MtM Plus Technology M904S M904S User Manual

MtM Technology Corporation M904S

User Manual

Product Specification Product Name: M904S Bluetooth SiP Module -BT 4.0 LE Version: 1.04 Doc No: Date: Nov 25th, 2016 MtM Technology Corporation 8F, 178 MinQuan East Road Section 3, Taipei, Taiwan (R.O.C.) www.mtmtech.com.tw
MtM Technology Corporation Document History Date Revise Contents Revise by Version Jan. 23, 2014 Initial Version Brian Juang XA Apr. 28, 2015 1.01 Dec. 29, 2015 1.02 Jun. 14, 2016 Add the antenna Design guide, and Modify Power consumption PJ Chang 1.03 Nov. 25, 2016 1. Revise the reference scheme 2. Add FCC Related information PJ Chang 1.04 © MtM Technology Corporation. All rights reserved. Page 2 / 27
MtM Technology Corporation INDEX 1 Description ...................................................................................................................... 4 2 Feature ............................................................................................................................ 5 3 Block Diagram ................................................................................................................ 6 4 Technical Specification .................................................................................................. 7 4.1Recommendable Operation Condition ......................................................................... 7 4.1Temperature, humidity ................................................................................................. 7 4.2Voltage ......................................................................................................................... 7 4.3 Wireless Specifications ............................................................................................... 7 4.4 Radio Specifications Bluetooth 4.0 Low Energy........................................................ 8 4.5 External Antenna Design Guide ....................................................................... ..........9 4.5.1 PCB Antenna Design Guide .......................................................................... ..........9 4.5.2 Chip Antenna Design Guide .................................................................................. 11 4.6 Power Consumption .................................................................................................. 14 5 Dimensions ................................................................................................................... 17 6 Pin Assignments .......................................................................................................... 19 7 Recommend Footprint ............................................................................................... 20 8 Reference Design Circuit ........................................................................................... 21 9 Recommended Reflow Profile ................................................................................... 22 10 SiP Module Preparation .......................................................................................... 23 10.1 Handling ................................................................................................................ 23 10.2 SMT Preparation ................................................................................................... 23 11 Package Information ............................................................................................... 24 11.1 Product Marking ..................................................................................................... 24 11.2 Package Information ............................................................................................... 25 12 BQB / CE/ FCC Certification .................................................................................. 26 © MtM Technology Corporation. All rights reserved. Page 3 / 27
MtM Technology Corporation 1 Description The SiP module M904S is a small size module with conformal shielding. The module provides full function of Bluetooth 4.0 Low Energy in a tiny module via 48 pins LGA Foot Print. The M904S module provides everything required to create Bluetooth 4.0 Low Energy product with RF, baseband, MCU, qualified Bluetooth v4.0 stack and customer application running on a single IC. M904S enables ultra-low power connectivity and basic data transfer for applications previously limited by the power consumption, size constraints and complexity of other wireless standards. The low power consumption and excellent radio performance make it the best solution for OEM /ODM customers who require embedded Bluetooth 4.0 Low Energy feature, such as, IP camera, car key, sport and fitness watch, mouse, led light bulb etc. For the software and driver development, we provide extensive technical document and reference software code for the system integration. Hardware evaluation kit and development utilities will be released base on listed OS and processors to OEM customers. © MtM Technology Corporation. All rights reserved. Page 4 / 27
MtM Technology Corporation 2 Feature  Bluetooth® v4.0 LE radio technology  -90 dBm sensitivity in Bluetooth® low energy mode  250 kbps, 1 Mbps, 2 Mbps supported data rates  TX Power -20 to +4 dBm in 4 dB steps  TX Power -30 dBm Whisper mode  12 mA peak RX, 10 mA peak TX (0 dBm)  256 kB embedded flash program memory  Supply voltage range 1.8 V to 3.6 V  SPI Master/Slave  Low power comparator  Temperature sensor  Two-wire Master (I2C compatible)  UART (CTS/RTS)  AES HW encryption  Real Timer Counter (RTC)  Demo SW Open source on nRF51SDK v8/SoftDevice version 1  Supports the nRF51SDK v11/SoftDevice v2  LGA-48 package, 6.5 x 6.5 mm ORDRING INFORMATION Part Number Description M904S CLASS 2 Bluetooth single mode Module according BT-4.0. Bluetooth SMART © MtM Technology Corporation. All rights reserved. Page 5 / 27
MtM Technology Corporation 3 Block Diagram M904S supports UART command line interface to connect to the host processor. The simplified block diagram is depicted in the Fig. as below.. © MtM Technology Corporation. All rights reserved. Page 6 / 27
MtM Technology Corporation 4 Technical Specification 4.1 Recommendable Operation Condition Temperature, humidity The M904S module has to withstand the operational requirements as listed in the table below No Description Value Unit Ratings Over Operating Free-Air Temperature Range 1 Supply voltage All supply pins –0.3 to 3.9 V must have the same voltage 2 Voltage on any digital pin TBD V 3 Operating ambient temperature –25 to 75 °C range 4 Storage temperature range –35 to 75 °C 5 Bluetooth RF output 4 ± 1 dBm 4..2Voltage Power supply for the M904S module will be provided by the host via the power pins Operating Condition Min. Typ. Max. DVDD_3V3 1.8 3.3 3.6 I/O supply voltage (VDD_PADS) 1.2 3.3 3.6 4.3 Wireless Specifications The M904S module compliance with the following features and standards Features Description Bluetooth Standards Bluetooth core v4.0 Low Energy Antenna Port Support Single Antenna for Bluetooth Frequency Band 2.402 – 2.480 GHz © MtM Technology Corporation. All rights reserved. Page 7 / 27
MtM Technology Corporation 4.4 Radio Specifications Bluetooth 4.0 Low Energy Features Description Frequency Band 2.402– 2.480 GHz (2.4 GHz ISM Band) Number of selectable Sub channels 40 channels Modulation GFSK Supported rates <2Mbps Maximum receive level -10dBm (with PER <30. 8%) Parameter Mode and Conditions Min. Typ. Max. Unit. RX sensitivity - -90 - dBm Maximum input - -10 dBm Frequency range 2400 - 2483 MHz Output power adjustment ranger -20 - 4 dBm Output power - 2 - dBm Output power variation - 4 - dB © MtM Technology Corporation. All rights reserved Page 8 / 27
MtM Technology Corporation 4.5 External Antenna Design Guide 4.5.1 PCB Antenna Design Guide: Peak Gain: -2dBi Typ. / Avg. Gain: -3.5dBi Typ. (XZ-V) Return Loss © MtM Technology Corporation. All rights reserved Page 9 / 27 MtM Technology Corporation
Radiation Patterns © MtM Technology Corporation. All rights reserved Page 10 / 27 MtM Technology Corporation
4.5.2 Chip Antenna Design Guide Dimensions and Recommended PC Board Pattern © MtM Technology Corporation. All rights reserved Page11 / 27 MtM Technology Corporation
Return Loss\With Matching Circuits © MtM Technology Corporation. All rights reserved Page 12 / 27
MtM Technology Corporation © MtM Technology Corporation. All rights reserved Page 13 / 27
MtM Technology Corporation 4.5.2 Dipole Antenna Design Guide: Return Loss Radiation Patterns xy-plane xz-plane yz-plane © MtM Technology Corporation. All rights reserved Page 14 / 27
MtM Technology Corporation 4.5.4 PIFA Antenna Design Guide: Return Loss
MtM Technology Corporation Radiation Patterns Vertical, Horizontal and Total Gain Patterns at 2400MHz Vertical, Horizontal and Total Gain Patterns at 2440MHz Vertical, Horizontal and Total Gain Patterns at 2480MHz © MtM Technology Corporation. All rights reserved Page 14 / 27
MtM Technology Corporation 4.6 Power Consumption Item Condition Typ. Tx mode 3.3V 9.76mA Rx mode 3.3V 12.15mA System ON Constant Latency Sleep Mode 0.41uA Power Management © MtM Technology Corporation. All rights reserved Page 14 / 27
MtM Technology Corporation Radio Current Consumption © MtM Technology Corporation. All rights reserved Page 15 / 27
MtM Technology Corporation Transmitter Specifications © MtM Technology Corporation. All rights reserved Page 16 / 27
MtM Technology Corporation 5 Dimensions The size and thickness of the M904 module 6.5mm (W) x 6.5mm (L) x 1.3mm (H): Top-View: Side-View: Bottom-View: © MtM Technology Corporation. All rights reserved Page 17 / 27
MtM Technology Corporation Dimensions © MtM Technology Corporation. All rights reserved. Page 18 / 27
MtM Technology Corporation 6 Pin Assignments 6.1Pin Description The foot print dimension and pin definition is defined as below © MtM Technology Corporation. All rights reserved. Page 19 / 27
MtM Technology Corporation 7 Recommend Footprint Suggest on PCB: SMD (1:1) © MtM Technology Corporation. All rights reserved. Page 20 / 27
MtM Technology Corporation 8 Reference Design Circuit 8.1 Reference Schematic P0_27P0_26ANTU11ANT 1NC22.4GHz AntennaRF50 Ohm traceC21.0uF_0402L6N.L_0402C90R_0402L7N.L_0402VDDAVDDU1M904S_BLE_ModuleGND1GND2GND3GND4GND5GND6GND7GND8GND9RF10ANT11GND12DEC213SWDCLK14SWDIO_nRESET15P0_1616P0_1517P0_1418P0_1319P0_0920P0_0821P0_06_AIN7_AREF122ANT_TEST 34GND 33P0_26_AIN0_XL2 32P0_27_AIN1_XL1 31GND 30VDD 29P0_00_AREF0 28P0_02_AIN3 27P0_01_AIN2 26P0_03_AIN4 25P0_04_AIN5 24P0_05_AIN6 23GND 48GND 47GND 46GND 45GND 44GND 43GND 42GND 41GND 40GND 39GND 38GND 37AVDD 36GND 35RFP0_09P0_08P0_15P0_14P0_13P0_16C17 12PF_0402Y1 NM_32.768kHzC16 12PF_0402C31.0uF_0402RTC (External)P0_00P0_01P0_02P0_03P0_05P0_04P0_06SWDIOSWDCLKDEC2P0_27P0_26DC PowerR50R_0402R40R_0402DEC2VDDAVDDR20R_0402R30R_0402PWRRTCRF JTAGDEC © MtM Technology Corporation. All rights reserved. Page 21 / 27
MtM Technology Corporation 8.2 Layout Guide The following points are observed for antenna. Reference Description1 The RF traces bends must be gradual with an appoximate maximum bend of 45 degrees2 RF traces must have via on ground plane beside the RF trace on both sides3 RF traces must have constant impedance (microstrip transmission line)4 RF trace gound layer must be the solid ground layer immediately below RF trace.5 There must be no trace and ground under antenna section RF Section Layout RF Section Layout CPW impedance Calculation
9 Recommended Reflow Profile Profile Condition a. Suitable for Lead-Free solder b. Between 155~160°C: 60~90 sec. c. Above 220°C: 60~90 sec. d. Peak Temperature: 240~245 (<10 sec.) © MtM Technology Corporation. All rights reserved. Page 22 / 27
MtM Technology Corporation 10 SiP Module Preparations 10.1 Handling Handling the module must wear the anti-static wrist strap to avoid ESD damage. After each module is aligned and tested, it should be transport and storage with anti-static tray and packing. This protective package must be remained in suitable environment until the module is assembled and soldered onto the main board. 10.2 SMT Preparation 1. Calculated shelf life in sealed bag: 6 months at <40℃ and <90% relative humidity (RH). 2. Peak package body temperature: 250℃. 3. After bag was opened, devices that will be subjected to reflow solder or other high temperature process must. A. Mounted within: 72 hours of factory conditions <30℃/60% RH. B. Stored at ≦10% RH with N2 flow box. 4. Devices require baking, before mounting, if: A. Package bag does not keep in vacuumed while first time open. B. Humidity Indicator Card is >10% when read at 23±5℃. C. Expose at 3A condition over 8 hours or Expose at 3B condition over 24 hours. 5. If baking is required, devices may be baked for 12 hours at 125±5℃. © MtM Technology Corporation. All rights reserved. Page 23 / 27
MtM Technology Corporation 11 Package Information 11.1 Product Marking © MtM Technology Corporation. All rights reserved. Page 24 / 27
MtM Technology Corporation 11.2 Package Information ---------------------------------------------------------------------------------------------------------------------------------------- ---------------------------------------------------------------------------------------------------------------------------------------- ---------------------------------------------------------------------------------------------------------------------------------------- © MtM Technology Corporation. All rights reserved. Page 25 / 27
MtM Technology Corporation 12 BQB/CE/FCC Certification 12.1 FCC (USA) Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:  Reorient or relocate the receiving antenna.  Increase the separation between the equipment and receiver.  Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.  Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. IMPORTANT NOTE: FCC Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. © MtM Technology Corporation. All rights reserved. Page 26 / 27
IMPORTANT NOTE: This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC compliance requirement of the end product, which integrates this module. Appropriate measurements (e.g. 15 B compliance) and if applicable additional equipment authorizations (e.g. Verification , Doc) of the host device to be addressed by the integrator/manufacturer. IMPORTANT NOTE: This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC compliance requirement of the end product, which integrates this module. 20cm minimum distance has to be able to be maintained between the antenna and the users for the host this module is integrated into. Under such configuration, the FCC radiation exposure limits set forth for an population/uncontrolled environment can be satisfied. Any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. USERS MANUAL OF THE END PRODUCT: In the users manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. If the size of the end product is smaller than the palm of the hand, then additional FCC part 15.19 statement is required to be available in the users manual: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. LABEL OF THE END PRODUCT: The final end product must be labeled in a visible area with the following " Contains TX FCC ID: 2AJ9P-M904S". If the size of the end product is larger than the palm of the hand, then the following FCC part 15.19 statement has to also be available on the label: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. Professional installation Section 15.204(b) states that an approved "transmission system" must always be marketed as a complete system including the antenna. © MtM Technology Corporation. All rights reserved. Page 27 / 27

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