 51.010 1 protocol and EMC certification requirements. Suggest USIM slot near the location of the module USIM card interface, to avoid running for too long, lead to serious deformation of waveform and effect signal integrity, USIM_CLK and USIM_DATA signal lines suggest ground protect. Between the USIM VCC & GND add a 1uF and a 33 pF capacitor in parallel, Between the USIM_CLK& GND, USIM_RST& GND, USIM DATA& GND add a 33 pF capacitor in parallel, for filter the RF signal interference. 3.5.3 USIM interface reference circuit LY AL
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdFigure 3-6 USIM Reference circuit Note:USIM_DATA have added the pull-up resistance in the module design. 3.6 PCM interface 3.6.1 PCM interface definition L506 provides hardware PCM interface for external codec. L506 PCM interface can be used in short sync master mode only, and only supports 16 bits linear format： Table 3-11 PCM interface definition Pin No. Signal name I/O Type DC Characteristics（V） Min. Typ. Max. 75 PCM_SYNC PCM synchronizing signal -0.3 1.8 1.9 74 PCM_DIN PCM data input -0.3 1.8 1.9 73 PCM_DOUT PCM Data output -0.3 1.8 1.9 76 PCM_CLK PCM Data clock -0.3 1.8 1.9
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdFigure 3-7 PCM_SYNC timing Figure 3-8 Codec to L506 module timing Figure 3-9 L506 to codec module timing Table 3-12 PCM interface Timing Parameter Descriptions DC characters Min. Typ. Max. Unit T(sync) PCM_SYNC cycle - 125 - us T(synch) PCM_SYNC high level hold time - 488 - ns T(syncl) PCM_SYNC low level hold time - 124.5 - us T(clk) PCM_CLK cycle - 488 - ns T(clkh) PCM_CLK high level hold time - 244 - ns
L506A Hardware DesignCopyright © Shanghai Mobiletek Communication LtdT(clkl) PCM_CLK low level hold time - 244 - ns T(susync) PCM_SYNC establish time - 122 - ns T(hsync) PCM_SYNC hold time - 366 - ns T(sudin) PCM_IN establish time 60 - - ns T(hdin) PCM_IN hold time 60 - - ns T(pdout) From PCM_CLK rising edge to PCM_OUT valid time - - 60 ns T(zdout) From PCM_CLK falling edge to PCM_OUT high impendence delay time - - 60 ns 3.6.2 PCM interface application L506A only support the host mode, PCM_SYNC,PCM_CLK is the output pin，PCM_SYN as the synchronizing output 8kHz sync signal. PCM Data support 8bit or 16bit data. L506A CODEC PCM_INPCM_SYNCPCM_OUTPCM_CLKGNDGNDPCM_DINPCM_DOUTPCM_SYNCPCM_CLK0R0R0R0RFigure 3-10 PCM application circuit（L506 in host mode） Note:1. L506 PCM port DC character is base on 1.8 voltage, please pay attention the voltage matching. 2. If your design need this function, you should add the crystal for PCM clock. About thecrystal type please contact our market. 3. L506 default design base on NAU8814 as the codec chip, the detail design please refer to《L506 reference design》. 3.7 USB2.0 interface 3.7.1 USB interface pin definition L506 integrated a USB 2.0 port and low speed mode full speed mode and high speed mode
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd transmission speed between the AP and the host. Below table is the module USB pin definition Table 3-13 USB interface pin definition Pin No. Signal name I/O type DC characteristic（V） Min. Typ. Max. 12 USB_DM USB2.0 date D- - - - 13 USB_DP USB2.0 data D+ - - - 3.7.2 USB Interface application USB bus is mainly used for data transmission, software upgrading, module testing. Work in the high-speed mode of the USB line, if you need ESD design, ESD protection device must meet the junction capacitance value <5pf, otherwise the larger junction capacitance will cause waveform distortion, the impact of bus communication. Differential impedance of differential data line in 90ohm + 10%. In your application must add a 47Kohm resistor between USB_VBUS to ground. Figure 3-11 USB application 3.8 UART Interface 3.8.1 Pin description L506 module provides a flexible 7-wire UART (universal asynchronous serial transmission) interface. UART as a full asynchronous communication interface, Support the standard modem handshake signal control, Comply with the RS - 232 interface protocols. And also support four wire serial bus interface or the 2-wire serial bus interface mode, and the module can be through the UART L506A HOST(PC)USB_DPUSB_DMVBUSGNDUSB_IDVBUSUSB_DPUSB_DMGND0R47K0R
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltdinterface for serial communication with the outside (DET) and the AT command input, etc. L506 module is a DCE (Data Communication Equipment) and client PC is a DTE (Data Terminal Equipment).AT commands are entered and serial communication is performed through UART interface. The pin signal is defined as shown in below table. Table 3-14 UART pin definition Pin No. Pin I/O type Descriptions 71 UART_TX DO UART data transmission 68 UART_RX DI UART data receive 69 UART_RI DO Ring Indicator. 66 UART_RTS DO UART DET request to send 72 UART_DTR DI DTE get ready. 67 UART_CTS DI UART Clear to Send. 70 UART_DCD DO UART Carrier detects. Note：UART_RI, UART_DTR can be used as two line UART interface for system debugging, See table 3-3 Pin functional description. 3.8.2 UART interface application UART_RI, UART_DTR default status is the system log port, so we recommend that users keep reserved the interface and test points in design. The L506 UART is 1.8V interface. A level shifter should be used if user’s application is equipped with a 3.3V UART interface. The level shifter TXB0108RGYR provided by Texas Instruments is recommended. The reference design of the TXB0108RGYR is in the following figures. About the application as below:
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdTXD1RXD1RTS1CTS1DTR1DCD1RING1TXDRXDRTSCTSDTRDCDRINGSerial Port Serial PortL506 (DCE) Client(DET)GND GNDFigure 3-12 UART 4 Line connection mode TXD1RXD1RTS1CTS1DTR1DCD1RING1TXDRXDRTSCTSDTRDCDRINGSerial Port Serial PortL506A(DCE) Client (DTE)GND GNDFigure 3-13 UART 2 Line connection mode
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdTXD1RXD1RTS1CTS1DTR1DCD1RING1TXDRXDRTSCTSDTRDCDRINGSerial Port Serial PortL506 (DCE) Client (DTE)GND GNDFigure 3-14 UART Full mode Figures 3-16 Voltage transfer Reference Circuit
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd3.9 Power on/off and reset interface 3.9.1 Pin definition L506 can be powered on by pulling PWRKEY pin down to ground. This pin is already internal pulled up to 1.8V in module, so external pull-up resistor is not necessary. Placing a100nF capacitor and an ESD protection diode close to the PWRKEY pin is strongly recommended. Please refer to the following figure for recommended reference circuit L506 also have a RESET pin to reset module. This function is used as an emergency reset only when AT command “AT+CPOF” and the PWRKEY pin has no effect. User can pull RESET pin to ground, then module will reset. This pin is already pulled up with a 40KΩ resistor to 1.8V in module, so external pull-up resistor is not necessary. Placing a100nF capacitor and an ESD protection diode close to the RESET pin is strongly recommended. Please refer to the following figure for recommended reference circuit, you can pull-down this pin to ground and hold about 200 MS and then release will force the module enter reset stateAL. Table 3-15 power on/off and reset key define Pin No. Net name I/O Typ. descriptions 3 PWRKEY DI L506A power on/off pin (internal pull-up to 1.8V) 4 RESET DI L506A RESET pin (internal pull-up to 1.8V) 3.9.2 Power on sequence Table 3-16 power on timing chart. Ton Power on low level pulse 100 500 -- ms Ton(status) Power on time (According to the STATUS pin judgment) 15 -- 25 s Ton(uart) Power on time (according the UART pin judgement) 10 -- 20 s VIH Input high level voltage of PWRKEY pin 1.17 1.8 2.1 V VIL Input low level voltage of PWRKEY pin -0.3 0 0.3 V
L506A Hardware DesignCopyright © Shanghai Mobiletek Communication LtdFigures 3-17 Power on Timing sequence Note: the STATUS pin can be used to identify whether has been power on, when the module has access to electricity and initialization is completed, the STATUS output high level, or has maintained low level. 3.9.3 Power off sequence The following methods can be used to power down. These procedures will make module disconnect from the network and allow the software to enter a safe state, and then save data before completely powering the module off. ●Method 1: Power off L506A by pulling the PWRKEY pin down●Method 2: Power off L506A by AT command “AT+CPOF”●Method 3: over-voltage or under-voltage automatic power down.●Method 4: over-temperature or under-temperature automatic power down.Note: 1. About the AT command “AT+CPOF” detail please refer document [1]. 2. Over-voltage or under-voltage may cause automatic power down.3. Over-temperature or under-temperature may cause automatic power down.Table 3-17 Power off timing chart. Toff The time of active low level pulse on PWRKEY pin to power off module 2.5 -- -- s Toff(status) The time from power-off issue to STATUS pin output low level (indicating power off) 6 -- -- s Toff(uart) The time from power-off issue to UART port off 6 -- -- s Toff-on The buffer time from power-off issue to power-on issue 0 -- -- V VIH Input high level voltage of PWRKEY pin 1.17 1.8 2.1 V VIL Input low level voltage of PWRKEY -0.3 0 0.3 V
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltdpin User can power off the L506 by pulling PWRKEY down to ground for a specific time. The power off scenario is illustrated in the following figure. Figures 3-18 Power off Timing sequence Note: the STATUS pin can be used to identify whether has been power on, when the module has access to electricity and initialization is completed, the STATUS output high level, or has maintained low level. 3.9.4 Reset sequence L506 can lower module RESET pin to restart the module. Table 3-18 Reset pin electrical properties Symbol Net name Min. Typ. Max. Unit Treset Reset pin low level hold time 50 100 500 ms VIH Reset pin input high level 1.17 1.8 2.1 V VIL Reset pin input low level -0.3 0 0.3 V Note: it is recommended that only in an emergency, such as module without response, use the RESET pin. In addition, under the module power off status the RESET pin is invalid. 3.9.5 Power on/off and reset interface application
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdL506ARESET4.7K47KPulsePWRKEY4.7K47KPulse500mS500mSFigure 3-19: Reference power on/off reset circuit Another way to control the PWRKEY pin is directly using a push button switch. Need to set a button near the TVS to ESD protection. The image below for reference circuit:
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdFigure 3-20: power on/off and reset recommended circuit (physical buttons) 3.10 Interactive interface 3.10.1 Pin definition Table 3-19 list the interface is mainly with the application processor interactive interface, including query, wake up four types, status indication, flight mode interface. Table 3-19 Interactive interface Pin No. Signal I/O type Descriptions 50 GPIO_2/WAKEUP_IN DI Default: GPIO Optional: Input pin as wake up interrupt signal to module from host. 52 GPIO_1/WAKEUP_OUT Default: GPIO Optional: Output pin as the module wake up the AP 49 STATUS DO AP inquire the module status 54 FLGHTMODE DI Pull up to 1.8V made the system enter in flight mode, at this mode will tune off all the wireless function 45 GPIO_0 DO General GPIO module output (used for keyboard backlighting, etc.) 28 GPIO_3 I/O GPIO
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd3.10.2 interactive interface application L506 provides three shook hands with application processor communication signals. Application processor can query whether the module boot normal work through STATUS. Through the WAKEUP_OUT query module is in sleep mode, and sleep in the module, through WAKEUP_IN wake module. Similarly, when application processor in the sleep state, the L506 modules can through WAKEUP_OUT wake application processor. STATUS：Module sleep instructions, high level indicator to sleep, low level instructions for theawakened state; WAKEUP_IN： The host can lower the signal awakens the module，If, low level has maintained,module can't sleep.WAKEUP_OUT: when L506A need to communicate with the AP, module can be set this pin for lowlevel to awaken application processor.FLGHTMODE：Through the external output high level module into flight mode;L506A Figure 3-21: Flight mode recommended circuit (physical buttons)
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd3.11 Net Light interface 3.11.1 Pin define Table 3-20 LED pin definitions Pin No. Net name I/O type description 51 NETLIGHT DO Module net state identify control LED port 3.11.2 Net light application The L506 module has 1 pins for controlling the LED display, which can be used as an indicator of network connection status. Different network states are represented by the mode of the flashing light. This pin is an GPIO，with An external NPN Transistor，External connect VBAT can directly drive LED. Drive current capacity varies according to external NPN model，recommend use DTC143ZEBTL，Drive current biggest can reach 100 mA, below is the reference circuit. L506ALEDVLEDR2R1 Figure 3-22 Status indicator reference circuit Note: R1, R2 value according to the voltage VLED and LED working current. Table 3-21 NETLIGHT status Net Status Module working status Always on Searching Network/Call Connect 200ms ON, 200ms OFF Data Transmit 800ms ON, 800ms OFF Registered network OFF Power off / Sleep Note: NETLIGHT output low level as “ON”, and high level as “OFF”.
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd3.12 SD card interface 3.12.1 Pin descriptions L506 provides a 4-bit SD/MMC interface with clock rate up to 52MHz. The operation voltage of MMC/SD interface is 2.85V with SD/MMC memory cards up to 128G(FAT4), which is compatible with SDIO Card Specification (version 3.0), Secure Digital (Physical Layer Specification, version 3.0) and Multimedia Card Host Specification MMC (version 4.4) Table 3-22 SD characteristics Symbol Parameter Min. Typ. Max. Unit VDD_EXT** LDO output - 2.85 - V VIH High-level input voltage 0.625*VDD_EXT - VDD_EXT+0.3 V VIL Low-level input voltage -0.3 0 0.25*VDD_EXT V VOH High-level output voltage 2.75*VDD_EXT 2.85 VDD_EXT V VOL Low-level output voltage 0 0 0.125*VDD_EXT V SD card I/O load capacity for linear output displacement, concrete can be calculated according to the following chart; Figure 3-23 VOL/VOH IV curve 3.12.2 SD card interface design guideline L506 VDD_EXT for external SD card interface of power supply, in the card slot position should add the ESD protection circuit; If you need to support SD hot plug design need to add SD_DET signals. Due to the default hot plug pin of L506 check for low level to identify the card insert status, so you need to choose the detect PIN connected to the ground when SD card is inserted into the SD slot, below is the reference circuit.
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdFigure 3-24 SD card recommended circuit 3.12.3 SD card signal PCB line rules Due to the SD signal is the high-speed digital interface, so it’s layout rules should be in accordance with the high speed digital rules. 1.Protect other sensitive signals/circuits from SDC corruption. 2. Protect SDC signals from noisy signals (clocks, SMPS, etc.).3. 50 Ω nominal, ±10% trace impedance.4. CLK to DATA/CMD length matching < 1 mm.5. Total routing length < 50 mm recommended.6. Spacing to all other signals = 2x line width.6 Bus capacitance < 15 pF.3.13 System boot configuration and download 3.13.1 Pin definition L506 can configure BOOT_CONFIG (Boot Configuration) pin to Configuration module power-on mode and the forced entry USB download mode.
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdTable 3-23 Boot configuration and force USB download Pin No. Net name Function description note 85 BOOT_CFG0 Pull up this pin change boot configuration register value 87 BOOT_CFG1 Pull up this pin change boot configuration register value 84 COEX2(System on) FOCE_USB_BOOT (before system on) Pull up this pin change boot configuration register value Multiplex pin 3.13.2 Boot configuration and force USB interface application Figure 3-25 boot configuration and force USB download recommended circuit L506A1.8VBOOT_CFG010KBOOT_CFG0COEX2/FORCE_USB_BOOTSW3SW1SW2
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdInput voltage range 0.3 -- VBAT V Input resistance 1 -- -- MΩ Note: 1. use "AT + CADC" and "AT + CADC2" can read ADC1 and ADC2 voltage on the pin. More information please refer to the document [1]. 2. The need for special software version to support access to the ADC.3.15 I2C interface3.15.1 I2C pin definition I2C is used to communicate with peripheral equipment and can be operated as either a transmitter or receiver, depending on the device function. Both SDA and SCL are bidirectional lines connected with I2C interface. Its operation voltage is 1.8V. High speed mode transmission rate can reach 400 KBPS, Because L506 have internal pulled up to the I2C interface, so in your design needn’t pull up. Figure 3-15 is the reference design: Figure 3-28 I2C reference design Note: 1. L506 I2C only support host mode. 2. Only special software version support inquire the I2C.3.16 Antenna interface3.16.1 RF signal PCB layout guideL506 provides RF antenna interface. Customer’s antenna should be located in the host board and connected to module’s antenna pad through micro-strip line or other types of RF trace and the trace impedance must be controlled in 50Ω. we recommends that the total insertion loss between the antenna pad and antenna should meet the following requirements: Copyright © Shanghai Mobiletek Communication Ltd 50 3.14 Analog and Digital conversion (ADC) interfaceL506 integrated two analog-to-digital conversion interface, specific parameters are as follows: Table 3-25 ADC1, ADC2 characters characters Min. Typ. Max. Unit ADC resolution -- 15 -- Bits Transfer time -- 442 -- ms
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd●WCDMA 1900<0.9dB●WCDMA 850<0.5 dB●LTE (F<1GHz) <0.5dB●LTE (1GHz<F<2GHz) <0.9dB● LTE (2GHz<F) <1.2dBTo facilitate the antenna tuning and certification test, a RF connector and an antenna matching circuit should be added. The following figure is the recommended circuit. The antenna feed point is defined as shown in below table： Table 3-26 antenna pin definition Pin No. Signal I/O Typ. Description 82 MAIN_ANT AI/AO Module main antenna 59 AUX_ANT AI LTE diversity antenna feed point 79 GNSS_ANT AI GNSS antenna feeder connector 3.16.2 applicationsFor convenience of antenna tuning and certification test, should increase RF connectors and the antenna matching circuit, below is a recommended circuit: Figure 3-29 Main antenna matching circuit diagram（MAIN_ANT） In this figure, the components R1, C1, C2 and R2 is used for antenna matching, the value of components can only be got after the antenna tuning, usually, they are provided by antenna vendor. By default, the R1, R2 are 0 Ohm resistors, and the C1, C2 are reserved for tuning. The RF test connector in the figure is used for the conducted RF performance test, and should be placed as close as to the module’s antenna pin. The traces impedance between components must be
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd 53 controlled in 50ohm. Figure 3-30 LTE Diversity antenna matching circuit diagram（AUX_ANT） Note：LTE diversity antenna recommend leaving. Because there are many high frequencies of TDD LTE design, such as band38 band40 and Band41. Due to the high insertion loss RF line, if there is no diversity antenna, receiving sensitivity of the spectrum in the certification will be a risk. Figure 3-32 GNSS passive antenna matching circuit diagram（GNSS_ANT） In above figures, the components C1 and L1, L2 are used for antenna matching, the values of the components can only be obtained after the antenna tuning usually, and they are provided by antenna vendor.C2 in Figure 3-19 is used for DC isolation. In active antenna circuit, users must use an external LDO/DCDC to provide VDD voltage whose value should be taken according active antenna characteristic, and VDD can be shut down to avoid consuming additional current when not being used. GNSS can be used by NMEA port. User can select NMEA as output through UART or USB. NMEA sentences are automatic and no command is provided. NMEA sentences include GSV, GGA, RMC,
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdGSA, and VTG. Before using GNSS, user should configure L506A in proper operating mode by AT command. Please refer to related document for details. L506 can also get position location information through AT directly. In the diagram above, component C1, L1 and L2 for antenna match, the element's value depends on the antenna after debugging. In figure 3-18, C2 for dc isolation. In the active antenna circuit, the user must use an external "/ DCDC VDD voltage, its value should be according to the properties of the active antenna, VDD can close to avoid without additional current consumption when using GNSS. In figure 3-19, the user can increase a external LNA gain to get better. L506 merges GNSS (GPS/GLONASS) satellite and network information to provide a high-availability solution that offers industry-leading accuracy and performance. This solution performs well, even in very challenging environmental conditions where conventional GNSS receivers fail, and provides a platform to enable wireless operators to address both location-based services and emergency mandates. ●Tracking sensitivity: -159 dBm（GPS） -158 dBm（GLONASS） ●AcquisitionSensitivity: -148dBm●Cold-start sensitivity: -142 dBm ●CN: C/N0 = S - (-170) S= Input Signal Intensity ●Accuracy (Open Sky) : 2.5m (CEP50)●TTFF (Open Sky:) Hot start <1s Cold start 35s ●Receiver Type: 16-channel, C/A Code ●GPS L1 Frequency : 1575.42±1.023MHz ●GLONASS: 1597.5~1605.8 MHz ●BEIDOU: 1559.05~1563.14 MHz ●Update rate Default: 1 Hz ●GNSS data format: NMEA-0183 ●GNSS Current consumption (WCDMA/Sleep mode) : 100mA (Total supplycurrent) Antenna Layout guideline In layout design, antenna RF transmission line must ensure the characteristic impedance = 50 ohm. The characteristic impedance depend on substrate board, line width and the distance from the ground plane. As shown in figure 3-20 is the layout of antenna feed point of reference for clearance area.
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdFigure 3-33 antenna feed point
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd4 Product characteristics 4.1 Absolute parameters The following table shows the state of the absolute maximum work in abnormal situation. Exceed the limit value will likely result in permanent damage to the module. Table 4-1 L506A absolute parameters Parameter Min. Max. Unit VBAT absolute voltage parameter -0.5 6.0 V USB_VBUS absolute voltage parameter -0.5 5.25 V I/O absolute voltage parameter： PWRKEY, RESET, SPI, GPIO, I2C, PCM, UART, SD1_DET,USIM_DET -0.3 2.1 V I/O absolute voltage parameter： SD and USIM -0.3 3.05 V 4.2 Operation condition 4.2.1 Operation voltage This product is a DC input voltage range of 3.4 V to 4.2 V, the typical value of 3.8 V, as shown in below table. Table 4-2 Input DC voltage Parameter Min. Typ. Max. Unit VBAT Voltage 3.4 3.8 4.2 V USB_VBUS Votage 2.0 5.0 5.25 V About L506A dc electric property, please refer to part 3.3 digital I/O characteristics. 4.2.2 Work mode Table 4-3 work mode Mode Description Normal operation mode (WCDMA/LTE)Sleep In this case, the current consumption of module will be reduced to the minimal level. In sleep mode, the module can still receive paging message and SMS. (WCDMA/LTE)) Software is active. Module is registered to the
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdIdle WCDMA/ LTE network, and the module is ready to communicate. (WCDMA) taking Connection between two subscribers is in progress. In this case, the power consumption depends on network settings such as DTX off/on, FR/EFR/HR, hopping sequences, antenna. (WCDMA/LTE)Standby Module is ready for WCDMA/LTE data transfer, but no data is currently sent or received. In this case, power consumption depends on network settings and /HSPA+ /LTE configuration. (WCDMA/LTE) Data transfer There is WCDMA/LTE data transfer in progress. In this case, power consumption is related to network settings (e.g. power control level); uplink/downlink data rates Minimum mode AT command “AT+CFUN” can be used to set the module to a minimum functionality mode without removing the power supply. In this mode, the RF part of the module will not work or the USIM card will not be accessible, or both RF part and USIM card will be closed, and the serial port is still accessible. The power consumption in this mode is lower than normal mode. Flight mode Use the "AT + CFUN = 7" command or lower FLIGHTMODE pins, the module can be configured to flight mode under without removing the power supply condition. In this case, the RF part does not work, but still can use the serial port and USB, the power consumption is lower than normal working mode. Power off Through the "AT + CPOF" command or lower PWRKEY pin can power off L506A. At this mode, the module of internal power supply will be closed, and the system is stop running also. The UART and USB are unavailable. Sleep mode In sleep mode, the module power consumption to a minimum, but the module is still able to receive paging information and SMS. 4.2.3 current consumption The power consumption in suspended mode and without USB connection is listed in the table below. Table 4-4 working current consumption (VBAT=3.8V) GNSS (Without USB)
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd（AT+CFUN=0） @ -140dBm，Positioning, Typical：72mA Power off Power off current 20uA UMTS sleep/idle WCDMA current （GNSS off，without USB） Sleep mode @DRX=9 typical：3.6mA Idle mode @DRX=9 typical：19mA LTE Sleep/Idle LTE supply current （GNSS off，without USB） Sleep mode typical：3.8mA Idle mode typical：TBD UMTS Talking WCDMA B2 @power 24dBm typical：665mA WCDMA B5 @power 24dBm typical：586mA HSDPA Data transmission WCDMA B2 @power 24dBm typical：560mA WCDMA B5 @power 24dBm typical：500mA LTE Data transmission LTE-FDD B2 @1.4Mbps typical：716mA @3Mbps typical：656mA @5Mbps typical：716mA @10Mbps typical：722mA @20Mbps typical：750mA LTE-FDD B4 @1.4Mbps typical：616mA @3Mbps typical：656mA @5Mbps typical：656mA @10Mbps typical：687mA @20Mbps typical：721mA LTE-FDD B5 @1.4Mbps typical：616mA @3Mbps typical：656mA @5Mbps typical：733mA @10Mbps typical：766mA LTE-FDD B13 5Mbps typical：591mA @10Mbps typical：597mA LTE-FDD B17 5Mbps typical：591mA @10Mbps typical：597mA
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd4.3 Working and storage temperature The operating temperature and storage temperature of L506A is listed in the following table. Table 4-5 Operating temperature Parameter Min. Typ. Max. Unit Normal operation temperature -30 25 80 ℃ Extended operation temperature* -40 25 85 ℃ Storage temperature -45 25 90 ℃ *Note: Module is able to make and receive voice calls, data calls, SMS and makeWCDMA/HSPA+/LTE traffic in -40℃ ~ +85℃. Temperatures outside of the range -30℃ ~ +80℃ might slightly deviate from ETSI specifications. 4.4 ESD performance L506A is electrostatic sensitive device, therefore, the user in the production, assembly and operation of the module must pay attention to the electrostatic protection. L506A ESD performance parameters in the following table: Table 4-6 ESD performance parameters (temperature 25 ℃, humidity: 45%) Net contact air VBAT GND ±5KV ±10KV Antenna port ±4KV ±8KV UART ±2KV ±4KV USB ±3KV ±6KV Other PADS ±2KV ±4KV 5 Design guideline This chapter provides a general design of the products instruction, the user can refer to design guidance for design, make products to achieve better performance.
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd5.1 General design rules and requirements Users in the design of this product is peripheral circuit, the first to ensure the external power supply circuit can provide enough power supply capacity, And the requirements for high speed signal lines USB control 90 ohm + / - 10% difference impedance. For general signal interface, require the user to us in strict accordance with the requirements of design, in line with the interface signal level matching, in case the level of damage to the module. This product its own radio frequency index is good, customers need to design in accordance with the requirements the mainboard side antenna circuit and corresponding impedance control, otherwise it will affect the whole RF index. 5.2 Reference circuit Request system board VPH_PWR side power supply ability of power supply to achieve more than 2 A, meet the demand of modules, peak current, and the system side the power of the average current will reach more than 0.9 A. System board side power supply cord shall ensure enough line width, and wants to form a good return with the ground plane, moreover should increase in the power supply circuit design the method of micro level energy storage capacitor, guarantee the instantaneous power supply capacity, and the power supply ripple control within the 100 mv, the specific function of each functional module can be found in the corresponding description, overall reference circuit design please refer《L506A reference design》.
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd5.3 RF part design guideline 5.3.1 Early antenna design considerations Pre-project evaluationThe selection of the antenna position must first ensure that the antenna and the base station are kept in the horizontal direction, this produces the highest efficiency; Secondly, try to avoid placing the switch in the power supply or data line, chip and other devices or chips that produce electromagnetic interference. At the same time, the position of the hand can be avoided, so as to prevent the human body to produce attenuation; But also to reduce the radiation and the structure of the realization of the need to take into account. So, At the beginning of the design need to structure, ID, circuit, antenna engineers together to evaluate the layout. Antenna matching circuitIf the module's radio frequency port and the antenna interface need to be transferred, the main board circuit design, The design of microstrip line or strip line between the module RF test base and the antenna interface between the microstrip line or the strip line by characteristic impedance 50 ohm, at the same time, reserved double L type matching circuit; If the antenna's RF connector can be directly stuck in the module's RF test base, can save the module of the RF port and the antenna interface between the transfer. 5.4 EMC and ESD design advice Users should take full account of the EMC problem caused by signal integrity and power integrity in the design of the whole machine, In the module of the peripheral circuit layout, for power and signal lines, etc., to maintain the spacing of 2 times line width. Can effectively reduce the coupling between the signal, so that the signal has a clean, the return path. When the peripheral power supply circuit is designed, the decoupling capacitor should be placed close to the module power supply pin, High frequency high speed circuit and sensitive circuit should be far from the edge of PCB, and the layout of the layout as far as possible to reduce the interference between each other, and the sensitive signal is protected. The circuit or device that may interfere with the operation of the system board is designed. This product is embedded in the system board side, design, need to pay attention to the ESD protection, the key input and output signal interface, such as (U) SIM card interface need to be placed close to the protection of ESD devices. In addition to the motherboard side, the user is required to design the structure and PCB layout, ensure that the metal shield is fully grounded, and set up an unobstructed discharge passage for the electrostatic discharge.
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd5.5 PCB Recommended land patternWe recommend that users in the design of main board PCB DEF，In the middle of the 12 geothermal solder design according to size in below figure. Recommended at 87 of peripheral signal pads to the module with a length of 1.0 mm. Recommended PCB pads as shown in below. Figure 5-1 RECOMMENDED LAND PATTERN (Unit: mm)（detail A）
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdFigure 5-2 RECOMMENDED LAND PATTERN (Unit: mm)（detail B） 5.6 Products recommended upgrade L506 default through the USB firmware updates, so products to facilitate the software update, when the design proposal to set aside the USB test points or interface to facilitate subsequent product of the firmware upgrade.
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd6 Manufacturers 6.1 Steel mesh design At the bottom of the module pad thermal, can be reduced by way of steel meshopenings, reduce the risk of short circuit between the thermal and the module of the module Pin, have certain effect; Module pad thermal welded steel mesh openings are recommended for reference. Figure6-1 and Figure 6-2 is recommended for steel mesh and size. Figure 6-11 Steel mesh (unit mm)(detail A)
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdFigure 6-2 Steel mesh (unit mm) (detail B) Note: The direction mark point only for identify the pin 1 position, should not embody in the steel mesh file.
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd6.2 Temperature curve The temperature curve of the welding quality and material status influence, please pay special attention. Temperature rise speed should not be too fast, from room temperature to 150, the temperature rise rate is less than 3s. At the same time in more than 217 degrees, please try to keep time no more than 70 seconds, at intermediate values of 55 seconds is appropriate. The thermal shock strength is too general will lead to part of the device failure, resulting in a decline in yield and maintenance difficulty. And please control the maximum temperature of no more than 245 degrees, partial material, such as crystal at high temperature easy to occur the package rupture, cause unable to play the problem, and then affect the function of the product, The temperature can be set using the curve shown in table 6-1. Table 6-1 Temperature curve Lead-free process temperature curve Stage Temperature time Preheat Temperature rise from room temperature to 150 rate of temperature rising <3 / ℃ s keep warm 150℃~200℃ 40~110 s Welding < 217℃ 40~70 s < 230℃ 15~45 s Peak temperature MAX：245℃ MIN：230℃
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdModule edge pointModule bottomChipTemperature differenceProcess limitButter of antimony:Statistic name Lower limit Upper limitMaximum temperature ascending slope (target: 2.0)(Time distance = 20 seconds)Maximum temperature descending slope(Time distance = 20 seconds)Preheat time 150200CTime of the reflow temperature or above271CMaximum temperatureTime of the temperature above 230CDegree per secondDegree per secondDegree centigradeSecondsSecondsSecondsUnitUpper limitPreheat time 150200C Time of the reflow temperature or above271CMaximum temperature ascending slopeMaximum temperature descending slope Total timeFigure 6-3 The reference temperature curve
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication Ltd7 Package Storage information 7.1 Package information 7.1.1 Tape and reel information Figure 7-1 Tape and reel information 7.1.1 Package information L506A packing diagram is as follows, every 4 volumes of material packed in a case between each volume of material has a bubble mat do isolation protection. Specific as shown in the figure below:
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdFigure 7-2 Package and ship information 7.2 Bagged storage conditions L506 shipments in the form of vacuum sealing anti-static bag. Module of storage need to follow the following conditions: Environment below 40 Degrees Celsius temperature, air humidity is less than 90% of cases, the module can be in vacuum sealed bags for 12 months. Conditions set the storage environment Suggestions with reference to the following form. Table 7-1 Storage conditions (less than 90% humidity of the air vacuum sealed packaging) Parameter Min. Typ. Max. Unit Storage temperature -45 25 90 ℃ When on the vacuum bags, if meet the following conditions, the module can be directly for reflow soldering (furnace temperature setting reference 6.2 furnace temperature curve) or other high temperature process: Module temperature below 30 degrees c, the air humidity is less than 60%, factory within 72 hours tocomplete the SMT.The humidity is less than 10%.If the module is in the following conditions, to be baked before SMT: When the environment temperature is 23 degrees Celsius (allow upper and lower volatility of 5 degreesCelsius), humidity index greater than 10%.When open vacuum bags, module temperature below 30 degrees Celsius, air humidity is less than 60%,but the factory have not finished the SMT within 72 hours.
L506 Hardware DesignCopyright © Shanghai Mobiletek Communication LtdWhen open the vacuum bags, module storage air humidity is more than 10%.If modules need baking, please under 125 degrees Celsius (allowing fluctuations of 5 degrees Celsius) up and down bake for 48 hours. CONFIDENTIALAny Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. FCC Label Instructions:If using a permanently affixed label, the modular transmitter must be labeled with its own FCC identification number, and, if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: 2AK9DL506” or “Contains FCC ID: 2AK9DL506". Any similar wording that expresses the same meaning may be used.The Grantee may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along with the module which explain this requirement.Single Modular Approval. Output power is conducted. This device is to be used in mobile or fixed applications only. Antenna gain including cable loss must not exceed 10.42 dBi in Band 5, 9.5 dBi in Band 2, 7 dBi in Band 4, 12.18 dBi in Band 13 and 11.77 dBi in Band 17 for the purpose of satisfying the requirements of CFR 47 2.1043 & 2.1091. The antenna(s) used for this transmitter must be installedto provide a separation distance of at least 20 cm from all persons and must not be co-located or operatedin conjunction with any antenna or transmitter, except in accordance with FCC multi-transmitter evaluationprocedure. Compliance of this device in all final product configurations is the responsibility of the Grantee. Installation of this device into specific final products may require the submission of a Class II permissivechange application containing data pertinent to RF Exposure, spurious emissions, ERP/EIRP, and host/module authentication, or new application if appropriate. FCC Radiation Exposure Statement:This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment .This equipment should be installed and operated with minimum distance 20cm between the radiator& your body.

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